AD ADSP-TS202S Tigersharc embedded processor Datasheet

TigerSHARC®
Embedded Processor
ADSP-TS202S
Preliminary Technical Data
KEY FEATURES
KEY BENEFITS
500 MHz, 2.0 ns Instruction Cycle Rate
12M Bits of Internal—On-Chip—DRAM Memory
25×25 mm (576-Ball) Thermally Enhanced Ball Grid Array
Package
Dual Computation Blocks—Each Containing an ALU, a Multiplier, a Shifter, and a Register File
Dual Integer ALUs, providing Data Addressing and Pointer
Manipulation
Integrated I/O Includes 14 Channel DMA Controller, External
Port, Four Link Ports, SDRAM Controller, Programmable
Flag Pins, Two Timers, and Timer Expired Pin for System
Integration
1149.1 IEEE Compliant JTAG Test Access Port for On-Chip
Emulation
On-Chip Arbitration for Glueless Multiprocessing
Provides High-Performance Static Superscalar DSP Operations, Optimized for Large, Demanding Multiprocessor
DSP Applications
Performs Exceptionally Well on DSP Algorithm and I/O
Benchmarks (See Benchmarks in Table 1)
Supports Low-Overhead DMA Transfers Between Internal
Memory, External Memory, Memory-Mapped Peripherals,
Link Ports, Host Processors, and Other (Multiprocessor)
DSPs
Eases DSP Programming Through Extremely Flexible Instruction Set and High-Level-Language Friendly DSP
Architecture
Enables Scalable Multiprocessing Systems With Low Communications Overhead
DATA ADDRESS GENERATION
INTEGER
J ALU
32
32X32
4xCROSSBAR CONNECT
A
32
J-BUS DATA
128
A
D
A
D
A
D
32
I-BUS DATA
128
32
S-BUS ADDR
T
128
128
128
DAB
DAB
Y
REGISTER
FILE
32x32
SHIFTER
128
ALU
S-BUS DATA 128
MULTIPLIER
MULTIPLIER
SOC INTERFACE
I-BUS ADDR
X
REGISTER
FILE
32x32
64
MULTI
PROC
DATA
SDRAM
CTRL
128
SHIFTER
IAB
D
EXTERNAL
PORT
32
ADDR
HOST
32
K-BUS DATA
ALU
PC
JTAG
(PAGE CACHE)
K-BUS ADDR
BTB
6
MEMORY BLOCKS
J-BUS ADDR
JTAG PORT
SOC BUS
12M BITS INTERNAL MEMORY
INTEGER
K ALU
32X32
PROGRAM
SEQUENCER
ADDR
FETCH
32
C-BUS
ARB
8
CTRL
10
CTRL
EXT DMA
REQ 4
DMA
LINK PORTS
4
8
IN
L0
4
OUT 8
4
8
IN
L1
4
OUT 8
4
8
IN
L2
4
OUT 8
4
8
IN
L3
4
OUT 8
COMPUTATIONAL BLOCKS
Figure 1. Functional block diagram
TigerSHARC and the TigerSHARC logo are registered trademarks of Analog Devices, Inc.
Rev. PrB
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O.Box 9106, Norwood, MA 02062-9106 U.S.A.
Tel:781/329-4700
www.analog.com
Fax:781/326-8703
© 2003 Analog Devices, Inc. All rights reserved.
ADSP-TS202S
Preliminary Technical Data
TABLE OF CONTENTS
General Description ................................................. 3
Pin Function Descriptions ........................................ 12
Dual Compute Blocks ............................................ 4
Strap Pin Function Descriptions ................................ 19
Data Alignment Buffer (DAB) .................................. 4
ADSP-TS202S—Specifications ................................... 21
Dual Integer ALU (IALU) ....................................... 4
Recommended Operating Conditions ...................... 21
Program Sequencer ............................................... 5
Electrical Characteristics ....................................... 21
Interrupt Controller ........................................... 5
Absolute Maximum Ratings ................................... 22
Flexible Instruction Set ........................................ 5
ESD Sensitivity ................................................... 22
DSP Memory ....................................................... 5
Timing Specifications ........................................... 23
External Port (Off-Chip Memory/Peripherals Interface) . 5
General AC Timing .......................................... 23
Host Interface ................................................... 6
Multiprocessor Interface ...................................... 7
Link Port Low-Voltage, Differential-Signal (LVDS)
Electrical Characteristics and Timing ................. 27
SDRAM Controller ............................................ 7
Link Port—Data Out Timing ........................... 28
EPROM Interface .............................................. 7
Link Port—Data In Timing .............................. 31
DMA Controller ................................................... 7
Output Drive Currents ......................................... 32
Link Ports (LVDS) ................................................ 8
Test Conditions .................................................. 33
Timer and General-Purpose I/O ............................... 9
Output Disable Time ......................................... 33
Reset and Booting ................................................. 9
Output Enable Time ......................................... 34
Clock Domains .................................................... 9
Capacitive Loading ........................................... 34
Power Domains .................................................... 9
Environmental Conditions .................................... 36
Filtering Reference Voltage and Clocks ...................... 9
Thermal Characteristics ..................................... 36
Development Tools ............................................. 10
576-Ball BGA_ED Pin Configurations ......................... 36
Designing an Emulator-Compatible DSP Board (Target) 11
Outline Dimensions ................................................ 40
Additional Information ........................................ 11
Ordering Guide ..................................................... 40
REVISION HISTORY
Revision PrB:
• Applies corrections and additional information to VREF
Filtering Scheme (page 9), SCLK_VREF filtering scheme
(page 10), Drive Strength/Output Impedance Selection
(page 18), Recommended Operating Conditions
(page 21), Electrical Characteristics (page 21), Power-Up
Reset Timing (page 23), AC Signal Specifications
(page 25), Link Port—Data Out Timing (page 28), Link
Port—Data In Timing (page 31), and Ordering Guide
(page 40).
• Provides unused pin termination data in Pin Function
Descriptions (page 12).
• Changes pins R2 and R3 to NC in 576-Ball (25 mm × 25
mm) BGA_ED Pin Assignments (page 37).
Rev. PrB
| Page 2 of 40 |
December 2003
Preliminary Technical Data
ADSP-TS202S
GENERAL DESCRIPTION
The ADSP-TS202S TigerSHARC processor is an ultra-high performance, static superscalar processor optimized for large signal
processing tasks and communications infrastructure. The DSP
combines very wide memory widths with dual computation
blocks—supporting 32- and 40-bit floating-point and supporting 8-, 16-, 32-, and 64-bit fixed-point processing—to set a new
standard of performance for digital signal processors. The
TigerSHARC static superscalar architecture lets the DSP execute up to four instructions each cycle, performing twenty-four
16-bit fixed-point operations or six floating-point operations.
Four independent 128-bit wide internal data buses, each connecting to the six 2M bit memory banks, enable quad-word
data, instruction, and I/O accesses and provide 28G bytes per
second of internal memory bandwidth. Operating at 500 MHz,
the ADSP-TS202S processor’s core has a 2.0 ns instruction cycle
time. Using its Single-Instruction, Multiple-Data (SIMD) features, the ADSP-TS202S processor can perform four billion 40bit MACs or one billion 80-bit MACs per second. Table 1 shows
the DSP’s performance benchmarks.
• Four 128-bit internal data buses, each connecting to the six
2M bit memory banks
• On-chip DRAM (12M bit)
• An external port that provides the interface to host processors, multiprocessing space (DSPs), off-chip memorymapped peripherals, and external SRAM and SDRAM
• A 14 channel DMA controller
• Four full-duplex LVDS link ports
• Two 64-bit interval timers and timer expired pin
• A 1149.1 IEEE compliant JTAG test access port for on-chip
emulation
Figure 2 on page 3 shows a typical single-processor system with
external SRAM and SDRAM. Figure 4 on page 8 shows a typical
multiprocessor system.
ADSP-TS202S
RST_IN
POR_IN
CLOCK
REFERENCE
SCLK_VREF
REFERENCE
VREF
SDRAM
MEMORY
(OPTIONAL)
CLK
CS
ADDR RAS
DATA CAS
DQM
• A program sequencer with Instruction Alignment Buffer
(IAB) and Branch Target Buffer (BTB)
• An interrupt controller that supports hardware and software interrupts, supports level- or edge-triggers, and
supports prioritized, nested interrupts
Rev. PrB
| Page 3 of 40 |
DATA63–0
DATA
RD
ID2–0
MSSD3–0
WRH/WRL
ACK
MS1–0
OE
WE
ACK
CS
CAS
LDQM
HDQM
MSH
HBR
HBG
BOFF
HOST
PROCESSOR
INTERFACE
(OPTIONAL)
A10
SDA10
BR7–0
IORD
CPA
IOWR
DPA
IOEN
LxDATO3–0P/N
LxCLKOUTP/N
DMAR3–0
LxACKI
ADDR
LxBCMPO
DATA
DATA
DMA DEVICE
(OPTIONAL)
DATA
LxDATI3–0P/N
LxCLKINP/N
LxACKO
LxBCMPI
CONTROLIMP1–0 BM
BUSLOCK
TMR0E
DS2–0
JTAG
The Functional Block Diagram on page 1 shows the ADSPTS202S processor’s architectural blocks. These blocks include:
• Dual integer ALUs (IALUs), each with its own 31-word
register file for data addressing and a status register
ADDR
SDWE
SDCKE
LINK
DEVICES
(4 MAX)
(OPTIONAL)
• Dual compute blocks, each consisting of an ALU, multiplier, 64-bit shifter, and 32-word register file and associated
Data Alignment Buffers (DABs)
MEMORY
(OPTIONAL)
ADDR31–0
FLAG3–0
RAS
DATA
BRST
WE
CKE
Cache preloaded
The ADSP-TS202S processor is code-compatible with the other
TigerSHARC processors.
IRQ3–0
CS
ADDR
ADDRESS
Clock
Cycles
32-bit Algorithm, one billion MACs/s peak performance
18.8 µs
9419
1K Point Complex FFT1 (Radix2)
1
64K Point Complex FFT (Radix2)
2.8 ms
1397544
FIR Filter (per real tap)
1 ns
0.5
[8 × 8][8 × 8] Matrix Multiply (Complex, 2.8 µs
1399
Floating-point)
16-bit Algorithm, four billion MACs/s peak performance
256 Point Complex FFT1 (Radix 2)
1.9 µs
928
I/O DMA Transfer Rate
External port
1G bytes/s
n/a
Link ports (each)
1G bytes/s
n/a
1
Speed
BMS
SCLK
SCLKRAT2–0
CONTROL
Benchmark
BOOT
EPROM
(OPTIONAL)
RST_OUT
Table 1. General Purpose Algorithm Benchmarks
at 500 MHz
Figure 2. ADSP-TS202S Single-Processor System With External SDRAM
The TigerSHARC DSP uses a Static Superscalar* architecture.
This architecture is superscalar in that the ADSP-TS202S processor’s core can execute simultaneously from one to four 32-bit
instructions encoded in a Very Large Instruction Word (VLIW)
instruction line using the DSP’s dual compute blocks. Because
*
Static Superscalar™ is a trademark of Analog Devices, Inc.
December 2003
ADSP-TS202S
Preliminary Technical Data
the DSP does not perform instruction re-ordering at runtime—
the programmer selects which operations will execute in parallel
prior to runtime—the order of instructions is static.
With few exceptions, an instruction line, whether it contains
one, two, three, or four 32-bit instructions, executes with a
throughput of one cycle in a ten-deep processor pipeline.
For optimal DSP program execution, programmers must follow
the DSP’s set of instruction parallelism rules when encoding an
instruction line. In general, the selection of instructions that the
DSP can execute in parallel each cycle depends on the instruction line resources each instruction requires and on the source
and destination registers used in the instructions. The programmer has direct control of three core components—the IALUs,
the compute blocks, and the program sequencer.
The ADSP-TS202S processor, in most cases, has a two-cycle
execution pipeline that is fully interlocked, so—whenever a
computation result is unavailable for another operation dependent on it—the DSP automatically inserts one or more stall
cycles as needed. Efficient programming with dependency-free
instructions can eliminate most computational and memory
transfer data dependencies.
In addition, the ADSP-TS202S processor supports SIMD operations two ways—SIMD compute blocks and SIMD
computations. The programmer can load both compute blocks
with the same data (broadcast distribution) or different data
(merged distribution).
Using these features, the compute blocks can:
• Provide 8 MACs per cycle peak and 7.1 MACs per cycle
sustained 16-bit performance and provide 2 MACs per
cycle peak and 1.8 MACs per cycle sustained 32-bit performance (based on FIR)
• Execute six single-precision floating-point or execute
twenty-four 16-bit fixed-point operations per cycle, providing 3 GFLOPS or 12.0 GOPS performance
• Perform two complex 16-bit MACs per cycle
DATA ALIGNMENT BUFFER (DAB)
The DAB is a quad-word FIFO that enables loading of quadword data from nonaligned addresses. Normally, load instructions must be aligned to their data size so that quad words are
loaded from a quad-aligned address. Using the DAB significantly improves the efficiency of some applications, such as FIR
filters.
DUAL INTEGER ALU (IALU)
The ADSP-TS202S processor has two IALUs that provide powerful address generation capabilities and perform many generalpurpose integer operations. The IALUs are referred to as J and
K in assembly syntax and have the following features:
• Provides memory addresses for data and update pointers
• Supports circular buffering and bit-reverse addressing
• Performs general-purpose integer operations, increasing
programming flexibility
DUAL COMPUTE BLOCKS
The ADSP-TS202S processor has compute blocks that can execute computations either independently or together as a SingleInstruction, Multiple-Data (SIMD) engine. The DSP can issue
up to two compute instructions per compute block each cycle,
instructing the ALU, multiplier, or shifter to perform independent, simultaneous operations. Each compute block can execute
eight 8-bit, four 16-bit, two 32-bit, or one 64-bit SIMD computations in parallel with the operation in the other block.
The compute blocks are referred to as X and Y in assembly syntax, and each block contains three computational units—an
ALU, a multiplier, a 64-bit shifter—and a 32-word register file.
• Register File—Each Compute Block has a multiported 32word, fully orthogonal register file used for transferring
data between the computation units and data buses and for
storing intermediate results. Instructions can access the
registers in the register file individually (word-aligned), in
sets of two (dual-aligned), or in sets of four (quad-aligned).
• ALU—The ALU performs a standard set of arithmetic
operations in both fixed- and floating-point formats. It also
performs logic and PERMUTE operations.
• Multiplier—The multiplier performs both fixed- and floating-point multiplication and fixed-point multiply and
accumulate.
• Includes a 31-word register file for each IALU
As address generators, the IALUs perform immediate or indirect (pre- and post-modify) addressing. They perform modulus
and bit-reverse operations with no constraints placed on memory addresses for the modulus data buffer placement. Each
IALU can specify either a single-, dual-, or quad-word access
from memory.
