Infineon IHW15N120R2 Reverse conducting igbt with monolithic body diode Datasheet

IHW15N120R2
Soft Switching Series
Reverse Conducting IGBT with monolithic body diode
Features:
• Powerful monolithic Body Diode with very low forward voltage
• Body diode clamps negative voltages
• Trench and Fieldstop technology for 1200 V applications offers :
- very tight parameter distribution
- high ruggedness, temperature stable behavior
• Low EMI
1
• Qualified according to JEDEC for target applications
• Pb-free lead plating; RoHS compliant
• Complete product spectrum and PSpice Models :
http://www.infineon.com/igbt/
C
G
E
PG-TO-247-3-21
Applications:
• Inductive Cooking
• Soft Switching Applications
Type
IHW15N120R2
VCE
IC
VCE(sat),Tj=25°C
Tj,max
Marking
Package
1200V
15A
1.5V
175°C
H15R1202
PG-TO-247-3-21
Maximum Ratings
Parameter
Symbol
Value
Unit
Collector-emitter voltage
VCE
1200
V
DC collector current
TC = 25°C
TC = 100°C
IC
Pulsed collector current, tp limited by Tjmax
ICpul s
45
Turn off safe operating area (VCE ≤ 1200V, Tj ≤ 175°C)
-
45
Diode forward current
IF
A
30
15
TC = 25°C
30
TC = 100°C
15
Diode pulsed current, tp limited by Tjmax
IFpul s
Diode surge non repetitive current, tp limited by Tjmax
TC = 25°C, tp = 10ms, sine halfwave
TC = 25°C, tp ≤ 2.5µs, sine halfwave
TC = 100°C, tp ≤ 2.5µs, sine halfwave
IFSM
Gate-emitter voltage
VGE
Transient Gate-emitter voltage (tp < 5 ms)
45
50
130
120
±20
V
±25
Power dissipation TC = 25°C
Ptot
Operating junction temperature
357
W
Tj
-40...+175
°C
Storage temperature
Tstg
-55...+175
Soldering temperature, 1.6mm (0.063 in.) from case for 10s
-
260
Mounting Torque
Ms
0.6
1
Nm
J-STD-020 and JESD-022
Power Semiconductors
1
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
Thermal Resistance
Parameter
Symbol
Conditions
Max. Value
Unit
RthJC
0.52
K/W
RthJCD
0.47
Characteristic
IGBT thermal resistance,
junction – case
Diode thermal resistance,
junction – case
Thermal resistance,
RthJA
40
junction – ambient
Electrical Characteristic, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Conditions
Value
min.
typ.
max.
1200
-
-
T j =2 5 °C
-
1.5
1.75
T j =1 2 5° C
-
1.7
-
T j =1 7 5° C
-
1.8
-
T j =2 5 °C
-
1.45
1.65
T j =1 2 5° C
-
1.55
-
T j =1 7 5° C
-
1.6
-
5.1
5.8
6.4
Unit
Static Characteristic
Collector-emitter breakdown voltage
V ( B R ) C E S V G E = 0V , I C = 5 00 µA
Collector-emitter saturation voltage
VCE(sat)
Diode forward voltage
VF
V
V G E = 15 V , I C = 15 A
V G E = 0V , I F = 1 5 A
Gate-emitter threshold voltage
VGE(th)
I C = 0. 4m A,
VCE=VGE
Zero gate voltage collector current
ICES
V C E = 12 0 0V ,
V G E = 0V
µA
T j =2 5 °C
-
-
5
T j =1 7 5° C
-
-
2500
Gate-emitter leakage current
IGES
V C E = 0V , V G E =2 0 V
-
-
100
nA
Transconductance
gfs
V C E = 20 V , I C = 15 A
-
11.7
-
S
Integrated gate resistor
RGint
Power Semiconductors
none
2
Ω
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
Dynamic Characteristic
Input capacitance
Ciss
V C E = 25 V ,
-
1530
-
Output capacitance
Coss
V G E = 0V ,
-
49
-
Reverse transfer capacitance
Crss
f= 1 MH z
-
39
-
Gate charge
QGate
V C C = 96 0 V, I C =1 5 A
-
133
-
nC
-
13
-
nH
pF
V G E = 15 V
Internal emitter inductance
LE
measured 5mm (0.197 in.) from case
Switching Characteristic, Inductive Load, at Tj=25 °C
Parameter
Symbol
Conditions
Value
min.
typ.
max.
-
282
-
-
62
-
-
0.9
-
-
0.9
-
Unit
IGBT Characteristic
Turn-off delay time
td(off)
Fall time
tf
Turn-off energy
Eoff
Total switching energy
Ets
T j =2 5 °C ,
V C C = 60 0 V, I C = 1 5 A
V G E = 0 /1 5 V,
R G = 14 . 8Ω,
2)
L σ =2 3 0n H,
2)
C σ = 3 9p F
Switching Characteristic, Inductive Load, at Tj=175 °C
Parameter
Symbol
Conditions
Value
min.
typ.
max.
