19-2878; Rev 0; 7/03 2:1 Multiplexers and 1:2 Demultiplexers with Loopback Ultra low 91psP-P (max) pseudorandom bit sequence (PRBS) jitter ensures reliable communications in highspeed links that are highly sensitive to timing error, especially those incorporating clock-and-data recovery, or serializers and deserializers. The high-speed switching performance guarantees 1.5GHz operation and less than 87ps (max) skew between channels. LVDS inputs and outputs are compatible with the TIA/EIA-644 LVDS standard. The LVDS outputs drive 100Ω loads. The MAX9394/MAX9395 are offered in 32pin TQFP and 28-pin thin QFN packages and operate over the extended temperature range (-40°C to +85°C). Features ♦ Guaranteed 1.5GHz Operation with 250mV Differential Output Swing ♦ Simultaneous Loopback Control ♦ 2ps(RMS) (max) Random Jitter ♦ AC Specifications Guaranteed for 150mV Differential Input ♦ Signal Inputs Accept Any Differential Signaling Standard ♦ LVDS Outputs for Clock or High-Speed Data ♦ High-Level Input Fail-Safe Detection (MAX9394) ♦ Low-Level Input Fail-Safe Detection (MAX9395) ♦ +3.0V to +3.6V Supply Voltage Range ♦ LVCMOS/LVTTL Logic Inputs Ordering Information PART MAX9394EHJ MAX9394ETI* MAX9395EHJ MAX9395ETI* TEMP RANGE -40°C to +85°C -40°C to +85°C -40°C to +85°C -40°C to +85°C *Future product—contact factory for availability. Typical Operating Circuit +3.0V TO +3.6V 0.1µF 0.01µF Z0 = 50Ω INA VCC OUTA0 Z0 = 50Ω OUTA0 Z0 = 50Ω OUTA1 Z0 = 50Ω OUTA1 Z0 = 50Ω OUTB Z0 = 50Ω OUTB Z0 = 50Ω 100Ω 100Ω Z0 = 50Ω Applications MAX9394 MAX9395 INA INB0 LVDS RECEIVER INB0 High-Speed Telecom/Datacom Equipment INB1 Central Office Backplane Clock Distribution INB1 DSLAM ENA0 ENA1 Protection Switching Fault-Tolerant Systems PIN-PACKAGE 32 TQFP 28 Thin QFN 32 TQFP 28 Thin QFN ENB LVCMOS/LVTTL LOGIC INPUTS LB_SELA LB_SELB BSEL GND GND GND GND Pin Configurations and Functional Diagram appear at end of data sheet. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX9394/MAX9395 General Description The MAX9394/MAX9395 consist of a 2:1 multiplexer and a 1:2 demultiplexer with loopback. The multiplexer section (channel B) accepts two low-voltage differential signaling (LVDS) inputs and generates a single LVDS output. The demultiplexer section (channel A) accepts a single LVDS input and generates two parallel LVDS outputs. The MAX9394/MAX9395 feature a loopback mode that connects the input of channel A to the output of channel B and connects the selected input of channel B to the outputs of channel A. Three LVCMOS/LVTTL logic inputs control the internal connections between inputs and outputs, one for the multiplexer portion of channel B (BSEL), and the other two for loopback control of channels A and B (LB_SELA and LB_SELB). Independent enable inputs for each differential output pair provide additional flexibility. Fail-safe circuitry forces the outputs to a differential low condition for undriven inputs or when the commonmode voltage exceeds the specified range. The MAX9394 provides high-level input fail-safe detection for HSTL, LVDS, and other GND-referenced differential inputs. The MAX9395 provides low-level fail-safe detection for CML, LVPECL, and other VCC-referenced differential inputs. MAX9394/MAX9395 2:1 Multiplexers and 1:2 Demultiplexers with Loopback ABSOLUTE MAXIMUM RATINGS VCC to GND ...........................................................-0.3V to +4.1V IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _, _SEL, LB_SEL_ to GND........................................................