The IALUs have hardware support for circular buffers, bit
reverse, and zero-overhead looping. Circular buffers facilitate
efficient programming of delay lines and other data structures
required in digital signal processing, and they are commonly
used in digital filters and Fourier transforms. Each IALU provides registers for four circular buffers, so applications can set
up a total of eight circular buffers. The IALUs handle address
pointer wraparound automatically, reducing overhead, increasing performance, and simplifying implementation. Circular
buffers can start and end at any memory location.
Because the IALU’s computational pipeline is one cycle deep, in
most cases integer results are available in the next cycle. Hardware (register dependency check) causes a stall if a result is
unavailable in a given cycle.
• Shifter—The 64-bit shifter performs logical and arithmetic
shifts, bit and bitstream manipulation, and field deposit
and extraction operations.
Rev. PrB
| Page 4 of 40 |
December 2003
Preliminary Technical Data
ADSP-TS202S
PROGRAM SEQUENCER
The ADSP-TS202S processor’s program sequencer supports the
following:
• A fully interruptible programming model with flexible programming in assembly and C/C++ languages; handles
hardware interrupts with high throughput and no aborted
instruction cycles
• A ten-cycle instruction pipeline—four-cycle fetch pipe and
six-cycle execution pipe—computation results available
two cycles after operands are available
• Supply of instruction fetch memory addresses; the
sequencer’s Instruction Alignment Buffer (IAB) caches up
to five fetched instruction lines waiting to execute; the program sequencer extracts an instruction line from the IAB
and distributes it to the appropriate core component for
execution
• Management of program structures and program flow
determined according to JUMP, CALL, RTI, RTS instructions, loop structures, conditions, interrupts, and software
exceptions
• Branch prediction and a 128-entry branch target buffer
(BTB) to reduce branch delays for efficient execution of
conditional and unconditional branch instructions and
zero-overhead looping; correctly predicted branches that
are taken occur with zero overhead cycles, overcoming the
five-to-nine stage branch penalty
• Compact code without the requirement to align code in
memory; the IAB handles alignment
Interrupt Controller
The DSP supports nested and nonnested interrupts. Each interrupt type has a register in the interrupt vector table. Also, each
has a bit in both the interrupt latch register and the interrupt
mask register. All interrupts are fixed as either level-sensitive or
edge-sensitive, except the IRQ3–0 hardware interrupts, which
are programmable.
The DSP distinguishes between hardware interrupts and software exceptions, handling them differently. When a software
exception occurs, the DSP aborts all other instructions in the
instruction pipe. When a hardware interrupt occurs, the DSP
continues to execute instructions already in the instruction pipe.
Flexible Instruction Set
The 128-bit instruction line, which can contain up to four 32-bit
instructions, accommodates a variety of parallel operations for
concise programming. For example, one instruction line can
direct the DSP to conditionally execute a multiply, an add, and a
subtract in both computation blocks while it also branches to
another location in the program. Some key features of the
instruction set include:
• Algebraic assembly language syntax
• Direct support for all DSP, imaging, and video arithmetic
types
Rev. PrB
| Page 5 of 40 |
• Eliminates toggling DSP hardware modes because modes
are supported as options (for example, rounding, saturation, and others) within instructions
• Branch prediction encoded in instruction; enables zerooverhead loops
• Parallelism encoded in instruction line
• Conditional execution optional for all instructions
• User defined partitioning between program and data
memory
DSP MEMORY
The DSP’s internal and external memory is organized into a
unified memory map, which defines the location (address) of all
elements in the system, as shown in Figure 3.
The memory map is divided into four memory areas—host
space, external memory, multiprocessor space, and internal
memory—and each memory space, except host memory, is subdivided into smaller memory spaces.
The ADSP-TS202S processor internal memory has 12M bits of
on-chip DRAM memory, divided into six blocks of 2M bits
(64K words × 32 bits). Each block—M0, M2, M4, M6, M8, and
M10—can store program, data, or both, so applications can
configure memory to suit specific needs. Placing program
instructions and data in different memory blocks, however,
enables the DSP to access data while performing an instruction
fetch. Each memory segment contains a 128K bit cache to
enable single cycle accesses to internal DRAM.
The six internal memory blocks connect to the four 128-bit wide
internal buses through a crossbar connection, enabling the DSP
to perform four memory transfers in the same cycle. The DSP’s
internal bus architecture provides a total memory bandwidth of
28G bytes per second, enabling the core and I/O to access eight
32-bit data words and four 32-bit instructions each cycle. The
DSP’s flexible memory structure enables:
• DSP core and I/O accesses to different memory blocks in
the same cycle
• DSP core access to three memory blocks in parallel—one
instruction and two data accesses
• Programmable partitioning of program and data memory
• Program access of all memory as 32-, 64-, or 128-bit
words—16-bit words with the DAB
EXTERNAL PORT (OFF-CHIP
MEMORY/PERIPHERALS INTERFACE)
The ADSP-TS202S processor’s external port provides the DSP’s
interface to off-chip memory and peripherals. The 4G word
address space is included in the DSP’s unified address space.
The separate on-chip buses—four 128-bit data buses and four
32-bit address buses—are multiplexed at the SOC interface and
transferred to the external port over the SOC bus to create an
external system bus transaction. The external system bus provides a single 64-bit data bus and a single 32-bit address bus.
The external port supports data transfer rates of 1G bytes per
second over the external bus.
December 2003
ADSP-TS202S
Preliminary Technical Data
GLOBAL SPACE
0xFFFFFFFF
HOST (MSH)
0x80000000
RESERVED
0x74000000
MSSD BANK 3 (MSSD3)
0x70000000
RESERVED
EXTERNAL MEMORY SPACE
INTERNAL SPACE
0x03FFFFFF
RESERVED
0x64000000
MSSD BANK 2 (MSSD2)
0x60000000
RESERVED
0x54000000
MSSD BANK 1 (MSSD1)
0x50000000
RESERVED
0x44000000
MSSD BANK 0 (MSSD0)
0x40000000
BANK 1 (MS1)
0x001F03FF
SOC REGISTERS (UREGS)
0x38000000
0X001F0000
BANK 0 (MS0)
RESERVED
0x001E03FF
RESERVED
INTERNAL MEMO RY BL OCK 10
0x30000000
MULTIPROCESSOR MEMO RY SPACE
INTERNAL REGISTERS (UREG S)
0X001E0000
0x0014FFFF
0x00140000
RESERVED
0x0010FFFF
INTERNAL MEMO RY BLOCK 8
RESERVED
INTERNAL MEMORY BLOCK 6
RESERVED
INTERNAL MEMORY BLOCK 4
RESERVED
0x00100000
0x000CFFFF
0x000C0000
0x0008FFFF
0x00080000
PROCESSOR ID 7
0x2C000000
PROCESSOR ID 6
0x28000000
PROCESSOR ID 5
0x24000000
PROCESSOR ID 4
0x20000000
PROCESSOR ID 3
0x1C000000
EACH IS A COPY
OF INTERNAL SPACE
PROCESSOR ID 2
0x18000000
PROCESSOR ID 1
0x14000000
PROCESSOR ID 0
0x10000000
BROADCAST
0X0C000000
0x0004FFFF
INTERNAL MEMORY BLOCK 2
RESERVED
0x00040000
RESERVED
0x03FFFFFF
0x0000FFFF
INTERNAL MEMORY
INTERNAL MEMORY BLOCK 0
0x00000000
0x00000000
Figure 3. ADSP-TS202S Memory Map
The external bus can be configured for 32- or 64-bit, littleendian operations. When the system bus is configured for 64-bit
operations, the lower 32 bits of the external data bus connect to
even addresses, and the upper 32 bits connect to odd addresses.
The external port supports pipelined, slow, and SDRAM protocols. Addressing of external memory devices and memorymapped peripherals is facilitated by on-chip decoding of highorder address lines to generate memory bank select signals.
The ADSP-TS202S processor provides programmable memory,
pipeline depth, and idle cycle for synchronous accesses, and
external acknowledge controls to support interfacing to pipelined or slow devices, host processors, and other memorymapped peripherals with variable access, hold, and disable time
requirements.
Rev. PrB
| Page 6 of 40 |
Host Interface
The ADSP-TS202S processor provides an easy and configurable
interface between its external bus and host processors through
the external port. To accommodate a variety of host processors,
the host interface supports pipelined or slow protocols for
ADSP-TS202S processor accesses of the host as slave or pipelined for host accesses of the ADSP-TS202S processor as slave.
Each protocol has programmable transmission parameters,
such as idle cycles, pipe depth, and internal wait cycles.
The host interface supports burst transactions initiated by a host
processor. After the host issues the starting address of the burst
and asserts the BRST signal, the DSP increments the address
internally while the host continues to assert BRST.
The host interface provides a deadlock recovery mechanism that
enables a host to recover from deadlock situations involving the
DSP. The BOFF signal provides the deadlock recovery mecha-
December 2003
Preliminary Technical Data
ADSP-TS202S
nism. When the host asserts BOFF, the DSP backs off the
current transaction and asserts HBG and relinquishes the external bus.
The host can directly read or write the internal memory of the
ADSP-TS202S processor, and it can access most of the DSP registers, including DMA control (TCB) registers. Vector
interrupts support efficient execution of host commands.
Multiprocessor Interface
The ADSP-TS202S processor offers powerful features tailored
to multiprocessing DSP systems through the external port and
link ports. This multiprocessing capability provides highest
bandwidth for interprocessor communication, including:
• Up to eight DSPs on a common bus
• On-chip arbitration for glueless multiprocessing
• Link ports for point to point communication
The external port and link ports provide integrated, glueless
multiprocessing support.
The external port supports a unified address space (see Figure 3)
that enables direct interprocessor accesses of each ADSPTS202S processor’s internal memory and registers. The DSP’s
on-chip distributed bus arbitration logic provides simple, glueless connection for systems containing up to eight ADSPTS202S processors and a host processor. Bus arbitration has a
rotating priority. Bus lock supports indivisible read-modifywrite sequences for semaphores. A bus fairness feature prevents
one DSP from holding the external bus too long.
The DSP’s four link ports provide a second path for interprocessor communications with throughput of 4G bytes per second.
The cluster bus provides 1G bytes per second throughput—with
a total of 4G bytes per second interprocessor bandwidth (limited by SOC bandwidth).
SDRAM Controller
The SDRAM controller controls the ADSP-TS202S processor’s
transfers of data to and from external synchronous DRAM
(SDRAM) at a throughput of 32 or 64 bits per SCLK cycle using
the external port and SDRAM control pins.
The SDRAM interface provides a glueless interface with standard SDRAMs—16M bit, 64M bit, 128M bit, and 256M bit. The
DSP supports directly a maximum of four banks of
64M words × 32 bit of SDRAM. The SDRAM interface is
mapped in external memory in each DSP’s unified memory
map.
EPROM Interface
The ADSP-TS202S processor can be configured to boot from an
external 8-bit EPROM at reset through the external port. An
automatic process (which follows reset) loads a program from
the EPROM into internal memory. This process uses sixteen
wait cycles for each read access. During booting, the BMS pin
functions as the EPROM chip select signal. The EPROM boot
procedure uses DMA channel 0, which packs the bytes into 32bit instructions. Applications can also access the EPROM (write
flash memories) during normal operation through DMA.
Rev. PrB
| Page 7 of 40 |
The EPROM or Flash Memory interface is not mapped in the
DSP’s unified memory map. It is a byte address space limited to
a maximum of 16M bytes (twenty-four address bits). The
EPROM or Flash Memory interface can be used after boot via a
DMA.
DMA CONTROLLER
The ADSP-TS202S processor’s on-chip DMA controller, with
14 DMA channels, provides zero-overhead data transfers without processor intervention. The DMA controller operates
independently and invisibly to the DSP’s core, enabling DMA
operations to occur while the DSP’s core continues to execute
program instructions.
The DMA controller performs DMA transfers between internal
memory and external memory and memory-mapped peripherals, the internal memory of other DSPs on a common bus, a host
processor, or link port I/O; between external memory and external peripherals or link port I/O; and between an external bus
master and internal memory or link port I/O. The DMA controller performs the following DMA operations:
• External port block transfers. Four dedicated bidirectional
DMA channels transfer blocks of data between the DSP’s
internal memory and any external memory or memorymapped peripheral on the external bus. These transfers
support master mode and handshake mode protocols.
• Link port transfers. Eight dedicated DMA channels (four
transmit and four receive) transfer quad-word data only
between link ports and between a link port and internal or
external memory. These transfers only use handshake
mode protocol. DMA priority rotates between the four
receive channels.
• AutoDMA transfers. Two dedicated unidirectional DMA
channels transfer data received from an external bus master
to internal memory or to link port I/O. These transfers only
use slave mode protocol, and an external bus master must
initiate the transfer.
The DMA controller provides these additional features:
• Flyby transfers. Flyby operations only occur through the
external port (DMA channel 0) and do not involve the
DSP’s core. The DMA controller acts as a conduit to transfer data from an external I/O device and external SDRAM
memory. During a transaction, the DSP relinquishes the
external data bus; outputs addresses, memory selects
(MSSD3–0) and the IORD, IOWR, IOEN, and RD/WR
strobes; and responds to ACK.
• DMA chaining. DMA chaining operations enable applications to automatically link one DMA transfer sequence to
another for continuous transmission. The sequences can
occur over different DMA channels and have different
transmission attributes.
• Two-dimensional transfers. The DMA controller can
access and transfer two-dimensional memory arrays on any
DMA transmit or receive channel. These transfers are
implemented with index, count, and modify registers for
both the X and Y dimensions.
December 2003
ADDRESS
DATA
ADDRESS
DATA
ADSP-TS202S #7
ADSP-TS202S #6
ADSP-TS202S #5
ADSP-TS202S #4
ADSP-TS202S #3
ADSP-TS202S #2
CONTROL
Preliminary Technical Data
CONTROL
ADSP-TS202S
ADSP-TS202S #1
001
ID2–0
RST_IN
CLKS/REFS
LINK
DEVICES
LINK
BR7–2,0
BR1
ADDR31–0
DATA63–0
CONTROL
ADSP-TS202S #0
BR7–1
BR0
ID2–0
000
RESET
RST_IN
ADDR31–0
ADDR
CLKS/REFS
RST_OUT
DATA63–0
DATA
POR_IN
CLOCK
SCLK
SCLK_VREF
REFERENCE
VREF
SCLKRAT2–0
IRQ3–0
FLAG3–0
LINK
LxDATO3–0P/N
LxCLKOUTP/N
ACK
CS
CS
CPA
DPA
ADDR
DATA
BRST
DMAR3–0
BOFF
HBR
HBG
MSH
ADDR
CS
RAS
CAS
LDQM
LxACKO
LxBCMPI
TMR0E
BM
CONTROLIMP1–0
BOOT
EPROM
(OPTIONAL)
HOST
PROCESSOR
INTERFACE
(OPTIONAL)
DATA
RAS
CAS
LxDATI3–0P/N
LxCLKINP/N
GLOBAL
MEMORY
AND
PERIPHERALS
(OPTIONAL)
CLOCK
IORD
IOWR
IOEN
MSSD3–0
LxACKI
LxBCMPO
DS2–0
OE
WE
WRH/L
ACK
MS1–0
BUSLOCK
BMS
REFERENCE
LINK
DEVICES
(4 MAX)
(OPTIONAL)
RD
SDRAM
MEMORY
(OPTIONAL)
DQM
HDQM
SDWE
WE
SDCKE
SDA10
CKE
A10
ADDR
CONTROL
DATA
JTAG
CLK
Figure 4. ADSP-TS202S Shared Memory Multiprocessing System
LINK PORTS (LVDS)
The DSP’s four full-duplex link ports each provide additional
four-bit receive and four-bit transmit I/O capability, using LowVoltage, Differential-Signal (LVDS) technology. With the ability to operate at a double data rate—latching data on both the
rising and falling edges of the clock—running at 500 MHz, each
link port can support up to 500M bytes per second per direction, for a combined maximum throughput of 4G bytes per
second.
