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DS42MB100
SNLS244H – SEPTEMBER 2006 – REVISED JANUARY 2016
DS42MB100 4.25-Gbps 2:1/1:2 CML MUX/Buffer
With Transmit Pre-Emphasis and Receive Equalization
1 Features
3 Description
•
•
The DS42MB100 device is a signal conditioning 2:1
multiplexer and 1:2 fan-out buffer designed for use in
backplane-redundancy or cable driving applications.
Signal conditioning features include continuous time
linear equalization (CTLE) and programmable output
pre-emphasis that enable data communication in FR4
backplane up to 4.25 Gbps. Each input stage has a
fixed equalizer to reduce ISI distortion from board
traces.
1
•
•
•
•
•
•
•
•
•
2:1 Multiplexer and 1:2 Buffer
0.25-Gbps to 4.25-Gbps Fully Differential Data
Paths
Fixed Input Equalization
Programmable Output Pre-Emphasis
Independent Pre-Emphasis Controls
Programmable Loopback Modes
On-Chip Terminations
ESD Rating of 6-kV HBM
3.3-V Supply
Lead-Less WQFN-36 Package
–40°C to +85°C Operating Temperature Range
2 Applications
•
•
•
Backplane Drivers or Cable Drivers
Redundancy and Signal Conditioning Applications
CPRI/OBSAI
All output drivers have four selectable levels of preemphasis to compensate for transmission losses from
long FR4 backplane or cable attenuation reducing
deterministic jitter. The pre-emphasis levels can be
independently controlled for the line-side and switchside drivers. The internal loopback paths from switchside input to switch-side output enable at-speed
system testing. All receiver inputs are internally
terminated with 100-Ω differential terminating
resistors. All driver outputs are internally terminated
with 50-Ω terminating resistors to VCC.
Device Information(1)
PART NUMBER
DS42MB100
PACKAGE
WQFN (36)
BODY SIZE (NOM)
6.00 mm × 6.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Block Diagram
Switch Side
Line Side
EQ
OUT+-
IN0 +EQS
DE_L
EQ
IN1 +-
MUX
LB0
OUT0 +DE_S
IN + -
OUT1 +-
EQ
DE_S
LB1
EQL
DEL _0
DEL_1
DES_0
DES_1
DE _L
Pre-emphasis
Control
DE_S
VCC
GND
RSV
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DS42MB100
SNLS244H – SEPTEMBER 2006 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
5
5
5
7
8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Ratings............................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 8
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
9
Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Application ................................................. 12
10 Power Supply Recommendations ..................... 17
11 Layout................................................................... 17
11.1 Layout Guidelines ................................................. 17
11.2 Layout Example .................................................... 17
12 Device and Documentation Support ................. 19
12.1
12.2
12.3
12.4
12.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
19
19
19
19
19
13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (April 2013) to Revision H
Page
•
Added Pin Configuration and Functions section, Storage Conditions table, ESD Ratings table, Thermal Information
table, Parameter Measurement Information section, Feature Description section, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
•
Changed thermal information per latest modeling results ...................................................................................................... 5
•
Changed board trace attenuation estimate, per recent measurement ................................................................................ 14
Changes from Revision F (April 2013) to Revision G
•
2
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 12
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5 Pin Configuration and Functions
VCC
33
32
LB0
IN+
34
GND
IN-
35
OUT-
GND
36
OUT+
EQS
NJK Package
36-Pin WQFN
Top View
31
30
29
28
DES_1
1
27
DEL_1
GND
2
26
LB1
OUT0+
3
25
IN1+
OUT0-
4
WQFN- 36
24
IN1-
DAP = GND
23
VCC
Top View Shown
22
OUT1+
GND
GND
9
19
MUX
11
12
13
14
15
16
17
18
DEL_0
10
RSV
8
VCC
OUT1-
20
GND
21
GND
GND
7
VCC
IN0-
GND
6
EQL
5
DES_0
VCC
IN0+
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
LINE SIDE HIGH SPEED DIFFERENTIAL I/Os
IN+
IN−
33
34
I
Inverting and non-inverting differential inputs at the line side. IN+ and IN− have an internal 50 Ω
connected to an internal reference voltage. See Figure 8.
