Rohm CM105B105K16A 1a variable fixed output ldo regulator Datasheet

Datasheet
1A Variable / Fixed Output
LDO Regulators
BDxxIC0WEFJ / BDxxIC0WHFV
●General Description
BDxxIC0W series devices are LDO regulators with an output current of 1.0A. The output accuracy is ±1% of the output
voltage. Both fixed and variable output voltage devices are available. The output voltage of the variable output voltage
device can be varied from 0.8 to 4.5V using external resistors. Various fixed output voltage devices that do not use external
resistors are also available. These LDO regulators are available in two package types: HTSOP-J8 (4.90mm x 6.00mm x
1.00mm) and HVSOF6 (1.60mm x 3.00mm x 0.75mm), and can be used in a wide variety of digital appliances. These
devices have built in over current protection to protect the device when output is shorted, 0µA shutdown mode and thermal
shutdown circuit to protect the device during over load conditions. These LDO regulators are usable with ceramic capacitors
that enable a smaller layout and longer life.
●Features
„ +/-1% output voltage accuracy
„ Built-in Over Current Protection circuit (OCP)
„ Built-in Thermal Shut Down circuit (TSD)
„ Zero µA Shutdown mode
●Package
HTSOP-J8
HVSOF6
(Typ.)
(Typ.)
(Max.)
4.90mm x 6.00mm x 1.00mm
1.60mm x 3.00mm x 0.75mm
●Key Specifications
■ Input Power Supply Voltage range:
2.4V to 5.5V
■ Output Voltage range(Variable type):
0.8V to 4.5V
■ Output Voltage(Fixed type):
1.0V/1.2V/1.25V/1.5V
1.8V/2.5V/2.6V/3.0V/3.3V
(1.25V/2.6V:HVSOF6 only)
■ Output Current:
1.0A (Max.)
■ Shutdown Current:
0 µA (Typ.)
■ Operating Temperature Range:
-25 to +85℃
HTSOP-J8
HVSOF6
●Typical Application Circuit
VCC
VO
CIN
VCC
R1
COUT
FB
EN
GND
GND
CIN,COUT : Ceramic Capacitor
Output voltage variable type
○Product structure：Silicon monolithic integrated circuit
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TSZ22111･14･001
VO_S
COUT
EN
R2
FIN
VO
CIN
FIN
CIN,COUT : Ceramic Capacitor
Output voltage fixed type
○This product is not designed with protection against radioactive rays.
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Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Ordering Information
B D
x
x
Part
Output
Number voltage
00:Variable
10:1.0V
12:1.2V
1C:1.25V
15:1.5V
18:1.8V
25:2.5V
26:2.6V
30:3.0V
33:3.3V
I
C
0
W
y
y
Package
-
zz
Input
voltage
range
Output
current
:7V
C0:1.0A “W”：included EFJ : HTSOP-J8 E2 : Emboss tape reel(HTSOP-J8)
HFV : HVSOF6 GTR : Emboss tape reel(HVSOF6)
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Shutdown
mode
y
2/23
Packaging and forming specification
TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Block Diagram
BD00IC0WEFJ / BD00IC0WHFV (Variable output voltage type)
VCC
OCP
SOFT
START
VO
FB
EN
TSD
GND
Fig.1 Block Diagram
●Pin Configuration and Pin Description
(HTSOP-J8)
Pin No.
Pin name
Pin Function
1
VO
Output pin
2
FB
Feedback pin
3
GND
GND pin
4
N.C
No Connect (Connect to GND or leave OPEN)
5
EN
Enable pin
6
N.C
No Connect (Connect to GND or leave OPEN)
7
N.C
No Connect (Connect to GND or leave OPEN)
8
VCC
Input pin
Reverse
FIN
Substrate (Connect to GND)
(HVSOF6)
Pin No.
1
2
3
4
5
6
Reverse
Pin name
VO
FB
GND
EN
N.C
VCC
FIN
Pin Function
Output pin
Feedback pin
GND pin
Enable pin
No Connect (Connect to GND or leave OPEN)
Input pin
Substrate (Connect to GND)
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VO
1
8
VCC
FB
2
7
N.C
GND
3
6
N.C
N.C
4
5
EN
Vo
1
6
Vcc
FB
2
5
N.C
GND
3
4
EN
TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Block Diagram
BDxxIC0WEFJ / BDxxIC0WHFV (Fixed output voltage type)
VCC
OCP
SOFT
START
VO
EN
TSD
VO_S
GND
Fig.2 Block Diagram
●Pin Configuration and Pin Description
(HTSOP-J8)
Pin No.
