LINER LTC2232CUK 10-bit,105msps/80msps adc Datasheet

LTC2232/LTC2233
10-Bit,105Msps/
80Msps ADCs
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FEATURES
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DESCRIPTIO
Sample Rate: 105Msps/80Msps
61dB SNR up to 140MHz Input
75dB SFDR up to 200MHz Input
775MHz Full Power Bandwidth S/H
Single 3.3V Supply
Low Power Dissipation: 475mW/366mW
Selectable Input Ranges: ±0.5V or ±1V
No Missing Codes
Optional Clock Duty Cycle Stabilizer
Shutdown and Nap Modes
Data Ready Output Clock
Pin Compatible Family
135Msps: LTC2224 (12-Bit), LTC2234 (10-Bit)
105Msps: LTC2222 (12-Bit), LTC2232 (10-Bit)
80Msps: LTC2223 (12-Bit), LTC2233 (10-Bit)
48-Pin 7mm x 7mm QFN Package
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APPLICATIO S
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Wireless and Wired Broadband Communication
Cable Head-End Systems
Power Amplifier Linearization
Communications Test Equipment
The LTC®2232 and LTC2233 are 105Msps/80Msps, sampling 10-bit A/D converters designed for digitizing high
frequency, wide dynamic range signals. The LTC2232/
LTC2233 are perfect for demanding communications
applications with AC performance that includes 61dB SNR
and 75dB spurious free dynamic range for signals
up to 200MHz. Ultralow jitter of 0.15psRMS allows
undersampling of IF frequencies with excellent noise
performance.
DC specs include ±0.15LSB INL (typ), ±0.1LSB DNL (typ)
and ±0.8LSB INL, ±0.6LSB DNL over temperature. The
transition noise is a low 0.12LSBRMS.
A separate output power supply allows the outputs to drive
0.5V to 3.6V logic.
The ENC+ and ENC – inputs may be driven differentially or
single ended with a sine wave, PECL, LVDS, TTL, or CMOS
inputs. An optional clock duty cycle stabilizer allows high
performance at full speed for a wide range of clock duty
cycles.
, LTC and LT are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
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TYPICAL APPLICATIO
3.3V
VDD
REFH
REFL
SFDR vs Input Frequency
0.5V
TO 3.6V
FLEXIBLE
REFERENCE
90
85
4th OR HIGHER
OVDD
ANALOG
INPUT
INPUT
S/H
–
10-BIT
PIPELINED
ADC CORE
CORRECTION
LOGIC
D9
•
•
•
D0
OUTPUT
DRIVERS
SFDR (dBFS)
+
80
75
70
2nd OR 3rd
65
60
OGND
CLOCK/DUTY
CYCLE
CONTROL
55
50
0
100
200
300
400
500
600
INPUT FREQUENCY (MHz) 22323 TA01b
22323 TA01
ENCODE INPUT
22323fa
1
LTC2232/LTC2233
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W W
W
ABSOLUTE
AXI U RATI GS
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W
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PACKAGE/ORDER I FOR ATIO
OVDD = VDD (Notes 1, 2)
TOP VIEW
48 GND
47 VDD
46 VDD
45 GND
44 VCM
43 SENSE
42 MODE
41 OF
40 D9
39 D8
38 OGND
37 OVDD
Supply Voltage (VDD) ................................................. 4V
Digital Output Ground Voltage (OGND) ....... –0.3V to 1V
Analog Input Voltage (Note 3) ..... –0.3V to (VDD + 0.3V)
Digital Input Voltage .................... –0.3V to (VDD + 0.3V)
Digital Output Voltage ............... –0.3V to (OVDD + 0.3V)
Power Dissipation ............................................ 1500mW
Operating Temperature Range
LTC2232C, LTC2233C ............................. 0°C to 70°C
LTC2232I, LTC2233I ...........................–40°C to 85°C
Storage Temperature Range ..................–65°C to 125°C
AIN+ 1
AIN– 2
REFHA 3
REFHA 4
REFLB 5
REFLB 6
REFHB 7
REFHB 8
REFLA 9
REFLA 10
VDD 11
VDD 12
36 D7
35 D6
34 D5
33 OVDD
32 OGND
31 D4
30 D3
29 D2
28 OVDD
27 OGND
26 D1
25 D0
GND 13
VDD 14
GND 15
ENC + 16
ENC – 17
SHDN 18
OE 19
CLOCKOUT 20
NC 21
OGND 22
OVDD 23
NC 24
49
UK PACKAGE
48-LEAD (7mm × 7mm) PLASTIC QFN
EXPOSED PAD IS GND (PIN 49),
MUST BE SOLDERED TO PCB
TJMAX = 125°C, θJA = 29°C/W
ORDER PART
NUMBER
UK PART
MARKING*
LTC2232CUK
LTC2232IUK
LTC2233CUK
LTC2233IUK
LTC2232UK
LTC2232UK
LTC2233UK
LTC2233UK
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
*The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for parts specified with wider operating temperature ranges.
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CO VERTER CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 4)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
●
10
Integral Linearity Error (Note 5)
Differential Analog Input
●
–0.8
±0.15
0.8
LSB
Differential Linearity Error
Differential Analog Input
●
–0.6
±0.1
0.6
LSB
Resolution (No Missing Codes)
Bits
Integral Linearity Error (Note 5)
Single-Ended Analog Input
±0.5
LSB
Differential Linearity Error
Single-Ended Analog Input
±0.1
LSB
Offset Error (Note 6)
Gain Error
External Reference
Offset Drift
●
–37
±5
37
●
–2.5
±0.5
2.5
mV
%FS
±10
µV/C
Full-Scale Drift
Internal Reference
External Reference
±30
±15
ppm/C
ppm/C
Transition Noise
SENSE = 1V
0.12
LSBRMS
22323fa
2
LTC2232/LTC2233
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U
A ALOG I PUT
The ● denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at TA = 25°C. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
VIN
Analog Input Range (AIN+ – AIN–)
3.1V < VDD < 3.5V
●
VIN, CM
Analog Input Common Mode (AIN+
Differential Input
Single Ended Input (Note 7)
●
●
1
0.5
IIN
Analog Input Leakage Current
0 < AIN+, AIN– < VDD
●
ISENSE
SENSE Input Leakage
0V < SENSE < 1V
●
IMODE
MODE Pin Pull-Down Current to GND
+ AIN–)/2
Full Power Bandwidth
MIN
TYP
MAX
UNITS
±0.5 to ±1
1.6
1.6
V
1.9
2.1
V
V
–1
1
µA
–1
1
µA
Figure 8 Test Circuit
10
µA
775
MHz
tAP
Sample and Hold Acquisition Delay Time
0
tJITTER
Sample and Hold Acquisition Delay Time Jitter
0.15
CMRR
Analog Input Common Mode Rejection Ratio
80
ns
psRMS
dB
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DY A IC ACCURACY
The ● denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
SNR
Signal-to-Noise Ratio
30MHz Input (1V Range)
30MHz Input (2V Range)
SFDR
SFDR
S/(N+D)
Spurious Free Dynamic Range
Spurious Free Dynamic Range
4th Harmonic or Higher
Signal-to-Noise Plus
Distortion Ratio
Intermodulation Distortion
●
60.4
LTC2232
TYP
MAX
59.8
61.3
MIN
60.4
LTC2233
TYP
MAX
UNITS
59.9
61.3
dB
dB
70MHz Input (1V Range)
70MHz Input (2V Range)
59.8
61.2
59.8
61.3
dB
dB
140MHz Input (1V Range)
140MHz Input (2V Range)