The link ports provide an optional communications channel
that is useful in multiprocessor systems for implementing pointto-point interprocessor communications. Applications can also
use the link ports for booting.
Rev. PrB
| Page 8 of 40 |
Each link port has its own triple-buffered quad-word input and
double-buffered quad-word output registers. The DSP’s core
can write directly to a link port’s transmit register and read from
a receive register, or the DMA controller can perform DMA
transfers through eight (four transmit and four receive) dedicated link port DMA channels.
Each link port direction has three signals that control its operation. For the transmitter, LxCLKOUT is the output transmit
clock, LxACKI is the handshake input to control the data flow,
and the LxBCMPO output indicates that the block transfer is
complete. For the receiver, LxCLKIN is the input receive clock,
LxACKO is the handshake output to control the data flow, and
December 2003
Preliminary Technical Data
ADSP-TS202S
the LxBCMPI input indicates that the block transfer is complete. The LxDATO3–0 pins are the data output bus for the
transmitter and the LxDATI3–0 pins are the input data bus for
the receiver.
Applications can program separate error detection mechanisms
for transmit and receive operations (applications can use the
checksum mechanism to implement consecutive link port
transfers), the size of data packets, and the speed at which bytes
are transmitted.
TIMER AND GENERAL-PURPOSE I/O
The ADSP-TS202S processor has a timer pin (TMR0E) that
generates output when a programmed timer counter has
expired and four programmable general-purpose I/O pins
(FLAG3–0) that can function as either single-bit input or output. As outputs, these pins can signal peripheral devices; as
inputs, they can provide the test for conditional branching.
For more information on boot options, see the EE-200: ADSPTS20xS Boot Loader Kernels Operation on the Analog Devices
website (www.analog.com)
CLOCK DOMAINS
The DSP uses calculated ratios of the SCLK clock to operate as
shown in Figure 5. The instruction execution rate is equal to
CCLK. A PLL from SCLK generates CCLK which is phaselocked. The SCLKRATx pins define the clock multiplication of
SCLK to CCLK (see Table 4 on page 12). The link port clock is
generated from CCLK via a software programmable divisor, and
the SOC bus operates at 1/2 CCLK. Memory transfers to external and link port buffers operate at the SOCCLK rate. SCLK also
provides clock input for the external bus interface and defines
the AC specification reference for the external bus signals. The
external bus interface runs at the SCLK frequency. The maximum SCLK frequency is one quarter the internal DSP clock
(CCLK) frequency.
RESET AND BOOTING
The ADSP-TS202S processor has three levels of reset:
EXTERNAL INTERFACE
• Power-up reset—After power-up of the system (SCLK, all
static inputs, and strap pins are stable), the RST_IN pin
must be asserted (low).
• Normal reset—For any chip reset following the power-up
reset, the RST_IN pin must be asserted (low).
• DSP-core reset—When setting the SWRST bit in
EMUCTL, the DSP core is reset, but not the external port
or I/O.
For normal operations, tie the RST_OUT pin to the POR_IN
pin.
After reset, the ADSP-TS202S processor has four boot options
for beginning operation:
• Boot from EPROM.
• Boot by an external master (host or another ADSP-TS202S
processor).
• Boot by link port.
• No boot—Start running from memory address selected
with one of the IRQ3–0 interrupt signals. See Table 2.
Using the ‘no boot’ option, the ADSP-TS202S processor must
start running from memory when one of the interrupts is
asserted.
Table 2. No Boot, Run From Memory Addresses
Interrupt
IRQ0
IRQ1
IRQ2
IRQ3
SCLK
CCLK
(INSTRUCTION RATE)
PLL
SCLKRATx
SOCCLK
(PERIPHERAL BUS RATE)
/2
LxCLKOUT
(LINK OUTPUT RATE)
/CR
SPD BITS,
LCTLx REGISTER
Figure 5. Clock Domains
POWER DOMAINS
The ADSP-TS202S processor has separate power supply connections for internal logic (VDD), analog circuits (VDD_A), I/O
buffer (VDD_IO), and internal DRAM (VDD_DRAM) power supply.
Note that the analog (VDD_A) supply powers the clock generator
PLLs. To produce a stable clock, systems must provide a clean
power supply to power input VDD_A. Designs must pay critical
attention to bypassing the VDD_A supply.
FILTERING REFERENCE VOLTAGE AND CLOCKS
Figure 6 and Figure 7 show possible circuits for filtering VREF,
and SCLK_VREF. These circuits provide the reference voltages
for the switching voltage reference and system clock reference.
VDD_IO
Address
0x3000 0000 (External Memory)
0x3800 0000 (External Memory)
0x8000 0000 (External Memory)
0x0000 0000 (Internal Memory)
VREF
R1
R2
C1
C2
VSS
The ADSP-TS202S processor core always exits from reset in the
idle state and waits for an interrupt. Some of the interrupts in
the interrupt vector table are initialized and enabled after reset.
R1: 2 k⍀ SERIES RESISTOR (±1%)
R2: 2.87 k⍀ SERIES RESISTOR (±1%)
C1: 1 ␮F CAPACITOR (SMD)
C2: 1 nF CAPACITOR (HF SMD) PLACED CLOSE TO DSP’S PINS
Figure 6. VREF Filtering Scheme
Rev. PrB
| Page 9 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
CLOCK DRIVER
VOLTAGE * OR
SCLK_VREF
Debugging both C/C++ and assembly programs with the
VisualDSP++ debugger, programmers can:
V DD_IO
• View mixed C/C++ and assembly code (interleaved source
and object information)
R1
R2
C1
• Insert breakpoints
C2
• Set conditional breakpoints on registers, memory,
and stacks
VSS
• Trace instruction execution
R1: 2 k⍀ SERIES RESISTOR (±1%)
R2: 2.87 k⍀ SERIES RESISTOR (±1%)
C1: 1 ␮F CAPACITOR (SMD)
C2: 1 nF CAPACITOR (HF SMD) PLACED CLOSE TO DSP’S PINS
• Perform linear or statistical profiling of program execution
• Fill, dump, and graphically plot the contents of memory
* IF CLOCK DRIVER VOLTAGE ⬎ V
DD_IO
• Perform source level debugging
Figure 7. SCLK_VREF filtering scheme
• Create custom debugger windows
DEVELOPMENT TOOLS
The ADSP-TS202S processor is supported with a complete set
of CROSSCORE† software and hardware development tools,
including Analog Devices emulators and VisualDSP++‡ development environment. The same emulator hardware that
supports other TigerSHARC processors also fully emulates the
ADSP-TS202S processor.
The VisualDSP++ project management environment lets programmers develop and debug an application. This environment
includes an easy to use assembler (which is based on an algebraic syntax), an archiver (librarian/library builder), a linker, a
loader, a cycle-accurate instruction-level simulator, a C/C++
compiler, and a C/C++ runtime library that includes DSP and
mathematical functions. A key point for theses tools is C/C++
code efficiency. The compiler has been developed for efficient
translation of C/C++ code to DSP assembly. The DSP has architectural features that improve the efficiency of compiled C/C++
code.
The VisualDSP++ debugger has a number of important features. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representation of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in complexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Statistical profiling enables the programmer to nonintrusively poll
the processor as it is running the program. This feature, unique
to VisualDSP++, enables the software developer to passively
gather important code execution metrics without interrupting
the realtime characteristics of the program. Essentially, the
developer can identify bottlenecks in software quickly and efficiently. By using the profiler, the programmer can focus on
those areas in the program that impact performance and take
corrective action.
†
‡
CROSSCORE is a registgered trademark of Analog Devices, Inc.
VisualDSP++ is a registered trademark of Analog Devices, Inc.
Rev. PrB
The VisualDSP++ IDE lets programmers define and manage
DSP software development. Its dialog boxes and property pages
let programmers configure and manage all of the TigerSHARC
processor development tools, including the color syntax highlighting in the VisualDSP++ editor. This capability permit
programmers to:
• Control how the development tools process inputs and
generate outputs
• Maintain a one-to-one correspondence with the tool’s
command line switches
The VisualDSP++™ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the memory and timing constraints of DSP programming. These
capabilities enable engineers to develop code more effectively,
eliminating the need to start from the very beginning, when
developing new application code. The VDK features include
Threads, Critical and Unscheduled regions, Semaphores,
Events, and Device flags. The VDK also supports Priority-based,
Preemptive, Cooperative and Time -Sliced scheduling
approaches. In addition, the VDK was designed to be scalable. If
the application does not use a specific feature, the support code
for that feature is excluded from the target system.
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++™
development environment, but can also be used via standard
command line tools. When the VDK is used, the development
environment assists the developer with many error-prone tasks
and assists in managing system resources, automating the generation of various VDK based objects, and visualizing the
system state, when debugging an application that uses the VDK.
VCSE is Analog Devices’ technology for creating, using, and
reusing software components (independent modules of substantial functionality) to quickly and reliably assemble software
applications. Download components from the Web and drop
them into the application. Publish component archives from
within VisualDSP++™. VCSE supports component implementation in C/C++ or assembly language.
Use the Expert Linker to visually manipulate the placement of
code and data on the embedded system. View memory utilization in a color-coded graphical form, easily move code and data
to different areas of the DSP or external memory with the drag
| Page 10 of 40 |
December 2003
Preliminary Technical Data
ADSP-TS202S
of the mouse, examine run-time stack and heap usage. The
Expert Linker is fully compatible with existing Linker Definition
File (LDF), allowing the developer to move between the graphical and textual environments.
Analog Devices DSP emulators use the IEEE 1149.1 JTAG Test
Access Port of the ADSP-TS202S processor to monitor and control the target board processor during emulation. The emulator
provides full speed emulation, allowing inspection and modification of memory, registers, and processor stacks. Nonintrusive
in-circuit emulation is assured by the use of the processor’s
JTAG interface—the emulator does not affect target system
loading or timing.
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the TigerSHARC processor family.
Hardware tools include TigerSHARC processor PC plug-in
cards. Third party software tools include DSP libraries, realtime operating systems, and block diagram design tools.
DESIGNING AN EMULATOR-COMPATIBLE DSP
BOARD (TARGET)
The Analog Devices family of emulators are tools that every
DSP developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG
Test Access Port (TAP) on each JTAG DSP. The emulator uses
the TAP to access the internal features of the DSP, allowing the
developer to load code, set breakpoints, observe variables,
observe memory, and examine registers. The DSP must be
halted to send data and commands, but once an operation has
been completed by the emulator, the DSP system is set running
at full speed with no impact on system timing.
To use these emulators, the target board must include a header
that connects the DSP’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, multiprocessor scan
chains, signal buffering, signal termination, and emulator pod
logic, see the EE-68: Analog Devices JTAG Emulation Technical
Reference on the Analog Devices website (www.analog.com)—
use site search on “EE-68”. This document is updated regularly
to keep pace with improvements to emulator support.
ADDITIONAL INFORMATION
This data sheet provides a general overview of the ADSPTS202S processor’s architecture and functionality. For detailed
information on the ADSP-TS202S processor’s core architecture
and instruction set, see the ADSP-TS201 TigerSHARC Processor
Hardware Reference and the ADSP-TS201 TigerSHARC Processor Programming Reference. For detailed information on the
development tools for this processor, see the VisualDSP++
User’s Guide for TigerSHARC Processors.
Rev. PrB
| Page 11 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
PIN FUNCTION DESCRIPTIONS
While most of the ADSP-TS202S processor’s input pins are normally synchronous—tied to a specific clock—a few are
asynchronous. For these asynchronous signals, an on-chip synchronization circuit prevents metastability problems. Use the
AC specification for asynchronous signals when the system
design requires predictable, cycle-by-cycle behavior for these
signals.
The output pins can be three-stated during normal operation.
The DSP three-states all outputs during reset, allowing these
pins to get to their internal pullup or pulldown state. Some pins
have an internal pullup or pulldown resistor (±30% tolerance)
that maintains a known value during transitions between different drivers.
Table 3. Pin Definitions—Clocks and Reset
Signal
SCLKRAT2–0
Description
Core Clock Ratio. The DSP’s core clock (CCLK) rate = n × SCLK, where n is user-programmable using the SCLKRATx pins to the values shown in Table 4. These pins must have
a constant value while the DSP is powered. The core clock rate (CCLK) is the instruction
cycle rate.
SCLK
I1
au
System Clock Input. The DSP’s system input clock for cluster bus.The core clock rate
is user-programmable using the SCLKRATx pins. For more information, see Clock
Domains on page 9.
I/A
au
Reset. Sets the DSP to a known state and causes program to be in idle state. RST_IN
RST_IN
must be asserted a specified time according to the type of reset operation. For details,
see Reset and Booting on page 9, Table 17 on page 23, and Figure 10 on page 24.
RST_OUT
O
au
Reset Output. Indicates that the DSP reset is complete. Connect to POR_IN.
POR_IN
I/A
au
Power On Reset for internal DRAM. Connect to RST_OUT.
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
1
Type
I (pd)
Term
au
For more information on SCLK and SCLK_VREF on revision 0.x silicon, see the EE-179: ADSP-TS20x TigerSHARC System Design Guidelines on the Analog Devices website
(www.analog.com).
Table 4. SCLK Ratio
SCLKRAT2–0
000 (default)
001
010
011
100
101
110
111
Ratio
4
5
6
7
8
10
12
Reserved
Rev. PrB
| Page 12 of 40 |
December 2003
Preliminary Technical Data
ADSP-TS202S
Table 5. Pin Definitions—External Port Bus Controls
Signal
ADDR31–0
Type
I/O/T
(pu_ad)
Term
nc
Description
Address Bus. The DSP issues addresses for accessing memory and peripherals on
these pins. In a multiprocessor system, the bus master drives addresses for accessing
internal memory or I/O processor registers of other ADSP-TS202S processors. The DSP
inputs addresses when a host or another DSP accesses its internal memory or I/O
processor registers.
DATA63–0
I/O/T
nc
External Data Bus. The DSP drives and receives data and instructions on these pins.
(pu_ad)
Pullup/down resistors on unused DATA pins are unnecessary.
RD
I/O/T
epu
Memory Read. RD is asserted whenever the DSP reads from any slave in the system,
(pu_0)
excluding SDRAM. When the DSP is a slave, RD is an input and indicates read transactions that access its internal memory or universal registers. In a multiprocessor
system, the bus master drives RD. RD changes concurrently with ADDR pins.