Pin name
Pin Function
1
VO
Output pin
2
VO_S
Output voltage monitor pin
3
GND
GND pin
4
N.C
No Connect (Connect to GND or leave OPEN)
5
EN
Enable pin
6
N.C
No Connect (Connect to GND or leave OPEN)
7
N.C
No Connect (Connect to GND or leave OPEN)
8
VCC
Input pin
Reverse
FIN
Substrate (Connect to GND)
(HVSOF6)
Pin No.
1
2
3
4
5
6
Reverse
Pin name
VO
VO_S
GND
EN
N.C
VCC
FIN
VO
1
8
VCC
VO_S
2
7
N.C
GND
3
6
N.C
N.C
4
5
EN
Pin Function
Output pin
Output voltage monitor pin
GND pin
Enable pin
No Connect (Connect to GND or leave OPEN)
Input pin
Substrate (Connect to GND)
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VO
1
6
VCC
VO_S
2
5
N.C
GND
3
4
EN
TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Power supply voltage
Ratings
HTSOP-J8
Unit
7.0 *1
VCC
EN voltage
Power dissipation
Symbol
V
VEN
7.0
V
Pd
2110 *2
mW
Operating Temperature Range
Topr
-25 to +85
℃
Storage Temperature Range
Tstg
-55 to +150
℃
Tjmax
+150
℃
Junction Temperature
*1 Not to exceed Pd
*2 Reduced by 16.9mW/℃ for each increase in Ta of 1℃ over 25℃. (when mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer)
●Recommended Operating Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Min.
Max.
Unit
Input power supply voltage
VCC
2.4
5.5
V
EN voltage
VEN
0.0
5.5
V
Output voltage setting range
VO
0.8
4.5
V
Output current
IO
0.0
1.0
A
●Electrical Characteristics (Unless otherwise noted, Ta=25℃, EN=3V, VCC=3.3V, R1=16kΩ, R2=7.5kΩ)
Limits
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Circuit current at shutdown mode
ISTB
-
0
5
µA
Bias current
ICC
-
250
500
µA
VEN=0V, OFF mode
Line regulation
Reg.Ii
-1
-
1
%
VCC=( VO+0.6V )→5.5V
Load regulation
Reg IO
-1.5
-
1.5
%
IO=0→1.0A
Minimum dropout voltage1
VCO1
-
0.10
0.15
V
VCC=3.3V, IO=250mA
Minimum dropout voltage2
VCO2
-
0.20
0.30
V
VCC=3.3V, IO=500mA
Minimum dropout voltage3
VCO3
-
0.30
0.45
V
VCC=3.3V, IO=750mA
Minimum dropout voltage4
VCO4
-
0.40
0.60
V
VCC=3.3V, IO=1.0A
Output reference voltage(variable type)
VFB
0.792
0.800
0.808
V
IO=0A
IO=0A
Output voltage(Fixed type)
VO
Vo×0.99
Vo
Vo×1.01
V
EN Low voltage
VEN_Low
0
-
0.8
V
EN High voltage
VEN_High
2.4
-
5.5
V
EN Bias current
IEN
1
3
9
µA
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TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Typical Performance Curves
(Unless otherwise noted, Ta=25℃, EN=3V, VCC=3.3V, R1=16kΩ, R2=7.5kΩ)
VVV
OOO
VOO
IIOOIO
IOO
Fig.4
Transient Response(1.0→0A)
Co=1.0µF
Fig.3
Transient Response(0→1.0A)
Co=1.0µF
VEN
VEN
VCC
VCC
VO
VO
Fig.5
Input sequence1
Co=1.0µF
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Fig.6
OFF sequence 1
Co=1.0µF
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TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
VEN
VEN
VCC
VCC
VO
VO
Fig.8
OFF sequence 2
Co=1.0µF
VO[V]
VFB[V]
Fig.7
Input sequence2
Co=1.0µF
Ta[℃]
Ta[℃]
Fig.10
Ta-VO (IO=0A)
Fig.9
Ta-VFB
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TSZ02201-0R6R0A600430-1-2
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Datasheet
ICC[µA]
ISTB[µA]
BDxxIC0WEFJ / BDxxIC0WHFV
Ta[℃]
Ta[℃]
Fig.11
Ta-ICC
ISTB[µA]
IEN[µA]
Fig.12
Ta-ISTB (VEN=0V)
Ta[℃]
VCC[V]
Fig.14
Ta-IEN
Fig.13
VCC-ISTB (VEN=0V)
