NCS37000 Ground Fault Circuit Interrupter (GFCI) Description Features • 6.0 – 12 Volt Operation (120 − 480 V AC mains with the appropriate • • • • • • • • • • series impedance) −40 to 85°C Very Low Power Consumption: <5 mW @ 5 V 16 Pin QFN Package or 20 Pin TSSOP Package Single Current Transformer (CT) Detection of both Differential and Grounded−Neutral Faults Self Syncing Internal Oscillator Adjusts to AC Mains Frequency to Guarantee Full Resolution on 50 and 60 Hz Distribution Systems Optimized Solenoid Deployment (coil is not energized near the AC mains zero crossings) Randomized Testing Sequence to Minimize Noise and Potential Interactions on the AC Mains >5 mA SCR Driver for use with High Igt SCR’s for Improved Noise Immunity Superior Immunity to Nuisance Loads/Noise (up to 10 A) without Loss of Detection Capability or CT Saturation These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications http://onsemi.com 20 1 QFN16 MN SUFFIX CASE 485G TSSOP−20 DA SUFFIX CASE 948E 1 MARKING DIAGRAMS 37000 MNG ALYW G 3700 0DBG ALYWG A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package PIN CONNECTIONS Supply SCRdrv The NCS37000 is a fully UL943 compliant signal processor for GFCI applications. The device integrates a flexible power supply (including both shunt and LDO regulators), differential fault, and grounded-neutral detection circuits. Proprietary impedance measurement and signal processing techniques are used to minimize the number of external components and improve performance. The device also includes a specialized DSP controller that offers best in class immunity to nuisance loads without the need for external analog filters. MLD CTresGN CTbias CTstim 1 (Top View) CTresD IDF • Load Panel GFCI Breakers • GFCI Receptacles • In−line GFCI Circuits (power cords) GND ORDERING INFORMATION Device NCS37000MNTWG NCS37000MNG NCS37000DBRG NCS37000DBG Package Shipping† 2500/Tape & Reel QFN16 (Pb−Free) 120 Units / Tube TSSOP20 2500/Tape & Reel (Pb−Free) 74 Units / Tube †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2012 December, 2012 − Rev. 0 1 Publication Order Number: NCS37000/D Supply NCS37000 − HV Bandgap Brown Out + AVDD/ DVDD − + POR CTresGN Grounded Neutral Detection IDF Low Pass Filter Differential Current Detection SCRdrv Mixer Self Trimmed RC Osc CTresD Control Logic and Digital Filter TE Offset Correction Driver CTstim Waveform Generator TestDin1−5 TestDout1−2 Vbias MLD G2N Randomizer VSS CTbias Figure 1. Simplified Block Diagram http://onsemi.com 2 Mains Level Detect (Zero Cross) NCS37000 Table 1. PIN FUNCTION DESCRIPTION − QFN Pin # Name Pad Description 0 Ground 1 MLD 2 CTresGN 3 CTbias Direct connection to the CT 4 CTstim Direct connection to the CT 5 CTresD Determines IV converter gain for detection threshold / matched to CT turns ratio (Differential Current) 6 IDF Front end noise filter capacitor 7 NC Tie to Ground or leave floating 8 NC Float QFN center slug Mains Level Detect (Zero Cross) Determines IV converter gain for detection threshold / matched to CT turns ratio (Ground-Neutral) 9 NC Tie to Ground or leave floating 10 NC Tie to Ground or leave floating 11 NC Tie to Ground or leave floating 12 NC Tie to Ground or leave floating 13 NC Float 14 NC Float 15 SCRdrv Used to trigger the solenoid at a fault detection 16 Supply Power supply Table 2. PIN FUNCTION DESCRIPTION − TSSOP Pin # Name Pad Description 1 CTstim Differential and ground to neutral stimulus point for the current transformer 2 Ground Ground connection for IC 3 CTresD Determines IV converter gain for detection threshold / matched to CT turns ratio (Differential Current) 4 IDF 5 GFtest 6 NC Tie to Ground or leave floating 7 NC Float 8 NC Tie to Ground or leave floating 9 NC Tie to Ground or leave floating 10 NC Tie to Ground or leave floating Determines corner frequency of the differential current path filter Output to induce external differential current 11 Ground 12 NC Ground connection for IC Float 13 NC Float 14 SCRdrv 15 DVDD Internal digital 5 V regulated supply 16 AVDD Internal analog 5 V regulated supply 17 Supply 12 V shunt regulated power supply 18 MLD 19 CTresGN 20 CTbias Used to trigger the solenoid at a fault detection Mains Level Detect (Zero Cross) and AM slope detect (for oscillator sync/trim and AM init) Determines IV converter gain for detection threshold / matched to CT turns ratio (Ground-Neutral) External 2 V bias for the current transformer http://onsemi.com 3 NCS37000 Table 3. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Supply Voltage Range Vs 6.0 to 12 V V Input Voltage Range (Note 1) Vin −0.3 to 6.0 V Output Voltage Range Vout −0.3 to 6.0 V or (Vin + 0.3), whichever is lower V TJ(max) 140 °C TSTG −65 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2 kV ESD Capability, Machine Model (Note 2) ESDMM 200 V TSLD 260 °C Maximum Junction Temperature Storage Temperature Range Lead Temperature Soldering Reflow (SMD Styles Only), Pb−Free Versions (Note 3) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78 3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D Table 4. THERMAL CHARACTERISTICS Rating Symbol Value Thermal Characteristics, QFN16, 3x3.3 mm (Note 4) Thermal Resistance, Junction−to−Air (Note 5) RqJA 64 Thermal Characteristics, TSOP−5 (Note 4) Thermal Resistance, Junction−to−Air (Note 5) RqJA 118.6 Unit °C/W °C/W 4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Table 5. OPERATING RANGES (Note 6) Parameter Conditions Operating Temperature Min −40 IDD in typical power state Stimulus Generator Frequency Typ Max Units 85 C 2.0 Tri−tone 3.1 SCR Trigger Current mA 3.4 kHz 8.0 mA 5.5 V 5.0 mA SCR Trigger output voltage With 5 V supply 4.5 Fault Current Sensitivity Programmable with CTresD 4.6 Ground Fault Response Time 5 − 20 mA 150 ms Ground Fault Response Time 20 − 40 mA 75 ms 4.8 Ground Fault Response Time >40 mA 25 ms Saturation Fault Response Time >300 mA 1.4 ms CT Turns Ratio Ground – Neutral Detection Threshold Total series impedance (Rn and Rg) 200 300 3.0 6.0 Internal Oscillator Frequency CT Stimulus Current 2.0 Internally limited CT Driver Closed Loop BW 6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. http://onsemi.com 4 W MHz 1.0 mA 500 kHz NCS37000 LINE PHASE NEUTRAL APPLICATIONS INFORMATION solenoid tvs ResMain CapSup NC NC Supply SCRdrv ResMLD NC MLD CapBIAS CTresGN NC CTbias TE CTstim NC ResGN CapGN CapCT PHASE NEUTRAL ResD CapIDF LOAD Figure 2. Typical Application Schematic http://onsemi.com 5 NC NC IDF CTresD ResCT NCS37000 RECOMMENDED EXTERNAL COMPONENTS: Component Type Instance Value Note SCR Q1 − ON−MCR08 Diode Dx − ON−1N4007 Capacitor Csup 1 − 5 mF For a full bridge rectifier Capacitor Cgn 2 − 10 nF Low pass corner frequency for GN detection Capacitor Cidf 220 nF 1kHz differential corner frequency Capacitor Cct 2.2 − 5 nF Match to current transformer for resonance Capacitor Cbias 10 nF Added for filtering Resistor RctresD 40 − 80K Matched to current transformer Resistor RctGN 100 − 400K Matched to current transformer Resistor Rzc 400 − 800K Zero cross detector shunt resistance Resistor Rmains 10 − 20K For a full bridge rectifier TVS T1 − ~250 − 400 V Filtering ground to neutral resistance trip level. Higher CTresGN values will cause the part to trip at higher ground to neutral impedances. CtresGN = #Turns^2 x Rt/2 – Subject to CT efficiency from 3 kHz to 4 kHz The analog signal capture portion of the IC includes a single pole filter that can be set externally with Cidf. This provides an additional layer of protection against false tripping under steady state noise conditions. High frequency steady state noise is common with pumps, motors or other cyclic noise generators. Cidf = 220 nF = 1 KHz low pass. Setting Grounded−Neutral response time Cgn is used to define the response time of the grounded−neutral detection circuit. The analog portion converts the impedance into a DC voltage and a high frequency (aliased) component. The capacitor is used to remove the high frequency component leaving just the DC representation of the impedance. CTcapGN= 1.8E-4/CTresGN Setting Trip Sensitivity The CTresD resistor sets the threshold for the differential current fault levels. Increasing CTresD causes the fault levels to trip at lower differential currents. CT efficiency at 60 Hz must be considered. CTresD= 200*#Turns – Subject to CT efficiency at 60 Hz The CTresGN resistor sets the threshold for ground to neutral fault detection. The Rt parameter is the desired http://onsemi.com 6 NCS37000 PACKAGE DIMENSIONS TSSOP−20 CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ S J J1 11 B −U− PIN 1 IDENT SECTION N−N 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ PLANE SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 7 INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NCS37000 PACKAGE DIMENSIONS QFN16 3x3, 0.5P CASE 485G ISSUE F D ÇÇÇ ÇÇÇ ÇÇÇ PIN 1 LOCATION 2X A B L DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E ÉÉ ÉÉ EXPOSED Cu 0.10 C TOP VIEW DETAIL B 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L1 0.10 C 2X L (A3) ÉÉ ÇÇ ÇÇ A3 A1 DETAIL B A 0.05 C MOLD CMPD ALTERNATE CONSTRUCTIONS NOTE 4 A1 SIDE VIEW C 16X L RECOMMENDED SOLDERING FOOTPRINT* D2 8 4 16X MILLIMETERS MIN NOM MAX 0.80 0.90 1.00 0.00 0.03 0.05 0.20 REF 0.18 0.24 0.30 3.00 BSC 1.65 1.75 1.85 3.00 BSC 1.65 1.75 1.85 0.50 BSC 0.18 TYP 0.30 0.40 0.50 0.00 0.08 0.15 SEATING PLANE 0.10 C A B DETAIL A DIM A A1 A3 b D D2 E E2 e K L L1 9 E2 K 16X 0.58 PACKAGE OUTLINE 1 2X 1 2X 1.84 3.30 16 e e/2 BOTTOM VIEW 16X b 16X 0.10 C A B 0.05 C 0.30 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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