Infineon AUIRF1010EZ Automotive grade Datasheet

AUIRF1010EZ
AUIRF1010EZS
AUIRF1010EZL
AUTOMOTIVE GRADE
Features
 Advanced Process Technology
 Ultra Low On-Resistance
 175°C Operating Temperature
 Fast Switching
 Repetitive Avalanche Allowed up to Tjmax
 Lead-Free, RoHS Compliant
 Automotive Qualified *
VDSS
RDS(on) typ.
max.
Package Type
AUIRF1010EZ
AUIRF1010EZL
TO-220
TO-262
AUIRF1010EZS
D2-Pak
6.8m
ID (Silicon Limited)
8.5m
84A
ID (Package Limited)
75A
D
D
Description
Specifically designed for Automotive applications, this
HEXFET® Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per silicon
area. Additional features of this design are a 175°C junction
operating temperature, fast switching speed and improved
repetitive avalanche rating. These features combine to make
this design an extremely efficient and reliable device for use in
Automotive applications and wide variety of other applications.
Base part number
60V
S
D
G
S
G
TO-220AB
AUIRF1010EZ
G
Gate
Standard Pack
Form
Quantity
Tube
50
Tube
50
Tube
50
Tape and Reel Left
800
G
S
D
D2Pak
AUIRF1010EZS
TO-262
AUIRF1010EZL
D
Drain
S
Source
Orderable Part Number
AUIRF1010EZ
AUIRF1010EZL
AUIRF1010EZS
AUIRF1010EZSTRL
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless
otherwise specified.
Symbol
Parameter
Max.
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
84
ID @ TC = 100°C
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
60
75
IDM
PD @TC = 25°C
Pulsed Drain Current 
Maximum Power Dissipation
340
140
VGS
EAS
EAS (tested)
IAR
EAR
TJ
TSTG
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally Limited) 
Single Pulse Avalanche Energy Tested Value 
Avalanche Current 
Repetitive Avalanche Energy 
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Mounting torque, 6-32 or M3 screw
Thermal Resistance
Symbol
RJC
RCS
RJA
RJA
Parameter
Junction-to-Case 
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Junction-to-Ambient ( PCB Mount, steady state) 
Units
A
W
0.90
± 20
99
180
See Fig.15,16, 12a, 12b
W/°C
V
mJ
A
mJ
-55 to + 175
°C
300
10 lbf•in (1.1N•m)
Typ.
Max.
Units
–––
0.50
–––
1.11
–––
62
40
°C/W
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
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AUIRF1010EZ/S/L
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Drain-to-Source Breakdown Voltage
V(BR)DSS
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
Gate Threshold Voltage
gfs
Forward Trans conductance
IDSS
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Min. Typ. Max. Units
Conditions
60
––– –––
V VGS = 0V, ID = 250µA
––– 0.058 ––– V/°C Reference to 25°C, ID = 1mA
–––
6.8
8.5
m VGS = 10V, ID = 51A 
2.0
–––
4.0
V VDS = VGS, ID = 250µA
200 ––– –––
S VDS = 25V, ID = 51A
––– –––
20
VDS =60 V, VGS = 0V
µA
––– ––– 250
VDS =60V,VGS = 0V,TJ =125°C
––– ––– 200
VGS = 20V
nA
––– ––– -200
VGS = -20V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
–––
–––
–––
–––
–––
–––
–––
58
19
21
19
90
38
54
86
28
32
–––
–––
–––
–––
LD
Internal Drain Inductance
–––
4.5
–––
LS
Internal Source Inductance
–––
7.5
–––
–––
–––
–––
–––
–––
–––
2810
420
200
1440
320
510
–––
–––
–––
–––
–––
–––
Min.
Typ. Max. Units
–––
–––
84
–––
–––
340
–––
–––
–––
–––
41
54
1.3
62
81
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Coss
Output Capacitance
Coss
Output Capacitance
Effective Output Capacitance
Coss eff.
Diode Characteristics
Parameter
Continuous Source Current
IS
(Body Diode)
Pulsed Source Current
ISM
(Body Diode)
VSD
Diode Forward Voltage
Reverse Recovery Time
trr
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
ID = 51A
nC VDS = 48V
VGS = 10V
VDD = 30V
ID = 51A
ns
RG= 7.95
VGS = 10V 
Between lead,
6mm (0.25in.)
nH
from package
and center of die contact
VGS = 0V
VDS = 25V
ƒ = 1.0MHz, See Fig. 5
pF
VGS = 0V, VDS = 1.0V ƒ = 1.0MHz
VGS = 0V, VDS = 48V ƒ = 1.0MHz
VGS = 0V, VDS = 0V to 48V
Conditions
MOSFET symbol
showing the
A
integral reverse
p-n junction diode.
V TJ = 25°C,IS = 51A,VGS = 0V 
ns TJ = 25°C ,IF = 51A, VDD = 30V
nC di/dt = 100A/µs 
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11)
 Limited by TJmax, starting TJ = 25°C, L = 0.077mH, RG = 25, IAS = 51A, VGS =10V. Part not recommended for use above this value.
 Pulse width 1.0ms; duty cycle  2%.
 Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.

Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive avalanche performance.
 This value determined from sample failure population, starting TJ = 25°C, L = 0.077mH, RG = 25, IAS = 51A, VGS =10V.
 When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to
application note #AN-994 : http://www.irf.com/technical-info/appnotes/an-994.pdf
 R is measured at TJ approximately 90°C.
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AUIRF1010EZ/S/L
1000
10000
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
1000
BOTTOM
100
100
10
1
4.5V
1
10
BOTTOM
10
4.5V
1
20µs PULSE WIDTH
Tj = 175°C
20µs PULSE WIDTH
Tj = 25°C
0.1
0.1
0.1
0.01
100
1
10
100
Fig. 2 Typical Output Characteristics
Fig. 1 Typical Output Characteristics
1000
100
100
Gfs, Forward Transconductance (S)
ID, Drain-to-Source Current )
0.1
V DS, Drain-to-Source Voltage (V)
V DS, Drain-to-Source Voltage (V)
T J = 175°C
10
T J = 25°C
1
0.1
4
5
6
7
8
9
10
VGS, Gate-to-Source Voltage (V)
Fig. 3 Typical Transfer Characteristics
3
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
TOP
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
TOP
90
T J = 25°C
80
70
60
50
T J = 175°C
40
30
20
10
0
0
20
40
60
80
100
120
140
ID ,Drain-to-Source Current (A)
Fig. 4 Typical Forward Transconductance
vs. Drain Current
2015-9-30
AUIRF1010EZ/S/L
100000
12.0
VGS = 0V,
f = 1 MHZ
C iss = Cgs + Cgd, C ds SHORTED
C rss = Cgd
VGS, Gate-to-Source Voltage (V)
ID = 51A
C, Capacitance(pF)
C oss = Cds + Cgd
10000
C iss
1000
Coss
VDS = 48V
VDS = 30V
VDS = 12V
10.0
8.0
6.0
4.0
2.0
C rss
0.0
100
1
10
0
100
10
20
30
40
50
60
QG Total Gate Charge (nC)
VDS , Drain-to-Source Voltage (V)
Fig 5. Typical Capacitance vs.
Drain-to-Source Voltage
Fig 6. Typical Gate Charge vs.
Gate-to-Source Voltage
1000.00
100.00
10.00
1.00
0.10
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
10000
OPERATION IN THIS AREA
LIMITED BY R DS (on)
1000
T J = 175°C
100µsec
100
T J = 25°C
VGS = 0V
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
VSD, Source-to-Drain Voltage (V)
1msec
10
1
10msec
Tc = 25°C
Tj = 175°C
Single Pulse
0.1
1
10
100
VDS , Drain-to-Source Voltage (V)
Fig. 7 Typical Source-to-Drain Diode
Forward Voltage
4
Fig 8. Maximum Safe Operating Area
2015-9-30
AUIRF1010EZ/S/L
100
90
R DS(on) , Drain-to-Source On Resistance
(Normalized)
2.5
Limited By Package
ID, Drain Current (A)
80
70
60
50
40
30
20
10
0
ID = 84A
VGS = 10V
2.0
1.5
1.0
0.5
25
50
75
100
125
150
175
-60 -40 -20
T C , Case Temperature (°C)
0
20 40 60 80 100 120 140 160 180
T J , Junction Temperature (°C)
Fig 10. Normalized On-Resistance
vs. Temperature
Fig 9. Maximum Drain Current vs. Case Temperature
Thermal Response ( Z thJC )
10
1
D = 0.50
0.20
0.10
0.05
0.1
J
0.02
0.01
R1
R1
J
1
R2
R2
C
1
2
2
Ci= iRi
Ci= iRi
0.01
R3
R3
3
3
C
Ri (°C/W)
i (sec)
0.415
0.000246
0.410
0.000898
0.285
0.009546
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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AUIRF1010EZ/S/L
DRIVER
L
VDS
D.U.T
RG
+
V
- DD
IAS
20V
A
0.01
tp
Fig 12a. Unclamped Inductive Test Circuit
V(BR)DSS
EAS , Single Pulse Avalanche Energy (mJ)
400
15V
ID
5.7A
9.1A
BOTTOM 51A
350
TOP
300
250
200
150
100
50
0
25
tp
50
75
100
125
150
175
Starting T J , Junction Temperature (°C)
Fig 12c. Maximum Avalanche Energy
vs. Drain Current
I AS
Fig 12b. Unclamped Inductive Waveforms
Id
Vds
Vgs
Vgs(th)
Qgs1 Qgs2
Qgd
Qgodr
Fig 13a. Gate Charge Waveform
VGS(th) Gate threshold Voltage (V)
4.5
4.0
3.5
ID = 250µA
3.0
2.5
2.0
1.5
1.0
-75
-50
-25
0
25
50
75
100 125 150 175
T J , Temperature ( °C )
Fig 14. Threshold Voltage vs. Temperature
Fig 13b. Gate Charge Test Circuit
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1000
Avalanche Current (A)
Duty Cycle = Single Pulse
100
Allowed avalanche Current vs
avalanche pulsewidth, tav
assuming  Tj = 25°C due to
avalanche losses
0.01
0.05
10
0.10
1
0.1
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
tav (sec)
Fig 15. Typical Avalanche Current vs. Pulse width
EAR , Avalanche Energy (mJ)
100
Notes on Repetitive Avalanche Curves , Figures 15, 16:
(For further info, see AN-1005 at www.infineon.com)
TOP
Single Pulse
BOTTOM 1% Duty Cycle
ID = 51A
75
50
25
0
25
50
75
100
125
150
Starting T J , Junction Temperature (°C)
175
1. Avalanche failures assumption:
Purely a thermal phenomenon and failure occurs at a temperature far in
excess of Tjmax. This is validated for every part type.
2. Safe operation in Avalanche is allowed as long as Tjmax is not exceeded.
3. Equation below based on circuit and waveforms shown in Figures 12a, 12b.
4. PD (ave) = Average power dissipation per single avalanche pulse.
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase
during avalanche).
6. Iav = Allowable avalanche current.
7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as
25°C in Figure 15, 16).
tav = Average time in avalanche.
D = Duty cycle in avalanche = tav ·f
ZthJC(D, tav) = Transient thermal resistance, see Figures 13)
PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC
Iav = 2T/ [1.3·BV·Zth]
EAS (AR) = PD (ave)·tav
Fig 16. Maximum Avalanche Energy
vs. Temperature
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Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
Fig 18a. Switching Time Test Circuit
Fig 18b. Switching Time Waveforms
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AUIRF1010EZ/S/L
TO-220AB Package Outline (Dimensions are shown in millimeters (inches))
TO-220AB Part Marking Information
Part Number
AUF1010EZ
YWWA
IR Logo
XX

