HSMx-C265 Surface Mount Chip LEDs Data Sheet Description Features The HSMx-C265 is a reverse mountable chip-type LED for lighting the non-component side of a PCB board. In this reverse mounting configuration, this LED is designed to emit light through a small cut-out hole in the PC board. • Reverse mountable The HSMx-C265 is available in four colors. The small size, narrow footprint, and low profile make this series of LEDs excellent for backlighting, status indication, and front panel illumination application. • Undiffused optics • Small 3.4 x 1.25 mm footprint • Operating temperature range of –30°C to +85°C • Compatible with IR solder reflow • Four colors available: red, orange, yellow, and green • Available in 8 mm tape on 7" (178 mm) diameter reels Applications • Keypad backlighting • Symbol backlighting • LCD backlighting • Status indication Device Selection Guide Part Number Color Parts Per Reel HSMS-C265 HSMD-C265 HSMY-C265 HSMG-C265 HSMH-C265 High Efficiency Red Orange Yellow Green AlGaAs Red 3000 3000 3000 3000 3000 Package Dimensions 3.4 (0.134) CATHODE MARK LED DIE 1.25 (0.049) R 0.25 (0.01) 0.4 (0.016) WHITE SOLDER MASK (THICKNESS = 0.15 (0.006) 0.4 (0.016) GREEN CATHODE MARK (CUM SOLDER MASK) 1.2 (0.047) UNDIFFUSED EPOXY 1.1 (0.043) POLARITY 1.1 (0.043) PC BOARD 0.3 (0.012) 0.25 (0.01) 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) SOLDERING TERMINAL Notes: NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES). 1. All dimensions in millimeters1.(inches). 2. TOLERANCE IS ± 0.1 mm UNLIESS OTHERWISE SPECIFIED. 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. 3. Polarity of HSMH-C265 will be the opposite of whatHSMx-C260 is shown on above drawing. Pkg Dimen Absolute Maximum Ratings TA = 25°C Parameter HSMD/G/S/Y-C265 DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR = 100 µA) Led Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature 25 25 100 100 65 65 5 5 95 95 –30 to +85 –30 to +85 –40 to +85 –40 to +85 See IR soldering profile (Figure 6) Notes: 1. Derate linearly as shown in Figure 4. 2. Pulse condition of 1/10 duty and 0.1 msec. width. HSMH-C265 Units mA mA mW V °C °C °C Electrical Characteristics TA = 25°C Part Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ.[1] Thermal Resistance RθJ-PIN (°C/W) Typ. HSMS-C265 HSMD-C265 HSMY-C265 HSMG-C265 HSMH-C265 2.1 2.2 2.1 2.2 1.8 5 5 5 5 5 8 6 7 6 18 250 250 250 250 300 2.6 2.6 2.6 2.6 2.6 Optical Characteristics TA = 25°C Part Number Color Luminous Intensity Iv (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength λpeak (nm) Typ. Dominant Wavelength λd (nm)[2] Typ. Viewing Angle 2θ1/2 Degrees[3] Typ. HSMS-C265 HSMD-C265 HSMY-C265 HSMG-C265 HSMH-C265 2.5 2.5 2.5 4.0 6.3 630 605 589 570 660 626 604 586 572 639 150 150 150 150 150 HER Orange Yellow Green AlGaAs 10.0 8.0 8.0 15.0 17.0 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represent the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 1.0 RELATIVE INTENSITY GREEN YELLOW 0.5 ORANGE 0 500 HER 550 600 650 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. HSMx-C260 fig 1 700 750 HER 10 GREEN 1 YELLOW 0.1 ORANGE 1.5 1.7 1.9 2.1 1.2 0.8 0.4 0 2.3 0 10 20 30 IF – FORWARD CURRENT – mA VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. HSMX-C190 fig 2 Figure 3. Luminous intensity vs. forward current. HSMx-C260 fig 3 40 IF MAX. – MAXIMUM FORWARD CURRENT – mA 1.6 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 35 30 25 20 RθJ-A = 600°C/W 15 RθJ-A = 800°C/W 10 5 0 0 20 40 60 80 Figure 4. Maximum forward current vs. ambient temperature. HSMx-C260 fig 4 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle. HSMx-C260 fig 5 2.2 (0.087) DIA. PCB HOLE TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C 4°C/SEC. MAX. 1.25 (0.049) 3°C/SEC. MAX. OVER 2 MIN. TIME Figure 6. Recommended reflow soldering profile. 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) Figure 7. Recommended soldering pad pattern. HSMx-C260 fig 7 HSMx-C260 fig 6 Note: 1. All dimensions in millimeters (inches). 100 TA – AMBIENT TEMPERATURE – °C USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 8. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 9. Reel Dimensions. Note: 1. All dimensions in millimeters (inches). 6 PS 5.0 ± 0.5 (0.197 ± 0.020) HSMx-C260 Reel Dimensions 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) Figure 10. Tape dimensions. HSMx-C260 fig 10 END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 11. Tape leader and trailer dimensions. HSMx-C260 fig 11 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. Storage Condition: 5 to 30˚C at 60% RH max. Baking is required under the condition: a) the blue silica gell indicator becoming white/transparent color b) the pack has been open for more than 1 week Baking recommended condition: 60 ± 5˚C for 20 hours. 6 MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5980-1655E 5980-2435E November 27, 2007