PARA LIGHT L-T670WDT-WW1-Q Surface mount device led Datasheet

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PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
http://www.para.com.tw
E-mail: [email protected]
DATA
SHEET
PART NO.: LT670WDT-WW1-Q
REV: A / 0
CUSTOMER’S APPROVAL : _______________
DCC : ____________
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DATE : 2011-11-19 PAGE
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l Features
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Top view, Wide view angle, Warm White color PLCC 2 package SMD LED .
EIA STD package, packing in 8mm tape on 7" diameter reels (ANSI/EIA-481-B-2001).
Compatible with automatic Pick & Place equipment.
Compatible with IR Reflow soldering and TTW soldering.
Pb free product and acceptable lead-free process.
Meet RoHS Green Product.
Application
*General lighting
*Decorative and Entertainment Lighting.
*Indicators.
l
Switch lights.Package Outline Dimensions
SIDE VIEW
TOP VIEW
3.50
2.80
2.70
0.15
c 0.80
2.40
3.20
-
POLARITY +
BACK VIEW
0.80
2.18
1.90
FRONT VIEW
0.75
0.75
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ± 0.10mm (.004") unless otherwise noted.
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l Chip Materials
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Dice Material : InGaN
Light Color : Warm White
Lens Color : Light Yellow Diffused.
l Absolute Maximum Ratings(Ta=25℃)
Symbol
Parameter
Rating
Unit
PD
Power Dissipation
110
mW
IPF
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
100
mA
IF
Continuous Forward Current
20
mA
VR
Reverse Voltage
5
V
2000
V
Note A
ESD
Electrostatic Discharge Threshold (HBM)
Topr
Operating Temperature Range
-40 ~ + 85
℃
Tstg
Storage Temperature Range
-40 ~ + 100
℃
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
l Electro-Optical Characteristics (Ta=25℃)
Parameter
Unit
Test Condition
2000
mcd
IF=20mA
2θ1/2
120
Deg
Note 2
CIE Chromaticity
x
0.43
CIE Chromaticity
y
0.40
Forward Voltage
VF
3.20
Color Rending Index
CRI
Luminous Intensity
Viewing Angle
Symbol
Min.
Typ.
IV
1900
DRAWING NO. : DS-7A-11-0013
80
Max.
IF=20mA
3.60
V
IF = 20mA
Ra
IF=20mA
DATE : 2011-11-19
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Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
l Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
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l Typical Electro-Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
Ta=25℃
Relative Luminous lntensity
Normalized of 20mA
Forward Current IF(mA)
50
40
30
20
10
0
0
20
40
60
80
Ta=25℃
100
Ambient Temperature Ta(℃)
Fig.2 Forward Current Derating Curve
0°
200
10° 20°
Ta=25℃
30°
100
50
30
1.0
40°
0.9
50°
0.8
60°
70°
80°
90°
20
0.7
10
1
5 10 20
50 100
0.5 0.3 0.1 0.2 0.4 0.6
Ambient Temperature Ta(℃)
Fig.4 Forward Current Derating Curve
Fig.5 Spatial Distribution
IFP=60mA
IFP=20mA
IFP=5mA
Fig.3 Relative Luminous Intensity vs.Forward Current
Relative luminous intensity
Allowable Forward Current IFP(mA)
Fig.1 Forward Current vs.Forward Voltage
2
IFP=20mA
1
0.5
0.2
0.1
-40 -20
20 40 60 80 100
0
Ambient Temperature Ta(℃)
Fig.6 Luminous Intensity vs.Ambient Temperature
Ta=25℃
IFP=20mA
100mA
50mA
-30℃
20mA
0℃
85℃50℃25℃
5mA
1mA
Ambient Temperature Ta(℃)
Fig.7 Ambient Temperature vs.Forward Voltage
x
x
Fig.8 Ambient Temperature vs.Chromaticity Coordinate
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Fig.9 Forward Current vs.Chromaticity Coordinate
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IV Bin Code List
Φ(lm)
Typ.