59.8
61.2
59.8
61.2
dB
dB
250MHz Input (1V Range)
250MHz Input (2V Range)
59.6
61.1
59.7
61.2
dB
dB
80
78
dB
dB
30MHz Input (1V Range)
30MHz Input (2V Range)
●
69
80
78
69
70MHz Input (1V Range)
70MHz Input (2V Range)
80
78
80
78
dB
dB
140MHz Input (1V Range)
140MHz Input (2V Range)
78
78
78
78
dB
dB
250MHz Input (1V Range)
250MHz Input (2V Range)
71
70
73
72
dB
dB
30MHz Input (1V Range)
30MHz Input (2V Range)
86
86
86
86
dB
dB
70MHz Input (1V Range)
70MHz Input (2V Range)
86
86
86
86
dB
dB
140MHz Input (1V Range)
140MHz Input (2V Range)
86
86
86
86
dB
dB
250MHz Input (1V Range)
250MHz Input (2V Range)
86
86
86
86
dB
dB
59.9
61.3
dB
dB
59.8
61.2
59.8
61.2
dB
dB
81
81
dBc
30MHz Input (1V Range)
30MHz Input (2V Range)
70MHz Input (1V Range)
70MHz Input (2V Range)
IMD
MIN
fIN1 = 138MHz, fIN2 = 140MHz
●
60.2
59.8
61.3
60.2
22323fa
3
LTC2232/LTC2233
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I TER AL REFERE CE CHARACTERISTICS
(Note 4)
PARAMETER
CONDITIONS
MIN
TYP
MAX
VCM Output Voltage
IOUT = 0
1.570
1.600
1.630
±25
VCM Output Tempco
UNITS
V
ppm/°C
VCM Line Regulation
3.1V < VDD < 3.5V
3
mV/V
VCM Output Resistance
–1mA < IOUT < 1mA
4
Ω
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DIGITAL I PUTS A D DIGITAL OUTPUTS
The ● denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
2.5
V
V
ENCODE INPUTS (ENC +, ENC –)
VID
Differential Input Voltage
VICM
Common Mode Input Voltage
RIN
Input Resistance
CIN
Input Capacitance
●
Internally Set
Externally Set (Note 7)
●
0.2
1.1
(Note 7)
V
1.6
1.6
6
kΩ
3
pF
LOGIC INPUTS (OE, SHDN)
VIH
High Level Input Voltage
VDD = 3.3V
●
VIL
Low Level Input Voltage
VDD = 3.3V
●
IIN
Input Current
VIN = 0V to VDD
●
CIN
Input Capacitance
(Note 7)
2
V
–10
0.8
V
10
µA
3
pF
LOGIC OUTPUTS
OVDD = 3.3V
COZ
Hi-Z Output Capacitance
OE = High (Note 7)
3
pF
ISOURCE
Output Source Current
VOUT = 0V
50
mA
ISINK
Output Sink Current
VOUT = 3.3V
50
mA
VOH
High Level Output Voltage
IO = –10µA
IO = –200µA
●
IO = 10µA
IO = 1.6mA
●
VOL
Low Level Output Voltage
3.1
3.295
3.29
0.005
0.09
V
V
0.4
V
V
OVDD = 2.5V
VOH
High Level Output Voltage
IO = –200µA
2.49
V
VOL
Low Level Output Voltage
IO = 1.6mA
0.09
V
VOH
High Level Output Voltage
IO = –200µA
1.79
V
VOL
Low Level Output Voltage
IO = 1.6mA
0.09
V
OVDD = 1.8V
22323fa
4
LTC2232/LTC2233
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POWER REQUIRE E TS
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 9)
CONDITIONS
MIN
LTC2232
TYP
MAX
PARAMETER
VDD
Analog Supply Voltage
●
3.1
OVDD
Output Supply Voltage
●
0.5
IVDD
Analog Supply Current
●
PDISS
Power Dissipation
●
475
PSHDN
Shutdown Power
SHDN = H, OE = H, No CLK
2
2
mW
PNAP
Nap Mode Power
SHDN = H, OE = L, No CLK
35
35
mW
3.3
MIN
LTC2233
TYP
MAX
SYMBOL
3.3
UNITS
3.5
3.1
3.5
V
3.3
3.6
0.5
3.3
3.6
V
144
162
111
123
mA
535
366
406
mW
WU
TI I G CHARACTERISTICS
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL
PARAMETER
fS
Sampling Frequency
tL
ENC Low Time (Note 8)
tH
ENC High Time (Note 8)
tAP
Sample-and-Hold Aperture Delay
tD
tC
tOE
CONDITIONS
MIN
●
1
Duty Cycle Stabilizer Off
Duty Cycle Stabilizer On
●
●
4.5
3
Duty Cycle Stabilizer Off
Duty Cycle Stabilizer On
●
●
ENC to DATA Delay
(Note 7)
ENC to CLOCKOUT Delay
LTC2232
TYP
MAX
MIN
105
1
4.76
4.76
500
500
5.9
3
4.5
3
4.76
4.76
500
500
●
1.3
2.1
(Note 7)
●
1.3
DATA to CLOCKOUT Skew
(tC - tD) (Note 7)
●
– 0.6
Output Enable Delay
(Note 7)
●
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to ground with GND and OGND
wired together (unless otherwise noted).
Note 3: When these pin voltages are taken below GND or above VDD, they will
be clamped by internal diodes. This product can handle input currents of
greater than 100mA below GND or above VDD without latchup.
Note 4: VDD = 3.3V, fSAMPLE = 105MHz (LTC2232) or 80MHz (LTC2233),
differential ENC+/ENC– = 2VP-P sine wave, input range = 2VP-P with differential
drive, unless otherwise noted.
UNITS
80
MHz
6.25
6.25
500
500
ns
ns
5.9
3
6.25
6.25
500
500
ns
ns
4
1.3
2.1
4
ns
2.1
4
1.3
2.1
4
ns
0
0.6
–0.6
0
0.6
ns
5
10
5
10
ns
0
Pipeline Latency
LTC2233
TYP
MAX
5
0
5
ns
Cycles
Note 5: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve. The
deviation is measured from the center of the quantization band.
Note 6: Offset error is the offset voltage measured from –0.5 LSB when the
output code flickers between 00 0000 0000 and 11 1111 1111 in 2’s
complement output mode.
Note 7: Guaranteed by design, not subject to test.
Note 8: Recommended operating conditions.
Note 9: VDD = 3.3V, fSAMPLE = 105MHz (LTC2232) or 80MHz (LTC2233),
differential ENC+/ENC– = 2VP-P sine wave, input range = 1VP-P with differential
drive.
22323fa
5
LTC2232/LTC2233
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TYPICAL PERFOR A CE CHARACTERISTICS
LTC2232: SNR vs Input Frequency,
–1dB, 2V Range
LTC2232: DNL, 2V Range
1.0
65
0.8
0.8
64
0.6
0.6
63
0.4
0.4
62
0.2
0
– 0.2
SNR (dBFS)
1.0
ERROR (LSB)
ERROR (LSB)
LTC2232: INL, 2V Range
0.2
0
– 0.2
61
60
59
– 0.4
– 0.4
58
– 0.6
– 0.6
57
– 0.8
– 0.8
56
– 1.0
– 1.0
256
0
768
512
OUTPUT CODE
1024
256
0
2232 G01
LTC2232: SNR vs Input Frequency,
–1dB, 1V Range
768
512
OUTPUT CODE
55
1024
LTC2232: SFDR (HD2 and HD3) vs
Input Frequency, –1dB, 2V Range
100
200
300
400
500
600
2232 G03
INPUT FREQUENCY (MHz)
LTC2232: SFDR (HD2 and HD3) vs
Input Frequency, –1dB, 1V Range
65
90
90
64
85
85
80
80
75
75
63
0
2232 G02
61
60
59
58
SFDR (dBFS)
SFDR (dBFS)
SNR (dBFS)
62
70
65
70
65
60
60
55
55
57
56
55
0
100
50
300
400
500
600
200
2232 G04
INPUT FREQUENCY (MHz)
100
50
200
300
400
500
600
2232 G05
INPUT FREQUENCY (MHz)
90
85
85
85
80
80
80
75
75
65
70
65
60
60
55
55
50
0
100
200
300
400
500
600
2232 G07
INPUT FREQUENCY (MHz)
SFDR AND SNR (dBFS)
90
70
50
0
100
200
300
400
500
600
2232 G06
INPUT FREQUENCY (MHz)
LTC2232: SFDR and SNR vs
Sample Rate, 2V Range,
fIN = 30MHz, –1dB
LTC2232: SFDR (HD4+) vs Input
Frequency, –1dB, 1V Range
SFDR (dBFS)
SFDR (dBFS)
LTC2232: SFDR (HD4+) vs Input
Frequency, –1dB, 2V Range
0
SFDR
75
70
65
SNR
60
55
50
0
100
200
300
400
500
600
2232 G08
INPUT FREQUENCY (MHz)
0
20
40
60
80
100
SAMPLE RATE (Msps)
120
2232 G09
22323fa
6
LTC2232/LTC2233
