TI DBB03 Baseband asic for dolphin chipset Datasheet

DBB03
Baseband ASIC for Dolphin Chipset
www.ti.com
FEATURES
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•
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•
•
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Low Supply Voltage Range: 1.8 V to 3.6 V
Ultralow-Power Consumption:
– Active Mode: 160 µA at 1 MHz, 2.2 V
– Standby Mode: 0.9 µA
– Off Mode (RAM Retention) : 0.1 µA
Contains Frequency-Hopping Firmware for
Dolphin Reference Design
Firmware Resides in ROM-Based Program
Memory and is Fixed
Simple UART Interface to an External
Host/System Microcontroller
Pre-Defined Protocol for Communication with
an External Host/System Microcontroller
SWRS027B – DECEMBER 2004 – REVISED MARCH 2005
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•
•
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Five Power-Saving Modes
Wake-Up From Standby Mode in less than 6
µs
16-Bit RISC Architecture, 125-ns Instruction
Cycle Time
Serial Communication Interface (USART),
Software Selects Asynchronous UART or
Synchronous SPI
Available in 64-Pin Quad Flat Pack (QFP)
For Complete Dolphin Product Description,
See the Dolphin Frequency Hopping Spread
Spectrum Evaluation Kit Hardware and
Software User’s Guide (SLLU090)
DESCRIPTION
The DBB03 is a baseband ASIC for the "Dolphin" reference design. The firmware for the Dolphin reference
design resides in the ROM-based program memory of the DBB03, and thus can be readily interfaced with a
TRF6903 single-chip RF Transceiver to generate a frequency hopping wireless UART "Dolphin" reference design
chipset. This is illustrated in Figure 1.
The DBB03 baseband ASIC in addition to being a RF baseband processor is also responsible for
communications with an external host/system micrcontroller. In a typical end user application, the Dolphin chipset
will be connected up to an external host/system microcontroller that will send configuration messages, RF
transmission messages into the Dolphin chipset, or receive status, RF messages received from the Dolphin
chipset.
Any catalog low-cost host/system microcontroller can be interfaced to the Dolphin chipset as long as the Dolphin
host interface protocol for communication is adhered to. (See Application Note Dolphin - Frequency Hopping
Spread Spectrum Chipset Host Interface Protocol TI Literature SWRA043) Texas Instruments recommends its
ultra-low power MSP430 series of microcontrollers to interface with Dolphin.
The interface between the DBB03 baseband ASIC and an external host/system microcontroller is a simple UART
consisting of RX and TX data lines. (See Application Note Interfacing Dolphin to an External System
Microcontroller, TI Literature SWRA045).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
DBB03
Baseband ASIC for Dolphin Chipset
www.ti.com
SWRS027B – DECEMBER 2004 – REVISED MARCH 2005
Host Interface
Protocol via UART
RF
TRF6903
DBB03 Baseband ASIC
System Micro
Application Layer
Data Link Layer
MAC Layer
PHY Layer
Figure 1. DBB03 - Baseband ASIC for the Dolphin Chipset
The Wireless UART Dolphin chipset is a true Data-In/RF-out and RF-in/Data-out solution with all aspects of data
management and frequency hopping implemented in firmware residing on the DBB03. As illustrated in Figure 1,
the DBB03 baseband ASIC contains the complete firmware for Dolphin (PHYsical, MAC and the Data Link layer),
while the application layer protocol is handled by the external Host/System Microcontroller.
