BTA08, BTB08 T810, T835 Snubberless™, logic level and standard 8 A Triacs Features A2 ■ On-state rms current, IT(RMS) 8 A ■ Repetitive peak off-state voltage, VDRM/VRRM 600 to 800 V ■ G A1 Triggering gate current, IGT (Q1) 5 to 50 mA Description A1 A2 A1 A2 G G Available either in through-hole or surface-mount packages, the BTA08, BTB08 and T8 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers,... D2PAK Logic level versions are designed to interface directly with low power drivers such as microcontrollers. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500 VRMS) complying with UL standards (file ref.: E81734). IPAK (T8-H) (T8-G) A2 A1 A2 G DPAK (T8-B) The snubberless versions (BTA/BTB...W and T8 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. March 2010 A2 A2 A2 A1 A2 G TO-220AB Insulated (BTA08) Doc ID 7472 Rev 7 A1 A2 G TO-220AB (BTB08) 1/12 www.st.com 12 Characteristics BTA08, BTB08 and T8 Series 1 Characteristics Table 1. Absolute maximum ratings Symbol IT(RMS) Parameter Value Unit 8 A IPAK/D2PAK/DPAK/ Tc = 110 °C TO-220AB On-state rms current (full sine wave) TO-220AB Ins. Tc = 100 °C Non repetitive surge peak on-state current (full cycle, Tj initial = 25 °C) F = 50 Hz t = 20 ms 80 F = 60 Hz t = 16.7 ms 84 I²t value for fusing tp = 10 ms dI/dt Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz IGM Peak gate current tp = 20 µs ITSM I²t PG(AV) Tstg Tj Table 2. A Average gate power dissipation 36 A ²s Tj = 125 °C 50 A/µs Tj = 125 °C 4 A Tj = 125 °C 1 W - 40 to + 150 - 40 to + 125 °C Storage junction temperature range Operating junction temperature range Electrical characteristics (Tj = 25 °C, unless otherwise specified) Snubberless and logic level (3 quadrants) T8 Symbol Test conditions BTA08 / BTB08 Quadrant Unit T810 T835 IGT (1) VGT VD = 12 V RL = 30 Ω VGD VD = VDRM RL = 3.3 kΩ Tj = 125 °C IH (2) IT = 100 mA IL IG = 1.2 IGT dV/dt (2) (dI/dt)c (2) 2/12 CW BW 5 10 35 50 MAX. I - II - III MAX. 1.3 V I - II - III MIN. 0.2 V I - III 35 SW I - II - III MAX. 10 TW 15 35 10 15 35 50 25 50 10 25 50 70 30 60 15 30 60 80 40 400 20 40 400 1000 5.4 - 3.5 5.4 - - 2.8 - 1.5 2.98 - - - 4.5 - - 4.5 7 MAX. II VD = 67 %VDRM gate open Tj = 125 °C (dV/dt)c = 0.1 V/µs Tj = 125 °C (dV/dt)c = 10 V/µs Tj = 125 °C Without snubber Tj = 125 °C MIN. MIN. mA mA mA Doc ID 7472 Rev 7 V/µs A/ms BTA08, BTB08 and T8 Series Table 3. Characteristics Standard (4 quadrants) BTA08 / BTB08 Symbol IGT (1) Test conditions Quadrant VD = 12 V, RL = 33 Ω VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C IH (2) IT = 500 mA IL IG = 1.2 IGT Table 4. MAX. 1.3 V ALL MIN. 0.2 V 25 50 40 50 80 100 MAX. (dI/dt)c = 5.3 A/ms mA mA mA II Tj = 125 °C MIN. 200 400 V/µs Tj = 125 °C MIN. 5 10 V/µs Value Unit Static characteristics Symbol VTM (1) 50 100 ALL MAX. dV/dt (2) VD = 67 %VDRM gate open (2) 25 50 MAX. I - III - IV (dV/dt)c B I - II - III IV VGT VGD Unit C Test conditions ITM = 11 A, tp = 380 µs Tj = 25 °C MAX. 1.55 V Vt0 (2) Threshold voltage Tj = 125 °C MAX. 0.85 V Rd (2) Dynamic resistance Tj = 125 °C MAX. 50 mΩ 5 µA 1 mA Value Unit IDRM IRRM Tj = 25 °C VDRM = VRRM MAX. Tj = 125 °C 1. minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1. Table 5. Thermal resistance Symbol Rth(j-c) Rth(j-a) Parameter IPAK / D2PAK / DPAK / TO-220AB 1.6 TO-220AB Insulated 2.5 S = 1 cm² D2PAK 45 S = 0.5 cm² DPAK 70 TO-220AB / TO-220AB Insulated 60 IPAK 100 Junction to case (AC) °C/W °C/W Junction to ambient S = Copper surface under tab. Doc ID 7472 Rev 7 3/12 Characteristics Figure 1. BTA08, BTB08 and T8 Series Maximum power dissipation versus Figure 2. rms on-state current (full cycle) P(W) On-state rms current versus case temperature (full cycle) IT(RMS)(A) 10 10 9 9 8 8 7 7 6 6 5 5 4 4 3 3 2 2 1 BTB / T8 BTA 1 IT(RMS)(A) TC(°C) 0 0 0 1 Figure 3. 2 3 4 5 6 7 0 8 On-state rms current versus ambient temperature (full cycle) 25 Figure 4. IT(RMS)(A) 50 75 100 125 Relative variation of thermal impedance versus pulse duration K=[Zth/Rth] 3.5 1E+0 printed circuit board FR4, copper thickness: 35 µm 3.0 Zth(j-c) D2PAK (S=1CM2) DPAK/IPAK Zth(j-a) 2.5 1E-1 TO-220AB/D2PAK Zth(j-a) 2.0 DPAK (S=0.5CM2) 1.5 1E-2 1.0 0.5 tp(s) TC(°C) 1E-3 0.0 0 25 Figure 5. 50 75 100 1E-3 125 On-state characteristics (maximum values) Figure 6. ITM(A) 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Surge peak on-state current versus number of cycles ITSM(A) 100 90 Tj max. Vto = 0.85V Rd = 50 mΩ Tj = Tj max. 80 70 t=20ms 60 One cycle Non repetitive Tj initial=25°C 50 10 Tj = 25°C. 40 Repetitive TC=110°C 30 20 10 VTM(V) 1 0.5 4/12 Number of cycles 0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1 Doc ID 7472 Rev 7 10 100 1000 BTA08, BTB08 and T8 Series Figure 7. Characteristics Non-repetitive surge peak on-state current for a sinusoidal 2 Figure 8. 2 Relative variation of gate trigger current IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] ITSM(A), I t (A s) 2.5 1000 Tj initial=25°C holding current and latching current versus junction temperature (typical values) 2.0 IGT dI/dt limitation: 50A/µs ITSM 1.5 360° 100 IH & IL 1.0 α I2t 0.5 pulse with width tp < 10 ms and corresponding value of I2t tp(ms) 10 0.01 0.10 Figure 9. 1.00 Tj(°C) 0.0 -40 10.00 Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) -20 0 20 40 60 80 100 120 140 Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.0 2.2 2.0 Standard types Snubberless and Logic level types TW 1.8 1.8 1.6 1.6 C 1.4 1.4 1.2 T835/CW/BW 1.2 1.0 B 1.0 0.8 T810/SW 0.6 0.8 0.4 0.2 0.6 (dV/dt)c (V/µs) 0.0 (dV/dt)c (V/µs) 0.4 0.1 1.0 10.0 100.0 Figure 11. Relative variation of critical rate of decrease of main current versus junction temperature 0.1 1.0 10.0 100.0 Figure 12. DPAK and D2PAK thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) (dI/dt)c [Tj] / (dI/dt)c [Tj specified] 100 6 printed circuit board FR4, copper thickness: 35 µm 90 5 80 70 4 60 DPAK 50 3 40 2 30 D2PAK 20 1 S(cm²) 10 Tj(°C) 0 0 0 25 50 75 100 125 0 Doc ID 7472 Rev 7 4 8 12 16 20 24 28 32 36 40 5/12 Package information 2 BTA08, BTB08 and T8 Series Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. D2PAK dimensions Dimensions Ref. Millimeters Min. A E C2 L2 D L L3 Typ. Inches Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 1.40 0.048 0.055 A1 B2 R C B G A2 2mm min. FLAT ZONE V2 R V2 0.40 0° 8° Figure 13. Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 6/12 Doc ID 7472 Rev 7 3.70 0.016 0° 8° BTA08, BTB08 and T8 Series Table 7. Package information DPAK dimensions Dimensions Ref. E A B2 C2 L2 Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 D R H L4 A1 B G R C A2 0.60 MIN. V2 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 14. Footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 Doc ID 7472 Rev 7 7/12 Package information BTA08, BTB08 and T8 Series Table 8. IPAK dimensions Dimensions Ref. Millimeters Min. A E C2 B2 L Typ. Max. 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A3 0.70 1.30 0.027 0.051 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 0.95 0.037 0.30 0.035 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.019 0.023 D 6 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 B3 L1 B A1 V1 e B5 e G 2.28 0.090 C A3 G 4.40 H 8/12 Min. 2.20 B5 D Max. A B3 L2 H Typ. Inches Doc ID 7472 Rev 7 4.60 0.173 16.10 0.181 0.634 L 9 9.40 0.354 0.370 L1 0.8 1.20 0.031 0.047 L2 0.80 V1 10° 1 0.031 0.039 10° BTA08, BTB08 and T8 Series Package information TO-220AB (NIns. and Ins. 20-up) dimensions Dimensions Ref. Millimeters Min. A 15.20 a1 C B ØI Typ. Max. Inches Min. Typ. 15.90 0.598 3.75 Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 b2 L F A I4 l3 c2 a1 l2 a2 M b1 c1 e M Doc ID 7472 Rev 7 2.60 0.102 9/12 Ordering information 3 BTA08, BTB08 and T8 Series Ordering information Figure 15. Ordering information scheme (BTA08 and BTB08 series) BT A 08 - 600 BW (RG) Triac series Insulation A = insulated B = non insulated Current 08 = 8A Voltage 600 = 600V 800 = 800V Sensitivity and type B = 50mA Standard C = 25mA Standard SW = 10mA Logic Level BW = 50mA Snubberless CW = 35mA Snubberless TW = 5mA Logic Level Packing mode RG = Tube Figure 16. Ordering information scheme (T8 series) T 8 10 - 600 B (-TR) Triac series Current 8 = 8A Sensitivity 10 = 10 mA 35 = 35 mA Voltage 600 = 600 V 800 = 800 V Package B = DPAK H = IPAK G = D2PAK R = I2PAK Packing mode Blanck = Tube -TR = Tape and reel Table 9. Product Selector Voltage (xxx) Part Number Sensitivity Package 800 V BTA/BTB08-xxxB X X 50 mA Standard TO-220AB BTA/BTB08-xxxBW X X 50 mA Snubberless TO-220AB BTA/BTB08-xxxC X X 25 mA Standard TO-220AB BTA/BTB08-xxxCW X X 35 mA Snubberless TO-220AB BTA/BTB08-xxxSW X X 10 mA Logic level TO-220AB BTA/BTB08-xxxTW X X 5 mA Logic Level TO-220AB T810-xxxG X X 10 mA Logic Level D2PAK T810-xxxH X X 10 mA Logic Level IPAK T835-xxxB X X 35 mA Snubberless DPAK T835-xxxG X X 35 mA Snubberless D2PAK T835-xxxH X X 35 mA Snubberless IPAK BTB: non insulated TO-220AB package 10/12 Type 600 V Doc ID 7472 Rev 7 BTA08, BTB08 and T8 Series 4 Ordering information Ordering information Table 10. Ordering information Order code Marking Package Weight BTA/BTB08-xxxyzRG BTA/BTB08-xxxyz TO-220AB 2.3 g T8yy-xxxG T8yyxx D2PAK 1.5 g T8yy-xxxG-TR T8yyxx T8yy-xxxB T8yyxx DPAK T8yy-xxxB-TR T8yyxx T8yy-xxxH T8yyxx IPAK Base qty Delivery mode 50 Tube 50 Tube 1000 Tape and reel 75 Tube 2500 Tape and reel 75 Tube 0.3 g 0.4 g xxx = voltage, yy = sensitivity, z = type 5 Revision history Table 11. Document revision history Date Revision Changes Apr-2002 5A 13-Feb-2006 6 TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. 10-Mar-2010 7 Updated ECOPACK statement and Figure 16. Last update. Doc ID 7472 Rev 7 11/12 BTA08, BTB08 and T8 Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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