AD AD7879ACBZ-500R7 Low voltage controller for touch screen Datasheet

FEATURES
FUNCTIONAL BLOCK DIAGRAM
APPLICATIONS
Personal digital assistants
Smart handheld devices
Touch screen monitors
Point-of-sale terminals
Medical devices
Cell phones
VCC/REF
X– Y– X+ Y+
X+
X–
REF–
REF–
REF+
GND
TEMPERATURE
SENSOR
12-BIT
SAR ADC
AD7879/
AD7879-1
AD7889/
AD7889-1
SERIAL PORT
RESULT
REGISTERS
CONTROL
REGISTERS
PENIRQ/INT/DAV
Y–
FILTERING
Y+
AUX/VBAT/GPIO
4-wire touch screen interface
1.6 V to 3.6 V operation
Median and averaging filter to reduce noise
Automatic conversion sequencer and timer
User-programmable conversion parameters
Auxiliary analog input/battery monitor (0.5 V to 5 V)
1 optional GPIO
Interrupt outputs (INT, PENIRQ)
Touch-pressure measurement
Wake-up on touch function
Shutdown mode: 6 μA maximum
12-ball, 1.6 mm × 2 mm WLCSP
16-lead, 4 mm × 4 mm LFCSP
6-TO-1 MUX
SEQUENCER
AND TIMER
TO
RESULT
REGISTERS
CS/
DIN/ DOUT/ SCL
ADD0 ADD1 SDA
07667-001
Data Sheet
Low Voltage Controller for Touch Screens
AD7879/AD7889
Figure 1.
GENERAL DESCRIPTION
The AD7879/AD7889 are 12-bit successive approximation
analog-to-digital converters (SAR ADCs) with a synchronous
serial interface and low on-resistance switches for driving 4-wire
resistive touch screens. The AD7879/AD7889 work with a very
low power supply—a single 1.6 V to 3.6 V supply—and feature a
throughput rate of 105 kSPS. The devices include a shutdown
mode that reduces current consumption to less than 6 μA.
To reduce the effects of noise from LCDs and other sources, the
AD7879/AD7889 contain a preprocessing block. The
preprocessing function consists of a median filter and an
averaging filter. The combination of these two filters provides a
more robust solution, discarding the spurious noise in the signal
and keeping only the data of interest. The size of both filters is
programmable. Other user-programmable conversion controls
include variable acquisition time and first conversion delay; up
to 16 averages can be taken per conversion. The AD7879/AD7889
can run in slave mode or standalone (master) mode, using an
automatic conversion sequencer and timer.
Rev. D
The AD7879/AD7889 have a programmable pin that can
operate as an auxiliary input to the ADCs, as a battery monitor,
or as a general-purpose input/output (GPIO). In addition, a
programmable interrupt output can operate in three modes: as a
general-purpose interrupt to signal when new data is available
(DAV), as an interrupt to indicate when limits are exceeded
(INT), or as a pen-down interrupt when the screen is touched
(PENIRQ). The AD7879/AD7889 offer temperature
measurement and touch pressure measurement.
The AD7879 is available in a 12-ball, 1.6 mm × 2 mm WLCSP
and in a 16-lead, 4 mm × 4 mm LFCSP. The AD7889 is available
in a backside coated version of the WLCSP. Both devices support
an SPI interface (AD7879/AD7889) or an I2C interface (AD7879-1/
AD7889-1).
Note that throughout this data sheet, multifunction pins, such
as PENIRQ/INT/DAV, are referred to either by the entire pin
name or by a single function of the pin, for example, PENIRQ,
when only that function is relevant.
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AD7879/AD7889
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Auxiliary Input ........................................................................... 18
Applications ....................................................................................... 1
Battery Input ............................................................................... 18
Functional Block Diagram .............................................................. 1
Limit Comparison ...................................................................... 18
General Description ......................................................................... 1
GPIO ............................................................................................ 18
Revision History ............................................................................... 2
Conversion Timing ........................................................................ 20
Specifications..................................................................................... 3
Register Map ................................................................................... 21
SPI Timing Specifications (AD7879/AD7889) ........................ 4
Detailed Register Descriptions ..................................................... 22
2
I C Timing Specifications (AD7879-1/AD7889-1) ................. 5
Control Registers ............................................................................ 26
Absolute Maximum Ratings ............................................................ 6
Control Register 1 ...................................................................... 26
Thermal Resistance ...................................................................... 6
Control Register 2 ...................................................................... 28
ESD Caution .................................................................................. 6
Control Register 3 ...................................................................... 30
Pin Configurations and Function Descriptions ........................... 7
Interrupts ..................................................................................... 31
Typical Performance Characteristics ............................................. 9
Synchronizing the AD7879/AD7889 to the Host CPU......... 32
Terminology .................................................................................... 12
Serial Interface ................................................................................ 33
Theory of Operation ...................................................................... 13
SPI Interface ................................................................................ 33
Touch Screen Principles ............................................................ 13
I2C-Compatible Interface .......................................................... 35
Measuring Touch Screen Inputs ............................................... 14
Grounding and Layout .................................................................. 38
Touch Pressure Measurement ................................................... 15
Lead Frame Chip Scale Packages ............................................. 38
Temperature Measurement ....................................................... 15
WLCSP Assembly Considerations ........................................... 38
Median and Averaging Filters ....................................................... 17
Outline Dimensions ....................................................................... 39
AUX/VBAT/GPIO Pin ................................................................... 18
Ordering Guide .......................................................................... 40
REVISION HISTORY
8/2016—Rev. C to Rev. D
Changed CP-16-10 to CP-16-20 .................................. Throughout
Changes to General Description Section ...................................... 1
Changes to Figure 7, Figure 8, and Table 7 ................................... 8
Moved Figure 34; Renumbered Sequentially .............................. 30
Updated Outline Dimensions ....................................................... 39
Changes to Ordering Guide .......................................................... 39
11/2010—Rev. B to Rev. C
Changes to Table 2 ............................................................................ 3
Added Conversion Timing Section .............................................. 20
Added Figure 34.............................................................................. 29
1/2010—Rev. A to Rev. B
Updated Outline Dimensions ....................................................... 37
Changes to Ordering Guide .......................................................... 38
3/2009—Rev. 0 to Rev. A
Added AD7889 and Backside-Coated WLCSP .............. Universal
Change to Battery Monitor, Input Voltage Range Parameter ..... 3
Changes to Table 4 ............................................................................ 6
Added Thermal Resistance Section and Table 5; Renumbered
Sequentially ....................................................................................... 6
Changes to Pin Configurations and Function Descriptions Section ..7
Added Table 7 ....................................................................................8
Changes to First Method Section ................................................. 15
Changes to Median and Averaging Filters Section .................... 17
Changes to GPIO Interrupt Enable (Bit 12, Control Register 3,
Address 0x03) Section ................................................................... 19
Changes to Table 13 ....................................................................... 22
Changes to ADC Channel (Control Register 1, Bits[14:12])
Section .............................................................................................. 26
Changes to Power Management (Control Register 2,
Bits[15:14]) Section ........................................................................ 27
Changes to DAV—Data Available Interrupt Section................. 29
Changes to INT—Out-of-Limit Interrupt Section .................... 29
Changes to Writing Data Section ................................................. 31
Changes to Reading Data Section and Figure 40 ....................... 32
Changes to Figure 41...................................................................... 33
Changes to Writing Data over the I2C Bus Section .................... 34
Changes to Figure 44...................................................................... 35
Updated Outline Dimensions ....................................................... 37
Changes to Ordering Guide. ......................................................... 38
10/2008—Revision 0: Initial Version
Rev. D | Page 2 of 40
Data Sheet
AD7879/AD7889
SPECIFICATIONS
VCC = 1.6 V to 3.6 V, TA = −40°C to +85°C, unless otherwise noted.
Table 1.
Parameter
DC ACCURACY
Resolution
No Missing Codes
Integral Nonlinearity (INL)1
Differential Nonlinearity (DNL)1
Negative DNL
Positive DNL
Offset Error1, 2
Gain Error1, 2
Noise3
Power Supply Rejection3
Internal Clock Frequency
Internal Clock Accuracy
SWITCH DRIVERS
On Resistance1
Y+, X+
Y−, X−
ANALOG INPUTS
Input Voltage Range
DC Leakage Current
Input Capacitance
Accuracy
TEMPERATURE MEASUREMENT
Temperature Range
Resolution
Accuracy2
BATTERY MONITOR
Input Voltage Range
Input Impedance3
Accuracy
LOGIC INPUTS (DIN, SCL, CS, SDA, GPIO)
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IIN
Input Capacitance, CIN3
LOGIC OUTPUTS (DOUT, GPIO, SCL, SDA, INT)
Output High Voltage, VOH
Output Low Voltage, VOL
Floating State Leakage Current
Floating State Output Capacitance2
CONVERSION RATE3
Conversion Time
Throughput Rate
Min
Typ
12
11
12
±2
Max
Unit
±3
Bits
Bits
LSB
−0.99
2
±6
±4
70
60
2
1.8
2.2
6
5
Test Conditions/Comments
LSB size = 390 µV
LSB size = 390 µV
LSB
LSB
LSB
LSB
µV rms
dB
MHz
MHz
Ω
Ω
0
VCC
V
µA
pF
%
+85
°C
°C
°C
Calibrated at 25°C
V
kΩ
%
Uncalibrated accuracy
±0.1
30
0.3
−40
0.3
±2
0.5
5
16
2
5
0.7 × VCC
0.3 × VCC
0.01
10
VCC − 0.2
V
V
µA
pF
±0.1
5
V
V
µA
pF
9.5
µs
105
kSPS
0.4
Rev. D | Page 3 of 40
VIN = 0 V or VCC
Including 2 µs of acquisition time, median
and averaging (MAV) filter off; 2 µs of additional time is required if the MAV filter is on
AD7879/AD7889
Data Sheet
Parameter
POWER REQUIREMENTS
VCC
ICC
Converting Mode
Static
Min
Typ
Max
Unit
Test Conditions/Comments
1.6
2.6
3.6
V
480
406
650
μA
μA
0.5
6
μA
Specified performance
Digital inputs = 0 V or VCC
ADC on, PM = 10
ADC and temperature sensor are off; the reference and oscillator are on; PM = 01 or 11
PM = 00
Shutdown Mode
1
See the Terminology section.
Guaranteed by characterization; not production tested.
3
Sample tested at 25°C to ensure compliance.
2
SPI TIMING SPECIFICATIONS (AD7879/AD7889)
VCC = 1.6 V to 3.6 V, TA = −40°C to +85°C, unless otherwise noted. Sample tested at 25°C to ensure compliance. All input signals are
specified with tR = tF = 5 ns (10% to 90% of VCC) and timed from a voltage level of 1.4 V.
Table 2.
Parameter1
fSCL
t1
t2
t3
t4
t5
t6
t7
t8
Unit
MHz max
ns min
ns min
ns min
ns min
ns min
ns max
ns max
ns min
Description
CS falling edge to first SCL falling edge
SCL high pulse width
SCL low pulse width
DIN setup time
DIN hold time
DOUT access time after SCL falling edge
CS rising edge to DOUT high impedance
SCL rising edge to CS high
Guaranteed by design; not production tested.
CS
t1
t2
1
SCL
t4
DIN
t8
t3
2
3
15
16
1
2
15
16
t5
LSB
MSB
t6
DOUT
MSB
Figure 2. Detailed SPI Timing Diagram
Rev. D | Page 4 of 40
t7
LSB
07667-002
1
Limit
5
5
20
20
15
15
20
16
15
Data Sheet
AD7879/AD7889
I2C TIMING SPECIFICATIONS (AD7879-1/AD7889-1)
VCC = 1.6 V to 3.6 V, TA = −40°C to +85°C, unless otherwise noted. Sample tested at 25°C to ensure compliance. All input signals are
timed from a voltage level of 1.4 V.
Table 3.
Parameter1
fSCL
t1
t2
t3
t4
t5
t6
t7
t8
tR
tF
Unit
kHz max
μs min
μs min
μs min
ns min
ns min
μs min
μs min
μs min
ns max
ns max
Description
Start condition hold time, tHD; STA
Clock low period, tLOW
Clock high period, tHIGH
Data setup time, tSU; DAT
Data hold time, tHD; DAT
Stop condition setup time, tSU; STO
Start condition setup time, tSU; STA
Bus-free time between stop and start conditions, tBUF
Clock/data rise time
Clock/data fall time
Guaranteed by design; not production tested.
tR
t2
tF
t1
SCL
t3
t1
t5
t7
t6
t4
SDA
t8
STOP START
START
Figure 3. Detailed I2C Timing Diagram
Rev. D | Page 5 of 40
STOP
07667-003
1
Limit
400
0.6
1.3
0.6
100
300
0.6
0.6
1.3
300
300
AD7879/AD7889
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
Table 4.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
1
Rating
−0.3 V to +3.6 V
−0.3 V to VCC + 0.3 V
−0.3 V to +5 V
−0.3 V to VCC + 0.3 V
−0.3 V to VCC + 0.3 V
10 mA
Table 5. Thermal Resistance
Package Type1
12-Ball WLCSP
16-Lead LFCSP
1
θJA
75
30.4
Unit
°C/W
°C/W
4-layer board.