OUT+
OUT−
30
31
O
Inverting and non-inverting differential outputs at the line side. OUT+ and OUT− have an internal
50 Ω connected to VCC.
SWITCH SIDE HIGH SPEED DIFFERENTIAL I/Os
IN0+
IN0−
6
7
I
Inverting and non-inverting differential inputs to the MUX at the switch side. IN0+ and IN0− have
an internal 50 Ω connected to an internal reference voltage. See Figure 8.
IN1+
IN1−
25
24
I
Inverting and non-inverting differential inputs to the MUX at the switch side. IN1+ and IN1− have
an internal 50 Ω connected to an internal reference voltage. See Figure 8.
OUT0+
OUT0−
3
4
O
Inverting and non-inverting differential outputs at the switch side. OUT0+ and OUT0− have an
internal 50 Ω connected to VCC.
OUT1+
OUT1−
22
21
O
Inverting and non-inverting differential outputs at the switch side. OUT1+ and OUT1− have an
internal 50 Ω connected to VCC.
CONTROL (3.3-V LVCMOS)
DEL_0
DEL_1
18
27
I
DEL_0 and DEL_1 select the output pre-emphasis of the line side drivers (OUT±).
DEL_0 and DEL_1 are internally pulled high.
DES_0
DES_1
10
1
I
DES_0 and DES_1 select the output pre-emphasis of the switch side drivers (OUT0±, OUT1±).
DES_0 and DES_1 are internally pulled high.
EQL
11
I
A logic low enables the input equalizer on the line side. EQL is internally pulled high. Default is
with EQ disabled.
EQS
36
I
A logic low enables the input equalizer on the switch side. EQS is internally pulled high. Default
is with EQ disabled.
LB0
28
I
A logic low at LB0 enables the internal loopback path from IN0± to OUT0±. LB0 is internally
pulled high.
LB1
26
I
A logic low at LB1 enables the internal loopback path from IN1± to OUT1±. LB1 is internally
pulled high.
MUX
19
I
A logic low at MUX selects IN1±. MUX is internally pulled high. Default state for MUX is IN0±.
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Pin Functions (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
17
I
Reserve pin to support factory testing. This pin can be left open, or tied to GND, or tied to GND
through an external pull-down resistor.
GND
2, 8, 9, 12,
14, 16, 20,
29, 35
P
Ground reference. Each ground pin should be connected to the ground plane through a low
inductance path, typically with a via located as close as possible to the landing pad of the GND
pin.
GND
DAP
P
DAP is the metal contact at the bottom side, located at the center of the WQFN package. It
should be connected to the GND plane with at least 16 via to lower the ground impedance and
improve the thermal performance of the package.
P
VCC = 3.3 V ± 5%.
Each VCC pin should be connected to the VCC plane through a low inductance path, typically with
a via located as close as possible to the landing pad of the VCC pin.
It is recommended to have a 0.01 μF or 0.1 μF, X7R, size-0402 bypass capacitor from each VCC
pin to ground plane.
