Chip Efficient Fast Rectifier Formosa MS EGFM101-MH1 THRU EGFM105-MH1 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-121539 2014/01/20 2015/01/21 B 7 Chip Efficient Fast Rectifier Formosa MS EGFM101-MH1 THRU EGFM105-MH1 1.0A Sufrace Mount Efficient Fast Rectifiers-50-600V Features Package outline • Batch process design, excellent power dissipation offers • • • • • • SOD-123H1 better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. High current & surge capability. Low forward dropdown voltage Glass passivated chip junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen free parts, ex. EGFM101-MΗ1-H. 0.146(3.7) 0.130(3.3) 0.071(1.8) 0.056(1.4) 0.012(0.3) Typ. 0.004(0.1) Typ. Mechanical data • • • Epoxy : UL94-V0 rated flame retardant 0.040(1.0) 0.024(0.6) Case : Molded plastic, SOD-123H1 Terminals :Plated terminals, solderable per MIL-STD-750, 0.031(0.8) Typ. 0.031(0.8) Typ. Method 2026 • • • Polarity : Indicated by cathode band Dimensions in inches and (millimeters) Mounting Position : Any Weight : Approximated 0.0103 gram Maximum ratings and Electrical Characteristics (AT PARAMETER o T A=25 C unless otherwise noted) SYMBOLS EGFM101-MH1 EGFM102-MH1 EGFM103-MH1 EGFM104-MH1 EGFM105-MH1 UNIT Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 V Maximum RMS voltage VRMS 35 70 140 280 420 V Maximum DC blocking voltage VDC 50 100 200 400 600 V Maximum average forward rectified current IO 1.0 A Peak forward surge current 8.3ms single half sine-wave(JEDEC method) IFSM 20 A Maximum forward voltage at I F =1.0A VF Maximum DC reverse current T J =25 ° C at rated DC blocking voltage T J =125 ° C IR 5.0 100 uA uA Typical junction capacitance (Note 2) CJ 15 pF Maximum reverse recovery time (Note 1) trr 25 ns Operating junction temperature range TJ -55 to +150 °C Storage temperature range TSTG -55 to +150 °C 0.875 1.25 1.75 V Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A 2. Measured at 1 MHz and applied reverse voltage of 4.0 VDC http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date Revision Page. DS-121539 2014/01/20 2015/01/21 B 7 Rating and characteristic curves (EGFM101-MH1 THRU EGFM105-MH1) FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE FIG.1-TYPICAL FORWARD AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 10 1 EGFM104-MH1 TJ=25°C 1.0 0.8 0.6 P.C.B. Mounted on 0.2 " x 0.2 " (5 mm x 5 mm) Copper Pad Areas 0.4 0.2 0 0 25 50 75 100 125 150 175 LEAD TEMPERATURE (°C) 0.1 EGFM105-MH1 pulse width =300μs 1% duty cycle 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 FORWARD VOLTAGE,(V) FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTICS 50W NONINDUCTIVE 10W NONINDUCTIVE ( ) (+) D.U.T. 25Vdc (approx.) PULSE GENERATOR (NOTE 2) ( ) PEAK FORWAARD SURGE CURRENT,(A) INSTANTANEOUS FORWARD CURRENT,(A) EGFM101-MH1 - EGFM103-MH1 1.2 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 50 40 30 8.3ms Single Half TJ=25 C JEDEC method 10 0 1 5 (+) 1W NONINDUCTIVE Sine Wave 20 50 10 100 NUMBER OF CYCLES AT 60Hz OSCILLISCOPE (NOTE 1) NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. 2. Rise Time= 10ns max., Source Impedance= 50 ohms. FIG.5-TYPICAL JUNCTION CAPACITANCE 35 TJ=25 C f=1.0MHZ Vsig = 50mVp-p JUNCTION CAPACITANCE,(pF) trr | | | | | | | | +0.5A 0 -0.25A -1.0A 30 25 20 15 10 5 1cm SET TIME BASE FOR 10 / 20ns / cm 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision Page. DS-121539 2014/01/20 2015/01/21 B 7 Chip Efficient Fast Rectifier Formosa MS EGFM101-MH1 THRU EGFM105-MH1 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code EGFM101-MH1 EGFM102-MH1 EGFM103-MH1 EGFM104-MH1 EGFM105-MH1 E1 E2 E3 E4 E5 Suggested solder pad layout C A B Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 PACKAGE A B C SOD-123H1 0.071 (1.80) 0.051 (1.30) 0.067 (1.70) Page 4 Document ID Issued Date Revised Date Revision Page. DS-121539 2014/01/20 2015/01/21 B 7 Chip Efficient Fast Rectifier Formosa MS EGFM101-MH1 THRU EGFM105-MH1 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123H1 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.00 3.85 1.10 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-121539 2014/01/20 2015/01/21 B 7 Chip Efficient Fast Rectifier Formosa MS EGFM101-MH1 THRU EGFM105-MH1 Reel packing PACKAGE REEL SIZE SOD-123H1 7" COMPONENT SPACING REEL (pcs) (m/m) 4.0 3,000 BOX (pcs) 30,000 INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (m/m) (m/m) (m/m) (pcs) (kg) 183*183*123 178 382*262*387 240,000 8.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 6 Document ID Issued Date Revised Date Revision Page. DS-121539 2014/01/20 2015/01/21 B 7 Chip Efficient Fast Rectifier Formosa MS EGFM101-MH1 THRU EGFM105-MH1 High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=150 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O MIL-STD-750D METHOD-1051 O 7. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. 9. Humidity at T A=85 C , RH=85% for 1000hrs. 10. High Temperature Storage Life at 175 C for 1000 hrs. MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 O http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1031 O Page 7 Document ID Issued Date Revised Date Revision Page. DS-121539 2014/01/20 2015/01/21 B 7