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TYPICAL PERFOR A CE CHARACTERISTICS
LTC2232: SFDR and SNR vs
Sample Rate, 1V Range,
fIN = 30MHz, –1dB
S
LTC2232: IOVDD vs Sample Rate,
5MHz Sine Wave Input,
–1dB, OVDD = 1.8V
LTC2232: IVDD vs Sample Rate,
5MHz Sine Wave Input, –1dB
160
85
10
SFDR
150
70
130
1V RANGE
SNR
4
20
0
40
60
2
110
80
100
SAMPLE RATE (Msps)
100
120
0
20
2232 G10
LTC2232: SFDR vs Input Level,
f IN = 70MHz, 2V Range
60
80
40
SAMPLE RATE (Msps)
100
0
120
0
– 10
– 10
– 20
– 20
– 30
– 30
– 40
– 40
AMPLITUDE (dB)
dBc
50
40
30
– 50
– 60
– 70
– 80
– 40
–30
– 20
– 10
INPUT LEVEL (dBFS)
– 80
– 90
– 110
– 110
0
5
2232 G13
LTC2232: 8192 Point FFT,
f IN = 30MHz, –1dB, 2V Range
10 15 20 25 30 35 40 45 50
2232 G14
FREQUENCY (MHz)
– 120
– 20
– 20
– 20
– 30
– 30
– 30
– 40
– 40
– 40
– 70
– 80
AMPLITUDE (dB)
0
– 10
AMPLITUDE (dB)
0
– 10
– 50
– 60
– 70
– 80
– 60
– 70
– 80
– 90
– 90
– 100
– 100
– 100
– 110
– 110
– 110
– 120
– 120
5
10 15 20 25 30 35 40 45 50
2232 G16
FREQUENCY (MHz)
0
5
10 15 20 25 30 35 40 45 50
2232 G17
FREQUENCY (MHz)
10 15 20 25 30 35 40 45 50
2232 G15
FREQUENCY (MHz)
– 50
– 90
0
5
LTC2232: 8192 Point FFT,
f IN = 70MHz, –1dB, 2V Range
0
– 60
0
LTC2232: 8192 Point FFT,
f IN = 30MHz, –1dB, 1V Range
– 10
– 50
120
2232 G12
– 70
– 100
0
100
– 60
– 100
– 120
0
– 50
40
60
80
SAMPLE RATE (Msps)
– 50
– 90
20
10
AMPLITUDE (dB)
0
80
60
20
LTC2232: 8192 Point FFT,
f IN = 5MHz, –1dB,1V Range
90
dBFS
0
2232 G11
LTC2232: 8192 Point FFT,
f IN = 5MHz, –1dB, 2V Range
70
SFDR (dBc AND dBFS)
6
120
65
55
IOVDD (mA)
140
75
60
AMPLITUDE (dB)
8
2V RANGE
IVDD (mA)
SFDR AND SNR (dBFS)
80
– 120
0
5
10 15 20 25 30 35 40 45 50
2232 G18
FREQUENCY (MHz)
22323fa
7
LTC2232/LTC2233
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2232: 8192 Point FFT,
f IN = 140MHz, –1dB, 2V Range
LTC2232: 8192 Point FFT,
f IN = 140MHz, –1dB, 1V Range
0
0
–10
–10
–20
–20
–20
–30
–30
–30
–40
–40
–40
–50
–60
–70
–80
AMPLITUDE (dB)
0
–10
AMPLITUDE (dB)
AMPLITUDE (dB)
LTC2232: 8192 Point FFT,
f IN = 70MHz, –1dB, 1V Range
–50
–60
–70
–80
–50
–60
–70
–80
–90
–90
–90
–100
–100
–100
–110
–110
–110
–120
–120
0
5
10 15 20 25 30 35 40 45 50
2232 G19
FREQUENCY (MHz)
5
–120
10 15 20 25 30 35 40 45 50
2232 G20
FREQUENCY (MHz)
LTC2232: 8192 Point FFT,
f IN = 250MHz, –1dB, 1V Range
LTC2232: 8192 Point FFT,
f IN = 250MHz, –1dB, 2V Range
0
0
–10
–10
–20
–20
–20
–30
–30
–30
–40
–40
–40
–60
–70
–80
AMPLITUDE (dB)
0
–50
–50
–60
–70
–80
–70
–80
–90
–100
–100
–100
–110
–110
–110
–120
–120
0
–10
–20
–20
–30
–30
–40
–40
AMPLITUDE (dB)
AMPLITUDE (dB)
0
–10
–60
–70
–80
10 15 20 25 30 35 40 45 50
2232 G24
FREQUENCY (MHz)
LTC2232: Shorted Input Noise
Histogram
131071
100000
80000
60000
–80
–100
–110
–110
10 15 20 25 30 35 40 45 50
2232 G25
FREQUENCY (MHz)
5
120000
–70
–100
5
0
140000
–60
–90
0
–120
10 15 20 25 30 35 40 45 50
2232 G23
FREQUENCY (MHz)
–50
–90
–120
5
LTC2232: 8192 Point 2-Tone FFT,
f IN = 138MHz and 140MHz, –7dB
Each, 1V Range
LTC2232: 8192 Point 2-Tone FFT,
f IN = 68MHz and 70MHz, –7dB
Each, 2V Range
–50
0
COUNT
10 15 20 25 30 35 40 45 50
2232 G22
FREQUENCY (MHz)
10 15 20 25 30 35 40 45 50
2232 G21
FREQUENCY (MHz)
–60
–90
5
5
–50
–90
0
0
LTC2232: 8192 Point FFT,
f IN = 500MHz, –6dB, 1V Range
–10
AMPLITUDE (dB)
AMPLITUDE (dB)
0
–120
40000
20000
0
0
5
10 15 20 25 30 35 40 45 50
2232 G26
FREQUENCY (MHz)
1
0
510
511
CODE
512
2232 G27
22323fa
8
LTC2232/LTC2233
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2233: SNR vs Input Frequency,
–1dB, 2V Range
LTC2233: DNL, 2V Range
1.0
65
0.8
0.8
64
0.6
0.6
63
0.4
0.4
62
0.2
0
–0.2
SNR (dBFS)
1.0
ERROR (LSB)
ERROR (LSB)
LTC2233: INL, 2V Range
0.2
0
–0.2
61
60
59
–0.4
–0.4
58
–0.6
–0.6
57
–0.8
–0.8
56
–1.0
–1.0
256
0
768
512
OUTPUT CODE
1024
256
0
2232 G01
768
512
OUTPUT CODE
55
1024
65
90
90
64
85
85
80
80
75
75
63
100
300
400
500
600
200
2232 G03
INPUT FREQUENCY (MHz)
LTC2233: SFDR (HD2 and HD3) vs
Input Frequency, –1dB, 1V Range
LTC2233: SFDR (HD2 and HD3) vs
Input Frequency, –1dB, 2V Range
LTC2233: SNR vs Input Frequency,
–1dB, 1V Range
0
2232 G02
61
60
59
58
SFDR (dBFS)
SFDR (dBFS)
SNR (dBFS)
62
70
65
70
65
60
60
55
55
57
56
55
0
100
50
300
400
500
600
200
2232 G04
INPUT FREQUENCY (MHz)
100
50
200
300
400
500
600
2232 G05
INPUT FREQUENCY (MHz)
90
85
85
85
80
80
80
75
75
65
70
65
60
60
55
55
50
0
100
200
300
400
500
600
2232 G07
INPUT FREQUENCY (MHz)
SFDR AND SNR (dBFS)
90
70
50
0
100
200
300
400
500
600
2232 G06
INPUT FREQUENCY (MHz)
LTC2233: SFDR and SNR vs
Sample Rate, 2V Range,
fIN = 30MHz, –1dB
LTC2233: SFDR (HD4+) vs Input
Frequency, –1dB, 1V Range
SFDR (dBFS)
SFDR (dBFS)
LTC2233: SFDR (HD4+) vs Input
Frequency, –1dB, 2V Range
0
SFDR
75
70
65
SNR
60
55
50
0
100
200
300
400
500
600
2232 G08
INPUT FREQUENCY (MHz)
0
20
40
60
80
100
SAMPLE RATE (Msps)
120
2232 G09
22323fa
9
LTC2232/LTC2233
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2233: SFDR and SNR vs
Sample Rate, 1V Range,
fIN = 30MHz, –1dB
LTC2233: IOVDD vs Sample Rate,
5MHz Sine Wave Input,
–1dB, OVDD = 1.8V
LTC2233: IVDD vs Sample Rate,
5MHz Sine Wave Input, –1dB
85
8
130
SFDR
80
6
70
65
IOVDD (mA)
2V RANGE
IVDD (mA)
SFDR AND SNR (dBFS)
120
75
110
1V RANGE
100
4
SNR
60
2
90
55
50
80
0
40
60
80
SAMPLE RATE (Msps)
20
20
0
100
60
80
40
SAMPLE RATE (Msps)
2233 G10
0
–10
–10
–20
–20
–30
–30
–40
–40
dBFS
AMPLITUDE (dB)
40
30
–60
–70
–80
–40
–30
–20
–10
INPUT LEVEL (dBFS)
–60
–70
–80
–90
–100
–100
–110
–110
–120
0
–50
–50
–90
20
10
–50
0
0
5
10
2233 G13
LTC2233: 8192 Point FFT,
f IN = 30MHz, –1dB, 2V Range
15 20 25 30
FREQUENCY (MHz)
35
40
–120
LTC2233: 8192 Point FFT,
f IN = 30MHz, –1dB, 1V Range
0
0
–10
–10
–20
–20
–20
–30
–30
–30
–40
–40
–40
AMPLITUDE (dB)
0
–60
–70
–80
–50
–60
–70
–80
–90
–100
–110
–110
–110
–120
–120
35
40
2233 G16
0
5
10
15 20 25 30
FREQUENCY (MHz)
40
2233 G15
–80
–100
15 20 25 30
FREQUENCY (MHz)
35
–70
–100
10
15 20 25 30
FREQUENCY (MHz)
–60
–90
5
10
–50
–90
0
5
LTC2233: 8192 Point FFT,
f IN = 70MHz, –1dB, 2V Range
–10
–50
0
2233 G14
AMPLITUDE (dB)
SFDR (dBc AND dBFS)
70
AMPLITUDE (dB)
0
80
50
100
LTC2233: 8192 Point FFT,
f IN = 5MHz, –1dB, 1V Range
90
dBc
60
80
40
SAMPLE RATE (Msps)
