AVAGO HSMS-8101 Surface mount microwave schottky mixer diodes low capacitance Datasheet

HSMS-8101, 8202, 8207, 8209
Surface Mount Microwave Schottky Mixer Diodes
Data Sheet
Description/Applications
Features
These low cost microwave Schottky diodes are ­specifically
designed for use at X/Ku-bands and are ideal for DBS and
VSAT downconverter applications. They are available in
SOT‑23 and SOT‑143 standard package configurations.
• Optimized for use at 10‑14 GHz
Note that Avago's manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent
sites on the wafer, assuring the highest degree of
match.
Plastic SOT-23 Package
• Low Capacitance
• Low Conversion Loss
• Low RD
• Low Cost Surface Mount Plastic Package
• Lead-free
Package Lead Code ­Identification
(Top View)
SINGLE
3
1
#1
Plastic SOT-143 Package
3
1
RING
QUAD
#7
SERIES
3
2
1
4
CROSS-OVER
QUAD
3
4
2
#2
1
#9
2
2
Absolute Maximum Ratings [1], TA = +25°C
Symbol
Parameter
Unit
Min.
Max.
PT
Total Device Dissipation
mW
—
75
PIV
Peak Inverse Voltage
V
—
4
TJ
Junction Temperature
°C
—
+150
TSTG, Top
Storage and Operating
Temperature
°C
-65
+150
[2]
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. Measured in an infinite heat sink at TCASE = 25°C. Derate linearly to
zero at 150°C per diode.
Attention: Observe precautions for
handling electrostatic ­sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control.
DC Electrical Specifications, TA = 25°C
HSMS-8101
Symbol
Parameters and Test Conditions
VBR
HSMS-8202
Max.
Min.
Breakdown Voltage
IR = 10 µA
V
4
CT
Total Capacitance
VR = 0 V, f = 1 MHz
pF
0.26
0.26
0.26
0.26
DCT
Capacitance Difference
VR = 0 V, f = 1 MHz
pF
—
0.04
0.04
0.04
RD
Dynamic Resistance
IF = 5 mA
Ω
14
14
14
14
DRD
Dynamic Resistance Difference
IF = 5 mA
Ω
—
2
2
2
VF
Forward Voltage
IF = 1 mA
mV
DVF
Forward Voltage Difference
IF = 1 mA
mV
4
250
Package Marking Code
where x is date code
RF Electrical Parameters, TA = 25°C
Max.
350
Min.
HSMS-8209
Units
Lead Code
Min.
HSMS-8207
Max.
Min.
4
250
350
—
4
250
350
20
250
Parameter
Units
Typical
Lc
Conversion Loss at 12 GHz
dB
6.3
ZIF
IF Impedance
Ω
150
SWR
SWR at 12 GHz
20
1
2
7
9
R1x
2Rx
R7x
R9x
0.08 pF
1.2
1.0 nH
Note:
DC Load Resistance = 0 Ω; LO Power = 1 mW.
1.3 nH
6
0.17 pF
Rj
Self Bias
SPICE Parameters
IS = 4.6 E-8
EG = 0.69
RS = 6
CJO = 0.18 E-12
N = 1.09
PB (VJ) = 0.5
BV = 7.3
M = 0.5
IBV = 10E-5
FC = 0.5
350
20
Linear Equivalent Circuit
Symbol
Max.
TT = 0
Rj
1 mA
2.5 mA
256
142
Typical Performance, TC = 25°C
10
10
IF - FORWARD CURRENT (mA)
FORWARD CURRENT (mA)
IF (Left Scale)
1
TA = +125 C
TA = +25 C
TA = –55 C
0.1
0.01
0
0.2
0.4
0.6
0.8
10
VF (Right Scale)
1
0.3
0.20
9
30
1
0.25
FORWARD VOLTAGE (V)
0.30
0.35
0.40
0.45
0.50
8
CONVERSION LOSS (dB)
30
VF - FORWARD VOLTAGE DIFFERENCE (mV)
100
7
6
–7 –5 –3 –1
0.3
0.55
Figure 1. Typical Forward Current vs. Forward
Voltage at Three Temperatures.