WRL
I/O/T
epu
Write Low. WRL is asserted in two cases: When the ADSP-TS202S processor writes to
(pu_0)
an even address word of external memory or to another external bus agent; and when
the ADSP-TS202S processor writes to a 32-bit zone (host, memory or DSP
programmed to 32-bit bus). An external master (host or DSP) asserts WRL for writing
to a DSP’s low word of internal memory. In a multiprocessor system, the bus master
drives WRL. WRL changes concurrently with ADDR pins. When the DSP is a slave, WRL
is an input and indicates write transactions that access its internal memory or
universal registers.
WRH
I/O/T
epu
Write High. WRH is asserted when the ADSP-TS202S processor writes a long word (64
(pu_0)
bits) or writes to an odd address word of external memory or to another external bus
agent on a 64-bit data bus. An external master (host or another DSP) must assert WRH
for writing to a DSP’s high word of 64-bit data bus. In a multiprocessing system, the
bus master drives WRH. WRH changes concurrently with ADDR pins. When the DSP
is a slave, WRH is an input and indicates write transactions that access its internal
memory or universal registers.
ACK
I/O/T/OD
epu
Acknowledge. External slave devices can de-assert ACK to add wait states to external
(pu_od_0)
memory accesses. ACK is used by I/O devices, memory controllers and other peripherals on the data phase. The DSP can de-assert ACK to add wait states to read and
write accesses of its internal memory. The pullup is 50 Ω on low-to-high transactions
and is 500 Ω on all other transactions.
O/T
au
Boot Memory Select. BMS is the chip select for boot EPROM or flash memory. During
BMS
(pu_0)
reset, the DSP uses BMS as a strap pin (EBOOT) for EPROM boot mode. In a multiprocessor system, the DSP bus master drives BMS. For details, see Reset and Booting on
page 9 and see the EBOOT signal description in Table 15 on page 19.
MS1–0
O/T
nc
Memory Select. MS0 or MS1 is asserted whenever the DSP accesses memory banks 0
(pu_0)
or 1 respectively. MS1–0 are decoded memory address pins that change concurrently
with ADDR pins. When ADDR31:27 = 0b00110, MS0 is asserted. When ADDR31:27 =
0b00111, MS1 is asserted. In multiprocessor systems, the master DSP drives MS1–0.
MSH
O/T
nc
Memory Select Host. MSH is asserted whenever the DSP accesses the host address
(pu_0)
space (ADDR31 = 0b1). MSH is a decoded memory address pin that changes concurrently with ADDR pins. In a multiprocessor system, the bus master DSP drives MSH.
BRST
I/O/T
epu
Burst. The current bus master (DSP or host) asserts this pin to indicate that it is reading
(pu_0)
or writing data associated with consecutive addresses. A slave device can ignore
addresses after the first one and increment an internal address counter after each
transfer. For host-to-DSP burst accesses, the DSP increments the address automatically while BRST is asserted.
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
Rev. PrB
| Page 13 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
Table 6. Pin Definitions—External Port Arbitration
Signal
BR7–0
Description
Multiprocessing Bus Request Pins. Used by the DSPs in a multiprocessor system to
arbitrate for bus mastership. Each DSP drives its own BRx line (corresponding to the
value of its ID2–0 inputs) and monitors all others. In systems with fewer than eight
DSPs, set the unused BRx pins high (VDD_IO).
ID2–0
I (pd)
au
Multiprocessor ID. Indicates the DSP’s ID, from which the DSP determines its order in
a multiprocessor system. These pins also indicate to the DSP which bus request
(BR0–BR7) to assert when requesting the bus: 000 = BR0, 001 = BR1, 010 = BR2,
011 = BR3, 100 = BR4, 101 = BR5, 110 = BR6, or 111 = BR7. ID2–0 must have a constant
value during system operation and can change during reset only.
BM
O
au
Bus Master. The current bus master DSP asserts BM. For debugging only. At reset this
is a strap pin. For more information, see Table 15 on page 19.
BOFF
I
epu
Back Off. A deadlock situation can occur when the host and a DSP try to read from
each other’s bus at the same time. When deadlock occurs, the host can assert BOFF
to force the DSP to relinquish the bus before completing its outstanding transaction.
BUSLOCK
O/T
au
Bus Lock Indication. Provides an indication that the current bus master has locked
(pu_0)
the bus. At reset, this is a strap pin. For more information, see Table 15 on page 19.
HBR
I
epu
Host Bus Request. A host must assert HBR to request control of the DSP’s external bus.
When HBR is asserted in a multiprocessing system, the bus master relinquishes the
bus and asserts HBG once the outstanding transaction is finished.
HBG
I/O/T
epu1
Host Bus Grant. Acknowledges HBR and indicates that the host can take control of
(pu_0)
the external bus. When relinquishing the bus, the master DSP three-states the
ADDR31–0, DATA63–0, MSH, MSSD3–0, MS1–0, RD, WRL, WRH, BMS, BRST, IORD,
IOWR, IOEN, RAS, CAS, SDWE, SDA10, SDCKE, LDQM and HDQM pins, and the DSP puts
the SDRAM in self-refresh mode. The DSP asserts HBG until the host deasserts HBR.
In multiprocessor systems, the current bus master DSP drives HBG, and all slave DSPs
monitor it.
CPA
I/O/OD
epu
Core Priority Access. Asserted while the DSP’s core accesses external memory. This
(pu_od_0)
pin enables a slave DSP to interrupt a master DSP’s background DMA transfers and
gain control of the external bus for core-initiated transactions. CPA is an open drain
output, connected to all DSPs in the system. If not required in the system, leave CPA
unconnected (external pullups will be required for DSP ID=1 through ID=7).
I/O/OD
epu
DMA Priority Access. Asserted while a high-priority DSP DMA channel accesses
DPA
(pu_od_0)
external memory. This pin enables a high-priority DMA channel on a slave DSP to
interrupt transfers of a normal-priority DMA channel on a master DSP and gain control
of the external bus for DMA-initiated transactions. DPA is an open drain output,
connected to all DSPs in the system. If not required in the system, leave DPA unconnected (external pullups will be required for DSP ID=1 through ID=7).
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
1
Type
I/O
Term
VDD_IO
This external pull-up resistor may be omitted for the ID=000 TigerSHARC processor.
Rev. PrB
| Page 14 of 40 |
December 2003
Preliminary Technical Data
ADSP-TS202S
Table 7. Pin Definitions—External Port DMA/Flyby
Signal
DMAR3–0
Type
I/A
Term
epu
Description
DMA Request Pins. Enable external I/O devices to request DMA services from the DSP.
In response to DMARx, the DSP performs DMA transfers according to the DMA
channel’s initialization. The DSP ignores DMA requests from uninitialized channels.
IOWR
O/T
nc
I/O Write. When a DSP DMA channel initiates a flyby mode read transaction, the DSP
(pu_0)
asserts the IOWR signal during the data cycles. This assertion makes the I/O device
sample the data instead of the TigerSHARC.
IORD
O/T
nc
I/O Read. When a DSP DMA channel initiates a flyby mode write transaction, the DSP
(pu_0)
asserts the IORD signal during the data cycle. This assertion with the IOEN makes the
I/O device drive the data instead of the TigerSHARC.
O/T
nc
I/O Device Output Enable. Enables the output buffers of an external I/O device for flyIOEN
(pu_0)
by transactions between the device and external memory. Active on fly-by
transactions.
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
Table 8. Pin Definitions—External Port SDRAM Controller
Signal
MSSD3–0
Type
I/O/T
(pu_0)
Term
nc
Description
Memory Select SDRAM. MSSD0, MSSD1, MSSD2, or MSSD3 is asserted whenever the
DSP accesses SDRAM memory space. MSSD3–0 are decoded memory address pins
that are asserted whenever the DSP issues an SDRAM command cycle (access to
ADDR31:30 = 0b01—except reserved spaces shown in Figure 3 on page 6). In a multiprocessor system, the master DSP drives MSSD3–0.
I/O/T
nc
Row Address Select. When sampled low, RAS indicates that a row address is valid in
RAS
(pu_0)
a read or write of SDRAM. In other SDRAM accesses, it defines the type of operation
to execute according to SDRAM specification.
CAS
I/O/T
nc
Column Address Select. When sampled low, CAS indicates that a column address is
(pu_0)
valid in a read or write of SDRAM. In other SDRAM accesses, it defines the type of
operation to execute according to the SDRAM specification.
LDQM
O/T
nc
Low Word SDRAM Data Mask. When sampled high, three-states the SDRAM DQ
(pu_0)
buffers. LDQM is valid on SDRAM transactions when CAS is asserted, and inactive on
read transactions. On write transactions, LDQM is active when accessing an odd
address word on a 64-bit memory bus to disable the write of the low word.
HDQM
O/T
nc
High Word SDRAM Data Mask. When sampled high, three-states the SDRAM DQ
(pu_0)
buffers. HDQM is valid on SDRAM transactions when CAS is asserted, and inactive on
read transactions. On write transactions, HDQM is active when accessing an even
address in word accesses or when memory is configured for a 32-bit bus to disable
the write of the high word.
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
Rev. PrB
| Page 15 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
Table 8. Pin Definitions—External Port SDRAM Controller (Continued)
Signal
SDA10
Type
O/T
(pu_0)
I/O/T
(pu_m/
pd_m)
Term
nc
Description
SDRAM Address bit 10 pin. Separate A10 signals enable SDRAM refresh operation
while the DSP executes non-SDRAM transactions.
SDCKE
nc
SDRAM Clock Enable. Activates the SDRAM clock for SDRAM self-refresh or suspend
modes. A slave DSP in a multiprocessor system does not have the pullup or pulldown.
A master DSP (or ID=0 in a single processor system) has a pullup before granting the
bus to the host, except when the SDRAM is put in self refresh mode. In self refresh
mode, the master has a pulldown before granting the bus to the host.
SDWE
I/O/T
nc
SDRAM Write Enable. When sampled low while CAS is active, SDWE indicates an
(pu_0)
SDRAM write access. When sampled high while CAS is active, SDWE indicates an
SDRAM read access. In other SDRAM accesses, SDWE defines the type of operation to
execute according to SDRAM specification.
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
Table 9. Pin Definitions—JTAG Port
Signal
EMU
Type
O/OD
Term
nc1
Description
Emulation. Connected to the DSP’s JTAG emulator target board connector only.
TCK
TDI
I
I
(pu_ad)
O/T
epd or epu1
nc1
Test Clock (JTAG). Provides an asynchronous clock for JTAG scan.
Test Data Input (JTAG). A serial data input of the scan path.
nc1
Test Data Output (JTAG). A serial data output of the scan path.
I
(pu_ad)
I/A
(pu_ad)
nc1
Test Mode Select (JTAG). Used to control the test state machine.
TDO
TMS
TRST
Test Reset (JTAG). Resets the test state machine. TRST must be asserted or pulsed low
after power up for proper device operation. For more information, see Reset and
Booting on page 9.
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
1
au
See the reference on page 11 to the JTAG emulation technical reference EE-68.
Rev. PrB
| Page 16 of 40 |
December 2003
Preliminary Technical Data
ADSP-TS202S
Table 10. Pin Definitions—Flags, Interrupts, and Timer
Signal
FLAG3–0
Type
I/O/A
(pu)
Term
nc
Description
FLAG pins. Bidirectional input/output pins can be used as program conditions. Each pin
can be configured individually for input or for output. FLAG3–0 are inputs after power-up
and reset.
IRQ3–0
I/A
nc
Interrupt Request. When asserted, the DSP generates an interrupt. Each of the IRQ3–0 pins
(pu)
can be independently set for edge-triggered or level-sensitive operation. After reset, these
pins are disabled unless the IRQ3–0 strap option and interrupt vectors are initialized for
booting.
TMR0E
O
au
Timer 0 expires. This output pulses whenever timer 0 expires. At reset, this is a strap pin.
For more information, see Table 15 on page 19.
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
Table 11. Pin Definitions—Link Ports
Signal
LxDATO3–0P
LxDATO3–0N
LxCLKOUTP
LxCLKOUTN
LxACKI
Description
Link Ports 3–0 Data 3–0 Transmit LVDS P
Link Ports 3–0 Data 3–0 Transmit LVDS N
Link Ports 3–0 Transmit Clock LVDS P
Link Ports 3–0 Transmit Clock LVDS N
Link Ports 3–0 Receive Acknowledge. Using this signal, the receiver indicates to the
transmitter that it may continue the transmission
LxBCMPO
O
nc1
Link Ports 3–0 Block Completion. When the transmission is executed using DMA, this
signal indicates to the receiver that the transmitted block is completed. At reset, the
L1BCMPO, L2BCMPO, and L3BCMPO pins are strap pins. For more information, see
Table 15 on page 19.
LxDATI3–0P
I
VDD_IO
Link Ports 3–0 Data 3–0 Receive LVDS P
LxDATI3–0N
I
VDD_IO
Link Ports 3–0 Data 3–0 Receive LVDS N
LxCLKINP
I/A
VDD_IO
Link Ports 3–0 Receive Clock LVDS P
LxCLKINN
I/A
VSS
Link Ports 3–0 Receive Clock LVDS N
LxACKO
O
nc
Link Ports 3–0 Transmit Acknowledge. Using this signal, the receiver indicates to the
transmitter that it may continue the transmission.
I
VSS
Link Ports 3–0 Block Completion. When the reception is executed using DMA, this
LxBCMPI
signal indicates to the transmitter that the receive block is completed.
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
1
Type
O
O
O
O
I (pd)
Term
nc
nc
nc
nc
nc
The L1BCMPO and L2BCMPO pins have different termination requirements on revision 0.x silicon, see the EE-179: ADSP-TS20xS TigerSHARC System Design Guidelines
on the Analog Devices website (www.analog.com).
Rev. PrB
| Page 17 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
Table 12. Pin definitions—Impedance Control , Drive Strength Control, and Regulator Enable
Signal
CONTROLIMP0
Type
I (pd)
Term
au
Description
Impedance Control. CONTROLIMP0 enables Pulse Mode. When CONTROLIMP0 = 0,
Pulse Mode is disabled and the output drive strength is continuously controlled by
DS2–0, both in the digital mode and in the analog mode (See analog and digital modes
below). When CONTROLIMP0 = 1, Pulse Mode is enabled. In Pulse Mode, whenever a
new value is driven to the output pin, drive strength is set to 100% for a short period of
1.5-2.5ns after rising edge of SCLK and afterwards it is set back to the value defined by
the resistance control DS2–0 pins as shown in Table 13.
CONTROLIMP1
I (pu)
au
Impedance Control. CONTROLIMP1 enables A/D mode of the control impedance
circuitry.When CONTROLIMP1 = 0, A/D mode is disabled, and output drive strength is
set relative to maximum drive strength according to table in DS2–0 explanation. When
CONTROLIMP1 = 1, A/D mode is enabled, and the resistance control operates in the
analog mode, where drive strength is continuously controlled to match a specific line
impedance as shown in Table 13.
