ATMEL ATA6827 High temperature triple half-bridge driver with serial input control Datasheet

Features
•
•
•
•
•
•
•
•
•
•
•
•
Supply Voltage up to 40V
RDSon Typically 0.8Ω at 25°C, Maximum 1.8Ω at 200°C
Up to 1.0A Output Current
Three Half-bridge Outputs Formed by Three High-side and Three Low-side Drivers
Capable to Switch all Kinds of Loads Such as DC Motors, Bulbs, Resistors, Capacitors
and Inductors
No Shoot-through Current
Outputs Short-circuit Protected
Overtemperature Protection for Each Switch and Overtemperature Prewarning
Undervoltage Protection
Various Diagnostic Functions Such as Shorted Output, Open-load, Overtemperature
and Power-supply Fail Detection
Serial Data Interface, Daisy Chain Capable, up to 2 MHz Clock Frequency
QFN18 Package
1. Description
The ATA6827 is a fully protected driver IC specially designed for high temperature
applications. In mechatronic solutions, for example turbo charger or exhaust gas recirculation systems, many flaps have to be controlled by DC motor driver ICs which are
located very close to the hot engine or actuator where ambient temperatures up to
150°C are usual. Due to the advantages of SOI technology junction temperatures up
to 200°C are allowed. This enables new cost effective board design possibilities to
achieve complex mechatronic solutions.
The ATA6827 is a fully protected Triple Half-Bridge to control up to 3 different loads by
a microcontroller in automotive and industrial applications. Each of the 3 high-side and
3 low-side drivers is capable to drive currents up to 1.0A. The drivers are internally
connected to form 3 half-bridges and can be controlled separately from a standard
serial data interface. Therefore, all kinds of loads such as bulbs, resistors, capacitors
and inductors can be combined. The IC design especially supports the application of
H-bridges to drive DC motors.
High
Temperature
Triple
Half-bridge
Driver with
Serial Input
Control
ATA6827
Preliminary
Protection is guaranteed regarding short-circuit conditions, overtemperature and undervoltage. Various diagnostic functions and a very low quiescent current in standby
mode opens a wide range of applications. Automotive qualification gives added value
and enhanced quality for exacting requirements of automotive applications.
4912D–AUTO–06/07
Figure 1-1.
Block Diagram
n.
u.
n.
u.
O
S
C
n.
u.
n.
u.
n.
u.
n.
u.
n.
u.
n.
u.
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
S
R
R
10
VS
11
Input register
Ouput register
DI
4
O
P
L
P
S
F
S
C
D
n.
u.
Serial interface
n.
u.
n.
u.
n.
u.
n.
u.
n. H
u. S
3
L
S
3
H
S
2
L
S
2
H
S
1
VS
Charge
pump
L
S
1
T
P
CLK
5
CS
3
Fault
detector
INH
Fault
detector
UV
protection
Fault
detector
9
8
Control
logic
DO
7
VCC
Power on
reset
14
GND
17
Fault
detector
Fault
detector
Fault
detector
GND
Thermal
protection
18
GND
6
1
OUT3S
2
2
OUT3F
13
OUT2S
12
OUT2F
16
OUT1S
15
GND
OUT1F
ATA6827
4912D–AUTO–06/07
ATA6827
2. Pin Configuration
Pinning QFN18
PGND3
PGND1
OUT1S
OUT1F
PGND2
OUT2S
Figure 2-1.
OUT3S
OUT3F
CS
DI
CLK
GND
Table 2-1.
1
2
3
4
5
6
18 17 16 15 14 13
12
11
10
9
8
7
OUT2F
VS
VS
VCC
INH
DO
Pin Description
Pin
Symbol
Function
1
OUT3S
Used only for final testing, to be connected to OUT3F
2
OUT3F
Half-bridge output 3
3
CS
Chip select input; 5-V CMOS logic level input with internal pull up;
low = serial communication is enabled, high = disabled
4
DI
Serial data input; 5-V CMOS logic level input with internal pull down; receives serial data from the control
device; DI expects a 16-bit control word with LSB being transferred first
5
CLK
Serial clock input; 5-V CMOS logic level input with internal pull down;
controls serial data input interface and internal shift register (fmax = 2 MHz)
6
GND
Ground; reference potential
7
DO
Serial data output; 5-V CMOS logic level tri-state output for output (status) register data; sends 16-bit
status information to the microcontroller (LSB is transferred first); output will remain tri-stated unless
device is selected by CS = low, therefore, several ICs can operate on one data output line only.