2233 G12
LTC2233: 8192 Point FFT,
f IN = 5MHz, –1dB, 2V Range
60
20
0
2233 G11
LTC2233: SFDR vs Input Level,
f IN = 70MHz, 2V Range
AMPLITUDE (dB)
0
100
35
40
2233 G17
–120
0
5
10
15 20 25 30
FREQUENCY (MHz)
35
40
2233 G18
22323fa
10
LTC2232/LTC2233
U W
TYPICAL PERFOR A CE CHARACTERISTICS
LTC2233: 8192 Point FFT,
f IN = 140MHz, –1dB, 2V Range
LTC2233: 8192 Point FFT,
f IN = 140MHz, –1dB, 1V Range
0
0
–10
–10
–20
–20
–20
–30
–30
–30
–40
–40
–40
–50
–60
–70
–80
AMPLITUDE (dB)
0
–10
AMPLITUDE (dB)
AMPLITUDE (dB)
LTC2233: 8192 Point FFT,
f IN = 70MHz, –1dB, 1V Range
–50
–60
–70
–80
–50
–60
–70
–80
–90
–90
–90
–100
–100
–100
–110
–110
–110
–120
–120
0
5
10
15 20 25 30
FREQUENCY (MHz)
35
40
5
10
2233 G19
LTC2233: 8192 Point FFT,
f IN = 250MHz, –1dB, 2V Range
15 20 25 30
FREQUENCY (MHz)
35
–120
40
0
0
–10
–10
–20
–20
–20
–30
–30
–30
–40
–40
–40
–70
–80
AMPLITUDE (dB)
0
–60
–50
–60
–70
–80
–80
–90
–100
–100
–110
–110
–110
–120
–120
35
40
0
–10
–20
–20
–30
–30
–40
–40
AMPLITUDE (dB)
AMPLITUDE (dB)
0
–50
–60
–70
–80
–100
–110
–120
–120
40
0
10
5
2233 G23
15 20 25 30
FREQUENCY (MHz)
35
40
2233 G24
LTC2233: Shorted Input Noise
Histogram
140000
131071
120000
100000
–80
–110
2233 G25
–120
40
–70
–100
35
35
–60
–90
15 20 25 30
FREQUENCY (MHz)
15 20 25 30
FREQUENCY (MHz)
–50
–90
10
10
LTC2233: 8192 Point 2-Tone FFT,
f IN = 138MHz and 140MHz, –7dB
Each, 1V Range
–10
5
5
2233 G22
LTC2233: 8192 Point 2-Tone FFT,
f IN = 68MHz and 70MHz, –7dB
Each, 2V Range
0
0
COUNT
15 20 25 30
FREQUENCY (MHz)
40
2233 G21
–70
–100
10
35
–60
–90
5
15 20 25 30
FREQUENCY (MHz)
–50
–90
0
10
5
LTC2233: 8192 Point FFT,
f IN = 500MHz, –6dB, 1V Range
–10
–50
0
2233 G20
LTC2233: 8192 Point FFT,
f IN = 250MHz, –1dB, 1V Range
AMPLITUDE (dB)
AMPLITUDE (dB)
0
80000
60000
40000
20000
0
1
0
0
5
10
15 20 25 30
FREQUENCY (MHz)
35
40
2233 G26
510
511
CODE
512
2233 G27
22323fa
11
LTC2232/LTC2233
U
U
U
PI FU CTIO S
AIN+ (Pin 1): Positive Differential Analog Input.
AIN– (Pin 2): Negative Differential Analog Input.
REFHA (Pins 3, 4): ADC High Reference. Bypass to Pins
5, 6 with 0.1µF ceramic chip capacitor, to Pins 9, 10 with
a 2.2µF ceramic capacitor and to ground with a 1µF
ceramic capacitor.
REFLB (Pins 5, 6): ADC Low Reference. Bypass to Pins 5,
6 with 0.1µF ceramic chip capacitor. Do not connect to
Pins 9, 10.
REFHB (Pins 7, 8): ADC High Reference. Bypass to Pins
9, 10 with 0.1µF ceramic chip capacitor. Do not connect to
Pins 3, 4.
REFLA (Pins 9, 10): ADC Low Reference. Bypass to Pins
7, 8 with 0.1µF ceramic chip capacitor, to Pins 3, 4 with a
2.2µF ceramic capacitor and to ground with a 1µF ceramic
capacitor.
VDD (Pins 11, 12, 14, 46, 47): 3.3V Supply. Bypass to
GND with 0.1µF ceramic chip capacitors. Adjacent pins
can share a bypass capacitor.
GND (Pins 13, 15, 45, 48): ADC Power Ground.
ENC+ (Pin 16): Encode Input. The input is sampled on the
positive edge.
ENC– (Pin 17): Encode Complement Input. The input is
sampled on the negative edge. Bypass to ground with
0.1µF ceramic for single-ended ENCODE signal.
SHDN (Pin 18): Shutdown Mode Selection Pin. Connecting SHDN to GND and OE to GND results in normal
operation with the outputs enabled. Connecting SHDN to
GND and OE to VDD results in normal operation with the
outputs at high impedance. Connecting SHDN to VDD and
OE to GND results in nap mode with the outputs at high
impedance. Connecting SHDN to VDD and OE to VDD
results in sleep mode with the outputs at high impedance.
OE (Pin 19): Output Enable Pin. Refer to SHDN pin
function.
CLOCKOUT (Pin 20): Data Valid Output. Latch data on the
falling edge of CLKOUT.
NC (Pins 21, 24): Do not connect these pins.
D0 – D9 (Pins 25, 26, 29, 30, 31, 34, 35, 36, 39, 40):
Digital Outputs. D9 is the MSB.
OGND (Pins 22, 27, 32, 38): Output Driver Ground.
OVDD (Pins 23, 28, 33, 37): Positive Supply for the
Output Drivers. Bypass to ground with 0.1µF ceramic chip
capacitors.
OF (Pin 41): Over/Under Flow Output. High when an over
or under flow has occurred.
MODE (Pin 42): Output Format and Clock Duty Cycle
Stabilizer Selection Pin. Connecting MODE to 0V selects
offset binary output format and turns the clock duty cycle
stabilizer off. Connecting MODE to 1/3 VDD selects offset
binary output format and turns the clock duty cycle stabilizer on. Connecting MODE to 2/3 VDD selects 2’s complement output format and turns the clock duty cycle stabilizer on. Connecting MODE to VDD selects 2’s complement
output format and turns the clock duty cycle stabilizer off.
SENSE (Pin 43): Reference Programming Pin. Connecting
SENSE to VCM selects the internal reference and a ±0.5V
input range. VDD selects the internal reference and a ±1V
input range. An external reference greater than 0.5V and
less than 1V applied to SENSE selects an input range of
±VSENSE. ±1V is the largest valid input range.
VCM (Pin 44): 1.6V Output and Input Common Mode Bias.
Bypass to ground with 2.2µF ceramic chip capacitor.
Exposed Pad (Pin 49): ADC Power Ground. The exposed
pad on the bottom of the package needs to be soldered to
ground.
22323fa
12
LTC2232/LTC2233
W
FUNCTIONAL BLOCK DIAGRA
U
U
AIN+
AIN–
VCM
INPUT
S/H
FIRST PIPELINED
ADC STAGE
THIRD PIPELINED
ADC STAGE
SECOND PIPELINED
ADC STAGE
FOURTH PIPELINED
ADC STAGE
1.6V
REFERENCE
2.2µF
SHIFT REGISTER
AND CORRECTION
RANGE
SELECT
REFH
SENSE
FIFTH PIPELINED
ADC STAGE
REFL
INTERNAL CLOCK SIGNALS
OVDD
REF
BUF
OF
DIFFERENTIAL
INPUT
LOW JITTER
CLOCK
DRIVER
DIFF
REF
AMP
CONTROL
LOGIC
•
•
•
OUTPUT
DRIVERS
D9
D0
CLKOUT
REFLB REFHA
2.2µF
0.1µF
22323 F01
REFLA REFHB
OGND
+
ENC
–
ENC
M0DE SHDN
OE
0.1µF
1µF
1µF
Figure 1. Functional Block Diagram
W
UW
TI I G DIAGRA S
Timing Diagram
tAP
ANALOG
INPUT
N+4
N+2
N
N+3
N+1
tH
tL
ENC –
ENC +
tD
N–5
D0-D9, OF
N–4
N–3
N–2
N–1
tC
CLOCKOUT
22323 TD02
22323fa
13
LTC2232/LTC2233
U
U
W
U
APPLICATIO S I FOR ATIO
DYNAMIC PERFORMANCE
The signal-to-noise plus distortion ratio [S/(N + D)] is the
ratio between the RMS amplitude of the fundamental input
frequency and the RMS amplitude of all other frequency
components at the ADC output. The output is band limited
to frequencies above DC to below half the sampling
frequency.
