Sharp GP2W0001YP Irda data sheet 115 kbps transceiver Datasheet

GP2W0001YP
IrDA Data Sheet
FEATURES
• Built-in Photodiode
• Operating voltage 2.7 V to 5.5 V
• In circuit design, allow for the degradation of light
emitting diode output that results from long continuous operation (50% degradation/5 years).
• This product shall not contain the following materials, and these materials shall not be used in the production process for this product.
– CFCs
– Halon
– Carbon Tetrachloride
– 1.1.1. Trichloroethane (Methylchloroform)
– Specific brominated flame retardants such as the
PBBOs and PBBs are not used in this device.
INTRODUCTION
This specification applies to the outline and characteristics of IrDA 1.2 type (data rate 2.4 kbps to
115.2 kbps, low power option compliant) optical data
communication transceiver.
115 kbps Transceiver
designed by considering 0.5 ms or more that is specified by IrDA. This turn around time means the time
that this device temporarily does not detect the
incoming signal, since the transmitted light from the
transmitter side reaches the detector side of the
same transceiver.
• Consider that 20 ms or more (at TA = 25°C, no input
signal) is necessary to return from shut-down mode
to ready operation mode. In addition, thoroughly
confirm the operation in the actual application.
• When there is considerable external stray light or a
light source is located near the transceiver, or the
detector face receives considerable external stray
light, a pulse other than the desired signal output may
be generated as noise on the output terminal of the
transceiver. Consider the layout and structure in your
design to minimize disturbing light on the detector face.
• When the sensor is adopted in an IR communication
system, it should be used according to the signal
method specified by ‘Serial Infrared Physical Layer
Link Specification’ published by the Infrared Data
Association. Faulty operation may occur if a signal
method other than that specified is used.
NOTES
• Caution should be taken to prevent the detector surface from being smeared with dust or dirt, or from
being touched, as it may cause faulty operation.
• In order to prevent electrostatic damage to the integrated circuit, handle this device in a static-free environment and workstation.
• External force applied to the device after mounting can
cause mounting defects such as the terminal coming
off. Be careful when handling the device and prevent
objects from touching the device after mounting.
• Refer to the ‘Precautions for Soldering’ section.
1
2
LEDA TXD
3
4
5
SD RXD GND
CX1
R2
RL
6
VCC
+
• Cleaning conditions:
– Solvent cleaning: Solvent temperature 45°C or
less. Immersion for 3 minutes or less.
– Ultrasonic cleaning: The effect of ultrasonic
cleaning on the device differs by cleaning bath
size, ultrasonic power output, cleaning time, PCB
size or device mounting condition, etc. Test the
device under actual conditions and confirm that
ultrasonic cleaning does not cause any immediate or potential defects.
– Cleaning solvent: The cleaning shall be carried
out with ethyl alcohol, methyl alcohol, or isopropyl
alcohol.
CX2
TX
COMPONENTS
R1
SD
RXD
VCC
RECOMMENDED VALUES
CX1
47 µF/6.3 V (NOTE)
CX2
1500 pF/25 V
R1
47 Ω ±5%, 1/10 W (NOTE)
R2
1 kΩ ±5%, 1/10 W
RL
(STANDARD)
2.2 Ω ±5%, 1/2 W
(VCC = 3.0 V, IE = 40 mW/sr)
RL
(LOW POWER)
33 Ω ±1%, 1/8 W
(VCC = 3.0 V, IE = 3.6 mW/Sr)
NOTE: Choose the most suitable CX1 and R1 according to
the noise level and noise frequency of power supply.
