CPC1906 Single-Pole, Normally Open Power SIP OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 60 2 0.3 Units VP Arms / ADC Description IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability, and compact size to a new family of high-power solid state relays. As part of that family, the CPC1906 is a single-pole, normally open (1-Form-A) solid state relay. The CPC1906 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The combination of low on-resistance and high load current handling capabilities makes the relay suitable for a variety of high-performance switching applications. Features • • • • • • Handle Load Currents Up to 2Arms 2500Vrms Input/Output Isolation Power SIP Package High Reliability No Moving Parts Low Drive Power Requirements (TTL/CMOS Compatible) • Arc-Free With No Snubbing Circuits • No EMI/RFI Generation • Machine Insertable, Wave Solderable Approvals • UL 508 Certified Component: File E69938 Applications Ordering Information • • • • • Industrial Controls Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • IC Equipment • Home Appliances Part # CPC1906Y Description 4-Pin (8-Pin Body) Power SIP Package (25 per tube) Pin Configuration 1 - 2 + 3 4 Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton Pb DS-CPC1906-R07 toff e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1906 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input control Current Peak (10ms) Input Power Dissipation1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 60 5 50 1 150 2500 -40 to +85 -40 to +125 Units V V mA A mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Derate linearly 3.33 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current, Continuous Peak Load Current On-Resistance1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input/Output 1 Conditions Symbol Min Typ Max Units free air t < 10ms IL=1A VL=60VP IL ILPK RON ILEAK - 0.105 - 2 ±6 0.3 1 ADC/Arms AP µA VL=50V, f=1MHz ton toff COUT - 3.5 0.04 130 10 5 - IL=1A IF=5mA VR=5V IF IF VF IR 0.6 0.9 - 3 1.2 - 10 1.4 10 mA mA V µA f=1MHz II/O - 2 - pF Conditions Symbol Min Typ Max Units - RJC - 1.5 - °C/W IF=10mA, VL=10V ms pF Measurement taken within 1 second of on-time. Thermal Characteristics Parameter Thermal Resistance (junction to case) 2 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION CPC1906 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=10mA, TA=25ºC) Device Count (N) Device Count (N) 30 25 20 15 10 5 0 25 25 20 20 Device Count (N) 35 15 10 5 1.19 1.21 1.23 LED Forward Voltage (V) 1.25 2.5 3.0 3.5 4.0 Turn-On (ms) 35 35 30 30 Device Count (N) Device Count (N) Typical On-Resistance Distribution (N=50, IF=10mA, IL=1ADC, TA=25ºC) 25 20 15 10 0.103 4.5 0.104 0.105 0.106 0.107 1.4 IF=50mA IF=20mA IF=10mA 1.2 1.0 0.8 60 80 100 0.050 15 10 66 0.108 67 68 69 70 Blocking Voltage (VP) 71 Typical Turn-Off vs. LED Forward Current (IL=100mADC) 0.09 4.0 3.6 3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0 120 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA) Typical IF for Switch Operation vs. Temperature (IL=100mADC) Typical Turn-On vs. Temperature (IF=10mA, IL=100 mADC) Typical Turn-Off vs. Temperature (IF=10mA, IL=100 mADC) 2.1 0.70 1.8 0.60 1.5 0.50 Turn-Off (ms) Turn-On (ms) LED Current (mA) 0.046 20 1.2 0.9 0.6 0 20 40 60 Temperature (ºC) 80 100 0.40 0.30 0.20 0 0 -20 50 0.10 0.3 -40 0.042 25 Turn-Off (ms) 1.6 Turn-On (ms) LED Forward Voltage Drop (V) 1.8 10.0 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 0.037 Typical Blocking Voltage Distribution (N=50, TA=25ºC) Typical Turn-On vs. LED Forward Current (IL=100mADC) Typical LED Forward Voltage Drop vs. Temperature 40 0.033 0.033 5.0 Turn-Off (ms) On-Resistance (:) 20 5 0 0 0 10 5 5 -20 15 0 0 1.17 -40 Typical Turn-Off Time (N=50, IF=10mA, IL=5mADC, TA=25ºC) Typical Turn-On Time (N=50, IF=10mA, IL=5mADC, TA=25ºC) -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 80 100 Temperature (ºC) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R07 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1906 PERFORMANCE DATA* 3 0.18 2 0.15 0.12 0.09 0.06 1 0 -1 -2 0.03 -20 0 20 40 60 80 100 Temperature (ºC) -0.1 0.0 0.1 Load Voltage (V) Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 3 & 4 (VL=60V) 72 0.035 71 0.030 70 0.025 69 68 67 66 0.2 64 -40 -20 0 20 40 60 Temperature (ºC) 80 100 2.0 1.5 1.0 0.5 -40 -20 0 20 40 60 80 100 120 Temperature (ºC) Energy Rating Curve (Free Air, No Heat Sink) 7 6 0.020 0.015 0.010 0 -40 2.5 0.3 5 4 3 2 0.005 65 3.0 0.0 -0.2 Load Current (A) -40 -3 -0.3 Leakage (PA) Blocking Voltage (VP) 3.5 Load Current (ADC/Arms) 0.21 0 Maximum Load Current vs. Temperature (IF=10mA) Typical Load Current vs. Load Voltage (IF=10mA, TA=25ºC) Load Current (A) On-Resistance (:) Typical On-Resistance vs. Temperature (IF=10mA, IL=100 mADC) -20 0 20 40 60 Temperature (ºC) 80 100 1 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION CPC1906 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1906Y MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1906Y 245ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R07 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1906 MECHANICAL DIMENSIONS CPC1906Y 21.082±0.381 (0.830±0.015) PCB Hole Pattern 3.302±0.051 (0.130±0.002) 10.160±0.127 (0.400±0.005) 1.75 (0.069) 7º TYP 4 Places Pin 1 1.778 (0.070) 0.762±0.076 (0.030±0.003) 2.540±0.127 (0.100±0.005) 4.572±0.127 (0.180±0.005) 10.160±0.127 (0.400±0.005) 5.080±0.127 (0.200±0.005) 1.651±0.102 (0.065±0.004) 5.080 (0.200) 10.160 (0.400) 1.016±0.127 (0.040±0.005) Pin 1 1.150 DIA. x4 (0.045 DIA. x4) 2.540 (0.100) 0.381±0.013 (0.015±0.0005) 1.778 (0.070) 7º TYP 4 Places Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1906-R07 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/17/2012