ISM97 Series 2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS Product Features: Applications: Low Jitter, Non-PLL Based Output CMOS/TTL Compatible Logic Levels Compatible with Leadfree Processing Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 System Clock Frequency 1.000 MHz to 152.250 MHz Output Level HC-MOS TTL Duty Cycle ‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min. ‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min. Specify 50% ±10% or ±5% See Table in Part Number Guide Rise / Fall Time 6 nS Max. Output Load See Table in Part Number Guide Frequency Stability See Frequency Stability Table (Includes room temperature tolerance and stability over operating temperature) 10 mS Max. Start-up Time Enable / Disable Time Supply Voltage 100 nS Max. N.C. or ≥ 70% Vdd = Enable. ≤ 30% Vdd = Disable. Current 25 mA Max. (5.0V) Recommended Pad layout See Input Voltage Table, tolerance ±5 % 2.6 20 mA Max. (1.8V-3.3V) 2.0 Operating See Operating Temperature Table in Part Number Guide Storage -55 C to +125 C 1.3 1.4 Jitter: RMS(1sigma) 1 MHz-60 MHz Max Integrated 1 MHz-60 MHz 1.5 pS RMS (1 sigma -12KHz to 20MHz) Max Total Jitter 1 MHz-60 MHz 50 pS p-p (100K adjacent periods) Part Number Guide Package ISM97 - Pin Connection 1 Enable 2 GND 3 Output 4 Vcc 5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods) Input Voltage Dimension Units: mm Sample Part Number: Operating Temperature Symmetry (Duty Cycle) 5 = 5.0 V 1 = 0 C to +70 C 5 = 45 / 55 Max. 3 = 3.3 V 6 = -10 C to +70 C 6 = 40 / 60 Max. 7 = 3.0 V 3 = -20 C to +70 C 2 = 2.7 V 4 = -30 C to +75 C 6 = 2.5 V 2 = -40 C to +85 C ISM97 - 3251BH - 20.000 Output Stability (in ppm) Enable / Disable **E = 10 H = Enable 6 = 30 pF **D = 15 O = N/C 5 = 50 pF HC-MOS (<40 MHz) **F = 20 1 = 10TTL / 15 pF HC-MOS **A = 25 B = 50 C = 100 1 = 1.8 V* NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. * Not available at all frequencies. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 6/05/12 _B Specifications subject to change without notice Page 1 Frequency - 20.000 MHz ISM97 Series 2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 6/05/12 _B Specifications subject to change without notice Page 2