15 kV
10 kV
200µA
4 kV
1 kV
0.2 kV
−40°C to +85°C
−65°C to +150°C
150°C
TO OUTPUT
PIN
IOL
1.4V
CL
50pF
200µA
IOH
Figure 4. Circuit Used for Digital Timing
866 mW
2.138 W
260°C (±0.5°C)
300°C
ESD CAUTION
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. D | Page 6 of 40
07667-004
Parameter
VCC to GND
Analog Input Voltage to GND
AUX/VBAT to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Input Current to Any Pin Except Supplies1
ESD Rating (X+, Y+, X−, Y−)
Air Discharge Human Body Model
Contact Human Body Model
ESD Rating (All Other Pins)
Human Body Discharge
Field-Induced Charged Device Model
Machine Model
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Power Dissipation
WLCSP (4-Layer Board)
LFCSP (4-Layer Board)
IR Reflow Peak Temperature
Lead Temperature (Soldering 10 sec)
Data Sheet
AD7879/AD7889
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
BALL A1
INDICATOR
1
2
AUX/
VBAT/ V
GPIO CC/REF
BALL A1
INDICATOR
1
2
3
AUX/
VBAT/ V
GPIO CC/REF
X+
A
3
X+
A
PENIRQ/
INT/DAV
CS
PENIRQ/
INT/DAV ADD0
Y+
B
Y+
B
DOUT
DIN
X–
C
SDA
ADD1
X–
SCL
GND
Y–
C
SCL
GND
Y–
D
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
07667-005
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
Figure 5. AD7879/AD7889 WLCSP Pin Configuration
07667-006
D
Figure 6. AD7879-1/AD7889-1 WLCSP Pin Configuration
Table 6. WLCSP Pin Function Descriptions
AD7879/
AD7889
1A
Pin No.
AD7879-1/
AD7889-1
1A
Mnemonic
AUX/VBAT/GPIO
1B
1B
PENIRQ/INT/DAV
1C
Not applicable
1D
2A
2B
Not applicable
Not applicable
1C
1D
2A
Not applicable
2B
DOUT
SDA
SCL
VCC/REF
CS
ADD0
2C
Not
applicable
2D
Not applicable
2C
DIN
ADD1
2D
GND
3A
3B
3C
3D
3A
3B
3C
3D
X+
Y+
X−
Y−
Description
This pin can be programmed as an auxiliary input to the ADC (AUX), as a battery
measurement input to the ADC (VBAT), or as a GPIO.
Interrupt Output. This pin is asserted when the screen is touched (PENIRQ), when a
measurement exceeds the preprogrammed limits (INT), or when new data is available
in the registers (DAV). This pin is active low and has an internal 50 kΩ pull-up resistor.
SPI Serial Data Output for the AD7879/AD7889.
I2C Serial Data Input and Output for the AD7879-1/AD7889-1.
Serial Interface Clock Input.
Power Supply Input and ADC Reference.
Chip Select for the SPI Serial Interface on the AD7879/AD7889. This pin is active low.
I2C Address Bit 0 for the AD7879-1/AD7889-1. Tie this pin high or low to determine an
address for the AD7879-1/AD7889-1 (see Table 25).
SPI Serial Data Input to the AD7879/AD7889.
I2C Address Bit 1 for the AD7879-1/AD7889-1. Tie this pin high or low to determine an
address for the AD7879-1/AD7889-1 (see Table 25).
Ground. This pin is the ground reference point for all circuitry on the AD7879/AD7889.
Refer all analog input signals and any external reference signal to this voltage.
Touch Screen Input Channel.
Touch Screen Input Channel.
Touch Screen Input Channel.
Touch Screen Input Channel.
Rev. D | Page 7 of 40
10 NIC
NIC 3
Y– 5
NOTES
1. NIC = NO INTERNAL CONNECTION.
2. THE EXPOSED PAD IS NOT CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER JOINTS
AND MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO THE GROUND PLANE.
14 ADD0
13 AUX/VBAT/GPIO
10 NIC
9
X– 4
DOUT
SCL 8
GND 7
Y– 5
DIN 6
TOP VIEW
(Not to Scale)
11 NIC
SDA
SCL 8
9
X– 4
AD7879-1
NOTES
1. NIC = NO INTERNAL CONNECTION.
2. THE EXPOSED PAD IS NOT CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER JOINTS
AND MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO THE GROUND PLANE.
Figure 7. AD7879 LFCSP Pin Configuration
07667-008
NIC 2
GND 7
TOP VIEW
(Not to Scale)
12 PENIRQ/INT/DAV
Y+ 1
11 NIC
ADD1 6
AD7879
07667-007
NIC 3
16 X+
12 PENIRQ/INT/DAV
Y+ 1
NIC 2
15 VCC/REF
13 AUX/VBAT/GPIO
14 CS
16 X+
Data Sheet
15 VCC/REF
AD7879/AD7889
Figure 8. AD7879-1 LFCSP Pin Configuration
Table 7. LFCSP Pin Function Descriptions
Pin No.
AD7879
AD7879-1
1
1
2, 3, 10, 11
2, 3, 10, 11
4
4
5
5
6
Not applicable
Not applicable 6
Mnemonic
Y+
NIC
X−
Y−
DIN
ADD1
7
7
GND
8
9
Not applicable
12
8
Not applicable
9
12
SCL
DOUT
SDA
PENIRQ/INT/DAV
13
13
AUX/VBAT/GPIO
14
Not applicable
Not applicable
14
CS
ADD0
15
16
15
16
VCC/REF
X+
EP
Description
Touch Screen Input Channel.
No Internal Connection.
Touch Screen Input Channel.
Touch Screen Input Channel.
SPI Serial Data Input to the AD7879.
I2C Address Bit 1 for the AD7879-1. Tie this pin high or low to determine an address for
the AD7879-1 (see Table 25).
Ground. This pin is the ground reference point for all circuitry on the AD7879. Refer all
analog input signals and any external reference signal to this voltage.
Serial Interface Clock Input.
SPI Serial Data Output for the AD7879.
I2C Serial Data Input and Output for the AD7879-1.
Interrupt Output. This pin is asserted when the screen is touched (PENIRQ), when a
measurement exceeds the preprogrammed limits (INT), or when new data is available in
the registers (DAV). This pin is active low and has an internal 50 kΩ pull-up resistor.
This pin can be programmed as an auxiliary input to the ADC (AUX), as a battery
measurement input to the ADC (VBAT), or as a GPIO.
Chip Select for the SPI Serial Interface on the AD7879/AD7889. This pin is active low.
I2C Address Bit 0 for the AD7879-1/AD7889-1. Tie this pin high or low to determine an
address for the AD7879-1/AD7889-1 (see Table 25).
Power Supply Input and ADC Reference.
Touch Screen Input Channel.
Exposed Pad. The exposed pad is not connected internally. For increased reliability of
the solder joints and maximum thermal capability, it is recommended that the pad be
soldered to the ground plane.
Rev. D | Page 8 of 40
Data Sheet
AD7879/AD7889
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, VCC = 2.6 V, fSCL = 2 MHz, unless otherwise noted.
1.0
470
0.8
465
0.6
GAIN ERROR VARIATION (LSB)
475
455
450
445
440
435
430
0.2
2.6V
0
–0.2
3.6V
–0.4
1.6V
–0.6
–0.8
–40
–25
–10
10
25
40
TEMPERATURE (°C)
55
70
85
–1.0
07667-009
425
0.4
Figure 9. Supply Current vs. Temperature
–40
–25
–10
10
25
40
TEMPERATURE (°C)
55
70
85
07667-011
CURRENT (µA)
460
Figure 12. Change in ADC Gain vs. Temperature
1.0
700
0.8
600
OFFSET VARIATION (LSB)
0.6
CURRENT (µA)
500
400
300
200
0.4
1.6V
0.2
2.6V
0
–0.2
3.6V
–0.4
–0.6
100
2.0
2.2
2.4
2.6 2.8
VCC (V)
3.0
3.2
3.4
3.6
–1.0
2.0
3.5
1.5
3.0
1.0
2.5
0.5
INL (LSB)
4.0
2.0
–0.5
1.0
–1.0
0.5
–1.5
–40
–25
–10
10
25
50
TEMPERATURE (°C)
–10
10
25
40
TEMPERATURE (°C)
55
70
85
0
1.5
0
–25
Figure 13. ADC Offset Variation vs. Temperature
75
100
–2.0
07667-012
CURRENT (µA)
Figure 10. Supply Current vs. VCC
–40
Figure 11. Full Power-Down Current (IDD) vs. Temperature
0
512
1024
1536
2048
CODE
2560
Figure 14. ADC INL
Rev. D | Page 9 of 40
3072
3584
4096
07667-014
1.8
07667-010
1.6
07667-013
–0.8
0
AD7879/AD7889
Data Sheet
1.0
6.0
0.8
5.5
0.6
5.0
0.2
RON (Ω)
0
–0.2
4.5
4.0
–0.4
–0.6
X+ TO VCC
Y+ TO VCC
X– TO GND
Y– TO GND
3.5
–0.8
1
501
1001
1501
2001 2501
CODE
3001
3501
4001
3.0
07667-015
–1.0
Figure 15. ADC DNL
–40
–25
–10
10
25
40
TEMPERATURE (°C)
55
70
85
07667-017
DNL (LSB)
0.4
Figure 17. Switch On Resistance (RON) vs. Temperature
(X+, Y+: Pin to VCC; X−, Y−: Pin to GND)
2370
7
2369
6
2368
ADC CODE (Decimal)
4
3
X+ TO VCC
Y+ TO VCC
X– TO GND
Y– TO GND
2
2367
2366
2365
2364
2363
2362
1
1.6
1.8
2.0
2.2
2.4
2.6 2.8
VCC (V)
3.0
3.2
3.4
3.6
2360
Figure 16. Switch On Resistance (RON) vs. VCC
(X+, Y+: Pin to VCC; X−, Y−: Pin to GND)
–40 –25 –15 –5
5
15 25 35 45
TEMPERATURE (°C)
55
65
75
85
Figure 18. ADC Code vs. Temperature (Fixed Analog Input)
Rev. D | Page 10 of 40
07667-018
2361
0
07667-016
RON (Ω)
5
Data Sheet
AD7879/AD7889
1400
250
1000
NUMBER OF UNITS
800
600
400
INPUT TONE AMPLITUDE (dB)
100
0
07667-019
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
VCC (V)
–40
–60
–80
–100
–120
–140
07667-020
–160
0
1603
3206
4809
6412
8015
9618
11221
12824
14427
16030
17633
19236
20839
22442
24045
25648
27251
28854
30457
32060
33663
35266
36869
–3
–2
–1
0
Figure 21. Typical Uncalibrated Accuracy for the Battery Channel (25°C)
SNR = 61.58dB
THD = 72.34dB
FREQUENCY (Hz)
–4
ERROR (%)
Figure 19. Temperature Code vs. VCC for 25°C
–20
150
50
200
0
200
07667-021
TEMPERATURE (Code)
1200
0
MEAN: –1.98893
SD: 0.475534
Figure 20. Typical FFT Plot for the Auxiliary Channels at a 25 kHz Sampling
Rate and a 1 kHz Input Frequency
Rev. D | Page 11 of 40
AD7879/AD7889
Data Sheet
TERMINOLOGY
Differential Nonlinearity (DNL)
DNL is the difference between the measured and the ideal
1 LSB change between any two adjacent codes in the ADC.
Integral Nonlinearity (INL)
INL is the maximum deviation from a straight line passing
through the endpoints of the ADC transfer function. The
endpoints of the transfer function are zero scale at 1 LSB below
the first code transition and full scale at 1 LSB above the last
code transition.
Gain Error
Gain error is the deviation of the last code transition
(111 … 110 to 111 … 111) from the ideal (VREF − 1 LSB)
after the offset error has been calibrated out.
Offset Error
Offset error is the deviation of the first code transition
(00 … 000 to 00 … 001) from the ideal (AGND + 1 LSB).
On Resistance
On resistance is a measure of the ohmic resistance between the
drain and the source of the switch drivers.
