DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 DS99R124Q 5 - 43 MHz 18-bit Color FPD-Link II to FPD-Link Converter Check for Samples: DS99R124Q FEATURES DESCRIPTION • The DS99R124Q converts FPD-Link II to FPD-Link. It translates a high-speed serialized interface with an embedded clock over a single pair (FPD-Link II) to three LVDS data/control streams and one LVDS clock pair (FPD-Link). This serial bus scheme greatly eases system design by eliminating skew problems between clock and data, reduces the number of connector pins, reduces the interconnect size, weight, and cost, and overall eases PCB layout. In addition, internal DC balanced decoding is used to support AC-coupled interconnects. 1 2 • • • • • • • • • • • • • • • • 5 – 43 MHz Support (140 Mbps to 1.2 Gbps Serial Link) 4-Channel (3 data + 1 Clock) FPD-Link LVDS Outputs 3 Low-Speed Over-Sampled LVCMOS Outputs AC Coupled STP Interconnect up to 10 Meters in Length Integrated Input Termination @ Speed Link BIST Mode and Reporting Pin Optional I2C Compatible Serial Control Bus RGB666 + VS, HS, DE Converted from 1 Pair Power Down Mode Minimizes Power Dissipation FAST Random Data Lock; no Reference Clock Required Adjustable Input Receive Equalization LOCK (Real Time Link Status) Reporting Pin Low EMI FPD-Link Output SSCG Option for Lower EMI 1.8V or 3.3V Compatible I/O Interface Automotive Grade Product: AEC-Q100 Grade 2 Qualified >8 kV HBM and ISO 10605 ESD Rating APPLICATIONS • • Automotive Display for Navigation Automotive Display for Entertainment The DS99R124Q converter recovers the data (RGB) and control signals and extracts the clock from a serial stream (FPD-Link II). It is able to lock to the incoming data stream without the use of a training sequence or special SYNC patterns and does not require a reference clock. A link status (LOCK) output signal is provided. Adjustable input equalization of the serial input stream provides compensation for transmission medium losses of the cable and reduces the mediuminduced deterministic jitter. EMI is minimized by the use of low voltage differential signaling, output state select feature, and additional output spread spectrum generation. With fewer wires to the physical interface of the display, FPD-Link output with LVDS technology is ideal for high speed, low power and low EMI data transfer. The DS99R124Q is offered in a 48-pin WQFN package and is specified over the automotive AECQ100 Grade 2 temperature range of -40˚C to +105˚C. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2013, Texas Instruments Incorporated DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com Applications Diagram FPD-Link FPD-Link II FPD-Link VDDIO 1.8V 3.3V (1.8V or 3.3V) HOST Graphics Processor RGB Style Display Interface 3.3V High-Speed Serial Link 1 Pair/AC Coupled RxIN2+/- TxOUT2+/- DOUT+ RxIN1+/RxIN0+/- RIN+ DOUT- RxCLKIN+/- PWDNB TxOUT1+/TxOUT0+/- RIN100 ohm STP Cable DS99R421Q Converter DS99R124Q Converter CMF SSC[2:0] LFMODE BISTM BISTEN OS[2:0] BISTEN DEN PRE VODSEL TxCLKOUT+/- OS[2:0] LOCK PASS PDB VODSEL OEN OSSEL SCL SDA ID[x] Optional RGB Display QVGA to WVGA 18-bit Color Depth Figure 1. LFMODE OSS_SEL OEN VODSEL GND VDDL BISTM BISTEN PASS/EQ LOCK GND VDDIO 36 35 34 33 32 31 30 29 28 27 26 25 DS99R124Q Pin Diagram RES[1] 37 24 VDDA 38 23 TxOUT0+ TxOUT0- GND 39 22 TxOUT1- RIN+ 40 21 TxOUT1+ RIN- 41 20 TxOUT2- 19 TxOUT2+ 18 TxCLKOUT- CMF 42 VDDA 43 DS99R124Q TOP VIEW DAP = GND 12 11 OS[1] OS[0] 10 VDDTX OS[2] 13 9 48 GND GND 8 GND VDDP 14 7 47 SSC[2] VDDP 6 RES[0] VDDL 15 5 46 SCL VDDP 4 ID[x] SDA 16 3 45 SSC[0] GND 2 TxCLKOUT+ SSC[1] 17 1 44 PDB GND Figure 2. FPD-Link II to FPD-Link Convertor - DS99R124Q 48 Pin WQFN Package See Package Number RHS0048A 2 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 PIN DESCRIPTIONS Pin Name Pin # I/O, Type Description FPD-Link II Input Interface RIN+ 40 I, LVDS True input The input must be AC coupled with a 100 nF capacitor. Internal termination. RIN- 41 I, LVDS Inverting input The input must be AC coupled with a 100 nF capacitor. Internal termination. CMF 42 I, Analog Common-Mode Filter VCM center-tap is a virtual ground which maybe ac-coupled to ground to increase receiver common mode noise immunity. Recommended value is 4.7 μF or higher. FPD-Link Output Interface TxOUT[2:0]+ 19, 21, 23 O, LVDS True LVDS Data Output This pair should have a 100 Ω termination for standard LVDS levels. TxOUT[2:0]- 20, 22, 24 O, LVDS Inverting LVDS Data Output This pair should have a 100 Ω termination for standard LVDS levels. TxCLKOUT+ 17 O, LVDS True LVDS Clock Output This pair should have a 100 Ω termination for standard LVDS levels. TxCLKOUT- 18 O, LVDS Inverting LVDS Clock Output This pair should have a 100 Ω termination for standard LVDS levels. LVCMOS Outputs OS[2:0] 10, 11, 12 O, LVMOS Over-Sampled Low Frequency Outputs These bits map to the DS99R421's OS[2:0] over-sampled low-frequency inputs. Signals must be slower the TxCLK/5. On the DS90UR241 these map to the DIN[23:21] inputs. OS0 = DIN21, OS1 = DIN22, OS2 = DIN23. LOCK 27 O, LVMOS LOCK Status Output LOCK = 1, PLL is locked, outputs are active. LOCK = 0, PLL is unlocked, output states determined by OSS_SEL. Maybe used as a Link Status or to flag when the Video Data is active (ON/OFF). Control and Configuration PDB 1 I, LVCMOS w/ pull-down Power Down Mode Input PDB = 1, Device is enabled (normal operation) PDB = 0, Device is in power-down, the output are controlled by the settings. Control registers are RESET. VODSEL 33 I, LVCMOS w/ pull-down Differential Driver Output Voltage Select VODSEL = 1, LVDS VOD is ±400 mV, 800 mVp-p (typ) — Long Cable / De-E Applications VODSEL = 0, LVDS VOD is ±250 mV, 500 mVp-p (typ) See