-
342
-
-
90
-
-
1.3
-
-
1.3
-
Unit
IGBT Characteristic
Turn-off delay time
td(off)
Fall time
tf
Turn-off energy
Eoff
Total switching energy
Ets
2)
T j =1 7 5° C
V C C = 60 0 V, I C = 1 5 A,
V G E = 0 / 15 V ,
R G = 1 4. 8Ω ,
2)
L σ =2 3 0n H ,
2)
C σ =3 9 pF
Leakage inductance L σ a nd Stray capacity C σ due to dynamic test circuit in Figure E.
Power Semiconductors
3
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
tp=1µs
10µs
TC=80°C
IC, COLLECTOR CURRENT
IC, COLLECTOR CURRENT
40A
TC=110°C
30A
20A
Ic
10A
10A
50µs
200µs
1A
1ms
10ms
0A
10Hz
DC
100Hz
1kHz
10kHz
100kHz
1V
f, SWITCHING FREQUENCY
Figure 1. Collector current as a function of
switching frequency for hard
switching (turn-off)
(Tj ≤ 175°C, D = 0.5, VCE = 600V,
VGE = 0/+15V, RG = 14.8Ω)
10V
100V
1000V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 2. IGBT Safe operating area
(D = 0, TC = 25°C,
Tj ≤175°C;VGE=15V)
250W
IC, COLLECTOR CURRENT
Ptot, DISSIPATED POWER
30A
200W
150W
100W
20A
10A
50W
0W
25°C
50°C
75°C
100°C
125°C
0A
25°C
150°C
TC, CASE TEMPERATURE
Figure 3. Power dissipation as a function of
case temperature
(Tj ≤ 175°C)
Power Semiconductors
50°C
75°C
100°C 125°C
150°C
TC, CASE TEMPERATURE
Figure 4. DC Collector current as a function
of case temperature
(VGE ≥ 15V, Tj ≤ 175°C)
4
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
40A
VGE=20V
VGE=20V
15V
30A
IC, COLLECTOR CURRENT
IC, COLLECTOR CURRENT
40A
13V
11V
9V
20A
7V
10A
13V
11V
9V
20A
7V
10A
0A
0A
0V
1V
0V
2V
40A
TJ=175°C
25°C
30A
20A
10A
0A
0V
2V
4V
6V
8V
10V
VGE, GATE-EMITTER VOLTAGE
Figure 7. Typical transfer characteristic
(VCE=20V)
Power Semiconductors
1V
2V
3V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 6. Typical output characteristic
(Tj = 175°C)
VCE(sat), COLLECTOR-EMITT SATURATION VOLTAGE
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 5. Typical output characteristic
(Tj = 25°C)
IC, COLLECTOR CURRENT
15V
30A
IC=30A
2.5V
2.0V
IC=15A
1.5V
IC=7.5A
1.0V
0.5V
0.0V
-50°C
0°C
50°C
100°C
150°C
TJ, JUNCTION TEMPERATURE
Figure 8. Typical collector-emitter
saturation voltage as a function of
junction temperature
(VGE =15V)
5
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
td(off)
t, SWITCHING TIMES
t, SWITCHING TIMES
td(off)
100ns
tf
10ns
100ns
tf
10ns
0A
10A
20A
IC, COLLECTOR CURRENT
Figure 9. Typical switching times as a
function of collector current
(inductive load, TJ=175°C,
VCE=600V, VGE=0/15V, RG=14.8Ω,
Dynamic test circuit in Figure E)
10Ω
20Ω
30Ω
40Ω
50Ω
60Ω
70Ω
RG, GATE RESISTOR
Figure 10. Typical switching times as a
function of gate resistor
(inductive load, TJ=175°C,
VCE=600V, VGE=0/15V, IC=15A,
Dynamic test circuit in Figure E)
VGE(th), GATE-EMITT TRSHOLD VOLTAGE
t, SWITCHING TIMES
td(off)
100ns
tf
10ns
25°C
50°C
75°C
100°C
125°C
max.
5V
typ.
4V
min.
