Microchip DSPIC30F6010A High-performance, 16-bit digital signal controller Datasheet

dsPIC30F6010A/6015
Data Sheet
High-Performance, 16-Bit
Digital Signal Controllers
© 2006 Microchip Technology Inc.
DS70150B
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•
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•
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dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC and SmartShunt are
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In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
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© 2006, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.
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Company’s quality system processes and procedures are for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
DS70150B-page ii
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
dsPIC30F6010A/6015 Enhanced Flash
16-bit Digital Signal Controller (DSC)
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
High-Performance Modified RISC CPU:
• Modified Harvard architecture
• C compiler optimized instruction set architecture
with flexible Addressing modes
• 83 base instructions
• 24-bit wide instructions, 16-bit wide data path
• 144 Kbytes on-chip Flash program space
(Instruction words)
• 8 Kbytes of on-chip data RAM
• 4 Kbytes of nonvolatile data EEPROM
• Up to 30 MIPS operation:
- DC to 40 MHz external clock input
- 4 MHz-10 MHz oscillator input with
PLL active (4x, 8x, 16x)
- 7.37 MHz internal RC with PLL active
(4x, 8x, 16x)
• 44 interrupt sources:
- 5 external interrupt sources
- 8 user selectable priority levels for each
interrupt source
- 4 processor trap sources
• 16 x 16-bit working register array
DSP Engine Features:
•
•
•
•
Dual data fetch
Accumulator write-back for DSP operations
Modulo and Bit-Reversed Addressing modes
Two, 40-bit wide accumulators with optional
saturation logic
• 17-bit x 17-bit single-cycle hardware fractional/
integer multiplier
• All DSP instructions single cycle
• ±16-bit single-cycle shift
© 2006 Microchip Technology Inc.
Peripheral Features:
• High-current sink/source I/O pins: 25 mA/25 mA
• Timer module with programmable prescaler:
- Five 16-bit timers/counters; optionally pair
16-bit timers into 32-bit timer modules
• 16-bit Capture input functions
• 16-bit Compare/PWM output functions
• 3-wire SPI modules (supports 4 Frame modes)
• I2CTM module supports Multi-Master/Slave mode
and 7-bit/10-bit addressing
• 2 UART modules with FIFO Buffers
• 2 CAN modules, 2.0B compliant (dsPIC306010A)
• 1 CAN module, 2.0B compliant (dsPIC306015)
Motor Control PWM Module Features:
• 8 PWM output channels:
- Complementary or Independent Output
modes
- Edge and Center-Aligned modes
• 4 duty cycle generators
• Dedicated time base
• Programmable output polarity
• Dead-Time control for Complementary mode
• Manual output control
• Trigger for A/D conversions
Quadrature Encoder Interface Module
Features:
•
•
•
•
•
•
•
Phase A, Phase B and Index Pulse input
16-bit up/down position counter
Count direction status
Position Measurement (x2 and x4) mode
Programmable digital noise filters on inputs
Alternate 16-bit Timer/Counter mode
Interrupt on position counter rollover/underflow
DS70150B-page 1
dsPIC30F6010A/6015