-0.3V to (VCC + 0.3V) IN_ _ to IN_ _..........................................................................±3V Short-Circuit Duration (OUT_ _, OUT_ _) ...................Continuous Continuous Power Dissipation (TA = +70°C) 32-Pin TQFP (derate 13.1mW/°C above +70°C)........1047mW 28-Pin 5mm x 5mm Thin QFN (derate 20.8mW/°C above +70°C) .............................1667mW Junction-to-Ambient Thermal Resistance in Still Air 32-Pin TQFP............................................................+76.4°C/W 28-Pin 5mm x 5mm Thin QFN....................................+48°C/W Junction-to-Case Thermal Resistance 28-Pin 5mm x 5mm Thin QFN......................................+2°C/W Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C ESD Protection (Human Body Model) (IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _, SEL_, LB_SEL_) ..±2kV Soldering Temperature (10s) ...........................................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (VCC = +3.0V to +3.6V, RL = 100Ω ±1%, EN_ _ = VCC, VCM = +0.05V to (VCC - 0.6V) (MAX9394), VCM = +0.06V to (VCC - 0.05V) (MAX9395), TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, |VID| = 0.2V, VCM = +1.2V, TA = +25°C.) (Notes 1, 2, and 3) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS LVCMOS/LVTTL INPUTS (EN_ _, BSEL, LB_SEL_) Input High Voltage VIH 2.0 VCC V Input Low Voltage VIL 0 0.8 V Input High Current IIH VIN = +2.0V to VCC 0 20 µA Input Low Current IIL VIN = 0V to +0.8V 0 10 µA VID VILD > 0V and VIHD < VCC, Figure 1 3.0 V DIFFERENTIAL INPUTS (IN_ _, IN_ _) Differential Input Voltage Input Common-Mode Range Input Current 0.1 IIN_ _, IIN_ _ MAX9394 |VID| < 3.0V -75 VCC 0.6 VCC 0.05 10 MAX9395 |VID| < 3.0V -10 100 VOD RL = 100Ω, Figure 2 MAX9394 0.05 MAX9395 0.6 VCM V µA LVDS OUTPUTS (OUT_ _, OUT_ _) Differential Output Voltage Change in Magnitude of VOD Between Complementary Output States Offset Common-Mode Voltage Change in Magnitude of VOS Between Complementary Output States 2 ∆VOD Figure 2 VOS Figure 2 ∆VOS Figure 2 250 1.125 350 450 mV 1.0 50 mV 1.25 1.375 V 1.0 50 mV _______________________________________________________________________________________ 2:1 Multiplexers and 1:2 Demultiplexers with Loopback (VCC = +3.0V to +3.6V, RL = 100Ω ±1%, EN_ _ = VCC, VCM = +0.05V to (VCC - 0.6V) (MAX9394), VCM = +0.06V to (VCC - 0.05V) (MAX9395), TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, |VID| = 0.2V, VCM = +1.2V, TA = +25°C.) (Notes 1, 2, and 3) PARAMETER SYMBOL Output Short-Circuit Current (Output(s) Shorted to GND) |IOS| Output Short-Circuit Current (Outputs Shorted Together) |IOSB| CONDITIONS TYP MAX VOUT_ _ or V OUT_ _ = 0V 30 40 VOUT_ _ = V OUT_ _ = 0V 17 24 VID = ±100mV, VOUT_ _ = V OUT_ _ (Note 4) 5 12 RL = 100Ω, EN_ _ = VCC 53 65 RL = 100Ω, EN_ _ = VCC, switching at 670MHz (1.34Gbps) 53 65 VID = ±100mV (Note 4) MIN UNITS mA mA SUPPLY CURRENT Supply Current ICC mA AC ELECTRICAL CHARACTERISTICS (VCC = +3.0V to +3.6V, fIN < 1.34GHz, tR_IN = tF_IN = 125ps, RL = 100Ω ±1%, |VID| ≥ 150mV, VCM = +0.075V to (VCC - 0.6V) (MAX9394 only), VCM = +0.6V to (VCC - 0.075V) (MAX9395 only), EN_ _ = VCC, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, |VID| = 0.2V, VCM = +1.2V, fIN = 1.34GHz, TA = +25°C.) (Note 5) PARAMETER SYMBOL MAX UNITS SEL to Switched Output tSWITCH Figure 3 1.1 ns Disable Time to Differential Output Low tPHD Figure 4 1.7 ns Enable Time to Differential Output High tPDH Figure 4 1.7 ns Switching Frequency fMAX VOD > 250mV 1.5 2.2 Low-to-High Propagation Delay tPLH Figures 1, 5 340 567 720 ps High-to-Low Propagation