If two pure sine waves of frequencies fa and fb are applied
to the ADC input, nonlinearities in the ADC transfer function can create distortion products at the sum and difference frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3,
etc. The 3rd order intermodulation products are 2fa + fb,
2fb + fa, 2fa – fb and 2fb – fa. The intermodulation
distortion is defined as the ratio of the RMS value of either
input tone to the RMS value of the largest 3rd order
intermodulation product.
Signal-to-Noise Ratio
Spurious Free Dynamic Range (SFDR)
The signal-to-noise ratio (SNR) is the ratio between the
RMS amplitude of the fundamental input frequency and
the RMS amplitude of all other frequency components
except the first five harmonics and DC.
Spurious free dynamic range is the peak harmonic or
spurious noise that is the largest spectral component
excluding the input signal and DC. This value is expressed
in decibels relative to the RMS value of a full scale input
signal.
Signal-to-Noise Plus Distortion Ratio
Total Harmonic Distortion
Total harmonic distortion is the ratio of the RMS sum of all
harmonics of the input signal to the fundamental itself. The
out-of-band harmonics alias into the frequency band
between DC and half the sampling frequency. THD is
expressed as:
2
2
2
2
THD = 20Log (√(V2 + V3 + V4 + . . . Vn )/V1)
where V1 is the RMS amplitude of the fundamental frequency and V2 through Vn are the amplitudes of the
second through nth harmonics. The THD calculated in this
data sheet uses all the harmonics up to the fifth.
Intermodulation Distortion
If the ADC input signal consists of more than one spectral
component, the ADC transfer function nonlinearity can
produce intermodulation distortion (IMD) in addition to
THD. IMD is the change in one sinusoidal input caused by
the presence of another sinusoidal input at a different
frequency.
Input Bandwidth
The input bandwidth is that input frequency at which the
amplitude of the reconstructed fundamental is reduced by
3dB for a full scale input signal.
Aperture Delay Time
The time from when a rising ENC+ equals the ENC– voltage
to the instant that the input signal is held by the sample and
hold circuit.
Aperture Delay Jitter
The variation in the aperture delay time from conversion to
conversion. This random variation will result in noise
when sampling an AC input. The signal to noise ratio due
to the jitter alone will be:
SNRJITTER = –20log (2π • fIN • tJITTER)
22323fa
14
LTC2232/LTC2233
U
W
U
U
APPLICATIO S I FOR ATIO
CONVERTER OPERATION
As shown in Figure 1, the LTC2232/LTC2233 is a CMOS
pipelined multistep converter. The converter has five
pipelined ADC stages; a sampled analog input will result in
a digitized value five cycles later (see the Timing Diagram
section). For optimal AC performance the analog inputs
should be driven differentially. For cost sensitive applications, the analog inputs can be driven single-ended with
slightly worse harmonic distortion. The encode input is
differential for improved common mode noise immunity.
The LTC2232/LTC2233 has two phases of operation,
determined by the state of the differential ENC+/ENC– input
pins. For brevity, the text will refer to ENC+ greater than
ENC– as ENC high and ENC+ less than ENC– as ENC low.
Each pipelined stage shown in Figure 1 contains an ADC,
a reconstruction DAC and an interstage residue amplifier.
In operation, the ADC quantizes the input to the stage and
the quantized value is subtracted from the input by the
DAC to produce a residue. The residue is amplified and
output by the residue amplifier. Successive stages operate
out of phase so that when the odd stages are outputting
their residue, the even stages are acquiring that residue
and vice versa.
When ENC is low, the analog input is sampled differentially
directly onto the input sample-and-hold capacitors, inside
the “Input S/H” shown in the block diagram. At the instant
that ENC transitions from low to high, the sampled input
is held. While ENC is high, the held input voltage is
buffered by the S/H amplifier which drives the first pipelined
ADC stage. The first stage acquires the output of the S/H
during this high phase of ENC. When ENC goes back low,
the first stage produces its residue which is acquired by
the second stage. At the same time, the input S/H goes
back to acquiring the analog input. When ENC goes back
high, the second stage produces its residue which is
acquired by the third stage. An identical process is repeated for the third and fourth stages, resulting in a fourth
stage residue that is sent to the fifth stage ADC for final
evaluation.
Each ADC stage following the first has additional range to
accommodate flash and amplifier offset errors. Results
from all of the ADC stages are digitally synchronized such
that the results can be properly combined in the correction
logic before being sent to the output buffer.
SAMPLE/HOLD OPERATION AND INPUT DRIVE
Sample/Hold Operation
Figure 2 shows an equivalent circuit for the LTC2232/
LTC2233 CMOS differential sample-and-hold. The analog
inputs are connected to the sampling capacitors (CSAMPLE)
through NMOS transistors. The capacitors shown attached to each input (CPARASITIC) are the summation of all
other capacitance associated with each input.
LTC2232/LTC2233
VDD
AIN+
CSAMPLE
1.6pF
15
CPARASITIC
1pF
VDD
AIN–
CSAMPLE
1.6pF
15
CPARASITIC
1pF
VDD
1.6V
6k
ENC+
ENC–
6k
1.6V
22323 F02
Figure 2. Equivalent Input Circuit
22323fa
15
LTC2232/LTC2233
U
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U
APPLICATIO S I FOR ATIO
During the sample phase when ENC is low, the transistors
connect the analog inputs to the sampling capacitors and
they charge to, and track the differential input voltage.
When ENC transitions from low to high, the sampled input
voltage is held on the sampling capacitors. During the hold
phase when ENC is high, the sampling capacitors are
disconnected from the input and the held voltage is passed
to the ADC core for processing. As ENC transitions from
high to low, the inputs are reconnected to the sampling
capacitors to acquire a new sample. Since the sampling
capacitors still hold the previous sample, a charging glitch
proportional to the change in voltage between samples will
be seen at this time. If the change between the last sample
and the new sample is small, the charging glitch seen at
the input will be small. If the input change is large, such as
the change seen with input frequencies near Nyquist, then
a larger charging glitch will be seen.
Single-Ended Input
For cost sensitive applications, the analog inputs can be
driven single-ended. With a single-ended input the harmonic distortion and INL will degrade, but the SNR and
DNL will remain unchanged. For a single-ended input, AIN+
should be driven with the input signal and AIN– should be
connected to 1.6V or VCM.
Common Mode Bias
For optimal performance the analog inputs should be
driven differentially. Each input should swing ±0.5V for
the 2V range or ±0.25V for the 1V range, around a
common mode voltage of 1.6V. The VCM output pin (Pin
44) may be used to provide the common mode bias level.
VCM can be tied directly to the center tap of a transformer
to set the DC input level or as a reference level to an op amp
differential driver circuit. The VCM pin must be bypassed to
ground close to the ADC with a 2.2µF or greater capacitor.
the sample-and-hold circuit will connect the 1.6pF sampling capacitor to the input pin and start the sampling
period. The sampling period ends when ENC rises, holding
the sampled input on the sampling capacitor. Ideally the
input circuitry should be fast enough to fully charge
the sampling capacitor during the sampling period
1/(2FENCODE); however, this is not always possible and the
incomplete settling may degrade the SFDR. The sampling
glitch has been designed to be as linear as possible to
minimize the effects of incomplete settling.
For the best performance, it is recommended to have a
source impedance of 100Ω or less for each input. The
source impedance should be matched for the differential
inputs. Poor matching will result in higher even order
harmonics, especially the second.
Input Drive Circuits
Figure 3 shows the LTC2232/LTC2233 being driven by an
RF transformer with a center tapped secondary. The
secondary center tap is DC biased with VCM, setting the
ADC input signal at its optimum DC level. Terminating on
the transformer secondary is desirable, as this provides a
common mode path for charging glitches caused by the
sample and hold. Figure 3 shows a 1:1 turns ratio transformer. Other turns ratios can be used if the source
impedance seen by the ADC does not exceed 100Ω for
each ADC input. A disadvantage of using a transformer is
the loss of low frequency response. Most small RF transformers have poor performance at frequencies below
1MHz.
VCM
2.2µF
0.1µF
ANALOG
INPUT
T1
1:1
25Ω
25Ω
AIN+
0.1µF
LTC2232/
LTC2233
12pF
Input Drive Impedance
As with all high performance, high speed ADCs, the
dynamic performance of the LTC2232/LTC2233 can be
influenced by the input drive circuitry, particularly the
second and third harmonics. Source impedance and input
reactance can influence SFDR. At the falling edge of ENC,
25Ω
25Ω
T1 = MA/COM ETC1-1T
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
AIN–
22323 F03
Figure 3. Single-Ended to Differential Conversion
Using a Transformer
22323fa
16
LTC2232/LTC2233
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W
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APPLICATIO S I FOR ATIO
Figure 4 demonstrates the use of a differential amplifier to
convert a single ended input signal into a differential input
signal. The advantage of this method is that it provides low
frequency input response; however, the limited gain bandwidth of most op amps will limit the SFDR at high input
frequencies.