RSV
POWER
5, 13, 15,
23, 32
VCC
6 Specifications
6.1 Absolute Maximum Ratings
see (1) (2)
MIN
MAX
UNIT
Supply voltage (VCC)
–0.3
4
V
CMOS/TTL input voltage
–0.3
VCC + 0.3
V
CML input/output voltage
–0.3
VCC + 0.3
V
Junction temperature
150
°C
Lead temperature (soldering, 4 seconds)
260
°C
150
°C
Storage temperature, Tstg
(1)
(2)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
4
Electrostatic discharge
Human-body model (HBM), 1.5 kΩ, 100 pF, per ANSI/ESDA/JEDEC JS001 (1)
±6000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1250
Machine model
±350
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Ratings
Supply voltage (VCC – GND)
Supply noise amplitude
MIN
NOM
MAX
3.135
3.3
3.465
(10 Hz to 2 GHz)
Ambient temperature
–40
Case temperature
UNIT
V
100
mVPP
85
°C
100
°C
6.4 Thermal Information
DS42MB100
THERMAL METRIC (1)
NJK (WQFN)
UNIT
36 PINS
RθJA
Junction-to-ambient thermal resistance (2)
32.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
14.3
°C/W
RθJB
Junction-to-board thermal resistance
6.2
°C/W
ψJT
Junction-to-top characterization parameter
0.2
°C/W
ψJB
Junction-to-board characterization parameter
6.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.9
°C/W
(1)
(2)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Thermal resistances are based on having 16 thermal relief vias on the DAP pad under the 0 airflow condition.
6.5 Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
LVCMOS DC SPECIFICATIONS
VIH
High level input voltage
2
VCC + 0.3
V
VIL
Low level input voltage
–0.3
0.8
V
IIH
High level input current
VIN = VCC
–10
10
µA
IIL
Low level input current
VIN = GND
75
RPU
Pull-high resistance
94
124
35
µA
kΩ
RECEIVER SPECIFICATIONS
Differential input voltage
range (2)
VID
AC coupled differential
signal.
This parameter is not
tested at production.
Below 1.25 Gbps
100
1750
Between 1.25 Gbps–3.125 Gbps
100
1560 mVP-P
Above 3.125 Gbps
100
1200
VICM
Common-mode voltage
at receiver inputs
Measured at receiver inputs reference to ground.
RITD
Input differential
termination (3)
On-chip differential termination between IN+ or IN−.
(1)
(2)
(3)
1.3
84
100
V
116
Ω
Typical parameters measured at VCC = 3.3 V, TA = 25°C, and represent most likely parametric norms at the time of product
characterization. The typical specifications are not ensured.
This parameter is specified by design and/or characterization. It is not tested in production.
IN+ and IN− are generic names refer to one of the many pairs of complimentary inputs of the DS42MB100. OUT+ and OUT− are
generic names refer to one of the many pairs of the complimentary outputs of the DS42MB100. Differential input voltage VID is defined
as |IN+–IN−|. Differential output voltage VOD is defined as |OUT+–OUT−|.
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Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
1100
1300
MAX
UNIT
DRIVER SPECIFICATIONS
Output differential
voltage swing without
pre-emphasis (4)
RL = 100 Ω ±1%
DES_1 = DES_0 = 0
DEL_1 = DEL_0 = 0
Driver pre-emphasis disabled.
Running K28.7 pattern at 4.25 Gbps.
See Figure 6 for test circuit.
Output pre-emphasis
voltage ratio
20 × log (VODPE /
VODB)
RL = 100 Ω ±1%
Running K28.7 pattern
at
4.25 Gbps
x = S for switch side
pre-emphasis control
x = L for line side preemphasis control
See Figure 9 on
waveform.
See Figure 6 for test
circuit.
TPE
Pre-emphasis width
Tested at −9-dB pre-emphasis level, DEx[1:0] = 11
x = S for switch side pre-emphasis control
x = L for line side pre-emphasis control
See Figure 3 on measurement condition.
ROTSE
Output termination (3)
On-chip termination from OUT+ or OUT− to VCC
ROTD
Output differential
termination
On-chip differential termination between OUT+ and OUT−
VODB
VPE
ΔROTS Mismatch in output
termination resistors
E
VOCM
DEx_[1:0] = 00
0
DEx_[1:0] = 01
–3
DEx_[1:0] = 10
–6
1500 mVP-P
dB
DEx_[1:0] = 11
–9
125
188
250
ps
42
50
58
Ω
Ω
100
Mismatch in output terminations at OUT+ and OUT−
5%
Output common mode
voltage
2.7
V
0.45
W
POWER DISSIPATION
PD
Power dissipation
VDD = 3.3 V at 25°C
All outputs terminated by 100 Ω ±1%.