Rev. D | Page 12 of 40
Data Sheet
AD7879/AD7889
THEORY OF OPERATION
The AD7879/AD7889 are a complete 12-bit data acquisition
system for digitizing positional inputs from a 4-wire resistive
touch screen. To support this function, data acquisition on the
AD7879/AD7889 is highly programmable to ensure accurate
and noise free results from the touch screen.
CONDUCTIVE ELECTRODE
ON BOTTOM SIDE
PLASTIC FILM WITH
TRANSPARENT, RESISTIVE
COATING ON BOTTOM SIDE
Y+
The core of the AD7879/AD7889 is a high speed, low power,
12-bit ADC with an input multiplexer, on-chip track-and-hold,
and an on-chip clock. Conversion results are stored in on-chip
result registers. Compare the results from the auxiliary input or
the battery input with high and low limits stored in the limit
registers to generate an out of limit interrupt (INT).
X–
Y–
Operating from a single supply from 1.6 V to 3.6 V, the AD7879/
AD7889 offer a throughput rate of 105 kHz. The device is
available in a 1.6 mm × 2 mm, 12-ball wafer level chip scale
package (WLCSP) and in a 4 mm × 4 mm, 16-lead, lead frame
chip scale package (LFCSP).
The AD7879/AD7889 have an on-chip sequencer that schedules
a sequence of preprogrammed conversions. The conversion
sequence starts automatically when the screen is touched or at
preset intervals, using the on-board timer.
To ensure that the AD7879/AD7889 work well with different
touch screens, the user is able to select the acquisition time. A
programmable delay ensures that the voltage on the touch
screen settles before a measurement is taken.
To reduce noise in the system, the ADC takes up to 16 conversion
results from each channel and writes the average of the results
to the register. If there is noise present in the system, use the
median filter to improve the performance of the AD7879/
AD7889.
CONDUCTIVE ELECTRODE
ON TOP SIDE
PLASTIC FILM WITH
TRANSPARENT, RESISTIVE
COATING ON TOP SIDE
LCD SCREEN
07667-022
X+
The AD7879/AD7889 also contain low resistance analog switches
to switch the X and Y excitation voltages to the touch screen
and to the on-chip temperature sensor. The high speed SPI
serial bus provides control of the devices, as well as communication
with the devices. The AD7879-1/AD7889-1 are available with an
I2C interface.
Figure 22. Basic Construction of a Touch Screen
The Y layer has conductive electrodes running along the top
and bottom edges, allowing the application of an excitation
voltage down the Y layer from top to bottom.
Provided that the layers are of uniform resistivity, the voltage
at any point between the two electrodes is proportional to the
horizontal position for the X layer and the vertical position for
the Y layer.
When the screen is touched, the two layers make contact. If
only the X layer is excited, the voltage at the point of contact
and, therefore, the horizontal position, can be sensed at one of
the Y layer electrodes. Similarly, if only the Y layer is excited,
the voltage and, therefore, the vertical position, can be sensed at
one of the X layer electrodes. By switching alternately between
X and Y excitation and measuring the voltages, the X and
Y coordinates of the contact point can be determined.
In addition to measuring the X and Y coordinates, it is also
possible to estimate the touch pressure by measuring the contact
resistance between the X and Y layers. The AD7879/AD7889
facilitate this measurement.
TOUCH SCREEN PRINCIPLES
A 4-wire touch screen consists of two flexible, transparent,
resistive coated layers typically separated by a small air gap
(see Figure 22). The X layer has conductive electrodes running
down the left and right edges, allowing the application of an
excitation voltage across the X layer from left to right.
Rev. D | Page 13 of 40
AD7879/AD7889
Data Sheet
The voltage seen at the input to the ADC in Figure 24 is
Figure 23 shows an equivalent circuit of the analog input structure
of the AD7879/AD7889, including the touch screen switches,
the main analog multiplexer, the ADC, and the dual 3 to 1
multiplexer that selects the reference source for the ADC.
VIN  VCC 
RY 
(1)
RYTOTAL
The advantage of the single-ended method is that the touch screen
excitation voltage is switched off when the signal is acquired.
Because a screen can draw over 1 mA, this is a significant
consideration for a battery-powered system.
VCC
X+
X–
Y+
Y–
X– Y– GND X+ Y+ VCC
INPUT
MUX
DUAL 3-TO-1 MUX
AUX/VBAT/GPIO
REF–
TEMPERATURE
SENSOR
REF+
12-BIT SUCCESSIVE
APPROXIMATION ADC
WITH TRACK-AND-HOLD
07667-023
IN+
Figure 23. Analog Input Structure
The AD7879/AD7889 can be set up to automatically convert
either specific input channels or a sequence of channels. The
results of the ADC conversions are stored in the result registers.
When measuring the ancillary analog inputs (AUX, TEMP, or
VBAT), the ADC uses a VCC reference and the measurement is
referred to GND.
The disadvantage of the single-ended method is that voltage
drops across the switches can introduce errors. Touch screens
can have a total end-to-end resistance ranging from 200 Ω to
900 Ω. By taking the lowest screen resistance of 200 Ω and a
typical switch resistance of 14 Ω, the user can reduce the apparent
excitation voltage to 200/228 × 100 = 87% of its actual value. In
addition, the voltage drop across the low-side switch adds to the
ADC input voltage. This introduces an offset into the input
voltage; thus, it can never reach 0.
Ratiometric Method
The ratiometric method illustrated in Figure 25 shows the
negative input of the ADC reference connected to Y− and the
positive input connected to Y+. Thus, the screen excitation
voltage provides the reference for the ADC. The input of the
ADC is connected to X+ to determine the Y position.
VCC
Y+
MEASURING TOUCH SCREEN INPUTS
Single-Ended Method
Figure 24 shows the single-ended method for the Y position.
For the X position, the excitation voltage is applied to X+ and
X− and the voltage is measured at Y+.
VCC
Y+
X+
INPUT
(VIA MUX)
TOUCH
SCREEN
REF+
ADC
REF–
Figure 25. Ratiometric Conversion of Touch Screen Inputs
For greater accuracy, the ratiometric method has two significant
advantages. One is that the reference to the ADC is provided
from the actual voltage across the screen; therefore, any voltage
dropped across the switches has no effect. The other advantage
is that because the measurement is ratiometric, it does not
matter if the voltage across the screen varies in the long term.
However, it must not change after the signal has been acquired.
The disadvantage of the ratiometric method is that the screen
must be powered up at all times because it provides the reference
voltage for the ADC.
REF+
ADC
REF–
Y–
GND
INPUT
(VIA MUX)
Y–
GND
07667-024
TOUCH
SCREEN
VREF
X+
07667-025
When measuring the touch screen inputs, it is possible to use
VCC as a reference or instead to use the touch screen excitation
voltage as the reference and to perform a ratiometric, differential
measurement. The differential method is the default method
and is selected by clearing the SER/DFR bit (Bit 9 in Control
Register 2) to 0. The single-ended method is selected by setting
this bit to 1.
Figure 24. Single-Ended Conversion of Touch Screen Inputs
Rev. D | Page 14 of 40
Data Sheet
AD7879/AD7889
TOUCH PRESSURE MEASUREMENT
Second Method for Calculating the Size of RTOUCH
The pressure applied to the touch screen by a pen or a finger can
also be measured with the AD7879/AD7889 by using simple
calculations. The contact resistance between the X and Y plates
is measured, providing a good indication of the size of the
depressed area and, therefore, the applied pressure. The area of
the spot that is touched is proportional to the size of the object
touching it. The size of this resistance (RTOUCH) can be calculated
using two different methods.
The second method for calculating RTOUCH requires the user to
know the resistance of the X-plate and Y-plate tablets. Three
touch screen conversions are required: a measurement of the
X position (XPOSITION), the Y position (YPOSITION), and the Z1
position.
Equation 3 also calculates the touch resistance (RTOUCH):
RTOUCH = RXPLATE × (XPOSITION/4096) × ((4096/Z1) − 1) −
RYPLATE × (1 − (YPOSITION/4096))
First Method for Calculating the Size of RTOUCH
The first method for calculating RTOUCH requires the user to know
the total resistance of the X-plate tablet (RX). Three touch screen
conversions are required: the measurement of the X position,
XPOSITION (Y+ input); the measurement of the X+ input with the
excitation voltage applied to Y+ and X− (Z1 measurement); and
the measurement of the Y− input with the excitation voltage
applied to Y+ and X− (Z2 measurement). These three measurements are shown in Figure 26.
The AD7879/AD7889 has two special ADC channel settings that
configure the X and Y switches for the Z1 and Z2 measurements
and store the results in the Z1 and Z2 result registers. The Z1
measurement is selected by setting the CHNL ADD[2:0] bits to
101 in Control Register 1 (Address 0x01); the result is stored in
the X+ (Z1) result register (Address 0x0A). The Z2 measurement is
selected by setting the CHNL ADD[2:0] bits to 100 in Control
Register 1 (Address 0x01); the result is stored in the Y− (Z2)
result register (Address 0x0B).
Y–
Y+
X+
The acquisition time is fixed at 16 ms for temperature
measurement.
Conversion Method
MEASURE
Z1 POSITION
The temperature limit comparison is performed on the result
in the temperature conversion result register (Address 0x0D),
which is the measurement of the diode forward voltage. The
values programmed into the high and low limits should be
referenced to the calibrated diode forward voltage to make
accurate limit comparisons.
TOUCH
RESISTANCE
X–
A temperature measurement option called the single-conversion
method is available on the AD7879/AD7889. The conversion
method requires only a single measurement on ADC Channel
001. The results are stored in the temperature conversion result
register (Address 0x0D). The AD7879/AD7889 do not provide
an explicit output of the temperature reading; the system must
perform some external calculations. This method is based on
an on-chip diode measurement.
MEASURE
X POSITION
RTOUCH = (RXPLATE) × (XPOSITION/4096) × ((Z2/Z1) − 1)
Y+
TEMPERATURE MEASUREMENT
The conversion method makes use of the fact that the temperature coefficient of a silicon diode is approximately −2.1 mV/°C.
However, this small change is superimposed on the diode forward
voltage, which can have a wide tolerance. Therefore, it is necessary
to calibrate by measuring the diode voltage at a known temperature
to provide a baseline from which the change in forward voltage
with temperature can be measured. This method provides a
resolution of approximately 0.3°C and a predicted accuracy
of ±2°C.
The touch resistance (RTOUCH) can then be calculated using
Equation 2:
X+
(2)
TOUCH
RESISTANCE
Y–
X–
Y+
X+
TOUCH
RESISTANCE
X–
MEASURE
Z2 POSITION
07667-026
Y–
(3)
Figure 26. Three Measurements Required for Touch Pressure
Rev. D | Page 15 of 40
AD7879/AD7889
Data Sheet
Temperature Calculations
Example
If an explicit temperature reading in degrees Celsius is required,
calculate for the single measurement method as follows:
Using VCC = 2.5 V as reference,
1.
Calculate the scale factor of the ADC in degrees per LSB.
Degrees per LSB = ADC LSB size/−2.1 mV =
(VCC/4096)/−2.1 mV
2.
3.
4.
Degrees per LSB = (2.5/4096)/−2.1 × 10−3 = −0.291
The ADC output is 983 decimal at 25°C, equivalent to a diode
forward voltage of 0.6 V.
The ADC output at TAMB is 880.
Save the ADC output, DCAL, at the calibration
temperature, TCAL.
Take the ADC reading, DAMB, at the temperature to be
measured, TAMB.
Calculate the difference in degrees between TCAL and TAMB by
∆T = (DAMB − DCAL) × degrees per LSB
5.
Add ∆T to TCAL.
Rev. D | Page 16 of 40
∆T = (880 − 983) × −0.291 = 30°C
TAMB = 25 + 30 = 55°C
Data Sheet
AD7879/AD7889
MEDIAN AND AVERAGING FILTERS
As explained in the Touch Screen Principles section, touch
screens are composed of two resistive layers, normally placed
over an LCD screen. Because these layers are in close proximity
to the LCD screen, noise can be coupled from the screen onto
these resistive layers, causing errors in the touch screen
positional measurements.
The AD7879/AD7889 contain a filtering block to process the
data and discard the spurious noise before sending the
information to the host. The purpose of this block is not only
the suppression of noise; the on-chip filtering also greatly
reduces the host processing loading.
The processing function consists of two filters that are applied
to the converted results: the median filter and the averaging filter.
The median filter suppresses the isolated out of range noise
and sets the number of measurements to be taken. These
measurements are arranged in a temporary array, where the
first value is the smallest measurement and the last value is
the largest measurement. Bit 6 and Bit 5 in Control Register 2
(MED1 and MED0, respectively) set the window of the median
filter and, therefore, the number of measurements taken.