AVAILABLE OPTIONS
2
TA
PACKAGE
ORDER NUMBER
-40°C to 85°C
Plastic 64-pin QFP (PM)
DBB03 IPM
DBB03
Baseband ASIC for Dolphin Chipset
www.ti.com
SWRS027B – DECEMBER 2004 – REVISED MARCH 2005
AVCC
DVSS
AV SS
P6.2
P6.1
P6.0
RST/NMI
TCK
TMS
TDI/TCLK
TDO/TDI
XT2IN
XT2OUT
P5.7/TBOUTH
PM PACKAGE
(TOP VIEW)
1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
33
16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P5.4/MCLK
P5.3
P5.2
P5.1
P5.0
P4.7/TBCLK
P4.6
P4.5
P4.4
P4.3
P4.2/TB2
P4.1/TB1
P4.0/TB0
P3.7
P3.6
P3.5/URXD0
P1.5/TA0
P1.6/TA1
P1.7/TA2
P2.0/ACLK
P2.1/TAINCLK
P2.2/CAOUT/TA0
P2.3/CA0/TA1
P2.4/CA1/TA2
P2.5/Rosc
P2.6
P2.7/TA0
P3.0/STE0
P3.1/SIMO0
P3.2/SOMI0
P3.3/UCLK0
P3.4/UTXD0
DVCC
P6.3
P6.4
P6.5
P6.6
P6.7
NC
XIN
XOUT
NC
NC
P1.0/TACLK
P1.1/TA0
P1.2/TA1
P1.3/TA2
P1.4/SMCLK
P5.6/ACLK
P5.5/SMCLK
PIN DESIGNATION, DBB03 Baseband ASIC
NC − No internal connection
3
DBB03
Baseband ASIC for Dolphin Chipset
www.ti.com
SWRS027B – DECEMBER 2004 – REVISED MARCH 2005
FUNCTIONAL BLOCK DIAGRAMS: DBB03
XIN XOUT/TCLK
DVCC
DVSS
AVCC
AVSS
P1
RST/NMI
P2
8
ROSC
Oscillator
XT2IN
System
Clock
XT2OUT
ACLK
16KB ROM
512B RAM
SMCLK
8KB ROM
256B RAM
I/O Port
1/2
16 I/Os,
with
Interrupt
Capability
P3
8
P4
8
I/O Port 3/4
16 I/Os
P5
8
P6
8
8
I/O Port 5/6
16 I/Os
MCLK
Test
MAB,
4 Bit
MAB,MAB,
16 Bit16-Bit
JTAG
CPU
MCB
Emulation
Module
Incl. 16 Reg.
Bus
Conv
MDB,
16-Bit
MDB,
16 Bit
MDB, 8 Bit
4
TMS
Watchdog
Timer
TCK
TDI
15/16-Bit
TDO/TDI
Timer_B3
Timer_A3
3 CC Reg
Shadow
Reg
3 CC Reg
POR
Comparator
A
USART0
UART Mode
SPI Mode
DEVICE INFORMATION
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NO.
AVCC
64
Supply voltage, positive terminal. AVCC and DVCC are internally connected together.
AVSS
64
Supply voltage, negative terminal. AVSS and DVSS are internally connected together.
DVCC
1
Supply voltage, positive terminal. AVCC and DVCC are internally connected together.
DVSS
63
P1.0/TACLK
12
I/O
General-purpose digital I/O pin/Timer_A, clock signal TACLK input
P1.1/TA0
13
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI0A input, compare: Out0 output
P1.2/TA1
14
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI1A input, compare: Out1 output
P1.3/TA2
15
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI2A input, compare: Out2 output
P1.4/SMCLK
16
I/O
General-purpose digital I/O pin/SMCLK signal output
P1.5/TA0
17
I/O
General-purpose digital I/O pin/Timer_A, compare: Out0 output
P1.6/TA1
18
I/O
General-purpose digital I/O pin/Timer_A, compare: Out1 output
P1.7/TA2
19
I/O
General-purpose digital I/O pin/Timer_A, compare: Out2 output
P2.0/ACLK
20
I/O
General-purpose digital I/O pin/ACLK output
P2.1/TAINCL
K
21
I/O
General-purpose digital I/O pin/Timer_A, clock signal at INCLK
P2.2/CAOUT/
TA0
22
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI0B input/Comparator_A output
P2.3/CA0/TA
1
23
I/O
General-purpose digital I/O pin/Timer_A, compare: Out1 output/Comparator_A input
P2.4/CA1/TA
2
24
I/O
General-purpose digital I/O pin/Timer_A, compare: Out2 output/Comparator_A input
P2.5/ROSC
25
I/O
General-purpose digital I/O pin/input for external resistor defining the DCO nominal
frequency
P2.6
26
I/O
General-purpose digital I/O pin
4
Supply voltage, negative terminal. AVSS and DVSS are internally connected together.