DS2,0
I (pu)
au
Digital Drive Strength Selection. Selected as shown in Table 13. For drive strength calcuDS1
I (pd)
lation, see Output Drive Currents on page 32. The drive strength for some pins is preset,
not controlled by the DS2–0 pins. The pins that are always at drive strength 7 (100%)
include: CPA, DPA, TDO, EMU, and RST_OUT. The drive strength for the ACK pin is always
x2 drive strength 7 (100%).
Enable on-chip DRAM regulator. Connect the ENEDREG pin to VSS. Connect the VDD_DRAM
ENEDREG
I (pu)
VSS
pins to a properly decoupled DRAM power supply.
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
Table 13. Drive Strength/Output Impedance Selection
DS2–0
Pins
000
001
010
011
100
101 (default)
110
111
1
2
Drive
Strength1
Strength 0 (11.1%)
Strength 1 (23.8%)
Strength 2 (36.5%)
Strength 3 (49.2%)
Strength 4 (61.9%)
Strength 5 (74.6%)
Strength 6 (87.3%)
Strength 7 (100%)
Output
Impedance 2
26 Ω
32 Ω
40 Ω
50 Ω
62 Ω
70 Ω
96 Ω
120 Ω
CONTROLIMP1 = 0, A/D mode disabled.
CONTROLIMP1 = 1, A/D mode enabled.
Rev. PrB
| Page 18 of 40 |
December 2003
Preliminary Technical Data
ADSP-TS202S
Table 14. Pin Definitions—Power, Ground, and Reference
Signal
VDD
VDD_A
VDD_IO
VDD_DRAM
VREF
Description
VDD pins for internal logic.
VDD pins for analog circuits. Pay critical attention to bypassing this supply.
VDD pins for I/O buffers.
VDD pins for internal DRAM.
Reference voltage defines the trip point for all input buffers, except SCLK, RST_IN,
POR_IN, IRQ3–0, FLAG3–0, DMAR3–0, ID2–0, CONTROLIMP1–0, LxDATO3–0P/N,
LxCLKOUTP/N, LxDATI3–0P/N, LxCLKINP/N, TCK, TDI, TMS, and TRST. VREF can be
connected to a power supply or set by a voltage divider circuit as shown in Figure 6.
For more information, see Filtering Reference Voltage and Clocks on page 9.
I1
au
System Clock Reference. Connect this pin to a reference voltage as shown in Figure 7.
SCLK_VREF
For more information, see Filtering Reference Voltage and Clocks on page 9.
VSS
G
au
Ground pins.
NC
—
nc
No Connect. Do not connect these pins to anything (not to any supply, signal, or each
other). These pins are reserved and must be left unconnected.
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Term (for termination) column symbols: epd = External pull-down approximately 5 kΩ to VSS; epu = External pull-up approximately 5 kΩ
to VDD_IO, nc = Not connected; au = Always used.
1
Type
P
P
P
P
I
Term
au
au
au
au
au
For more information on SCLK and SCLK_VREF on revision 0.0 silicon, see the EE-179: ADSP-TS20xS TigerSHARC System Design Guidelines on the Analog Devices website
(www.analog.com).
STRAP PIN FUNCTION DESCRIPTIONS
Some pins have alternate functions at reset. Strap options set
DSP operating modes. During reset, the DSP samples the strap
option pins. Strap pins have an internal pullup or pulldown for
the default value. If a strap pin is not connected to an overdriving external pullup, pulldown, or logic load, the DSP samples
the default value during reset. If strap pins are connected to
logic inputs, a stronger external pullup or pulldown may be
required to ensure default value depending on leakage and/or
low level input current of the logic load. To set a mode other
than the default mode, connect the strap pin to a sufficiently
stronger external pullup or pulldown. Table 15 lists and
describes each of the DSP’s strap pins.
Table 15. Pin Definitions—I/O Strap Pins
Signal
EBOOT
Type (at
Reset)
I
(pd_0)
On Pin…
Description
BMS
EPROM boot.
0 = boot from EPROM immediately after reset (default)
1 = idle after reset and wait for an external device to boot DSP
through the external port or a link port
Interrupt Enable.
IRQEN
I
BM
0 = disable and set IRQ3–0 interrupts to level-sensitive after
(pd)
reset (default)
1 = enable and set IRQ3–0 interrupts to edge-sensitive
immediately after reset
LINK_DWIDTH
I
TMR0E
Link Port Input Default Data Width.
(pd)
0 = 1-bit (default)
1 = 4-bit
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
Rev. PrB
| Page 19 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
Table 15. Pin Definitions—I/O Strap Pins (Continued)
Signal
SYS_REG_WE
Type (at
Reset)
I
(pd_0)
On Pin…
Description
BUSLOCK
SYSCON and SDRCON Write Enable.
0 = one-time writable after reset (default)
1 = always writable
Test Mode 1. Do not overdrive default value during reset.
TM1
I
L1BCMPO
(pu)
TM2
I
L2BCMPO
Test Mode 2. Do not overdrive default value during reset.
(pu)
TM3
I
L3BCMPO
Test Mode 3. Do not overdrive default value during reset.
(pu)
I = input; A = asynchronous; O = output; OD = open drain output; T = Three-State; P = power supply; G = ground;
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 = internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ on DSP
ID=0; pu_od_0 = internal pullup 500Ω on DSP ID=0; pd_m = internal pulldown 5 kΩ on DSP bus master; pu_m = internal pullup 5 kΩ on DSP
bus master; pu_ad = internal pullup 40 kΩ; For more pulldown and pullup information, see Electrical Characteristics on page 21.
When default configuration is used, no external resistor is
needed on the strap pins. To apply other configurations, a 500Ω
resistor connected to VDD_IO is required. If providing external
pulldowns, do not strap these pins directly to VSS; the strap pins
require 500Ω resistor straps.
Table 16. Strap Pin Internal Resistors—Active Reset
(RST_IN = 0) Versus Normal Operation (RST_IN = 1)
All strap pins are sampled on the rising edge of RST_IN (deassertion edge). Each pin latches the strapped pin state (state of
the strap pin at the rising edge of RST_IN). Shortly after deassertion of RST_IN, these pins are re-configured to their normal functionality.
These strap pins have an internal pull-down resistor, pull-up
resistor, or no-resistor (three-state) on each pin. The resistor
type, which is connected to the I/O pad, depends on whether
RST_IN is active (low) or if RST_IN is de-asserted (high).
Table 16 shows the resistors that are enabled during active reset
and during normal operation
Rev. PrB
| Page 20 of 40 |
PIN
RST_IN = 0
RST_IN = 1
BMS
(pd_0)
(pu_0)
(pd)
Driven
BM
TMR0E
(pd)
Driven
BUSLOCK
(pd_0)
(pu_0)
L1BCMPO
(pu)
Driven
L2BCMPO
(pu)
Driven
L3BCMPO
(pu)
Driven
pd = internal pulldown 5 kΩ; pu = internal pullup 5 kΩ; pd_0 =
internal pulldown 5 kΩ on DSP ID=0; pu_0 = internal pullup 5 kΩ
on DSP ID=0
December 2003
Preliminary Technical Data
ADSP-TS202S
ADSP-TS202S—SPECIFICATIONS
Note that component specifications are subject to change without notice. For information on Link port electrical
characteristics, see Link Port Low-Voltage, Differential-Signal
(LVDS) Electrical Characteristics and Timing on page 27.
RECOMMENDED OPERATING CONDITIONS
Parameter
VDD
VDD_A
VDD_IO
VDD_DRAM
TCASE
VIH
VIL
IDD
IDD_A
IDD_IO
Test Conditions
IDD_DRAM
Internal Supply Voltage
Analog Supply Voltage
I/O Supply Voltage
Internal DRAM Supply Voltage
Case Operating Temperature
High-Level Input Voltage1
Low-Level Input Voltage1
VDD supply current for typical activity2
VDD_A supply current for typical activity
VDD_IO supply current for typical activity2 (DRAM
Internal Regulator Disabled)
VDD_DRAM supply current for typical activity2
VREF
SCLK_VREF
Voltage reference
Voltage reference
@ VDD, VDD_IO = max
@ VDD, VDD_IO = min
@ CCLK=500 MHz, VDD=1.0 V, TCASE=25ºC
@ CCLK=500 MHz, VDD=1.0 V, TCASE=25ºC
@ SCLK=100 MHz, VDD_IO=2.5 V, TCASE=25ºC,
ENEDREG=0
@ CCLK=500 MHz, VDD_DRAM=1.5 V,
TCASE=25ºC, ENEDREG=0
Min
0.95
0.95
2.38
1.425
–40
1.7
–0.5
Typ
2.39
20
0.16
Max
1.05
1.05
2.63
1.575
+85
3.63
0.8
50
Unit
V
V
V
V
°C
V
V
A
mA
A
0.40
A
(VDD_IO ×0.56)3
(VDD_IO ×0.56)3
V
V
1
Applies to input and bidirectional pins.
For details on internal and external power calculation issues, see the EE-170, Estimating Power for the ADSP-TS201S on the Analog Devices website.
3
If the clock driver voltage is > 2.8 V and the clock driver voltage is used to generate SCLK_VREF, this formula becomes: (VCLOCK_DRIVE/2) ±5%)
2
ELECTRICAL CHARACTERISTICS
Parameter
Test Conditions
Min
Max
Unit
High-Level Output Voltage1
@VDD_IO = min, IOH = –2 mA
2.18
V
VOH
VOL
Low-Level Output Voltage1
@VDD_IO = min, IOL = 4 mA
0.4
V
High-Level Input Current
@VDD_IO = max, VIN = VDD_IO max
10
µA
IIH
High-Level Input Current
@VDD_IO = max, VIN = VDD_IO max
50
µA
IIH_PU
IIH_PD
High-Level Input Current
@VDD_IO = max, VIN = VDD_IO max
0.3
0.76
mA
Low-Level Input Current
@VDD_IO = max, VIN = 0V
10
µA
IIL
Low-Level Input Current
@VDD_IO = max, VIN = 0V
0.3
0.76
mA
IIL_PU
Low-Level Input Current
@VDD_IO = max, VIN = 0V
0.03
0.1
mA
IIL_PU_AD
Three-State Leakage Current High
@VDD_IO = max, VIN = VDD_IO max
10
µA
IOZH
Three-State Leakage Current High
@VDD_IO = max, VIN = VDD_IO max
0.3
0.76
mA
IOZH_PD
Three-State Leakage Current Low
@VDD_IO = max, VIN = 0V
10
µA
IOZL
Three-State Leakage Current Low
@VDD_IO = max, VIN = 0
0.3
0.76
mA
IOZL_PU
Three-State Leakage Current Low
@VDD_IO = max, VIN = 0
0.03
0.1
mA
IOZL_PU_AD
Three-State Leakage Current Low
@VDD_IO = max, VIN = 0V
4
7.6
mA
IOZL_OD
2,3
Input Capacitance
@fIN = 1MHz,TCASE = 25C, VIN = 2.5V
3
pF
CIN
Parameter name suffix conventions: no suffix = applies to pins without pullup or pull down resistors, _PD = applies to pin types (pd) or
(pd_0), _PU = applies to pin types (pu) or (pu_0), _PU_AD = applies to pin types (pu_ad), _OD = applies to pin types OD
1
Applies to output and bidirectional pins.
Applies to all signals.
3
Guaranteed but not tested.
2
Rev. PrB
| Page 21 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Internal (Core) Supply Voltage (VDD)1
Analog (PLL) Supply Voltage (VDD_A)1
External (I/O) Supply Voltage (VDD_IO)1
External (DRAM) Supply Voltage (VDD_DRAM)1
Input Voltage1
Output Voltage Swing1
Storage Temperature Range1
1
–0.3 V to +1.40 V
–0.3 V to +1.40 V
–0.3 V to +3.5 V
–0.3 V to +2.1 V
–0.5 V to 3.63 V
–0.5 V to VDD_IO +0.5 V
–65ºC to +150ºC
Stresses greater than those listed above may cause permanent damage to the device. These
are stress ratings only. Functional operation of the device at these or any other conditions
greater than those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
ESD SENSITIVITY
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADSP-TS202S features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Rev. PrB
| Page 22 of 40 |
December 2003
Preliminary Technical Data
ADSP-TS202S
TIMING SPECIFICATIONS
General AC Timing
With the exception of DMAR3–0, IRQ3–0, TMR0E, and
FLAG3–0 (input only) pins, all AC timing for the ADSP-TS202S
processor is relative to a reference clock edge. Because input
setup/hold, output valid/hold, and output enable/disable times
are relative to a clock edge, the timing data for the ADSPTS202S processor has few calculated (formula-based) values.
For information on AC timing, see General AC Timing on
page 23. For information on Link port transfer timing, see Link
Port Low-Voltage, Differential-Signal (LVDS) Electrical Characteristics and Timing on page 27.
Timing is measured on signals when they cross the 1.25 V level
as described in Figure 11 on page 26. All delays (in nanoseconds) are measured between the point that the first signal
reaches 1.25 V and the point that the second signal reaches
1.25 V.
The general AC timing data appears in Table 18 and Table 22.
The AC asynchronous timing data for the IRQ3–0, DMAR3–0,
FLAG3–0, and TMR0E pins appears in Table 17.
Table 17. AC Asynchronous Signal Specifications (all values in this table are in nanoseconds)
Name
IRQ3–01
DMAR3–01
FLAG3–02
TMR0E3
Description
Interrupt Request
DMA Request
FLAG3–0 Input
Timer 0 Expired
Pulsewidth Low (min)
2 × tSCLK ns
2 × tSCLK ns
2×tSCLK ns
4×tSCLK ns
Pulsewidth High (min)
2 × tSCLK ns
2 × tSCLK ns
2×tSCLK ns
–
1
These input pins have Schmitt triggers and therefore do not need to be synchronized to a clock reference.
For output specifications on FLAG3–0 pins, see Table 22.
3
This pin is a strap option. During reset, an internal resistor pulls the pin low.
2
Table 18. Reference Clocks
Signal
Type Description
Speed
Grade
(MHz)
Clock
Cycle
Min (ns)
Clock
Cycle
Max (ns)
Clock
High
Min (ns)
CCLK1
SCLK2,3,4
–
I
Core Clock
System Clock
500
All
12.5
50
–
TCK
I
Test Clock (JTAG)
All
2.0
Greater of 8
or CCLK×4
Greater of 30
or CCLK×4
–
12
Clock
Low
Min (ns)
–
{40% to 60%
Duty Cycle}
12
Input
Jitter
Tolerance
(ps)
–
100
–
1
CCLK is the internal DSP clock or instruction cycle time. The period of this clock is equal to the System Clock (SCLK) period divided by the System Clock Ratio (SCLKRAT2–0).
For information on available internal DSP clock rates, see the Ordering Guide on page 40.
2
Actual input jitter should be combined with ac specifications for accurate timing analysis.
3
For more information, see Table 3 on page 12.
4
For more information, see Clock Domains on page 9.
