IC80LV52 IC80LV32 IC80LV52 IC80LV32 CMOS SINGLE CHIP LOW VOLTAGE 8-BIT MICROCONTROLLER FEATURES GENERAL DESCRIPTION • • • • • • • • The ICSI IC80LV52 and IC80LV32 are high-performance microcontrollers fabricated using high-density CMOS technology. The CMOS IC80LV52/32 is functionally compatible with the industry standard 8052/32 microcontrollers. • • • • • • • 80C51 based architecture 8K x 8 ROM (IC80LV52 only) 256 x 8 RAM Three 16-bit Timer/Counters Full duplex serial channel Boolean processor Four 8-bit I/O ports, 32 I/O lines Memory addressing capability – 64K ROM and 64K RAM Program memory lock – Encrypted verify (32 bytes) – Lock bits (2) Power save modes: – Idle and power-down Eight interrupt sources Most instructions execute in 0.5 µs CMOS and TTL compatible Maximum speed: 24 MHz @ Vcc = 3.3V Packages available: – 40-pin DIP – 44-pin PLCC – 44-pin PQFP The IC80LV52/32 is designed with 8K x 8 ROM (IC80LV52 only); 256 x 8 RAM; 32 programmable I/O lines; a serial I/O port for either multiprocessor communications, I/O expansion or full duplex UART; three 16-bit timer/counters; an eight-source, two-priority-level, nested interrupt structure; and an on-chip oscillator and clock circuit. The IC80LV52/32 can be expanded using standard TTL compatible memory. T2/P1.0 1 40 VCC T2EX/P1.1 2 39 P0.0/AD0 P1.2 3 38 P0.1/AD1 P1.3 4 37 P0.2/AD2 P1.4 5 36 P0.3/AD3 P1.5 6 35 P0.4/AD4 P1.6 7 34 P0.5/AD5 P1.7 8 33 P0.6/AD6 RST 9 32 P0.7/AD7 RxD/P3.0 10 31 EA TxD/P3.1 11 30 ALE INT0/P3.2 12 29 PSEN INT1/P3.3 13 28 P2.7/A15 T0/P3.4 14 27 P2.6/A14 T1/P3.5 15 26 P2.5/A13 WR/P3.6 16 25 P2.4/A12 RD/P3.7 17 24 P2.3/A11 XTAL2 18 23 P2.2/A10 XTAL1 19 22 P2.1/A9 GND 20 21 P2.0/A8 Figure 1. IC80LV52/32 Pin Configuration: 40-pin DIP ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc. Integrated Circuit Solution Inc. MC006-0B 1 P1.3 P1.2 P1.1/T2EX P1.0/T2 NC VCC P0.0/AD0 P0.1/AD1 P0.2/AD2 P0.3/AD3 INDEX P1.4 IC80LV52 IC80LV32 6 5 4 3 2 1 44 43 42 41 40 P1.5 7 39 P0.4/AD4 P1.6 8 38 P0.5/AD5 P1.7 9 37 P0.6/AD6 RST 10 36 P0.7/AD7 RxD/P3.0 11 35 EA NC 12 34 NC TxD/P3.1 13 33 ALE INT0/P3.2 14 32 PSEN INT1/P3.3 15 31 P2.7/A15 T0/P3.4 16 30 P2.6/A14 T1/P3.5 17 29 P2.5/A13 18 19 20 21 22 23 24 25 26 27 28 WR/P3.6 RD/P3.7 XTAL2 XTAL1 GND NC A8/P2.0 A9/P2.1 A10/P2.2 A11/P2.3 A12/P2.4 TOP VIEW Figure 2. IC80LV52/32 Pin Configuration: 44-pin PLCC 2 Integrated Circuit Solution Inc. MC006-0B P1.4 P1.3 P1.2 P1.1/T2EX P1.0/T2 NC VCC P0.0/AD0 P0.1/AD1 P0.2/AD2 P0.3/AD3 IC80LV52 IC80LV32 44 43 42 41 40 39 38 37 36 35 34 P0.6/AD6 RST 4 30 P0.7/AD7 RxD/P3.0 5 29 EA NC 6 28 NC TxD/P3.1 7 27 ALE INT0/P3.2 8 26 PSEN INT1/P3.3 9 25 P2.7/A15 T0/P3.4 10 24 P2.6/A14 T1/P3.5 11 23 P2.5/A13 12 13 14 15 16 17 18 19 20 21 22 A12/P2.4 31 A11/P2.3 3 A10/P2.2 P1.7 A9/P2.1 P0.5/AD5 A8/P2.0 32 NC 2 GND P1.6 XTAL1 P0.4/AD4 XTAL2 33 RD/P3.7 1 WR/P3.6 P1.5 Figure 3. IC80LV52/32 Pin Configuration: 44-pin PQFP Integrated Circuit Solution Inc. MC006-0B 3 IC80LV52 IC80LV32 VCC P2.0-P2.7 P0.0-P0.7 P2 DRIVERS P0 DRIVERS P2 LATCH P0 LATCH GND RAM ADDR REGISTER ADDRESS DECODER & 256 BYTES RAM B REGISTER STACK POINT ADDRESS 2 LOCK BITS DECODER & & 32 BYTES 8K ROM ENCRYPTION PROGRAM ADDRESS REGISTER ACC PCON SCON T2CON TH0 TL1 TH2 RCAP2L SBUF TMOD TCON TL0 TH1 TL2 RCAP2H IE IP TMP2 INTERRUPT SERIAL PORT AND TIMER