LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT SMD DISPLAY(0.28") Pb Lead-Free Parts LSSD205/66F-XX DATA SHEET DOC. NO : QW0905-LSSD205/66F-XX REV. : A DATE : 16 - Jun. - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/9 PART NO. LSSD205/66F-XX Package Dimensions 7.5(0.295") 3.75(0.148") 1.27X5=6.35 (0.25") 12 0.6(0.024") 7 0.98(0.039") 1.0 (0.039") A F 7.0 (0.28") B 10.0 10.8 (0.394") (0.425") G E C D DP 1 6 ψ0.9(0.035") R0.4 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 1.0 2.1 8.5 1.27X6=7.62 Note : The tolerances unless mentioned is ±0.1mm 12.7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/66F-XX Page 2/9 Internal Circuit Diagram LSSD2056F-XX 3,10 A B C D 11 12 2 4 E F 5 9 G DP 7 1 LSSD2066F-XX 3,10 A B C D 11 12 2 4 E F 5 9 G DP 7 1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/9 PART NO. LSSD205/66F-XX Electrical Connection PIN NO. LSSD2056F-XX PIN NO. LSSD2066F-XX 1 Anode DP 1 Cathode DP 2 Anode C 2 Cathode C 3 Common Cathode 3 Common Anode 4 Anode D 4 Cathode D 5 Anode E 5 Cathode E 6 No Pin 6 No Pin 7 Anode G 7 Cathode G 8 Nc 8 Nc 9 Anode F 9 Cathode F 10 Common Cathode 10 Common Anode 11 Anode A 11 Cathode A 12 Anode B 12 Cathode B LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/66F-XX Page 4/9 Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol Ratings UNIT Power Dissipation Per Chip PD 72 mW Peak Forward Current Per Chip Duty 1/10@10KHz IFP 90 mA Forward Current Per Chip IF 30 mA Reverse Current Per Chip @5V Ir 10 μA Electrostatic Discharge ESD 2000 V Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode or anode Material Emitted CHIP PART NO △λ Vf(v) (nm) IV(mcd) Min. Max. Min. Typ. 1.5 7.2 IV-M Common Cathode LSSD2056F-XX AIGaInP LSSD2066F-XX Electrical λD (nm) Red 630 20 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.4 4.0 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/66F-XX Page 5/9 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Dominant Wavelegth λD nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page6/9 PART NO. LSSD205/66F-XX Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 1.5 2.0 2.5 3.0 1.0 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize@25 ℃ 1.2 Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 100 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 100 10 1.0 0.5 0 550 600 650 Wavelength (nm) 700 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/9 PART NO. LSSD205/66F-XX Carrier Type Dimensions 4.0 1.5 2.0±0.2 1.75 0.3 11.5 24.0±0.3 11.1 12.0 7.8 4.15 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. Package Dimensions 1300PCS / REEL 28.6±0.5 24±0.5 13.5±0.5 99.5±1.5 330±2.0 2.5±0.2 立碁電子工業股份有限公司 LIGITEK ELEC TR ON ICS CO., LTD. PART NO. : L SSD2056F-20 LOT NO. : GS 1-96 0038 Q'TY(P CS) : 130 0 PCS BIN/HUE : O LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/66F-XX Page 8/9 Recommended Soldering Conditions 1.Hand Solder : Soldering Iron:30W Max Temperature 280°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2. PB-Free Reflow Solder Temp. (℃) 260°C/10 sec Max 260 rise +5° c/sec cooling -5° c/sec 220 200 180 Preheat 25 Time 120 sec Max 10 sec Max Above 220° C 60 sec Max Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/9 PART NO. LSSD205/66F-XX Reliability Test: Classification Test Item Test Condition Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=1000hrs ±2hrs Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling IR Reflow 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 300 cycles 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface 1.105 ℃ ~ 25 ℃ ~ -55 ℃ ~ 25 ℃ 30mins 5mins 30mins 5mins 2.10 Cyeles 1.T=260 ° C Max. 10sec.Max. 2. 6 Min