Microcomputer Peripheral LSIs MN1380 Series CMOS LSIs for Voltage Detection Overview The MN1380 series are elements that monitor the power supply voltage supplied to microcomputers and other LSI systems and issue reset signals for initializing the system after the power is first applied or for preventing runaway operation when the supply voltage fluctuates. There is a choice of three output types: CMOS output, N-channel open drain output, and inverted CMOS output. There are also three package types: M, TO-92, and a mini type for surface mounting. Choose the ideal element for your application from the series' wide selection of detection ranks (17 ranks between 2.0 and 4.9 volts), output types, and package types. Pin Assignment 23 MN1380 - R 2 3 1 M type package Features Three-pin element requiring no adjustment Wide selection of detection ranks (17 ranks between 2.0 and 4.9 volts) Highly precise detection voltage Detection voltage with hysteresis characteristic ∆VD = 50 mV for ranks C to K ∆VD = 100 mV for ranks L to U Low current consumption: IDD = 1µA (typ.) for VDD =5V Low fluctuation in detection voltage with temperature (typ. 1 mV/˚C) Wide selection of output types: CMOS output, Nchannel open drain output, and inverted CMOS output Wide selection of package types: M, TO-92, and a mini type for surface mounting. 1381 23R 1 2 3 TO-92 type package 2 LCR Applications Battery checkers 1 3 Power outage detectors Level discriminators Memory backup systems Mini type package 1=OUT 2=VDD 3=VSS Microcomputer reset circuits Reset circuits for other electronic circuits 1 MN1380 Series Microcomputer Peripheral LSIs MN1380 Series Naming Conventions The MN1380 series offers a wide selection of detection ranks, output types, package types, and packaging. All combinations use the following naming conventions. When ordering, be sure to give the correct part number using these naming conventions. MN13801–R (TA) Winding direction for tape packaging (TA) ...... Tape packaging for TO-92 type package (TX) ...... Embossed tape packing for mini type package (TW) ..... Embossed tape packing for mini type package For further details, see the package specifications. Detection voltage rank (C to U) Output type: Blank ········ CMOS output 1 ················ N-channel open drain output 2 ················ inverted CMOS output Package: 0 ················ M type package 1 ················ TO-92 type package 2 ················ Mini type package Matsushita Electronics Corporation MN1380 series of voltage detection CMOS LSIs with low current consumptions (Example) MN13821–R (TW) Embossed tape packaging R rank (detection voltage of 4.0 to 4.3 V) N-channel open drain output Mini type package MN1380 series of voltage detection CMOS LSIs with low current consumption Minimum Packaging Unit Bulk (M and TO-92 types) ·············· 1,000 Magazine (Mini type) ······················ 50 Taping (Mini and TO-92 types) ······· 3,000 2 Microcomputer Peripheral LSIs MN1380 Series Series Lineup Package Output CMOS output M type Package MN1380 TO-92 type Package MN1381 Mini type Package MN1382 N-channel open drain output MN13801 MN13811 MN13821 Inverted CMOS output MN13802 MN13812 MN13822 Detection Ranks (on Voltage) Rank Detection Voltage for Drop in Power Supply Voltage (VDL) C min 2.0 max 2.2 D 2.1 2.3 E 2.2 2.4 F 2.3 2.5 G 2.4 2.6 H 2.5 2.7 J 2.6 2.9 K 2.8 3.1 L 3.0 3.3 M 3.2 3.5 N 3.4 3.7 P 3.6 3.9 Q 3.8 4.1 R 4.0 4.3 S 4.2 4.5 T 4.4 4.7 U 4.6 4.9 Unit Detection Voltage Hysteresis Width (∆VD) Unit min max V 50 300 mV V 50 300 mV V 100 300 mV 3 MN1380 Series Microcomputer Peripheral LSIs