Table 2 OEN 34 I, LVCMOS w/ pull-down Output Enable Input OEN = 1, FPD-Link outputs are enabled (active). OEN = 0, FPD-Link outputs are TRI-STATE. OSS_SEL 35 I, LVCMOS w/ pull-down Output Sleep State Select Input See Table 1 LFMODE 36 I, LVCMOS w/ pull-down Low Frequency Mode — Pin or Register Control LF_MODE = 1, low frequency mode (TxCLKOUT = 5-20 MHz) LF_MODE = 0, high frequency mode (TxCLKOUT = 20-43 MHz) SSC[2:0] 7, 2, 3 I, LVCMOS w/ pull-down Spread Spectrum Clock Generation (SSCG) Range Select See Table 3 and Table 4 RES[1:0] 37, 15 I, LVCMOS w/ pull-down Reserved Tie Low Control and Configuration — STRAP PIN For a High State, use a 10 kΩ pull up to VDDIO; for a Low State, the IO includes an internal pull down. The STRAP pin is read upon powerup and set device configuration. Pin number listed along with shared LVCMOS Output name in square bracket. EQ 28 [PASS] STRAP I, LVCMOS w/ pull-down EQ Gain Control of FPD-Link II Input EQ = 1, EQ gain is enabled (~13 dB) EQ = 0, EQ gain is disabled (~1.625 dB) I, LVCMOS w/ pull-down BIST Enable Input – Optional BISTEN = 1, BIST Mode is enabled. BISTEN = 0, normal mode. Optional BIST Mode BISTEN 29 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 3 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com PIN DESCRIPTIONS (continued) Pin Name Pin # I/O, Type Description BISTM 30 I, LVCMOS w/ pull-down BIST Mode Input – Optional BISTM = 1, selects Payload Error Mode BISTM = 0, selects Pass / Fail Result-Only Mode PASS 28 O, LVCMOS PASS Output (BIST Mode) – Optional PASS = 1, no errors detected PASS = 0, errors detected Leave open if unused. Route to a test point (pad) recommended. Optional Serial Bus Control Interface SCL 5 I, LVCMOS Serial Control Bus Clock Input - Optional SCL requires an external pull-up resistor to VDDIO. SDA 4 I/O, LVCMOS Serial Control Bus Data Input / Output - Optional Open Drain SDA requires an external pull-up resistor to VDDIO. ID[x] 16 I, Analog Serial Control Bus Device ID Address Select — Optional Resistor to Ground and 10 kΩ pull-up to 1.8V rail. See Table 5. Power and Ground VDDL 6, 31 Power Logic Power, 1.8 V ±5% VDDA 38, 43 Power Analog Power, 1.8 V ±5% VDDP 8, 46, 47 Power SSC Generator Power, 1.8 V ±5% VDDTX 13 Power FPD-Link Power, 3.3 V ±10% VDDIO 25 Power LVCMOS I/O Power, 1.8 V ±5% OR 3.3 V ±10% GND 9, 14, 26, 32, 39, 44, 45, 48 Ground Ground DAP DAP Ground DAP is the large metal contact at the bottom side, located at the center of the WQFN package. Connected to the ground plane (GND) with at least 9 vias. Block Diagram DS99R124Q ± CONVERTER SSC[2:0] OEN VODSEL SSCG RIN- PDB SCL SCA ID[x] BISTEN BISTM OSS_SEL LFMODE Serializer RIN+ TxOUT[2] DC Balance Decoder Serial to Parallel CMF TxOUT[0] TxCLKOUT Error Detector Timing and Control TxOUT[1] 3 PLL OS[2:0] PASS LOCK Figure 3. FPD-Link II to FPD-Link Convertor These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 4 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) Supply Voltage – VDDn (1.8V) −0.3V to +2.5V Supply Voltage – VDDTX (3.3V) −0.3V to +4.0V −0.3V to +4.0V Supply Voltage – VDDIO −0.3V to +(VDDIO + 0.3V) LVCMOS I/O Voltage −0.3V to (VDD + 0.3V) Receiver Input Voltage LVDS Output Voltage −0.3V to (VDDTX + 0.3V) Junction Temperature +150°C Storage Temperature −65°C to +150°C Lead Temperature (Soldering, 4s) +260°C 48L RHS Package Maximum Power Dissipation Capacity at 25°C 1/ θJA°C/W Derate above 25°C θJA 27.7 °C/W θJC 3.0 °C/W ESD Rating (IEC, powered-up only), RD = 330Ω, CS = 150pF Air Discharge (RIN+, RIN−) ESD Rating (ISO10605), RD = 330Ω, CS = 150 & 330pF Air Discharge (RIN+, RIN−) ≥±30 kV ≥±6 kV Contact Discharge (RIN+, RIN−) ≥±15 kV Contact Discharge (RIN+, RIN−) ≥±8 kV ESD Rating (ISO10605), RD = 2kΩ, CS = 150 Air Discharge (RIN+, RIN−) & 330pF Contact Discharge (RIN+, RIN−) ≥±15 kV ≥±8 kV ESD Rating (HBM) ≥±8 kV ESD Rating (CDM) ≥±1.25 kV ≥±250 V ESD Rating (MM) (1) (2) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Recommended Operating Conditions Min Nom Max Units Supply Voltage (VDDn) 1.71 1.8 1.89 V LVCMOS Supply Voltage (VDDIO) 1.71 1.8 1.89 V LVCMOS Supply Voltage (VDDIO) 3.0 3.3 3.6 V Operating Free Air Temperature (TA) −40 +25 +105 °C 43 MHz 100 mVP-P TxCLK Clock Frequency 5 Supply Noise (1) (1) Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC coupled to the VDDn (1.8V) supply with amplitude = 100 mVp-p measured at the device VDDn pins. Bit error rate testing of input to the Ser and output of the Des with 10 meter cable shows no error when the noise frequency on the Ser is less than 750 kHz. The Des on the other hand shows no error when the noise frequency is less than 400 kHz. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 5 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com DC Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) (3) Symbol Parameter Conditions Pin/Freq. Min Typ Max Units mV FPD-Link LVDS Output |VOD| Differential Output Voltage VODSEL = L 100 250 400 VODSEL = H 200 400 600 VODSEL = L 500 mVp-p VODp-p Differential Output Voltage A-B VODSEL = H 800 mVp-p ΔVOD Output Voltage RL = 100Ω Unbalance VOS Offset Voltage ΔVOS Offset Voltage Unbalance IOS Output Short Circuit Current Vout = GND IOZ Output TRISTATE Current OEN = GND, Vout =VDDTX, or GND VODSEL = L TxCLKOUT+, TxCLKOUT-, TxOUT[2:0]+, TxOUT[2:0]- 1.0 VODSEL = H mV 1 50 mV 1.2 1.5 V 1.2 1 V 50 -5 mV mA -10 +10 µA 2.2 VDDIO V GND 0.8 V +15 μA 3.3 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 3.0 to 3.6V VIH High Level Input Voltage PDB, VODSEL, OEN, OSS_SEL, LFMODE, SSC[2:0], BISTEN, BISTM VIL Low Level Input Voltage IIN Input Current VOH High Level I = −0.5 mA Output Voltage OH VOL Low Level I = +0.5 mA Output Voltage OL IOS Output Short Circuit Current IOZ TRI-STATE PDB = 0V, OSS_SEL = 0V, Output Current VOUT = 0V or VDDIO VIN = 0V or VDDIO −15 ±1 VDDIO- 0.2 VDDIO GND LOCK, PASS, OS[2:0] VOUT = 0V V 0.2 -10 V mA −10 +10 µA 0.7 VDDIO VDDIO V GND 0.35* VDDIO V +10 μA 1.8 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 1.71 to 1.89V VIH High Level Input Voltage VIL Low Level Input Voltage IIN Input Current (1) (2) (3) 6 VIN = 0V or VDDIO PDB, VODSEL, OEN, OSS_SEL, LFMODE, SSC[2:0], BISTEN, BISTM −10 ±1 The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured. Typical values represent most likely parametric norms at VDDn = 1.8V, VDDTX = 3.3V, VDDIO = 1.8V or 3.3V, Ta = +25 °C, and at the Recommended Operation Conditions at the time of product characterization and are not ensured. Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD, ΔVOD, VTH and VTL which are differential voltages. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 DC Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified.(1)(2)(3) Symbol Parameter Conditions VOH High Level I = −0.1 mA Output Voltage OH VOL Low Level I = +0.1 mA Output Voltage OL IOS Output Short Circuit Current IOZ TRI-STATE VOUT = 0V or VDDIO Output Current Pin/Freq. Typ VDDIO - 0.2 VDDIO GND LOCK, PASS, OS[2:0] VOUT = 0V Min Max Units V 0.2 V -3 -15 mA +15 µA +50 mV FPD-Link II LVDS RECEIVER DC SPECIFICATIONS VTH Differential Input Threshold High Voltage VTL Differential Input Threshold Low Voltage VCM Common Mode Voltage, Internal VBIAS RT Input Termination VCM = +1.2V (Internal VBIAS) −50 RIN+, RIN- mV 1.2 75 V 80 92 Ω SUPPLY CURRENT IDD1 Checker Board Supply Current Pattern, (includes load VODSEL = H, current) SSCG = On 43 MHz Clock Figure 4 IDDTX1 IDDIO1 IDDZ PDB = 0V, All Supply Current other LVCMOS Power Down Inputs = 0V IDDTXZ IDDIOZ VDDn= 1.89V All VDD(1.8) pins 70 80 mA VDDTX = 3.6V VDDTX 30 40 mA 0.35 1 mA 1 1.5 mA VDD= 1.89V All VDD(1.8) pins 0.15 4 mA VDDTX = 3.6V VDDTX 0.01 0.05 mA 0.1 0.4 mA 0.4 0.8 mA VDDIO=1.89V VDDIO = 3.6V VDDIO=1.89V VDDIO = 3.6V VDDIO VDDIO Switching Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) Symbol Parameter Conditions Pin/Freq. Min Typ Max Units FPD-Link II tDDLT tDJIT Lock Time (3) Input Jitter Tolerance SSCG = Off 5 MHz 6 ms SSCG = On 5 MHz 14 ms SSCG = Off 43 MHz 5 ms SSCG = On 43 MHz 8 ms >0.45 UI EQ = Off Jitter Frequency > 10 MHz Figure 14 FPD-Link Output (1) (2) (3) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured. Typical values represent most likely parametric norms at VDDn = 1.8V, VDDTX = 3.3V, VDDIO = 1.8V or 3.3V, Ta = +25 °C, and at the Recommended Operation Conditions at the time of product characterization and are not ensured. tDDLT is the time required by the deserializer to obtain lock when exiting power-down state with an active PCLK. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 7 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com Switching Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified.(1)(2) Symbol Parameter Conditions tTLHT Low to High Transition Time tTHLT High to Low Transition Time tDCCJ Cycle-to-Cycle Output Jitter (4) (5) TxCLKOUT = 5 MHz Pin/Freq. RL = 100Ω Min Typ Max Units TxCLKOUT±, TxOUT[2:0]± 0.3 0.6 ns 0.3 0.6 ns TxCLKOUT± 900 2100 ps 75 125 ps TxCLKOUT = 43 MHz tTTP1 Transmitter Pulse Position for bit 1 tTTP0 TxOUT[2:0]± 0 UI Transmitter Pulse Position for bit 0 1 UI tTPP6 Transmitter Pulse Position for bit 6 2 UI tTTP5 Transmitter Pulse Position for bit 5 3 UI tTTP4 Transmitter Pulse Position for bit 4 4 UI tTTP3 Transmitter Pulse Position for bit 3 5 UI tTTP2 Transmitter Pulse Position for bit 2 6 UI tTPDD Power Down Delay active to OFF Figure 6 TxCLKOUT = 43 MHz Enable Delay OFF to active Figure 7 TxCLKOUT = 43 MHz tTXZR 6 10 ns 40 55 ns 15 ns LVCMOS Outputs tCLH Low to High Transition Time tCHL High to Low Transition Time tPASS BIST PASS Valid Time, BISTEN = 1, Figure 12 CL = 8 pF Figure 5 LOCK, PASS, OS[2:0] 10 10 15 ns TxCLKOUT = 5 MHz PASS 560 570 ns 70 75 ns TxCLKOUT = 43 MHz SSCG Mode fDEV fMOD (4) (5) (6) Spread Spectrum Clocking Deviation Frequency See (6) Spread Spectrum Clocking Modulation Frequency See (6) TxCLKOUT = 5 to 43 MHz, SSC[3:0] = ON ±0.5 ±2 % TxCLKOUT = 5 to 43 MHz, SSC[3:0] = ON 8 100 kHz Max Units tDCCJ is the maximum amount of jitter between adjacent clock cycles. Specification is ensured by characterization and is not tested in production. Specification is ensured by design and is not tested in production. Recommended Timing for the Serial Control Bus Over recommended operating supply and temperature ranges unless otherwise specified. Symbol fSCL Parameter SCL Clock Frequency tLOW SCL Low Period tHIGH SCL High Period tHD;STA 8 Hold time for a start or a repeated start condition, Figure 13 Conditions Min Typ Standard Mode 0 100 kHz Fast Mode 0 400 kHz Standard Mode 4.7 us Fast Mode 1.3 us Standard Mode 4.0 us Fast Mode 0.6 us Standard Mode 4.0 us Fast Mode 0.6 us Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 Recommended Timing for the Serial Control Bus (continued) Over recommended operating supply and temperature ranges unless otherwise specified. Symbol tSU:STA Parameter Conditions Min Typ Max Units Set Up time for a start or a repeated start condition, Figure 13 Standard Mode 4.7 us Fast Mode 0.6 us tHD;DAT Data Hold Time, Figure 13 Standard Mode tSU;DAT Data Set Up Time, Figure 13 Standard Mode 250 ns Fast Mode 100 ns Set Up Time for STOP Condition, Figure 13 Standard Mode 4.0 us Fast Mode 0.6 us Bus Free Time Between STOP and START, Figure 13 Standard Mode 4.7 us Fast Mode 1.3 us SCL & SDA Rise Time, Figure 13 Standard Mode 1000 ns Fast Mode 300 ns SCL & SDA Fall Time, Figure 13 Standard Mode 300 ns Fast mode 300 ns Max Units 0.7* VDDIO