8
INH
Inhibit input; 5-V logic input with internal pull down; low = standby, high = normal operation
9
VCC
Logic supply voltage (5 V)
10
VS
Power supply for output stages OUT1, OUT2 and OUT3, internal supply
11
VS
Power supply for output stages OUT1, OUT2 and OUT3, internal supply
12
OUT2F
Half-bridge output 2
13
OUT2S
Used only for final testing, to be connected to OUT2F
14
PGND2
Power Ground OUT2
15
OUT1F
Half-bridge output 1
16
OUT1S
Used only for final testing, to be connected to OUT13F
17
PGND1
PGND3
Power Ground OUT1 and OUT3
18
PGND1
PGND3
Power Ground OUT1 and OUT3
3
4912D–AUTO–06/07
3. Functional Description
3.1
Serial Interface
Data transfer starts with the falling edge of the CS signal. Data must appear at DI synchronized
to CLK and are accepted on the falling edge of the CLK signal. LSB (bit 0, SRR) has to be transferred first. Execution of new input data is enabled on the rising edge of the CS signal. When CS
is high, pin DO is in tri-state condition. This output is enabled on the falling edge of CS. Output
data will change their state with the rising edge of CLK and stay stable until the next rising edge
of CLK appears. LSB (bit 0, TP) is transferred first.
Figure 3-1.
Data Transfer
CS
DI
SRR
0
LS1
1
HS1
LS2
HS2
2
3
4
S1H
S2L
S2H
LS3
HS3
n. u.
5
6
7
8
S3H
n. u.
n. u.
n. u.
n. u.
9
n. u.
10
n. u.
11
n. u.
12
OCS
13
n. u.
14
n. u.
15
CLK
DO
TP
S1L
Table 3-1.
Bit
4
S3L
n. u.
n. u.
n. u.
n. u.
SCD
OPL
PSF
Input Data Protocol
Input Register
Function
0
SRR
Status register reset (high = reset; the bits PSF, OPL and SCD in the
output data register are set to low)
1
LS1
Controls output LS1 (high = switch output LS1 on)
2
HS1
Controls output HS1 (high = switch output HS1 on)
3
LS2
See LS1
4
HS2
See HS1
5
LS3
See LS1
6
HS3
See HS1
7
n. u.
Not used
8
n. u.
Not used
9
n. u.
Not used
10
n. u.
Not used
11
n. u.
Not used
12
n. u.
Not used
13
OCS
Overcurrent shutdown (high = overcurrent shutdown is active)
14
n. u.
Not used
15
n. u.
Not used
ATA6827
4912D–AUTO–06/07
ATA6827
Table 3-2.
Output Data Protocol
Output (Status)
Register
Bit
Function
0
TP
1
Status LS1
High = output is on, low = output is off; not affected by SRR
Temperature prewarning: high = warning
2
Status HS1
High = output is on, low = output is off; not affected by SRR
3
Status LS2
Description see LS1
4
Status HS2
Description see HS1
5
Status LS3
Description see LS1
6
Status HS3
Description see HS1
7
n. u.
Not used
8
n. u.
Not used
9
n. u.
Not used
10
n. u.
Not used
11
n. u.
Not used
12
n. u.
Not used
13
SCD
Short circuit detected: set high when at least one high-side or low-side
switch is switched off by a short-circuit condition. Bits 1 to 6 can be used
to detect the shorted switch.
14
OPL
Open load detected: set high, when at least one active high-side or
low-side switch sinks/sources a current below the open load threshold
current.
15
PSF
Power-supply fail: undervoltage at pin VS detected
After power-on reset, the input register has the following status:
Bit 15 Bit 14
x
x
Bit 13
(OCS)
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
(HS3)
Bit 5
(LS3)
Bit 4
(HS2)
Bit 3
(LS2)
H
x
x
x
x
x
x
L
L
L
L
Bit 2 Bit 1
(HS1) (LS1)
L
L
Bit 0
(SRR)
L
The following patterns are used to enable internal test modes of the IC. It is not recommended to use these patterns during
normal operation.