Block Diagram 2 Voltage Reference 1 VDD + Comparator – *1 Output Circuit Level Converter 1 OUT + Comparator Voltage Reference 2 – 3 VSS Note *1: Circuits vary slightly depending on the output type (CMOS output, N-channel open drain output, or inverted CMOS output) Pin Descriptions 4 Pin No. 1 Symbol OUT Function Description Reset signal output pin 2 VDD Power supply pin 3 VSS Ground pin Microcomputer Peripheral LSIs Absolute Maximum Ratings MN1380 Series VSS=0V, Ta=25˚C Parameter Power supply voltage Symbol VDD Rating 7.0 Output voltage VO – 0.3 to VDD +0.3 V Operating ambient temperature Ta –20 to +70 ˚C Storage temperature Tstg –55 to +125 ˚C Recommended Operating Conditions Parameter Power supply voltage Symbol VDD Unit V VSS=0V, Ta=25˚C Conditions See Figures 1 and 4. min 1.5 typ max 6.0 Unit V Electrical Characteristics 1) DC Characteristics VSS=0V, Ta=–20˚C to +70˚C Parameter Power supply current Symbol Conditions IDD VDD = 5 V *1 min typ max Unit 1 5 µA *2 *2 V *2 *2 mV 0.8VDD VDD Load resistance = 10 kW Detection voltage for drop in power supply voltage *2 Detection voltage hysteresis width *2 "H" level output voltage VDL Ta=25˚C ∆VD See Figures 1 and 4. VOH CMOS output IOH=– 40µA Inverted VDD=1.8V CMOS output IOH=– 0.5mA "L" level output voltage VOL N-channel open VDD=1.8V drain output IOL=0.7mA Inverted VDD=6.0V 0.8 VDD V –1.5 VSS 0.4 VSS 0.6 V CMOS output IOH=0.3mA Notes *1: This includes the output pin's leakage current. *2: For particulars, see the detection voltage rank table. 5 MN1380 Series Microcomputer Peripheral LSIs Electrical Characteristics (continued) 2) AC Characteristics Parameter VSS=0V, Ta=25˚C Symbol Conditions Rank C MN1380 MN1381 MN1382 Allowable Value (typ) MN13801 MN13802 MN13811 MN13812 MN13821 MN13822 Unit D E 3.0 2.5 230.0 3.0 3.0 100.0 2.0 4.0 30.0 250.0 160.0 3.0 115.0 100.0 3.0 15.0 35.0 3.0 F G Reset release time tOH See H Figures J 2 and 3. K µs L M N P Q R S T C D E F G Reset time tOL See H Figures J 2 and 3. K L M N P Q R S T 6 µs Microcomputer Peripheral LSIs MN1380 Series Description of Operation VDD VDH VDL 1.5V 0V t VOUT CMOS output, N-channel open drain output MN1380/1381/1382 MN13801/13811/13821 tOH tOH tOL tOL 0V VOUT t Inverted CMOS output Figure MN13802/13812/13822 tOL tOL tOH 0V tOH t Figure 1. Description of Operation Notes 1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range. 2: VDL: Detection voltage for drop in power supply voltage VDH: Detection voltage for rise in power supply voltage tOL : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that the output pin (OUT) goes to "L" level. tOH : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that the output pin (OUT) goes to "H" level. 3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD pins. 7 MN1380 Series Microcomputer Peripheral LSIs Description for Measuring the Output Characteristics VDD 6.0V 1.6V 0V 6.0V t CMOS output, N-channel open drain output MN1380/1381/1382 MN13801/13811/13821 tOH 1.5V tOL 1.0V 0V t Inverted CMOS output MN13802/13812/13822 6.0V 1.6V 1.5V 1.0V tOH tOH 0V t Figure 2. Description chart of Measuring the Output Characteristics 100kΩ VDD Switch: Connect when measuring N-channel open drain output (MN13801/MN13811/MN13821) MN1380 Series 100pF VOUT Figure 3. Circuit for Measuring the Output Characteristics 8 Microcomputer Peripheral LSIs MN1380 Series Description for Measuring the I/O Characteristics VOUT CMOS output, N-channel open drain output MN1380/1381/1382 MN13801/13811/13821 ∆VD Operation indeterminate 0 0 1.5V VDD VDL VDH VOUT Inverted CMOS output MN13802/13812/13822 ∆VD Operation indeterminate 0 0 1.5V VDD VDL VDH Figure 4. Description chart for Measuring the I/O Characteristics Notes 1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range. 