PHILIPS BYG50 Controlled avalanche rectifier Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
ok, halfpage
M3D168
BYG50 series
Controlled avalanche rectifiers
Preliminary specification
1996 May 24
Philips Semiconductors
Preliminary specification
Controlled avalanche rectifiers
BYG50 series
FEATURES
DESCRIPTION
• Glass passivated
DO-214AC; SOD106 surface
mountable package with glass
passivated chip.
• High maximum operating
temperature
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic.
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
cathode
band
handbook, 4 columns
• UL 94V-O classified plastic
package
k
a
• Shipped in 12 mm embossed tape.
Top view
Side view
MSA474
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VRRM
PARAMETER
CONDITIONS
IF(AV)
IFSM
MAX.
UNIT
−
200
V
repetitive peak reverse voltage
BYG50D
VR
MIN.
BYG50G
−
400
V
BYG50J
−
600
V
BYG50K
−
800
V
BYG50M
−
1000
V
BYG50D
−
200
V
BYG50G
−
400
V
continuous reverse voltage
BYG50J
−
600
V
BYG50K
−
800
V
BYG50M
−
1000
V
average forward current
non-repetitive peak forward current
1996 May 24
averaged over any 20 ms
period; Ttp = 100 °C; see Fig.2
−
2.1
A
averaged over any 20 ms
period; Al2O3 PCB mounting (see
Fig.7); Tamb = 60 °C; see Fig.3
−
1.0
A
averaged over any 20 ms
period; epoxy PCB mounting
(see Fig.7); Tamb = 60 °C;
see Fig.3
−
0.7
A
t = 10 ms half sinewave;
Tj = Tj max prior to surge;
VR = VRRMmax
−
2
30
A
Philips Semiconductors
Preliminary specification
Controlled avalanche rectifiers
SYMBOL
BYG50 series
MIN.
MAX.
BYG50D to J
−
10
mJ
BYG50K and M
−
7
mJ
Tstg
storage temperature
−65
+175
°C
Tj
junction temperature
−65
+175
°C
MIN.
TYP.
MAX.
IF = 1 A; Tj = Tj max; see Fig.5
−
−
0.85
V
IF = 1 A; see Fig.5
−
−
1.00
V
BYG50D
300
−
−
V
BYG50G
500
−
−
V
ERSM
PARAMETER
CONDITIONS
non-repetitive peak reverse avalanche
energy
L = 120 mH; Tj = Tj max prior to
surge; inductive load switched off
see Fig.4
UNIT
ELECTRICAL CHARACTERISTICS
Tj = 25 °C; unless otherwise specified.
SYMBOL
VF
V(BR)R
PARAMETER
CONDITIONS
forward voltage
reverse avalanche
breakdown voltage
UNIT
IR = 0.1 mA
BYG50J
700
−
−
V
BYG50K
900
−
−
V
BYG50M
1100
−
−
V
−
−
1
VR = VRRMmax; Tj = 165 °C; see Fig.6
−
−
100
when switched from IF = 0.5 A to
IR = 1 A; measured at IR = 0.25 A;
see Fig.8
−
2
IR
reverse current
trr
reverse recovery time
VR = VRRMmax; see Fig.6
µA
µA
−
µs
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-tp
thermal resistance from junction to tie-point
Rth j-a
thermal resistance from junction to ambient
CONDITIONS
VALUE
UNIT
25
K/W
note 1
100
K/W
note 2
150
K/W
Notes
1. Device mounted on Al2O3 printed-circuit board, 0.7 mm thick; thickness of copper ≥35 µm, see Fig.7.
2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.7.
For more information please refer to the “General Part of associated Handbook”.
1996 May 24
3
Philips Semiconductors
Preliminary specification
Controlled avalanche rectifiers
BYG50 series
GRAPHICAL DATA
MBH396
4
MBH397
2.0
handbook, halfpage
handbook, halfpage
IF(AV)
IF(AV)
(A)
(A)
1.6
3
1.2
2
0.8
1
0.4
0
0
0
40
80
120
160
200
Ttp (°C)
0
Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
Fig.3
MGD483
120
160
200
Tamb (°C)
Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
MBH398
10
200
Tj
(°C)
handbook, halfpage
handbook, halfpage
IF
(A)
160
8
120
6
80
4
D
G
J
K
M
2
40
0
0
0
400
800
VR (V)
0
1200
0.8
1.2
1.6
2.0
Solid line: Tj = 25 °C.
Dotted line: Tj = 175 °C.
Dotted line: epoxy PCB.
Maximum permissible junction temperature
as a function of reverse voltage.
1996 May 24
0.4
VF (V)
Device mounted as shown in Fig.7.
Solid line: Al2O3 PCB.
Fig.4
80
VR = VRRMmax; δ = 0.5; a = 1.57.
Device mounted as shown in Fig.7
Solid line: Al2O3 PCB; dotted line: epoxy PCB.
VR = VRRMmax; δ = 0.5; a = 1.57.
Fig.2
40
Fig.5
4
Forward current as a function of forward
voltage; maximum values.
Philips Semiconductors
Preliminary specification
Controlled avalanche rectifiers
BYG50 series
MGC739
3
10halfpage
handbook,
50
IR
(µA)
10
2
4.5
50
10
2.5
1
0
40
80
120
1.25
160
200
Tj (oC)
MSB213
VR = VRMMmax.
Dimensions in mm.
Fig.6
Reverse current as a function of junction
temperature; maximum values.
handbook, full pagewidth
Fig.7
IF
(A)
DUT
+
10 Ω
Printed-circuit board for surface mounting.
0.5
25 V
t rr
1Ω
50 Ω
0
t
0.25
0.5
IR
(A)
1.0
Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns.
Source impedance: 50 Ω; tr ≤ 15 ns.
Fig.8 Test circuit and reverse recovery time waveform and definition.
1996 May 24
5
MAM057
Philips Semiconductors
Preliminary specification
Controlled avalanche rectifiers
BYG50 series
PACKAGE OUTLINE
5.5
5.1
4.5
4.3
handbook, full pagewidth
2.3
2.0
0.05
2.8 1.6
2.4 1.4
,
,
,
,
0.2
3.3
2.7
MSA414
Dimensions in mm.
Fig.9 SOD106.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 May 24
6
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