Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM36273 SNVSA80A – FEBRUARY 2016 – REVISED FEBRUARY 2016 LM36273 Integrated Backlight Driver With Integrated LCD Bias 1 Features 3 Description • The LM36273 is an integrated three-channel WLED driver and LCD bias supply. The ultra-compact size, high efficiency, high level of integration, and programmability allow the LM36273 to address a variety of applications without the need for hardware changes while minimizing the overall solution area. 1 • • • • • • • • Drives up to Three Parallel White LED Strings (29-V Maximum VOUT) 11-Bit Exponential and Linear Dimming Control PWM and I2C Brightness Control Backlight Operation With 4.7-µH to 15-µH Inductor Backlight and LCD Bias Efficiency up to 92% Programmable LCD Bias Voltages (±4 V to ±6.5 V With 50-mV resolution) With Up to 80-mA per Output 0.2% Matched LED Current From 60 µA to 30 mA 1% Accurate LED Current From 60 µA to 30 mA 2.7-V to 5-V Input Voltage Range 2 Applications • • • • The backlight boost provides the power to bias three parallel LED strings with up to 29-V total output voltage. The 11-bit LED current is programmable via the I2C bus and/or controlled via a logic level PWM input from 60 µA to 30 mA. Each LED string can be independently enabled or disabled to provide zone dimming capabilities. The backlight boost can be operated efficiently with an inductance range from 4.7 µH to 15 µH, allowing for efficiency and solution size optimization. The LCD bias boost provides the power to both a positive LDO and an inverting charge pump. Both positive and negative bias supplies have programmable output voltages of ±4 V to ±6.5 V with 50-mV steps and up to ±80 mA of current capability. An auto-sequencing feature provides a programmed delay from positive to negative bias activation, with additional programmable voltage slew rate control. Two wake-up modes allow both bias outputs to be controlled with a single external signal and stay active while consuming very low quiescent current. LCD Panels With up to 24 LEDs Smart Phones Tablets and Gaming Tablets Home Automation Panels space space Simplified Schematic DSCH LBL Device Information(1) IN LLCM PART NUMBER BL_SW BL_SW CBL_OUT BL_OUT DSBGA (24) BODY SIZE (MAX) 2.44 mm × 1.67 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. LED1 LCM_SW VBATT PACKAGE LM36273 LED2 Backlight Efficiency, 3P7S SCL LED3 SDA 95 Up to 8 LEDs / String 90 LM36273 C+ 85 PWM C- HWEN LCM_EN1 LCM_OUT LCM_EN2 VPOS CLCM Efficiency (%) CFLY 80 75 70 65 60 VIN = 2.7 V VIN = 3.7 V VIN = 5 V AGND LCM_GND CP_GND BL_GND CVPOS VNEG 55 CVNEG 50 0 10 20 30 40 50 Load (mA) 60 70 80 90 D052 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM36273 SNVSA80A – FEBRUARY 2016 – REVISED FEBRUARY 2016 www.ti.com 4 Revision History Changes from Original (February 2016) to Revision A • 2 Page Changed device status from preview to production .............................................................................................................. 1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LM36273 LM36273 www.ti.com SNVSA80A – FEBRUARY 2016 – REVISED FEBRUARY 2016 5 Device and Documentation Support 5.1 Device Support 5.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 5.1.2 Development Support Power Stage Designer™ tools can be used for the boost calculation: http://www.ti.com/tool/powerstage-designer 5.2 Documentation Support 5.2.1 Related Documentation For related documentation, see the following: • AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009) • Understanding Boost Power Stages in Switch Mode Power Supplies http://focus.ti.com/lit/an/slva061/slva061.pdf 5.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 5.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 5.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 5.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LM36273 3 PACKAGE OPTION ADDENDUM www.ti.com 24-Mar-2016 PACKAGING INFORMATION Orderable Device Status (1) LM36273YFFR ACTIVE Package Type Package Pins Package Drawing Qty DSBGA YFF 24 3000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Op Temp (°C) Device Marking (4/5) -40 to 85 LM36273 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Mar-2016 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Mar-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM36273YFFR Package Package Pins Type Drawing SPQ DSBGA 3000 YFF 24 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.0 8.4 Pack Materials-Page 1 1.72 B0 (mm) K0 (mm) P1 (mm) 2.51 0.69 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Mar-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM36273YFFR DSBGA YFF 24 3000 182.0 182.0 20.0 Pack Materials-Page 2 D: Max = 2.44 mm, Min = 2.38 mm E: Max = 1.671 mm, Min = 1.61 mm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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