Bit 15 Bit 14
Bit 13
(OCS)
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
(HS3)
Bit 5
(LS3)
Bit 4
(HS2)
Bit 3
(LS2)
Bit 2 Bit 1
(HS1) (LS1)
Bit 0
(SRR)
H
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
H
H
H
L
L
H
H
L
L
L
L
L
L
L
L
L
H
H
H
L
L
L
L
H
H
L
L
L
L
L
L
L
5
4912D–AUTO–06/07
3.2
Power-supply Fail
In case of undervoltage at pin VS, the Power-Supply Fail bit (PSF) in the output register is set
and all outputs are disabled. To detect an undervoltage, its duration has to be longer than the
undervoltage detection delay time tdUV. The outputs are enabled immediately when supply voltage recovers to a normal operating value. The PSF bit stays high until it is reset by the SRR
(Status Register Reset) bit in the input register.
3.3
Open-load Detection
If the current through a high-side or low-side switch in the ON-state stays below the open-load
detection threshold, the open-load detection bit (OPL) in the output register is set.
The OPL bit stays high until it is reset by the SRR bit in the input register. To detect an open
load, its duration has to be longer than the open-load detection delay time tdSd.
3.4
Overtemperature Protection
If the junction temperature of one or more output stages exceeds the thermal prewarning threshold, T jPW set , the temperature prewarning bit (TP) in the output register is set. When the
temperature falls below the thermal prewarning threshold, TjPW reset, the bit TP is reset. The TP
bit can be read without transferring a complete 16-bit data word. The status of TP is available at
pin DO with the falling edge of CS. After the microcontroller has read this information, CS is set
high and the data transfer is interrupted without affecting the status of input and output registers.
If the junction temperature of one or more output stages exceeds the thermal shutdown threshold, Tj switch off, all outputs are disabled and the corresponding bits in the output register are set to
low. The outputs can be enabled again when the temperature falls below the thermal shutdown
threshold, Tjswitch on and the SRR bit in the input register is set to high. Hysteresis of thermal prewarning and shutdown threshold avoids oscillations.
3.5
Short-circuit Protection
The output currents are limited by a current regulator. Overcurrent detection is activated by writing a high to the OCS (Overcurrent Shutdown) bit in the input register. When the current in an
output stage exceeds the overcurrent limitation and shutdown threshold, it is switched off after a
delay time (tdSd). The short-circuit detection bit (SCD) is set and the corresponding status bit in
the output register is set to low. For OCS = low the overcurrent shutdown is inactive. The SCD
bit is also set if the current exceeds the overcurrent limitation and shutdown threshold, but the
outputs are not affected. By writing a high to the SRR bit in the input register the SCD bit is reset
and the disabled outputs are enabled.
3.6
Inhibit
Applying 0V to pin 8 (INH) inhibits the ATA6827.
All output switches are then turned off and switched to tri-state. The data in the output register is
deleted. The output switches can be activated again by switching pin 8 (INH) to 5V which initiates an internal power-on reset.
6
ATA6827
4912D–AUTO–06/07
ATA6827
4. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
All values refer to GND pins.
Parameters
Pin
Symbol
Value
Unit
Supply voltage
10, 11
VVS
–0.3 to +40
V
Supply voltage
t < 0.5s; IS > –2A
10, 11
VVS
–1
V
9
VVCC
–0.3 to +7
V
3, 4, 5, 8
VCS,VDI, VCLK, VINH
–0.3 to VVCC + 0.3
V
7
VDO
–0.3 to VVCC + 0.3
V
3, 4, 5, 8
ICS, IDI, ICLK, IINH
–10 to +10
mA
Output current
7
IDO
–10 to +10
mA
Logic supply voltage
Logic input voltage
Logic output voltage
Input current
Output current
2, 12, 15
IOut3, IOut2, IOut1
Internally limited, see output specification
Output voltage
2, 12, 15
IOut3, IOut2, IOut1
–0.3 to +40
V
Reverse conducting current
(tpulse = 150 µs)
2, 12, 15
IOut3, IOut2, IOut1
17
A
Junction temperature range
Tj
–40 to +200
°C
Storage temperature range
TSTG
–55 to +200
°C
Ambient temperature range
Ta
–40 to +150
°C
5. Thermal Resistance
Parameters
Test Conditions
Junction case
Junction ambient
Notes:
(1)
Symbol
Value
Unit
Rthjc
maximum 15
K/W
RthJA
40
K/W
1. Depends on PCB board design
6. Operating Range
Parameters
Symbol
Value
Unit
Supply voltage
VVS
VUV(2) to 40
V
Logic supply voltage
VVCC
4.75 to 5.25
V
VCS,VDI, VCLK, VINH
–0.3 to VVCC
V
fCLK
2
MHz
Tj
–40 to +200
°C
Logic input voltage
Serial interface clock frequency
Junction temperature range
Note:
Threshold for undervoltage detection
7
4912D–AUTO–06/07
7. Noise and Surge Immunity
Parameters
Test Conditions
Value
Conducted interferences
ISO 7637-1
Interference suppression
VDE 0879 Part 2
ESD (Human Body Model)
ESD S 5.1
2 kV
CDM (Charged Device Model)
Note:
Test pulse 5: Vsmax = 40V
ESD STM 5.3.1-1999 all pins
500V
Level 4(1)
Level 5
8. Electrical Characteristics
7.5V < VVS < 40V; 4.75V < VVCC < 5.25 V; INH = High; –40°C ≤ Tj ≤ 200°C; Ta ≤ 150°C; unless otherwise specified, all values refer to
GND pins.
