Austin AS8E512K8CW-250/IT 512k x 8 eeprom eeprom module Datasheet

EEPROM
AS8E512K8
Austin Semiconductor, Inc.
512K x 8 EEPROM
PIN ASSIGNMENT
EEPROM Module
(Top View)
AVAILABLE AS MILITARY
SPECIFICATIONS
•
•
32-Pin DIP & 32-Pin SOJ (CW)
FEATURES
•
•
•
•
•
•
•
•
Access times of 150, 200, 250, and 300 ns
JEDEC Compatible Pinout
10,000 Write Endurance Cycles
10 year Data Retention
Organized as 512Kx8
Operation with single 5 volt supply
Low power CMOS
TTL Compatible Inputs and Outputs
OPTIONS
•
•
•
1
32
Vcc
A16
2
31
WE\
A15
3
30
A17
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O 0
I/O 1
I/O 2
Vss
4
5
6
7
8
9
10
11
12
13
14
15
16
29
28
27
26
25
24
23
22
21
20
19
18
17
A14
A13
A8
A9
A11
OE\
A10
CE\
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
A18
SMD 5962-93091
MIL-STD-883
MARKING
Packaging
32 pin 600 MIL DIP
CW
Timing
150ns
200ns
250ns
300ns
-150
-200
-250
-300
Operating Temperature Range
-Military (-55oC to +125oC)
-Industrial (-40oC to +85oC)
No. 112
PIN DESCRIPTION
A0 - A18
Address Inputs
I/O 0 - I/O 7 Data Inputs/Outputs
CE\
Chip Select
OE\
Output Enable
WE\
Write Enable
Vcc
+5.0V Power
XT
IT
GENERAL DESCRIPTION
A0 - A16
The Austin Semiconductor, Inc. AS8E512K8 is a
4 Megabit CMOS EEPROM Module organized as 512K x 8-bits.
It is built with four 128K x 8 components and a single decoder.
The AS8E512K8 achieves high speed access, low power
consumption and high reliability by employing advanced CMOS
memory technology. Software data protection is implemented
using the JEDEC Optional Standard algorithm.
This military temperature grade product is ideally suited
for military and space applications requiring high reliability.
AS8E512K8
Rev. 3.1 6/05
I/O 0 - I/O 7
WE\
OE\
U1
A0 - A16
I/O 0 - I/O 7
U4
U3
A0 - A16
I/O 0 - I/O 7
A0 - A16
I/O 0 - I/O 7
WE\
WE\
WE\
WE\
OE\
OE\
OE\
OE\
CE\
A17
A18
CE\
U2
A0 - A16
I/O 0 - I/O 7
CE\
CE\
CE\
1 of 4
Decoder
For more products and information
please visit our web site at
www.austinsemiconductor.com
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1
EEPROM
Austin Semiconductor, Inc.
AS8E512K8
DEVICE OPERATION:
TOGGLE BIT:
The AS8E512K8 is an electrically erasable and programmable memory
module that is accessed like a Static RAM for the read or write cycle
without the need for external components. The device contains a
128-byte-page register to allow writing of up to 128 bytes of data
simultaneously. During a write cycle, the address and 1 to 128 bytes
of data are internally latched, freeing the address and data bus for other
operations. Following the initiation of a write cycle, the device will
automatically write the latched data using an internal control timer.
The end of a write cycle can be detected by DATA\ polling of I/O7.
Once the end of a write cycle has been detected a new access for a read
or write can begin.
In addition to DATA\ Polling the AS8E512K8 provides another
method for determining the end of a write cycle. During the write
operation, successive attempts to read data from the device will result
in I/O 6 toggling between one and zero. Once the write has completed,
I/O 6 will stop toggling and valid data will be read. Reading the toggle
bit may begin at any time during the write cycle.
DATA PROTECTION:
If precautions are not taken, inadvertent writes may occur during
transitions of the host power supply. The E2 module has incorporated both hardware and software features that will protect the memory
against inadvertent writes.