VDDIO V GND 0.3* VDDIO V tSU;STO tBUF tr tf Fast Mode 0 3.45 us 0 0.9 us DC and AC Serial Control Bus Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions VIH Input High Level SDA and SCL VIL Input Low Level Voltage SDA and SCL VHY Input Hysteresis Min Typ >50 VOL SDA, IOL = +0.5 mA Iin SDA or SCL, Vin = VDDIO or GND mV 0 0.36 V -10 +10 µA 850 ns 120 ns SDA, RPU = X, Cb ≤ 400pF tR SDA RiseTime – READ tF SDA Fall Time – READ tSU;DAT Set Up Time — READ 500 tHD;DAT Hold Up Time — READ 580 tSP Input Filter Cin Input Capacitance ns ns SDA or SCL 50 ns <5 pF AC Timing Diagrams and Test Circuits +VOD TxCLKOUT -VOD +VOD TxOUT[odd] -VOD +VOD TxOUT[even] -VOD Cycle N Cycle N+1 Figure 4. Checkerboard Data Pattern Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 9 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com VDDIO 80% 20% GND tCLH tCHL Figure 5. LVCMOS Transition Times PDB VILmax RIN X tTPDD LOCK Z PASS Z OS[2:0] Z TxCLKOUT Z TxOUT[2:0] Z Figure 6. FPD-Link & LVCMOS Powerdown Delay PDB LOCK tTXZR OEN VIHmin TxCLKOUT Z TxOUT[2:0] Z Figure 7. FPD-Link Outputs Enable Delay VIH(min) PDB RIN± tDDLT LOCK VIH(min) TRI-STATE Figure 8. Deserializer PLL Lock Times 10 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 SINGLE-ENDED www.ti.com |VOD| VOS GND DIFFERENTIAL +VOD 0V VODp-p -VOD tTLHT tTHLT Figure 9. FPD-Link (LVDS) Single-ended and Differential Waveforms Cycle N TxCLKOUT± bit 1 TxOUT[2:0]± tTTP1 bit 0 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 1UI tTTP2 2UI tTTP3 3UI tTTP4 4UI tTTP5 5UI tTTP6 tTTP7 6UI 7UI Figure 10. FPD-Link Transmitter Pulse Positions Sampling Window Ideal Data Bit Beginning RxIN_TOL -L Ideal Data Bit End RxIN_TOL -R Ideal Center Position (tBIT/2) tBIT (1 UI) Figure 11. Receiver Input Jitter Tolerance BISTEN 1/2 VDDIO tPASS PASS (w/ errors) 1/2 VDDIO Prior BIST Result Current BIST Test - Toggle on Error Result Held Figure 12. BIST PASS Waveform Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 11 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com SDA tf tHD;STA tLOW tr tf tr tBUF tSP SCL tSU;STA tHD;STA tHIGH tHD;DAT START tSU;STO tSU;DAT STOP REPEATED START START Figure 13. Serial Control Bus Timing Diagram 12 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 Typical Performance Characteristics 70 0.61 TOTAL IDD @ 1.8V (mA) JITTER AMPLITUDE (UI) 0.63 0.58 0.56 0.53 0.51 0.48 SSCG = ON VODSEL = H or L 60 SSCG = OFF VODSEL = H or L 50 0.46 1.0E+05 1.0E+06 40 1.0E+07 0 5 10 15 20 25 30 35 40 45 PCLK (MHz) JITTER FREQUENCY (kHz) Figure 14. Typical Input Jitter Tolerance Curve at 43 MHz Figure 15. Typical Total IDD Current (1.8V Supply) as a Function of PCLK IDDTX @ 3.3V (mA) 40 VODSEL = H SSCG = ON or OFF 30 20 VODSEL = L SSCG = ON or OFF 10 0 5 10 15 20 25 30 35 40 45 PCLK (MHz) Figure 16. Typical IDDTX Current (3.3V Supply) as a Function of PCLK Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 13 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com FUNCTIONAL DESCRIPTION The DS99R124Q receives 24-bits of data over a single serial FPD-Link II pair operating at 140Mbps to 1.2Gbps. The serial stream also contains an embedded clock, and the DC-balance information which enhances signal quality and supports AC coupling. The receiver copnverts the serial stream into a 4-channel (3 data and 1 clock) FPD-Link LVDS Interface. The device is intended to be used with the DS90UR241or the DS99R421 FPD-Link II serializers. The Des converts a single input serial data stream to a FPD-Link output bus, and also provides a signal check for the chipset Built In Self Test (BIST) mode. The device can be configured via external pins or through the optional serial control bus. The Des features enhance signal quality on the link by supporting the FPD-Link II data coding that provides randomization, scrambling, and DC balancing of the data. The Des includes multiple features to reduce EMI associated with display data transmission. This includes the randomization and scrambling of the data, FPD-Link LVDS Output interface, and also the output spread spectrum clock generation (SSCG) support. The Des' power saving features include a power down mode, and optional LVCMOS (1.8 V) interface compatibility. The Des can attain lock to a data stream without the use of a separate reference clock source, which greatly simplifies system complexity and overall cost. The Des also synchronizes to the Ser regardless of the data pattern, delivering true automatic “plug and lock” performance. It can lock to the incoming serial stream without the need of special training patterns or sync characters. The Des recovers the clock and data by extracting the embedded clock information, validating and then deserializing the incoming data stream. The DS99R421Q / DS99R124Q chipset supports 18-bit color depth, HS, VS and DE video control signals and up to three over-sampled low-speed (general purpose) data bits. DATA TRANSFER The DS99R124 will receive a pixel of data in the following format: C1 and C0 represent the embedded clock in the serial stream. C1 is always HIGH and C0 is always LOW. b[23:0] contain the scrambled data. DCB is the DC-Balanced control bit. DCB is used to minimize the short and long-term DC bias on the signal lines. This bit determines if the data is unmodified or inverted. DCA is used to validate data integrity in the embedded data stream. Both DCA and DCB coding schemes are generated by the Ser and decoded by the Des automatically. Figure 17 illustrates the serial stream per PCLK cycle. C 1 b 0 b 1 D C B b 2 b 1 2 b 3 b 1 3 b 5 b 4 b 1 4 b 6 b 1 5 b 7 b 1 6 b 1 7 b 8 b 1 8 b 9 b 1 9 b 1 0 b 2 0 D C A b 1 1 b 2 1 b 2 2 b 2 3 C 0 Figure 17. FPD-Link II Serial Stream (DS99R421/DS99R124) The