No.
1
Parameters
Test Conditions
Pin
Symbol
10, 11
9
Min.
Typ.
Max.
Unit
Type*
IVS
1
60
µA
A
IVCC
15
40
µA
A
Current Consumption
1.1
Quiescent current VS
VVS < 20V, INH = low
1.2
Quiescent current VCC
4.75 V < VVCC < 5.25V,
INH = low
1.3
Supply current VS
VVS < 20V normal
10, 11
operating, all outputs off
IVS
4
6
mA
A
1.4
Supply current VCC
4.75V < VVCC < 5.25V,
normal operating
9
IVCC
350
500
µA
A
1.5
Discharge current VS
VVS = 32.5V,
INH = low
10, 11
IVS
0.5
5.5
mA
A
1.6
Discharge current VS
VVS = 40V,
INH = low
10, 11
IVS
2.0
10
mA
A
9
VVCC
3.1
3.9
4.5
V
A
tdPor
30
95
190
µs
A
5.5
7.1
V
A
V
A
40
µs
A
2
Undervoltage Detection, Power-on Reset
2.1
Power-on reset
threshold
2.2
Power-on reset
delay time
2.3
Undervoltage-detection
VCC = 5V
threshold
10, 11
VUv
2.4
Undervoltage-detection
VCC = 5V
hysteresis
10, 11
∆VUv
2.5
Undervoltage-detection
delay time
3
After switching on VCC
0.6
tdUV
10
TjPW set
170
195
220
°C
B
155
180
205
°C
B
°C
B
Thermal Prewarning and Shutdown
3.1
Thermal prewarning set
3.2
Thermal prewarning
reset
TjPW reset
3.3
Thermal prewarning
hysteresis
∆TjPW
3.4
Thermal shutdown off
Tj switch off
200
225
250
°C
B
3.5
Thermal shutdown on
Tj switch on
185
210
235
°C
B
15
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1. Delay time between rising edge of the input signal at pin CS after data transmission and switch on output stages to 90% of
final level. Device not in standby for t > 1 ms
8
ATA6827
4912D–AUTO–06/07
ATA6827
8. Electrical Characteristics (Continued)
7.5V < VVS < 40V; 4.75V < VVCC < 5.25 V; INH = High; –40°C ≤ Tj ≤ 200°C; Ta ≤ 150°C; unless otherwise specified, all values refer to
GND pins.
No.