Analog Features:
• Power-on Reset (POR), Power-up Timer (PWRT)
and Oscillator Start-up Timer (OST)
• Flexible Watchdog Timer (WDT) with on-chip,
low-power RC oscillator for reliable operation
• Fail-Safe Clock Monitor operation detects clock
failure and switches to on-chip, low-power RC
oscillator
• Programmable code protection
• In-Circuit Serial Programming™ (ICSP™)
• Selectable Power Management modes
- Sleep, Idle and Alternate Clock modes
• 10-bit Analog-to-Digital Converter (ADC) with
4 S/H Inputs:
- 1 Msps conversion rate
- 16 input channels
- Conversion available during Sleep and Idle
• Programmable Brown-out Reset
Special Microcontroller Features:
• Enhanced Flash program memory:
- 10,000 erase/write cycle (min.) for
industrial temperature range, 100K (typical)
• Data EEPROM memory:
- 100,000 erase/write cycle (min.) for
industrial temperature range, 1M (typical)
• Self-reprogrammable under software control
CMOS Technology:
•
•
•
•
Low-power, high-speed Flash technology
Wide operating voltage range (2.5V to 5.5V)
Industrial and Extended temperature ranges
Low-power consumption
dsPIC30F Motor Control and Power Conversion Family*
UART
SPI
2
I C™
CAN
Program
Output
Motor
SRAM EEPROM Timer Input
A/D 10-bit Quad
Pins Mem. Bytes/
Comp/Std Control
Bytes
Bytes
16-bit Cap
1 Msps
Enc
Instructions
PWM
PWM
dsPIC30F2010
28
12K/4K
512
1024
3
4
2
6 ch
6 ch
Yes
1
1
1
—
dsPIC30F3010
28
24K/8K
1024
1024
5
4
2
6 ch
6 ch
Yes
1
1
1
—
dsPIC30F4012
28
48K/16K
2048
1024
5
4
2
6 ch
6 ch
Yes
1
1
1
1
dsPIC30F3011
40/
44
24K/8K
1024
1024
5
4
4
6 ch
9 ch
Yes
2
1
1
—
dsPIC30F4011
40/
44
48K/16K
2048
1024
5
4
4
6 ch
9 ch
Yes
2
1
1
1
dsPIC30F5015
64
66K/22K
2048
1024
5
4
4
8 ch
16 ch
Yes
1
2
1
1
dsPIC30F5016
80
66K/22K
2048
1024
5
4
4
8 ch
16 ch
Yes
1
2
1
1
dsPIC30F6010A
80
144K/48K
8192
4096
5
8
8
8 ch
16 ch
Yes
2
2
1
2
dsPIC30F6015
64
144K/48K
8192
4096
5
8
8
8 ch
16 ch
Yes
2
2
1
1
Device
* This table provides a summary of the dsPIC30F peripheral features. Other available devices in the dsPIC30F Motor Control and
Power Conversion Family are shown for feature comparison.
DS70150B-page 2
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
Pin Diagram
IC5/RD12
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
OC6/CN14/RD5
OC5/CN13/RD4
IC6/CN19/RD13
OC7/CN15/RD6
C2RX/RG0
C2TX/RG1
C1TX/RF1
C1RX/RF0
VDD
VSS
OC8/UPDN/CN16/RD7
PWM2L/RE2
PWM1H/RE1
PWM1L/RE0
PWM2H/RE3
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
PWM3L/RE4
80-Pin TQFP
PWM3H/RE5
PWM4L/RE6
1
2
PWM4H/RE7
3
T2CK/RC1
T4CK/RC3
SCK2/CN8/RG6
4
60
EMUC1/SOSCO/T1CK/CN0/RC14
59
EMUD1/SOSCI/CN1/RC13
58
EMUC2/OC1/RD0
57
5
56
IC4/RD11
IC3/RD10
6
55
IC2/RD9
SDI2/CN9/RG7
7
54
IC1/RD8
SDO2/CN10/RG8
MCLR
8
53
INT4/RA15
9
52
INT3/RA14
VSS
51
dsPIC30F6010A
SS2/CN11/RG9
VSS
10
11
50
VDD
12
49
OSC2/CLKO/RC15
OSC1/CLKI
FLTA/INT1/RE8
13
48
VDD
FLTB/INT2/RE9
14
47
AN5/QEB/CN7/RB5
15
46
SCL/RG2
SDA/RG3
AN4/QEA/CN6/RB4
AN3/INDX/CN5/RB3
16
45
EMUC3/SCK1/INT0/RF6
SDI1/RF7
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
IC7/CN20/RD14
IC8/CN21/RD15
U2RX/CN17/RF4
U2TX/CN18/RF5
U1TX/RF3
24
41
VREF+/RA10
20
23
U1RX/RF2
PGD/EMUD/AN0/CN2/RB0
22
42
VREF-/RA9
EMUD3/SDO1/RF8
19
21
18
43
AN7/RB7
AN2/SS1/CN4/RB2
PGC/EMUC/AN1/CN3/RB1
AN6/OCFA/RB6
17
44
Note: Pinout subject to change.
© 2006 Microchip Technology Inc.