Table 10. Median Averaging Filters (MAVF) Settings
Setting
M=A
M>A
M<A
Example
In this example, MED1, MED0 = 11 and AVG1, AVG0 = 10;
the median filter has a window size of 16. This means that 16
measurements are taken and arranged in descending order in a
temporary array.
Number of Measurements
Median filter disabled
4
8
16
The averaging filter size determines the number of values to
average. Bit 8 and Bit 7 in Control Register 2 (AVG1, AVG0)
set the average to 2, 4, 8, or 16 samples. Only the final averaged
result is written into the result register.
Table 9. Averaging Filter Size
AVG1
0
0
1
1
AVG0
0
1
0
1
Filter Size
Average of 2 middle samples
Average of 4 middle samples
Average of 8 middle samples
Average of 16 samples
Function
Median filter is disabled; output is the average of
A converted results
Output is the average of the middle A values from
the array of M measurements
Not possible because the median filter size is always
larger than the averaging window size
12-BIT SAR
ADC
MEDIAN
FILTER
AVERAGING
FILTER
CONVERTED
RESULTS
16 MEASUREMENTS
ARRANGED
AVERAGE OF
MIDDLE 8 VALUES
6
2
13
4
16
5
15
10
9
3
11
8
1
12
14
7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
M = 16
A=8
07667-027
MED0
0
1
0
1
The number specified with the MED1 and MED0 settings must
be greater than or equal to the number specified with the AVG1
and AVG0 settings. If both settings specify the same number,
the median filter is switched off.
The averaging window size in this example is 8. The output is
the average of the middle eight values of the 16 measurements
taken with the median filter.
Table 8. Median Filter Size
MED1
0
0
1
1
When both filter values are 00, only one measurement is
transferred to the register map.
Figure 27. Median and Averaging Filter Example
It takes approximately 2 μs to sort the data in the rank filter
(tSORT in Figure 33); tSORT adds to the update rate of the AD7879.
Rev. D | Page 17 of 40
AD7879/AD7889
Data Sheet
AUX/VBAT/GPIO PIN
The AUX/VBAT/GPIO pin on the AD7879/AD7889 can be
programmed as an auxiliary input to the ADC, as a battery
monitoring input or as a GPIO. To select the auxiliary
measurement, set the ADC channel address to 011 (Bits[14:12]
in Control Register 1, Address 0x01). To select a battery
measurement, set the ADC channel address to 010. To select the
GPIO function, set Bit 13 in Control Register 2 (Address 0x02) to 1.
AUXILIARY INPUT
The AD7879/AD7889 have an auxiliary analog input, AUX.
When the auxiliary input function is selected, the signal on the
AUX pin (AUX/VBAT/GPIO) is connected directly to the ADC
input. This channel has a full-scale input range from 0 V to VCC.
The ADC channel address for AUX is 011 (Bits[14:12] in
Control Register 1, Address 0x01), and the result is stored in the
AUX/VBAT result register (Address 0x0C).
BATTERY INPUT
The AD7879/AD7889 can monitor battery voltages from 0.5 V
to 5 V when the BAT measurement is selected. Figure 28 shows
a block diagram of a battery voltage monitored through the VBAT
pin. The voltage to the VCC pin (VCC/REF) of the AD7879/AD7889
is maintained at the desired supply voltage via the dc-to-dc
converter, and the input to the converter is monitored. This
voltage on VBAT is divided by 4 internally, so that a 5 V battery
voltage is presented to the ADC as 1.25 V. To conserve power,
the divider circuit is on only during the sampling of a voltage on
VBAT. Note that the possible maximum input is 5 V.
The ADC channel address for VBAT is 010 (Bits[14:12] in
Control Register 1, Address 0x01), and the result is stored in
the AUX/VBAT result register (Address 0x0C).
BATTERY
0.5V TO 5V
DC-TO-DC
CONVERTER
12kΩ
SW
0.125V TO 1.25V
The AUX measurement and the battery measurement can be
compared with high and low limits stored on chip. An out of
limit result generates an alarm output at the INT pin (PENIRQ/
INT/DAV) when the INT function is enabled. The high limit
for both channels is stored in the AUX/VBAT high limit register
(Address 0x04), and the low limit is stored in the AUX/VBAT
low limit register (Address 0x05).
After a measurement from either AUX or VBAT is taken, it
is compared with the high and low limits. The out of limit
comparison sets a status bit in Control Register 3. Separate
status bits for the high limit and the low limit indicate which
limit was exceeded. The interrupt sources can be masked by
clearing the corresponding enable bit in Control Register 3.
GPIO
The AD7879/AD7889 have one general-purpose logic input/output
pin, GPIO (AUX/VBAT/GPIO). To enable GPIO, set Bit 13 in
Control Register 2 to 1. If this bit is set to 0, the AUX/VBAT
function is active on the pin. If the GPIO is not enabled, the
other GPIO configuration bits have no effect.
The GPIO data bit is Bit 12 in Control Register 2.
Direction (Bit 11, Control Register 2, Address 0x02)
Bit 11 sets the direction of the GPIO pin (AUX/VBAT/GPIO).
When GPIO DIR = 0, the pin is an output. Setting or clearing
the GPIO data bit (Bit 12 in Control Register 2) outputs a value
on the GPIO pin.
When GPIO DIR = 1, the pin is an input. An input value on the
GPIO pin sets or clears the GPIO data bit (Bit 12 in Control
Register 2). GPIO data register bits are read-only when GPIO
DIR = 1.
Polarity (Bit 10, Control Register 2, Address 0x02)
VCC
VBAT
LIMIT COMPARISON
When GPIO POL = 0, the GPIO pin is active low. When GPIO
POL = 1, the GPIO pin is active high. How this bit affects the
GPIO operation also depends on the GPIO DIR bit.
ADC
4kΩ
07667-028
If GPIO POL = 1 and GPIO DIR = 1, a 1 at the input pin sets
the corresponding GPIO data register bit to 1. A 0 at the input
pin clears the corresponding GPIO data bit to 0.
Figure 28. Block Diagram of Battery Measurement Circuit
The maximum battery voltage that the AD7879/AD7889 can
measure changes when a different reference voltage is used. The
maximum voltage that is measurable is VCC × 4 because this
voltage gives a full-scale output from the ADC. Calculate the
battery voltage using the following formula:
VBAT (V) = ((Register Value) × VCC × 4)/4095
If GPIO POL = 1 and GPIO DIR = 0, a 1 in the GPIO data
register bit puts a 1 on the corresponding GPIO output pin. A 0
in the GPIO data register bit puts a 0 on the GPIO output pin.
If GPIO POL = 0 and GPIO DIR = 1, a 1 at the input pin sets
the corresponding GPIO data bit to 0. A 0 at the input pin clears
the corresponding GPIO data bit to 1.
If GPIO POL = 0 and GPIO DIR = 0, a 1 in the GPIO data
register bit puts a 0 on the corresponding GPIO output pin. A 0
in the GPIO data register bit puts a 1 on the GPIO output pin.
Rev. D | Page 18 of 40
Data Sheet
AD7879/AD7889
GPIO Interrupt Enable (Bit 12, Control Register 3,
Address 0x03)
The GPIO pin can operate as an interrupt source to trigger the
INT output. This is controlled by Bit 12 in Control Register 3.
INT is asserted if the GPIO data register bit is set when the
GPIO is configured as an input, provided that INT is enabled.
INT is triggered only when the GPIO is configured as an input,
that is, when GPIO DIR = 1.
If the GPIO ALERT interrupt enable bit is set to 0, the GPIO can
trigger INT. If this bit is set to 1, the GPIO cannot trigger INT.
INT is cleared only when the GPIO signal or the GPIO enable
bit changes.
Rev. D | Page 19 of 40
AD7879/AD7889
Data Sheet
CONVERSION TIMING
Conversion timing or update rate is the rate at which the
AD7879/AD7889 provides converted values from the ADC so
that the XY positions in the touch screen can be updated. In
other words, the update rate is the timing required to give valid
measurements in the sequencer.
Conversion time per channel depends on the number of
samples to be converted. The number of samples is programmed using the following median filter settings:
TCHANNEL = TMEASURE × MED
TCHANNEL_MIN =9.5 μs (ACQ = 2 μs, MED = 0)
Figure 29 shows conversion timing for a conversion sequence.
X+
Y+
Z1
VBAT/AUX
Z2
TCHANNEL_MAX = 376 μs (ACQ = 16 μs, MED = 16)
TEMP
Update Rate = (FCD + (TMEASURE × MED)) × N + FCD +
TMR
×M
×M
×M
×M
×M
07667-046
F
F
F
F
F
C TMEASURE C TMEASURE C TMEASURE C TMEASURE TMEASURE TMEASURE C
D
D
D
D
D
×M
Figure 29. Conversion Timing Sequence
FCD is required before each touch screen measurement (X+,
Y+, Z1, and Z2). This time is required to allow the screen inputs
to settle before converting. If the sequence does not contain any
screen channel (VBAT, AUX, or TEMP), only one FCD is added
at the start of the sequence. At the end of the sequence, there is
always another FCD.
TMEASURE is the time required to perform one measurement in
the conversion sequence.
TMEASURE = (ACQ (2 μs, 4 μs, 8 μs, 16 μs) + TCONV (7.5 μs) +
TSORT (2 μs))
where:
ACQ is the acquisition time which is programmable in Control
Register 1. For temperature measurements, ACQ is fixed at 16 μs.
TCONV (typical ADC conversion time) is specified at 7.5 μs.
TSORT is the time needed to sort the new sample within the
median filter array. The TSORT value is approximately 2 μs. If a
median filter is not used (MED =0), the TSORT value is 0.
where:
MED = median filter setting (1, 4, 8, 16).
N = number of channels to be measured (1 to 6).
TMR = timer setting (0 μs to 9.4 ms).
The total update rate depends on the median filter settings and
the number of channels in the conversion sequence. The timer
setting (TMR) allows the user more flexibility to program the
update rate.
For example, if
ACQ = 4 μs
MED = 8
N=2
FCD = 1.024 ms
TMR = 620 μs
TMEASURE = 4 + 7.5 + 2 = 13.5 μs
TCHANNEL = (13.5 × 8) = 108 μs
Then, Update Rate = (1024 + 108) × 2 + 1024 + 620 = 3.9 ms
TMEASURE_MIN = 9.5 μs (ACQ = 2 μs, no median filter)
Rev. D | Page 20 of 40
Data Sheet
AD7879/AD7889
REGISTER MAP
Table 11. Register Table
Address1
0x00
0x01
Register Name
Unused
Control Register 1
0x02
Control Register 2
0x03
Control Register 3
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
AUX/VBAT high limit
AUX/VBAT low limit
TEMP high limit
TEMP low limit
X+
Y+
X+ (Z1)
Y− (Z2)
AUX/VBAT
TEMP
Revision and device ID
1
Description
Unused
Pen interrupt enable, channel selection for manual
conversion, ADC mode, acquisition time, and
conversion timer
ADC power management, GPIO control, pen interrupt
mode, averaging, median filter, software reset, and FCD
Status of high/low limit comparisons for TEMP and
AUX/VBAT, and enable bits to allow them to become
interrupts; channel selection for slave/master mode
AUX/VBAT high limit for comparison
AUX/VBAT low limit for comparison
TEMP high limit for comparison
TEMP low limit for comparison
X+ measurement for Y position
Y+ measurement for X position
X+ measurement for touch pressure calculation (Z1)
Y− measurement for touch pressure calculation (Z2)
AUX/VBAT voltage measurement
Temperature conversion measurement
Revision and device ID
Do not write to addresses outside the register map.
Rev. D | Page 21 of 40
Default Value
0x0000
0x0000
Type
R/W
R/W
0x4040
R/W
0x0000
R/W
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
0x0379 (AD7879-1/AD7889-1)
0x037A (AD7879/AD7889)
R/W
R/W
R/W
R/W
R
R
R
R
R
R
R
R
AD7879/AD7889
Data Sheet
DETAILED REGISTER DESCRIPTIONS
All addresses and default values are expressed in hexadecimal.
Table 12. Control Register 1
Address
0x01
Bit Name
Disable PENIRQ
Data Bit
15
Description
Pen interrupt enable.
0 = PENIRQ is enabled.
1 = PENIRQ is disabled and INT is enabled.
CHNL ADD[2:0]
[14:12]
ADC channel address for manual conversion (ADC mode = 01).
111 = X+ input (Y position).
110 = Y+ input (X position).
101 = X+ (Z1) input for touch-pressure calculation.
100 = Y− (Z2) input (used for touch-pressure measurement).
