Material Content Data Sheet Sales Product Name BTM7700G Issued MA# MA001363370 Package PG-DSO-28-22 30. April 2015 Weight* 808.71 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper aluminium carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 4.035 0.50 0.072 0.01 0.288 0.04 356 5.754 0.71 7115 233.637 28.89 29.65 288901 296461 1.768 0.22 0.22 2186 2186 1.112 0.14 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.50 4990 4990 89 1375 79.488 9.83 475.260 58.75 68.72 587678 687343 4.975 0.62 0.62 6151 6151 0.678 0.08 0.08 838 838 0.287 0.04 1.355 0.17 98290 355 0.21 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1676 2031 1000000