Delay tPHL Figures 1, 5 340 562 720 ps 12.4 86 ps 16 87 ps Pulse Skew |tPLH – tPHL| Output Channel-to-Channel Skew tSKEW tCCS CONDITIONS MIN Figures 1, 5 (Note 6) Figure 6 (Note 7) TYP GHz Output Low-to-High Transition Time (20% to 80%) tR fIN_ _ = 100MHz, Figures 1, 5 112 154 187 ps Output High-to-Low Transition Time (80% to 20%) tF fIN_ _ = 100MHz, Figures 1, 5 112 152 187 ps Added Random Jitter tRJ fIN_ _ = 1.34GHz, clock pattern (Note 8) 2 ps(RMS) 91 psP-P Added Deterministic Jitter tDJ 23 1.34Gbps, 2 - 1 PRBS (Note 8) 60 Measurements obtained with the device in thermal equilibrium. All voltages referenced to GND except VID, VOD, and ∆VOD. Current into the device defined as positive. Current out of the device defined as negative. DC parameters production tested at TA = +25°C and guaranteed by design and characterization for TA = -40°C to +85°C. Current through either output. Guaranteed by design and characterization. Limits set at ±6 sigma. tSKEW is the magnitude difference of differential propagation delays for the same output over the same condtions. tSKEW = |tPHL - tPLH|. Note 7: Measured between outputs of the same device at the signal crossing points for a same-edge transition under the same conditions. Does not apply to loopback mode. Note 8: Device jitter added to the differential input signal. Note 1: Note 2: Note 3: Note 4: Note 5: Note 6: _______________________________________________________________________________________ 3 MAX9394/MAX9395 DC ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (VCC = +3.3V, |VID| = 0.2V, VCM = +1.2V, TA = +25°C, fIN = 1.34GHz, Figure 5.) 55 50 VCC = +3.3V VCC = +3.0V 40 35 250 200 150 -15 10 35 60 tR 150 tF 140 130 120 85 0 0.4 0.8 1.2 1.6 -40 2.4 2.0 -15 10 35 60 85 TEMPERATURE (°C) FREQUENCY (GHz) TEMPERATURE (°C) PROPAGATION DELAY vs. TEMPERATURE MAX9394 DIFFERENTIAL INPUT CURRENT vs. TEMPERATURE MAX9395 DIFFERENTIAL INPUT CURRENT vs. TEMPERATURE INPUT CURRENT (µA) 570 560 550 540 530 520 510 VIN_ _ = 0V 80 VIN_ _ = 3.0V VIN_ _ = VCC 70 -10 -15 -20 -25 -30 -35 -40 VIN_ _ = 0.1V -15 10 35 60 85 30 VIN_ _ = (VCC - 3.0V) -15 10 35 85 60 -40 -15 TEMPERATURE (°C) IN_ _ OR IN_ _ = GND VCC = +3V -15 -20 VCC = +3.6V -25 80 IN_ _ OR IN_ _ = VCC 70 60 50 VCC = +3.6V 40 30 VCC = +3V 20 -30 10 -35 0 -40 35 MAX9395 DIFFERENTIAL INPUT CURRENT vs. VILD INPUT CURRENT (µA) -5 10 TEMPERATURE (°C) MAX9394/95 toc07 5 INPUT CURRENT (µA) 40 0 -40 MAX9394 DIFFERENTIAL INPUT CURRENT vs. VIHD -10 50 10 TEMPERATURE (°C) 0 VIN_ _ = (VCC - 0.1V) 60 20 -45 -50 500 MAX9394/95 toc06 580 10 5 0 -5 INPUT CURRENT (µA) 590 MAX9394/95 toc05 MAX9394/95 toc04 600 -40 160 100 0 -40 -10 0 0.6 1.2 1.8 VIHD (V) 4 170 50 30 fIN = 100MHz MAX9394/95 toc08 45 300 RISE/FALL TIME (ps) VCC = +3.6V 180 MAX9394/95 toc02 60 350 OUTPUT AMPLITUDE (mV) 65 SUPPLY CURRENT (mA) 400 MAX9394/95 toc01 70 OUTPUT RISE/FALL TIME vs. TEMPERATURE OUTPUT AMPLITUDE vs. FREQUENCY MAX9394/95 toc03 SUPPLY CURRENT vs. TEMPERATURE PROPAGATION DELAY (ps) MAX9394/MAX9395 2:1 Multiplexers and 1:2 Demultiplexers with Loopback 2.4 3.0 3.6 0 0.6 1.2 1.8 2.4 3.0 VILD (V) _______________________________________________________________________________________ 3.6 60 85 2:1 Multiplexers and 1:2 Demultiplexers with Loopback PIN NAME FUNCTION TQFP QFN 1, 2, 3, 30, 31, 32 1, 2, 28 N.C. No Connection. Not internally connected. 4, 9, 20, 25 3, 8, 18, 23 GND Ground 5 4 ENB Channel B Output Enable. Drive ENB high to enable the LVDS outputs for channel B. An internal 435kΩ resistor to GND pulls ENB low when unconnected. 