011 = AUX input.1
010 = VBAT input.1
001 = temperature measurement.
000 = not applicable.
ADC MODE[1:0]
[11:10]
ADC mode.
00 = no conversion.
01 = single conversion.2
10 = conversion sequence (slave mode).2
11 = conversion sequence (master mode).
ACQ[1:0]
[9:8]
TMR[7:0]
[7:0]
ADC acquisition time.
00 = 4 clock periods (2 µs).
01 = 8 clock periods (4 µs).
10 = 16 clock periods (8 µs).
11 = 32 clock periods (16 µs).
Note that the acquisition time does not apply to the temperature sensor
channels; the temperature channel has a constant settling time of 16 µs.
Conversion interval timer.
Starts at 550 µs (00000001) and continues to 9.440 ms (11111111) in steps of
35 µs (see Table 18).
Note that, in slave mode, the conversion interval timer starts to count as soon
as the conversion sequence is finished; in master mode, it starts to count again
only if the screen remains touched. If the screen is released, the timer stops
counting and, on the next screen touch, a conversion starts immediately.
1
Default Value
0x0000
If GPIO is enabled in Control Register 2 (Bit 13), AUX and VBAT are both ignored. If AUX and VBAT are both selected in Control Register 3 and GPIO is disabled, AUX is
ignored and VBAT is measured.
2
Note that these bits are cleared to 00 at the end of the conversion sequence if the conversion interval timer bits in Control Register 1 (Address 0x01) Bits[7:0] = 0x00 at
the end of the conversion sequence.
Rev. D | Page 22 of 40
Data Sheet
AD7879/AD7889
Table 13. Control Register 2
Address
0x02
1
Bit Name
PM[1:0]
Data Bit
[15:14]
GPIO EN
13
GPIO DAT
GPIO DIR
12
11
GPIO POL
10
SER/DFR
9
AVG[1:0]
[8:7]
MED[1:0]
[6:5]
SW/RST
FCD[3:0]
4
[3:0]
Description
ADC power management.
00 = full shutdown; the ADC, oscillator, bias, and temperature sensor are all powered
down.
01 = analog blocks to be powered down depend on the ADC mode.
If ADC mode is master mode, the ADC, oscillator, bias, and temperature sensor are
powered down and must wake up when the user touches the screen.
If ADC mode is slave mode, the ADC and temperature sensor are powered down
when not being used. They wake up automatically when required. The oscillator and
bias are powered up because they are needed to measure time. This also applies to the
single-conversion mode.
10 = ADC, bias, and oscillator are powered up continuously, irrespective of ADC mode.
11 = same as 01.
GPIO enable.
0 = AUX/VBAT channel active.
1 = GPIO enabled on AUX/VBAT/GPIO pin.
GPIO data bit.
GPIO direction.
0 = output.
1 = input.
GPIO polarity.
0 = GPIO pin is active low.
1 = GPIO pin is active high.
Selects normal (single-ended) or ratiometric (differential) conversion.
0 = ratiometric (differential).
1 = normal (single-ended).
ADC averaging.
00 = 2 middle values averaged (one measurement when median filter is disabled).
01 = 4 middle values averaged.
10 = 8 middle values averaged.
11 = 16 values averaged.
Median filter size.
00 = median filter disabled.
01 = 4 measurements.
10 = 8 measurements.
11 = 16 measurements.
Software reset; digital logic is reset when this bit is set.
ADC first conversion delay.1
Starts at 128 µs (default) and continues to 4.096 ms in steps of 128 µs (see Table 22).
Default Value
0x4040
This delay occurs before conversion of the X and Y coordinate channels (including Z1 and Z2) to allow screen settling and before the first conversion to allow the ADC
to power up.
Rev. D | Page 23 of 40
AD7879/AD7889
Data Sheet
Table 14. Control Register 3
Address
0x03
1
Bit Name
TEMP MASK
Data Bit
15
Description
TEMP mask bit.
0 = temperature measurement is allowed to cause interrupt.
1 = temperature measurement is not allowed to cause interrupt.
AUX/VBAT mask bit.
0 = AUX/VBAT measurement is allowed to cause interrupt.
1 = AUX/VBAT measurement is not allowed to cause interrupt.
AUX/VBAT MASK
14
INT MODE
13
DAV/INT mode select.
0 = enable DAV mode.
1 = enable INT mode.
This bit overrides any mask bits associated with individual channels.
GPIO ALERT
12
GPIO interrupt enable.
0 = GPIO can cause an alert on the INT output.
1 = mask GPIO from causing an alert on the INT output.
AUX/VBAT LOW
11
1 = AUX/VBAT below low limit.
AUX/VBAT HIGH
10
1 = AUX/VBAT above high limit.
TEMP LOW
9
1 = TEMP below low limit.
TEMP HIGH
8
1 = TEMP above high limit.
X+
7
1 = include measurement of Y position (X+ input).
Y+
6
1 = include measurement of X position (Y+ input).
Z1
5
1 = include Z1 touch-pressure measurement (X+ input).
Z2
4
1 = include measurement of Z2 touch-pressure measurement (Y− input).
AUX
3
1 = include measurement of AUX channel.1
VBAT
2
1 = include measurement of battery monitor (VBAT).1
TEMP
1
1 = include temperature measurement.
Not used
0
Unused.
Default Value
0x0000
If GPIO is enabled in Control Register 2 (Bit 13), AUX and VBAT are both ignored. If AUX and VBAT are both selected and GPIO is disabled, AUX is ignored and VBAT is
measured.
Table 15. Limit Registers
Address
0x04
0x05
0x06
0x07
Register Name
AUX/VBAT high limit
AUX/VBAT low limit
TEMP high limit
TEMP low limit
Data Bit
[15:0]
[15:0]
[15:0]
[15:0]
Description
User-programmable AUX/VBAT high limit register
User-programmable AUX/VBAT low limit register
User-programmable TEMP high limit register
User-programmable TEMP low limit register
Rev. D | Page 24 of 40
Default Value
0x0000
0x0000
0x0000
0x0000
Data Sheet
AD7879/AD7889
Table 16. Measurement Result Registers (Read Only)
Address
0x08
0x09
0x0A
0x0B
0x0C
0x0D
Register Name
X+
Y+
X+ (Z1)
Y− (Z2)
AUX/VBAT
TEMP
Data Bits
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
[15:0]
Description
Measured X+ input with Y excitation (Y position)
Measured Y+ input with X excitation (X position)
Measured X+ input with X− and Y+ excitation (touch-pressure calculation Z1)
Measured Y− input with X− and Y+ excitation (touch-pressure calculation Z2)
AUX/VBAT voltage measurement
Temperature conversion measurement
Default Value
0x0000
0x0000
0x0000
0x0000
0x0000
0x0000
Table 17. Revision and Device ID Register (Read Only)
Address
0x0E
Data Bits
[15:12]
[11:8]
[7:0]
Description
Unused
Revision and device ID bits
Device ID
Rev. D | Page 25 of 40
Default Value
0x0379 (AD7879-1/AD7889-1)
0x037A (AD7879/AD7889)
AD7879/AD7889
Data Sheet
CONTROL REGISTERS
CONTROL REGISTER 1
Table 19. Acquisition Time Selection
Control Register 1 (Address 0x01) contains the ADC channel
address and the ADC mode bits. It sets the acquisition time and
the timer. It also contains a bit to disable the pen interrupt.
Control Register 1 must always be the last register programmed
prior to starting conversions. Its power-on default value is 0x0000.
To change any parameter after conversion has begun, the device
must first be put into ADC Mode 00. Make the changes, and
then reprogram Control Register 1, ensuring that it is always
the last register programmed before conversions begin.
ACQ1
0
0
1
1
Timer (Control Register 1, Bits[7:0])
The TMR bits in Control Register 1 set the conversion interval
timer, which enables the ADC to perform a conversion sequence at
regular intervals from 550 μs (00000001) up to 9.440 ms
(11111111) in increments of 35 μs (see Table 18). The default
value of these bits is 00000000, which enables the ADC to
perform one conversion only.
In slave mode, the timer starts as soon as the conversion sequence
is finished. In master mode, the timer starts at the end of a conversion sequence only if the screen remains touched. If the touch is
released at any stage, the timer stops. The next time that the
screen is touched, a conversion sequence begins immediately.
Table 18. Timer Selection
Conversion Interval
Convert one time only (default)
Every 550 μs
Every 585 μs
Every 620 μs
…
Every 9.370 ms
Every 9.405 ms
Every 9.440 ms
Acquisition Time
4 clock periods (2 μs)
8 clock periods (4 μs)
16 clock periods (8 μs)
32 clock periods (16 μs)
ADC Mode (Control Register 1, Bits[11:10])
The mode bits select the operating mode of the ADC. The
AD7879/AD7889 have three operating modes. These modes are
selected by writing to the mode bits in Control Register 1. If the
mode bits are set to 00, no conversion is performed.
Table 20. Mode Selection
ADC
MODE1
0
0
ADC
MODE0
0
1
1
1
0
1
Function
Do not convert (default)
Single-channel conversion; the device is
in slave mode
Sequence 0; the device is in slave mode
Sequence 1; the device is in master mode
If the mode bits are set to 01, a single conversion is performed
on the channel selected by writing to the channel bits of Control
Register 1 (Bits[14:12]). At the end of the conversion, if the TMR
bits in Control Register 1 are set to 00000000, the mode bits
revert to 00 and the ADC returns to no convert mode until a
new conversion is initiated by the host. Setting the TMR bits to
a value other than 00000000 causes the conversion to be repeated.
The AD7879/AD7889 can also be programmed to automatically
convert a sequence of selected channels. The two modes for this
type of conversion are slave mode and master mode.
Acquisition Time (Control Register 1, Bits[9:8])
The ACQ bits in Control Register 1 allow the selection of acquisition times for the ADC of 2 μs (default), 4 μs, 8 μs, or 16 μs. The
user can program the ADC with an acquisition time suitable for
the type of signal being sampled. For example, signals with large
RC time constants can require longer acquisition times.
For slave mode operation, the channels to be digitized are selected
by setting the corresponding bits in Control Register 3. Conversion
is initiated by writing 10 to the mode bits of Control Register 1.
The ADC then digitizes the selected channels and stores the results
in the corresponding result registers. At the end of the conversion,
if the TMR bits in Control Register 1 are set to 00000000, the
mode bits revert to 00 and the ADC returns to no convert mode
until a new conversion is initiated by the host. Setting the TMR
bits to a value other than 00000000 causes the conversion
sequence to be repeated.
15
0
DISABLE CHNL CHNL CHNL ADC
ADC
ACQ1 ACQ0 TMR7 TMR6 TMR5 TMR4 TMR3 TMR2 TMR1 TMR0
PENIRQ ADD2 ADD1 ADD0 MODE1 MODE0
Figure 30. Control Register 1
Rev. D | Page 26 of 40
07667-029
TMR[7:0]
00000000
00000001
00000010
00000011
…
11111101
11111110
11111111
ACQ0
0
1
0
1
Data Sheet
AD7879/AD7889
For master mode operation, the channels to be digitized are
written to Control Register 3. Master mode is then selected by
writing 11 to the mode bits in Control Register 1. In this mode,
the wake-up on touch feature is active; therefore, conversion
does not begin immediately. The AD7879/AD7889 wait until
the screen is touched before beginning the sequence of conversions.
The ADC then digitizes the selected channels, and the results are
written to the result registers. Before beginning another sequence
of conversions, the AD7879/AD7889 wait for the screen to be
touched again or for a timer event if the screen remains touched.
For sequential channel conversion, the channels to be converted
are selected by setting the bits corresponding to the channel
number in Control Register 3 for slave and master mode
sequencing.
ADC Channel (Control Register 1, Bits[14:12])
The AD7879/AD7889 have a dual function output that performs
as PENIRQ or INT, depending on the pen interrupt enable bit
(Bit 15 of Control Register 1). When this bit is set to 0, the pin
functions as a pen interrupt and goes low whenever the screen
is touched. When the pen interrupt enable bit is set to 1, the pen
interrupt request is disabled and the pin functions as an interrupt
when a measurement exceeds a preprogrammed limit (INT).
The ADC channel address is selected by Bits[14:12] of Control
Register 1 (CHNL ADD2 to CHNL ADD0). A complete list of
channel addresses is given in Table 21.
For single-channel conversion, the channel address is selected
by writing the appropriate code to the CHNL ADD2 to CHNL
ADD0 bits in Control Register 1.
For both single-channel and sequential conversion, a normal
conversion (single-ended) is selected by setting the SER/DFR bit in
Control Register 2 (Bit 9). Ratiometric (differential) conversion
is selected by clearing the SER/DFR bit.