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Datasheet
VO[V]
VO[V]
BDxxIC0WEFJ / BDxxIC0WHFV
IO[A]
IO[A]
Fig.16
IO-VO (VO=1.5V)
VO[V]
VO[V]
Fig.15
IO-VO (VO=1.2V)
IO[A]
IO[A]
Fig.18
IO-VO (VO=2.5V)
Fig.17
IO-VO (VO=1.8V)
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TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
VO[V]
VO[V]
BDxxIC0WEFJ / BDxxIC0WHFV
IO[A]
VCC[V]
Fig.20
VCC-VO (IO=0A)
VO[V]
VO[V]
Fig.19
IO-VO (VO=3.3V)
Ta[℃]
IO[A]
Fig.21
TSD (IO=0A)
Fig.22
OCP
(VCC=5V, VO=3.3V)
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TSZ02201-0R6R0A600430-1-2
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Datasheet
VO[V]
VO[V]
BDxxIC0WEFJ / BDxxIC0WHFV
Fig.23
OCP
(VCC=5V, VO=2.5V)
Fig.24
OCP
(VCC=5V, VO=1.8V)
VO[V]
IO[A]
VO[V]
IO[A]
IO[A]
IO[A]
Fig.25
OCP
(VCC=5V, VO=1.5 V)
Fig.26
OCP
(VCC=5V, VO=1.2 V)
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TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
VO[V]
VO[V]
BDxxIC0WEFJ / BDxxIC0WHFV
IO[A]
Fig.27
OCP
(VCC=3.3V, VO=2.5V)
Fig.28
OCP
(VCC=3.3V, VO=1.8V)
VO[V]
VO[V]
IO[A]
IO[A]
IO[A]
Fig.29
OCP
(VCC=3.3V, VO=1.5 V)
Fig.30
OCP
(VCC=3.3V, VO=1.2 V)
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TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
IO[A]
Fig.31
ESR-IO characteristics
(Co=2.2µF)
Fig.32
IO-ICC
Vdrop[V]
IO[A]
Ta[℃]
Fig.34
Minimum dropout Voltage 1
(VCC=3.3V, IO=1.0A)
Fig.33
PSRR(IO=0A)
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TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
IO[A]
IO[A]
Fig.35
Minimum dropout Voltage2
(VCC=2.4V)
Fig.36
Minimum dropout Voltage3
(VCC=3.3V)
IO[A]
Fig.37
Minimum dropout Voltage4
(VCC=5.0V)
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TSZ02201-0R6R0A600430-1-2
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Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Power Dissipation
◎HTSOP-J8
4.0
Power Dissipation :Pd [W]
⑤3.76W
Measurement condition: mounted on a ROHM
board,
Substrate size: 70mm × 70mm × 1.6mm
(Substrate with thermal via)
・Solder the thermal pad to Ground
3.0
① IC only
θj-a=249.5℃/W
② 1-layer（copper foil are :0mm×0mm）
θj-a=153.2℃/W
③ 2-layer（copper foil are :15mm×15mm）
θj-a=113.6℃/W
④ 2-layer（copper foil are :70mm×70mm）
θj-a=59.2℃/W
⑤ 4-layer（copper foil are :70mm×70mm）
θj-a=33.3℃/W
④2.11W
2.0
③1.10W
1.0
②0.82W
①0.50W
0
0
25
50
75
100
125
150
Ambient 周囲温度:Ta
Temperature
[℃] :Ta [℃]
◎HVSOF6
Power Dissipation: Pd [W ]
4.0
Measurement condition: mounted on a ROHM
board,
Substrate size: 70mm × 70mm × 1.6mm
(Substrate with thermal via)
・Solder the thermal pad to Ground
3.0
① single-layer(copper foil are :2%)
θj-a=147.1℃/W
② single-layer(copper foil are :18%)
θj-a=89.3℃/W
③single-layer(copper foil are :51%)
θj-a=73.5℃/W
2.0
③1.7W
②1.4W
1.0
①0.85W
0.0
0
25
50
75
100
Ambient Tempera ture: Ta [℃]
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15/23
150
TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
Thermal design should ensure operation within the following conditions. Note that the temperatures listed are the allowed
temperature limits and thermal design should allow sufficient margin beyond these limits.