BLOCK TMP1 PROGRAM COUNTER PC INCREMENTER ALU PSW PSEN ALE RST TIMING AND CONTROL EA INSTRUCTION REGISTER BUFFER DPTR P3 LATCH P1 LATCH P3 DRIVERS P1 DRIVERS P3.0-P3.7 P1.0-P1.7 OSCILLATOR XTAL1 XTAL2 Figure 4. IC80LV52/32 Block Diagram 4 Integrated Circuit Solution Inc. MC006-0B IC80LV52 IC80LV32 Table 1. Detailed Pin Description Symbol PDIP PLCC PQFP I/O Name and Function ALE 30 33 27 I/O Address Latch Enable: Output pulse for latching the low byte of the address during an address to the external memory. In normal operation, ALE is emitted at a constant rate of 1/6 the oscillator frequency, and can be used for external timing or clocking. Note that one ALE pulse is skipped during each access to external data memory. EA 31 35 29 I External Access enable: EA must be externally held low to enable the device to fetch code from external program memory locations 0000H to FFFFH. If EA is held high, the device executes from internal program memory unless the program counter contains an address greater than 1FFFH. P0.0-P0.7 39-32 43-36 37-30 I/O Port 0: Port 0 is an 8-bit open-drain, bidirectional I/O port. Port 0 pins that have 1s written to them float and can be used as high-impedance inputs. Port 0 is also the multiplexed low-order address and data bus during accesses to external program and data memory. In this application, it uses strong internal pullups when emitting 1s. P1.0-P1.7 1-8 2-9 40-44 1-3 I/O Port 1: Port 1 is an 8-bit bidirectional I/O port with internal pullups. Port 1 pins that have 1s written to them are pulled high by the internal pullups and can be used as inputs. As inputs, Port 1 pins that are externally pulled low will source current because of the internal pullups. (See DC Characteristics: IIL). The Port 1 output buffers can sink/source four TTL inputs. Port 1 also receives the low-order address byte during ROM verification. P2.0-P2.7 1 2 2 3 40 41 I I 21-28 24-31 18-25 I/O T2(P1.0): Timer/Counter 2 external count input. T2EX(P1.1): Timer/Counter 2 trigger input. Port 2: Port 2 is an 8-bit bidirectional I/O port with internal pullups. Port 2 pins that have 1s written to them are pulled high by the internal pullups and can be used as inputs. As inputs, Port 2 pins that are externally pulled low will source current because of the internal pullups. (See DC Characteristics: IIL). Port 2 emits the high order address byte during fetches from external program memory and during accesses to external data memory that used 16-bit addresses (MOVX @ DPTR). In this application, Port 2 uses strong internal pullups when emitting 1s. During accesses to external data memory that use 8-bit addresses (MOVX @ Ri [i = 0, 1]), Port 2 emits the contents of the P2 Special Function Register. Port 2 also receives the high-order bits and some control signals during ROM verification. Integrated Circuit Solution Inc. MC006-0B 5 IC80LV52 IC80LV32 Table 1. Detailed Pin Description (continued) Symbol PDIP PLCC PQFP I/O Name and Function P3.0-P3.7 10-17 11, 13-19 5, 7-13 I/O Port 3: Port 3 is an 8-bit bidirectional I/O port with internal pullups. Port 3 pins that have 1s written to them are pulled high by the internal pullups and can be used as inputs. As inputs, Port 3 pins that are externally pulled low will source current because of the internal