DBB03
Baseband ASIC for Dolphin Chipset
www.ti.com
SWRS027B – DECEMBER 2004 – REVISED MARCH 2005
DEVICE INFORMATION (continued)
TERMINAL FUNCTIONS (continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
P2.7/TA0
27
I/O
General-purpose digital I/O pin/Timer_A, compare: Out0 output
P3.0/STE0
28
I/O
General-purpose digital I/O pin/slave transmit enable - USART0/SPI mode
P3.1/SIMO0
29
I/O
General-purpose digital I/O pin/slave in/master out of USART0/SPI mode
P3.2/SOMI0
30
I/O
General-purpose digital I/O pin/slave out/master in of USART0/SPI mode
P3.3/UCLK0
31
I/O
General-purpose digital I/O pin/external clock input - USART0/UART or SPI mode, clock
output - USART0/SPI mode
P3.4/UTXD0
32
I/O
General-purpose digital I/O pin/transmit data out - USART0/UART mode
P3.5/URXD0
33
I/O
General-purpose digital I/O pin/receive data in - USART0/UART mode
P3.6
34
I/O
General-purpose digital I/O pin
P3.7
35
I/O
General-purpose digital I/O pin
P4.0/TB0
36
I/O
General-purpose digital I/O pin/Timer_B, capture: CCI0A/B input, compare: Out0 output
P4.1/TB1
37
I/O
General-purpose digital I/O pin/Timer_B, capture: CCI1A/B input, compare: Out1 output
P4.2/TB2
38
I/O
General-purpose digital I/O pin/Timer_B, capture: CCI2A/B input, compare: Out2 output
P4.3
39
I/O
General-purpose digital I/O pin
P4.4
40
I/O
General-purpose digital I/O pin
P4.5
41
I/O
General-purpose digital I/O pin
P4.6
42
I/O
General-purpose digital I/O pin
P4.7/TBCLK
43
I/O
General-purpose digital I/O pin/Timer_B, clock signal TBCLK input
P5.0
44
I/O
General-purpose digital I/O pin
P5.1
45
I/O
General-purpose digital I/O pin
P5.2
46
I/O
General-purpose digital I/O pin
P5.3
47
I/O
General-purpose digital I/O pin
P5.4/MCLK
48
I/O
General-purpose digital I/O pin/main system clock MCLK output
P5.5/SMCLK
49
I/O
General-purpose digital I/O pin/submain system clock SMCLK output
P5.6/ACLK
50
I/O
General-purpose digital I/O pin/auxiliary clock ACLK output
P5.7/TBOUT
H
51
I/O
General-purpose digital I/O pin/switch all PWM digital output ports to high impedance Timer_B7 TB0 to TB2
P6.0
59
I/O
General-purpose digital I/O pin
P6.1
60
I/O
General-purpose digital I/O pin
P6.2
61
I/O
General-purpose digital I/O pin
P6.3
2
I/O
General-purpose digital I/O pin
P6.4
3
I/O
General-purpose digital I/O pin
P6.5
4
I/O
General-purpose digital I/O pin
P6.6
5
I/O
General-purpose digital I/O pin
P6.7
6
I/O
General-purpose digital I/O pin
RST/NMI
58
I
Reset input, nonmaskable interrupt input port
TCK
57
I
Test clock. TCK is the clock input port for device programming test.
TDI/TCLK
55
I
Test data input or test clock input. TDI is used as a data input port. The device protection
fuse is connected to TDI.
TDO/TDI
54
I/O
TMS
56
I
Test data output port. TDO/TDI data output
Test mode select. TMS is used as an input port for device test.
NC
7, 10, 11
No internal connection
XIN
8
I
Input port for crystal oscillator XT1. Standard or watch crystals can be connected.
XOUT
9
O
Output terminal of crystal oscillator XT1
XT2IN
53
I
Input port for crystal oscillator XT2. Only standard crystals can be connected.
XT2OUT
52
O
Output terminal of crystal oscillator XT2
5
DBB03
Baseband ASIC for Dolphin Chipset
SWRS027B – DECEMBER 2004 – REVISED MARCH 2005
6
www.ti.com
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040152 / C 11/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
May also be thermally enhanced plastic with leads connected to the die pads.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
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