READ:
HARDWARE PROTECTION:
The AS8E512K8 is accessed like a Static RAM. When CE\ and
OE\ are low and WE\ is high, the data stored at the memory location
determined by the address pins is asserted on the outputs. The
outputs are put in the high impedance state when either CE\ or OE\ is
high. This dual-line control gives designers flexibility in preventing
bus contention in their system.
Hardware features protect against inadvertent writes to the
AS8E512K8 in the following ways: (a) Vcc sense - if Vcc is below
3.8V (typical) the write function is inhibited; (b) Vcc power-on delay
- once Vcc has reached 3.8V the device will automatically time out
5ms (typical) before allowing a write; (c) write inhibit - holding any
one of OE\ low, CE\ high or WE\ high inhibits write cycles; (d) noise
filter - pulses of less than 15 ns (typical) on the WE\ or CE\ inputs will
not initiate a write cycle.
BYTE WRITE:
A low pulse on the WE\ or CE\ input with CE\ or WE\ low
(respectively) and OE\ high initiates a write cycle. The address is
latched on the falling edge of CE\ or WE\, whichever occurs last. The
data is latched by the first rising edge of CE\ or WE\. Once a byte,
word or double word write has been started it will automatically time
itself to completion.
SOFTWARE DATA PROTECTION:
A software controlled data protection feature has been implemented on theAS8E512K8. When enabled, the software data protection (SDP), will prevent inadvertent writes. The SDP feature may be
enabled or disabled by the user and is shipped with SDP disabled,
SDP is enabled by the host system issuing a series of three write
commands; three specific bytes of data are written to three specific
addresses (refer to Software Data Protection Algorithm). After
writing the three byte command sequence and after tWC for each of the
die the entire AS8E512K8 will be protected from inadvertent write
operations. It should be noted, that once protected the host may still
perform a byte or page write to the AS8E512K8. This is done by
preceding the data to be written by the same three byte command
sequence used to enable SDP. Once set, SDP will remain active unless
the disable command sequence is issued. Power transitions do not
disable SDP and SDP will protect the AS8E512K8 during power-up
and power-down conditions. All command sequences must conform
to the page write timing specifications. The data in the enable and
disable
command sequences is not written to the device and the
memory addresses used in the sequence may be written with data in
either a byte or page write operation.
After setting SDP, any attempt to write to the device without the
three byte command sequence will start the internal write timers. No
data will be written to the device; however, for the duration of tWC,
read operations will effectively be polling operations.
PAGE WRITE:
The page write operation of the AS8E512K8 allows 1 to 128
BWDWs of data to be written into the device during a single internal
programming period. Each new BWDW must be written within 150us
(tBLC) of the previous BWDW. If the tBLC limit is exceeded the
AS8E512K8 will cease accepting data and commence the internal
programming operation. For each WE\ high to low transition during
the page write operation, A7-A18 must be the same.
The A0-A6 inputs are used to specify which bytes within the page
are to be written. The bytes may be loaded in any order and may be
altered within the same load period. Only bytes which are specified
for writing will be written; unnecessary cycling of other bytes within
the page does not occur.
DATA\ POLLING:
The AS8E512K8 features DATA\ Polling to indicate the end of a
write cycle. During a byte or page write cycle an attempted read of
the last byte written will result in the complement of the written data
to be presented on I/O 7. Once the write cycle has been completed,
true data is valid on all outputs, and the next write cycle may begin.
DATA\ Polling may begin at anytime during the write cycle.
AS8E512K8
Rev. 3.1 6/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
2
EEPROM
AS8E512K8
Austin Semiconductor, Inc.
ABSOLUTE MAXIMUM RATINGS*
Voltage on Vcc Supply Relative to Vss
Supply/Input Voltage Range1.........................-0.6V to +6.25V DC
Voltage on OE\ and A9....................................-0.6V to +13.5V DC
Voltage on all other pins..................................-0.6V to +6.25V DC
Storage Temperature.............................................-65°C to +150°C
Operating Temperature, TA (Ambient)................-55oC to +125oC
Lead Temperature (soldering 10 seconds)........................+300oC
Maximum Junction Temperature**....................................+165°C
*Stresses greater than those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the
operation section of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods
may affect reliability.