Table 19. Power-Up Reset Timing
Parameter
Timing Requirements
tVDD_DRAM1
VDD_DRAM Stable After VDD, VDD_A, VDD_IO Stable
tVDD_DRAM_RAMP VDD_DRAM Supply Rise Time
1
Min
tVDD_DRAM
VDD
VDD_A
VDD_IO
tVDD_DRAM_RAMP
VDD_DRAM
Figure 8. Power-Up Timing
| Page 23 of 40 |
Units
0.2
ms
ms
0
Applies only when the internal DRAM regulator is disabled (ENEDREG=0)
Rev. PrB
Max
December 2003
ADSP-TS202S
Preliminary Technical Data
Table 20. Power-Up Reset Timing
Parameter
Timing Requirements
tRST_IN_PWR
RST_IN Deasserted After VDD, VDD_A, VDD_IO, VDD_DRAM (ENEDREG=0), SCLK, and
Static/Strap Pins Stable
tTRST_IN_PWR1
TRST Asserted During Power-Up Reset
Switching Characteristic
tRST_OUT_PWR
RST_OUT Deasserted After RST_IN Deasserted
1
Min
Max
Units
2
ms
100×tSCLK
ns
1.5
ms
Applies after VDD, VDD_A, VDD_IO, VDD_DRAM (ENEDREG=0), and SCLK are stable and before RST_IN deasserted.
tRST_IN_PWR
tRST_OUT_PWR
RST_IN
RST_OUT
tTRST_PWR
TRST
SCLK, VDD, VDD_A,
VDD_IO, VDD_DRAM
STATIC/STRAP PINS
Figure 9. Power-Up Reset Timing
Table 21. Normal Reset Timing
Parameter
Timing Requirements
tRST_IN
RST_IN Asserted
tSTRAP
RST_IN Deasserted After Strap Pins Stable
Switching Characteristic
tRST_OUT
RST_OUT Deasserted After RST_IN Deasserted
Min
tRST_IN
RST_IN
tRST_OUT
RST_OUT
tSTRAP
STRAP PINS
Figure 10. Normal Reset Timing
Rev. PrB
| Page 24 of 40 |
December 2003
Max
Units
2
1.5
ms
ms
1.5
ms
Preliminary Technical Data
ADSP-TS202S
Table 22. AC Signal Specifications
Rev. PrB
Output Enable
(min)1
Output Disable
(max)1
Reference
Clock
BMS
FLAG3–02
RST_IN3,4
TMS
TDI
TDO
TRST3,4
EMU5
ID2–06
CONTROLIMP1–06
Output Hold
(min)
DPA
Output Valid
(max)
SDCKE
RAS
CAS
SDWE
LDQM
HDQM
SDA10
HBR
HBG
BOFF
BUSLOCK
BRST
BR7–0
BM
IORD
IOWR
IOEN
CPA
External Address Bus
External Data Bus
Memory Select HOST Line
Memory Select SDRAM Lines
Memory Select for Static Blocks
Memory Read
Write Low Word
Write High Word
Acknowledge for Data Hi to Low
Acknowledge for Data Low to High
SDRAM Clock Enable
Row Address Select
Column Address Select
SDRAM Write Enable
Low Word SDRAM Data Mask
High Word SDRAM Data Mask
SDRAM ADDR10
Host Bus Request
Host Bus Grant
Back Off Request
Bus Lock
Burst pin
Multiprocessing Bus Request pins
Bus Master Debug aid only
I/O Read pin
I/O Write pin
I/O Enable pin
Core Priority Access Hi to Low
Core Priority Access Low to Hi
DMA Priority Access Hi to Low
DMA Priority Access Low to Hi
Boot Memory Select
FLAG pins
Global Reset pin
Test Mode Select (JTAG)
Test Data Input (JTAG)
Test Data Output (JTAG)
Test Reset (JTAG)
Emulation High to Low
Static pins – must be constant
Static pins – must be constant
Input Hold
(min)
ADDR31–0
DATA63–0
MSH
MSSD3–0
MS1–0
RD
WRL
WRH
ACK
Input Setup
(min)
(all values in this table are in nanoseconds)
Name
Description
1.5
1.5
—
1.5
—
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
—
—
—
1.5
1.5
1.5
—
1.5
1.5
—
—
—
—
1.5
1.5
1.5
1.5
1.5
—
1.5
1.5
1.5
—
1.5
—
—
—
0.5
0.5
—
0.5
—
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
—
—
—
0.5
0.5
0.5
—
0.5
0.5
—
—
—
—
0.5
0.5
0.5
0.5
0.5
—
0.5
0.5
0.5
—
0.5
—
—
—
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
3.6
4.2
4.0
4.0
4.0
4.0
4.0
4.0
4.0
—
4.0
—
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
23.5
4.0
23.5
4.0
4.0
—
—
—
4.0
—
3.6
—
—
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
—
1.0
—
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
1.0
2.0
1.0
1.0
—
—
—
1.0
—
2.0
—
—
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
—
1.15
—
1.15
1.15
—
—
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
1.15
—
—
—
1.15
—
1.15
—
—
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
—
2.0
—
2.0
2.0
—
—
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
—
—
—
2.0
—
2.0
—
—
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
SCLK
TCK
TCK
TCK
TCK
TCK or SCLK
—
—
| Page 25 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
Table 22. AC Signal Specifications (Continued)
Output Valid
(max)
Output Hold
(min)
Output Enable
(min)1
Output Disable
(max)1
Reference
Clock
Static pins – must be constant
Static pins – must be constant
Static pins – must be connected to VSS
Strap pins
JTAG system pins
Input Hold
(min)
DS2–06
SCLKRAT2–06
ENEDREG6
STRAP SYS7,8
JTAG SYS9
Input Setup
(min)
(all values in this table are in nanoseconds)
Name
Description
—
—
—
1.5
1.5
—
—
—
0.5
0.5
—
—
—
—
4.0
—
—
—
—
1.0
—
—
—
—
—
—
—
—
—
—
—
—
—
SCLK
TCK
1
The external port protocols employ bus IDLE cycles for bus mastership transitions as well as slave address boundary crossings to avoid any potential bus contention. The
apparent driver overlap, due to output disables being larger than output enables, is not actual.
For input specifications on FLAG3–0 pins, see Table 17.
3
These input pins are asynchronous and therefore do not need to be synchronized to a clock reference.
4
For additional requirement details, see Reset and Booting on page 9.
5
Reference clock depends on function.
6
These pins may change only during reset; recommend connecting it to VDD_IO/VSS.
7
STRAP pins include: BMS, BM, BUSLOCK, TMR0E, L1BCMPO, L2BCMPO, and L3BCMPO.
8
Specifications applicable during reset only.
9
JTAG system pins include: RST_IN, RST_OUT, POR_IN, IRQ3-0, DMAR3-0, HBR, BOFF, MS1-0, MSH, SDCKE, LDQM, HDQM, BMS, IOWR, IORD, BM, EMU, SDA10,
IOEN, BUSLOCK, TMR0E, DATA63-0, ADDR31-0, RD, WRL, WRH, BRST, MSSD3-0, RAS, CAS, SDWE, HBG, BR7-0, FLAG3-0, L0DATOP3-0, L0DATON3-0,
L1DATOP3-0, L1DATON3-0, L2DATOP3-0, L2DATON3-0, L3DATOP3-0, L3DATON3-0, L0CLKOUTP, L0CLKOUTN, L1CLKOUTP, L1CLKOUTN, L2CLKOUTP,
L2CLKOUTN, L3CLKOUTP, L3CLKOUTN, L0ACKI, L1ACKI, L2ACKI, L3ACKI, L0DATIP3-0, L0DATIN3-0, L1DATIP3-0, L1DATIN3-0, L2DATIP3-0, L2DATIN3-0,
L3DATIP3-0, L3DATIN3-0, L0CLKINP, L0CLKINN, L1CLKINP, L1CLKINN, L2CLKINP, L2CLKINN, L3CLKINP, L3CLKINN, L0ACKO, L1ACKO, L2ACKO, L3ACKO,
ACK, CPA, DPA, L0BCMPO, L1BCMPO, L2BCMPO, L3BCMPO, L0BCMPI, L1BCMPI, L2BCMPI, L3BCMPI, ID2-0, CTRL_IMPD1-0, SCLKRAT2-0, DS2-0, ENEDREG.
2
REFERENCE
CLOCK
1.25V
tSCLK OR tTCK
INPUT
SIGNAL
1.25V
INPUT
SETUP
INPUT
HOLD
OUTPUT
SIGNAL
OUTPUT
VALID
OUTPUT
HOLD
1.25V
THREESTATE
OUTPUT
DISABLE
OUTPUT
ENABLE
Figure 11. General AC Parameters Timing
Rev. PrB
| Page 26 of 40 |
December 2003
Preliminary Technical Data
ADSP-TS202S
Link Port Low-Voltage, Differential-Signal (LVDS)
Electrical Characteristics and Timing
Table 23 and Table 24 with Figure 12 provide the electrical
characteristics for the LVDS link ports. The LVDS link port signal definitions represent all differential signals with a VOD = 0 V
level and use signal naming without N (negative) and P (positive) suffixes (see Figure 12).
Table 23. Link Port LVDS Transmit Electrical Characteristics
Parameter
VOH
VOL
|VOD|
IOS
Output Voltage High, VO_P or VO_N
Output Voltage Low, VO_P or VO_N
Output Differential Voltage
Short-circuit Output Current
VOCM
Common Mode Output Voltage
Test Conditions
RL = 100 Ω
RL = 100 Ω
RL = 100 Ω
VO_P or VO_N = 0 V
VOD = 0 V
Min
1.13
450
+5/- 40
+/- 5
1.38
Units
V
V
mV
mA
mA
V
Min
100
0.6
Max
600
1.57
Units
mV
V
0.92
150
Max
1.58
Table 24. Link Port LVDS Receive Electrical Characteristics
Parameter
|VID|
VICM
Test Conditions
Differential Input Voltage
Common Mode Input Voltage
VO_P
VOD = (VO_P – VO_N)
RL
VOCM =
(VO_P + VO_N )
2
VO_N
Figure 12. Link Ports—Transmit Electrical Characteristics
DIFFERENTIAL PAIR WAVEFORMS
Lx<PIN>P
V O_N
VO _P
Lx<PIN>N
DIFFERENTIAL VO LTAG E WAVEFORM
Lx<PIN>
V OD = 0V
V OD = VO _P – V O_N
Figure 13. Link Ports—Signals Definition
Rev. PrB
| Page 27 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
Link Port—Data Out Timing
Table 25 with Figure 14, Figure 15, Figure 16, Figure 17,
Figure 18, and Figure 19 provide the data out timing for the
LVDS link ports.
Table 25. Link Port—Data Out Timing
Parameter
Outputs
tREO
tFEO
tLCLKOP
Min
Rising Edge (Figure 14)
Falling Edge (Figure 14)
LxCLKOUT Period (Figure 15)
tLCLKOH
tLCLKOL
tCOJT
tLDOS
greater of 2.0 or
0.9×LCR×tCCLK1,2
0.4×tLCLKOP1
0.4×tLCLKOP1
LxCLKOUT High (Figure 15
LxCLKOUT Low (Figure 15)
LxCLKOUT Jitter (Figure 15)
LxDATO Output Setup, LCR = 1 and LCR = 1.5 (Figure 16) smaller of 2.53 or
0.25×LCR×tCCLK – 0.151,2,4
LxDATO Output Setup, LCR = 2 and LCR = 4 (Figure 16) smaller of 2.53 or
0.25×LCR×tCCLK – 0.31,2,4
LxDATO Output Hold, LCR = 1 and LCR = 1.5 (Figure 16) 0.25×LCR×tCCLK – 0.151,2,4
LxDATO Output Hold, LCR = 2 and LCR = 4 (Figure 16)
0.25×LCR×tCCLK – 0.31,2,4
Delay from LxACKI rising edge to first transmission clock
edge (Figure 17)
LxBCMPO Valid (Figure 17)
LxBCMPO Hold (Figure 18).
3×TSW - 0.51,,5
tLDOH
tLACKID
tBCMPOV
tBCMPOH
Inputs
tLACKIS
Max
Units
200
200
1.1×LCR×tCCLK1,2
ps
ps
ns
0.6×tLCLKOP1
0.6×tLCLKOP1
–/+70
ns
ns
ps
ns
ns
14×LCR×tCCLK1,2
2×LCR×tCCLK1,2
LxACKI low setup to guarantee that the transmitter stops 14×LCR×tCCLK1,2
transmitting (Figure 18).
LxACKI high setup to guarantee that the transmitter
continues its transmission without any interruption
(Figure 19).
LxACKI high hold time (Figure 18).
0.51
tLACKIH
ns
Timing is relative to the 0 differential voltage (VOD = 0)
LCR (Link port Clock Ratio) = 1, 1.5, 2 or 4. tCCLK is the core period
3
The 2.5 value for tLDOS applies for LCLKOUT≤100 MHz.
4
tLDOS and tLDOH values include LCLKOUT jitter.
5
TSW is a short-word transmission period. For a 4-Bit Link it is 2×LCR×tCCLK and for a 1-Bit Link is 8×LCR×tCCLK ns
2
VO_P
tLCLKOP
RL = 100⍀
CL_P
CL
VO_N
CL = 0.1pF
CL_P = 5pF
CL_N = 5pF
CL_N
VOD = 0V
LxCLKOUT
tCOJT
tREO
|
tLCLKOH
tLCLKOL
tFEO
|
+ VOD MIN
Figure 15. Link Ports—Output Clock
VOD = 0V
–|VOD| MIN
Figure 14. Link Ports—Differential Output Signals Transition Time
Rev. PrB
| Page 28 of 40 |
December 2003
ns
ns
ns
1
RL
ns
ns
ns
Preliminary Technical Data
ADSP-TS202S
LxCLKOUT
VOD = 0V
tLDOS tLDOH tLDOS tLDOH
LxDATO
VOD = 0V
Figure 16. Link Ports—Data Output Setup and Hold1
1
These parameters are valid for both clock edges
LxCLKOUT
VOD = 0V
LxDATO
VOD = 0V
tLACKID
LxACKI
tBCMPOV
LxBCMPO
Figure 17. Link Ports—Transmission Start
Rev. PrB
| Page 29 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
FIRST EDGE OF 5TH SHORT WORD IN A QUAD WORD
LAST EDGE IN A QUAD WORD
LxCLKOUT
VOD = 0V
LxDATO
VOD = 0V
tLACKIS
tLACKIH
LxACKI
tBCMPOH
LxBCMPO
Figure 18. Link Ports—Transmission End and Stops
LAST EDGE IN A QUAD WORD
LxCLKOUT
VOD = 0V
LxDATO
VOD = 0V
tLACKIS
tLACKIH
LxACKI
Figure 19. Link Ports—Back to Back Transmission
Rev. PrB
| Page 30 of 40 |
December 2003
Preliminary Technical Data
ADSP-TS202S
Link Port—Data In Timing
Table 26 with Figure 20, Figure 21, and Figure 22 provide the
data in timing for the LVDS link ports.