1. Ambient temperature Ta can be no higher than 85℃.
2. Chip junction temperature (Tj) can be no higher than 150℃.
Chip junction temperature can be determined as follows:
Calculation based on ambient temperature (Ta)
Tj=Ta+θj-a×P
＜Reference values＞
θj-a：HTSOP-J8 153.2℃/W
113.6℃/W
59.2℃/W
33.3℃/W
1-layer substrate (copper foil density 0mm×0mm)
2-layer substrate (copper foil density 15mm×15mm)
2-layer substrate (copper foil density 70mm×70mm)
4-layer substrate (copper foil density 70mm×70mm)
Substrate size: 70mm×70mm×1.6mm (substrate with thermal via)
Most of the heat loss that occurs in the BDxxIC0W series is generated from the output Pch FET. Power loss is determined by
the total VCC-VO voltage and output current. Be sure to confirm the system input and output voltage as well as the output current
conditions in relation to the heat dissipation characteristics of the VCC and VO in the design. Bearing in mind that heat dissipation
may vary substantially depending on the substrate employed (due to the power package incorporated in the BDxxIC0W
series )make certain to factor conditions such as substrate size into the thermal design.
Power consumption [W] =
Input voltage (VCC) - Output voltage (VO)
×IO(Ave)
Example) When VCC=3.3V, VO=2.5V, IO(Ave) = 0.1A
Power consumption [W] =
3.3V - 2.5V
×0.1A
=0.08[W]
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TSZ02201-0R6R0A600430-1-2
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Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Input-to-Output Capacitor
It is recommended that a capacitor (over 1uF) is placed near pins between the input pin and GND as well as the output pin
and GND. A capacitor, between input pin and GND, is valid when the power supply impedance is high or trace is long. Also,
as for the capacitor between the output pin and GND, the greater the capacitance, the more sustainable the line regulation
will be and the capacitor will make improvements of characteristics depending on the load. However, please check the
actual functionality of this part by mounting it on a board for the actual application. Ceramic capacitors usually have different,
thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use.
For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application.
10
Rated Voltage：10V
B1 characteristics
Rated Voltage：10V
B characteristics
0
Capacitance Change [%]
-10
Rated Voltage：6.3V
B characteristics
-20
-30
-40
-50
Rated Voltage:10V
F characteristics
-60
Rated Voltage：4V
X6S characteristics
-70
-80
-90
-100
0
1
2
3
4
DC Bias Voltage [V]
Ceramic capacitor capacity – DC bias characteristics
(Characteristics example)
●Equivalent Series Resistance ESR (Output Capacitor)
10.00
1.00
ESR [Ω]
To prevent oscillations, please attach a capacitor between
VO and GND. Capacitors usually have ESR (Equivalent
Series Resistance). Operation will be stable in the ESR-IO
range shown to the right. Ceramic, tantalum and
electrolytic Capacitors have different ESR values, so
please ensure that you are using a capacitor that operates
in the stable operating region shown on the right. Finally,
please evaluate in the actual application.
Safety area
0.10
CO=1uF
0.01
0
0.2
0.4
0.6
Io [A]
0.8
1
ESR – IO characteristics
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TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Evaluation Board Circuit
U1
C3
C7
1
VCC
VO
8
C2
C6
R1
C5
2
FB
N.C
7
GND
N.C
6
C1
R2
GND
3
SW1
VO
4
N.C.
EN
EN
5
FIN
●Evaluation Board Parts List
Designation
Value
Part No.
Company
Designation
Value
Part No.
Company
R1
16kΩ
MCR01PZPZF1602
ROHM
C4
‐
‐
‐
R2
7.5kΩ
MCR01PZPZF7501
ROHM
C5
1µF
CM105B105K10A
KYOCERA
R3
‐
‐
‐
C6
‐
‐
‐
R4
‐
‐
‐
C7
‐
‐
‐
R5
‐
‐
‐
C8
‐
‐
‐
R6
‐
‐
‐
C9
‐
‐
‐
C1
1µF
CM105B105K16A
KYOCERA
C10
‐
‐
‐
C2
‐
‐
U1
‐
BD00IC0WEFJ
ROHM
C3
‐
‐
U2
‐
‐
‐
●Board Layout
EN
GND
CIN
VCC ( VIN )
R1
R2
COUT
VO
PCB layout considerations:
・Input capacitor CIN connected to VCC (Vin) should be placed as close to VCC(VIN) pin as possible.
Output capacitor COUT also should be placed as close to IC pin as possible. In case the part is connected to inner layer
GND plane, please use several through holes.
・FB pin has comparatively high impedance and can be affected by noise, so stray capacitance should be as small as
possible. Please take care of this during layout.
・Please make GND pattern wide enough to handle thermal dissipation.
・For output voltage setting
Output voltage can be set by FB pin voltage (0.800V typ.) and external resistance R1, R2.