2: VDL: Detection voltage for drop in power supply voltage VDH: Detection voltage for rise in power supply voltage 3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD pins. 9 MN1380 Series Microcomputer Peripheral LSIs Application Circuit Example Connect resistors, capacitors, and the like only to the output pin on the MN1380 series element. Note that connecting them to the Power source pins changes VDH, VDL, and ∆VD. Sample Circuit 1 Sample Circuit 2 VDD VDD R OUT MN1380 Series C Select the values of R and C to match the application. 10 OUT MN1380 Series C Microcomputer Peripheral LSIs MN1380 Series Package Dimensions (Unit:mm) M type package 6.9±0.2 1.5 2.5±0.2 1.5 4.5±0.2 0.4 1.0 1.0 4.1±0.2 0.7R 0.55±0.10 0.45±0.10 1.25 1 2 3 1.25 2.5 2.5±0.5 2.5±0.5 1.25 0.85 11 MN1380 Series Microcomputer Peripheral LSIs Package Dimensions (continued)(Unit:mm) TO-92 type package 4.0±0.2 13.5±0.5 5.1±0.2 5.0±0.2 +0.2 0.45 -0.1 2.54 1 2 3 12 2.3±0.2 Microcomputer Peripheral LSIs MN1380 Series Package Dimensions (continued)(Unit:mm) Mini type package +0.20 2.9 -0.05 +0.10 0.4 -0.05 +0.2 3 0.95 0.3 +0.10 0.16 -0.05 0.8 1.9±0.2 +0.2 0.65±0.15 0.95 1.1 -0.1 1 2.8 -0.3 1.5 -0.05 +0.25 2 0.4±0.2 0.1 13 MN1380 Series Microcomputer Peripheral LSIs Reference Characteristics The following characteristics curves represent results from a specific sample therefore they do not guarantee the characteristics for the final product. 1.4 1.2 IDD(µA ) 1.0 VSS OUT 0.8 VDD A 0.6 0.4 V 0.2 0 0 1.0 2.0 5.0 3.0 4.0 VDD(V) 6.0 Figure 5.a. IDD vs. VDD Characteristic (Rank Q) 7.0 Figure 5.b. Measurement Circuit 2.0 VSS IDD(µA ) 1.5 OUT VDD A 1.0 5V 0.5 –40 –20 0 20 40 60 80 Ambient temperature, Ta (˚C) Figure 6.a. IDD Temperature Characteristic (Rank Q) 14 Figure 6.b. Measurement Circuit Microcomputer Peripheral LSIs MN1380 Series Reference Characteristics (continued) 4.8 4.6 4.4 VSS VDL,VDH(V) 4.2 VDH OUT V VDD 4.0 VDL 3.8 V 3.6 3.4 –40 –20 0 20 40 60 80 Temperature Ta(˚C) Figure 7.a. VDL/VDH Temperature Characteristic (Rank Q) Figure 7.b. Measurement Circuit 0.3 0.25 VSS OUT ∆VD(V) 0.2 0.15 V VDD 0.1 V 0.05 0 –40 –20 0 20 40 60 80 Ambient temperature, Ta (˚C) Figure 8.a. ∆VD Temperature Characteristic (Rank Q) Figure 8.b. Measurement Circuit 15 MN1380 Series Microcomputer Peripheral LSIs Reference Characteristics (continued) 3 –30˚C Room temperature 80˚C VSS 2 OUT IOL(mA) VDD A 1 1.8V V 0 0 0.5 1.0 1.5 2.0 2.5 3.0 VOL(V) Figure 9.a. IOL vs. VOL Characteristic 20 Figure 9.b. Measurement Circuit –30˚C Room temperature 15 VSS | IOH | (mA) 80˚C VDD 10 A 5V V 5 0 0 1 2 3 VOL(V) 4 Figure 10.a. IOH vs. VOH Characteristic 16 OUT 5 Figure 10.b. Measurement Circuit Microcomputer Peripheral LSIs MN1380 Series Reference Characteristics (continued) 2.5 2.0 VSS OUT IOL(mA) 1.5 VDD A 1.0 1.8V V 0.5 0 –40 –20 0 20 40 60 Ambient temperature, Ta (˚C) 80 Figure 11.a. IOL vs. Temperature Characteristic Figure 11.b. Measurement Circuit 7.0 6.5 | IOH | (mA) VSS 6.0 OUT VDD A 5.5 5V V 5.0 4.5 –40 –20 0 20 40 60 80 Ambient temperature, Ta (˚C) Figure 12.a. IOH vs. Temperature Characteristic Figure 12.b. Measurement Circuit 17 MN1380 Series Microcomputer Peripheral LSIs TO-92 Type Package Taping-Specifications (MN1381/MN13811/MN13812) ∆h1 A1 P ∆h2 t1 t2 W W0 H0 l1 H1 W2 H A P1 0 T d F1 F2 Drawing direction øD0 P0 Figure 13. TO-92 Type Package Taping-Dimensions (Ammunition pack) TO-92 Type Package Taping Dimensions (Ammunition pack) Name Product height* Symbol