TI1 LM20CIM7 Lm20 2.4v, 10î¼a, sc70, dsbga temperature sensor Datasheet

LM20
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SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013
LM20 2.4V, 10µA, SC70, DSBGA Temperature Sensor
Check for Samples: LM20
FEATURES
1
•
•
•
•
2
Rated for full −55°C to +130°C range
Available in an SC70 and DSBGA package
Predictable Curvature Error
Suitable for Remote Applications
APPLICATIONS
•
•
•
•
•
•
•
•
•
Cellular Phones
Computers
Power Supply Modules
Battery Management
FAX Machines
Printers
HVAC
Disk Drives
Appliances
KEY SPECIFICATIONS
•
•
•
•
•
•
•
Accuracy at 30°C ±1.5 to ±4 °C (max)
Accuracy at 130°C and −55°C ±2.5 to ±5 °C
(max)
Power Supply Voltage Range 2.4 to 5.5 V
Current Drain 10 μA (max)
Nonlinearity ±0.4% (typ)
Output Impedance 160 Ω (max)
Load Regulation
0 μA < IL< 16 μA −2.5 mV (max)
DESCRIPTION
The LM20 is a precision analog output CMOS
integrated-circuit temperature sensor that operates
over a −55°C to 130°C temperature range. The
power supply operating range is 2.4 V to 5.5 V. The
transfer function of LM20 is predominately linear, yet
has a slight predictable parabolic curvature. The
accuracy of the LM20 when specified to a parabolic
transfer function is ±1.5°C at an ambient temperature
of 30°C. The temperature error increases linearly and
reaches a maximum of ±2.5°C at the temperature
range extremes. The temperature range is affected
by the power supply voltage. At a power supply
voltage of 2.7 V to 5.5 V the temperature range
extremes are 130°C and −55°C. Decreasing the
power supply voltage to 2.4 V changes the negative
extreme to −30°C, while the positive remains at
130°C.
The LM20 quiescent current is less than 10 μA.
Therefore, self-heating is less than 0.02°C in still air.
Shutdown capability for the LM20 is intrinsic because
its inherent low power consumption allows it to be
powered directly from the output of many logic gates
or does not necessitate shutdown at all.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM20
SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013
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Typical Application
Full-Range Celsius (Centigrade) Temperature Sensor (−55°C TO 130°C)
Operating From a Single LI-Ion Battery Cell
VO = (−3.88×10−6×T2) + (−1.15×10−2×T) + 1.8639
where:
T is temperature, and VO is the measured output voltage of the LM20.
Output Voltage vs Temperature
Table 1. Output Voltage vs Temperature
2
Temperature (T)
Typical VO
130°C
303 mV
100°C
675 mV
80°C
919 mV
30°C
1515 mV
25°C
1574 mV
0°C
1863.9 mV
–30°C
2205 mV
−40°C
2318 mV
−55°C
2485 mV
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Connection Diagrams
GND (pin 2) may be grounded or left floating. For optimum thermal conductivity to the pc board ground plane, pin 2
must be grounded.
NC (pin 1) must be left floating or grounded. Other signal traces must not be connected to this pin.
Figure 1. SC70-5 Top View
Package Number DCK0005A
Pin numbers are referenced to the package marking text orientation.
Reference JEDEC Registration MO-211, variation BA
The actual physical placement of package marking will vary slightly from part to part. The package marking will
designate the date code and will vary considerably. Package marking does not correlate to device type in any way.
Figure 2. DSBGA Top View
Package Number YZR0004ZZA
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
Supply Voltage
6.5V to −0.2V
Output Voltage
(V+ + 0.6 V) to −0.6 V
Output Current
10 mA
Input Current at any pin
(2)
5 mA
−65°C to 150°C
Storage Temperature
Maximum Junction Temperature (TJMAX)
ESD Susceptibility
(3)
150°C
Human Body Model
2500 V
Machine Model
250 V
Soldering process must comply with TI's
Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging. (4)
(1)
(2)
(3)
(4)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V+), the current at that pin should be limited to 5 mA.
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Reflow temperature profiles are different for lead-free and non-lead-free packages.
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LM20
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Operation Ratings (1)
TMIN ≤ TA ≤ TMAX
Specified Temperature Range:
LM20B, LM20C with
2.4 V ≤ V+≤ 2.7 V
−30°C ≤ TA ≤ 130°C
LM20B, LM20C with
2.7 V ≤ V+≤ 5.5 V
−55°C ≤ TA ≤ 130°C
LM20S with
2.4 V ≤ V+≤ 5.5 V
−30°C ≤ TA ≤ 125°C
LM20S with
2.7 V ≤ V+≤ 5.5 V
−40°C ≤ TA ≤ 125°C
Supply Voltage Range (V+)
2.4 V to 5.5 V
Thermal Resistance, θJA (2)
SC70
DSBGA
415°C/W
340°C/W
(1)
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air using the printed circuit board layout shown in
PCB Layouts Used For Thermal Measurements.