DEL_[1:0] = 0, DES_[1:0] = 0
Running PRBS 27– 1 pattern at 4.25 Gbps
AC CHARACTERISTICS
RJ
Device random jitter (5)
See Figure 6 for test
circuit.
Alternating 1-0 pattern.
EQ and pre-emphasis
disabled.
At 0.25 Gbps
2
At 1.25 Gbps
2
At 4.25 Gbps
2
DJ
Device deterministic
jitter (6)
See Figure 6 for test
circuit.
EQ and pre-emphasis
disabled
DR
Data rate (2)
Tested with alternating 1-0 pattern
(4)
(5)
(6)
6
Between 0.25 and
4.25 Gbps with PRBS7 pattern for
DS42MB100 at –40°C to 85°C
0.25
psrms
35
psp-p
4.25
Gbps
K28.7 pattern is a 10-bit repeating pattern of K28.7 code group {001111 1000} K28.5 pattern is a 20-bit repeating pattern of +K28.5 and
−K28.5 code groups {110000 0101 001111 1010}
Device output random jitter is a measurement of the random jitter contribution from the device. It is derived by the equation
sqrt(RJOUT2 – RJIN2), where RJOUT is the total random jitter measured at the output of the device in psrms, RJIN is the random jitter of the
pattern generator driving the device.
Device output deterministic jitter is a measurement of the deterministic jitter contribution from the device. It is derived by the equation
(DJOUT – DJIN), where DJOUT is the total peak-to-peak deterministic jitter measured at the output of the device in psp-p, DJIN is the peakto-peak deterministic jitter of the pattern generator driving the device.
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6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Measured with a clock-like pattern at 4.25
Gbps, between 20% and 80% of the differential
output voltage. Pre-emphasis disabled.
Transition time is measured with fixture as
shown in Figure 6, adjusted to reflect the
transition time at the output pins.
tR
Differential low to high transition
time
tF
Differential high to low transition
time
tPLH
Differential low to high propagation
delay
tPHL
Differential high to low propagation
delay
tSKP
Pulse skew
UNIT
ps
85
ps
|tPHL – tPLH|
(1)
MAX
85
Measured at 50% differential voltage from input
to output.
1
ns
1
ns
20
ps
Difference in propagation delay among data
paths in the same device.
100
ps
100
ps
6
ns
tSKO
Output skew
tSKPP
Part-to-part skew
Difference in propagation delay between the
same output from devices operating under
identical condition.
tSM
MUX switch time
Measured from VIH or VIL of the MUX-control or
loopback control to 50% of the valid differential
output.
(1)
TYP
1.8
tSKO is the magnitude difference in the propagation delays among data paths. An example is the output skew among data paths from
IN0± to OUT± and IN1± to OUT±.. Another example is the output skew among data paths from IN± to OUT0± and IN± to OUT1±. tSKO
also refers to the delay skew of the loopback paths of the same port and between similar data paths. An example is the output skew
among data paths IN0± to OUT0± and IN1± to OUT1±.
80%
80%
0V
VODB
20%
20%
tR
tF
Figure 1. Driver Output Transition Time
IN
50% VID
tPLH
tPHL
OUT
50% VOD
Figure 2. Propagation Delay From Input To Output
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1-bit
1 to N bits
1-bit
1 to N bits
tPE
20%
-9 dB
VODB
VODPE3
80%
0V
Figure 3. Test Condition For Output Pre-Emphasis Duration
100 mV/div
100 mV/div
6.7 Typical Characteristics
42 ps/div
50 ps/div
Figure 4. PRBS-7, Pre-Emphasis = 0 dB at 4 Gbps
Figure 5. PRBS-7, Pre-Emphasis = –9 dB at 4 Gbps
7 Parameter Measurement Information
DS42MB100 Test Fixture
Pattern
Generator
DC
Block
VCC
DS42MB100
Coax
D+
INPUT
25-inch
TLine
D-
IN+
IN-
EQ
R
Oscilloscope or
Jitter Measurement
Instrument
Coax
M
U
X
50+-1%
OUT+
< 2"
D
OUT-
Coax
1000 mVpp
Differential
DC
Block
50: TL
Coax
GND
50: TL
50 +-1%
Figure 6. AC Test Circuit
8
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8 Detailed Description
8.1 Overview
The DS42MB100 is a signal conditioning 2:1 multiplexer and a 1:2 buffer designed to support port redundancy
with encoded or scrambled data rates between 0.25 and 4.25 Gbps. The DS42MB100 provides fixed
equalization at the receive input and pre-emphasis control on the output in order to support signal reach
extension.