device supports clocks in the range of 5 MHz to 43 MHz. With every clock cycle 24 bits of payload are received along with the four overhead bits. Thus, the line rate is 1.2 Gbps maximum (140 Mbps minimum) with an effective data rate of 1.03 Gbps maximum. The link is extremely efficient at 86% (24/28). The FPD-Link output will pass along the data to the Display in the format shown in Figure 18. TxCLKOUT TxOUT0 G0 R5 R4 R3 R2 R1 R0 TxOUT1 B1 B0 G5 G4 G3 G2 G1 TxOUT2 DE VS HS B5 B4 B3 B2 Figure 18. FPD-Link Output Format 14 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 FPD-LINK II INPUT Common Mode Filter Pin (CMF) — Optional The Des provides access to the center tap of the internal termination. A capacitor may be placed on this pin for additional common-mode filtering of the differential pair. This can be useful in high noise environments for additional noise rejection capability. A 4.7 µF capacitor may be connected to this pin to Ground. OUTPUT INTERFACES (LVCMOS & FPD-LINK) OS[2:0] LVCMOS Outputs Additional signals maybe received across the serial link per PCLK. The over-sampled bits are restricted to be low speed signals and should be less than 1/5 of the frequency of the PCLK. Signals should convey level information only, as pulse width distrotion will occur by the over sampling technique and location of the sampling clock. The three over sampled bits are exactly mapped to DS99R421's; and to DS90UR421 bits are: OS0 = DIN21, OS1 = DIN22, and OS2 = DIN23. CLOCK-DATA RECOVERY STATUS FLAG (LOCK) and OUTPUT STATE SELECT (OSS_SEL) When PDB is driven HIGH, the CDR PLL begins locking to the serial input, LOCK is Low and the FPD-Link interface state is determined by the state of the OSS_SEL pin. After the DS99R124Q completes its lock sequence to the input serial data, the LOCK output is driven HIGH, indicating valid data and clock recovered from the serial input is available on the FPD-Link outputs. The TxCLK output is held at its current state at the change from OSC_CLK (if this is enabled via OSC_SEL) to the recovered clock (or vice versa). Note that the FPD-Link outputs may be held in an inactive state (TRI-STATE) through the use of the Output Enable pin (OEN). If there is a loss of clock from the input serial stream, LOCK is driven Low and the state of the outputs are based on the OSS_SEL setting (configuration pin or register). Table 1. Output State Table INPUTS OUTPUTS PDB OEN OSS_SEL LOCK OTHER OUTPUTS L X L Z TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are TRI-STATE PASS is TRI-STATE L X H L TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are LOW PASS is TRI-STATE H L L L TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are LOW PASS is HIGH H L H L TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are LOW PASS is LOW H H L L TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are TRI-STATE PASS is HIGH H H H L TxCLKOUT is TRI-STATE TxOUT[2:0] areLOW OS[2:0] are LOW PASS is LOW Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 15 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com Table 1. Output State Table (continued) INPUTS OUTPUTS PDB OEN OSS_SEL LOCK OTHER OUTPUTS H L X H TxCLKOUT is TRI-STATE TxOUT[2:0] areTRI-STATE OS[2:0] are Active PASS is Active (This setting allows the system to run BIST or use the OS[2:0] bits while the panel is off) H H X H TxCLKOUT is Active TxOUT[2:0] are Active OS[2:0] are Active PASS is Active (Normal operating mode) LVCMOS 1.8V / 3.3V VDDIO Operation The LVCMOS inputs and outputs can operate with 1.8 V or 3.3 V levels (VDDIO) for target (Display) compatibility. The 1.8 V levels will offer a lower noise (EMI) and also a system power savings. FPD-LINK OUTPUT VODSEL The differential output voltage of the FPD-Link interface is controlled by the VODSEL input. Table 2. VODSEL Configuration Table VODSEL Result L VOD is 250mV TYP (500mVp-p) H VOD is 400mV TYP (800mVp-p) SSCG Generation — Optional The Des provides an internally generated spread spectrum clock (SSCG) to modulate its outputs. Both clock and data outputs are modulated. This will aid to lower system EMI. Output SSCG deviations to ±2.0% (4% total) at up to 35kHz modulations nominally are available. See Table 3 and Table 4. This feature may be controlled by pins or by register. The LFMODE should be set appropriately if the SSCG is being used. Set LFMODE High if the clock frequency is between 5 MHz and 20 MHz, set LFMODE Low if the clock frequency is between 20 MHz and 43 MHz. Table 3. SSCG Configuration (LFMODE = L) — Des Output SSC[2:0] Inputs LFMODE = L (20 - 43 MHz) 16 Result SSC2 SSC1 SSC0 fdev (%) fmod (kHz) L L L OFF OFF L L H ±0.9 L H L ±1.2 L H H ±1.9 H L L ±2.3 H L H ±0.7 H H L ±1.3 H H H ±1.7 Submit Documentation Feedback CLK/2168 CLK/1300 Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 Table 4. SSCG Configuration (LFMODE = H) — Des Output SSC[2:0] Inputs LFMODE = H (5 - 20 MHz) SSC2 SSC1 L L Result SSC0 fdev (%) fmod (kHz) L L OFF OFF L H ±0.7 L H L ±1.3 L H H ±1.8 H L L ±2.2 H L H ±0.7 H H L ±1.2 H H H ±1.7 CLK/625 CLK/385 Frequency fdev(max) FPCLK+ FPCLK FPCLK- fdev(min) Time 1/fmod Figure 19. SSCG Waveform POWER SAVING FEATURES PowerDown Feature (PDB) The Des has a PDB input pin to ENABLE or POWER DOWN the device. This pin can be controlled by the system to save power, disabling the Des when the display is not needed. An auto detect mode is also available. In this mode, the PDB pin is tied High and the Des will enter POWER DOWN when the serial stream stops. When the serial stream starts up again, the Des will lock to the input stream and assert the LOCK pin and output valid data. In POWER DOWN mode, the Data and PCLK output states are determined