6 5 OUTB Channel B LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTB and OUTB at the receiver inputs to ensure proper operation. 7 6 OUTB Channel B LVDS Inverting Output. Connect a 100Ω termination resistor between OUTB and OUTB at the receiver inputs to ensure proper operation. 8, 13, 24, 29 7, 22, 27 VCC Power-Supply Input. Bypass each VCC to GND with a 0.1µF and 0.01µF ceramic capacitor. Install both bypass capacitors as close to the device as possible, with the 0.01µF capacitor closest to the device. 10 9 INB0 LVDS/HSTL (MAX9394) or LVPECL/CML (MAX9395) Inverting Input. An internal 128kΩ pullup resistor to VCC pulls the input high when unconnected (MAX9394). An internal 68kΩ resistor to GND pulls the input low when unconnected (MAX9395). 11 10 INB0 LVDS/HSTL (MAX9394) or LVPECL/CML (MAX9395) Noninverting Input. An internal 128kΩ pullup resistor to VCC pulls the input high when unconnected (MAX9394). An internal 68kΩ resistor to GND pulls the input low when unconnected (MAX9395). 12 11 LB_SELB Loopback Select for Channel B Output. Connect LB_SELB to GND or leave unconnected to reproduce the INB_ (INB_) differential inputs at OUTB (OUTB). Connect LB_SELB to VCC to loop back the INA (INA) differential inputs to OUTB (OUTB). An internal 435kΩ resistor to GND pulls LB_SELB low when unconnected. 14 12 INB1 LVDS/HSTL (MAX9394) or LVPECL/CML (MAX9395) Inverting Input. An internal 128kΩ pullup resistor to VCC pulls the input high when unconnected (MAX9394). An internal 68kΩ resistor to GND pulls the input low when unconnected (MAX9395). 15 13 INB1 LVDS/HSTL (MAX9394) or LVPECL/CML (MAX9395) Noninverting Input. An internal 128kΩ pullup resistor to VCC pulls the input high when unconnected (MAX9394). An internal 68kΩ resistor to GND pulls the input low when unconnected (MAX9395). 16 14 BSEL Channel B Multiplexer Control Input. Selects the differential input to reproduce at the B channel differential output. Connect BSEL to GND or leave unconnected to select the INB0 (INB0) set of inputs. Connect BSEL to VCC to select the INB1 (INB1) set of inputs. An internal 435kΩ resistor to GND pulls BSEL low when unconnected. 17 15 ENA1 Channel A1 Output Enable. Drive ENA1 high to enable the A1 LVDS outputs. An internal 435kΩ resistor to GND pulls the ENA1 low when unconnected. 18 16 OUTA1 Channel A1 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTA1 and OUTA1 at the receiver inputs to ensure proper operation. 19 17 OUTA1 Channel A1 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTA1 and OUTA1 at the receiver inputs to ensure proper operation. _______________________________________________________________________________________ 5 MAX9394/MAX9395 Pin Description 2:1 Multiplexers and 1:2 Demultiplexers with Loopback MAX9394/MAX9395 Pin Description (continued) PIN NAME FUNCTION TQFP QFN 21 19 ENA0 22 20 OUTA0 Channel A0 LVDS Inverting Output. Connect a 100Ω termination resistor between OUTA0 and OUTA0 at the receiver inputs to ensure proper operation. 23 21 OUTA0 Channel A0 LVDS Noninverting Output. Connect a 100Ω termination resistor between OUTA0 and OUTA0 at the receiver inputs to ensure proper operation. 26 24 INA LVDS/HSTL (MAX9394) or LVPECL/CML (MAX9395) Noninverting Input. An internal 128kΩ pullup resistor to VCC pulls the input high when unconnected (MAX9394). An internal 68kΩ resistor to GND pulls the input low when unconnected (MAX9395). 