GP2W0001YP-1
• When the system (program) is designed, the turn
around time from transmit to receive should be
IrDA Data Sheet
Figure 1. Recommended External Circuit
1
GP2W0001YP
115 kbps Transceiver
R1
+
CX1
RL
VCC
CX2
LEDA
1
2
ENCODER
CIRCUIT
3
R2
TXD
UART
GP2W0001YP
5
DECODER
CIRCUIT
4
3
RXD
SD
GND
SD INPUT
PERFORMANCE
HIGH
Normal Mode
LOW or
OPEN
Shutdown
Mode
NOTES:
1 Transmitting data waveform
2 Encoder circuit output waveform
3 Transmitter output optical signal waveform
4 GP2W0001YP receiver output waveform
5 Receiving data waveform
GP2W0001YP-2
Figure 2. System Example
2
IrDA Data Sheet
115 kbps Transceiver
T
T
0
1
LENS (PD/LED) SIDE
0
1
1.7
1
GP2W0001YP
3T/16
6
5
4
3
2
1
2
0.7
0.9
P 1.4 x 5 = 7
3
View from parts side
1.7
4
5
0
1
0
1
6
5
4
1
P 1.4 x 5 = 7
Solder Mask Opening
2 Encoder circuit output waveform
3 Transmitter output optical signal waveform
4 GP2W0001YP receiver output waveform
5 Receiving data waveform
PIN
1
Data Rate
Data rate: 2.4 kbps, 9.6 kbps, 19.2 kbps, 38.4 kbps,
57.6 kbps, 115.2 kbps
GP2W0001YP-3
Figure 3. Signal Waveform Example
Recommended Size of
Solder Cream Paste
Open the solder mask as shown in Figure 4. The size
of solder cream paste for this device before reflow soldering must be as large as the foot pattern landings.
IrDA Data Sheet
2
0.7
0.9
NOTES:
1 Transmitting data waveform
T=
3
PIN NAME
SYMBOL
1
LED Anode
LEDA
2
Transmitter Data Input
TXD
3
Shutdown
SD
4
Receiver Data Output
RXD
5
Ground
GND
6
Supply Voltage
VCC
NOTES: Dimensions are in mm.
Soldering paste area
GP2W0001YP-4
Figure 4. Foot Pattern and
Solder Cream Paste Size
3
GP2W0001YP
115 kbps Transceiver
8.7 ±0.2
2.325
4.2
3.5
2.2
2.95
EMBOSSED
'S'
1.0
1.7
3.15
4.2
CENTER
OF EMITTER
φ3.6 ±0.1
CENTER
OF DETECTOR
φ2.8 ±0.1
6 - 1.1 ±0.2
0.7
0.6
0.7
P 1.4 x 5 = 7 ±0.2
1
6 - 0.8
+0.2
-0.3
2
3
4
5
6
PIN
PIN NAME
SYMBOL
0.7
0.7
P 1.4 x 5 = 7 ±0.2
NOTES:
1. Dimensions are in mm.
2. Unspecified tolerances are ±0.3 mm.
3. Adhesion of resin to the terminal area are allowed MAX. 0.3 mm.
4. Resin burr are not included in this outline drawing.
5. Product mass: Approx. 0.12 g
6. Mold resin: Epoxy resin (black)
1
LED Anode
LEDA
2
Transmitter data Input
TXD
3
Shutdown
SD
4
Receiver Data Output
RXD
5
Ground
GND
6
Supply Voltage
VCC
area: Au plating
GP2W0001YP-5
Figure 5. GP2W0001YP Outline Dimensions
4
IrDA Data Sheet
115 kbps Transceiver
GP2W0001YP
RATINGS AND CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER
SYMBOL
RATINGS
UNIT
VCC
0 to 6.0
V
Supply voltage
IF
50
mA
IFM
500
mA
Operating temperature
TOPR
-10 to +70
°C
Storage temperature
TSTG
-20 to +85
°C
Soldering temperature
TSOL
230
°C
Forward current
Peak forward current
NOTES
1
2
NOTES:
1. Pulse width: 78.1 µs. Duty ratio: 3/16.
2. Soldering reflow time: 5 seconds.
Recommended Operating Conditions
PARAMETER
SYMBOL
OPERATING CONDITION
UNIT
Supply voltage
VCC
2.7 to 5.5
V
Data rate
BR
2.4 to 115.2
kbps
Shutdown circuit high level input voltage
VIHSD
VCC – 0.6 to VCC
V
Shutdown circuit low level input voltage
VILSD
0.0 to 0.4 or Open
V
Logic high transmitter input voltage*
VIHTXD
2.4 to VCC
V
Logic low receiver input voltage*
VILTXD
0.0 to 0.4
V
NOTES: *Recommended circuit of emitter side.