Figure 5 shows a single-ended input circuit. The impedance seen by the analog inputs should be matched. This
circuit is not recommended if low distortion is required.
The 25Ω resistors and 12pF capacitor on the analog inputs
serve two purposes: isolating the drive circuitry from the
sample-and-hold charging glitches and limiting the
wideband noise at the converter input. For input frequencies higher than 100MHz, the capacitor may need to be
decreased to prevent excessive signal loss.
For input frequencies above 100MHz the input circuits of
Figure 6, 7 and 8 are recommended. The balun transformer gives better high frequency response than a flux
coupled center tapped transformer. The coupling capacitors allow the analog inputs to be DC biased at 1.6V. In
Figure 8 the series inductors are impedance matching
elements that maximize the ADC bandwidth.
Reference Operation
Figure 9 shows the LTC2232/LTC2233 reference circuitry
consisting of a 1.6V bandgap reference, a difference
amplifier and switching and control circuit. The internal
voltage reference can be configured for two pin selectable
input ranges of 2V (±1V differential) or 1V (±0.5V differential). Tying the SENSE pin to VDD selects the 2V range;
typing the SENSE pin to VCM selects the 1V range.
The 1.6V bandgap reference serves two functions: its
output provides a DC bias point for setting the common
mode voltage of any external input circuitry; additionally,
the reference is used with a difference amplifier to generate the differential reference levels needed by the internal
ADC circuitry. An external bypass capacitor is required for
the 1.6V reference output, VCM. This provides a high
frequency low impedance path to ground for internal and
external circuitry.
The difference amplifier generates the high and low reference for the ADC. High speed switching circuits are
connected to these outputs and they must be externally
bypassed. Each output has four pins: two each of REFHA
and REFHB for the high reference and two each of REFLA
and REFLB for the low reference. The multiple output pins
are needed to reduce package inductance. Bypass capacitors must be connected as shown in Figure 9.
Other voltage ranges in between the pin selectable ranges
can be programmed with two external resistors as shown
in Figure 10. An external reference can be used by applying
its output directly or through a resistor divider to SENSE.
It is not recommended to drive the SENSE pin with a logic
device. The SENSE pin should be tied to the appropriate
level as close to the converter as possible. If the SENSE pin
is driven externally, it should be bypassed to ground as
close to the device as possible with a 1µF ceramic capacitor.
22323fa
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VCM
VCM
2.2µF
HIGH SPEED
DIFFERENTIAL
25Ω
AMPLIFIER
ANALOG
INPUT
+
2.2µF
10k
0.1µF
AIN+
25Ω
ANALOG
INPUT
LTC2232/
LTC2233
+
CM
–
10k
12pF
–
25Ω
AMPLIFIER = LTC6600-20, AD8138, ETC.
AIN–
0.1µF
22323 F04
Figure 4. Differential Drive with an Amplifier
25Ω
0.1µF
T1
0.1µF
AIN+
2.2µF
0.1µF
LTC2232/
LTC2233
25Ω
0.1µF
LTC2232/
LTC2233
T1
0.1µF
12Ω
T1 = MA/COM ETC1-1-13
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
AIN+
ANALOG
INPUT
8pF
25Ω
22323 F05
VCM
2.2µF
12Ω
AIN–
Figure 5. Single-Ended Drive
VCM
ANALOG
INPUT
LTC2232/
LTC2233
12pF
25Ω
0.1µF
AIN+
AIN–
22323 F06
Figure 6. Recommended Front End Circuit for Input
Frequencies Between 100MHz and 250MHz
25Ω
T1 = MA/COM ETC1-1-13
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
AIN–
22323 F07
Figure 7. Recommended Front End Circuit for Input
Frequencies Between 250MHz and 500MHz
22323fa
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VCM
LTC2232/LTC2233
2.2µF
0.1µF
AIN+
4.7nH
ANALOG
INPUT
25Ω
0.1µF
T1
VCM
1.6V
25Ω
1V
LTC2232/
LTC2233
4.7nH
AIN–
T1 = MA/COM ETC1-1-13
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
INDUCTORS 0603 OR 0402
1.6V BANDGAP
REFERENCE
2.2µF
22323 F08
TIE TO VDD FOR 2V RANGE;
TIE TO VCM FOR 1V RANGE;
RANGE = 2 • VSENSE FOR
0.5V < VSENSE < 1V
1µF
0.5V
RANGE
DETECT
AND
CONTROL
2pF
0.1µF
4Ω
SENSE
REFLB
0.1µF
REFHA
BUFFER
INTERNAL ADC
HIGH REFERENCE
2.2µF
Figure 8. Recommended Front End Circuit for Input
Frequencies Above 500MHz
DIFF AMP
1µF
REFLA
1.6V
0.1µF
VCM
REFHB
INTERNAL ADC
LOW REFERENCE
2.2µF
22323 F09
12k
0.8V
12k
SENSE
LTC2232/
LTC2233
Figure 9. Equivalent Reference Circuit
1µF
22323 F10
Figure 10. 1.6V Range ADC
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Input Range
The input range can be set based on the application. The
2V input range will provide the best signal-to-noise performance while maintaining excellent SFDR. The 1V input
range will have better SFDR performance, but the SNR will
degrade by 1.5dB. See the Typical Performance Characteristics section.
Driving the Encode Inputs
The noise performance of the LTC2232/LTC2233 can
depend on the encode signal quality as much as on the
analog input. The ENC+/ENC– inputs are intended to be
driven differentially, primarily for noise immunity from
common mode noise sources. Each input is biased through
a 6k resistor to a 1.6V bias. The bias resistors set the DC
operating point for transformer coupled drive circuits and
can set the logic threshold for single-ended drive circuits.
Any noise present on the encode signal will result in
additional aperture jitter that will be RMS summed with the
inherent ADC aperture jitter.
LTC2232/LTC2233
VDD
TO INTERNAL
ADC CIRCUITS
VDD
1.6V BIAS
6k
ENC+
0.1µF
1:4
CLOCK
INPUT
VDD
50Ω
1.6V BIAS
6k
ENC–
22323 F11
Figure 11. Transformer Driven ENC+/ENC–
In applications where jitter is critical (high input frequencies) take the following into consideration:
1. Differential drive should be used.
2. Use as large an amplitude as possible; if transformer
coupled use a higher turns ratio to increase the amplitude.
3. If the ADC is clocked with a sinusoidal signal, filter the
encode signal to reduce wideband noise.
4. Balance the capacitance and series resistance at both
encode inputs so that any coupled noise will appear at both
inputs as common mode noise. The encode inputs have a
common mode range of 1.1V to 2.5V. Each input may be
driven from ground to VDD for single-ended drive.
Maximum and Minimum Encode Rates
The maximum encode rate for the LTC2232/LTC2233 is
105Msps (LTC2232) and 80Msps (LTC2233). For the ADC
to operate properly, the encode signal should have a 50%
(±5%) duty cycle. Each half cycle must have at least 4.5ns
(LTC2232) or 5.9ns (LTC2233) for the ADC internal circuitry to have enough settling time for proper operation.
Achieving a precise 50% duty cycle is easy with differential
sinusoidal drive using a transformer or using symmetric
differential logic such as PECL or LVDS.
An optional clock duty cycle stabilizer circuit can be used
if the input clock has a non 50% duty cycle. This circuit
uses the rising edge of the ENC+ pin to sample the analog
input. The falling edge of ENC+ is ignored and the internal
falling edge is generated by a phase-locked loop. The input
clock duty cycle can vary from 20% to 80% and the clock
duty cycle stabilizer will maintain a constant 50% internal
duty cycle. If the clock is turned off for a long period of
time, the duty cycle stabilizer circuit will require a hundred
clock cycles for the PLL to lock onto the input clock. To use
the clock duty cycle stabilizer, the MODE pin should be
connected to 1/3VDD or 2/3VDD using external resistors.
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The lower limit of the LTC2232/LTC2233 sample rate is
determined by droop of the sample-and-hold circuits. The
pipelined architecture of this ADC relies on storing analog
signals on small valued capacitors. Junction leakage will
discharge the capacitors. The specified minimum operating frequency for the LTC2232/LTC2233 is 1Msps.
DIGITAL OUTPUTS
Table 1 shows the relationship between the analog input
voltage, the digital data bits and the overflow bit.