** Junction temperature depends upon package type, cycle
time, loading, ambient temperature and airflow.
NOTE: 1. Including NC pins, with respect to ground.
PIN CAPACITANCE (f= 1MHz, T = 25° C)(1)
SYMBOL
CONDITIONS
MAX
UNIT
VIN = 0V, f = 1MHz
45
pF
CI/O
VOUT = 0V, f = 1MHz
50
pF
CCE\
VIN = 0V, f = 1MHz
10
pF
CADD, OE\, WE\
OPERATING MODES
MODE
CE\
OE\
WE\
I/O
VIL
VIL
VIH
DOUT
VIL
VIH
VIL
DIN
VIH
1
X
X
High Z
Write Inhibit
X
X
VIH
Write Inhibit
X
VIL
X
Output Disable
X
VIH
X
Read
Write
2
Standby/Write Inhibit
High Z
NOTE: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS
(-55oC<TA<+125oC; Vcc = 5V +10%)
PARAMETER
Input Load Current
Output Leakage Current
Vcc Standby Current CMOS
CONDITION
SYMBOL
MIN
MAX
UNITS
VIN = OV to Vcc + 1V
ILI
-20
20
µΑ
VI/O = OV to Vcc
ILO
-20
20
µΑ
CE\ = Vcc -0.2V to Vcc + 1
ISB1
CE\ = 2.2V to Vcc + 1
ISB2
20
mA
F = 5 MHz; IOUT = 0 mA
ICC
120
mA
Input Low Voltage
VIL
0.8
V
Input High Voltage
VIH
Vcc Standby Current TTL
Vcc Active Current
mA
2.0
V
Output Low Voltage
IOL = 2.1 mA
VOL
Output High Voltage
IOH = -400 µA
VOH1
2.4
V
IOH = -100 µA; Vcc = 4.5V
VOH2
4.2
V
Output High Voltage CMOS
AS8E512K8
Rev. 3.1 6/05
0.45
V
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
3
EEPROM
AS8E512K8
Austin Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC READ OPERATING
CONDITIONS (-55oC<TA<+125oC; Vcc = 5V +10%)
!" # "" !
A.C. READ WAVEFORMS(1,2,3,4)
ADDRESS
ADDRESS VALID
CE\
tCE
tOE
OE\
OUTPUT
HIGH Z
tOH
tACC
OUTPUT
VALID
NOTES:
1. CE\ may be delayed up to tACC-tCE after the address transition without inpact on tACC.
2. OE\ may be delayed up to tCE-tOE after the falling edge of
CE\ without inpact on tCE or by tACC-tOE after an address
change without inpact on tACC.
3. tDF is specified from OE\ or CE\ whichever occurs first
(CL = 5pF).
4. This parameter is characterized and is not 100% tested.
5. A17 and A18 must remain valid through the WE\ and CE\
low pulse.
INPUT TEST WAVEFORMS AND MEASUREMENT
LEVEL FOR AC TEST CONDITIONS
In p u t P u ls e L e v e ls
In p u t R is e a n d F a ll T im e s
In p u t a n d O u tp u t
T im in g R e fe re n c e L e v e ls
AS8E512K8
Rev. 3.1 6/05
tDF
0 V to 3 .0 V
5nS
1 .5 V
OUTPUT TEST LOAD
5.0V
1.8K
1.3K
100pF
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
4
EEPROM
AS8E512K8
Austin Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC WRITE OPERATING
CONDITIONS (-55oC<TA<+125oC; Vcc = 5V +10%)
SYMBOL
PARAMETER
tWC
Write Cycle Time
MIN
tAS
Address Set-up time
tAH
Address Hold Time
50
ns
tDS
Data Set-up Time
50
ns
ns
5
tDH
Data Hold Time
0
Write Pulse Width
100
tBLC
Byte Load Cycle Time
Write Pulse Width High
OE\
UNITS
10
ms
10
tWP
tWPH
MAX
ns
ns
150
50
µs
ns
AC WRITE WAVEFORMS - WE\ CONTROLLED5
tOEH
tOES
ADDRESS
CE\
WE\
tAS5
tCH
tAH5
tCS
tWPH
tWP
tDS
tDH
DATA IN
AC WRITE WAVEFORMS - CE\ CONTROLLED5
OE\
tOEH
tOES
ADDRESS
?WE\
CE\
tAS5
tCH
tAH5
tCS
tWPH
tWP
tDS
tDH
DATA IN
AS8E512K8
Rev. 3.1 6/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
5
EEPROM
AS8E512K8
Austin Semiconductor, Inc.