pullups. (See DC Characteristics: IIL). Port 3 also serves the special features of the IC80LV52/32, as listed below: 10 11 12 13 14 15 16 17 11 13 14 15 16 17 18 19 5 7 8 9 10 11 12 13 I O I I I I O O RxD (P3.0): Serial input port. TxD (P3.1): Serial output port. INT0 (P3.2): External interrupt 0. INT1 (P3.3): External interrupt 1. T0 (P3.4): Timer 0 external input. T1 (P3.5): Timer 1 external input. WR (P3.6): External data memory write strobe. RD (P3.7): External data memory read strobe. PSEN 29 32 26 O Program Store Enable: The read strobe to external program memory. When the device is executing code from the external program memory, PSEN is activated twice each machine cycle except that two PSEN activations are skipped during each access to external data memory. PSEN is not activated during fetches from internal program memory. RST 9 10 4 I Reset: A high on this pin for two machine cycles while the oscillator is running, resets the device. An internal MOS resistor to GND permits a power-on reset using only an external capacitor connected to Vcc. XTAL 1 19 21 15 I Crystal 1: Input to the inverting oscillator amplifier and input to the internal clock generator circuits. XTAL 2 18 20 14 O Crystal 2: Output from the inverting oscillator amplifier. GND 20 22 16 I Ground: 0V reference. Vcc 40 44 38 I Power Supply: This is the power supply voltage for operation. OPERATING DESCRIPTION The detail description of the IC80LV52/32 included in this description are: • Memory Map and Registers • Timer/Counters • Serial Interface • Interrupt System • Other Information The detail information desription of the IC80LV52/32 refer to IC80C52/32 data sheet 6 Integrated Circuit Solution Inc. MC006-0B IC80LV52 IC80LV32 OTHER INFORMATION Reset The reset input is the RST pin, which is the input to a Schmitt Trigger. A reset is accomplished by holding the RST pin high for at least two machine cycles (24 oscillator periods), while the oscillator is running. The CPU responds by generating an internal reset, with the timing shown in Figure 6. The external reset signal is asynchronous to the internal clock. The RST pin is sampled during State 5 Phase 2 of every machine cycle. The port pins will maintain their current activities for 19 oscillator periods after a logic 1 has been sampled at the RST pin; that is, for 19 to 31 oscillator periods after the external reset signal has been applied to the RST pin. The internal reset algorithm writes 0s to all the SFRs except the port latches, the Stack Pointer, and SBUF. The port latches are initialized to FFH, the Stack Pointer to 07H, and SBUF is indeterminate. Table 2 lists the SFRs and their reset values. Then internal RAM is not affected by reset. On power-up the RAM content is indeterminate. Integrated Circuit Solution Inc. MC006-0B Table 2. Reset Values of the SFR's SFR Name PC ACC Reset Value 0000H 00H B PSW SP DPTR P0-P3 IP IE TMOD TCON T2CON TH0 TL0 TH1 TL1 TH2 TL2 RCAP2H RCAP2L SCON SBUF PCON 00H 00H 07H 0000H FFH XX000000B 0X000000B 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H Indeterminate 0XXX0000B 7 IC80LV52 IC80LV32 Power-on Reset An automatic reset can be obtained when VCC goes through a 10µF capacitor and GND through an 8.2K resistor, providing the VCC rise time does not exceed 1 msec and the oscillator