Table 1. Output Codes vs Input Voltage
AIN+ – AIN–
(2V Range)
OF
D9 – D0
(Offset Binary)
D9 – D0
(2’s Complement)
>+1.000000V
+0.998047V
+0.996094V
1
0
0
11 1111 1111
11 1111 1111
11 1111 1110
01 1111 1111
01 1111 1111
01 1111 1110
+0.001953V
0.000000V
–0.001953V
–0.003906V
0
0
0
0
10 0000 0001
10 0000 0000
01 1111 1111
01 1111 1110
00 0000 0001
00 0000 0000
11 1111 1111
11 1111 1110
–0.998047V
–1.000000V
<–1.000000V
0
0
1
00 0000 0001
00 0000 0000
00 0000 0000
10 0000 0001
10 0000 0000
10 0000 0000
Digital Output Buffers
Figure 13 shows an equivalent circuit for a single output
buffer. Each buffer is powered by OVDD and OGND, isolated from the ADC power and ground. The additional Nchannel transistor in the output driver allows operation
down to low voltages. The internal resistor in series with
the output makes the output appear as 50Ω to external
circuitry and may eliminate the need for external damping
resistors.
As with all high speed/high resolution converters, the
digital output loading can affect the performance. The
digital outputs of the LTC2232/LTC2233 should drive a
minimal capacitive load to avoid possible interaction between the digital outputs and sensitive input circuitry. The
output should be buffered with a device such as an
ALVCH16373 CMOS latch. For full speed operation the
capacitive load should be kept under 10pF.
Lower OVDD voltages will also help reduce interference
from the digital outputs.
LTC2232/LTC2233
OVDD
VDD
0.5V
TO 3.6V
VDD
0.1µF
ENC+
VTHRESHOLD = 1.6V
1.6V ENC–
OVDD
LTC2232/
LTC2233
0.1µF
22323 F12a
DATA
FROM
LATCH
PREDRIVER
LOGIC
43Ω
OE
OGND
Figure 12a. Single-Ended ENC Drive,
Not Recommended for Low Jitter
22323 F13
Figure 13. Digital Output Buffer
3.3V
MC100LVELT22
TYPICAL
DATA
OUTPUT
3.3V
130Ω
Q0
130Ω
ENC+
D0
ENC–
Q0
83Ω
LTC2232/
LTC2233
83Ω
22323 F12b
Figure 12b. ENC Drive Using a CMOS to PECL Translator
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Data Format
Output Driver Power
The LTC2232/LTC2233 parallel digital output can be selected for offset binary or 2’s complement format. The
format is selected with the MODE pin. Connecting MODE
to GND or 1/3VDD selects offset binary output format.
Connecting MODE to 2/3VDD or VDD selects 2’s complement output format. An external resistor divider can be
used to set the 1/3VDD or 2/3VDD logic values. Table 2
shows the logic states for the MODE pin.
Separate output power and ground pins allow the output
drivers to be isolated from the analog circuitry. The power
supply for the digital output buffers, OVDD, should be tied
to the same power supply as for the logic being driven. For
example if the converter is driving a DSP powered by a 1.8V
supply then OVDD should be tied to that same 1.8V supply.
Table 2. MODE Pin Function
OVDD can be powered with any voltage up to 3.6V. OGND
can be powered with any voltage from GND up to 1V and
must be less than OVDD. The logic outputs will swing between OGND and OVDD.
Output Format
Clock Duty
Cycle Stablizer
Offset Binary
Off
Output Enable
1/3VDD
Offset Binary
On
2/3VDD
2’s Complement
On
VDD
2’s Complement
Off
The outputs may be disabled with the output enable pin, OE.
OE high disables all data outputs including OF and CLKOUT.
The data access and bus relinquish times are too slow to
allow the outputs to be enabled and disabled during full
speed operation. The output Hi-Z state is intended for use
during long periods of inactivity.
MODE Pin
0
Overflow Bit
When OF outputs a logic high the converter is either
overranged or underranged.
Output Clock
The ADC has a delayed version of the ENC+ input available
as a digital output, CLKOUT. The CLKOUT pin can be used
to synchronize the converter data to the digital system. This
is necessary when using a sinusoidal encode. Data will be
updated just after CLKOUT rises and can be latched on the
falling edge of CLKOUT.
Sleep and Nap Modes
The converter may be placed in shutdown or nap modes
to conserve power. Connecting SHDN to GND results in
normal operation. Connecting SHDN to VDD and OE to VDD
results in sleep mode, which powers down all circuitry
including the reference and typically dissipates 1mW. When
exiting sleep mode it will take milliseconds for the output
data to become valid because the reference capacitors have
22323fa
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to recharge and stabilize. Connecting SHDN to VDD and OE
to GND results in nap mode, which typically dissipates
30mW. In nap mode, the on-chip reference circuit is kept
on, so that recovery from nap mode is faster than that from
sleep mode, typically taking 100 clock cycles. In both sleep
and nap mode all digital outputs are disabled and enter the
Hi-Z state.
GROUNDING AND BYPASSING
The LTC2232/LTC2233 requires a printed circuit board with
a clean unbroken ground plane. A multilayer board with an
internal ground plane is recommended. Layout for the
printed circuit board should ensure that digital and analog
signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, REFHA, REFHB, REFLA and REFLB pins
as shown in the block diagram on the front page of this data
sheet. Bypass capacitors must be located as close to the
pins as possible. Of particular importance are the capaci-
tors between REFHA and REFLB and between REFHB and
REFLA. These capacitors should be as close to the device
as possible (1.5mm or less). Size 0402 ceramic capacitors
are recommended. The 2.2µF capacitor between REFHA and
REFLA can be somewhat further away. The traces connecting the pins and bypass capacitors must be kept short and
should be made as wide as possible.
The LTC2232/LTC2233 differential inputs should run parallel and close to each other. The input traces should be as
short as possible to minimize capacitance and to minimize
noise pickup.
HEAT TRANSFER
Most of the heat generated by the LTC2232/LTC2233 is
transferred from the die through the bottom-side exposed
pad and package leads onto the printed circuit board. For
good electrical and thermal performance, the exposed pad
should be soldered to a large grounded pad on the PC board.
It is critical that all ground pins are connected to a ground
plane of sufficient area.
22323fa
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Clock Sources for Undersampling
Undersampling raises the bar on the clock source and the
higher the input frequency, the greater the sensitivity to
clock jitter or phase noise. A clock source that degrades
SNR of a full-scale signal by 1dB at 70MHz will degrade
SNR by 3dB at 140MHz, and 4.5dB at 190MHz.
In cases where absolute clock frequency accuracy is
relatively unimportant and only a single ADC is required,
a 3V canned oscillator from vendors such as Saronix or
Vectron can be placed close to the ADC and simply
connected directly to the ADC. If there is any distance to
the ADC, some source termination to reduce ringing that
may occur even over a fraction of an inch is advisable. You
must not allow the clock to overshoot the supplies or
performance will suffer. Do not filter the clock signal with
a narrow band filter unless you have a sinusoidal clock
source, as the rise and fall time artifacts present in typical
digital clock signals will be translated into phase noise.
The lowest phase noise oscillators have single-ended
sinusoidal outputs, and for these devices the use of a filter
close to the ADC may be beneficial. This filter should be
close to the ADC to both reduce roundtrip reflection times,
as well as reduce the susceptibility of the traces between
the filter and the ADC. If you are sensitive to close-in phase
noise, the power supply for oscillators and any buffers
must be very stable, or propagation delay variation with
supply will translate into phase noise. Even though these
clock sources may be regarded as digital devices, do not
operate them on a digital supply. If your clock is also used
to drive digital devices such as an FPGA, you should locate
the oscillator, and any clock fan-out devices close to the
ADC, and give the routing to the ADC precedence. The
clock signals to the FPGA should have series termination
at the source to prevent high frequency noise from the
FPGA disturbing the substrate of the clock fan-out device.
If you use an FPGA as a programmable divider, you must
re-time the signal using the original oscillator, and the retiming flip-flop as well as the oscillator should be close to
the ADC, and powered with a very quiet supply.
For cases where there are multiple ADCs, or where the
clock source originates some distance away, differential
clock distribution is advisable. This is advisable both from
the perspective of EMI, but also to avoid receiving noise
from digital sources both radiated, as well as propagated
in the waveguides that exist between the layers of multilayer PCBs. The differential pairs must be close together,
and distanced from other signals. The differential pair
should be guarded on both sides with copper distanced at
least 3x the distance between the traces, and grounded
with vias no more than 1/4 inch apart.
