AP4820AGYT-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Simple Drive Requirement ▼ Small Size & Lower Profile ▼ RoHS Compliant & Halogen-Free BVDSS RDS(ON) ID D 30V 8.5mΩ 15A G D S Description AP4820A series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range of power applications. ® The PMPAK 3x3 package is special for voltage conversion application using standard infrared reflow technique with the backside heat sink to achieve the good thermal performance. D D D S S S G PMPAK® 3x3 Absolute Maximum Ratings@Tj=25oC(unless otherwise specified) Symbol Parameter VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TA=25℃ ID@TA=70℃ . 3 Drain Current, VGS @ 10V 3 Drain Current, VGS @ 10V 1 Rating Units 30 V +20 V 15 A 12 A 50 A 3.13 W IDM Pulsed Drain Current PD@TA=25℃ Total Power Dissipation TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Parameter Value Unit Rthj-c Maximum Thermal Resistance, Junction-case 4 ℃/W Rthj-a Maximum Thermal Resistance, Junction-ambient3 40 ℃/W Data and specifications subject to change without notice 1 201501293 AP4820AGYT-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol BVDSS RDS(ON) Parameter Test Conditions Drain-Source Breakdown Voltage 2 Static Drain-Source On-Resistance Min. Typ. Max. Units VGS=0V, ID=250uA 30 - - V VGS=10V, ID=12A - 6.4 8.5 mΩ VGS=4.5V, ID=8A - 11.3 15 mΩ VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 1.55 2.5 V gfs Forward Transconductance VDS=10V, ID=12A - 34 - S IDSS Drain-Source Leakage Current VDS=30V, VGS=0V - - 10 uA IGSS Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA Qg Total Gate Charge ID=12A - 9 14.4 nC Qgs Gate-Source Charge VDS=15V - 2.6 - nC Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 5 - nC td(on) Turn-on Delay Time VDS=15V - 13 - ns tr Rise Time ID=1A - 12 - ns td(off) Turn-off Delay Time RG=3.3Ω - 16 - ns tf Fall Time VGS=5V - 8.5 - ns Ciss Input Capacitance VGS=0V - 795 1270 pF Coss Output Capacitance VDS=15V - 230 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 125 - pF Rg Gate Resistance f=1.0MHz - 2 4 Ω Min. Typ. . Source-Drain Diode Symbol Parameter 2 Test Conditions Max. Units VSD Forward On Voltage IS=2.6A, VGS=0V - - 1.2 V trr Reverse Recovery Time IS=12A, VGS=0V, - 23 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 16 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 2oz copper pad of FR4 board, t <10sec; 210oC/W when mounted on min. copper pad. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP4820AGYT-HF 60 60 10V 7.0V 6.0V 5.0V V G =4.0V ID , Drain Current (A) 50 40 10V 7.0V 6.0V 5.0V V G =4.0V T A = 150 o C 50 ID , Drain Current (A) o T A =25 C 30 20 10 40 30 20 10 0 0 0 1 2 3 4 0 1 V DS , Drain-to-Source Voltage (V) 2 3 4 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 14 2.4 I D =12A V G =10V ID=8A T A =25 ℃ 2.0 10 . Normalized RDS(ON) RDS(ON) (mΩ ) 12 1.6 1.2 8 0.8 6 0.4 2 4 6 8 10 -50 0 V GS , Gate-to-Source Voltage (V) 50 100 150 o T j , Junction Temperature ( C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 12 2.0 I D =250uA 1.8 Normalized VGS(th) 1.6 IS(A) 8 o o T j =150 C T j =25 C 1.4 1.2 1.0 0.8 4 0.6 0.4 0.2 0.0 0 0 0 0 1 1 1 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP4820AGYT-HF f=1.0MHz 1000 5 I D = 12 A C iss 800 C (pF) VGS , Gate to Source Voltage (V) V DS = 15 V 4 3 600 2 400 1 200 C oss C rss 0 0 0 2 4 6 8 10 1 5 Q G , Total Gate Charge (nC) 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 100 100u s 10 ID (A) 1ms . 10ms 1 100m s 0.1 T A =25 o C Single Pulse Normalized Thermal Response (R thja) Duty factor=0.5 Operation in this area limited by RDS(ON) 0.2 0.1 0.05 0.02 PDM 0.01 t T Duty factor = t/T Peak Tj = PDM x Rthja + Ta Single Pulse Rthia=210 ℃ /W 1s 0.01 0.01 0.1 1 10 0.0001 100 0.001 0.01 0.1 1 10 100 1000 V DS , Drain-to-Source Voltage (V) t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance 50 16 V DS =5V ID , Drain Current (A) ID , Drain Current (A) 40 30 20 T =150 o C 12 8 4 10 o T j =25 C o T j =-40 C 0 0 0 1 2 3 4 5 V GS , Gate-to-Source Voltage (V) Fig 11. Transfer Characteristics 6 25 50 75 100 125 150 T A , Ambient Temperature ( o C ) Fig 12. Drain Current v.s. Ambient Temperature 4 AP4820AGYT-HF MARKING INFORMATION 4820AGYT Part Number meet Rohs requirement for low voltage MOSFET only Package Code : YT YWWSSS Date Code (YWWSSS) Y:Last Digit Of The Year WW:Week SSS:Sequence . 5