27 25 INA LVDS/HSTL (MAX9394) or LVPECL/CML (MAX9395) Inverting Input. An internal 128kΩ pullup resistor to VCC pulls the input high when unconnected (MAX9394). An internal 68kΩ resistor to GND pulls the input low when unconnected (MAX9395). Loopback Select for Channel A Output. Connect LB_SELA to GND or leave unconnected to reproduce the INA (INA) differential inputs at OUTA_ (OUTA_). Connect LB_SELA to VCC to loop back the INB_ (INB_) differential inputs to OUTA_ (OUTA_). An internal 435kΩ resistor to GND pulls LB_SELA low when unconnected. 28 26 LB_SELA — — EP Channel A0 Output Enable. Drive ENA0 high to enable the A0 LVDS outputs. An internal 435kΩ resistor to GND pulls ENA0 low when unconnected. Exposed Paddle. Connect to GND for optimal thermal and EMI characteristics. Detailed Description The LVDS interface standard provides a signaling method for point-to-point communication over a controlled-impedance medium as defined by the ANSI TIA/EIA-644 standard. LVDS utilizes a lower voltage swing than other communication standards, achieving higher data rates with reduced power consumption, while reducing EMI emissions and system susceptibility to noise. The MAX9394/MAX9395 high-speed, low-power 2:1 multiplexers and 1:2 demultiplexers with loopback provide signal redundancy switching in telecom and storage applications. These devices select one of two remote signal sources for local input and buffer a single local output signal to two remote receivers. The multiplexer section (channel B) accepts two differential inputs and generates a single LVDS output. The demultiplexer section (channel A) accepts a single differential input and generates two parallel LVDS outputs. The MAX9394/MAX9395 feature a loopback mode that connects the input of channel A to the output of channel B and connects the selected input of channel B to the outputs of channel A. LB_SELA and LB_SELB provide independent loopback control for each channel. 6 Three LVCMOS/LVTTL logic inputs control the internal connections between inputs and outputs, one for the multiplexer portion of channel B (BSEL), and the other two for loopback control of channels A and B (LB_SELA and LB_SELB). Independent enable inputs for each differential output pair provide additional flexibility. Input Fail-Safe The differential inputs of the MAX9394/MAX9395 possess internal fail-safe protection. Fail-safe circuitry forces the outputs to a differential-low condition for undriven inputs or when the common-mode voltage exceeds the specified range. The MAX9394 provides high-level input fail-safe detection for LVDS, HSTL, and other GND-referenced differential inputs. The MAX9395 provides low-level input fail-safe detection for LVPECL, CML, and other VCC-referenced differential inputs. Select Function BSEL selects the differential input pair to transmit through OUTB (OUTB) for LB_SELB = GND or through OUTA_ (OUTA_) for LB_SELA = VCC. LB_SEL_ controls the loopback function for each channel. Connect LB_SEL_ to GND to select the normal inputs for each channel. Connect LB_SEL_ to VCC to enable the loop- _______________________________________________________________________________________ 2:1 Multiplexers and 1:2 Demultiplexers with Loopback VIN_ _ VIHD VID = 0V tPLH tPHL VILD Enable Function The EN_ _ logic inputs enable and disable each set of differential outputs. Connect EN_ 0 to VCC to enable the OUT_0/OUT_0 differential output pair. Connect EN_0 to GND to disable the OUT_0/OUT_0 differential output pair. The differential output pairs assert to a differential low condition when disabled. VID = 0V VIN_ _ VOUT_ _ VOD = 0V 80% Applications Information Differential Inputs The MAX9394/MAX9395 inputs accept any differential