8.2 Functional Block Diagram
DS42MB100
1.5V
50
50
VCC
IN0+
50
OUT +
50
Input stage
+ EQ
M
U
X
CML
driver
IN0-
IN1+
OUT Input stage
+ EQ
IN1-
DE _L
50
50
1.5V
MUX
VCC
LB0
DE _S
LB1
50
50
2
IN +
2
Input stage
+ EQ
IN-
OUT 0+
M
U
X
CML
driver
OUT 0-
OUT 1+
2
50
50
1.5V
2
M
U
X
CML
driver
OUT 1-
EQ_L
50
50
DE _S
DEL _0
DE _L
DEL _1
VCC
Pre-emphasis
Control
DES _0
DE_S
DES _1
Figure 7. Simplified Block Diagram
8.3 Feature Description
The DS42MB100 MUX buffer consists of several key blocks:
• CML Inputs and EQ
• Multiplexer and Loopback Control
• CML Drivers and Pre-Emphasis Control
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Feature Description (continued)
8.3.1 CML inputs and EQ
The high speed inputs are self-biased to about 1.3 V at IN+ and IN- and are designed for AC coupling, allowing
the DS42MB100 to be inserted directly into the datapath without any limitation. See Figure 8 for details about the
internal receiver input termination and bias circuit.
VCC
5k
IN +
50
1.5V
EQ
50
IN 3.9k
180 pF
Figure 8. Receiver Input Termination and Bias Circuit
The inputs are compatible to most AC coupling differential signals such as LVDS, LVPECL, and CML. The ideal
AC coupling capacitor value is often based on the lowest frequency component embedded within the serial link.
A typical AC coupling capacitor value ranges between 100 and 1000 nF. Some specifications with scrambled
data may require a larger coupling capacitor for optimal performance. To reduce unwanted parasitics around and
within the AC coupling capacitor, a body size of 0402 is recommended. Figure 6 shows the AC coupling
capacitor placement in an AC test circuit.
Each input stage has a fixed equalizer that provides equalization to compensate about 5 dB (at 2 GHz) of
transmission loss from a short backplane trace (about 10 inches backplane). EQ can be enabled or disabled with
the EQL and EQS pins.
Table 1. EQ Controls for Line and Switch Inputs
PIN
EQL, EQS
PIN VALUE
EQUALIZER FUNCTION
0
Enable equalization.
1 (default)
Normal mode. Equalization disabled.
8.3.2 Multiplexer and Loopback Control
Table 2 and Table 3 provide details about how to configure the DS42MB100 multiplexer and loopback settings.
Table 2. Logic Table for Multiplex Controls
PIN
MUX
PIN VALUE
MUX FUNCTION
0
MUX select switch input IN1±.
1 (default)
MUX select switch input IN0±.
Table 3. Logic Table for Loopback Controls
PIN
LB0
LB1
10
PIN VALUE
LOOPBACK FUNCTION
0
Enable loopback from IN0± to OUT0±.
1 (default)
Normal mode. Loopback disabled.
0
Enable loopback from IN1± to OUT1±.
1 (default)
Normal mode. Loopback disabled.