3V
2V
-50°C
150°C
TJ, JUNCTION TEMPERATURE
Figure 11. Typical switching times as a
function of junction temperature
(inductive load, VCE=600V,
VGE=0/15V, IC=15A, RG=14.8Ω,
Dynamic test circuit in Figure E)
Power Semiconductors
6V
0°C
50°C
100°C
TJ, JUNCTION TEMPERATURE
Figure 12. Gate-emitter threshold voltage as
a function of junction temperature
(IC = 0.4mA)
6
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
2.0mJ
E, SWITCHING ENERGY LOSSES
E, SWITCHING ENERGY LOSSES
1.8mJ
Eoff
1.5mJ
1.0mJ
0.5mJ
1.5mJ
1.3mJ
1.0mJ
0.8mJ
0.5mJ
0.3mJ
0.0mJ
0.0mJ
0A
5A
10A
15A
20A
10Ω
25A
IC, COLLECTOR CURRENT
Figure 13. Typical turn-off energy as a
function of collector current
(inductive load, TJ=175°C,
VCE=600V, VGE=0/15V, RG=14.8Ω,
Dynamic test circuit in Figure E)
E, SWITCHING ENERGY LOSSES
Eoff
0.6mJ
0.4mJ
0.2mJ
0.0mJ
25°C
30Ω
40Ω
1.5mJ
1.0mJ
0.8mJ
20Ω
50°C
75°C
60Ω
70Ω
100°C 125°C 150°C
Eoff
1.0mJ
0.5mJ
0.0mJ
400V
TJ, JUNCTION TEMPERATURE
Figure 15. Typical turn-off energy as a
function of junction temperature
(inductive load, VCE=600V,
VGE=0/15V, IC=15A, RG=14.8Ω,
Dynamic test circuit in Figure E)
Power Semiconductors
50Ω
RG, GATE RESISTOR
Figure 14. Typical turn-off energy as a
function of gate resistor
(inductive load, TJ=175°C,
VCE=600V, VGE=0/15V, IC=15A,
Dynamic test circuit in Figure E)
1.2mJ
E, SWITCHING ENERGY LOSSES
Eoff
500V
600V
700V
800V
900V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 16. Typical turn-off energy as a
function of collector emitter
voltage
(inductive load, TJ=175°C,
VGE=0/15V, IC=15A, RG=14.8Ω,
Dynamic test circuit in Figure E)
7
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
240V
960V
10V
100pF
Coss
5V
Crss
0V
10pF
0nC
50nC
100nC
150nC
200nC
D=0.5
0.2
-1
10 K/W
0.1
0.05
0.02
τ, (s)
9.37*10-2
1.20*10-2
1.03*10-3
1.15*10-4
R,(K/W)
0.0861
0.1702
0.1372
0.0454
R1
R2
0.01
single
pulse
C 1 = τ 1 /R 1
C 2 = τ 2 /R 2
10V
20V
D=0.5
-1
10 K/W
0.2
R,(K/W)
0.1092
0.1517
0.1148
0.0198
0.1
τ, (s)
7.41*10-2
8.77*10-3
5.58*10-4
3.81*10-5
R1
0.05
R2
0.02
C 1 = τ 1 /R 1
0.01
C 2 = τ 2 /R 2
single pulse
-2
-2
10 K/W
0V
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 18. Typical capacitance as a function
of collector-emitter voltage
(VGE=0V, f = 1 MHz)
ZthJC, TRANSIENT THERMAL RESISTANCE
QGE, GATE CHARGE
Figure 17. Typical gate charge
(IC=15 A)
ZthJC, TRANSIENT THERMAL RESISTANCE
Ciss
1nF
c, CAPACITANCE
VGE, GATE-EMITTER VOLTAGE
15V
10 K/W
10µs
100µs
1ms
10ms
100ms
tP, PULSE WIDTH
Figure 19. IGBT transient thermal
resistance
(D = tp / T)
Power Semiconductors
10µs
100µs
1ms
10ms
100ms
tP, PULSE WIDTH
Figure 20. Typical Diode transient thermal
impedance as a function of pulse width
(D=tP/T)
8
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
IF=30A
2.0V
40A
15A
VF, FORWARD VOLTAGE
IF, FORWARD CURRENT
35A
30A
25A
TJ=25°C
20A
175°C
15A
10A
1.5V
7.5A
1.0V
0.5V
5A
0A
0.0V
0.0V
0.5V
1.0V
1.5V
2.0V
VF, FORWARD VOLTAGE
Figure 21. Typical diode forward current as
a function of forward voltage
Power Semiconductors
0°C
50°C
100°C
150°C
TJ, JUNCTION TEMPERATURE
Figure 22. Typical diode forward voltage
as a function of junction temperature
9
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
PG-TO247-3-21
Power Semiconductors
10
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
i,v
tr r =tS +tF
diF /dt
Qr r =QS +QF
IF
tS
QS
Ir r m
tr r
tF
QF
10% Ir r m
dir r /dt
90% Ir r m
t
VR
Figure C. Definition of diodes
switching characteristics
τ1
τ2
r1
r2
τn
rn
Tj (t)
p(t)
r1
r2
rn
Figure A. Definition of switching times
TC
Figure D. Thermal equivalent
circuit
Figure E. Dynamic test circuit
Leakage inductance Lσ =180nH
an d Stray capacity C σ =39pF.
Figure B. Definition of switching losses
Power Semiconductors
11
Rev. 1.2
May 06
IHW15N120R2
Soft Switching Series
Power Semiconductors
12
Rev. 1.2
May 06
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