DS70150B-page 3
dsPIC30F6010A/6015
Pin Diagram
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
PWM3L/RE4
PWM2H/RE3
PWM2L/RE2
PWM1H/RE1
PWM1L/RE0
C1TX/RF1
C1RX/RF0
VDD
VSS
OC8/UPDN/CN16/RD7
OC7/CN15/RD6
OC6/IC6/CN14/RD5
OC5/IC5/CN13/RD4
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
64-Pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
dsPIC30F6015
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/T4CK/CN1/RC13
EMUC2/OC1/RD0
IC4/INT4/RD11
IC3/INT3/RD10
IC2/FLTB/INT2/RD9
IC1/FLTA/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKI
VDD
SCL/RG2
SDA/RG3
EMUC3/SCK1/INT0/RF6
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
U2RX/CN17/RF4
U2TX/CN18/RF5
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
VSS
VDD
AN5/QEB/IC8/CN7/RB5
AN4/QEA/IC7/CN6/RB4
AN3/INDX/CN5/RB3
AN2/SS1/CN4/RB2
AN1/VREF-/CN3/RB1
AN0/VREF+/CN2/RB0
Note: Pinout subject to change.
DS70150B-page 4
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
Table of Contents
1.0 Device Overview ......................................................................................................................................................................... 7
2.0 CPU Architecture Overview ....................................................................................................................................................... 13
3.0 Memory Organization ................................................................................................................................................................ 21
4.0 Address Generator Units ........................................................................................................................................................... 33
5.0
Interrupts .................................................................................................................................................................................. 39
6.0 Flash Program Memory ............................................................................................................................................................. 47
7.0 Data EEPROM Memory ............................................................................................................................................................ 53
8.0 I/O Ports .................................................................................................................................................................................... 57
9.0 Timer1 Module .......................................................................................................................................................................... 63
10.0 Timer2/3 Module ....................................................................................................................................................................... 67
11.0 Timer4/5 Module ...................................................................................................................................................................... 75
12.0 Input Capture Module ............................................................................................................................................................... 79
13.0 Output Compare Module ........................................................................................................................................................... 83
14.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................ 87
15/0 Motor Control PWM Module ...................................................................................................................................................... 93
16.0 SPI Module .............................................................................................................................................................................. 103
17.0 I2C™ Module .......................................................................................................................................................................... 107
18.0 Universal Asynchronous Receiver Transmitter (UART) Module ............................................................................................. 115
19.0 CAN Module ............................................................................................................................................................................ 123
20.0 10-bit High-Speed Analog-to-Digital Converter (ADC) Module ............................................................................................... 135
21.0 System Integration .................................................................................................................................................................. 147
22.0 Instruction Set Summary ......................................................................................................................................................... 163
23.0 Development Support .............................................................................................................................................................. 171
24.0 Electrical Characteristics ......................................................................................................................................................... 175
25.0 Packaging Information ............................................................................................................................................................. 215
Appendix A: Revision History ............................................................................................................................................................ 219
Appendix B: Device Comparisons .................................................................................................................................................... 221
Appendix C: Migration From dsPIC30F6010 to dsPIC30F6010A ..................................................................................................... 223
Index ................................................................................................................................................................................................. 225
The Microchip Web Site .................................................................................................................................................................... 231
Customer Change Notification Service ............................................................................................................................................. 231
Customer Support ............................................................................................................................................................................. 231
Reader Response ............................................................................................................................................................................. 232
Product Identification System ........................................................................................................................................................... 233
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© 2006 Microchip Technology Inc.
DS70150B-page 5
dsPIC30F6010A/6015
NOTES:
DS70150B-page 6
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
1.0
DEVICE OVERVIEW
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
© 2006 Microchip Technology Inc.
This document contains device-specific information for
the dsPIC30F6010A and dsPIC30F6015 devices. The
dsPIC30F devices contain extensive Digital Signal
Processor (DSP) functionality within a high-performance
16-bit microcontroller (MCU) architecture. Figure 1-1
shows a device block diagram for the dsPIC30F6010A
device. Figure 1-2 shows a device block diagram for the
dsPIC30F6015 device.