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8.3.3 CML Drivers and Pre-Emphasis Control
The output driver has pre-emphasis (driver-side equalization) to compensate the transmission loss of the
backplane that it is driving. The driver conditions the output signal such that the lower frequency and higher
frequency pulses reach approximately the same amplitude at the end of the backplane and minimize the
deterministic jitter caused by the amplitude disparity. The DS42MB100 provides four steps of user-selectable preemphasis ranging from 0, –3, –6 and –9 dB to handle different lengths of backplane. Figure 9 shows a driver preemphasis waveform. The pre-emphasis duration is 188 ps nominal, corresponding to 0.8 unit intervals (UI) at
4.25 Gbps. The pre-emphasis levels of switch-side and line-side can be individually programmed.
1-bit
1 to N bits
1-bit
1 to N bits
0 dB
- 3 dB
- 6 dB
VODPE2
VODPE1
VODPE3
0V
VODB
- 9 dB
Figure 9. Driver Pre-Emphasis Differential Waveform (Showing All 4 Pre-Emphasis Steps)
Table 4. Line-Side Pre-Emphasis Controls
DEL_[1:0]
PRE-EMPHASIS LEVEL IN
mVPP
(VODB)
PRE-EMPHASIS LEVEL IN
mVPP
(VODPE)
00
1300
01
1300
10
11
(default)
DES_[1:0]
PRE-EMPHASIS LEVEL IN
mVPP
(VODB)
PRE-EMPHASIS LEVEL IN
mVPP
(VODPE)
PRE-EMPHASIS IN dB
(VODPE/VODB)
TYPICAL FR4
BOARD TRACE
00
1300
1300
0
10 inches
01
1300
920
−3
20 inches
10
1300
650
−6
30 inches
11
(default)
1300
461
−9
40 inches
PRE-EMPHASIS IN dB
(VODPE/VODB)
TYPICAL FR4
BOARD TRACE
1300
0
10 inches
920
−3
20 inches
1300
650
−6
30 inches
1300
461
−9
40 inches
Table 5. Switch-Side Pre-Emphasis Controls
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The DS42MB100 is a 2:1 MUX and 1:2 buffer that equalizes input data up to 4.25 Gbps and provides transmit
pre-emphasis controls to improve overall signal reach. As a MUX buffer, the DS42MB100 is ideal for designs
where there is a need for port sharing or redundancy as well as on-the-fly reorganization of routes and data
connections.
9.2 Typical Application
A typical application for the DS42MB100 is shown in Figure 10 and Figure 11.
Passive Backplane
Line Cards
DS42MB100
SerDes
HT
TD
SOB
T_ CLK
ASIC
PHY
SOA
LI
SIA
RD
R_CLK
HR
LO
SIB
REFCLK
Mux/Buf
Clock
Distribution
ASIC or FPGA with integrated SerDes
PC
Switch Card 2
Switch Card 1
SerDes
TD
Switch
ASIC
HT
T_ CLK
RD
R_CLK
HR
REFCLK
Clock
Distribution
ASIC or FPGA with integrated SerDes
Figure 10. Network Switch System With Redundancy
12
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Typical Application (continued)
DS42MB100
1.5V
50
50
VCC
2 x 0.01 PF
0402 - size
IN0+
50
To Upstream
receiver
50
OUT +
Input stage
+ EQ
M
U
X
CML
driver
From
downstream
transmitter
IN0-
IN1+
From
downstream
transmitter
OUT Input stage
+ EQ
IN1-
DE _L
2 x 0.01 PF
0402 - size
50
50
1.5V
Control
MUX
VCC
LB0
DE _S
LB1
50
50
2
IN +
From
Upstream
transmitter
Input stage
+ EQ
IN-
2 x 0.01 PF
0402 - size
2
OUT0+
M
U
X
To
downstream
CML
driver
OUT0- receiver
2
50
50
1.5V
2
OUT1+
M
U
X
To
downstream
OUT1- receiver
CML
driver
50
Control
DEL _0
DE _L
DEL _1
DES _0
50
DE _S
Pre-emphasis
Control
VCC
DE_S
DES _1
GND pins
and DAP
VCC pins
RSV
3.3V
4 x 0.01 PF
X7R
0402 - size
Figure 11. DS42MB100 Connection Block Diagram
9.2.1 Design Requirements
In a typical design, the DS42MB100 equalizes a short backplane trace on its input, followed by a longer trace at
the DS42MB100 output. In this application example, a 25-inch FR4 coupled micro-strip board trace is used in
place of the short backplane link. A block diagram of this example is shown in Figure 12.
