MAS MAS9280A3TG00 Ic for 18.00 - 40.00 mhz vctcxo Datasheet

DA9280.003
13 July 2006
MAS9280
IC FOR 18.00 – 40.00 MHz VCTCXO
This is preliminary information on a new
product under development. Micro Analog
Systems Oy reserves the right to make any
changes without notice.
Min. Supply Voltage 2.4 V
Max. Frequency 40 MHz
True Sine Wave Output
Frequency Stability +/- 1.5 ppm
Suitable Also for Low Pull
Crystals
Very Low Phase Noise
•
•
•
•
•
•
DESCRIPTION
The MAS9280 is an integrated circuit well suited to
build VCTCXO for mobile communication.
Temperature calibration is achieved in three
calibration temperatures only. The trimming is done
through a serial bus and the calibration information
is stored in an internal PROM. This means no
rework for trimming is needed.
To build a VCTCXO additionally only a crystal is
required. The compensation method is fully analog,
working continuously without generating any steps
or other interference.
Divider function allows the usage of double
frequency crystal.
FEATURES
•
•
•
•
•
•
APPLICATIONS
Very small size
Minimum Vdd 2.4V
No voltage reference capacitor needed
Phase noise <-110 dBc/Hz at 100 Hz and
<-130 dBc/Hz at 1kHz @ 32 MHz crystal
Programmable VC-sensitivity
Oscillator frequency output fo /2 versions
available
•
•
VCTCXO for mobile phones
VCTCXO for other telecommunications
systems
BLOCK DIAGRAM
DA
CLK
PV
CUB
4
INF
4
SENS
4
LIN
8
CDAC1
8
MAS9280
f(T)
TE1
Σ
f(T)
T
Vref
TMux
TE2
VC
VDD
CDAC2
VSS
2
OUT
X2
X1
1 (8)
DA9280.003
13 July 2006
PIN DESCRIPTION
Pin Description
Symbol
MAS9280A1/
A3 /B1/B3
x-coordinate
MAS9280A1/
A3 /B1/B3
y-coordinate
MAS9280A2
/B2
x-coordinate
MAS9280A2
/B2
y-coordinate
Power Supply Voltage
Programming Input
Serial Bus Clock Input
VDD
PV
CLK
268
604
1047
1320
1320
1320
268
604
1420
1320
1320
1320
Serial Bus Data Input
Temperature Output
Crystal/Varactor Oscillator Input
Voltage Control Input
Crystal Oscillator Output
Buffer Output
Power Supply Ground
Test Multiplexer Output
DA
TE1
X2
VC
X1
OUT
VSS
TE2
1420
1848
1048
268
796
2020
1701
2058
1320
1320
164
164
164
164
164
1320
1047
1848
1048
268
796
2020
1701
2058
1320
1320
164
164
164
164
164
1320
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
Note: Test Multiplexer Output is for testing only and must not be connected in module.
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min
Max
Unit
Supply Voltage
Input Voltage
Power Dissipation
Storage Temperature
VDD - VSS
VIN
PMAX
TST
-0.3
VSS -0.3
6.0
VDD + 0.3
20
150
V
V
mW
o
C
-55
Note
1)
Note 1: Not valid for programming pin PV
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Supply Current
Operating Temperature
Load Capacitance
Load Capacitance
Crystal Pulling Sensitivity
Crystal Rs
Symbol
VDD
ICC
TOP
CL
CL
S
CRS
Conditions
Min
Typ
Max
Unit
2.4
2.6
5.0
1.8
+85
V
mA
o
C
pF
pF
ppm/pF
Ω
Vdd = 2.8 Volt
-40
8
10
18
30
50
Note
1
2
3
Note 1: MAS9280A1, MAS9280A2 and MAS9280A3 with CDAC1 = 160 …200
Note 2: MAS9280B1, MAS9280B2 and MAS9280B3 with CDAC1 = 160 …200
Note 3: At 30 MHz to 40 MHz maximum Rs 30 ohm.
2 (8)
DA9280.003
13 July 2006
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Min
Frequency Range
fo
Voltage Control Range
VC
Typ
Max
Unit
Note
18.00
40.00
MHz
1)
0
VDD
V
Voltage Control Sensitivity (VCR = 0)
VCSENS
10
ppm/V
Voltage Control Sensitivity (VCR = 1)
VCSENS
5
ppm/V
2)
Frequency vs. Supply Voltage
dfo
±0.2
ppm
3)
Frequency vs. Load Change
dfo
±0.2
ppm
4)
Output Voltage (10kΩ // 10 pF)
Vout
0.6
Harmonic Distortion
Compensation Range ± 2.5 ppm
TC
Compensation Range ± 2.0 ppm
1.0
Vpp
-25
dBc
-40
TC
-30
85
o
C
85
o
C
o
C
Compensation Range ± 1.5 ppm
TC
-25
75
Compensation Range Linear Part
a1
-0.7
0.0
Compensation Inflection Point
INF
25
31
Compensation Range Cubic Part
a3
Compensation CDAC1 (8 Bit)
CX1
C10
C10 + 10.6
pF
5)
Compensation CDAC2 (2 Bit)
CX2
C20
C20 + 3
pF
6)
Start up Time
ppm/K
o
TSTART
C
ppm2/K3
95
2
ms
Note 1: MAS9280B1, MAS9280B2 and MAS9280B3 maximum frequency are 36MHz
Note 2: default
Note 3: VDD +/- 5%
Note 4: R=10 kohm +/- 10%, C=10 pF +/- 10%
Note 5: typ C10 = 9.7pF
Note 6: typ C20 = 15.2pF
IC OUTLINES
VDD
PV
CLK
DA
TE1
TE2
1484um
VDD
PV
DA
CLK
TE1
TE2
1484um
MAS9280A1/A3 /B2/B3
VC
X1
X2
Die map reference
VSS
MAS9280A2 /B2
VC
OUT
X1
X2
VSS
OUT
Die map reference
2194um
2194um
Note 1: MAS9280A and MAS9280B pads are round with 80 µm diameter at opening.