PENIRQ Enable (Control Register 1, Bit 15)
Table 21. Codes for Selecting Input Channel and Normal or Ratiometric Conversion
Channel
0
1
2
3
4
5
6
7
8
9
12
13
14
15
SER/DFR
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
CHNL ADD[2:0]
111
110
101
100
011
010
001
000
111
110
101
100
011
010
001
000
Analog Input
X+ (Y position)
Y+ (X position)
X+ (Z1 touch pressure)
Y− (Z2 touch pressure)
AUX
VBAT
TEMP
X+ (Y position)
Y+ (X position)
X+ (Z1 touch pressure)
Y− (Z2 touch pressure)
AUX
VBAT
TEMP
X Switches
Y Switches
Off
On
On
Off
X+ off, X− on
Y+ on, Y− off
X+ off, X− on
Y+ on, Y− off
Off
Off
Off
Off
Off
Off
Invalid address
Off
On
On
Off
Off
Off
Off
Off
Off
Off
Off
Off
Off
Off
Invalid address
Rev. D | Page 27 of 40
REF+
Y+
X+
Y+
Y+
VCC
VCC
VCC
REF−
Y−
X−
X−
X−
GND
GND
GND
VCC
VCC
VCC
VCC
VCC
VCC
VCC
GND
GND
GND
GND
GND
GND
GND
AD7879/AD7889
Data Sheet
CONTROL REGISTER 2
Table 22. First Conversion Delay Selection
Control Register 2 (Address 0x02) contains the ADC
power management bits, the GPIO settings, the SER/DFR bit
(to choose the single-ended or differential method of touch
screen measurement), the averaging and median filter settings,
a bit that allows resetting of the device, and the first conversion
delay bits. Its power-on default value is 0x4040. See the Detailed
Register Descriptions section for more information about the
control registers.
FCD[3:0]
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
For information about the averaging and median filter settings,
see the Median and Averaging Filters section. For information
about the GPIO settings, see the GPIO section.
First Conversion Delay (Control Register 2, Bits[3:0])
The first conversion delay (FCD) bits in Control Register 2
program a delay from 128 μs (default) up to 4.096 ms before
the first conversion to allow the ADC time to power up. This
delay also occurs before conversion of the X and Y coordinate
channels to allow extra time for screen settling, and after the
last conversion in a sequence to precharge PENIRQ.
Delay
128 μs
256 μs
384 μs
512 μs
640 μs
768 μs
896 μs
1.024 ms
1.152 ms
1.280 ms
1.536 ms
1.792 ms
2.048 ms
2.560 ms
3.584 ms
4.096 ms
PM1
0
PM0
GPIO
EN
GPIO
DAT
GPIO
DIR
GPIO
POL
SER/
DFR
AVG1 AVG0 MED1 MED0
Figure 31. Control Register 2
Rev. D | Page 28 of 40
SW/
RST
FCD3
FCD2
FCD1 FCD0
07667-030
15
Data Sheet
AD7879/AD7889
Power Management (Control Register 2, Bits[15:14])
The power management (PM) bits in Control Register 2 allow the power management features of the ADC to be programmed (see Table 23).
If the PM bits are set to 00, the ADC is in full shutdown. This setting overrides any setting of the mode bits in Control Register 1. Power
management overrides the ADC modes.
Table 23. Power Management Selection
PM1
0
PM0
0
0
1
1
1
0
1
Function
Full shutdown; ADC, oscillator, bias, and temperature sensor are turned off. The only way to exit this
mode is to write to the device over the serial interface and change the PM bits. This setting overrides
any other setting on the device, including the ADC mode bits.
The analog blocks to be powered down depend on the ADC mode setting. In master mode, the ADC,
bias, temperature sensor, and oscillator are powered down and must wake up when the user touches
the screen. In slave mode, the ADC and temperature sensor are powered down when not being
used. They wake up automatically when required. The oscillator and bias are powered up because
they are needed to measure time. This setting also applies to the single-conversion mode.
The ADC, bias, and oscillator are powered up continuously, irrespective of ADC mode.
The analog blocks to be powered down depend on the ADC mode setting. In master mode, the ADC,
bias, temperature sensor, and oscillator are powered down and must wake up when the user touches
the screen. In slave mode, the ADC and temperature sensor are powered down when not being
used. They wake up automatically when required. The oscillator and bias are powered up because
they are needed to measure time. This setting also applies to the single-conversion mode.
Rev. D | Page 29 of 40
AD7879/AD7889
Data Sheet
CONTROL REGISTER 3
START OF
CONVERSION
SEQUENCE
Control Register 3 (Address 0x03) includes the interrupt
register (Bits[15:8]) and the sequencer bits (Bits[7:0]).
SET CHANNEL
YES
Sequencer (Control Register 3, Bits[7:0])
The sequencer bits control which channels are converted during
a conversion sequence in both slave mode and master mode.
WAIT FOR
ACQUISITION
ACQ
CONVERT DATA
YES
Figure 34 illustrates the correspondence between the bits in
Control Register 3 and the various measurements. Bit 0 is
not used.
SLAVE MODE
CONVERSION
SEQUENCE
TIMER = 00?
YES
MAV FILTER
ENABLED
?
NO
NO
00
MEDIAN
# OF SAMPLES
TAKEN? 1
11
10
YES
RANK NEW
DATA
(WAIT tSORT)
MASTER MODE
TRANSFER DATA
TO REGISTERS
AVERAGE DATA
WAIT FOR
FIRST TOUCH
SET ALERT AND
INTERRUPT
YES
OUT-OFLIMIT?
NO
CONVERSION
SEQUENCE
NO
SCREEN
TOUCHED?
START TIMER
END OF
SEQUENCE
?
NO
YES
1MEDIAN # MEANS MEDIAN
YES
WAIT FOR TIMER
TIMER = 00?
FCD
FILTER SIZE.
Figure 33. Conversion Sequence
YES
NO
START TIMER
WAIT FOR TIMER
YES
NO
07667-032
SCREEN
TOUCHED?
Figure 32. Conversion Modes
0
AUX/
AUX/ AUX/
TEMP TEMP
TEMP
INT
GPIO
VBAT
VBAT VBAT
LOW HIGH
MASK
MODE ALERT
MASK
LOW HIGH
X+
Y+
Figure 34. Control Register 3
Rev. D | Page 30 of 40
Z1
Z2
AUX
VBAT TEMP
NOT
USED
07667-031
15
NO
07667-033
01
SINGLE
CONVERSION
NO
FCD
To include a measurement in a sequence, the relevant bit must
be set in the sequence. Setting Bit 7 includes a measurement on
the X+ channel (Y position). Setting Bit 6 includes a measurement on the Y+ channel (X position), and so on (see Table 14).
IDLE
ADC MODE?
FCD
REQ’D?
Data Sheet
AD7879/AD7889
INTERRUPTS
PENIRQ—Pen Interrupt
The AD7879/AD7889 have a dual function interrupt output, INT,
as well as a pen-down interrupt, PENIRQ. The INT output can be
configured as a data available interrupt (DAV), as an out of limit
interrupt (INT), or as a GPIO interrupt.
The pen interrupt request output (PENIRQ) goes low whenever
the screen is touched and the PENIRQ enable bit is set to 0
(Control Register 1, Bit 15). When PENIRQ enable is set to 1,
the pen interrupt request output is disabled.
DAV—Data Available Interrupt
The pen interrupt equivalent output circuitry is shown in Figure 36.
This digital logic output has an internal 50 kΩ pull-up resistor,
so it does not need an external pull-up. The PENIRQ output
idles high, and the PENIRQ circuitry is always enabled in
master mode (ADC mode = 11), except during conversions.
tCONV
AD7879
STATUS
IDLE
SETUP
BY HOST
ADC
CONVERTING
NEW DATA HOST READS
IDLE
AVAILABLE
RESULTS
07667-034
DAV
Figure 35. Operation of DAV Output
When the on-board timer is programmed to perform automatic
conversions, limited time is available to the host to read the
result registers before another sequence of conversions begins.
The DAV signal is reset high when the timer expires, and the
host should not access the result registers while DAV is high.
50kΩ
PENIRQ
X+
X–
TOUCH
SCREEN
PENIRQ
ENABLE
Y–
Figure 36. PENIRQ Output Equivalent Circuit
When the screen is touched, PENIRQ goes low. This generates
an interrupt request to the host. When the screen touch ends,
PENIRQ immediately goes high if the ADC is idle. If the ADC
is converting, PENIRQ goes high when the ADC becomes idle.
The PENIRQ operation for these two conditions is shown in
Figure 37.
NOT
SCREEN TOUCHED
ADC
STATUS
TOUCHED
RELEASE NOT
DETECTED
PENIRQ
DETECTS
TOUCH
PENIRQ
Rev. D | Page 31 of 40
PENIRQ
DETECTS
RELEASE
ADC IDLE
NOT
SCREEN TOUCHED
ADC
STATUS
NOT
TOUCHED
TOUCHED
PENIRQ
DETECTS
TOUCH
PENIRQ
INT—Out of Limit Interrupt
The INT pin operates as an alarm or interrupt output when
Bit 13 in Control Register 3 (Address 0x03) is set to 1. The
output goes low if any one of the interrupt sources is asserted.
The results of high and low limit comparisons on the AUX,
VBAT, and TEMP channels are interrupt sources. An out of
limit comparison sets a status bit in the interrupt register. A
separate status bit for the high limit and the low limit on each
channel indicates which limit was exceeded. The interrupt
sources can be masked by setting the corresponding enable bit
in this register to 1. There is one enable bit per channel.
VCC
VCC
07667-035
While the ADC is idle or is converting, DAV is high. When the
ADC finishes converting and new data has been written to the
result registers, DAV goes low. Reading the result registers resets
DAV to a high condition. DAV is also reset if a new conversion
is started by the AD7879/AD7889 because the timer expired.
The host reads the result registers only when DAV is low. To ensure
correct operation of the DAV mode when using the SPI interface, it
is necessary to write 0x0000 to Register 0x81 after a set of
register reads. This write clears the internal data read signal.
Y+
ADC IDLE
NOT
TOUCHED
PENIRQ
DETECTS
RELEASE
ADC
CONVERTING
ADC IDLE
Figure 37. PENIRQ Operation for ADC Idle and ADC Converting
07667-036
The behavior of the interrupt output is controlled by Bit 13 in
Control Register 3. In default mode (Bit 13 = 0), INT operates
as a data available interrupt (DAV). When the AD7879/AD7889
finish a conversion or a conversion sequence, the interrupt is
asserted to let the host know that new ADC data is available in
the result registers.
AD7879/AD7889
Data Sheet
Bit 13 in Control Register 3. The host can then enter sleep mode
to conserve power. The wake-up on touch feature of the AD7879/
AD7889 is active in this mode; therefore, when the screen is
touched, the programmed sequence of conversions automatically
begins. When the INT or DAV signal is asserted, the host reads
the new data available in the AD7879/AD7889 result registers and
returns to sleep mode. This method can significantly reduce the
load on the host.
SYNCHRONIZING THE AD7879/AD7889 TO THE
HOST CPU
The two methods for synchronizing the AD7879/AD7889 to the
host CPU are slave mode (in which the mode bits are set to 01
or 10) and master mode (in which the mode bits set to 11).
In master mode (ADC mode bits = 11), PENIRQ can be used
as an interrupt to the host. When PENIRQ goes low to indicate
that the screen has been touched, the host is awakened. The host
can then program the AD7879/AD7889 to convert in any mode
and read the results after the conversions are completed.
Figure 38 shows how the PENIRQ circuit is enabled. The wake-up
on touch circuit and the PENIRQ circuit are enabled only in master
mode (ADC mode = 11). In slave mode, the PENIRQ/INT/DAV
pin can output only INT or DAV signals.
In master mode, INT or DAV can also be used as an interrupt to
the host. The host must first define a conversion sequence in
Control Register 3, initialize the AD7879/AD7889 in Mode 11,
and enable INT or DAV using Bit 15 in Control Register 1 and
ENABLE
PENIRQ
DETECTION
CIRCUIT
ADC MODE = 11?
MASTER MODE
YES
TOUCH SCREEN TOUCHED
DAV
(END OF CONVERSION SEQUENCE)
INT
(GPIO ALERT/OUT OF LIMITS)
ENABLE
WAKE-UP
ON TOUCH
TOUCH SCREEN TOUCHED
0
INT/DAV/GPIO ALERT
1
0
TO THE DIGITAL CORE
PENIRQ/INT/DAV PIN
1
CONTROL REGISTER 1
BIT 15
CONTROL REGISTER 3
BIT 13
Figure 38. Master Mode Operation
Rev. D | Page 32 of 40
07667-037
YES
Data Sheet
AD7879/AD7889
SERIAL INTERFACE
The AD7879 and AD7879-1 (AD7889 and AD7889-1) differ
only in the serial interface provided on the device. The AD7879
and the AD7889 are available with a serial peripheral interface
(SPI). The AD7879-1 and the AD7889-1 are available with an
I2C-compatible interface. It is recommended that addresses
outside the register map not be written to.