1
3
5
7
9
Figure 3. Typical Conversion Loss vs. Local Oscillator
Power.
Figure 2. Typical VF Match, HSMS-820X Pairs and
Quads.
Ordering Information
Profile Option Descriptions
Specify part number followed by option. For example:
-BLKG = Bulk
HSMS - 8101 - XXXG
-TR1G = 3K pc. Tape and Reel, Device Orientation
Figures 4, 5
Bulk or Tape and Reel Option
Part Number
Surface Mount Schottky
Device Orientation
-TR2G = 10K pc. Tape and Reel, Device Orientation
Figures 4, 5
Tape and Reeling conforms to Electronic Industries RS481, “Taping of Surface Mounted Components for Auto‑
mated Placement.”
REEL
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
TOP VIEW
TOP VIEW
END VIE W
4 mm
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Figure 4. Option -TR1G/-TR2G for SOT-23 Packages.
8 mm
ABC
ABC
ABC
ABC
ABC
ABC
END VIEW
4 mm
ABC
8 mm
11 13
LOCAL OSCILLATOR POWER (dBm)
V - FORWARD VOLTAGE (V)
Note: "AB" represents package marking code.
"C" represents date code.
Figure 5. Option -TR1G/-TR2G for SOT-143 Packages.
Package Characteristics
Lead Material
Alloy 42
Lead Finish
Tin 100% (Lead-free option)
Maximum Soldering Temperature
260°C for 5 seconds
Minimum Lead Strength
2 pounds pull
Typical Package Inductance
2 nH
Typical Package Capacitance
0.08 pF (opposite leads)
Package Dimensions
Recommended PCB Pad Layout for Avago’s SOT-23
Products
Outline 23 (SOT-23)
e2
0.039
1
e1
0.039
1
XXX
E
E1
e
0.079
2.0
L
B
C
DIMENSIONS (mm)
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
SYMBOL
A
A1
B
C
D
E1
e
e1
e2
E
L
MIN.
0.79
0.000
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
0.035
0.9
MAX.
1.20
0.100
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
Outline 143 (SOT-143)
0.031
0.8
Dimensions in inches
mm
Recommended PCB Pad Layout for Avago’s SOT-143
Products
e2
e1
0.112
2.85
B1
E
XXX
0.079
2
0.033
0.85
E1
L
B
e
0.114
2.9
0.033
0.85
DIMENSIONS (mm)
A
Notes:
XXX-package marking
Drawings are not to scale
0.048
1.2
0.071
1.8
C
D
A1
0.081
2.05
SYMBOL
A
A1
B
B1
C
D
E1
e
e1
e2
E
L
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
0.047
1.2
0.031
0.8
0.033
0.85
Dimensions in
inches
mm
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P2
D
E
P0
F
W
D1
t1
9° MAX
Ko
B0
A0
DESCRIPTION
13.5° MAX
8° MAX
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
3.15 ± 0.10
2.77 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.05
0.124 ± 0.004
0.109 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 ± 0.002
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 +0.30 - 0.10
0.229 ± 0.013
0.315 +0.012 - 0.004
0.009 � 0.0005
DISTANCE
BETWEEN
CENTERLINE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
Tape Dimensions and Product Orientation
For Outline SOT-143
P
D
P2
P0
E
F
W
D1
t1
9° MAX
9° MAX
K0
A0
B0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A0
B0
K0
P
D1
3.19 ± 0.10
2.80 ± 0.10
1.31 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.126 ± 0.004
0.110 ± 0.004
0.052 ± 0.004
0.157 ± 0.004
0.039 + 0.010
PERFORATION
DIAMETER
PITCH
POSITION
D
P0
E
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
0.059 + 0.004
0.157 ± 0.004
0.069 �± 0.004
CARRIER TAPE
WIDTH
THICKNESS
W
t1
8.00 +0.30 - 0.10
0.254 ± 0.013
0.315+0.012 - 0.004
0.0100 ± 0.0005
DISTANCE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50 ± 0.05
0.138 ± 0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P2
2.00 ± 0.05
0.079 ± 0.002
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-4024EN
AV02-1365EN - May 29, 2009
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