ON MC100ELT22DR2 5v dual ttl to differential pecl translator Datasheet

MC10ELT22, MC100ELT22
5VDual TTL to Differential
PECL Translator
The MC10ELT/100ELT22 is a dual TTL to differential PECL
translator. Because PECL (Positive ECL) levels are used only +5 V
and ground are required. The small outline 8-lead package and the low
skew, dual gate design of the ELT22 makes it ideal for applications
which require the translation of a clock and a data signal.
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MARKING
DIAGRAMS*
1.2 ns Typical Propagation Delay
<300 ps Typical Output to Output Skew
8
8
PNP TTL Inputs for Minimal Loading
Flow Through Pinouts
ESD Protection: >2 KV HBM, >200 V MM
Operating Range: VCC= 4.75 V to 5.25 V with GND= 0 V
SO–8
D SUFFIX
CASE 751
8
HLT22
ALYW
1
1
KLT22
ALYW
1
No Internal Input Pulldown Resistors
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level 1
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL–94 code V–0 @ 1/8”,
Oxygen Index 28 to 34
Transistor Count = 51 devices
LOGIC DIAGRAM AND PINOUT ASSIGNMENT
Q0 1
8
VCC
Q0
7
D0
2
PECL
Q1
1
TSSOP–8
DT SUFFIX
CASE 948R
1
KT22
ALYW
1
L = Wafer Lot
Y = Year
W = Work Week
ORDERING INFORMATION
6
4
HT22
ALYW
H = MC10
K = MC100
A = Assembly Location
Device
D1
Package
Shipping
SO–8
98 Units/Rail
MC10ELT22DR2
SO–8
2500 Tape & Reel
MC100ELT22D
SO–8
98 Units/Rail
MC100ELT22DR2
SO–8
2500 Tape & Reel
TSSOP–8
98 Units/Rail
MC10ELT22DTR2
TSSOP–8
2500 Tape & Reel
MC100ELT22DT
TSSOP–8
98 Units/Rail
MC10ELT22D
Q1
8
*For additional information, see Application Note
AND8002/D
TTL
3
8
8
5
GND
MC10ELT22DT
PIN DESCRIPTION
PIN
FUNCTION
Qn, Qn
Dn
VCC
GND
PECL Differential Outputs*
TTL Inputs
Positive Supply
Ground
MC100ELT22DTR2 TSSOP–8
2500 Tape & Reel
* Output state undetermined when inputs are open.
 Semiconductor Components Industries, LLC, 2000
October, 2000 – Rev. 4
1
Publication Order Number:
MC10ELT22/D
MC10ELT22, MC100ELT22
MAXIMUM RATINGS (Note 1.)
Symbol
Parameter
Condition 1
Rating
Units
7
V
7
V
50
100
mA
mA
Operating Temperature Range
–40 to +85
°C
Storage Temperature Range
–65 to +150
°C
8 SOIC
8 SOIC
190
130
°C/W
°C/W
std bd
8 SOIC
41 to 44
°C/W
Thermal Resistance (Junction to Ambient)
0 LFPM
500 LFPM
8 TSSOP
8 TSSOP
185
140
°C/W
°C/W
θJC
Thermal Resistance (Junction to Case)
std bd
8 TSSOP
41 to 44 ± 5%
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
265
°C
VCC
Positive Power Supply
GND = 0 V
VIN
Input Voltage
GND = 0 V
Iout
Output Current
Continuous
Surge
TA
Tstg
θJA
Thermal Resistance (Junction to Ambient)
0 LFPM
500 LFPM
θJC
Thermal Resistance (Junction to Case)
θJA
Condition 2
VI VCC
1. Maximum Ratings are those values beyond which device damage may occur.
10ELT SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 1.)
–40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
22
85°C
Max
Min
ICC
Power Supply Current
VOH
Output HIGH Voltage (Note 2.)
3920
4010
4110
4020
4105
4190
4090
VOL
Output LOW Voltage (Note 2.)
3050
3200
3350
3050
3210
3370
3050
Typ
Max
Unit
22
mA
4185
4280
mV
3227
3405
mV
22
NOTE: Devices are designed to meet the DC specifications shown in the above table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
1. Output parameters vary 1:1 with VCC. VCC can vary ± 0.25 V.
2. Outputs are terminated through a 50 ohm resistor to VCC–2 volts.
100ELT SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 1.)