Bits[15:11] of the command word must be set to 11100 to
successfully begin a bus transaction.
Bit 10 is the read/write bit; 1 indicates a read, and 0 indicates
a write.
Bits[9:0] contain the target register address. When reading or
writing to more than one register, this address indicates the
address of the first register to be written to or read from.
SPI INTERFACE
The AD7879/AD7889 have a 4-wire SPI. The SPI has a data
input pin (DIN) for inputting data to the device, a data output pin
(DOUT) for reading data back from the device, and a data clock
pin (SCL) for clocking data into and out of the device. A chip
select pin (CS) enables or disables the serial interface. CS is
required for correct operation of the SPI interface. Data is
clocked out of the AD7879/AD7889 on the falling edge of SCL,
and data is clocked into the device on the rising edge of SCL.
Writing Data
SPI Command Word
Data is written to the AD7879/AD7889 in 16-bit words. The
first word written to the device is the command word, with the
read/write bit set to 0. The master then supplies the 16-bit input
data-word on the DIN line. The AD7879/AD7889 clock the data
into the register addressed in the command word. If there is more
than one word of data to be clocked in, the AD7879/AD7889
automatically increment the address pointer and clocks the next
data-word into the following register.
All data transactions on the SPI bus begin with the master taking
CS from high to low and sending out the command word. This
indicates to the AD7879/AD7889 whether the transaction is a
read or a write and gives the address of the register from which
to begin the data transfer. The bit map in Table 24 shows the
SPI command word.
The AD7879/AD7889 continue to clock in data on the DIN line
until the master ends the write transition by pulling CS high or
until the address pointer reaches its maximum value. The AD7879/
AD7889 address pointer does not wrap. When the address
pointer reaches its maximum value, any data provided by the
master on the DIN line is ignored by the AD7879/AD7889.
Table 24. SPI Command Word
LSB
14
1
13
1
12
0
11
0
10
R/W
[9:0]
Register address
16-BIT COMMAND WORD
ENABLE WORD
DIN
CW
15
CW
14
CW
13
CW
12
R/W
CW
11
t2
SCL
CW
10
CW
8
t4
1
t1
2
3
4
5
16-BIT DATA
REGISTER ADDRESS
CW
9
CW
7
CW
6
CW
5
CW
4
CW
3
CW
2
CW
1
CW
0
D15
D14
D13
D2
D1
D0
t5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
t3
30
31
32
t8
CS
NOTES
1. DATA BITS ARE LATCHED ON SCL RISING EDGES. SCL CAN IDLE HIGH OR LOW BETWEEN WRITE OPERATIONS.
2. ALL 32 BITS MUST BE WRITTEN: 16 BITS FOR THE COMMAND WORD AND 16 BITS FOR DATA.
3. 16-BIT COMMAND WORD SETTINGS FOR SINGLE WRITE OPERATION:
CW[15:11] = 11100 (ENABLE WORD)
CW[10] = 0 (R/W)
CW[9:0] = [AD9, AD8, AD7, AD6, AD5, AD4, AD3, AD2, AD1, AD0] (10-BIT MSB JUSTIFIED REGISTER ADDRESS)
Figure 39. Single Register Write, SPI Timing
Rev. D | Page 33 of 40
07667-038
MSB
15
1
AD7879/AD7889
Data Sheet
16-BIT COMMAND WORD
ENABLE WORD
DIN
SCL
CW
15
CW
14
1
2
R/W
CW
13
CW
12
CW
11
3
4
5
CW
10
DATA FOR STARTING
REGISTER ADDRESS
STARTING REGISTER ADDRESS
CW
9
6
CW
8
7
CW
7
8
CW
6
9
CW
5
CW
4
11
10
CW
3
12
CW
2
13
CW
1
14
CW
0
15
D15
16
D14
17
DATA FOR NEXT
REGISTER ADDRESS
D1
18
D0
31
32
D15
33
D1
D14
34
47
D0
D15
48
49
CS
07667-039
NOTES
1. MULTIPLE SEQUENTIAL REGISTERS CAN BE LOADED CONTINUOUSLY.
2. THE FIRST (LOWEST ADDRESS) REGISTER ADDRESS IS WRITTEN, FOLLOWED BY MULTIPLE 16-BIT DATA-WORDS.
3. THE ADDRESS AUTOMATICALLY INCREMENTS WITH EACH 16-BIT DATA-WORD (ALL 16 BITS MUST BE WRITTEN).
4. CS IS HELD LOW UNTIL THE LAST DESIRED REGISTER HAS BEEN LOADED.
5. 16-BIT COMMAND WORD SETTINGS FOR SEQUENTIAL WRITE OPERATION:
CW[15:11] = 11100 (ENABLE WORD)
CW[10] = 0 (R/W)
CW[9:0] = [AD9, AD8, AD7, AD6, AD5, AD4, AD3, AD2, AD1, AD0] (STARTING MSB JUSTIFIED REGISTER ADDRESS)
Figure 40. Sequential Register Write, SPI Timing
16-BIT COMMAND WORD
ENABLE WORD
DIN
CW
15
CW
14
CW
13
CW
12
R/W
CW
11
REGISTER ADDRESS
CW
9
CW
8
t4
t2
SCL
CW
10
1
2
t1
3
4
5
CW
7
CW
6
CW
5
CW
4
CW
3
CW
2
CW
1
CW
0
X
X
X
X
X
X
t5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
30
31
32
t8
t3
CS
t6
DOUT
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
D15
D14
t7
D13
D2
D1
D0
XXX
16-BIT READBACK DATA
07667-040
NOTES
1. DATA BITS ARE LATCHED ON SCL RISING EDGES. SCL CAN IDLE HIGH OR LOW BETWEEN WRITE OPERATIONS.
2. THE 16-BIT COMMAND WORD MUST BE WRITTEN ON DIN: 5 BITS FOR ENABLE WORD, 1 BIT FOR R/W, AND 10 BITS FOR REGISTER ADDRESS.
3. THE REGISTER DATA IS READ BACK ON THE DOUT PIN.
4. X DENOTES DON’T CARE.
5. XXX DENOTES HIGH IMPEDANCE THREE-STATE OUTPUT.
6. CS IS HELD LOW UNTIL ALL REGISTER BITS HAVE BEEN READ BACK.
7. 16-BIT COMMAND WORD SETTINGS FOR SINGLE READBACK OPERATION:
CW[15:11] = 11100 (ENABLE WORD)
CW[10] = 1 (R/W)
CW[9:0] = [AD9, AD8, AD7, AD6, AD5, AD4, AD3, AD2, AD1, AD0] (10-BIT MSB JUSTIFIED REGISTER ADDRESS)
Figure 41. Single Register Readback, SPI Timing
Reading Data
A read transaction begins when the master writes the command
word to the AD7879/AD7889 with the read/write bit set to 1. The
master then supplies 16 clock pulses per data-word to be read,
and the AD7879/AD7889 clock out data from the addressed
register on the DOUT line. The first data-word is clocked out
on the first falling edge of SCL following the command word,
as shown in Figure 41.
The AD7879/AD7889 continue to clock out data on the DOUT
line, provided that the master continues to supply the clock signal
on SCL. The read transaction ends when the master takes CS high.
If the AD7879/AD7889 address pointer reaches its maximum
value, the AD7879/AD7889 repeatedly clock out data from the
addressed register. The address pointer does not wrap.
Rev. D | Page 34 of 40
Data Sheet
AD7879/AD7889
16-BIT COMMAND WORD
ENABLE WORD
R/W
STARTING REGISTER ADDRESS
DIN
CW
15
CW
14
CW
13
CW
12
CW
11
CW
10
CW
9
CW
8
CW
7
SCL
1
2
3
4
5
6
7
8
9
CW
6
10
CW
5
11
CW
4
CW
3
12
13
CW
2
14
CW
1
15
CW
0
X
X
16
17
18
XXX XXX XXX
D15
D14
X
X
31
32
X
33
X
34
X
47
X
48
X
49
CS
XXX XXX XXX XXX XXX XXX XXX XXX XXX XXX
XXX XXX
XXX
D1
D0
READBACK DATA FOR
STARTING REGISTER
ADDRESS
D15
D14
D1
D0
D15
READBACK DATA FOR
NEXT REGISTER ADDRESS
NOTES
1. MULTIPLE SEQUENTIAL REGISTERS CAN BE READ BACK CONTINUOUSLY.
2. THE 16-BIT COMMAND WORD MUST BE WRITTEN ON DIN: 5 BITS FOR ENABLE WORD, 1 BIT FOR R/W, AND 10 BITS FOR REGISTER ADDRESS.
3. THE ADDRESS AUTOMATICALLY INCREMENTS WITH EACH 16-BIT DATA-WORD BEING READ BACK ON THE DOUT PIN.
4. CS IS HELD LOW UNTIL ALL REGISTER BITS HAVE BEEN READ BACK.
5. X DENOTES DON’T CARE.
6. XXX DENOTES HIGH IMPEDANCE THREE-STATE OUTPUT.
7. 16-BIT COMMAND WORD SETTINGS FOR SEQUENTIAL READBACK OPERATION:
CW[15:11] = 11100 (ENABLE WORD)
CW[10] = 1 (R/W)
CW[9:0] = [AD9, AD8, AD7, AD6, AD5, AD4, AD3, AD2, AD1, AD0] (STARTING MSB JUSTIFIED REGISTER ADDRESS)
07667-041
DOUT
Figure 42. Sequential Register Readback, SPI Timing
I2C-COMPATIBLE INTERFACE
The AD7879-1/AD7889-1 support the industry standard 2-wire
I2C serial interface protocol. The two wires associated with the
I2C timing are the SCL and SDA inputs. SDA is an input output
pin that allows both register write and register readback operations.
The AD7879-1/AD7889-1 are always a slave device on the I2C
serial interface bus.
The devices have a 7-bit device address, Address 0101 1XX. The
lower two bits are set by tying the ADD0 and ADD1 pins high or
low. The AD7879-1/AD7889-1 respond when the master device
sends the device address over the bus. The AD7879-1/AD7889-1
cannot initiate data transfers on the bus.
Table 25. I2C Device Addresses for the AD7879-1/AD7889-1
ADD1
0
0
1
1
ADD0
0
1
0
1
I2C Address
0101 100
0101 101
0101 110
0101 111
Data Transfer
Data is transferred over the I2C serial interface in 8-bit bytes.
The master initiates a data transfer by establishing a start condition,
defined as a high-to-low transition on the serial data line, SDA,
while the serial clock line, SCL, remains high. This indicates
that an address/data stream follows.
All slave peripherals connected to the serial bus respond to the
start condition and shift in the next eight bits, consisting of a
7-bit address (MSB first) plus a R/W bit that determines the
direction of the data transfer. The peripheral whose address
corresponds to the transmitted address responds by pulling the
data line low during the ninth clock pulse. This is known as the
acknowledge bit. All other devices on the bus then remain idle
while the selected device waits for data to be read from or written
to it. If the R/W bit is a 0, the master writes to the slave device.
If the R/W bit is a 1, the master reads from the slave device.
Data is sent over the serial bus in a sequence of nine clock
pulses (eight bits of data followed by an acknowledge bit from
the slave device). Transitions on the data line must occur during
the low period of the clock signal and remain stable during the
high period because a low-to-high transition when the clock
is high can be interpreted as a stop signal. The number of data
bytes transmitted over the serial bus in a single read or write
operation is limited only by what the master and slave devices
can handle.
When all data bytes are read or written, a stop condition is
established. A stop condition is defined by a low-to-high
transition on SDA while SCL remains high. If the AD7879-1/
AD7889-1 encounter a stop condition, they return to the idle
condition.