IrDA Data Sheet
5
GP2W0001YP
115 kbps Transceiver
Electrical Characteristics
TA = -25°C, VCC = 5 V unless otherwise specified
PARAMETER
SYMBOL
Current consumption at no input signal
Current consumption at shut-down mode
MIN.
TYP.
MAX.
UNIT
NOTES
ICC1
1.0
1.4
mA
1
ICC2
0.7
1.0
mA
2
ICC1-S
0.5
1.0
µA
3
0.3
1.0
µA
4
VOH1
4.5
V
5
VOH2
2.5
V
6
V
7
ICC2-S
High level output voltage
0.6
VOL1
Low level output voltage
0.6
V
8
8.0
µs
9
tr
1.2
µs
9
tf
0.2
µs
9
m
10
350
mW/Sr
11
900
nm
11
VOL2
Low level pulse width
tw
Rise time
Fall time
0.8
Maximum reception distance
L
1
Radiant intensity
IE
40
Peak emission wavelength
λp
850
870
NOTES:
1. VCC = 5 V, no input signal, output terminal open, VIHSD = VCC -0.6 V.
2. VCC = 3 V, no input signal, output terminal open, VIHSD = VCC -0.6 V.
3. VCC = 5 V, SD terminal open.
4. VCC = 3 V, SD terminal open.
5. VCC = 5 V.
6. VCC = 3 V.
7. VCC = 5 V, IOL = 400 µA.
8. VCC = 3 V, IOL = 400 µA. See Figures 6, 7, and 8.
9. BR = 115.2 kbps. See Figures 6, 7, and 8.
10. VOH, VOL, tw, tr, tf shall be satisfied at φ ≤ 15°. See Figures 6, 7, and 8.
11. BR = 115.2 kbps, φ ≤ 15°, VCC = 3 V, RL = 2.2 Ω,
VINTX = 2.7 V, R2 = 1 kΩ ±5%, CX2 = 1,500 pF. See Figures 9, 10, and 11.
T1
T1
tF
tR
T2
VOH
90%
RADIATION
INTENSITY OF
TRANSMITTER
40 mW/Sr
NOTE: At BR = 2.4 kbps: T1 = 416.7 µs, T2 = 78.1 µs
At BR = 115.2 kbps: T1 = 8.68 µs, T2 = 1.63 µs
50%
10%
VOL
tW
GP2W0001YP-7
GP2W0001YP-6
Figure 6. Input Signal Waveform (Detector Side)
6
Figure 7. Output Waveform (Detector Side)
IrDA Data Sheet
115 kbps Transceiver
GP2W0001YP
φ
φ
GP2W0001YP
TRANSMITTER
(NOTE 1)
OSCILLOSCOPE
L
NOTES:
1. Transmitter uses GP2W0001YP (λp = 870 nm TYP.)
adjusted to a radiation intensity of 40 mW/Sr.
2. φ Indicates horizontal and vertical directions.