start-up time does not exceed 10 msec. This power-on reset circuit is shown in Figure 5. The CMOS devices do not require the 8.2K pulldown resistor, although its presence does no harm. Vcc 10 F + - Vcc IC80LV52/32 When power is turned on, the circuit holds the RST pin high for an amount of time that depends on the value of the capacitor and the rate at which it charges. To ensure a good reset, the RST pin must be high long enough to allow the oscillator time to start-up (normally a few msec) plus two machine cycles. RST 8.2K Ω Note that the port pins will be in a random state until the oscillator has start and the internal reset algorithm has written 1s to them. GND With this circuit, reducing VCC quickly to 0 causes the RST pin voltage to momentarily fall below 0V. However, this voltage is internally limited, and will not harm the device. Figure 5. Power-On Reset Circuit 12 OSC. PERIODS S5 S6 S1 S2 S3 S4 S5 S6 S1 S2 S3 S4 S5 S6 S1 S2 S3 S4 RST INTERNAL RESET SIGNAL SAMPLE SAMPLE RST RST ALE PSEN P0 INST ADDR INST 11 OSC. PERIODS ADDR INST ADDR INST ADDR INST ADDR 19 OSC. PERIODS Figure 6. Reset Timing 8 Integrated Circuit Solution Inc. MC006-0B IC80LV52 IC80LV32 Power-Saving Modes of Operation The IC80LV52/32 has two power-reducing modes. Idle and Power-down. The input through which backup power is supplied during these operations is Vcc. Figure 7 shows the internal circuitry which implements these features. In the Idle mode (IDL = 1), the oscillator continues to run and the Interrupt, Serial Port, and Timer blocks continue to be clocked, but the clock signal is gated off to the CPU. In Power-down (PD = 1), the oscillator is frozen. The Idle and Power-down modes are activated by setting bits in Special Function Register PCON. XTAL 1 XTAL 2 OSC INTERRUPT, SERIAL PORT, TIMER BLOCKS CLOCK GEN CPU PD IDL Idle Mode An instruction that sets PCON.0 is the last instruction executed before the Idle mode begins. In the Idle mode, the internal clock signal is gated off to the CPU, but not to the Interrupt, Timer, and Serial Port functions. The CPU status is preserved in its entirety: the Stack Pointer, Program Counter, Program Status Word, Accumulator, and all other registers maintain their data during Idle. The port pins hold the logical states they had at the time Idle was activated. ALE and PSEN hold at logic high levels. There are two ways to terminate the Idle. Activation of any enabled interrupt will cause PCON.0 to be cleared by hardware, terminating the Idle mode. The interrupt will be serviced, and following RETI the next instruction to be executed will be the one following the instruction that put the device into Idle. The flag bits GF0 and GF1 can be used to indicate whether an interrupt occurred during normal operation or during an Idle. For example, an instruction that activates Idle can also set one or both flag bits. When Idle is terminated by an interrupt, the interrupt service routine can examine the flag bits. The other way of terminating the Idle mode is with a hardware reset. Since the clock oscillator is still running, the hardware reset must be held active for only two machine cycles (24 oscillator periods) to complete the reset. Figure 7. Idle and Power-Down Hardware Power-down Mode An instruction that sets PCON.1 is the last