by the OSS_SEL status. Note – in POWER DOWN, the optional Serial Bus Control Registers are RESET. Stop Stream SLEEP Feature The Des will enter a low power SLEEP state when the input serial stream is stopped. A STOP condition is detected when the embedded clock bits are not present. When the serial stream starts again, the Des will then lock to the incoming signal and recover the data. Note – in STOP STREAM SLEEP, the optional Serial Bus Control Registers values are RETAINED. Built In Self Test (BIST) — Optional An optional At-Speed Built In Self Test (BIST) feature supports the testing of the high-speed serial link. This is useful in the prototype stage, equipment production, in-system test and also for system diagnostics. In the BIST mode only an input clock is required along with control to the Ser and Des BISTEN input pins. The Ser outputs a test pattern (PRBS7) and drives the link at speed. The Des detects the PRBS7 pattern and monitors it for errors. The PASS output pin toggles to flag any payloads that are received with 1 to 24 bit errors. The BISTM pin selects the operational mode of the PASS pin. If BISTM = L, the PASS pins reports the final result only. If BISTM = H, the PASS pins counts payload errors and also results the result. The result of the test is held on the PASS output until reset (new BIST test or Power Down). A high on PASS indicates NO ERRORS were detected. A Low on PASS indicates one or more errors were detected. The duration of the test is controlled by the pulse width applied to the Des BISTEN pin. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 17 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com Normal Step 1: SER in BIST BIST Wait Step 2: Wait, DES in BIST BIST Start Step 3: DES in Normal Mode - check PASS BIST Stop Step 4: SER in Normal Figure 20. BIST Mode Flow Diagram Sample BIST Sequence See Figure 20 for the BIST mode flow diagram. 1. For the DS99R421 FPD-Link II Ser BIST Mode is enabled via the BISTEN pin. For the DS90UR241 Ser, BIST mode is enetered by setting all the input data of the device to Low state. A PCLK is required for all the Ser options. When the Des detects the BIST mode pattern and command (DCA and DCB code) the RGB and control signal outputs are shut off. 2. Place the DS99R124Q Des in BIST mode by setting the BISTEN = H. The Des is now in the BIST mode. If BISTM = H, the Des will check the incoming serial payloads for errors. If an error in the payload (1 to 24) is detected, the PASS pin will switch low for one half of the clock period. During the BIST test, the PASS output can be monitored and counted to determine the payload error rate. 3. To Stop the BIST mode, the Des BISTEN pin is set Low. The Des stops checking the data. The final test result is held on the PASS pin. If the test ran error free, the PASS output will be High. If there was one or more errors detected, the PASS output will be Low. The PASS output state is held until a new BIST is run, the device is RESET, or Powered Down. The BIST duration is user controlled by the duration of the BISTEN signal. 4. To return the link to normal operation, the Ser BISTEN input is set Low. The Link returns to normal operation. Figure 21 shows the waveform diagram of a typical BIST test for two cases. Case 1 is error free, and Case 2 shows one with multiple errors. In most cases it is difficult to generate errors due to the robustness of the link (differential data transmission etc.), thus they may be introduced by greatly extending the cable length, faulting the interconnect, reducing signal condition enhancements (De-Emphasis, VODSEL, or Rx Equalization). 18 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 SER BISTEN (SER) DES Outputs BISTEN (DES) Case 1 - Pass PCLK (RFB = L) RGB[7:0] HS, VS, DE DATA (internal) PASS Prior Result PASS DATA (internal) PASS w/ BISTM = L X X Case 2a - Fail X = bit error(s) X FAIL Prior Result X X X FAIL Prior Result Normal Case 2b - Fail X = bit error(s) DATA (internal) PASS w/ BISTM = H PRBS BIST Result Held BIST Test BIST Duration Normal Figure 21. BIST Waveforms Serial Bus Control — Optional The DS99R124 may also be configured by the use of a serial control bus that is I2C protocol compatible. By default, the I2C reg_0x00'h is set to 00'h and all configuration is set by control/strap pins. A write of 01'h to reg_0x00'h will enable/allow configuration by registers; this will override the control/strap pins. Multiple devices may share the serial control bus since multiple addresses are supported. See Figure 22. The serial bus is comprised of three pins. The SCL is a Serial Bus Clock Input. The SDA is the Serial Bus Data Input / Output signal. Both SCL and SDA signals require an external pull up resistor to VDDIO. For most applications a 4.7 k pull up resistor to VDDIO may be used. The resistor value may be adjusted for capacitive loading and data rate requirements. The signals are either pulled High, or driven Low. 1.8V VDDIO 10k ID[X] 4.7k HOST 4.7k RID SCL SCL SDA SDA SER or DES To Other Devices Figure 22. Serial Control Bus Connection The third pin is the ID[X] pin. This pin sets one of four possible device addresses. Two different connections are possible. The pin may be pulled to VDD (1.8V, NOT VDDIO)) with a 10 kΩ resistor. Or a 10 kΩ pull up resistor (to VDD1.8V, NOT VDDIO)) and a pull down resistor of the recommended value to set other three possible addresses may be used. See Table 5 for the Des. The Serial Bus protocol is controlled by START, START-Repeated, and STOP phases. A START occurs when SCL transitions Low while SDA is High. A STOP occurs when SDA transition High while SCL is also HIGH. See Figure 23 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 