Parameters
3.6
Thermal shutdown
hysteresis
∆Tj switch off
3.7
Ratio thermal shutdown
off/thermal prewarning
set
Tj switch off/
TjPW set
1.05
1.15
B
3.8
Ratio thermal shutdown
on/thermal prewarning
reset
Tj switch on/
TjPW reset
1.05
1.15
B
4
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
15
Unit
Type*
°C
B
Output Specification (OUT1-OUT3)
4.1
IOut 1-3 = –0.9A
2, 12,
15
RDSOn1-3
1.8
Ω
A
IOut 1-3 = +0.9A
2, 12,
15
RDSOn1-3
1.8
Ω
A
µA
A
On resistance
4.2
4.3
High-side output
leakage current
VOut 1-3 = 0V,
output stages off
2, 12,
15
IOut1-3
4.4
Low-side output
leakage current
VOut 1-3 = VVS,
output stages off
2, 12,
15
IOut1-3
300
µA
A
4.5
High-side switch
reverse diode forward
voltage
IOut 1-3 = 1.5A
2, 12,
15
VOut1-3 – VVS
2
V
A
4.6
Low-side switch reverse
IOut 1-3 = –1.5A
diode forward voltage
2, 12,
15
VOut 1-3
–2
V
A
4.7
High-side overcurrent
limitation and shutdown 7.5V < VS < 20V
threshold
2, 12,
15
IOut1-3
1.0
1.3
1.7
AA
A
4.8
Low-side overcurrent
limitation and shutdown 7.5V < VS < 20V
threshold
2, 12,
15
IOut1-3
–1.7
–1.3
–1.0
A
A
4.18
High-side overcurrent
limitation and shutdown 20V < VS < 40V
threshold
2, 12,
15
IOut1-3
1.0
1.3
2.0
AA
A
4.19
Low-side overcurrent
limitation and shutdown 20V < VS < 40V
threshold
2, 12,
15
IOut1-3
–2.0
–1.3
–1.0
A
A
4.9
Overcurrent shutdown
delay time
2, 12,
15
tdSd
10
40
µs
A
4.10
High-side open-load
detection threshold
2, 12,
15
IOut1-3
–55
–30
–5
mA
A
4.11
Low-side open-load
detection threshold
2, 12,
15
IOut1-3
5
30
55
mA
A
4.12
Open-load detection
delay time
tdSd
200
600
µs
A
–60
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1. Delay time between rising edge of the input signal at pin CS after data transmission and switch on output stages to 90% of
final level. Device not in standby for t > 1 ms
9
4912D–AUTO–06/07
8. Electrical Characteristics (Continued)
7.5V < VVS < 40V; 4.75V < VVCC < 5.25 V; INH = High; –40°C ≤ Tj ≤ 200°C; Ta ≤ 150°C; unless otherwise specified, all values refer to
GND pins.
No.
Parameters
Max.
Unit
Type*
4.13
High-side output switch VVS = 13V
RLoad = 30Ω
on delay(1)
tdon
20
µs
A
4.14
Low-side output switch VVS = 13V
on delay(1)
RLoad = 30Ω
tdon
20
µs
A
4.15
High-side output switch VVS = 13V
off delay(1)
RLoad = 30Ω
tdoff
20
µs
A
4.16
Low-side output switch VVS = 13V
off delay(1)
RLoad = 30Ω
tdoff
3
µs
A
4.17
Dead time between
corresponding highand low-side switches
5
Test Conditions
Pin
VVS = 13V
RLoad = 30Ω
Symbol
Min.
Typ.
tdon – tdoff
1
µs
A
0.3 ×
VVCC
V
A
0.7 ×
VVCC
V
A
Logic Inputs DI, CLK, CS, INH
5.1
Input voltage low-level
threshold
3, 4, 5,
8
VIL
5.2
Input voltage high-level
threshold
3, 4, 5,
8
VIH
5.3
Hysteresis of input
voltage
3, 4, 5,
8
∆VI
50
700
mV
B
5.4
Pull-down current pin
DI, CLK, INH
VDI, VCLK, VINH = VCC
4, 5, 8
IPD
5
70
µA
A
5.5
Pull-up current
Pin CS
VCS = 0V
3
IPU
–70
–5
µA
A
0.4
V
A
V
A
+15
µA
A
100
µs
A
6
Serial Interface – Logic Output DO
6.1
Output-voltage low level IDOL = 2 mA
7
VDOL
6.2
Output-voltage high
level
IDOL = –2 mA
7
VDOH
VVCC
–0.7V
6.3
Leakage current
(tri-state)
VCS = VCC
0V < VDO < VVCC
7
IDO
–15
7
7.1
Inhibit Input - Timing
Delay time from
standby to normal
operation
tdINH
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1. Delay time between rising edge of the input signal at pin CS after data transmission and switch on output stages to 90% of
final level. Device not in standby for t > 1 ms
10
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4912D–AUTO–06/07
ATA6827
9. Serial Interface – Timing
Pin
Timing Chart No.(1)
Symbol
DO enable after CS
CDO = 100 pF
falling edge
7
1
8.2
DO disable after CS
CDO = 100 pF
rising edge
7
8.3
DO fall time
CDO = 100 pF
7
8.4
DO rise time
CDO = 100 pF
7
8.5
DO valid time
CDO = 100 pF
7
8.6
CS setup time
3
4
tCSSethl
8.7
CS setup time
3
8
8.8
CS high time
3
8.9
CLK high time
5
8.10 CLK low time
No.