instruction executed before Power-down mode begins. In the Powerdown mode, the on-chip oscillator stops. With the clock frozen, all functions are stopped, but the on-chip RAM and Special function Registers are held. The port pins output the values held by their respective SFRs. ALE and PSEN output lows. In the Power-down mode of operation, Vcc can be reduced to as low as 2V. However, Vcc must not be reduced before the Power-down mode is invoked, and Vcc must be restored to its normal operating level before the Power-down mode is terminated. The reset that terminates Power-down also frees the oscillator. The reset should not be activated before Vcc is restored to its normal operating level and must be held active long enough to allow the oscillator to restart and stabilize (normally less than 10 msec). The only exit from power-down is a hardware reset. Reset redefines all the SFRs but does not change the on-chip RAM. The signal at the RST pin clears the IDL bit directly and asynchronously. At this time, the CPU resumes program execution from where it left off; that is, at the instruction following the one that invoked the Idle Mode. As shown in Figure 22, two or three machine cycles of program execution may take place before the internal reset algorithm takes control. On-chip hardware inhibits access to the internal RAM during his time, but access to the port pins is not inhibited. To eliminate the possibility of unexpected outputs at the port pins, the instruction following the one that invokes Idle should not write to a port pin or to external data RAM. Integrated Circuit Solution Inc. MC006-0B 9 IC80LV52 IC80LV32 Table 3. Status of the External Pins During Idle and Power-down Modes. Mode Memory ALE PSEN PORT 0 PORT 1 PORT 2 PORT 3 Idle Internal 1 1 Data Data Data Data Idle External 1 1 Float Data Address Data Power-down Internal 0 0 Data Data Data Data Power-down External 0 0 Float Data Data Data On-Chip Oscillators The on-chip oscillator circuitry of the IC80LV52/32 is a single stage linear inverter, intended for use as a crystalcontrolled, positive reactance oscillator (Figure 8). In this application the crystal is operated in its fundamental response mode as an inductive reactance in parallel resonance with capacitance external to the crystal (Figure 8). Examples of how to drive the clock with external oscillator are shown in Figure 9. The crystal specifications and capacitance values (C1 and C2 in Figure 8) are not critical. 20 pF to 30 pF can be used in these positions at a12 MHz to 24 MHz frequency with good quality crystals. A ceramic resonator can be used in place of the crystal in cost-sensitive applications. When a ceramic resonator is used, C1 and C2 are normally selected to be of somewhat higher values. The manufacturer of the ceramic resonator should be consulted for recommendation on the values of these capacitors. C2 XTAL2 C1 XTAL1 XTAL2 NC EXTERNAL OSCILLATOR SIGNAL XTAL1 GND GND Figure 8. Oscillator Connections Figure 9. External Clock Drive Configuration Table 4. Recommended Value for C1, C2, R C1 C2 R 10 Frequency Range 4 MHz-24 MHz 30 MHz-40 MHz 20 pF-30 pF – 20 pF-30 pF – Not Apply – Integrated Circuit Solution Inc. MC006-0B IC80LV52 IC80LV32 ROM Verification The address of the program memory location to be read is applied