signaling standard within the specified common-mode voltage range. The fail-safe feature detects commonmode input signal levels and generates a differential output low condition for undriven inputs or when the common-mode voltage exceeds the specified range (VCM ≥ VCC - 0.6V, MAX9394; VCM ≤ 0.6V, MAX9395). Leave unused inputs unconnected or connect to VCC for the MAX9394 or to GND for the MAX9395. VOD = 0V VOUT_ _ VOD = 0V 50% 80% VOD = 0V 50% 20% 20% tR tF VID = VIN_ _ - VIN_ _ VOD = VOUT_ _ - VOUT_ _ Figure 1. Output Transition Time and Propagation Delay Timing Diagram Power-Supply Bypassing Bypass each VCC to GND with high-frequency surfacemount ceramic 0.1µF and 0.01µF capacitors in parallel as close to the device as possible. Install the 0.01µF capacitor closest to the device. OUT_ _ MAX9394/MAX9395 Differential Traces Input and output trace characteristics affect the performance of the MAX9394/MAX9395. Connect each input and output to a 50Ω characteristic impedance trace. Maintain the distance between differential traces and eliminate sharp corners to avoid discontinuities in differential impedance and maximize common-mode noise immunity. Minimize the number of vias on the differential input and output traces to prevent impedance discontinuities. Reduce reflections by maintaining the 50Ω characteristic impedance through connectors and across cables. Minimize skew by matching the electrical length of the traces. Output Termination Terminate LVDS outputs with a 100Ω resistor between the differential outputs at the receiver inputs. LVDS outputs require 100Ω termination for proper operation. Ensure that the output currents do not exceed the current limits specified in the Absolute Maximum Ratings. Observe the total thermal limits of the MAX9394/ MAX9395 under all operating conditions. VOD RL/2 IN_ _ VOS IN_ _ RL/2 EN_ _ = HIGH VID = VIN_ _ - VIN_ _ OUT_ _ ∆VOD = VOD - VOD* RL = 100Ω ±1% ∆VOS = VOS - VOS* VOD AND VOS ARE MEASURED WITH VID = +100mV. VOD* AND VOS* ARE MEASURED WITH VID = -100mV. Figure 2. Test Circuit for VOD and VOS Cables and Connectors Use matched differential impedance for transmission media. Use cables and connectors with matched differential impedance to minimize impedance discontinuities. Avoid the use of unbalanced cables. _______________________________________________________________________________________ 7 MAX9394/MAX9395 back function. The loopback function routes the input of channel A to the output of channel B, and the inputs of channel B to the outputs of channel A. See Tables 1 and 2 for a summary of the input/output routing between channels. MAX9394/MAX9395 2:1 Multiplexers and 1:2 Demultiplexers with Loopback VIHD INB0 VID = 0V VILD INB0 VIHD INB1 VID = 0V VILD INB1 VIH 1.5V 1.5V VIL BSEL OUT_ _ VOD = 0V INB0 INB1 VOD = 0V INB0 OUT_ _ tSWITCH tSWITCH EN_0 = EN_1 = HIGH VID = VIN_ _ - VIN_ _ Figure 3. Input to Rising/Falling Edge Select and Mux Switch Timing Diagram OUT_ _ MAX9394/MAX9395 CL RL/2 IN_ _ IN_ _ +1.25V RL/2 RL = 100Ω ±1% OUT_ _ CL = 1.0pF EN_ _ PULSE GENERATOR CL 50Ω VEN_ _ 1.5V 3V 1.5V 0V tPHD VOUT_ _ WHEN VID = +100mV VOUT_ _ WHEN VID = -100mV tPDH 50% VOUT_ _ WHEN VID = -100mV VOUT_ _ WHEN VID = +100mV 50% 50% 50% tPHD tPDH VID = VIN_ _ - VIN_ _ Figure 4. Output Active-to-Disable and Disable-to-Active Test Circuit and Timing Diagram 8 _______________________________________________________________________________________ 2:1 Multiplexers and 1:2 Demultiplexers with Loopback MAX9394/MAX9395 Table 1. Input Select Truth Table LOGIC INPUTS