DS70150B-page 7
dsPIC30F6010A/6015
FIGURE 1-1:
dsPIC30F6010A BLOCK DIAGRAM
Y Data Bus
X Data Bus
16
Interrupt
Controller
PSV & Table
Data Access
24 Control Block
8
16
16
Data Latch
Y Data
RAM
(4 Kbytes)
Address
Latch
16
24
Y AGU
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
Address Latch
Program Memory
(144 Kbytes)
Data EEPROM
(4 Kbytes)
Data Latch
X Data
RAM
(4 Kbytes)
Address
Latch
16
VREF-/RA9
VREF+/RA10
INT3/RA14
INT4/RA15
PORTA
PGD/EMUD/AN0/CN2/RB0
PGC/EMUC/AN1/CN3/RB1
AN2/SS1/CN4/RB2
AN3/INDX/CN5/RB3
AN4/QEA/CN6/RB4
AN5/QEB/CN7/RB5
AN6/OCFA/RB6
AN7/RB7
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
16
16
X RAGU
X WAGU
16
24
16
Effective Address
16
Data Latch
ROM Latch
16
24
PORTB
T2CK/RC1
T4CK/RC3
EMUD1/SOSCI/CN1/RC13
EMUC1/SOSCO/T1CK/CN0/RC14
OSC2/CLKO/RC15
IR
16
16
16 x 16
W Reg Array
Decode
PORTC
Instruction
Decode &
Control
16 16
Control Signals
to Various Blocks
OSC1/CLKI
DSP
Engine
Power-up
Timer
ALU<16>
POR/BOR
Reset
16
Watchdog
Timer
MCLR
VDD, VSS
AVDD, AVSS
SPI1,
SPI2
Divide
Unit
Oscillator
Start-up Timer
Timing
Generation
CAN1,
CAN2
EMUC2/OC1/RD0
EMUD2/OC2/RD1
OC3/RD2
OC4/RD3
OC5/CN13/RD4
OC6/CN14/RD5
OC7/CN15/RD6
OC8/UPDN/CN16/RD7
IC1/RD8
IC2/RD9
IC3/RD10
IC4/RD11
IC5/RD12
IC6/CN19/RD13
IC7/CN20/RD14
IC8/CN21/RD15
16
Low-Voltage
Detect
PORTD
10-bit ADC
Input
Capture
Module
Output
Compare
Module
I C™
Timers
QEI
Motor Control
PWM
UART1,
UART2
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
FLTA/INT1/RE8
FLTB/INT2/RE9
2
PORTE
C1RX/RF0
C1TX/RF1
U1RX/RF2
U1TX/RF3
U2RX/CN17/RF4
U2TX/CN18/RF5
EMUC3/SCK1/INT0/RF6
SDI1/RF7
EMUD3/SDO1/RF8
C2RX/RG0
C2TX/RG1
SCL/RG2
SDA/RG3
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
SS2/CN11/RG9
PORTG
DS70150B-page 8
PORTF
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 1-2:
dsPIC30F6015 BLOCK DIAGRAM
Y Data Bus
X Data Bus
Interrupt
Controller
PSV & Table
Data Access
24 Control Block
8
16
16
16
Data Latch
Y Data
RAM
(4 Kbytes)
Address
Latch
16
24
Y AGU
PCU PCH PCL
Program Counter
Loop
Stack
Control
Control
Logic
Logic
Address Latch
Program Memory
(144 Kbytes)
Data EEPROM
(4 Kbytes)
16
Data Latch
X Data
RAM
(4 Kbytes)
Address
Latch
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/CN4/RB2
AN3/INDX/CN5/RB3
AN4/QEA/IC7/CN6/RB4
AN5/QEB/IC8/CN7/RB5
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
AN12/RB12
AN13/RB13
AN14/RB14
AN15/OCFB/CN12/RB15
16
16
X RAGU
X WAGU
16
24
16
Effective Address
16
Data Latch
ROM Latch
16
24
PORTB
IR
16 x 16
W Reg Array
Decode
PORTC
Instruction
Decode &
Control
16 16
Control Signals
to Various Blocks
OSC1/CLKI
EMUD1/SOSCI/T4CK/CN1/RC13
EMUC1/SOSCO/T1CK/CN0/RC14
OSC2/CLKO/RC15
16
16
DSP
Engine
Power-up
Timer
EMUC2/OC1/RD0
EMUD2/OC2/RD1
OC3/RD2
OC4/RD3
OC5/IC5/CN13/RD4
OC6/IC6/CN14/RD5
OC7/CN15/RD6
OC8/UPDN/CN16/RD7
IC1/FLTA/INT1/RD8
IC2/FLTB/INT2/RD9
IC3/INT3/RD10
IC4/INT4/RD11
Divide
Unit
Oscillator
Start-up Timer
Timing
Generation
ALU<16>
POR/BOR
Reset
VDD, VSS
AVDD, AVSS
16
16
Watchdog
Timer
MCLR
Low-Voltage
Detect
PORTD
CAN1
10-bit ADC
Input
Capture
Module
Output
Compare
Module
I2C™
SPI1,
SPI2
Timers
QEI
Motor Control
PWM
UART1,
UART2
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
PORTE
SCL/RG2
SDA/RG3
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
SS2/CN11/RG9
C1RX/RF0
C1TX/RF1
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
U2RX/CN17/RF4
U2TX/CN18/RF5
EMUC3/SCK1/INT0/RF6
PORTG
© 2006 Microchip Technology Inc.