to Port 1 and pins P2.4-P2.0. The other pins should be held at the “Verify” level are indicated in Figure 10. The contents of the addressed locations exits on Port 0. External pullups are required on Port 0 for this operation. Figure 10 shows the setup to verify the program memory. + 3..3V A7-A0 P1 A12-A8 P2.4-P2.0 1 RST 1 EA 1 ALE 0 PSEN 0 P2.7 0 P2.6 Vcc 10K x 8 P0 PGM DATA XTAL1 4-6 MHz XTAL2 GND Figure 10. ROM Verification Integrated Circuit Solution Inc. MC006-0B 11 IC80LV52 IC80LV32 ROM Lock System Encryption Array The program lock system, when programmed, protects the ROM code against software piracy. The IC80LV52/32 has a two-level program lock system (see Table 5) and a 32-byte encryption table. No matter what lock bit is, the user submits the encryption table with his or her code in verify ROM mode. Both the lock-bit and encryption array programmed by the factory. Within the ROM array are 32 bytes of Encryption Array that are initially unprogrammed (all 1's). Every time that a byte is addressed during verify, five address lines are used to select a byte of the Encryption Array.This byte is then exclusive-NOR'ed (XNOR) with the code byte, creating an Encryption verify byte. The algorithm, with the array in the unprogrammed state (all 1's), will return the code in its original, unmodified form. When using the encryption array, one important factor needs to be considered. If a code byte has the value 0FFH, verifying the byte will produce the encryption byte value. If a large block (> 32 bytes) of code is left unprogrammed, a verification routine will display the contents of the encryption array. For this reason, all unused code bytes should be programmed with some value other than 0FFH, and not all of them the same value. Table 5. Program Lock Bits 12 1 LB1 U LB2 U 2 P U 3 P P Protection Type No Program Lock Features enabled. (Code verify will still be encrypted by the Encryption Array if Programmed) MOVC instructions executed from external program memory are diabled form fetching code bytes from internal memory, EA is sampled and latched on Reset. Same as 2, also ROM verify is disabled. Integrated Circuit Solution Inc. MC006-0B IC80LV52 IC80LV32 ABSOLUTE MAXIMUM RATINGS(1) Symbol VTERM TBIAS TSTG PT Parameter Terminal Voltage with Respect to GND(2) Temperature Under Bias(3) Storage Temperature Power Dissipation Value –2.0 to +7.0 0 to +70 –65 to +125 1.5 Unit V °C °C W Note: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods less than 20 ns. Maximum DC voltage on output pins is Vcc + 0.5V which may overshoot to Vcc + 2.0V for periods less than 20 ns. 3. Operating temperature is for commercial products only defined by this specification. OPERATING RANGE(1) Range Commercial Ambient Temperature 0°C to +70°C VCC 3.3V ± 10% Oscillator Frequency 3.5 to 24 MHz Note: 1. Operating ranges define those limits between which the functionality of the device is guaranteed. Integrated Circuit Solution Inc. MC006-0B 13 IC80LV52 IC80LV32 DC CHARACTERISTICS (TA = 0°C to 70°C; Vcc = 3.3V ± 10%; GND = 0V) Symbol Parameter Test conditions Min Max Unit VIL Input low voltage (All except EA) –0.5 0.2Vcc + 0.1 V VIL1 Input low voltage (EA) –0.5 0.2Vcc + 0.1 V VIH Input high voltage (All except XTAL 1, RST) 0.2Vcc + 0.9 Vcc + 0.5 V VIH1 Input high voltage (XTAL 1) 0.7Vcc Vcc + 0.5 V VSCH+ RST positive schmitt-trigger threshold voltage 0.7Vcc Vcc + 0.5 V VSCH– RST negative schmitt-trigger threshold voltage 0 0.3Vcc V Vol(1) Output low voltage IOL = 1.6 mA — 0.45 V IOL = 3.2 mA — 0.45 V (Ports 1, 2, 3) (1) VOL1 Output low voltage (Port 0, ALE, PSEN) VOH Output high voltage (Ports 1, 2, 3, ALE, PSEN) IOH = –20 µA Vcc–0.9 — V VOH1 Output high voltage (Port 0, ALE, PSEN) IOH = –800 µA Vcc–0.9 — V IIL Logical 0 input current (Ports 1, 2, 3) VIN = 0.45V — –50 µA ILI Input leakage current (Port 0) 0.45V < VIN < Vcc –5 5 µA ITL Logical 1-to-0 transition current (Ports 1, 2, 3) VIN = 2.0V — –450 µA 150 450 KΩ RRST RST pulldown resister Note: 1. Under steady state (non-transient) conditions, Iol must be externally limited as follows: Maximum IOL per port pin: 10 mA Maximum IOL per 8-bit port Port 0: 26 mA Ports 1, 2, 3: 15 mA Maximum total IOL for all output pins: 71 mA If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink greater than the listed test conditions. 14 Integrated Circuit Solution Inc. MC006-0B IC80LV52 IC80LV32 POWER SUPPLY CHARACTERISTICS Symbol Parameter Test conditions (1) Icc Min Max Unit Power supply current Vcc = 3.3V Active mode 12 MHz — 15 mA 24 MHz — 24 mA Idle mode 12 MHz — 4 mA 24 MHz — 8 mA Power-down mode VCC = 3.3V — 50 µA Note: 1. See Figures 11, 12, 13, and 14 for Icc test conditiions. Vcc Vcc Vcc Icc Icc RST RST Vcc Vcc Vcc Vcc NC XTAL2 CLOCK SIGNAL XTAL1 GND P0 EA NC XTAL2 CLOCK SIGNAL XTAL1 GND Figure 11. Active Mode P0 EA Figure 12. Idle Mode Vcc Icc RST Vcc Vcc NC XTAL2 P0 XTAL1 GND EA Figure 13. Power-down Mode Integrated Circuit Solution Inc. MC006-0B 15 IC80LV52 IC80LV32 tCLCX Vcc — 0.5V 0.45V tCHCX 0.7Vcc 0.2Vcc — 0.1 tCHCL tCLCH tCLCL Figure 14. Clock Signal Waveform for Icc Tests in Active and Idle Modes. (tCLCH=t CHCL=5 ns) AC CHARACTERISTICS (TA = 0°C to 70°C; Vcc = 3.3V ± 10%; GND = 0V; Cl for Port 0, ALE and PSEN Outputs = 100 pF; Cl for other outputs = 80 pF) EXTERNAL MEMORY CHARACTERISTICS Symbol 1/tCLCL tLHLL tAVLL tLLAX tLLIV tLLPL tPLPH tPLIV tPXIX tPXIZ tAVIV tPLAZ tRLRH tWLWH tRLDV tRHDX tRHDZ tLLDV tAVDV tLLWL tAVWL tQVWX tWHQX tRLAZ tWHLH 16 Parameter Oscillator frequency ALE pulse width Address valid to ALE low Address hold after ALE low ALE low to valid instr in ALE low to PSEN low PSEN pulse width PSEN low to valid instr in Input instr hold after PSEN Input instr float after PSEN Address to valid instr in PSEN low to address float RD pulse width WR pulse width RD low to valid data in Data hold after RD Data float after RD ALE low to valid data in Address to valid data in ALE low to RD or WR low Address to RD or WR low Data valid to WR transition Data hold after WR RD low to address float RD or WR high to ALE high 12 MHz Clock Min Max — — 152 — 68 — 73 — — 313 73 — 235 — — 230 0 — — 78 — 397 — 10 480 — 480 — — 323 0 — — 162 — 573 — 656 230 270 313 — 68 — 73 — — 0 68 98 24 MHz Clock Min Max — — 68 — 26 — 31 — — 147 31 — 110 — — 105 0 — — 37 — 188 — 10 230 — 230 — — 157 0 — — 78 — 282 — 323 105 145 146 — 26 — 31 — — 0 26 57 Variable Oscillator (3.5-24 MHz) Min Max 3.5 24 2tCLCL–15 — tCLCL–15 — tCLCL–10 — — 4tCLCL–20 tCLCL–10 — 3tCLCL–15 — — 3tCLCL–20 0 — — tCLCL–5 — 5tCLCL–20 — 10 6tCLCL–20 — 6tCLCL–20 — — 4tCLCL–10 0 — — 2tCLCL–5 — 7tCLCL–10 — 