MM5ZxxxST1G Series, SZMM5ZxxxST1G Series Zener Voltage Regulators 300 mW SOD−523 Surface Mount This series of Zener diodes is packaged in a SOD−523 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. http://onsemi.com SOD−523 CASE 502 Specification Features • Standard Zener Breakdown Voltage Range −2.4 V to 18 V • Steady State Power Rating of 200 mW • Small Body Outline Dimensions: • • • • • 0.047″ x 0.032″ (1.20 mm x 0.80 mm) Low Body Height: 0.028″ (0.7 mm) ESD Rating of Class 3 (> 16 kV) per Human Body Model Tight Tolerance VZ SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* 1 Cathode 2 Anode MARKING DIAGRAM 1 XX MG G 2 XX = Specific Device Code M Date Code* G = Pb−Free Package Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements ORDERING INFORMATION MAXIMUM RATINGS Rating Total Device Dissipation FR−5 Board, (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance from Junction−to−Ambient Junction and Storage Temperature Range Symbol Max Unit 300 1.5 mW mW/°C RqJA 390 °C/W TJ, Tstg −65 to +150 °C PD Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−4 Minimum Pad. Device Package Shipping† MM5ZxxxST1G SOD−523** 3,000 / Tape & Reel SZMM5ZxxxST1G SOD−523** 3,000 / Tape & Reel SZMM5ZxxxST5G SOD−523** 8,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. **This package is inherently Pb−Free. DEVICE MARKING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2013 July, 2013 − Rev. 9 1 See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. Publication Order Number: MM5Z2V4ST1/D MM5ZxxxST1G Series, SZMM5ZxxxST1G Series ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Symbol Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF QVZ C I IF VZ VR V IR VF IZT Figure 1. Zener Voltage Regulator Maximum Temperature Coefficient of VZ Max. Capacitance @VR = 0 and f = 1 MHz ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types) Zener Voltage VZ ZZT IZ = IZT @ 10% Mod W Max Max IR @ VR dVZ/dt (mV/k) @ IZT1 = 5 mA Device Marking Test Current Izt mA Min Max ZZK IZ = 1.0 mA W Max mA V Min Max C pF Max @ VR = 0 f = 1 MHz MM5Z2V4ST1G T2 5.0 2.43 2.63 1000 100 120 1.0 −3.5 0 450 MM5Z2V7ST1G T3 5.0 2.67 2.91 1000 100 100 1.0 −3.5 0 450 MM5Z3V3ST1G T5 5.0 3.32 3.53 1000 95 5.0 1.0 −3.5 0 450 MM5Z3V6ST1G T6 5.0 3.60 3.85 1000 90 5.0 1.0 −3.5 0 450 MM5Z3V9ST1G T7 5.0 3.89 4.16 1000 90 3.0 1.0 −3.5 −2.5 450 MM5Z4V3ST1G T8 5.0 4.17 4.43 1000 90 3.0 1.0 −3.5 0 450 MM5Z4V7ST1G/T5G T9 5.0 4.55 4.75 800 80 3.0 2.0 −3.5 0.2 260 MM5Z5V1ST1G TA 5.0 4.98 5.2 500 60 2.0 2.0 −2.7 1.2 225 MM5Z5V6ST1G TC 5.0 5.49 5.73 200 40 1.0 2.0 −2.0 2.5 200 MM5Z6V2ST1G TE 5.0 6.06 6.33 100 10 3.0 4.0 0.4 3.7 185 MM5Z6V8ST1G TF 5.0 6.65 6.93 160 15 2.0 4.0 1.2 4.5 155 MM5Z7V5ST1G TG 5.0 7.28 7.6 160 15 1.0 5.0 2.5 5.3 140 MM5Z8V2ST1G TH 5.0 8.02 8.36 160 15 0.7 5.0 3.2 6.2 135 MM5Z9V1ST1G TK 5.0 8.85 9.23 160 15 0.5 6.0 3.8 7.0 130 MM5Z12VST1G TN 5.0 11.74 12.24 80 25 0.1 8.0 6.0 10 130 MM5Z16VST1G TU 5.0 15.85 16.51 80 40 0.05 11.2 10.4 14 105 MM5Z18VST1G TW 5.0 17.56 18.35 80 45 0.05 12.6 12.4 16 100 Device* *Include SZ-prefix devices where applicable. http://onsemi.com 2 MM5ZxxxST1G Series, SZMM5ZxxxST1G Series TYPICAL CHARACTERISTICS 100 POWER DISSIPATION (%) 80 60 40 20 0 0 25 50 75 100 125 TEMPERATURE (°C) Figure 2. Steady State Power Derating http://onsemi.com 3 150 MM5ZxxxST1G Series, SZMM5ZxxxST1G Series PACKAGE DIMENSIONS SOD−523 CASE 502 ISSUE E −X− D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. −Y− E 2X b 0.08 1 M 2 X Y DIM A b c D E HE L L2 TOP VIEW A c HE RECOMMENDED SOLDERING FOOTPRINT* SIDE VIEW 2X 2X 2X MILLIMETERS MIN NOM MAX 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 1.10 1.20 1.30 0.70 0.80 0.90 1.50 1.60 1.70 0.30 REF 0.15 0.20 0.25 L PACKAGE OUTLINE L2 BOTTOM VIEW 1.80 0.48 2X 0.40 DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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