Electrical Characteristics
Unless otherwise noted, these specifications apply for V+ = +2.7 VDC. Boldface limits apply for TA = TJ = TMIN to TMAX ; all
other limits TA = TJ = 25°C; Unless otherwise noted.
PARAMETER
Temperature to Voltage Error
VO = (−3.88×10−6×T2)
+ (−1.15×10−2×T) + 1.8639V
(3)
CONDITIONS
TYPICAL
(1)
LM20B
LM20C
LM20S
Limits
Limits
Limits
UNIT
(Limit)
(2)
(2)
(2)
TA = 25°C to 30°C
±1.5
±4.0
±2.5
TA = 130°C
±2.5
±5.0
TA = 125°C
±2.5
±5.0
±3.5
°C (max)
TA = 100°C
±2.2
±4.7
±3.2
°C (max)
TA = 85°C
±2.1
±4.6
±3.1
°C (max)
TA = 80°C
±2.0
±4.5
±3.0
°C (max)
TA = 0°C
±1.9
±4.4
±2.9
°C (max)
TA = –30°C
±2.2
±4.7
±3.3
°C (min)
TA = –40°C
±2.3
±4.8
±3.5
°C (max)
TA = –55°C
±2.5
±5.0
°C (max)
°C (max)
°C (max)
Output Voltage at 0°C
1.8639
V
Variance from Curve
±1.0
°C
Non-Linearity
(4)
–20°C ≤ TA ≤ 80°C
Sensor Gain (Temperature
Sensitivity or Average Slope) to
–30°C ≤ TA ≤ 100°C
equation: VO=−11.77
mV/°C×T+1.860V
Output Impedance
(1)
(2)
(3)
(4)
(5)
(6)
4
±0.4%
−11.77
0 μA ≤ IL ≤ 16 μA
(5) (6)
−11.4
−12.2
−11.0
−12.6
−11.0
−12.6
mV/°C (min)
mV/°C (max)
160
160
160
Ω (max)
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
Accuracy is defined as the error between the measured and calculated output voltage at the specified conditions of voltage, current, and
temperature (expressed in°C).
Non-Linearity is defined as the deviation of the calculated output-voltage-versus-temperature curve from the best-fit straight line, over
the temperature range specified.
Negative currents are flowing into the LM20. Positive currents are flowing out of the LM20. Using this convention the LM20 can at most
sink −1 μA and source 16 μA.
Load regulation or output impedance specifications apply over the supply voltage range of 2.4V to 5.5V.
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Electrical Characteristics (continued)
Unless otherwise noted, these specifications apply for V+ = +2.7 VDC. Boldface limits apply for TA = TJ = TMIN to TMAX ; all
other limits TA = TJ = 25°C; Unless otherwise noted.
PARAMETER
Load Regulation (7)
Line Regulation (8)
Quiescent Current
Change of Quiescent Current
CONDITIONS
(7)
(8)
(1)
LM20B
LM20C
LM20S
Limits
Limits
Limits
UNIT
(Limit)
(2)
(2)
(2)
0 μA ≤ IL ≤ 16 μA
−2.5
−2.5
−2.5
mV (max)
2.4 V ≤ V+ ≤ 5.0V
3.3
3.7
3.7
mV/V (max)
(5) (6)
+
5.0 V ≤ V ≤ 5.5 V
11
11
11
mV (max)
2.4V ≤ V+ ≤ 5.0V
4.5
7
7
7
μA (max)
5.0V ≤ V+ ≤ 5.5V
4.5
9
9
9
μA (max)
+
2.4V ≤ V ≤ 5.0V
4.5
10
10
10
μA (max)
2.4 V ≤ V+ ≤ 5.5V
0.7
μA
−11
nA/°C
0.02
μA
Temperature Coefficient of
Quiescent Current
Shutdown Current
TYPICAL
V+ ≤ 0.8 V
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
Line regulation is calculated by subtracting the output voltage at the highest supply input voltage from the output voltage at the lowest
supply input voltage.
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LM20
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Typical Performance Characteristics
Temperature Error
vs
Temperature
Figure 3.
PCB LAYOUTS USED FOR THERMAL MEASUREMENTS
Figure 4. Layout Used For No Heat Sink Measurements
Figure 5. Layout Used For Measurements With Small Heat Sink
LM20 Transfer Function
The LM20 transfer function can be described in different ways with varying levels of precision. A simple linear
transfer function, with good accuracy near 25°C, is
VO = −11.69 mV/°C × T + 1.8663 V
(1)
Over the full operating temperature range of −55°C to 130°C, best accuracy can be obtained by using the
parabolic transfer function.