PORTF
DS70150B-page 9
dsPIC30F6010A/6015
Table 1-1 provides a brief description of the device I/O
pinout and the functions that are multiplexed to a port
pin. Multiple functions may exist on one port pin. When
multiplexing occurs, the peripheral module’s functional
requirements may force an override of the data
direction of the port pin.
TABLE 1-1:
dsPIC30F6010A/6015 I/O PIN DESCRIPTIONS
Pin
Type
Buffer
Type
AN0-AN15
I
Analog
Pin Name
Description
Analog input channels. AN0 and AN1 are also used for device programming
data and clock inputs, respectively.
AVDD
P
P
Positive supply for analog module.
AVSS
P
P
Ground reference for analog module.
CLKI
CLKO
I
O
CN0-CN23
I
ST
Input change notification inputs. Can be software programmed for internal weak
pull-ups on all inputs.
C1RX
C1TX
C2RX
C2TX
I
O
I
O
ST
—
ST
—
CAN1 bus receive pin.
CAN1 bus transmit pin.
CAN2 bus receive pin.
CAN2 bus transmit pin.
EMUD
EMUC
EMUD1
EMUC1
EMUD2
EMUC2
EMUD3
EMUC3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
ICD Quaternary Communication Channel data input/output pin.
ICD Quaternary Communication Channel clock input/output pin.
IC1-IC8
I
ST
Capture inputs 1 through 8.
INDX
QEA
I
I
ST
ST
QEB
I
ST
UPDN
O
CMOS
Quadrature Encoder Index Pulse input.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Position Up/Down Counter Direction State.
INT0
INT1
INT2
INT3
INT4
I
I
I
I
I
ST
ST
ST
ST
ST
Legend: CMOS =
ST
=
I
=
DS70150B-page 10
ST/CMOS External clock source input. Always associated with OSC1 pin function.
—
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always
associated with OSC2 pin function.
External interrupt 0.
External interrupt 1.
External interrupt 2.
External interrupt 3.
External interrupt 4.
CMOS compatible input or output
Schmitt Trigger input with CMOS levels
Input
Analog =
O
=
P
=
Analog input
Output
Power
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 1-1:
dsPIC30F6010A/6015 I/O PIN DESCRIPTIONS (CONTINUED)
Pin
Type
Buffer
Type
FLTA
FLTB
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM4L
PWM4H
I
I
O
O
O
O
O
O
O
O
ST
ST
—
—
—
—
—
—
—
—
PWM Fault A input.
PWM Fault B input.
PWM 1 Low output.
PWM 1 High output.
PWM 2 Low output.
PWM 2 High output.
PWM 3 Low output.
PWM 3 High output.
PWM 4 Low output.
PWM 4 High output.
MCLR
I/P
ST
Master Clear (Reset) input or programming voltage input. This pin is an
active-low Reset to the device.
OCFA
OCFB
OC1-OC8
I
I
O
ST
ST
—
Compare Fault A input (for Compare channels 1, 2, 3 and 4).
Compare Fault B input (for Compare channels 5, 6, 7 and 8).
Compare outputs 1 through 8.
OSC1
I
OSC2
I/O
PGD
PGC
I/O
I
ST
ST
In-Circuit Serial Programming™ data input/output pin.
In-Circuit Serial Programming clock input pin.
RA9-RA10
RA14-RA15
I/O
I/O
ST
ST
PORTA is a bidirectional I/O port.
Pin Name
Description
ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise.
—
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes.
RB0-RB15
I/O
ST
PORTB is a bidirectional I/O port.