Date Code
Y= Year
WW= Work Week
XX
Lot Code
TO-220AB package is not recommended for Surface Mount Application.
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AUIRF1010EZ/S/L
D2Pak (TO-263AB) Package Outline (Dimensions are shown in millimeters (inches))
D2Pak (TO-263AB) Part Marking Information
Part Number
AUF1010EZS
YWWA
IR Logo
XX

Date Code
Y= Year
WW= Work Week
XX
Lot Code
10
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AUIRF1010EZ/S/L
TO-262 Package Outline (Dimensions are shown in millimeters (inches)
TO-262 Part Marking Information
Part Number
AUF1010EZL
YWWA
IR Logo
XX

Date Code
Y= Year
WW= Work Week
XX
Lot Code
11
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AUIRF1010EZ/S/L
D2Pak (TO-263AB) Tape & Reel Information (Dimensions are shown in millimeters (inches))
TRR
1.60 (.063)
1.50 (.059)
4.10 (.161)
3.90 (.153)
FEED DIRECTION 1.85 (.073)
1.65 (.065)
1.60 (.063)
1.50 (.059)
11.60 (.457)
11.40 (.449)
0.368 (.0145)
0.342 (.0135)
15.42 (.609)
15.22 (.601)
24.30 (.957)
23.90 (.941)
TRL
10.90 (.429)
10.70 (.421)
1.75 (.069)
1.25 (.049)
4.72 (.136)
4.52 (.178)
16.10 (.634)
15.90 (.626)
FEED DIRECTION
13.50 (.532)
12.80 (.504)
27.40 (1.079)
23.90 (.941)
4
330.00
(14.173)
MAX.
NOTES :
1. COMFORMS TO EIA-418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
12
60.00 (2.362)
MIN.
26.40 (1.039)
24.40 (.961)
3
30.40 (1.197)
MAX.
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AUIRF1010EZ/S/L
Qualification Information
Automotive
(per AEC-Q101)
Comments: This part number(s) passed Automotive qualification. Infineon’s
Industrial and Consumer qualification level is granted by extension of the higher
Automotive level.
Qualification Level
Moisture Sensitivity Level
TO-220AB
N/A
TO-262
D2-Pak
MSL1
Machine Model
ESD
Human Body Model
Charged Device Model
RoHS Compliant
Class M4†
AEC-Q101-002
Class H1C†
AEC-Q101-001
Class C3†
AEC-Q101-005
Yes
† Highest passing voltage.
Revision History
Date
9/30/2015
Comments


Updated datasheet with corporate template
Corrected ordering table on page 1.
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2015
All Rights Reserved.
IMPORTANT NOTICE
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any
information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third
party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this
document and any applicable legal requirements, norms and standards concerning customer’s products and any use of
the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of
customer’s technical departments to evaluate the suitability of the product for the intended application and the
completeness of the product information given in this document with respect to such application.
For further information on the product, technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies office (www.infineon.com).
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Due to technical requirements products may contain dangerous substances. For information on the types in question
please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized
representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a
failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.
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