PAGE MODE CHARACTERISTICS
PARAMETER
SYMBOL
MIN
tAS, tOES
10
ns
Address Hold Time
tAH
50
ns
Chip Select Setup Time
tCS
0
ns
Chip Select Hold Time
tCH
0
ns
Write Pulse Width (WE\ or CE\)
tWP
100
ns
Data Setup Time
tDS
50
ns
tDH, tOEH
10
ns
Address, OE\ Setup Time
Data, OE\ Hold Time
MAX
UNITS
PAGE MODE WRITE WAVEFORMS(1,2,3)
OE\
?CE\
tBLC
tWPH
tWP
WE\
tAS
A0-A18
t AH
VALID ADDR
tDS
DATA
tDH
VALID DATA
BYTE 0
BYTE 1
BYTE 2
BYTE 3
BYTE 126
NOTES: 1. A7 through A16 must specify the page address during each high to low transition of ?W/E (or ?C/E).
2. ?O/E must be high only when ?W/E and ?C/E are both low.
3. A17 and A18 must remain valid throughout the WE\ and CE\ low.
BYTE 127
tWC
CHIP ERASE WAVEFORMS
VIH
CE\
VIL
VH
?OE\
VIH
NOTES:
tS = 5µsec (min)
tW= tH= 10 msec (min)
VH=12.0 V +/- 0.5 V
AS8E512K8
Rev. 3.1 6/05
?WE\
tS
VIH
VIL
tH
tw
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
6
EEPROM
AS8E512K8
Austin Semiconductor, Inc.
SOFTWARE DATA PROTECTION ENABLE
ALGORITHM(1)(5)
SOFTWARE DATA PROTECTION DISABLE
ALGORITHM(1)(5)
Load Data AA
to
Address 5555
Load Data AA
to
Address 5555
Load Data 55
to
Address 2AAA
Load Data 55
to
Address 2AAA
Load Data A0
to
Address 5555
Load Data 80
to
Address 5555
Writes Enabled(2)
Load Data AA
to
Address 5555
Load Data XX
to
Any Address(4)
Load Last Byte
to
Last Address
Load Data 55
to
Address 2AAA
Enter Data
Protect State
Load Data 20
to
Address 5555
Exit Data Protect
State(3)
Load Data XX
to
Any Address(4)
Load Last Byte
to
Last Address
NOTES:
1. Data Format: I/O 7 - I/O0 (Hex)
2. Write Protect state will be active at end of write even if no other
data is loaded.
3. Write Protect state will be deactivated at end of period even if no
other data is loaded.
4. 1 to 128 bytes of data are loaded.
5. Applies to each of the 4 die in the module.
AS8E512K8
Rev. 3.1 6/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
7
EEPROM
AS8E512K8
Austin Semiconductor, Inc.
SOFTWARE PROTECTED PROGRAM CYCLE WAVEFORM(1,2,3,4)
OE\
CE\
WE\
tWP
tAS
tAH
A0-A6
BYTE ADDRESS
5555
2AAA
5555
A7-A18
PAGE ADDRESS
tDH
tDS
DATA
tBLC
tWPH
AA
55
A0
BYTE 0
BYTE 126
BYTE 127
t WC
NOTES: 1. A0-A14 must conform to the addressing sequence for the first three bytes as shown above.
2. After the command sequence has been issued and a page write operation follows, the page address inputs
(A7-A18) must be the same for each high to low transition of WE\ (or CE\).
3. OE\ Must be high only when WE\ and CE\ are both low.
4. A17 and A18 must remain valid throughout the WE\ and CE\ low cycle.
AS8E512K8
Rev. 3.1 6/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
8
EEPROM
AS8E512K8
Austin Semiconductor, Inc.