8tCLCL–10 3tCLCL–20 3tCLCL+20 4tCLCL–20 — tCLCL–15 — tCLCL–10 — — 0 tCLCL–15 tCLCL+15 Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Integrated Circuit Solution Inc. MC006-0B IC80LV52 IC80LV32 EXTERNAL MEMORY CHARACTERISTICS (CONTINUED) Symbol tXLXL tQVXH tXHQX tXHDX tXHDV Parameter Serial port clock cycle time Output data setup to clock rising edge Output data hold after clock rising edge Input data hold after clock rising edge Clock rising edge to input data valid 12 MHz Clock Min Max 990 1010 823 — 24 MHz Clock Min Max 290 310 240 — Variable Oscillator (3.5-24 MHz) Min Max 12tCLCL–10 12tCLCL+10 10tCLCL–10 — 157 — 40 — 2tCLCL–10 — ns 0 — 0 — 0 — ns — 833 — 250 — 10tCLCL ns Min 3.5 10 10 — — Max 40 — — 10 10 Unit MHz ns ns ns ns Min 4 — — 0 Max 6 48tCLCL 48tCLCL 48tCLCL Unit MHz Unit ns ns EXTERNAL CLOCK DRIVE Symbol 1/tCLCL tCHCX tCLCX tCLCH tCHCL wParameter Oscillator Frequency High time Low time Rise time Fall time ROM VERIFICATION CHARACTERISTICS Symbol 1/tCLCL tAVQV tELQV tEHQZ Parameter Oscillator Frequency Address to data valid ENABLE low to data valid Data float after ENABLE Integrated Circuit Solution Inc. MC006-0B 17 IC80LV52 IC80LV32 TIMING WAVEFORMS tLHLL ALE tLLPL tPLPH tPLIV tAVLL PSEN tPLAZ tLLAX PORT 0 A7-A0 tPXIX tPXIZ INSTR IN A7-A0 tLLIV tAVIV PORT 2 A15-A8 A15-A8 Figure 15. External Program Memory Read Cycle ALE tWHLH PSEN tLLDV tLLWL RD PORT 0 tAVLL tRLAZ tLLAX tRLRH tRLDV A7-A0 FROM RI OR DPL tRHDZ tRHDX DATA IN A7-A0 FROM PCL INSTR IN tAVWL tAVDV PORT 2 A15-A8 FROM DPH A15-A8 FROM PCH Figure 16. External Data Memory Read Cycle 18 Integrated Circuit Solution Inc. MC006-0B IC80LV52 IC80LV32 ALE tWHLH PSEN tLLWL WR tWLWH tAVLL PORT 0 tWHQX tQVWX tLLAX A7-A0 FROM RI OR DPL DATA OUT A7-A0 FROM PCL INSTR IN tAVWL PORT 2 A15-A8 FROM DPH A15-A8 FROM PCH Figure 17. External Data Memory Write Cycle INSTRUCTION 0 1 2 3 4 5 6 7 8 ALE tXLXL CLOCK tXHQX tQVXH 0 DATAOUT 1 VALID 3 4 5 6 tXHDX tXHDV DATAIN 2 VALID VALID 7 SET TI VALID VALID VALID VALID VALID SET RI Figure 18. Shift Register Mode Timing Waveform Integrated Circuit Solution Inc. MC006-0B 19 IC80LV52 IC80LV32 tCLCX Vcc — 0.5V 0.45V tCHCX 0.7Vcc 0.2Vcc — 0.1 tCHCL tCLCH tCLCL Figure 19. External Clock Drive Waveform P1.0-P1.7 P2.0-P2.3 ADDRESS PORT 0 DATA OUT tAVQV tELQV tEHQZ P2.7 Figure 20. ROM Verification Waveforms Vcc - 0.5V 0.45V 0.2Vcc + 0.9V 0.2Vcc - 0.1V Figure 21. AC Test Point Note: 1. AC inputs during testing are driven at VCC – 0.5V for logic “1” and 0.45V for logic “0”. Timing measurements are made at VIH min for logic “1” and max for logic “0”. 20 Integrated Circuit Solution Inc. MC006-0B IC80LV52 IC80LV32 ORDERING INFORMATION COMMERCIAL TEMPERATURE: 0°C to +70°C Speed 24 MHz 24 MHz Order Part Number IC80LV52-24PL IC80LV52-24PQ IC80LV52-24W IC80LV32-24PL IC80LV32-24PQ IC80LV32-24W Package PLCC PQFP 600mil DIP PLCC PQFP 600mil DIP Integrated Circuit Solution Inc. HEADQUARTER: NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN, R.O.C. TEL: 886-3-5780333 Fax: 886-3-5783000 BRANCH OFFICE: 7F, NO. 106, SEC. 1, HSIN-TAI 5TH ROAD, HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C. TEL: 886-2-26962140 FAX: 886-2-26962252 http://www.icsi.com.tw Integrated Circuit Solution Inc. MC006-0B 21 IC80LV52 IC80LV32 22 Integrated Circuit Solution Inc. MC006-0B