VO = (−3.88×10−6×T2) + (−1.15×10−2×T) + 1.8639
(2)
solving for T:
(3)
A linear transfer function can be used over a limited temperature range by calculating a slope and offset that give
best results over that range. A linear transfer function can be calculated from the parabolic transfer function of
the LM20. The slope of the linear transfer function can be calculated using the following equation:
m = −7.76 × 10−6× T − 0.0115,
6
(4)
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where T is the middle of the temperature range of interest and m is in V/°C. For example for the temperature
range of TMIN = −30 to TMAX = +100°C:
T = 35°C
(5)
m = −11.77 mV/°C
(6)
and
The offset of the linear transfer function can be calculated using the following equation:
b = (VOP(TMAX) + VOP(T) − m × (TMAX+T))/2
(7)
where:
• VOP(TMAX) is the calculated output voltage at TMAX using the parabolic transfer function for VO
• VOP(T) is the calculated output voltage at T using the parabolic transfer function for VO.
Using this procedure the best fit linear transfer function for many popular temperature ranges was calculated in
Table 2. As shown in Table 2 the error that is introduced by the linear transfer function increases with wider
temperature ranges.
Table 2. First Order Equations Optimized for Different Temperature Ranges
Temperature Range
Linear Equation
VO =
Maximum Deviation of Linear Equation from
Parabolic Equation (°C)
Tmin (°C)
Tmax (°C)
−55
130
−11.79 mV/°C × T + 1.8528 V
±1.41
−40
110
−11.77 mV/°C × T + 1.8577 V
±0.93
−30
100
−11.77 mV/°C × T + 1.8605 V
±0.70
-40
85
−11.67 mV/°C × T + 1.8583 V
±0.65
−10
65
−11.71 mV/°C × T + 1.8641 V
±0.23
35
45
−11.81 mV/°C × T + 1.8701 V
±0.004
20
30
–11.69 mV/°C × T + 1.8663 V
±0.004
Mounting
The LM20 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued
or cemented to a surface. The temperature that the LM20 is sensing will be within about +0.02°C of the surface
temperature to which the LM20's leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature measured would
be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the LM20 die is directly attached to the pin 2 GND pin. The
tempertures of the lands and traces to the other leads of the LM20 will also affect the temperature that is being
sensed.
Alternatively, the LM20 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LM20 and accompanying wiring and circuits must be
kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy
paints or dips are often used to ensure that moisture cannot corrode the LM20 or its connections.
The thermal resistance junction to ambient (θJA) is the parameter used to calculate the rise of a device junction
temperature due to its power dissipation. For the LM20 the equation used to calculate the rise in the die
temperature is as follows:
TJ = TA + θJA [(V+ IQ) + (V+ − VO) IL]
where IQ is the quiescent current and ILis the load current on the output. Since the LM20's junction temperature
is the actual temperature being measured care should be taken to minimize the load current that the LM20 is
required to drive.
The tables shown in Table 3 summarize the rise in die temperature of the LM20 without any loading, and the
thermal resistance for different conditions.
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LM20
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Table 3. Temperature Rise of LM20 Due to Self-Heating and Thermal Resistance (θJA) (1)
SC70-5
SC70-5
No Heat Sink
Small Heat Sink
θJA
TJ − TA
θJA
(°C/W)
(°C)
(°C/W)
(°C)
Still air
412
0.2
350
0.19
Moving air
312
0.17
266
0.15
(1)
TJ − TA
See PCB Layouts Used For Thermal Measurements for PCB layout samples.
DSBGA
DSBGA
No Heat Sink
Small Heat Sink
θJA
TJ − TA
θJA
(°C/W)
(°C)
(°C/W)
TJ − TA
(°C)
Still air
340
0.18
TBD
TBD
Moving air
TBD
TBD
TBD
TBD
Capacitive Loads
The LM20 handles capacitive loading well. Without any precautions, the LM20 can drive any capacitive load less
than 300 pF as shown in Figure 6. Over the specified temperature range the LM20 has a maximum output
impedance of 160 Ω. In an extremely noisy environment it may be necessary to add some filtering to minimize
noise pickup. It is recommended that 0.1 μF be added from V+ to GND to bypass the power supply voltage, as
shown in Figure 7. In a noisy environment it may even be necessary to add a capacitor from the output to ground
with a series resistor as shown in Figure 7. A 1 μF output capacitor with the 160 Ω maximum output impedance
and a 200 Ω series resistor will form a 442 Hz lowpass filter. Since the thermal time constant of the LM20 is
much slower, the overall response time of the LM20 will not be significantly affected.
