NL37WZ07 Triple Buffer with Open Drain Outputs The NL37WZ07 is a high performance triple buffer with open drain outputs operating from a 1.65 V to 5.5 V supply. The internal circuit is composed of multiple stages, including an open drain output which provides the capability to set output switching level. This allows the NL37WZ07 to be used to interface 5 V circuits to circuits of any voltage between VCC and 7 V using an external resistor and power supply. http://onsemi.com MARKING DIAGRAM 8 Features • • • • • • • • • • Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Overvoltage Tolerant Inputs LVTTL Compatible − Interface Capability with 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Output Sink Capability @ 3.0 V Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 72 These Devices are Pb−Free and are RoHS Compliant NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable IN A1 1 8 VCC OUT Y3 2 7 OUT Y1 IN A2 3 6 IN A3 GND 4 5 OUT Y2 L7 MG G US8 US SUFFIX CASE 493 L7 M G 1 = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT Pin Function 1 IN A1 2 OUT Y3 3 IN A2 4 GND 5 OUT Y2 6 IN A3 7 OUT Y1 8 VCC FUNCTION TABLE A Input Y Output L L H Z ORDERING INFORMATION Figure 1. Pinout IN A1 1 OUT Y1 IN A2 1 OUT Y2 IN A3 1 OUT Y3 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2012 April, 2012 − Rev. 8 1 Publication Order Number: NL37WZ07/D NL37WZ07 MAXIMUM RATINGS Symbol Value Units DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 to +7.0 V VO DC Output Voltage −0.5 to +7.0 V IIK DC Input Diode Current VI < GND −50 IOK DC Output Diode Current VO < GND −50 IO DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range VCC Parameter mA mA −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature under Bias +150 °C qJA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL FR VESD Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) V > 2000 > 150 N/A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max VCC Supply Voltage Operating Data Retention Only 1.65 1.5 5.5 5.5 Units V VI Input Voltage (Note 5) 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 5.5 V TA Operating Free−Air Temperature −55 +125 °C Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V 0 0 0 20 10 5 5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 ns/V NL37WZ07 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter VIH TA = 25°C −55°C 3 TA 3 125°C (V) Min High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 0.75 VCC 0.7 VCC VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 0.25 VCC 0.3 VCC 0.25 VCC 0.3 VCC V ILKG Z−State Output Leakage Current VIN = VIL VOUT = VCC or GND 1.65 to 5.5 ±5.0 ±10.0 mA VOL Low−Level Output Voltage VIN = VIH or VIL IOL = 100 mA 1.65 to 5.5 0.0 0.1 0.1 V IOL = 4 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 IIN Input Leakage Current Condition Typ Max Min Max 0.75 VCC 0.7 VCC Units V VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 mA IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V 0 1 10 mA ICC Quiescent Supply Current VIN = 5.5 V or GND 5.5 1 10 mA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W TA = 25°C Symbol tPZL tPLZ Parameter Propagation Delay (Figure 3 and 4) Propagation Delay (Figure 3 and 4) Min Typ −55°C 3 TA 3 125°C Max Min Max Units 7.8 ns Condition VCC (V) RL = R1 = 500 W, CL = 50 pF 1.8 ± 0.15 RL = R1 = 500 W, CL = 50 pF 2.5 ± 0.2 1.2 3.7 5.8 1.2 6.4 RL = R1 = 500 W, CL = 50 pF 3.3 ± 0.3 0.8 2.9 4.4 0.8 4.8 RL = R1 = 500 W, CL = 50 pF 5.0 ± 0.5 0.5 2.3 3.5 0.5 3.9 RL = R1 = 500 W, CL = 50 pF 1.8 ± 0.15 RL = R1 = 500 W, CL = 50 pF 2.5 ± 0.2 1.2 2.8 5.8 1.2 6.4 RL = R1 = 500 W, CL = 50 pF 3.3 ± 0.3 0.8 2.1 4.4 0.8 4.8 RL = R1 = 500 W, CL = 50 pF 5.0 ± 0.5 0.5 1.4 3.5 0.5 3.9 7.8 7.8 7.8 ns CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Units Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 4.0 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4.0 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin ) ICC VCC. http://onsemi.com 3 NL37WZ07 A VCC 50% GND tPZL Y tPLZ 50% VCC HIGH IMPEDANCE VOL +0.3 V Figure 3. Switching Waveforms VCC R1 PULSE GENERATOR DUT RT CL VCC x 2 RL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit DEVICE ORDERING INFORMATION Package Shipping† NL37WZ07USG US8 (Pb−Free) 3000 / Tape & Reel NLV37WZ07USG* US8 (Pb−Free) 3000 / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 4 NL37WZ07 PACKAGE DIMENSIONS US8 CASE 493−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M R 0.10 TYP T X Y V M F DETAIL E MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC DIM A B C D F G H J K L M N P R S U V INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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