RC1
RC3
RC13-RC15
I/O
I/O
I/O
ST
ST
ST
PORTC is a bidirectional I/O port.
RD0-RD15
I/O
ST
PORTD is a bidirectional I/O port.
RE0-RE9
I/O
ST
PORTE is a bidirectional I/O port.
RF0-RF8
I/O
ST
PORTF is a bidirectional I/O port.
RG0-RG3
RG6-RG9
I/O
I/O
ST
ST
PORTG is a bidirectional I/O port.
SCK1
SDI1
SDO1
SS1
SCK2
SDI2
SDO2
SS2
I/O
I
O
I
I/O
I
O
I
ST
ST
—
ST
ST
ST
—
ST
Synchronous serial clock input/output for SPI #1.
SPI #1 Data In.
SPI #1 Data Out.
SPI #1 Slave Synchronization.
Synchronous serial clock input/output for SPI #2.
SPI #2 Data In.
SPI #2 Data Out.
SPI #2 Slave Synchronization.
SCL
SDA
I/O
I/O
ST
ST
Synchronous serial clock input/output for I2C™.
Synchronous serial data input/output for I2C.
SOSCO
SOSCI
O
I
T1CK
T2CK
T4CK
I
I
I
Legend: CMOS =
ST
=
I
=
—
32 kHz low-power oscillator crystal output.
ST/CMOS 32 kHz low-power oscillator crystal input. ST buffer when configured in RC
mode; CMOS otherwise.
ST
ST
ST
Timer1 external clock input.
Timer2 external clock input.
Timer4 external clock input.
CMOS compatible input or output
Schmitt Trigger input with CMOS levels
Input
© 2006 Microchip Technology Inc.
Analog =
O
=
P
=
Analog input
Output
Power
DS70150B-page 11
dsPIC30F6010A/6015
TABLE 1-1:
dsPIC30F6010A/6015 I/O PIN DESCRIPTIONS (CONTINUED)
Pin
Type
Buffer
Type
U1RX
U1TX
U1ARX
U1ATX
U2RX
U2TX
I
O
I
O
I
O
ST
—
ST
—
ST
—
UART1 Receive.
UART1 Transmit.
UART1 Alternate Receive.
UART1 Alternate Transmit.
UART2 Receive.
UART2 Transmit.
VDD
P
—
Positive supply for logic and I/O pins.
VSS
P
—
Ground reference for logic and I/O pins.
VREF+
I
Analog
Analog Voltage Reference (High) input.
VREF-
I
Analog
Analog Voltage Reference (Low) input.
Pin Name
Legend: CMOS =
ST
=
I
=
DS70150B-page 12
Description
CMOS compatible input or output
Schmitt Trigger input with CMOS levels
Input
Analog =
O
=
P
=
Analog input
Output
Power
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
2.0
CPU ARCHITECTURE
OVERVIEW
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
This document summarizes the CPU and peripheral
functions of the dsPIC30F6010A/6015. For a complete
description of this functionality, please refer to
the “dsPIC30F Family Reference Manual” (DS70046).
2.1
Core Overview
The core has a 24-bit instruction word. The Program
Counter (PC) is 23 bits wide with the Least Significant
bit (LSb) always clear (see Section 3.1 “Program
Address Space”), and the Most Significant bit (MSb)
is ignored during normal program execution, except for
certain specialized instructions. Thus, the PC can
address up to 4M instruction words of user program
space. An instruction prefetch mechanism is used to
help maintain throughput. Program loop constructs,
free from loop count management overhead, are supported using the DO and REPEAT instructions, both of
which are interruptible at any point.
The working register array consists of 16x16-bit registers, each of which can act as data, address or offset
registers. One working register (W15) operates as a
Software Stack Pointer for interrupts and calls.
The data space is 64 Kbytes (32K words) and is split into
two blocks, referred to as X and Y data memory. Each
block has its own independent Address Generation Unit
(AGU). Most instructions operate solely through the X
memory AGU, which provides the appearance of a single unified data space. The Multiply-Accumulate (MAC)
class of dual source DSP instructions operate through
both the X and Y AGUs, splitting the data address space
into two parts (see Section 3.2 “Data Address
Space”). The X and Y data space boundary is devicespecific and cannot be altered by the user. Each data
word consists of 2 bytes, and most instructions can
address data either as words or bytes.