Table 26. Link Port—Data In Timing
1
Parameter
Inputs
tLCLKIP
Min
LxCLKIN Period (Figure 22)
tREI
tFEI
tLDIS
tLDIH
tBCMPIS
tBCMPIH
Rising Edge (Figure 21)
Falling Edge (Figure 21)
LxDATI Input Setup (Figure 22)
LxDATI Input Hold (Figure 22)
LxBCMPI Valid (Figure 20)
LxBCMPI Hold (Figure 20)
Max
Units
greater of 1.8 or
0.9×tCCLK1
ns
400
400
ps
ps
ns
ns
ns
ns
0.21
0.21
2×tLCLKIP1
2×tLCLKIP1
Timing is relative to the 0 differential voltage (VOD = 0)
FIRST EDGE IN FIFTH SHORT WORD IN A QUAD WORD
LxCLKIN
VOD = 0V
LxDATI
VOD = 0V
tBCMPIS
tBCMPIH
LxBCMPI
Figure 20. Link Ports—Last Received Quad Word
tREI
|
tLCLKIP
tFEI
|
+ VOD MIN
LxCLKIN
VOD = 0V
VOD = 0V
–|VOD| MIN
tLDIS
Figure 21. Link Ports—Differential Input Signals
Transition Time
tLDIH
tLDIS
tLDIH
LxDATI
VOD = 0V
Figure 22. Link Ports—Data Input Setup and Hold1
1
Rev. PrB
| Page 31 of 40 |
These parameters are valid for both clock edges
December 2003
ADSP-TS202S
Preliminary Technical Data
OUTPUT DRIVE CURRENTS
STRENGTH 0
30
25
IOL
20
IOL
60
VDD_IO = 2.5V, +25°C
20
V Y = 2.625V, –40°C
R
A
IN
DD_IO
VDD_IO = 2.375V, +85°C
0
IM
VDD_IO = 2.5V, +25°C
–20
–40 VDD_IO
EL
= 2.375V, +85°C
PR
–60
Y
AVR = 2.625V, –40°C
N
MI
5
0
–5
–100
0
DD_IO
VDD_IO = 2.375V, +85°C
EV L
= 2.375V, +85°C
PR
IOH
–80
VDD_IO = 2.5V, +25°C
10
I = 2.5V, +25°C
–10 VDD_IO
0.4
0.8
1.2
1.6
2.0
OUTPUT PIN VOLTAGE – V
2.4
2.8
Figure 25. Typical Drive Currents at Strength 2
DD_IO
–15
STRENGTH 3
125
–20
IOH
–25
IOL
100
–30
0.4
0.8
1.2
1.6
2.0
OUTPUT PIN VOLTAGE – V
2.4
2.8
Figure 23. Typical Drive Currents at Strength 0
STRENGTH 1
60
IOL
50
40
75
OUTPUT PIN CURRENT – mA
0
10
I
RY = 2.625V, –40°C
V
A
IN
25
DD_IO
VDD_IO = 2.375V, +85°C
0
IM
V L = 2.5V, +25°C
E
PR
= 2.375V, +85°C
DD_IO
–25
–50 VDD_IO
Y
VR = 2.625V, –40°C
A
IN
= 2.5V, +25°C
M
IOH
–125
DD_IO
VDD_IO = 2.375V, +85°C
0
VDD_IO = 2.5V, +25°C
–100
VDD_IO = 2.5V, +25°C
20
VDD_IO = 2.625V, –40°C
50
–75
VDD_IO = 2.625V, –40°C
30
0
0.4
0.8
1.2
1.6
2.0
OUTPUT PIN VOLTAGE – V
2.4
2.8
VDD_IO
–10
–20
VDD_IO
–30
EL
= 2.375V, +85°C
R
P
Figure 26. Typical Drive Currents at Strength 3
STRENGTH 4
–40
140
IOH
–50
IOL
120
–60
100
–70
80
0
0.4
0.8
1.2
1.6
2.0
OUTPUT PIN VOLTAGE – V
2.4
2.8
Figure 24. Typical Drive Currents at Strength 1
OUTPUT PIN CURRENT – mA
OUTPUT PIN CURRENT – mA
VDD_IO = 2.625V, –40°C
40
VDD_IO = 2.625V, –40°C
15
OUTPUT PIN CURRENT – mA
STRENGTH 2
80
OUTPUT PIN CURRENT – mA
Figure 23 through Figure 30 show typical I–V characteristics for
the output drivers of the ADSP-TS202S processor. The curves in
these diagrams represent the current drive capability of the output drivers as a function of output voltage over the range of
drive strengths. For complete output driver characteristics, refer
to the DSP’s IBIS models, available on the Analog Devices website (www.analog.com).
VDD_IO = 2.625V, –40°C
60
VDD_IO = 2.5V, +25°C
40
20
–20
EL
R
= 2.375V, +85°C
P
Y = 2.625V, –40°C
VR
A
N
MI
DD_IO
VDD_IO = 2.375V, +85°C
0
I
VDD_IO = 2.5V, +25°C
–40
–60 V
DD_IO
–80
–100
–120
IOH
–140
–160
0
0.4
0.8
1.2
1.6
2.0
OUTPUT PIN VOLTAGE – V
2.4
Figure 27. Typical Drive Currents at Strength 4
Rev. PrB
| Page 32 of 40 |
December 2003
2.8
Preliminary Technical Data
ADSP-TS202S
TEST CONDITIONS
STRENGTH 5
OUTPUT PIN CURRENT – mA
160
140
The ac signal specifications (timing parameters) appear
Table 22 on page 25. These include output disable time, output
enable time, and capacitive loading. The timing specifications
for the DSP apply for the voltage reference levels in Figure 31.
IOL
120
100
80
VDD_IO = 2.625V, –40°C
VDD_IO = 2.5V, +25°C
60
40
20
VDD_IO = 2.375V, +85°C
0
–20
–40
Y
VR = 2.625V, –40°C
A
N
MI
DD_IO
I
EL
R
P
–60
–80 VDD_IO = 2.375V, +85°C
–100
–120
–140
–160
0
0.4
0.8
1.2
1.6
2.0
OUTPUT PIN VOLTAGE – V
2.4
2.8
Figure 28. Typical Drive Currents at Strength 5
STRENGTH 6
180
160
IOL
140
120
VDD_IO = 2.625V, –40°C
100
80
VDD_IO = 2.5V, +25°C
60
40
VDD_IO = 2.625V, –40°C
20
VDD_IO = 2.375V, +85°C
0
–20
VDD_IO = 2.5V, +25°C
–40
–60
–80 VDD_IO = 2.375V, +85°C
–100
–120
–140
–160
IOH
–180
–200
–220
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
OUTPUT PIN VOLTAGE – V
EL
R
P
I
1.25V
1.25V
Figure 31. Voltage reference levels for AC measurements
(except output enable/disable)
IOH
–180
OUTPUT PIN CURRENT – mA
INPUT
OR
OUTPUT
VDD_IO = 2.5V, +25°C
RY
A
N
MI
Output Disable Time
Output pins are considered to be disabled when they stop driving, go into a high impedance state, and start to decay from their
output high or low voltage. The time for the voltage on the bus
to decay by ∆V is dependent on the capacitive load, CL and the
load current, IL. This decay time can be approximated by the following equation:
t DECAY = ( C L ∆V ) ⁄ I L
The output disable time tDIS is the difference between
tMEASURED_DIS and tDECAY as shown in Figure 32. The time
tMEASURED_DIS is the interval from when the reference signal
switches to when the output voltage decays ∆V from the measured output high or output low voltage. tDECAY is calculated
with test loads CL and IL, and with ∆V equal to 0.4 V.
REFERENCE
SIGNAL
tMEASURED_DIS
Figure 29. Typical Drive Currents at Strength 6
tENA
tDIS
OUTPUT PIN CURRENT – mA
STRENGTH 7
VOH (MEASURED)
220
200
IOL
180
160
140
VDD_IO = 2.625V, –40°C
120
100
VDD_IO = 2.5V, +25°C
80
60
40
VDD_IO = 2.625V, –40°C
20
VDD_IO = 2.375V, +85°C
0
–20
VDD_IO = 2.5V, +25°C
–40
–60
–80
–100 VDD_IO = 2.375V, +85°C
–120
–140
–160
IOH
–180
–200
–220
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
OUTPUT PIN VOLTAGE – V
EL
R
P
I
tMEASURED_ENA
VOL (MEASURED)
tDECAY
tRAMP
OUTPUT STARTS
DRIVING
HIGH-IMPEDANCE STATE.
TEST CONDITIONS CAUSE THIS
VOLTAGE TO BE APPROXIMATELY 1.25V
Figure 32. Output Enable/Disable
Figure 30. Typical Drive Currents at Strength 7
| Page 33 of 40 |
1.65V
0.85V
OUTPUT STOPS
DRIVING
RY
A
N
MI
Rev. PrB
VOH (MEASURED) – ⌬V
VOL (MEASURED) + ⌬V
December 2003
ADSP-TS202S
Preliminary Technical Data
Output Enable Time
t RAMP = ( C L ∆V ) ⁄ I D
The output enable time tENA is the difference between
tMEASURED_ENA and tRAMP as shown in Figure 32. The time
tMEASURED_ENA is the interval from when the reference signal
switches to when the output voltage ramps ∆V from the measured three-stated output level. tRAMP is calculated with test load
CL, drive current ID, and with ∆V equal to 0.4 V.
STRENGTH 1
25
RISE AND FALL TIMES – ns
Output pins are considered to be enabled when they have made
a transition from a high impedance state to when they start driving. The time for the voltage on the bus to ramp by ∆V is
dependent on the capacitive load, CL, and the drive current, ID.
This ramp time can be approximated by the following equation:
(VDD _IO = 2.5V)
20
15
RISE TIME
10
P
L
RE
IM
IN A
RY
y = 0.1349x + 1.9955
FALL TIME
y = 0.1163x + 1.4058
5
0
0
10
20
30
40
50
60
70
80
90
100
LOAD CAPACITANCE – pF
Figure 35. Typical Output Rise and Fall Time (10%–90%, VDD_IO = 2.5 V) vs.
Load Capacitance at Strength 1
Output valid and hold are based on standard capacitive loads:
30 pF on all pins (see Figure 33). The delay and hold specifications given should be derated by a drive strength related factor
for loads other than the nominal value of 30 pF. Figure 34
through Figure 41 show how output rise time varies with capacitance. Figure 42 graphically shows how output valid varies with
load capacitance. (Note that this graph or derating does not
apply to output disable delays; see Output Disable Time on
page 33.) The graphs of Figure 34 through Figure 42 may not be
linear outside the ranges shown.
STRENGTH 2
25
RISE AND FALL TIMES – ns
Capacitive Loading
50⍀
TO
OUTPUT
PIN
(VDD_IO = 2.5V)
20
15
I
EL
R
y = 0.1304x +P
0.8427
RY
A
N
MI
RISE TIME
10
FALL TIME
y = 0.1144x + 0.7025
5
1.25V
30pF
0
0
Figure 33. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
10
20
30
40
50
60
70
80
90
100
LOAD CAPACITANCE – pF
Figure 36. Typical Output Rise and Fall Time (10%–90%, VDD_IO = 2.5 V) vs.
Load Capacitance at Strength 2
STRENGTH 0
25
(VDD_IO = 2.5V)
STRENGTH 3
(VDD_IO = 2.5V)
20
RISE TIME
15
y = 0.2015x + 3.8869
10
P
L IM
E
R
RISE AND FALL TIMES – ns
RISE AND FALL TIMES – ns
25
RY
A
IN
FALL TIME
y = 0.174x + 2.6931
5
20
15
10
P
RISE TIME
L IM
E
R
RY
A
IN
y = 0.1082x + 1.3123
FALL TIME
y = 0.0912x + 1.2048
5
0
0
10
20
30
40
50
60
70
80
90
100
0
LOAD CAPACITANCE – pF
0
Figure 34. Typical Output Rise and Fall Time (10%–90%, VDD_IO = 2.5 V) vs.
Load Capacitance at Strength 0
Rev. PrB
| Page 34 of 40 |
10
20
30
40
50
60
70
80
90
100
LOAD CAPACITANCE – pF
Figure 37. Typical Output Rise and Fall Time (10%–90%, VDD_IO = 2.5 V) vs.
Load Capacitance at Strength 3
December 2003
Preliminary Technical Data
ADSP-TS202S
STRENGTH 4
STRENGTH 7
25
(VDD_IO = 2.5V)
RISE AND FALL TIMES – ns
RISE AND FALL TIMES – ns
25
20
RY
A
IN
M
I
EL
RISE TIMEPR
15
10
y = 0.1071x + 0.9877
20
15
10
P
RISE TIME
L IM
E
R
RY
A
N
I
y = 0.0907x + 1.0071
FALL TIME
5
FALL TIME
5
(VDD_IO = 2.5V)
y = 0.09x + 0.3134
y = 0.0798x + 1.0743
0
0
0
10
20
30
40
50
60
70
80
90
0
10
20
30
40
50
60
70
80
90
100
100
LOAD CAPACITANCE – pF
LOAD CAPACITANCE – pF
Figure 41. Typical Output Rise and Fall Time (10%–90%, VDD_IO = 2.5 V) vs.
Load Capacitance at Strength 7
Figure 38. Typical Output Rise and Fall Time (10%–90%, VDD_IO = 2.5 V) vs.
Load Capacitance at Strength 4
15
STRENGTH 5
STRENGTH 0–7
(V DD_IO = 2.5V)
(VDD_IO = 2.5V)
0
20
15
10
RISE TIME
P
LI
E
R
MI
OUTPUT VALID – ns
RISE AND FALL TIMES – ns
25
RY
A
N
10
E
PR
5
LI
N
MI
Y
AR
1
2
3
4
5
6
y = 0.1001x + 0.7763
7
5
FALL TIME
y = 0.0793x + 0.8691
0
0
10
20
30
40
50
60
70
80
90
0
100
0
10
LOAD CAPACITANCE – pF
1
STRENGTH 6
RISE AND FALL TIMES – ns
(VDD_IO = 2.5V)
20
15
10
P
RISE TIME
L IM
E
R
Y
AR
N
I
FALL TIME
y = 0.0906x + 0.4597
0
0
10
20
30
40
50
60
70
80
90
100
LOAD CAPACITANCE – pF
Figure 40. Typical Output Rise and Fall Time (10%–90%, VDD_IO = 2.5 V) vs.
Load Capacitance at Strength 6
Rev. PrB
90
The line equations for the output valid versus load capacitance are:
Strength 0: y = 0.0956x + 3.5662
Strength 1: y = 0.0523x + 3.2144
Strength 2: y = 0.0433x + 3.1319
Strength 3: y = 0.0391x + 2.9675
Strength 4: y = 0.0393x + 2.7653
Strength 5: y = 0.0373x + 2.6515
Strength 6: y = 0.0379x + 2.1206
Strength 7: y = 0.0399x + 1.9080
y = 0.0946x + 1.2187
5
30
40
50
60
70
80
LOAD CAPACITANCE – pF
100
Figure 42. Typical Output Valid (VDD_IO = 2.5 V) vs. Load Capacitance at Max
Case Temperature and Strength 0–71
Figure 39. Typical Output Rise and Fall Time (10%–90%, VDD_IO = 2.5 V) vs.