19 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com SDA SCL S P START condition, or START repeat condition STOP condition Figure 23. START and STOP Conditions To communicate with a remote device, the host controller (master) sends the slave address and listens for a response from the slave. This response is referred to as an acknowledge bit (ACK). If a slave on the bus is addressed correctly, it Acknowledges (ACKs) the master by driving the SDA bus low. If the address doesn't match a device's slave address, it Not-acknowledges (NACKs) the master by letting SDA be pulled High. ACKs also occur on the bus when data is being transmitted. When the master is writing data, the slave ACKs after every data byte is successfully received. When the master is reading data, the master ACKs after every data byte is received to let the slave know it wants to receive another data byte. When the master wants to stop reading, it NACKs after the last data byte and creates a stop condition on the bus. All communication on the bus begins with either a Start condition or a Repeated Start condition. All communication on the bus ends with a Stop condition. A READ is shown in Figure 24 and a WRITE is shown in Figure 25. If the Serial Bus is not required, the three pins may be left open (NC). Table 5. ID[x] Resistor Value – DS99R124Q Des Resistor RID kΩ (5%tol) Address 7'b Address 8'b 0 appended (WRITE) 0.47 7b' 111 0001 (h'71) 8b' 1110 0010 (h'E2) 2.7 7b' 111 0010 (h'72) 8b' 1110 0100 (h'E4) 8.2 7b' 111 0011 (h'73) 8b' 1110 0110 (h'E6) Open 7b' 111 0110 (h'76) 8b' 1110 1100 (h'EC) Register Address Slave Address S A 2 A 1 A 0 0 Slave Address a c k a c k A 2 S A 1 A 0 Data 1 a c k a c k P Figure 24. Serial Control Bus — READ Register Address Slave Address S A 2 A 1 A 0 0 a c k Data a c k a c k P Figure 25. Serial Control Bus — WRITE 20 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 Table 6. DS99R124Q — Serial Bus Control Registers ADD ADD Register Name (dec) (hex) 0 1 2 0 1 2 Des Config 1 Slave ID Des Features 1 Bit(s) R/W Defau Function lt (bin) 7 R/W 0 LFMODE SSCG Mode – low frequency support 0: 20 to 43 MHz Operation 1: 5 to 20 MHz Operation 6 R/W 0 OSS_SEL Output Sleep State Select TBD 5 R/W 0 Reserved Reserved 4 R/W 0 Reserved Reserved 3:2 R/W 00 Reserved Reserved 1 R/W 0 SLEEP Note – not the same function as PowerDown (PDB) 0: normal mode 1: Sleep Mode – Register settings retained. 0 R/W 0 REG Control 0: Configurations set from control pins 1: Configurations set from registers (except I2C_ID) 7 R/W 0 ADD_SEL 0: Address from ID[X] Pin 1: Address from Register 6:0 R/W 7 R/W 0 OEN Output Enable Input 0: FPD-Link output are TRI-STATE 1: FPD-Link outputs are enabled (active) 6 R/W 0 Reserved Reserved 5:4 R/W 00 Reserved Reserved 3 R/W 0 VODSEL Differential Driver Output Voltage Select 0: LVDS VOD is ±250 mV, 500 mVp-p (typ) 1: LVDS VOD is ±400 mV, 800 mVp-p (typ) 2:0 R/W 00 OSC_SEL 000: OFF 001: Reserved 010: 25 MHz ±40% 011: 16.7 MHz ±40% 100: 12.5 MHz ±40% 101: 10 MHz ±40% 110: 8.3 MHz ±40% 111: 6.3 MHz ±40% 11100 ID[X] 00 Description Serial Bus Device ID, Four IDs are: 7b '1110 001 (h'71); 8b ' 1110 0010 (h'E2) 7b '1110 010 (h'72); 8b ' 1110 0100 (h'E4) 7b '1110 011 (h'73); 8b ' 1110 0110 (h'E6) 7b '1110 110 (h'76); 8b ' 1110 1100 (h'EC) All other addresses are Reserved. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 21 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com Table 6. DS99R124Q — Serial Bus Control Registers (continued) ADD ADD Register Name (dec) (hex) 3 22 3 Des Features 2 Bit(s) R/W Defau Function lt (bin) 7:5 R/W 000 4 R/W 3 2:0 Description EQ Gain 000: 001: 010: 011: 100: 101: 110: 111: ~1.625 dB ~3.25 dB ~4.87 dB ~6.5 dB ~8.125 dB ~9.75 dB ~11.375 dB ~13 dB 0 EQ Enable 0: EQ = disabled 1: EQ = enabled R/W 0 Reserved Reserved R/W 000 SSC IF LFMODE = 0, then: 000: SSCG OFF 001: fdev = ±0.9%, fmod = CLK/2168 010: fdev = ±1.2%, fmod = CLK/2168 011: fdev = ±1.9%, fmod = CLK/2168 100: fdev = ±2.3%, fmod = CLK/2168 101: fdev = ±0.7%, fmod = CLK/1300 110: fdev = ±1.3%, fmod = CLK/1300 111: fdev = ±1.57%, fmod = CLK/1300 IF LFMODE = 1, then: 000: SSCG OFF 001: fdev = ±0.7%, fmod = CLK/625 010: fdev = ±1.3%, fmod = CLK/625 011: fdev = ±1.8%, fmod = CLK/625 100: fdev = ±2.2%, fmod = CLK/625 101: fdev = ±0.7%, fmod = CLK/385 110: fdev = ±1.2%, fmod = CLK/385 111: fdev = ±1.7%, fmod = CLK/385 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 APPLICATIONS INFORMATION DISPLAY APPLICATION The DS99R124Q, in conjunction with the DS99R421Q or DS90UR241Q, is intended for interfacing between a host (graphics processor) and a Display. It supports an 18-bit color depth (RGB666) and up to WVGA display formats. In a RGB666 application, 18 color bits (R[5:0], G[5:0], B[5:0]), Pixel Clock (PCLK) and three control bits (VS, HS and DE) are supported across the serial link with PCLK rates from 5 to 43MHz. TYPICAL APPLICATION CONNECTION Figure 26 shows a typical application of the DS99R124QQ Des in pin mode for a 43 MHz WVGA Display Application. The LVDS inputs utilize 100 nF coupling capacitors to the line and the Receiver provides internal termination. Bypass capacitors are placed near the power supply pins. Ferrite beads are placed on the power lines for effective noise suppression. DS99R124Q (CON) 1.8V FB4 FB1 VDDL 3.3V VDDTX C7 C3 VDDL VDDIO FB5 FB2 VDDA VDDIO C8 C4 VDDA FB3 VDDP VDDIO C9 C5 VDDP VDDP TxCLKOUT+ C6 TxCLKOUT TxOUT2+ FPD-Link Interface TxOUT2- C1 RIN+ Serial FPD-Link II Interface LVDS 100 Ohm Termination TxOUT1+ TxOUT1TxOUT0+ RINTxOUT0- C2 CMF OS[2] C10 OS[1] OS[0] BISTEN BISTM OE Host Control PDB R C13 C1 - C2 = 0.1 PF (50 WV) C3 - C9 = 0.1 PF C10 - C12 = 4.7 PF C13 = > 10 PF