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Typical Application (continued)
(A)
(B)
Pattern
Generator, 4 Gb/s
(C)
(D)
DS42MB100
Pre-Emph
D+
D-
25-inch FR4
board trace
M
IN+
EQ
IN-
R
U
OUT+
D
40-inch
FR4 trace
OUT-
X
27 -1 pattern
Figure 12. Block Diagram of DS42MB100 Application Example
The 25-inch microstrip board trace has approximately 6 dB of attenuation between 375 MHz and 1.875 GHz,
representing closely the transmission loss of the short backplane transmission line. The 25-inch microstrip is
connected between the pattern generator and the differential inputs of the DS42MB100 for AC measurements.
Table 6. Input Trace Parameters
TRACE LENGTH
FINISHED TRACE
WIDTH W
SEPARATION
BETWEEN TRACES
DIELECTRIC
HEIGHT H
DIELECTRIC
CONSTANT εR
LOSS TANGENT
25 inches
8.5 mil
11.5 mil
6 mil
3.8
0.022
The length of the output trace may vary based on system requirements. In this example, a 40-inch FR4 trace
with similar trace width, separation, and dielectric characteristics, is placed at the DS42MB100 output.
As with any high speed design, there are many factors which influence the overall performance. Following is a
list of critical areas for consideration and study during design.
• Use 100-Ω impedance traces. Generally these are very loosely coupled to ease routing length differences.
• Place AC-coupling capacitors near to the receiver end of each channel segment to minimize reflections.
• The maximum body size for AC-coupling capacitors is 0402.
• Back-drill connector vias and signal vias to minimize stub length.
• Use reference plane vias to ensure a low inductance path for the return current.
9.2.2 Detailed Design Procedure
For optimal design, the DS42MB100 must be configured to route incoming data correctly as well as provide the
best signal quality. The following design procedures should be observed:
1. The DS42MB100 should be configured to provide the correct MUX and buffer routes in order to satisfy
system requirements. In order to set the appropriate MUX control settings, refer to Table 2. To configure the
buffer control settings, refer to Table 3. For example, consider the case where the designer wishes to route
the input from Switch Card 0 (IN0±) to the output for the line card (OUT±). To accomplish this, set MUX = 1
(select IN0±). For the other direction from line card output to switch card, set LB0 = 1 and LB1 = 1 so that the
input from the line card is buffered to both Switch Card 0 (OUT0±) and Switch Card 1 (OUT1±).
2. The DS42MB100 is designed to be placed at an offset location with respect to the overall channel
attenuation. To optimize performance, determine whether input and output equalization is required. Set EQL
= 0 and EQS = 0 to enable input equalization. The MUX buffer transmit pre-emphasis can be tuned to extend
the trace length reach while also recovering a solid eye opening. To tune transmit pre-emphasis on either the
line card side or switch card side, refer to Table 4 and Table 5 for recommended pre-emphasis control
settings according to the length of FR4 board trace connected at the DS42MB100 output. For example, if 40
inches of FR4 trace is connected to the switch card output, set DES_[1:0] = (1, 1) for VOD = 1200 mVpp and
–9 dB of transmit pre-emphasis.
14
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9.2.3 Application Curves
Figure 13 through Figure 18 show how the signal integrity varies at different places in the data path. These
measured locations can be referenced back to the labeled points provided in Figure 12.