3. Ee: Detector face illuminance < 10 x
GP2W0001YP-8
Figure 8. Standard Optical System (Detector Side)
90%
IE
10%
tR
tF
GP2W0001YP-9
Figure 9. Output Waveform Specification
(Emitter Side)
IrDA Data Sheet
7
GP2W0001YP
115 kbps Transceiver
DETECTOR FOR
RADIATION INTENSITY
MEASURMENT
φ
φ
GP2W0001YP
NOTE: φ indicates horizontal
and vertical directions
GP2W0001YP-10
Figure 10. Standard Optical System (Emitter Side)
VCC = 3 V,
RL = 2.2 Ω
1.63 µs
CX2 = 1500 pF
400
LEDA
TX
TXD
GP2W0001YP
300
VIN Tx = 2.7 V
PEAK
FORWARD
CURRENT
R2 = 1 kΩ
IFM (mA)
BR = 115.2 kbps
200
GP2W0001YP-11
Figure 11. Recommended Circuit (Emitter Side)
100
0
-10
-25
0
25
50
60 70
75
100
AMBIENT TEMPERATURE TA (°C)
GP2W0001YP-12
Figure 12. Peak Forward Current
Versus Ambient Temperature
8
IrDA Data Sheet
115 kbps Transceiver
GP2W0001YP
RELIABILITY1
TEST ITEMS
TEST CONDITIONS
Temperature cycling
1 cycle -20°C to 85°C
(30 minutes at each extreme)
20 cycles test
High temperature and high
humidity storage
+40°C, 90% RH, 240 hours
High temperature storage
+85°C, 240 hours
Low temperature storage
-20°C, 240 hours
Operation life 1
+25°C, VCC = 5 V, 240 hours
Operation life 2
+25°C, IFM = 400 mA,
240 hours, Pulse width
78.1 µs, Duty ratio 3/16
Mechanical shock
1,000 m/s2, 6 ms,
3 times/±X, ±Y, ±Z direction
Variable frequency
vibration
200 m/s2,
100 to 2,000 to 100 Hz for
approximately 4 minutes
48 minutes/X, Y, Z direction
Reflow solder heat
230°C, 5 s.
FAILURE JUDGEMENT
CRITERIA
ICC1 > Up × 1.2
ICC2 > Up × 1.2
L < Low × 0.8
Judgement of Criteria:
VOH1 < Low × 0.8
VOH2 < Low × 0.8
VOL1 > Up × 1.2
VOL2 > Up × 1.2
tw1 > Up × 1.2
tw1 < Low × 0.8
tw2 > Up × 1.2
tw2 < Low × 0.8
tr > Up × 1.2
tf > Up × 1.2
Up: Upper
Specification Limit
Low: Lower
Specification Limit
SAMPLES
(n)
DEFECTIVE
(c)
NOTES
n = 22
c=0
2
n = 22
c=0
2
n = 22
c=0
2
n = 22
c=0
2
n = 11
c=0
2
n = 11
c=0
n = 11
c=0
n = 11
c=0
n = 11
c=0
3
NOTES:
1. Confidence level 90%, LTPD 10%/20%.
2. The sample to be tested shall be left at normal temperature and humidity for
2 hours after it is taken out of the chamber. No dew point.
3. Refer to the ‘Precautions for Soldering’ section for temperature profile.
IrDA Data Sheet
9
GP2W0001YP
115 kbps Transceiver
INCOMING INSPECTION
• Inspection lot: Inspection shall be carried out per
each delivery lot.
• Inspection method: A single sampling plan, normal
inspection level two based on ISO 2859 shall be
adopted.
Table 1. Incoming Inspection
PARAMETER
Major defect
Minor defect
INSPECTION ITEMS AND
TEST METHOD
AQL(%)
Disconnection, short
0.1
Inverse polarity on terminal
0.1
Soldering defect (obstacle
to use)
0.1
Electrical characteristic defect
0.1
Appearance defect which
affects the electrical characteristics such as, split, chip,
scratch, stain, or blur
PRECAUTIONS FOR SOLDERING
Solder Reflow
Solder only once at the temperature and the time
within the temperature profile as shown in Figure 13.
Other Precautions
An infrared lamp used to heat up for soldering may
cause a localized temperature rise in the resin. Keep the
package temperature within that specified in Figure 13.
Also avoid immersing the resin part in the solder. Even if
within the temperature profile shown in Figure 13, there
is the possibility that the gold wire in the package may
break if the deformation of the PCB affects the lead pins.
Use after fully confirming the conditions of actual solder
reflow machine.
Soldering
0.25
• Soldering iron shall be less than 25 W, and temperature of soldering iron point shall be used at less
than 260°C.
• Soldering time shall be within 3 seconds.
• Soldered product shall treat at normal temperature.
• Solder: 6/4 solder or included Ag solder.
230°C
MAX.
1 - 4°C/s
200°C
165°C
MAX.
1 - 4°C/s
1 - 4°C/s
25°C
5 s MAX.
60 s MAX.
120 s MAX.
90 s MAX.