There are two methods of accessing data stored in
program memory:
• The upper 32 Kbytes of data space memory can be
mapped into the lower half (user space) of program
space at any 16K program word boundary, defined
by the 8-bit Program Space Visibility Page
(PSVPAG) register. This lets any instruction access
program space as if it were data space, with a limitation that the access requires an additional cycle.
Moreover, only the lower 16 bits of each instruction
word can be accessed using this method.
© 2006 Microchip Technology Inc.
• Linear indirect access of 32K word pages within
program space is also possible using any working
register, via table read and write instructions.
Table read and write instructions can be used to
access all 24 bits of an instruction word.
Overhead-free circular buffers (Modulo Addressing)
are supported in both X and Y address spaces. This is
primarily intended to remove the loop overhead for
DSP algorithms.
The X AGU also supports Bit-Reversed Addressing on
destination Effective Addresses, to greatly simplify
input or output data reordering for radix-2 FFT algorithms. Refer to Section 4.0 “Address Generator
Units” for details on Modulo and Bit-Reversed
Addressing.
The core supports Inherent (no operand), Relative, Literal, Memory Direct, Register Direct, Register Indirect,
Register Offset and Literal Offset Addressing modes.
Instructions are associated with predefined addressing
modes, depending upon their functional requirements.
For most instructions, the core is capable of executing
a data (or program data) memory read, a working register (data) read, a data memory write and a program
(instruction) memory read per instruction cycle. As a
result, 3-operand instructions are supported, allowing
C = A + B operations to be executed in a single cycle.
A DSP engine has been included to significantly
enhance the core arithmetic capability and throughput.
It features a high-speed 17-bit by 17-bit multiplier, a
40-bit ALU, two 40-bit saturating accumulators and a
40-bit bidirectional barrel shifter. Data in the accumulator or any working register can be shifted up to 16 bits
right or 16 bits left in a single cycle. The DSP instructions operate seamlessly with all other instructions and
have been designed for optimal real-time performance.
The MAC class of instructions can concurrently fetch
two data operands from memory, while multiplying two
W registers. To enable this concurrent fetching of data
operands, the data space has been split for these
instructions and linear for all others. This has been
achieved in a transparent and flexible manner, by dedicating certain working registers to each address space
for the MAC class of instructions.
The core does not support a multi-stage instruction
pipeline. However, a single stage instruction prefetch
mechanism is used, which accesses and partially
decodes instructions a cycle ahead of execution, in
order to maximize available execution time. Most
instructions execute in a single cycle, with certain
exceptions.
The core features a vectored exception processing
structure for traps and interrupts, with 62 independent
vectors. The exceptions consist of up to 8 traps (of
which 4 are reserved) and 54 interrupts. Each interrupt
is prioritized based on a user-assigned priority between
1 and 7 (1 being the lowest priority and 7 being the
highest) in conjunction with a predetermined ‘natural
order’. Traps have fixed priorities, ranging from 8 to 15.
DS70150B-page 13
dsPIC30F6010A/6015
2.2
Programmer’s Model
The programmer’s model is shown in Figure 2-1 and
consists of 16x16-bit working registers (W0 through
W15), 2x40-bit accumulators (AccA and AccB),
STATUS register (SR), Data Table Page register
(TBLPAG), Program Space Visibility Page register
(PSVPAG), DO and REPEAT registers (DOSTART,
DOEND, DCOUNT and RCOUNT), and Program
Counter (PC). The working registers can act as data,
address or offset registers. All registers are memory
mapped. W0 acts as the W register for file register
addressing.
Some of these registers have a shadow register associated with each of them, as shown in Figure 2-1. The
shadow register is used as a temporary holding register
and can transfer its contents to or from its host register
upon the occurrence of an event. None of the shadow
registers are accessible directly. The following rules
apply for transfer of registers into and out of shadows.
• PUSH.S and POP.S
W0, W1, W2, W3, SR (DC, N, OV, Z and C bits
only) are transferred.
• DO instruction
DOSTART, DOEND, DCOUNT shadows are
pushed on loop start and popped on loop end.
When a byte operation is performed on a working
register, only the Least Significant Byte of the target
register is affected. However, a benefit of memory
mapped working registers is that both the Least and
Most Significant Bytes can be manipulated through
byte-wide data memory space accesses.