Figure 6. LM20 No Decoupling Required for Capacitive Loads Less Than 300 pF
R (Ω)
8
C (µF)
200
1
470
0.1
680
0.01
1k
0.001
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Figure 7. LM20 with Filter for Noisy Environment and Capacitive Loading Greater Than 300 pF
NOTE
Either placement of resistor as shown above is just as effective.
LM20 DSBGA Light Sensitivity
Exposing the LM20 DSBGA package to bright sunlight may cause the output reading of the LM20 to drop by
1.5V. In a normal office environment of fluorescent lighting the output voltage is minimally affected (less than a
millivolt drop). In either case it is recommended that the LM20 DSBGA be placed inside an enclosure of some
type that minimizes its light exposure. Most chassis provide more than ample protection. The LM20 does not
sustain permanent damage from light exposure. Removing the light source will cause LM20's output voltage to
recover to the proper value.
APPLICATION CIRCUITS
V+
VTEMP
R3
VT1
R4
VT2
LM4040
V+
VT
R1
4.1V
U3
0.1 PF
LM20
R2
(High = overtemp alarm)
+
U1
-
VOUT
VOUT
LM7211
VTemp
U2
VT1 =
(4.1)R2
R2 + R1||R3
VT2 =
(4.1)R2||R3
R1 + R2||R3
Figure 8. Centigrade Thermostat
Figure 9. Conserving Power Dissipation with Shutdown
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Figure 10. Suggested Connection to a Sampling Analog to Digital Converter Input Stage
Most CMOS ADCs found in ASICs have a sampled data comparator input structure that is notorious for causing
grief to analog output devices such as the LM20 and many op amps. The cause of this grief is the requirement of
instantaneous charge of the input sampling capacitor in the ADC. This requirement is easily accommodated by
the addition of a capacitor. Since not all ADCs have identical input stages, the charge requirements will vary
necessitating a different value of compensating capacitor. This ADC is shown as an example only. If a digital
output temperature is required please refer to devices such as the LM74.
10
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SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013
REVISION HISTORY
Changes from Revision O (February 2013) to Revision P
•
Page
Changed layout of National Data Sheet to TI Format ........................................................................................................ 10
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PACKAGE OPTION ADDENDUM
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1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM20BIM7
NRND
SC70
DCK
5
1000
TBD
Call TI
Call TI
-55 to 130
T2B
LM20BIM7/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 130
T2B
LM20BIM7X
NRND
SC70
DCK
5
3000
TBD
Call TI
Call TI
-55 to 130
T2B
LM20BIM7X/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 130
T2B
LM20CIM7
NRND
SC70
DCK
5
1000
TBD
Call TI
Call TI
-55 to 130
T2C
LM20CIM7/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 130
T2C
LM20CIM7X
NRND
SC70
DCK
5
3000
TBD
Call TI
Call TI
-55 to 130
T2C
LM20CIM7X/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-55 to 130
T2C
LM20SITL/NOPB
ACTIVE
DSBGA
YZR
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LM20SITLX/NOPB
ACTIVE
DSBGA
YZR
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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(4)
1-Nov-2013
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM20BIM7
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LM20BIM7/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LM20BIM7X
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LM20BIM7X/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LM20CIM7
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LM20CIM7/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LM20CIM7X
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LM20CIM7X/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LM20SITL/NOPB
DSBGA
YZR
4
250
178.0
8.4
1.04
1.04
0.76
4.0
8.0
Q1
LM20SITLX/NOPB
DSBGA
YZR
4
3000
178.0
8.4
1.04
1.04
0.76
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM20BIM7
SC70
DCK
5
1000
210.0
185.0
35.0
LM20BIM7/NOPB
SC70
DCK
5
1000
210.0
185.0
35.0
LM20BIM7X
SC70
DCK
5
3000
210.0
185.0
35.0
LM20BIM7X/NOPB
SC70
DCK
5
3000
210.0
185.0
35.0
LM20CIM7
SC70
DCK
5
1000
210.0
185.0
35.0
LM20CIM7/NOPB
SC70
DCK
5
1000
210.0
185.0
35.0
LM20CIM7X
SC70
DCK
5
3000
210.0
185.0
35.0
LM20CIM7X/NOPB
SC70
DCK
5
3000
210.0
185.0
35.0
LM20SITL/NOPB
DSBGA
YZR
4
250
210.0
185.0
35.0
LM20SITLX/NOPB
DSBGA
YZR
4
3000
210.0
185.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
YZR0004xxx
D
0.600±0.075
E
TLA04XXX (Rev D)
D: Max = 0.994 mm, Min =0.933 mm
E: Max = 0.994 mm, Min =0.933 mm
4215042/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
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