Luminous Intensity(IV), Unit:mcd@20mA
H15
1900
2100
6.27
H16
2100
2350
6.75
H17
2350
2600
7.20
Tolerance of each bin are±10%
l VF Bin Code List
Forward Voltage(VF),, Unit:V@20mA
BINCODE
MIN
MAX
14
2.90
3.00
15
3.00
3.10
16
3.10
3.20
17
3.20
3.30
18
3.30
3.40
19
3.40
3.50
20
3.50
3.60
Tolerance of each bin are±0.1Volt
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●Bin Range of Chromaticity Coordinates @ 20mA
CIE-X
CIE-Y
CIE-X
CIE-Y
CIE-X
CIE-Y
0.4330
0.4280
0.4477
0.4325
0.493
0.4405
T1
0.4160
0.4222
U1
0.4330
0.4280
X1
0.478
0.4388
(3250-3500K)
0.4110
0.4080
(3050-3250K)
0.4270
0.4145
(2500-2670K)
0.4708
0.4261
0.4270
0.4145
0.4416
0.4195
0.4855
0.4281
0.4270
0.4145
0.4416
0.4195
0.4855
0.4281
T2
0.4110
0.4080
U2
0.4270
0.4145
X2
0.4708
0.4261
(3250-3500K)
0.4055
0.3915
(3050-3250K)
0.4200
0.3975
(2500-2670K)
0.4622
0.411
0.4200
0.3975
0.4333
0.4029
0.4767
0.414
0.4200
0.3975
0.4333
0.4029
0.4767
0.414
T3
0.4055
0.3915
U3
0.4200
0.3975
X3
0.4622
0.411
(3250-3500K)
0.4000
0.3750
(3050-3250K)
0.413
0.3810
(2500-2670K)
0.4531
0.3947
0.4130
0.3810
0.4260
0.3868
0.466
0.397
0.4130
0.3810
0.4260
0.3868
0.466
0.397
T4
0.4000
0.3750
U4
0.4130
0.3810
X4
0.4531
0.3947
(3250-3500K)
0.3945
0.3600
(3050-3250K)
0.4066
0.3655
(2500-2670K)
0.4443
0.3793
0.4066
0.3655
0.4180
0.3700
0.4567
0.3822
0.4626
0.4362
0.478
0.4388
V1
0.4477
0.4325
W1
0.4626
0.4362
(2850-3050K)
0.4416
0.4195
(2670-2850K)
0.4559
0.4231
0.4559
0.4231
0.4708
0.4261
0.4559
0.4231
0.4708
0.4261
V2
0.4416
0.4195
W2
0.4559
0.4231
(2850-3050K)
0.4333
0.4029
(2670-2850K)
0.4478
0.4072
0.4478
0.4072
0.4622
0.4110
0.4478
0.4072
0.4622
0.4110
V3
0.4333
0.4029
W3
0.4478
0.4072
(2850-3050K)
0.4260
0.3868
(2670-2850K)
0.4395
0.3912
0.4395
0.3912
0.4531
0.3947
0.4395
0.3912
0.4531
0.3947
V4
0.4260
0.3868
W4
0.4395
0.3912
(2850-3050K)
0.4180
0.3700
(2670-2850K)
0.4308
0.375
0.4308
0.3750
0.4443
0.3793
* Measurement of Color coordinates : +/- 0.01
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DATE : 2011-11-19
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C.I.E Chromaticity Diagram
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l Label Explanation
CUS. PART NO: To be denominated.
CUSTOMER: To be denominated.
PART NO: Refer to P17
IV--- Luminous Intensity Code
VF--- Forward Voltage Code
CIE--- Color Rank Code
LOT NO:
E L P 7 8 0001
A
B
C D
E
F
A---E: For series number
B---L: Local F: Foreign
C---P: PLCC SMD
D---Year
E---Month
F---SPEC.
PACKING QUANTITY OF BAG :
2000pcs max for T670 series
2000pcs max for T650 series
2000pcs max for S020 series
DATE CODE:2007
G
G--- Year
H--- Month
I --- Day
08
H
02
I
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l Reel Dimensions
Notes:
1.
2.
Taping Quantity : 1000pcs/reel、1500 pcs/reel、2000 pcs/reel
The tolerances unless noted is±0.1mm, Angle±0.5°, Unit: mm.
l Suggest Soldering Pad Dimensions
1.6
2.2
1.8
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l Package Dimensions Of Tape And Reel
1.75±0.10
(.069±.004)
User Feed Direction
2.00±0.05
(.079±.002)
4.00±0.10
(.157±.004)
*2.03+0.10
(.080+.004)
3.50±0.05
(.138±.002)
*8.00+0.30
-0.10
( 0.315+.012
-.004
5°
*3.66± .10
(.144± .004)
)
*0.23± 0.03
(.009± .001)
4.00±0.10
(.157±.004)
Notes: All dimensions are in millimeters.
l Packaging Of Electronic Components On Continuous Tapes
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Moisture Resistant Packaging
Label
H:\S M D\SM D\S M D° ü × ° \± ê ? ? .jpg
H:\S MD\ SM D\S MD° ü × ° \± ê ? ? .jpg
H:\S
MD\
SM
D\SM
D°
ü×
ê
° \±
? ? .jpg
l
REV: A / 1
Reel
Label
Desiccant
Aluminum moistue-proof bag
240
H:\S
M D\S
M D\S
MD
° \± ê
°ü ×
pg
? ? .j
145
210
5
25
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
l
Cleaning
Û
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If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed
beforehand whether the solvents will dissolve the package and the resin or not.)