Parameters
8.1
Test Conditions
Min.
Typ.
Max.
Unit
Type*
tENDO
200
ns
D
2
tDISDO
200
ns
D
-
tDOf
100
ns
D
-
tDOr
100
ns
D
10
tDOVal
200
ns
D
225
ns
D
tCSSetlh
225
ns
D
9
tCSh
500
ns
D
5
tCLKh
225
ns
D
5
6
tCLKl
225
ns
D
8.11 CLK period time
5
-
tCLKp
500
ns
D
8.12 CLK setup time
5
7
tCLKSethl
225
ns
D
8.13 CLK setup time
5
3
tCLKSetlh
225
ns
D
8.14 DI setup time
4
11
tDIset
40
ns
D
8.15 DI hold time
4
12
tDIHold
40
ns
D
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1. Serial Interface Timing with Chart Numbers
11
4912D–AUTO–06/07
Figure 9-1.
Serial Interface Timing with Chart Numbers
1
2
CS
DO
9
CS
4
7
CLK
5
3
6
8
DI
11
CLK
10
12
DO
Inputs DI, CLK, CS: High level = 0.7 × VCC, low level = 0.3 × VCC
Output DO: High level = 0.8 × VCC, low level = 0.2 × VCC
12
ATA6827
4912D–AUTO–06/07
ATA6827
10. Application Circuit
Figure 10-1. Application Circuit
VCC
VS
Enable
n.
u.
O
S
C
n.
u.
n.
u.
n.
u.
n.
u.
n.
u.
n.
u.
H
n. S
u. 3
L
S
3
L
S
2
H
S
2
H
S
1
L
S
1
S
R
R
10
VS
BYT41D
VBatt
Trigger
Reset
U5021M
Watchdog
11
Input register
Ouput register
P
S
F
DI
4
O
P
L
S
C
D
n.
u.
Serial interface
n.
u.
n.
u.
n.
u.
n.
u.
n. H
u. S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
13V
VS
Charge
pump
+
T
P
CLK
5
CS
3
Microcontroller
Fault
detector
INH
Fault
detector
VCC
UV
protection
Fault
detector
VCC
9
8
Control
logic
DO
7
VCC
Power on
reset
5V
+
14
GND
Fault
detector
Fault
detector
17
Fault
detector
GND
Thermal
protection
18
GND
6
VCC
1
2
13
OUT3F
12
16
OUT2F
M
GND
15
OUT1F
M
11. Application Notes
It is strongly recommended to connect the blocking capacitors at VCC and VS as close as possible to the power supply and GND pins.
Recommended value for capacitors at VS:
Electrolytic capacitor C > 22 µF in parallel with a ceramic capacitor C = 100 nF. The value for
electrolytic capacitor depends on external loads, conducted interferences and reverse conducting current IOut1,2,3 (see Section 4. ”Absolute Maximum Ratings” on page 7).
Recommended value for capacitors at VCC:
Electrolytic capacitor C > 10 µF in parallel with a ceramic capacitor C = 100 nF.
To reduce thermal resistance it is recommended to place cooling areas on the PCB as close as
possible to the GND pins and to the die pad.
13
4912D–AUTO–06/07
12. Ordering Information
Extended Type Number
Package
Remarks
ATA6827-PIQW
QFN18, 4 mm × 4 mm
Taped and reeled, Pb-free
13. Package Information
Package: VQFN_4 x 4_18L
Exposed pad 2.7 x 3.175
Dimensions in mm
Bottom
2.5
Not indicated tolerances ±0.05
Z
0.5 nom.
Top
13
18
1
4
7
0.175
6
0.2
1
2.5
3.175±0.15
Pin 1 identification
18
12
6
2.7±0.15
0.9±0.1
Drawing-No.: 6.543-5133.01-4
0.23±0.07
Issue: 1; 26.04.07
0.4±0.1
Z 10:1
technical drawings
according to DIN
specifications
14. Revision History
Please note that the following page numbers referred to in this section refer to the specific revision
mentioned, not to this document.
14
Revision No.
History
4912D-auto-06/07
• Put datasheet in a new template
• Package drawing changed
• Block diagram changed
• Pinning drawing changed
• Pin Description table changed
• Application circuit drawing changed
ATA6827
4912D–AUTO–06/07
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4912D–AUTO–06/07