Rev. D | Page 35 of 40
AD7879/AD7889
Data Sheet
START
REGISTER ADDRESS[A7:A0]
AD7879-1/AD7889-1 DEVICE ADDRESS
SDA
DEV
A6
DEV
A5
DEV
A4
1
2
3
DEV DEV DEV
A2
A1
A3
DEV
A0
R/W
ACK
7
8
9
A7
A6
A1
A0
t3
t1
SCL
4
5
6
10
11
16
17
t2
ACK
D15
D14
D9
REGISTER DATA[D7:D0]
D8
ACK
D7
t4
18
19
20
25
26
D1
D6
D0
28
t6
29
34
35
36
AD7879-1/AD7889-1
DEVICE ADDRESS
DEV
A6
ACK
t5
27
START
t8
DEV
A5
DEV
A4
t7
37
1
2
NOTES
1. A START CONDITION AT THE BEGINNING IS DEFINED AS A HIGH-TO-LOW TRANSITION ON SDA WHILE SCL REMAINS HIGH.
2. A STOP CONDITION AT THE END IS DEFINED AS A LOW-TO-HIGH TRANSITION ON SDA WHILE SCL REMAINS HIGH.
3. 7-BIT DEVICE ADDRESS [DEV A6:DEV A0] = [01011XX], WHERE THE Xs ARE DON'T CARE BITS.
4. REGISTER DATA [D15:D8] AND REGISTER DATA [D7:D0] ARE ALWAYS SEPARATED BY A LOW ACK BIT.
3
07667-042
STOP
REGISTER DATA[D15:D8]
Figure 43. Example of I2C Timing for Single Register Write Operation
Writing Data over the I2C Bus
Reading Data over the I2C Bus
The process of writing to the AD7879-1/AD7889-1 over the I2C
bus is shown in Figure 43 and Figure 45. The device address is
sent over the bus followed by the R/W bit set to 0. This is followed
by one byte of data that contains the 8-bit address of the internal
data register to be written. The bit map in Table 26 shows the
register address byte.
To read from the AD7879-1/AD7889-1, the address pointer
register must first be set to the address of the required internal
register. The master performs a write transaction and writes to the
AD7879-1/AD7889-1 to set the address pointer. The master then
outputs a repeat start condition to keep control of the bus or, if
this is not possible, the master ends the write transaction with a
stop condition. A read transaction is initiated, with the R/W bit
set to 1.
Table 26. I2C Register Address Byte
MSB
7
6
Bit 7
Bit 6
5
4
3
2
Register Address
Bit 5
Bit 4
Bit 3
Bit 2
1
LSB
0
Bit 1
Bit 0
The third data byte contains the eight MSBs of the data to be
written to the internal register. The fourth data byte contains
the eight LSBs of data to be written to the internal register.
The AD7879-1/AD7889-1 address pointer register automatically
increments after each write. This allows the master to sequentially
write to all registers on the AD7879-1/AD7889-1 in the same
write transaction. However, the address pointer register does
not wrap after the last address.
The AD7879-1/AD7889-1 supply the upper eight bits of data
from the addressed register in the first readback byte, followed
by the lower eight bits in the next byte. This is shown in Figure 44
and Figure 45.
Because the address pointer automatically increments after each
read, the AD7879-1/AD7889-1 continue to output readback data
until the master puts a no acknowledge and a stop condition on
the bus. If the address pointer reaches its maximum value and the
master continues to read from the device, the AD7879-1/
AD7889-1 repeatedly send data from the last register addressed.
Any data written to the AD7879-1/AD7889-1 after the address
pointer has reached its maximum value is discarded.
All registers on the AD7879-1/AD7889-1 have 16 bits. Two
consecutive 8-bit data bytes are combined and written to the
16-bit registers. To avoid errors, all writes to the device must
contain an even number of data bytes.
To end the transaction, the master generates a stop condition on
SDA, or it generates a repeat start condition if the master is to
maintain control of the bus.
Rev. D | Page 36 of 40
Data Sheet
AD7879/AD7889
START
AD7879-1/AD7889-1
DEVICE ADDRESS
SDA
DEV
A6
DEV
A5
DEV
A4
REGISTER ADDRESS[A7:A0]
DEV DEV DEV
A3
A2
A1
DEV
A0
t1
R/W ACK
A7
A1
A6
A0
ACK
t3
SCL
1
2
3
4
5
6
7
8
9
10
11
17
16
18
t2
DEV
A6
USING
REPEATED
START
P
AD7879-1/AD7889-1
DEVICE ADDRESS
SR
DEV
A5
DEV
A1
REGISTER DATA[D7:D0]
DEV
A0
ACK
R/W
D7
20
19
P
25
21
DEV
A6
DEV
A5
20
ACK
t5
26
27
28
29
35
30
DEV
A0
25
21
37
36
R/W
D7
ACK
26
D1
D6
DEV
A6
DEV
A5
DEV
A4
1
2
3
t7
REGISTER DATA[D7:D0]
DEV
A1
t4
19
D0
t6
AD7879-1/AD7889-1
DEVICE ADDRESS
S
SEPARATE
READ AND
WRITE
TRANSACTIONS
D1
D6
t4
AD7879-1/AD7889-1
DEVICE ADDRESS
t8
P
D0
ACK
t5
27
28
29
35
30
36
37
07667-043
NOTES
1. A START CONDITION AT THE BEGINNING IS DEFINED AS A HIGH-TO-LOW TRANSITION ON SDA WHILE SCL REMAINS HIGH.
2. A STOP CONDITION AT THE END IS DEFINED AS A LOW-TO-HIGH TRANSITION ON SDA WHILE SCL REMAINS HIGH.
3. THE MASTER GENERATES THE ACK AT THE END OF THE READBACK TO SIGNAL THAT IT DOES NOT WANT ADDITIONAL DATA.
4. 7-BIT DEVICE ADDRESS [DEV A6:DEV A0] = [01011XX], WHERE THE TWO LSB Xs ARE DON'T CARE BITS.
5. REGISTER DATA [D15:D8] AND REGISTER DATA [D7:D0] ARE ALWAYS SEPARATED BY A LOW ACK BIT.
6. THE R/W BIT IS SET TO 1 TO INDICATE A READBACK OPERATION.
Figure 44. Example of I2C Timing for Single Register Readback Operation
WRITE DATA
LOW BYTE [7:0]
...
WRITE DATA
HIGH BYTE [15:8]
WRITE DATA
LOW BYTE [7:0]
ACK
WRITE DATA
HIGH BYTE [15:8]
ACK
REGISTER ADDR
[7:0]
ACK
7-BIT DEVICE
ADDRESS W
ACK
S
ACK
WRITE
P
READ DATA
LOW BYTE [7:0]
...
READ DATA
HIGH BYTE [15:8]
READ DATA
LOW BYTE [7:0]
ACK
READ DATA
HIGH BYTE [15:8]
ACK
7-BIT DEVICE
R
ADDRESS
ACK
REGISTER ADDR
[7:0]
ACK
7-BIT DEVICE
ADDRESS W
ACK
SR
S
ACK
READ (USING REPEATED START)
P
OUTPUT FROM
AD7879-1/AD7889-1
S = START BIT
P = STOP BIT
SR = REPEATED START BIT
R = READ BIT
READ DATA
HIGH BYTE [15:8]
READ DATA .
LOW BYTE [7:0]
READ DATA
. . HIGH
BYTE [15:8]
W = WRITE BIT
ACK = ACKNOWLEDGE BIT
ACK = NO ACKNOWLEDGE BIT
Figure 45. Example of Sequential I2C Write and Readback Operation
Rev. D | Page 37 of 40
READ DATA
LOW BYTE [7:0]
ACK
7-BIT DEVICE
R
ADDRESS
ACK
S
P
07667-044
OUTPUT FROM MASTER
P
ACK
REGISTER ADDR
[7:0]
ACK
7-BIT DEVICE
ADDRESS W
ACK
S
ACK
READ (WRITE TRANSACTION SETS UP REGISTER ADDRESS)
AD7879/AD7889
Data Sheet
GROUNDING AND LAYOUT
of at least 0.25 mm between the thermal pad and the inner
edges of the land pattern on the PCB. Thermal vias can be used
on the PCB thermal pad to improve the thermal performance of
the package. If vias are used, incorporate them into the thermal
pad at a 1.2 mm pitch grid. The via diameter should be between
0.3 mm and 0.33 mm, and the via barrel should be plated with
1 oz. of copper to plug the via.
For detailed information on grounding and layout considerations
for the AD7879/AD7889, refer to the AN-577 Application Note,
Layout and Grounding Recommendations for Touch Screen
Digitizers.
LEAD FRAME CHIP SCALE PACKAGES
The lands on the lead frame chip scale package (CP-16-20) are
rectangular. The printed circuit board (PCB) pad for these lands
should be 0.1 mm longer than the package land length and
0.05 mm wider than the package land width. Center the land
on the pad to maximize the solder joint size.
Connect the PCB thermal pad to GND.
WLCSP ASSEMBLY CONSIDERATIONS
For detailed information on the WLCSP PCB assembly and
reliability, see the AN-617 Application Note, Wafer Level Chip
Scale Package.
The bottom of the lead frame chip scale package has a central
thermal pad. The thermal pad on the PCB should be at least as
large as this exposed pad. To avoid shorting, provide a clearance
0.1µF
X–
DOUT
5
6
7
11
SCLK
10
MISO
9
MOSI
SPI
INTERFACE
INT
8
NIC = NO INTERNAL CONNECTION
Figure 46. Typical Application Circuit
Rev. D | Page 38 of 40
07667-045
TOUCH
SCREEN
NIC
NIC
NIC
Y–
4
AD7879/AD7889
12
SCL
3
NIC
HOST
CS
PENIRQ/INT/DAV
GND
2
Y+
DIN
1
MAIN
BATTERY
13
14
CS
X+
VCC/REF
15
AUX/
VBAT/
GPIO
16
0.1µF TO 10µF
(OPTIONAL)
VOLTAGE
REGULATOR
Data Sheet
AD7879/AD7889
OUTLINE DIMENSIONS
1.670
1.610
1.550
BOTTOM VIEW
(BALL SIDE UP)
3
2
1
A
BALL A1
IDENTIFIER
2.070
2.010
1.950
1.50
REF
B
C
D
0.50
BSC
TOP VIEW
0.17
0.15
0.13
(BALL SIDE DOWN)
0.650
0.590
0.530
0.370
0.350
0.330
END VIEW
1.00
REF
COPLANARITY
0.10
0.360
0.320
0.280
0.280
0.240
0.220
09-06-2012-A
SEATING
PLANE
Figure 47. 12-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-12-1)
Dimensions shown in millimeters
1.555
1.505
1.455
BOTTOM VIEW
(BALL SIDE UP)
3
1
A
BALL A1
IDENTIFIER
2.055
2.005
1.955
1.50
REF
B
C
D
0.50
BSC
TOP VIEW
(BALL SIDE DOWN)
0.650
0.595
0.540
2
0.380
0.355
0.330
END VIEW
1.00
REF
SEATING
PLANE
0.340
0.320
0.300
0.270
0.240
0.210
Figure 48. 12-Ball, Backside-Coated Wafer Level Chip Scale Package [WLCSP]
(CB-12-5)
Dimensions shown in millimeters
Rev. D | Page 39 of 40
09-07-2012-A
COPLANARITY
0.10
AD7879/AD7889
Data Sheet
4.10
4.00 SQ
3.90
PIN 1
INDICATOR
0.35
0.30
0.25
0.65
BSC
PIN 1
INDICATOR
16
13
1
12
*2.40
EXPOSED
PAD
2.35 SQ
2.30
9
0.80
0.75
0.70
4
5
8
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
PKG-000000
SEATING
PLANE
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
*COMPLIANT TO JEDEC STANDARDS MO-220-WGGC-3
WITH EXCEPTION TO THE EXPOSED PAD.
07-21-2015-B
TOP VIEW
0.50
0.40
0.30
Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm and 0.75 mm Package Height
(CP-16-20)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD7879ACBZ-RL
AD7879ACBZ-500R7
AD7879ACPZ-RL
AD7879ACPZ-500R7
AD7879-1ACBZ-RL
AD7879-1ACBZ-500R7
AD7879-1ACPZ-RL
AD7879-1ACPZ-500R7
AD7889ACBZ-RL
EVAL-AD7879EBZ
EVAL-AD7879-1EBZ
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Serial Interface Description
SPI Interface
SPI Interface
SPI Interface
SPI Interface
I2C Interface
I2C Interface
I2C Interface
I2C Interface
SPI Interface
SPI Interface
I2C Interface
Package Description
12-Ball WLCSP
12-Ball WLCSP
16-Lead LFCSP
16-Lead LFCSP
12-Ball WLCSP
12-Ball WLCSP
16-Lead LFCSP
16-Lead LFCSP
12-Ball, Backside-Coated WLCSP
Evaluation Board
Evaluation Board
Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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registered trademarks are the property of their respective owners.
D07667-0-8/16(D)
Rev. D | Page 40 of 40
Package
Option
CB-12-1
CB-12-1
CP-16-20
CP-16-20
CB-12-1
CB-12-1
CP-16-20
CP-16-20
CB-12-5
Branding
T2Y
T2Y
T0Q
T0Q
T3R