GP2W0001YP-13
Figure 13. Temperature Profile
10
IrDA Data Sheet
115 kbps Transceiver
GP2W0001YP
TAPING SPECIFICATIONS
Taping Method
• Taping structure and dimensions: The tape should
have a structure in which a cover tape is sealed by
using heat-pressed on the carrier tape of conductive
PET. See Figure 14.
• Reel structure and dimensions: The taping reel
should be conductive plastic with its dimensions as
shown in Figure 15.
• Direction of product insertion: Product direction in
carrier tape should be such that electrode side of
product is placed on the cover tape side and lens
side of product is placed on the hold side of the tape.
See Figure 16.
• Taped device repair: To repair taped device failure,
cut the bottom of carrier tape with a cutter, and after
replacing with good devices, seal the cut portion with
adhesive tape.
• Adhesiveness of cover tape: The exfoliation force
between carrier tape and cover tape should be 0.2 N
to 1 N for the angle from 160° to 180°.
• Rolling method and quantity: Wind the tape back on
the reel so that the cover tape is on the outside.
Attach more than 20 cm of blank tape to the trailer
and the leader of the tape and fix both ends with
adhesive tape. One reel shall contain 2,000 pieces.
• Safety protection during shipping: There should be
no deformation of component or degradation of electrical characteristics due to shipping.
2.0 ±0.1
+0.1
φ1.5 -0.0
16.0 ±0.3
1.75 ±0.1
0.3 ±0.05
10.7 ±0.1
8.0 ±0.1
7.5 ±0.1
4.0 ±0.1
3.5 ±0.1
7° MAX.
4.8 ±0.25
4.1 ±0.25
NOTE: Dimensions are in mm.
GP2W0001YP-14
Figure 14. Tape Structure and Dimensions
IrDA Data Sheet
11
GP2W0001YP
115 kbps Transceiver
21 ±0.8
13 ±0.2
22.4 MAX.
100 ±0.1
2 ±0.5
330 ±2
17.5 ±0.5
NOTE: Dimensions are in mm.
GP2W0001YP-15
Figure 15. Reel Structure and Dimensions
PULL-OUT DIRECTION
LENS
SIDE
GP2W0001YP-16
Figure 16. Direction of Product Insertion
12
IrDA Data Sheet
115 kbps Transceiver
GP2W0001YP
TAPING MOISTURE-PROOF PACKING
Packaging Specifications
Table 2. Packaging Material
NAME
MATERIAL
Aluminum laminate bag
Aluminum polyethylene
Label
Paper
Desiccant
Outer case
Paper
Pads
Paper
Packaging Method
• Seal the aluminum laminated bag containing the
tape reel (2,000 pieces per reel) and desiccant.
• Fill out necessary information on the label and paste
it on the aluminum laminate bag.
• Pack four aluminum laminated bags (containing one
reel each) into the designated outer case, where
paper pads are placed on the bottom and top of the
outer case, as well as between each layer of the aluminum laminated bags. Minimum order/shipment
quantity should be one laminated bag.
• The outer case should then be sealed with packing
tape, indicating the model name, quantity, and outgoing inspection data on the case. Total of 8,000
pieces per carton.
Storage and Treatment After Unsealing
• Storage conditions: The product should be stored
with these conditions:
– Storage temperature: 10°C to 30°C
– Humidity: below 60% RH
• Treatment after opening:
– After unsealing, devices should be mounted under the temperature condition of 10°C to 30°C, at
the humidity conditions of below 60% RH, within
two days.
– In case long term storage is needed, devices
should either be stored in dry box or re-sealed in
a moisture-proof bag with desiccant and kept in
an environment where the temperature is 10°C to
30°C, at the humidity condition of below 60% RH.
Devices must be mounted within two weeks.
• Baking before mounting:
– In the event that the devices are not maintained
in the recommended storage conditions or the
enclosed desiccant indicator has turned pink,
baking must be done before devices are mounted. Please also note that baking should only be
done once.
– Recommended condition: 100°C, 12 to 24 hours.
– Baking will not be properly done with the devices
in their shipping package. To complete the baking
properly, devices should either be temporarily
mounted to PCB with adhesive, or placed in a
metal tray. The temporary mounting should be
done using adhesive, not by soldering.