• Point (A): Output signal of source pattern generator
• Point (B): Input to DS42MB100 after 25 inches of FR4 trace from source
• Point (C): Output of DS42MB100 driver
• Point (D): Signal after 40 inches of FR4 trace from DS42MB100 driver
200 mV/DIV
200 mV/DIV
The source signal is a PRBS-7 pattern at 4 Gbps. For the long output traces, the eye after 40 inches of output
FR4 trace is significantly improved by adding –9 dB of pre-emphasis.
50 ps/DIV
Figure 14. Eye Measured at Point (B)
200 mV/DIV
200 mV/DIV
50 ps/DIV
Figure 13. Eye Measured at Point (A)
50 ps/DIV
Figure 15. Eye Measured at Point (C),
Pre-Emphasis = 0 dB
50 ps/DIV
Figure 16. Eye Measured at Point (D),
Pre-Emphasis = 0 dB
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200 mV/DIV
200 mV/DIV
SNLS244H – SEPTEMBER 2006 – REVISED JANUARY 2016
50 ps/DIV
Figure 17. Eye Measured at Point (C),
Pre-Emphasis = –9 dB
16
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50 ps/DIV
Figure 18. Eye Measured at Point (D),
Pre-Emphasis = –9 dB
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10 Power Supply Recommendations
The supply (VCC) and ground (GND) pins should be connected to power planes routed on adjacent layers of the
printed circuit board. The layer thickness of the dielectric should be minimized so that the VCC and GND planes
create a low inductance supply with distributed capacitance. Careful attention to supply bypassing through the
proper use of bypass capacitors is required. A 0.01-μF or 0.1-μF bypass capacitor should be connected to each
VCC pin such that the capacitor is placed as close as possible to the VCC pins. Smaller body size capacitors, such
as 0402 body size, can help facilitate proper component placement. Refer to the VCC pin connections in
Figure 11 for further details.
11 Layout
11.1 Layout Guidelines
Use at least a four layer board with a power and ground plane. Closely-coupled differential lines of 100 Ω are
typically recommended for differential interconnect. The closely coupled lines help to ensure that coupled noise
will appear as common-mode and thus will be rejected by the receivers. Information on the WQFN style package
is provided in AN-1187 Leadless Leadframe Package (LLP), SNOA401.
11.2 Layout Example
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improve
board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown in Figure 19. A
layout example for the DS42MB100 is shown in Figure 20, where 16 stencil openings are used for the DAP
alongside nine vias to GND.
Figure 19. No Pullback WQFN, Single Row Reference Diagram
Table 7. No Pullback WQFN Stencil Aperture Summary for DS42MB100
DEVICE
PIN
COUNT
MKT
DWG
PCB I/O
PAD SIZE
(mm)
PCB
PITCH
(mm)
PCB DAP
SIZE (mm)
STENCIL I/O
APERTURE
(mm)
STENCIL DAP
APERTURE
(mm)
NUMBER
OF DAP
APERTURE
OPENINGS
GAP BETWEEN
DAP APERTURE
(Dim A mm)
DS42MB100
36
SQA36A
0.25 × 0.6
0.5
4.6 × 4.6
0.25 × 0.7
1.0 × 1.0
16
0.2
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Figure 20. 36-Pin WQFN Stencil Example of Via and Opening Placement
18
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
AN-1187 Leadless Leadframe Package (LLP), SNOA401
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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14-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
DS42MB100TSQ/NOPB
ACTIVE
Package Type Package Pins Package
Drawing
Qty
WQFN
NJK
36
250
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
42MB100
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2015
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DS42MB100TSQ/NOPB
Package Package Pins
Type Drawing
WQFN
NJK
36
SPQ
250
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
178.0
16.4
Pack Materials-Page 1
6.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.3
1.5
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS42MB100TSQ/NOPB
WQFN
NJK
36
250
213.0
191.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
NJK0036A
SQA36A (Rev A)
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