Note 2: Pins CLK and DA can either be connected to VSS or left floating, pin PV can either be connected to
VDD or left floating and pin TE1 must be left floating in VCTCXO module end-user application.
Note 3: Die map reference is the actual left bottom corner of the sawn chip.
3 (8)
DA9280.003
13 July 2006
SAMPLES IN SBDIL 20 PACKAGE
1
20 OUT
2
19
3
18 VSS
TE2 4
DA 6
MAS9280A1
YYWW
XXXXX.X
TE1 5
17
16 X2
Top marking:
YYWW = Year, Week
XXXXX.X = Lot number
15
14 X1
CLK 7
13
PV 8
VDD 9
12 VC
10
11
DEVICE OUTLINE CONFIGURATION
MSOP10
OUT
DA
VSS
CLK
X2
PV
VDD
9280
AX
YWW
TE2
Top View
X1
VC
A = product version
X = pad layout and fo version
Y = year
WW= week
4 (8)
DA9280.003
13 July 2006
PACKAGE (MSOP-10) OUTLINE
e
S
See Detail A
c
B
c1
b1
(b)
E1
E1
B
Section B - B
E
E
5-15 Degrees
L1
Detail A
A2A
F
AA
A1
Land
Pattern
Recommendation
Gauge Plane
0 - 8 Degrees
L2
D
Seating Plane
N
L
G
Symbol
Min
Nom
Max
Unit
A
A1
A2
b
b1
c
c1
D
E
E1
e
F
G
L
(Terminal length for
soldering)
L1
L2
M
N
S
-0.00
0.75
0.15
0.15
0.08
0.08
--0.85
----
1.10
0.15
0.95
0.30
0.25
0.23
0.18
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
0.40
3.00 BSC
4.90 BSC
3.00 BSC
0.50 BSC
4.8
0.50
0.60
0.80
0.95 REF
0.25 BSC
0.41
1.02
0.50
M
mm
mm
mm
Mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
Reference Standard : JEDEC MO-187 BA.
5 (8)
DA9280.003
13 July 2006
SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20 2*220°C
240°C
2
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
Seating Plane Co-planarity
Lead Finish
EMBOSSED TAPE SPECIFICATIONS
P1
T
DO
PO
P2
E
W
F
BO
A
AO
KO
D1
Section A-A
User Direction of Feed
Pin 1 Designator
Dimension
Min/Max
Unit
Ao
Bo
Do
D1
E
F
Ko
Po
P1
P2
T
W
5.00 ±0.10
3.20 ±0.10
1.50 +0.1/-0.0
1.50 min
1.75
5.50 ±0.05
1.45 ±0.10
4.0
8.0
±0.10
2.0
±0.05
0.3
±0.05
12.00 +0.30/-0.10
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
6 (8)
DA9280.003
13 July 2006
REEL SPECIFICATIONS
W2
A
D
C
Tape Slot for Tape Start
N
B
W1
5000 Components on Each Reel
Reel Material: Conductive, Plastic Antistatic or Static Dissipative
Carrier Tape Material: Conductive
Cover Tape Material: Static Dissipative
Carrier Tape
Cover Tape
End
Start
Trailer
Dimension
A
B
C
D
N
W 1 (measured at hub)
W 2 (measured at hub)
Trailer
Leader
Weight
Leader
Components
Min
1.5
12.80
20.2
50
12.4
Max
Unit
330
mm
mm
mm
mm
mm
mm
mm
mm
mm
13.50
14.4
18.4
160
390,
of which minimum 160
mm of empty carrier tape
sealed with cover tape
1500
g
7 (8)
DA9280.003
13 July 2006
ORDERING INFORMATION
Product Code
MAS9280A1TG00
MAS9280A1SM06
MAS9280A2TG00
MAS9280A3TG00
MAS9280A3SM06
MAS9280B1TG00
MAS9280B1SM06
MAS9280B2TG00
MAS9280B3TG00
MAS9280B3SM06
Product
IC FOR VCTCXO
IC FOR VCTCXO
IC FOR VCTCXO,
CLK and DA pins
swapped round
IC FOR VCTCXO,
frequency output fo /2
IC FOR VCTCXO,
frequency output fo /2
IC FOR VCTCXO
IC FOR VCTCXO
IC FOR VCTCXO,
CLK and DA pins
swapped round
IC FOR VCTCXO,
frequency output fo /2
IC FOR VCTCXO,
frequency output fo /2
Comments
For 8pF Crystal load
For 8pF Crystal load
For 8pF Crystal load
Package
EWS Tested wafers 215 µm
For 8pF Crystal load
EWS Tested wafers 215 µm
For 8pF Crystal load
MSOP-10, T&R/5000 pcs/r.
For 10pF Crystal load
For 10pF Crystal load
For 10pF Crystal load
EWS Tested wafers 215 µm
For 10pF Crystal load
EWS Tested wafers 215 µm
For 10pF Crystal load
MSOP-10, T&R/5000 pcs/r.
MSOP-10, T&R/5000 pcs/r.
EWS Tested wafers 215 µm
MSOP-10, T&R/5000 pcs/r.
EWS Tested wafers 215 µm
Please contact Micro Analog Systems Oy for other wafer thickness options.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O. Box 51
FIN-02771 Espoo, FINLAND
Tel. +358 9 80 521
Fax +358 9 805 3213
http://www.mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no
claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or
modification.
8 (8)
Similar pages