A Length (mm) 5.3 max Product width* A1 Product thickness* T Lead width* d Taped lead length l1 2.0 max Product pitch P Name Adhesive tape width Symbol W0 5.2 max Feed hole position W1 9.0±0.5 4.2 max Adhesive tape position W2 0.5 max Distance to top of product H 25.0 max 12.7±1.0 Distance to bottom of product H0 19.0±0.5 16.0±0.5 0.45 +0.15 – 0.1 Length (mm) 6.0±0.5 Feed hole pitch P0 12.7±0.3 Lead clinch height H1 Feed hole position P1 6.35±0.5 Feed hole diameter D0 4.0±0.2 Lead spacing F1, F2 Tape thickness t1 0.7±0.2 Product deflection angle ∆h1, ∆h2 Total tape thickness t2 1.5 max Tape width W 2.5 +0.5 – 0.2 2.0 max 18.0 +1.0 – 0.5 Note*1: For further details, see the specifications issued separately. 25 elements (example) Unit: mm Leave the space for at least three elements B D 41 E H 250 H W 330 W Figure 14. Box Dimensions for TO-92 Type Packages with Ammunition pack 18 D Microcomputer Peripheral LSIs MN1380 Series Embossed Taping Specifications for Mini Type Package (MN1382/MN13821/MN13822) There is a choice of two orientations, TW and TX, for the product relative to the tape. TW TX Tape feed hole Tape feed hole Drawing direction (Marking surface on top) Drawing direction (Marking surface on top) Figure 16. TX Orientation Unit: mm +0.1 -0 4.0±0.1 A t+0.3±0.1 3.3±0.1 1.75±0.1 ø1.5 3.5±0.05 B 3.2±0.1 4.0±0.1 Product orientation A is labeled TW; orientation B, TX. Figure 17. Embossed Taping Dimensions for Mini Type Package Unit: mm ø178±2.0 0.5 2± ø80±1.0 ø21±0.8 ø13±0.5 8.0±0.3 1.75±0.1 Figure 15. TW Orientation 2±0.5 10±1.5 3,000 packages per reel Figure 18. Embossed Taping Reel Dimensions for Mini Type Package 19 MN1380 Series Microcomputer Peripheral LSIs Reliability Testing Results for MN1380 Series (1) M type package (MN1380/MN13801/MN13802) and TO-92 type package (MN1381/MN13811/MN13812) Test Subjects Test Conditions Results Operating lifetime test VDD=5.5V, Ta=125˚C, t=1000hrs 0/15 High-temperature storage test Ta=150˚C, t=1000hrs 0/15 Low-temperature storage test Ta=–65˚C, t=1000hrs 0/15 High-temperature, Ta=85˚C, RH=85%, t=1000hrs 0/15 VDD=5.5V, Ta=85˚C, RH=85%, t=1000hrs 0/15 Ta=150˚C and –65˚C. 0/15 high-humidity storage test High-temperature, high-humidity bias test Thermal shock test Five minutes at each temperature for ten cycles Temperature cycle test Ta=150˚C and –65˚C. 0/15 Thirty minutes at each temperature for ten cycles Pressure cooker test Two atmospheres for 50 hours at ambient temperature (Ta) of 121˚C 0/15 Soldering test Ambient temperature (Ta) of 230˚C for five seconds 0/15 Solder heat resistance test Ambient temperature (Ta) of 270˚C for ten seconds 0/15 (2) Mini type package (MN1382/MN13821/MN13822) Test Subjects Operating lifetime test Test Conditions VDD=5.5V, Ta=125˚C, t=1000hrs Results 0/15 High-temperature storage test Ta=150˚C, t=1000hrs 0/15 Low-temperature storage test Ta=–65˚C, t=1000hrs 0/15 High-temperature, Ta=85˚C, RH=85%, t=1000hrs 0/15 VDD=5.5V, Ta=85˚C, RH=85%, t=1000hrs 0/15 Thermal shock test Ta=150˚C and –65˚C. 0/15 Temperature cycle test Ta=150˚C and –65˚C. high-humidity storage test High-temperature, high-humidity bias test Five minutes at each temperature for ten cycles 0/15 Thirty minutes at each temperature for ten cycles Pressure cooker test *1 Two atmospheres for 24 hours at ambient temperature (Ta) of 121˚C 0/15 Soldering test Ambient temperature (Ta) of 230˚C for five seconds 0/15 Solder heat resistance test *1 Ambient temperature (Ta) of 260˚C for five seconds 0/15 Note*1: Note that the testing conditions for the mini package differ from those for the other two packages. 20