LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LWK3333-X DATA SHEET DOC. NO : QW0905-LWK3333-X REV. : A DATE : 24 - Nov. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK3333-X Page 1/6 Package Dimensions 5.0 5.9 7.6 8.6 1.5MAX 25.0MIN □0.5 TYP 2.54TYP + 1.0MIN - Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LWK3333-X Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT WK Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 120 mW Ir 50 μA Electrostatic Discharge( * ) ESD 150 V Operating Temperature Topr -20~ +80 ℃ Storage Temperature Tstg -30~ +100 ℃ Reverse Current @5V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO LWK3333-X COLOR MATERIAL InGaN/GaN Color Temperature (° K) Forward Luminous Viewing voltage intensity angle @20mA(V) @20mA(mcd) 2θ 1/2 (deg) Typ. Max. Min. Typ. Emitted Lens Min. Max. White Water Clear 3000 3500 3.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 4.0 6200 11500 16 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/6 PART NO. LWK3333-X Correspondence table of Color Temperature - 1931 CIE(Reference) Color Temperature Color Temperature 1931 CIE 1931 CIE Kelvin(° K) X Y Kelvin(° K) X Y 1000 1200 0.653 0.625 0.344 0.367 4100 0.376 4200 0.372 0.374 0.371 1400 1500 0.599 0.588 4300 4400 0.368 0.364 0.369 0.366 1600 1700 0.573 0.561 0.386 0.393 0.399 0.404 4500 4600 0.361 0.357 0.364 0.361 1800 0.549 0.408 4800 0.351 1900 0.538 0.411 4900 0.348 0.356 0.354 2000 2100 0.527 0.516 0.413 0.415 5000 5200 0.345 0.34 0.352 0.347 2200 2300 0.506 0.496 0.415 0.415 5400 5600 0.335 0.33 0.343 0.339 2400 2500 0.486 0.477 5800 6000 0.468 0.46 0.326 0.322 0.314 0.335 0.332 2600 2700 2800 0.415 0.414 0.412 0.411 0.409 2900 3000 0.452 0.444 0.437 0.407 0.404 3100 3200 0.43 0.423 0.402 0.399 3250 3300 0.42 0.417 0.398 0.396 3400 0.411 0.394 3500 3600 3700 0.405 0.409 0.395 0.391 3800 3900 0.39 4000 0.385 0.381 0.388 0.385 0.382 0.38 0.377 6500 7000 0.306 0.3 0.354 0.317 0.31 0.295 0.291 0.305 0.3 0.287 0.296 0.293 10000 0.285 0.281 15000 0.264 0.267 7500 8000 8500 9000 9300 0.288 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 PART NO. LWK3333-X Typical Electro-Optical Characteristics Curve WK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 SPECTRAL RADIANCE 100 Intensity 80 60 40 20 0 600 Wavelength (nm) 700 2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80 Ambient Temperature( ℃) Fig.5 Luminous Spectrum(Ta=25 ℃) 500 3.0 -40 Ambient Temperature( ℃) 400 1000 Forward Current(mA) Forward Voltage(V) -40 100 800 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6 PART NO. LWK3333-X Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 2° /sec max 0 Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK3333-X Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃ &-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11