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
ultrasonic power and the assembled condition. Before cleaning, a pre-test should be
confirm whether any damage to the LEDS will occur.
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●
Suggest Sn/Pb IR Reflow Soldering Profile Condition:
●
Suggest Pb-Free IR Reflow Soldering Profile Condition:
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l CAUTIONS
1. Static Electricity:
* Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
* All devices, equipment and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.
* When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged
LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended).
* Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases,
the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria: (VF>2.0V,at IF=0.5m A )
2. Storage :
* Before opening the package :
The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture
proof packaging with absorbent material (silica gel) is recommended.
* After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within
168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in
moisture proof packages, such as sealed containers with packages of moisture absorbent material
(silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to
reseal the moisture proof bag again.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should e performed using the following conditions.
Baking treatment: more than 24hours at 65±5℃.
* Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
3. Soldering:
Do not apply any stress to the LED lens during soldering while the LED is at high temperature.
Recommended soldering condition.
* Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
* Soldering Iron : (Not recommended)
Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
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4. Lead-Free Soldering
For Reflow Soldering :
1、Pre-Heat Temp: 150-180℃,120sec.Max.
2、Soldering Temp: Temperature Of Soldering Pot Over 240℃,40sec.Max.
3、Peak Temperature: 260℃,10sec.
4、Reflow Repetition: 2 Times Max.
5、Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
1、Iron Tip Temp: 350℃ Max.
2、Soldering Iron: 30w Max.
3、Soldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
1、Criteria For Judging The Damage
Item
Symbol
Test Conditions
Forward Voltage
VF
Reverse Current
Luminous Intensity
Criteria for Judgement
MIN.
Max.
IF=20mA
-
U.S.L.*)×1.1
IR
VR=5V
-
U.S.L.*)×2.0
IV
IF=20mA
L.S.L**)×0.7
-
*) U.S.L.: Upper Standard Level
**) L.S.L: Lower Standard Level
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2、Test Items And Results
Test Item
Reference
Standard
Test Condition
Note
Tsld=260℃,10sec.
(Pre treatment 30
2times
℃,70%,168hrs)
JEITA
Tsld=215℃,3sec.
1time
Solder ability (Reflow Soldering)
ED-4701300 303
(Lead Solder)
over 95%
JEITA
-40℃ ~ 100℃
100cycles
Thermal Shock
ED-4701300 307
30min. 30min.
JEITA
-40℃ ~ 25℃~100℃~25℃
Temperature Cycle
100cycles
ED-4701100 105 30min. 5min. 30min. 5min
JEITA
ED-4701200High Temperature Storage
Ta=100℃
1000hrs.
201
JEITA
Temperature Humidity Storage
Ta=60℃,RH=90%
1000hrs.
ED-4701100 103
JEITA
Low Temperature Storage
Ta=-40℃
1000hrs.
ED-4701200 202
Steady State Operating Life
1000hrs.
Ta=25℃,IF=20mA
Condition
Steady State Operating Life
Ta=60℃,RH=90%,IF=15mA 500hrs.
of High Humidity Heat
Resistance to Soldering Heat
JEITA
(Reflow Soldering)
ED-4701300 301
Number
of
Damaged
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
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l PART NO. SYSTEM :
Lumen:
L – T 67 0 W D T– WW1-Q - X
L:6.0~6.3;M:6.3~6.6;N:6.6~6.9;P:6.9~7.2
M:65~70; N:70~75; P:75~80;Q:80~85
Ra:M:65~70; N:70~75; P:75~80;Q:80~85
CW1:5500-6500K;CW2:5000-7000K
NW1:3800-5000K;WW1:2500-3500 K
T : Taping for 7 inch reeL
Lens color
C : Water Clear
W : White Diffused
D : Color Diffused
KY : 9mil AlInGap 590nm Super Yellow
KR : 9mil AlInGap 630 nm Super Red
TE(HE) : 14mil AlInGap 624 nm Super Red
TY(HY): 14mil AlInGap590 nm Super Yellow
LB : InGaN ITO rough 470nm Blue
LG(SG) : InGaN ITO rough520nm Green
W : InGaN + YAG White color
0 : Single chip
1/2 : Super thin single chip
5/6 : Dual chip
F : Three chip(Full color)
C : PCB Top View Type
T :PLCC Top View Type
S : Side View Type
DRAWING NO. : DS-7A-11-0015
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650 :
3020 1.3T TYPE
670 :
3528 1.9T TYPE
020 :
3812 0.6T TYPE
680:
5630 0.9T TYPE
690:
5050 1.5T TYPE
DATE : 2011-10-6
PAGE
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