DIFFERENTIAL OUTPUTS LB_SELA LB_SELB BSEL OUTA_ / OUTA_ OUTB / OUTB 0 0 0 INA selected INB0 selected 0 0 1 INA selected INB1 selected 0 1 X INA selected INA selected 1 0 0 INB0 selected INB0 selected 1 0 1 INB1 selected INB1 selected 1 1 0 INB0 selected INA selected 1 1 INB1 selected INA selected 1 X = Don’t care. LB_SELA MAX9394 MAX9395 INA PULSE GENERATOR CL OUTA0 0 INA RL 50Ω 50Ω LB OUTA0 CL FROM CHANNEL B CL OUTA1 RL OUTA1 CL RL = 100Ω ±1% CL = 1.0pF ENA0 = ENA1 = HIGH 1 CHANNEL SHOWN. Figure 5. Output Transition Time, Propagation Delay, and Output Channel-to-Channel Skew Test Circuit Balanced cables such as twisted pair offer superior signal quality and tend to generate less EMI due to canceling effects. Board Layout Use a four-layer printed circuit (PC) board providing separate signal, power, and ground planes for highspeed signaling applications. Bypass VCC to GND as close to the device as possible. Install termination resistors as close to receiver inputs as possible. Match the electrical length of the differential traces to minimize signal skew. Table 2. Loopback Select Truth Table LB_SEL_ OUT_ _ GND or open Normal inputs selected. VCC Loopback inputs selected. _______________________________________________________________________________________ 9 MAX9394/MAX9395 2:1 Multiplexers and 1:2 Demultiplexers with Loopback VOUTA0 VOD = 0V VOD = 0V tCCS tCCS VOUTA0 VOUTA1 VOD = 0V VOD = 0V VOUTA1 VOD = VOUT_ _ - VOUT_ _ Figure 6. Output Channel-to-Channel Skew Functional Diagram LB_SELA ENA0 MAX9394 MAX9395 OUTA0 INA OUTA0 0 INA LB OUTA1 OUTA1 ENA1 LB_SELB INB0 OUTB LB 0 INB0 OUTB ENB 0 INB1 1 INB1 BSEL 10 ______________________________________________________________________________________ 2:1 Multiplexers and 1:2 Demultiplexers with Loopback GND 26 25 VCC INA 27 GND INA 28 INA LB_SELA 29 INA VCC 30 LB_SELA N.C. 31 VCC N.C. 32 N.C. N.C. TOP VIEW 28 27 26 25 24 23 22 TOP VIEW N.C. 1 24 VCC N.C. 1 21 OUTA0 N.C. 2 23 OUTA0 N.C. 2 20 OUTA0 N.C. 3 22 OUTA0 GND 3 GND 4 21 ENA0 ENB 4 VCC 7 9 10 11 12 13 14 15 16 GND INB0 INB0 LB_SELB VCC INB1 INB1 BSEL 17 ENA1 TQFP 16 OUTA1 15 ENA1 8 9 10 11 12 13 14 INB1 18 OUTA1 VCC 8 17 OUTA1 BSEL OUTB 7 18 GND *EXPOSED PADDLE INB1 OUTB 6 LB_SELB OUTB 5 19 OUTA1 INB0 20 GND INB0 ENB 5 OUTB 6 GND MAX9394 MAX9395 19 ENA0 MAX9394 MAX9395 THIN QFN *CONNECT EXPOSED PADDLE TO GND. Chip Information TRANSISTOR COUNT: 1565 PROCESS: Bipolar ______________________________________________________________________________________ 11 MAX9394/MAX9395 Pin Configurations Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) D2 0.15 C A D b CL 0.10 M C A B D2/2 D/2 PIN # 1 I.D. QFN THIN.EPS MAX9394/MAX9395 2:1 Multiplexers and 1:2 Demultiplexers with Loopback k 0.15 C B PIN # 1 I.D. 0.35x45 E/2 E2/2 CL (NE-1) X e E E2 k L DETAIL A e (ND-1) X e CL CL L L e e 0.10 C A C 0.08 C A1 A3 PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE 16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm APPROVAL COMMON DIMENSIONS DOCUMENT CONTROL NO. REV. 21-0140 C 1 2 EXPOSED PAD VARIATIONS NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE 16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm APPROVAL 12 DOCUMENT CONTROL NO. REV. 21-0140 C 2 2 ______________________________________________________________________________________ 2:1 Multiplexers and 1:2 Demultiplexers with Loopback 32L TQFP, 5x5x01.0.EPS Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13 © 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. MAX9394/MAX9395 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)