22323fa
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Evaluation Circuit Schematic of the LTC2232
VCC
VCC
CLKOUT JP1
34
45
VCC
R19
OPT
ANALOG
INPUT
C1
0.1µF
42
R1*
T1*
25
R2
24.9
J1
48
C2*
24
R4
24.9
C3
0.1µF
VCM
1
47
R6*
1
C4
0.1µF
R5
50
2
3
4
13
C6
0.1µF
C5
1µF
15
5
C7
2.2µF
6
7
8
C9
0.1µF
C8
1µF
9
10
VDD
46
VDD
47
11
12
14
CLK
16
C11
33pF
SHDN
C10
0.1µF
17
CLK
18
VDD
C12
0.1µF
19
JP2
GND
44
C13
0.1µF
C15
2.2µF
43
42
JP3
SENSE
VDD
LTC2232*
20
CLKOUT
21
AIN–
NC
24
REFHA
NC
25
REFHA
D0
26
GND
D1
29
GND
D2
30
REFLB
D3
31
REFLB
D4
34
REFHB
D5
35
REFHB
D6
36
REFLA
D7
39
REFLA
D8
40
VDD
D9
41
VDD
OF
37
VDD
OVDD
33
VDD
OVDD
28
VDD
OVDD
23
+
ENC
OVDD
38
ENC–
OGND
32
SHDN
OGND
27
OEL
OGND
22
VCM
OGND
48
SENSE
GND
45
MODE
GND
46
AIN+
44
43
41
40
38
37
36
35
33
32
30
29
27
26
GND
GND
VCC
GND
GND
VCC
GND
2LE
VCC
1LE
GND
2OE
GND
1OE
VCC
1D1
28
31
4
1Q5
1D6
1Q6
1D7
1Q7
1D8
1Q8
2D1
2Q1
2D2
2Q2
2D3
2D5
2/3VDD
EXT
REF
R13
1k
1/3VDD
R14
1k
GND
2D6
2Q6
2D7
2Q7
2D8
R18
100k
VDD
C28
0.01µF
8
7
6
5
D0
33
34
6
RN1C 33Ω
D1
31
32
8
RN1B 33Ω
D2
29
30
9
RN1A 33Ω
D3
27
28
11
RN2D 33Ω
D4
25
26
12
RN2C 33Ω
D5
23
24
13
RN2B 33Ω
D6
21
22
14
RN2A 33Ω
D7
19
20
16
RN3D 33Ω
D8
17
18
17
RN3C 33Ω
D9
15
16
19
RN3B 33Ω
D10
13
14
20
RN3A 33Ω
D11
11
12
22
9
10
23
7
8
5
6
3
4
1
2
C17
0.1µF
VCC
NC7SV86P5X
4
5
1
1
A0
2
A1
3
A2
4
A3
2
C16
0.1µF
3
R10
10k
R9
10k
R8
10k
3201S-40G1
8
VCC
7
WP
6
SCL
5
SDA
24LC025
VCC
VDD
Assembly Type
VCC
C18
0.1µF
(2.5V) 1
2
3
4
RN1D 33Ω
PI74VCX16373A
C20
0.1µF
C24
0.1µF
VCC
C27
10µF
6.3V
36
5
2Q8
GND
C19
0.1µF
LT1763
OUT
IN
ADJ GND
GND GND
BYP SHDN
35
VDD
3.3V
C29
0.1µF
C30
0.1µF
C31
0.1µF
C32
0.1µF
C21
0.1µF
C22
0.1µF
R17
105k
38
3
C25
4.7µF
PWR
GND
VCM
EXT
REF
40
37
2Q5
VDD
R12
1k
39
2
2Q4
VDD
VCM
7
2Q3
2D4
R3
33Ω
10
1Q4
1D5
5 NC7SV86P5X
4
3
C33
0.1µF
18
1Q3
1D4
2
15
1Q2
1D3
1
21
1Q1
1D2
GND
49
JP4
MODE
VDD
39
GND
CLKOUT
ENCODE
INPUT
C23
J3 0.1µF
CLK
T2
ETC1-1T
R16
100Ω
R15
100Ω
CLK
C34
1µF
C26
0.1µF
U1
R1, R6
C2
T1
DC751A-A
LTC2222
24.9Ω
12pF
ETC1-1T
DC751A-B
LTC2223
24.9Ω
12pF
ETC1-1T
DC751A-C
LTC2232
24.9Ω
12pF
ETC1-1T
DC751A-D
LTC2233
24.9Ω
12pF
ETC1-1T
DC751A-E
LTC2222
12.4Ω
8.2pF
ETC1-1-13
DC751A-F
LTC2223
12.4Ω
8.2pF
ETC1-1-13
DC751A-G
LTC2232
12.4Ω
8.2pF
ETC1-1-13
DC751A-H
LTC2233
12.4Ω
8.2pF
ETC1-1-13
*Depends On Version Type
22323fa
25
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Silkscreen Top
Layer 1 Component Side
Layer 2 GND Plane
Layer 3 Power Plane
Layer 4 Bottom Side
22323fa
26
LTC2232/LTC2233
U
PACKAGE DESCRIPTIO
UK Package
48-Lead Plastic QFN (7mm × 7mm)
(Reference LTC DWG # 05-08-1704)
0.70 ±0.05
5.15 ±0.05
6.10 ±0.05 7.50 ±0.05
(4 SIDES)
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
7.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
R = 0.115
TYP
47 48
0.40 ± 0.10
PIN 1 TOP MARK
(SEE NOTE 5)
1
PIN 1
CHAMFER
2
5.15 ± 0.10
(4-SIDES)
0.25 ± 0.05
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WKKD-2)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
(UK48) QFN 0903
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
22323fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
27
LTC2232/LTC2233
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC1748
14-Bit, 80Msps, 5V ADC
76.3dB SNR, 90dB SFDR, 48-Pin TSSOP Package
LTC1750
14-Bit, 80Msps, 5V Wideband ADC
Up to 500MHz IF Undersampling, 90dB SFDR
LT1993-2
High Speed Differential Op Amp
800MHz BW, 70dBc Distortion at 70MHz, 6dB Gain
LT1994
Low Noise, Low Distortion Fully Differential
Input/Output Amplifier/Driver
Low Distortion: –94dBc at 1MHz
LTC2202
16-Bit, 10Msps, 3.3V ADC, Lowest Noise
150mW, 81.6dB SNR, 100dB SFDR, 48-Pin QFN
LTC2208
16-Bit, 130Msps, 3.3V ADC, LVDS Outputs
1250mW, 78dB SNR, 100dB SFDR, 64-Pin QFN
LTC2220-1
12-Bit, 185Msps, 3.3V ADC, LVDS Outputs
910mW, 67.7dB SNR, 80dB SFDR, 64-Pin QFN
LTC2222
12-Bit, 105Msps, 3.3V ADC, High IF Sampling
475mW, 68.4dB SNR, 84dB SFDR, 48-Pin QFN
LTC2222-11
11-Bit, 105Msps, 3.3V ADC, High IF Sampling
475mW, 65.7dB SNR, 84dB SFDR, 48-Pin QFN
LTC2223
12-Bit, 80Msps, 3.3V ADC, High IF Sampling
366mW, 68.5dB SNR, 84dB SFDR, 48-Pin QFN
LTC2224
12-Bit, 135Msps, 3.3V ADC, High IF Sampling
630mW, 67.6dB SNR, 84dB SFDR, 48-Pin QFN
LTC2232
10-Bit, 105Msps, 3.3V ADC, High IF Sampling
475mW, 61.3dB SNR, 78dB SFDR, 48-Pin QFN
LTC2233
10-Bit, 80Msps, 3.3V ADC, High IF Sampling
366mW, 61.3dB SNR, 78dB SFDR, 48-Pin QFN
LTC2234
10-Bit, 135Msps, 3.3V ADC, High IF Sampling
630mW, 61.2dB SNR, 78dB SFDR, 48-Pin QFN
LTC2255
14-Bit, 125Msps, 3V ADC, Lowest Power
395mW, 72.5dB SNR, 88dB SFDR, 32-Pin QFN
LTC2284
14-Bit, Dual, 105Msps, 3V ADC, Low Crosstalk
540mW, 72.4dB SNR, 88dB SFDR, 64-Pin QFN
LT5512
DC-3GHz High Signal Level Downconverting Mixer
DC to 3GHz, 21dBm IIP3, Integrated LO Buffer
LT5514
Ultralow Distortion IF Amplifier/ADC Driver
with Digitally Controlled Gain
450MHz to 1dB BW, 47dB OIP3,
Digital Gain Control 10.5dB to 33dB in 1.5dB/Step
LT5515
1.5GHz to 2.5GHz Direct Conversion
Quadrature Demodulator
High IIP3: 20dBm at 1.9GHz,
Integrated LO Quadrature Generator
LT5516
800MHz to 1.5GHz Direct Conversion
Quadrature Demodulator
High IIP3: 21.5dBm at 900MHz,
Integrated LO Quadrature Generator
LT5517
40MHz to 900MHz Direct Conversion
Quadrature Demodulator
High IIP3: 21dBm at 800MHz,
Integrated LO Quadrature Generator
LT5522
600MHz to 2.7GHz High Linearity Downconverting Mixer
4.5V to 5.25V Supply, 25dBm IIP3 at 900MHz.
NF = 12.5dB, 50Ω Single-Ended RF and LO Ports
22323fa
28
Linear Technology Corporation
LT 0106 REV A • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2004
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