–40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
22
85°C
Max
Min
ICC
Power Supply Current
VOH
Output HIGH Voltage (Note 2.)
3915
3995
4120
3975
4045
4120
3975
VOL
Output LOW Voltage (Note 2.)
3170
3305
3445
3190
3295
3380
3190
Typ
Max
Unit
22
mA
4050
4120
mV
3295
3380
mV
22
NOTE: Devices are designed to meet the DC specifications shown in the above table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
1. Output parameters vary 1:1 with VCC. VCC can vary ± 0.25 V.
2. Outputs are terminated through a 50 ohm resistor to VCC–2 volts.
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2
MC10ELT22, MC100ELT22
TTL INPUT DC CHARACTERISTICS VCC = 4.75 V to 5.25 V; TA = –40°C to 85°C
Symbol
Max
Unit
IIH
Input HIGH Current
Characteristic
VIN = 2.7 V
Condition
Min
Typ
20
µA
IIHH
Input HIGH Current
VIN = 7.0 V
100
µA
IIL
Input LOW Current
VIN = 0.5 V
–0.6
mA
VIK
Input Clamp Diode Voltage
IIN = –18 mA
–1.2
V
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
2.0
V
0.8
V
AC CHARACTERISTICS VCC= 4.75 V to 5.25 V; GND= 0.0 V
–40°C
Symbol
Typ
25°C
Max
Min
Typ
85°C
Characteristic
Min
Max
fMAX
Maximum Input Frequency
100
tPLH
Propagation Delay (Note 1.)
1.5 V to 50%
0.6
1.2
0.9
1.2
1.5
0.6
1.35
ns
tPHL
Propagation Delay (Note 1.)
1.5 V to 50%
0.4
1.0
0.5
0.8
1.1
0.7
1.30
ns
tJITTER
Cycle–to–Cycle Jitter
TBD
TBD
tr/tf
Output Rise/Fall Time
(20–80%)
1.6
0.4
100
0.4
Min
0.4
Receiver
Device
Qb
Db
50 50 V TT
V TT = V CC – 2.0 V
Figure 1. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020 – Termination of ECL Logic Devices.)
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3
Unit
MHz
TBD
1.6
D
Driver
Device
Max
100
1. Specifications for standard TTL input signal.
Q
Typ
ps
1.6
ns
MC10ELT22, MC100ELT22
Resource Reference of Application Notes
AN1400
– MC10/100H640 Clock Driver Family I/O SPICE Modeling Kit
AN1404
–
ECLinPS Circuit Performance at Non–Standard VIH Levels
AN1405
–
ECL Clock Distribution Techniques
AN1406
–
Designing with PECL (ECL at +5.0 V)
AN1503
–
ECLinPS I/O SPICE Modeling Kit
AN1504
–
Metastability and the ECLinPS Family
AN1560
–
Low Voltage ECLinPS SPICE Modeling Kit
AN1568
–
Interfacing Between LVDS and ECL
AN1596
–
ECLinPS Lite Translator ELT Family SPICE I/O Model Kit
AN1650
–
Using Wire–OR Ties in ECLinPS Designs
AN1672
–
The ECL Translator Guide
AND8001
–
Odd Number Counters Design
AND8002
–
Marking and Date Codes
AND8020
–
Termination of ECL Logic Devices
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4
MC10ELT22, MC100ELT22
PACKAGE DIMENSIONS
SO–8
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–07
ISSUE V
–X–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
A
8
5
0.25 (0.010)
S
B
1
M
Y
M
4
K
–Y–
G
C
N
X 45 SEATING
PLANE
–Z–
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
S
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5
J
DIM
A
B
C
D
G
H
J
K
M
N
S
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0
8
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0
8
0.010
0.020
0.228
0.244
MC10ELT22, MC100ELT22
PACKAGE DIMENSIONS
TSSOP–8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R–02
ISSUE A
8x
0.15 (0.006) T U
K REF
0.10 (0.004)
S
2X
L/2
8
1
PIN 1
IDENT
S
T U
S
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED 0.25 (0.010) PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE -W-.
S
5
0.25 (0.010)
B
–U–
L
0.15 (0.006) T U
M
M
4
A
–V–
F
DETAIL E
C
0.10 (0.004)
–T– SEATING
PLANE
D
–W–
G
DETAIL E
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6
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0
6
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0
6
MC10ELT22, MC100ELT22
Notes
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7
MC10ELT22, MC100ELT22
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MC10ELT22/D
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