Load Capacitance at Strength 5
25
20
| Page 35 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
ENVIRONMENTAL CONDITIONS
Table 27 shows the thermal characteristics of the
25 mm × 25 mm BGA_ED package.
The ADSP-TS202S processor is rated for performance over the
extended commercial temperature range, TCASE = –40°C to
85°C.
Table 27. Thermal Characteristics
for 25 mm × 25 mm Package
Thermal Characteristics
Parameter
θJA
The ADSP-TS202S processor is packaged in a 25 mm × 25 mm
thermally enhanced Ball Grid Array (BGA_ED). The ADSPTS202S processor is specified for a case temperature (TCASE). To
ensure that the TCASE data sheet specification is not exceeded, a
heatsink and/or an air flow source may be used.
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
–
–
θJC
θJB
Typical
19.6
15.4
13.7
0.7
8.3
576-BALL BGA_ED PIN CONFIGURATIONS
Figure 43 shows a summary of pin configurations for the 576ball BGA_ED package and Table 28 lists the signal-to-ball
assignments.
2
1
4
3
6
5
8
7
10
9
14
12
11
13
16
15
20
18
17
19
24
22
21
23
A
B
C
D
E
F
G
H
KEY:
J
K
SIGNAL
L
VDD
M
VDD_IO
N
P
VDD_DRAM
R
VDD_A
T
VREF
U
VSS
V
W
Y
AA
AB
AC
AD
TOP VIEW
Figure 43. 576-ball BGA_ED Pin Configurations1 (top view, Summary)
1
For a more detailed pin summary diagram, see the EE-179: ADSP-TS201S System Design Guidelines on the Analog Devices website (www.analog.com)
Rev. PrB
| Page 36 of 40 |
December 2003
Units
°C/W
°C/W
°C/W
°C/W
°C/W
Preliminary Technical Data
ADSP-TS202S
Table 28. 576-Ball (25 mm × 25 mm) BGA_ED Pin Assignments
Pin#
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
E1
E2
E3
E4
E5
E6
E7
E8
E9
E10
E11
E12
E13
E14
E15
E16
E17
E18
E19
E20
E21
E22
E23
E24
Signal Name
VSS
DATA51
VSS
DATA49
DATA43
DATA41
DATA37
DATA33
DATA29
DATA25
DATA23
DATA19
DATA15
DATA11
DATA9
DATA5
DATA1
WRL
ADDR30
ADDR28
ADDR22
VSS
ADDR21
VSS
DATA61
DATA62
DATA57
DATA58
VSS
VDD_IO
VSS
VDD_IO
VSS
VDD_IO
VDD_IO
VDD_IO
VDD_IO
VDD_IO
VDD_IO
VSS
VDD_IO
VSS
VDD_IO
VSS
ADDR15
ADDR14
ADDR11
ADDR10
Pin#
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
F1
F2
F3
F4
F5
F6
F7
F8
F9
F10
F11
F12
F13
F14
F15
F16
F17
F18
F19
F20
F21
F22
F23
F24
Signal Name
DATA53
VSS
VSS
DATA50
DATA44
DATA42
DATA38
DATA34
DATA30
DATA26
DATA24
DATA20
DATA16
DATA12
DATA10
DATA6
DATA2
WRH
ADDR31
ADDR29
ADDR23
VSS
VSS
ADDR18
DATA63
MS1
DATA59
DATA60
VDD_IO
VDD
VDD
VDD
VDD
VDD
VDD_DRAM
VDD_DRAM
VDD
VDD
VDD_DRAM
VDD_DRAM
VDD
VDD
VDD
VDD_IO
ADDR13
ADDR12
ADDR9
ADDR8
Rev. PrB
Pin#
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
C22
C23
C24
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
G11
G12
G13
G14
G15
G16
G17
G18
G19
G20
G21
G22
G23
G24
| Page 37 of 40 |
Signal Name
VSS
VSS
VSS
DATA52
DATA47
DATA45
DATA39
DATA35
DATA31
DATA27
DATA21
DATA17
VSS
DATA13
DATA7
DATA3
ACK
RD
ADDR26
ADDR24
ADDR20
VSS
VDD_IO
VDD_IO
MSSD1
VSS
MS0
BMS
VSS
VDD
VDD
VDD
VDD
VDD
VDD_DRAM
VDD_DRAM
VDD
VDD
VDD_DRAM
VDD_DRAM
VDD
VDD
VDD
VDD_IO
ADDR7
ADDR6
ADDR5
ADDR4
December 2003
Pin#
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
D16
D17
D18
D19
D20
D21
D22
D23
D24
H1
H2
H3
H4
H5
H6
H7
H8
H9
H10
H11
H12
H13
H14
H15
H16
H17
H18
H19
H20
H21
H22
H23
H24
Signal Name
DATA55
DATA56
DATA54
VSS
DATA48
DATA46
DATA40
DATA36
DATA32
DATA28
DATA22
DATA18
VSS
DATA14
DATA8
DATA4
DATA0
BRST
ADDR27
ADDR25
VSS
ADDR19
ADDR17
ADDR16
VSS
MSH
MSSD3
SCLKRAT0
VDD_IO
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD_IO
ADDR3
ADDR2
ADDR1
ADDR0
ADSP-TS202S
Preliminary Technical Data
Table 28. 576-Ball (25 mm × 25 mm) BGA_ED Pin Assignments (Continued)
Pin#
J1
J2
J3
J4
J5
J6
J7
J8
J9
J10
J11
J12
J13
J14
J15
J16
J17
J18
J19
J20
J21
J22
J23
J24
N1
N2
N3
N4
N5
N6
N7
N8
N9
N10
N11
N12
N13
N14
N15
N16
N17
N18
N19
N20
N21
N22
N23
N24
Signal Name
RAS
CAS
VSS
VREF
VSS
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VSS
L0ACKO
L0BCMPI
L0DATI0_N
L0DATI0_P
ID0
VSS
VDD_A
VDD_A
VDD_IO
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD_IO
L0DATO2_N
L0DATO2_P
L0CLKON
L0CLKOP
Pin#
K1
K2
K3
K4
K5
K6
K7
K8
K9
K10
K11
K12
K13
K14
K15
K16
K17
K18
K19
K20
K21
K22
K23
K24
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
Signal Name
SDA10
SDCKE
LDQM
HDQM
VDD_IO
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD_DRAM
VDD_DRAM
VDD_IO
L0DATI1_N
L0DATI1_P
L0CLKINN
L0CLKINP
SCLK
SCLK_VREF
VSS
BM
VDD_IO
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD_DRAM
VDD_DRAM
VDD_IO
L0DATO1_N
L0DATO1_P
L0DATO0_N
L0DATO0_P
Rev. PrB
Pin#
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
L12
L13
L14
L15
L16
L17
L18
L19
L20
L21
L22
L23
L24
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R13
R14
R15
R16
R17
R18
R19
R20
R21
R22
R23
R24
| Page 38 of 40 |
Signal Name
SDWE
BR0
BR1
BR2
VDD_IO
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD_DRAM
VDD_DRAM
VDD_IO
L0DATI3_N
L0DATI3_P
L0DATI2_N
L0DATI2_P
VSS
NC (SCLK)1
NC (SCLK_VREF)1
BR7
VDD_IO
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD_DRAM
VDD_DRAM
VDD_IO
NC
VSS
L0BCMPO
L0ACKI
December 2003
Pin#
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
M13
M14
M15
M16
M17
M18
M19
M20
M21
M22
M23
M24
T1
T2
T3
T4
T5
T6
T7
T8
T9
T10
T11
T12
T13
T14
T15
T16
T17
T18
T19
T20
T21
T22
T23
T24
Signal Name
BR3
SCLKRAT1
BR5
BR6
VDD_IO
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD_IO
VSS
VSS
L0DATO3_N
L0DATO3_P
RST_IN
SCLKRAT2
BR4
DS0
VSS
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VSS
L1DATI0_N
L1DATI0_P
L1ACKO
L1BCMPI
Preliminary Technical Data
ADSP-TS202S
Table 28. 576-Ball (25 mm × 25 mm) BGA_ED Pin Assignments (Continued)
Pin#
U1
U2
U3
U4
U5
U6
U7
U8
U9
U10
U11
U12
U13
U14
U15
U16
U17
U18
U19
U20
U21
U22
U23
U24
AA1
AA2
AA3
AA4
AA5
AA6
AA7
AA8
AA9
AA10
AA11
AA12
AA13
AA14
AA15
AA16
AA17
AA18
AA19
AA20
AA21
AA22
AA23
AA24
1
Signal Name
MSSD0
RST_OUT
ID2
DS1
VDD_IO
VDD
VDD
VSS
VSS
VDD
VDD_DRAM
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD_IO
L1CLKINN
L1CLKINP
L1DATI1_N
L1DATI1_P
FLAG2
FLAG1
IRQ3
VSS
IRQ0
IOEN
DMAR0
HBR
L3BCMPO
L3DATO1_N
L3DATO3_N
VSS
L3DATI2_N
L3DATI1_N
NC
L2DATO0_N
L2CLKON
L2DATO3_N
L2CLKINN
L2DATI1_N
VSS
L1BCMPO
L1DATO0_N
L1DATO0_P
Pin#
V1
V2
V3
V4
V5
V6
V7
V8
V9
V10
V11
V12
V13
V14
V15
V16
V17
V18
V19
V20
V21
V22
V23
V24
AB1
AB2
AB3
AB4
AB5
AB6
AB7
AB8
AB9
AB10
AB11
AB12
AB13
AB14
AB15
AB16
AB17
AB18
AB19
AB20
AB21
AB22
AB23
AB24
Signal Name
MSSD2
DS2
POR_IN
CONTROLIMP1
VSS
VDD
VDD
VDD
VDD
VDD
VDD_DRAM
VDD_DRAM
VDD
VDD
VDD_DRAM
VDD_DRAM
VDD
VDD
VDD
VDD_IO
L1DATI3_N
L1DATI3_P
L1DATI2_N
L1DATI2_P
VSS
VSS
VSS
NC
IRQ2
IRQ1
DMAR1
HBG
L3ACKI
L3DATO1_P
L3DATO3_P
VSS
L3DATI2_P
L3DATI1_P
VSS
L2DATO0_P
L2CLKOP
L2DATO3_P
L2CLKINP
L2DATI1_P
L2ACKO
VSS
VDD_IO
VDD_IO
Pin#
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12
W13
W14
W15
W16
W17
W18
W19
W20
W21
W22
W23
W24
AC1
AC2
AC3
AC4
AC5
AC6
AC7
AC8
AC9
AC10
AC11
AC12
AC13
AC14
AC15
AC16
AC17
AC18
AC19
AC20
AC21
AC22
AC23
AC24
Signal Name
CONTROLIMP0
ENEDREG
TDI
TDO
VDD_IO
VDD
VDD
VDD
VDD
VDD
VDD_DRAM
VDD_DRAM
VDD
VDD
VDD_DRAM
VDD_DRAM
VDD
VDD
VDD
VDD_IO
L1CLKON
L1CLKOP
L1DATO3_N
L1DATO3_P
FLAG0
VSS
VDD_IO
TMS
IOWR
DMAR2
CPA
BOFF
L3DATO0_N
L3CLKON
L3DATO2_N
L3DATI3_N
L3CLKINN
L3DATI0_N
L3ACKO
L2BCMPO
L2DATO1_N
L2DATO2_N
L2DATI3_N
L2DATI2_N
L2DATI0_N
VDD_IO
VSS
L1ACKI
Pin#
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
Y11
Y12
Y13
Y14
Y15
Y16
Y17
Y18
Y19
Y20
Y21
Y22
Y23
Y24
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
AD24
Signal Name
EMU
TCK
TMR0E
FLAG3
VSS
VDD_IO
VSS
VDD_IO
VSS
VDD_IO
VDD_IO
VDD_IO
VDD_IO
VDD_IO
VDD_IO
VSS
VDD_IO
VSS
VDD_IO
VSS
L1DATO1_N
L1DATO1_P
L1DATO2_N
L1DATO2_P
VSS
ID1
VDD_IO
TRST
IORD
DMAR3
DPA
BUSLOCK
L3DATO0_P
L3CLKOP
L3DATO2_P
L3DATI3_P
L3CLKINP
L3DATI0_P
L3BCMPI
L2ACKI
L2DATO1_P
L2DATO2_P
L2DATI3_P
L2DATI2_P
L2DATI0_P
VDD_IO
L2BCMPI
VSS
On revision 1.x silicon, the R2 and R3 pins are NC. On revision 0.x silicon, the R2 pin is SCLK, and the R3 pin is SCLK_VREF. For more information on SCLK and SCLK_VREF
on revision 0.x silicon, see the EE-179: ADSP-TS20x TigerSHARC System Design Guidelines on the Analog Devices website (www.analog.com).
Rev. PrB
| Page 39 of 40 |
December 2003
ADSP-TS202S
Preliminary Technical Data
OUTLINE DIMENSIONS
The ADSP-TS202S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced Ball Grid Array (BGA_ED) package with 24 rows of balls (BP-576).
25.20
25.00
24.80
24 22 20 18 16 14 12 10 8 6 4 2
23 21 19 17 15 13 11 9 7 5 3 1
B
1.25
1.00
0.75
1.00
BSC
A1 BALL
INDICATOR
D
F
H
25.20
25.00
24.80
23.00
BSC
SQ
K
M
P
1.00
BSC
SQ
BALL
PITCH
T
V
Y
AB
AD
1.25
1.00
0.75
1.00
BSC
A
C
E
G
J
L
N
R
U
W
AA
AC
25.20
25.00 SQ
24.80
TOP VIEW
BOTTOM VIEW
DETAIL A
1.60 MAX
0.97 BSC
3.10 MAX
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GR ID IS WITHIN 0.25m m OF ITS
IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.
3. THE ACTUAL POSITION OF EACH BALL IS WITHIN 0.10mm OF ITS
IDEAL POSITION RELATIVE TO THE BALL GRID.
4. CENTER DIMENSIONS ARE N OMINAL.
5. THIS PACKAGE C ONFORMS WITH TH E JEDEC MS-034 SPECIFICATION.
0.60
0.50
0.40
SEATING PLANE
0.75
0.65
0.55
BALL DIAMETER
0.20 MAX
DETAIL A
Figure 44. 576-ball BGA_ED (BP-576)
ORDERING GUIDE
Part Number1,2,3,4
ADSP-TS202SABP-X
Case
Temperature
Range
–40°C to 85°C
Instruction
Rate5
On-chip
DRAM
Operating
Voltage
Package
500 MHz
12Mbit
1.0 VDD
2.5 VDD_IO
1.5 VDD_DRAM
(BP-576)6
1
S indicates 1.0/2.5 V supplies.
A indicates –40°C to 85°C temperature.
3
BP indicated thermally enhanced Ball Grid Array (BGA_ED) package.
4
-X indicates engineering grade product.
5
The instruction rate is the same as the internal DSP clock (CCLK) rate.
6
The BP-576 package measures 25mm × 25mm.
2
© 2003 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00000-0-03/03(0)
Rev. PrB
a
| Page 40 of 40 |
December 2003
www.analog.com