R = 10 k: FB1 - FB5: Impedance = 1 k: Low DC resistance (< 1:) SCL SDA ID[X] 2 8 LOCK PASS VODSEL OSS_SEL LFMODE SSC[2] SSC[1] SSC[0] Tie to desired setting NC GND DAP (GND) Figure 26. DS99R124Q Typical Connection Diagram — Pin Control Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 23 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com POWER UP REQUIREMENTS AND PDB PIN The VDD (VDDn), VDDTX and VDDIO supply ramps should be faster than 1.5 ms with a monotonic rise. Supplies may power up in any order, however device operation should be initiated only after all supplies are in their valid operating ranges. The optional serial bus address selection is done upon power up also. Thus, if using this optional feature, the PDB signal must be delayed to allow time for the ID setting to occur. The delay maybe done by simply holding the PDB pin at a Low, or with an external RC delay based off the VDDIO rail which would then need to lag the others in time. If the PDB pin is pulled to VDDIO, it is recommended to use a 10 kΩ pull-up and a 10 uF cap to GND to delay the PDB input signal. TRANSMISSION MEDIA The Ser/Des chipset is intended to be used in a point-to-point configuration, through a PCB trace, or through twisted pair cable. The Ser and Des provide internal terminations providing a clean signaling environment. The interconnect for LVDS should present a differential impedance of 100 Ohms. Use cables and connectors that have matched differential impedance to minimize impedance discontinuities. Shielded or un-shielded cables may be used depending upon the noise environment and application requirements. LIVE LINK INSERTION The Ser and Des devices support live pluggable applications. The automatic receiver lock to random data “plug & go” hot insertion capability allows the DS99R124Q to attain lock to the active data stream during a live insertion event. PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS Circuit board layout and stack-up for the LVDS Ser/Des devices should be designed to provide low-noise power feed to the device. Good layout practice will also separate high frequency or high-level inputs and outputs to minimize unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane capacitance for the PCB power system with low-inductance parasitics, which has proven especially effective at high frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the range of 0.01 uF to 0.1 uF. Tantalum capacitors may be in the 2.2 uF to 10 uF range. Voltage rating of the tantalum capacitors should be at least 5X the power supply voltage being used. Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power entry. This is typically in the 50uF to 100uF range and will smooth low frequency switching noise. It is recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external bypass capacitor will increase the inductance of the path. A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of these external bypass capacitors, usually in the range of 20-30 MHz. To provide effective bypassing, multiple capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing the impedance at high frequency. Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power pin pairs. In some cases, an external filter many be used to provide clean power to sensitive circuits such as PLLs. Use at least a four layer board with a power and ground plane. Locate LVCMOS signals away from the LVDS lines to prevent coupling from the LVCMOS lines to the LVDS lines. Closely-coupled differential lines of 100 Ohms are typically recommended for LVDS interconnect. The closely coupled lines help to ensure that coupled noise will appear as common-mode and thus is rejected by the receivers. The tightly coupled lines will also radiate less. Information on the WQFN style package is provided in Texas Instruments Note: AN-1187 (SNOA401). 24 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q DS99R124Q www.ti.com SNLS318D – JANUARY 2010 – REVISED APRIL 2013 LVDS INTERCONNECT GUIDELINES See AN-1108 (SNLA008) and AN-905 (SNLA035) for full details. • Use 100Ω coupled differential pairs • Use the S/2S/3S rule in spacings – S = space between the pair – 2S = space between pairs – 3S = space to LVCMOS signal • Minimize the number of Vias • Use differential connectors when operating above 500Mbps line speed • Maintain balance of the traces • Minimize skew within the pair • Terminate as close to the TX outputs and RX inputs as possible Additional general guidance can be found in the LVDS Owner’s Manual - available in PDF format from the TI web site at: http://www.ti.com/ww/en/analog/interface/lvds.shtml Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q 25 DS99R124Q SNLS318D – JANUARY 2010 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision C (April 2013) to Revision D • 26 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 25 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: DS99R124Q PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) DS99R124QSQ/NOPB ACTIVE WQFN RHS 48 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 105 DS99R124Q DS99R124QSQE/NOPB ACTIVE WQFN RHS 48 250 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 105 DS99R124Q DS99R124QSQX/NOPB ACTIVE WQFN RHS 48 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 105 DS99R124Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing DS99R124QSQ/NOPB WQFN RHS 48 DS99R124QSQE/NOPB WQFN RHS DS99R124QSQX/NOPB WQFN RHS SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS99R124QSQ/NOPB WQFN RHS 48 1000 367.0 367.0 38.0 DS99R124QSQE/NOPB WQFN RHS 48 250 213.0 191.0 55.0 DS99R124QSQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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