DATA POLLING CHARACTERISTICS(1)
SYMBOL
MIN
Data Hold Time
PARAMETER
tDH
10
ns
OE\ Hold Time
tOEH
10
ns
2
tOE
Write Recovery Time
tWR
OE\ to Output Delay
MAX
UNITS
ns
0
ns
NOTES: 1. These parameters are characterized and not 100% tested.
2. See A.C. Read Characteristics.
DATA POLLING WAVEFORMS
WE\
CE\
tOEH
OE\
t OE
I/O7
A0-A18
AS8E512K8
Rev. 3.1 6/05
An
tWR
HIGH Z
An
An
An
An
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
9
EEPROM
Austin Semiconductor, Inc.
AS8E512K8
TOGGLE BIT CHARACTERISTICS(1)
PARAMETER
SYMBOL
MIN
Data Hold Time
tDH
10
ns
OE\ Hold Time
tOEH
10
ns
OE\ to Output Delay
2
MAX
UNITS
ns
tOE
OE\ High Pulse
Write Recovery Time
tOEHP
150
tWR
0
ns
NOTES: 1. These parameters are characterized and not 100% tested.
2. See A.C. Read Characteristics.
TOGGLE BIT WAVEFORMS(1,2,3)
WE\
CE\
t OEH
?OE\
t DH
I/O6
t OE
HIGH Z
t WR
NOTES: 1. Toggling either OE\ or CE\ or Both OE\ and CE\ will operate toggle bit.
2. Beginning and ending state of I/O6 will vary.
3. Any address location may be used but the address should not vary.
AS8E512K8
Rev. 3.1 6/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
10
EEPROM
AS8E512K8
Austin Semiconductor, Inc.
MECHANICAL DEFINITIONS*
ASI Case #112 (Package Designator CW)
SMD 5962-93091, Case Outline Y
D
32
17
A
A1
D1
1
A2
16
e
e1
D2
B
B1
SMD Specifications
SYMBOL
A
A1
A2
B
B1
D
D1
D2
e
e1
MIN
0.161
0.027
MAX
0.181
0.047
0.125 MIN
0.009
0.590
1.654
0.580
1.492
0.012
0.610
1.686
0.600
1.508
0.100 TYP
0.016
0.02
NOTE: These dimensions are per the SMD. ASI's package dimensional limits
may differ, but they will be within the SMD limits.
*All measurements are in inches.
AS8E512K8
Rev. 3.1 6/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
11
EEPROM
AS8E512K8
Austin Semiconductor, Inc.
ORDERING INFORMATION
EXAMPLE: AS8E512K8CW-250/XT
Device Number
Package
Type
Speed
ns
Process
AS8E512K8
CW
-150
/*
AS8E512K8
AS8E512K8
AS8E512K8
CW
CW
CW
-200
-250
-300
/*
/*
/*
*AVAILABLE PROCESSES
IT = Industrial Temperature Range
XT = Extended Temperature Range
HQ = MIL-PRF-38534
AS8E512K8
Rev. 3.1 6/05
-40oC to +85oC
-55oC to +125oC
-55oC to +125oC
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
12
EEPROM
Austin Semiconductor, Inc.
AS8E512K8
ASI TO DSCC PART NUMBER
CROSS REFERENCE*
ASI Package Designator CW
ASI Part #
AS8E512K8CW-150/HQ
AS8E512K8CW-150/HQ
AS8E512K8CW-200/HQ
AS8E512K8CW-200/HQ
AS8E512K8CW-250/HQ
AS8E512K8CW-250/HQ
AS8E512K8CW-300/HQ
AS8E512K8CW-300/HQ
SMD Part #
5962-9309101HYC
5962-9309101HYA
5962-9309104HYC
5962-9309104HYA
5962-9309103HYC
5962-9309103HYA
5962-9309102HYC
5962-9309102HYA
* ASI part number is for reference only. Orders received referencing the SMD part number will be processed per the SMD.
AS8E512K8
Rev. 3.1 6/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
13
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