R1+R2
VO = VFB×
R2
(The use of resistors with R1+R2=1k to 90k is recommended)
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Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●I/O Equivalent Circuits (Variable type：BD00IC0WEFJ)
8pin(VCC) / 1pin(VO)
8pin(VCC)
2pin(FB)
5pin(EN)
2pin(FB)
5pin (EN )
520kΩ
1pn(VO)
480kΩ
●I/O Equivalent Circuits (Fixed type：BDxxIC0WEFJ)
8pin(VCC) / 1pin(VO)
2pin(VO_S)
5pin(EN)
8pin(VCC)
2pin(VO_S)
5pin(EN)
520kΩ
480kΩ
1pin(VO)
●I/O Equivalent Circuits (Variable type：BD00IC0WHFV)
6pin(VCC) / 1pin(VO)
2pin(FB)
4pin(EN)
6pin(VCC)
2pin(FB)
4pin (EN )
520kΩ
1pn(VO)
480kΩ
●I/O Equivalent Circuits (Fixed type：BDxxIC0WHFV)
6pin(VCC) / 1pin(VO)
2pin(VO_S)
4pin(EN)
6pin(VCC)
2pin(VO_S)
4pin(EN)
480kΩ
1pin(VO)
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
520kΩ
19/23
TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Operational Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the device, thus making it impossible to identify the damage mode, such as a short circuit or an open circuit.
If there is any possibility of exposure over the rated values, please consider adding circuit protection devices such as
fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage the IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
(3) Power supply lines
Design the PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply
terminals to ICs, connect a capacitor between the power supply and GND terminal. When using electrolytic capacitors in
a circuit, note that capacitance values are reduced at low temperatures and over time.
(4) GND voltage
The potential of the GND pin must be minimum potential under all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
(6) Off-leakage at high temperature.
Off-leakage at high temperature may increase because of manufacturing variations.
Design should consider the typical & worst cases shown below.
Ta-Ileak
0.5
0.4
Ileak (mA)
worst
0.3
0.2
0.1
typ
0
25
50
75
100
Temperature (℃)
125
150
(7) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
(8) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(9) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(10) Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit
is assumed.
TSD ON Temperature[℃] (typ.)
BDxxIC0W series
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
175
Hysteresis Temperature [℃]
(typ.)
15
20/23
TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
(11)Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
(12) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin B
B
E
Pin A
N P+
N
P+
P
N
N
Parasitic
element
P+
GND
B
P
P
+
C
N
E
P substrate
Parasitic element
N
P substrate
Parasitic element
GND
GND
Parasitic
element
Other adjacent elements
GND
(13) Ground Wiring Pattern.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external components, either.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
21/23
TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Physical Dimension Tape and Reel Information
HTSOP-J8
<Tape and Reel information>
4°
(2.4)
3.9±0.1
6.0±0.2
8 7 6 5
+6°
−4°
1
0.65±0.15
(3.2)
1.05±0.2
4.9±0.1
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
2 3 4
1PIN MARK
+0.05
0.17 -0.03
1.0MAX
0.545
S
+0.05
0.42 -0.04
0.08±0.08
0.85±0.05
1.27
0.08
M
0.08 S
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
HVSOF6
<Tape and Reel information>
(1.5)
(0.45)
6 5 4
Tape
Embossed carrier tape
Quantity
3000pcs
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
(1.4)
1 2 3
(0.15)
(1.2)
)
1pin
0.145±0.05
0.75Max.
3.0±0.1
2.6±0.1
(MAX 2.8 include BURR)
1.6±0.1
(MAX 1.8 include BURR)
S
0.1 S
0.22±0.05
Direction of feed
0.5
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
HTSOP-J8(TOP VIEW)
Part Number Marking
x x I C 0 W
LOT Number
1PIN MARK
HVSOF6(TOP VIEW)
Part Number Marking
xx
LOT Number
1PIN MARK
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
22/23
xx
00
10
12
15
18
25
30
33
Product Name
BD00IC0WEFJ
BD10IC0WEFJ
BD12IC0WEFJ
BD15IC0WEFJ
BD18IC0WEFJ
BD25IC0WEFJ
BD30IC0WEFJ
BD33IC0WEFJ
xx
B0
BT
BU
BS
BV
BW
BX
BR
BY
BZ
Product Name
BD00IC0WHFV
BD10IC0WHFV
BD12IC0WHFV
BD1CIC0WHFV
BD15IC0WHFV
BD18IC0WHFV
BD25IC0WHFV
BD26IC0WHFV
BD30IC0WHFV
BD33IC0WHFV
TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
BDxxIC0WEFJ / BDxxIC0WHFV
●Revision History
Date
Revision
6.Jul.2012
21.Dec.2012
001
002
Changes
New Release.
The description was modified.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
23/23
TSZ02201-0R6R0A600430-1-2
21.Dec.2012 Rev.002
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.