Table 3. Packaging Method Specifications
PACKAGE
SHAPE
PRODUCT
QUANTITY
SACK
QUANTITY
Tape reel
(φ 330 mm)
1 model
2,000
pieces
per reel
1 reel per
moisture-proof
laminated bag
IrDA Data Sheet
13
GP2W0001YP
115 kbps Transceiver
PRODUCTS
IN TAPE-REEL
PADS
(TOTAL 5 SHEETS)
TAPE-REEL IN
ALUMINUM
LAMINATED BAG
(TOTAL 4 SETS)
DESICCANT
ALUMINUM
LAMINATED BAG
EXAMPLE 1
PACKING CASE
LABEL
(MODEL NUMBER
QUANTITY
DATE)
TAPE-REEL IN
ALUMINUM LAMINATED BAG
EXAMPLE 3
370 mm TYP.
440 mm TYP.
PACKING
TAPE
150 mm TYP.
EXAMPLE 2
PACKAGE METHOD EXAMPLES:
1. Seal the aluminum laminated bag, including the tape reel
with 2,000 pieces and desiccant.
2. Fill out the model name, quantity etc. in the blank area of label
and paste on the bag.
3. Put the four moisture-proof laminated bags in the ruled case.
Put the pad between the bags, and top and bottom.
4. Seal the case with packing tape, and indicate model name
and quantity. (8,000 pieces/package)
Total Packaged mass: Approximately 3.6 kg.
MODEL NUMBER
QUANTITY
DATE
EXAMPLE 4
NOTE: Dimensions are in mm.
GP2W0001YP-17
Figure 17. Packing Specification
14
IrDA Data Sheet
115 kbps Transceiver
GP2W0001YP
LIFE SUPPORT POLICY
SHARP components should not be used in medical devices with life support functions or in safety equipment (or similiar applications where
component failure would result in loss of life or physical harm) without the written approval of an officer of the SHARP Corporation.
LIMITED WARRANTY
SHARP warrants to its Customer that the Products will be free from defects in material and workmanship under normal use and service for a
period of one year from the date of invoice. Customer's exclusive remedy for breach of this warranty is that SHARP will either (i) repair or
replace, at its option, any Product which fails during the warranty period because of such defect (if Customer promptly reported the failure to
SHARP in writing) or, (ii) if SHARP is unable to repair or replace, refund the purchase price of the Product upon its return to SHARP. This
warranty does not apply to any Product which has been subjected to misuse, abnormal service or handling, or which has been altered or
modified in design or construction, or which has been serviced or repaired by anyone other than Sharp. The warranties set forth herein are in
lieu of, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE
WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY
EXCLUDED. In no event will Sharp be liable, or in any way responsible, for any incidental or consequential economic or property damage.
The above warranty is also extended to Customers of Sharp authorized distributors with the following exception: reports of failures of Products
during the warranty period and return of Products that were purchased from an authorized distributor must be made through the distributor.
In case Sharp is unable to repair or replace such Products, refunds will be issued to the distributor in the amount of distributor cost.
SHARP reserves the right to make changes in specifications at any time and without notice. SHARP does not assume any responsibility
for the use of any circuitry described; no circuit patent licenses are implied.
NORTH AMERICA
EUROPE
ASIA
SHARP Microelectronics
of the Americas
5700 NW Pacific Rim Blvd.
Camas, WA 98607, U.S.A.
Phone: (360) 834-2500
Telex: 49608472 (SHARPCAM)
Facsimile: (360) 834-8903
http://www.sharpsma.com
SHARP Electronics (Europe) GmbH
Microelectronics Division
Sonninstraße 3
20097 Hamburg, Germany
Phone: (49) 40 2376-2286
Facsimile: (49) 40 2376-2232
http://www.sharpmed.com
SHARP Corporation
Integrated Circuits Group
2613-1 Ichinomoto-Cho
Tenri-City, Nara, 632, Japan
Phone: +81-743-65-1321
Facsimile: +81-743-65-1532
http://www.sharp.co.jp
©2000 by SHARP Corporation
Reference Code SMA00011