2.2.1
SOFTWARE STACK POINTER/
FRAME POINTER
The dsPIC® DSC devices contain a software stack.
W15 is the dedicated Software Stack Pointer (SP), and
will be automatically modified by exception processing
and subroutine calls and returns. However, W15 can
be referenced by any instruction in the same manner
as all other W registers. This simplifies the reading,
writing and manipulation of the Stack Pointer (e.g., creating stack frames).
Note:
In order to protect against misaligned
stack accesses, W15<0> is always clear.
W15 is initialized to 0x0800 during a Reset. The user
may reprogram the SP during initialization to any
location within data space.
W14 has been dedicated as a Stack Frame Pointer as
defined by the LNK and ULNK instructions. However,
W14 can be referenced by any instruction in the same
manner as all other W registers.
2.2.2
STATUS REGISTER
The dsPIC DSC core has a 16-bit STATUS register
(SR), the LSB of which is referred to as the SR Low
Byte (SRL) and the MSB as the SR High Byte (SRH).
See Figure 2-1 for SR layout.
SRL contains all the MCU ALU operation status flags
(including the Z bit), as well as the CPU Interrupt Priority Level Status bits, IPL<2:0>, and the Repeat Active
Status bit, RA. During exception processing, SRL is
concatenated with the MSB of the PC to form a
complete word value which is then stacked.
The upper byte of the SR register contains the DSP
adder/subtractor Status bits, the DO Loop Active bit
(DA) and the Digit Carry (DC) Status bit.
2.2.3
PROGRAM COUNTER
The Program Counter is 23 bits wide. Bit 0 is always
clear. Therefore, the PC can address up to 4M
instruction words.
DS70150B-page 14
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 2-1:
dsPIC30F6010A/6015 PROGRAMMER’S MODEL
D15
D0
W0/WREG
PUSH.S Shadow
W1
DO Shadow
W2
W3
Legend
W4
DSP Operand
Registers
W5
W6
W7
Working Registers
W8
W9
DSP Address
Registers
W10
W11
W12/DSP Offset
W13/DSP Write-Back
W14/Frame Pointer
W15/Stack Pointer
SPLIM
AD39
Stack Pointer Limit Register
AD15
AD31
AD0
AccA
DSP
Accumulators
AccB
PC22
PC0
Program Counter
0
0
7
TABPAG
TBLPAG
7
Data Table Page Address
0
PSVPAG
Program Space Visibility Page Address
15
0
RCOUNT
REPEAT Loop Counter
15
0
DCOUNT
DO Loop Counter
22
0
DOSTART
DO Loop Start Address
DOEND
DO Loop End Address
22
15
0
Core Configuration Register
CORCON
OA
OB
SA
SB OAB SAB DA
SRH
© 2006 Microchip Technology Inc.
DC IPL2 IPL1 IPL0 RA
N
OV
Z
C
STATUS Register
SRL
DS70150B-page 15
dsPIC30F6010A/6015
2.3
Divide Support
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and
16/16-bit signed and unsigned integer divide operations, in the form of single instruction iterative divides.
The following instructions and data sizes are
supported:
1.
2.
3.
4.
5.
DIVF – 16/16 signed fractional divide
DIV.sd – 32/16 signed divide
DIV.ud – 32/16 unsigned divide
DIV.s – 16/16 signed divide
DIV.u – 16/16 unsigned divide
TABLE 2-1:
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g., a
series of discrete divide instructions) will not function
correctly because the instruction flow depends on
RCOUNT. The divide instruction does not automatically
set up the RCOUNT value, and it must, therefore, be
explicitly and correctly specified in the REPEAT instruction, as shown in Table 2-1 (REPEAT will execute the target instruction {operand value + 1} times). The REPEAT
loop count must be set up for 18 iterations of the DIV/
DIVF instruction. Thus, a complete divide operation
requires 19 cycles.
Note:
The divide flow is interruptible. However,
the user needs to save the context as
appropriate.
DIVIDE INSTRUCTIONS
Instruction
Function
DIVF
Signed fractional divide: Wm/Wn → W0; Rem → W1
DIV.sd
Signed divide: (Wm+1:Wm)/Wn → W0; Rem → W1
DIV.s
Signed divide: Wm/Wn → W0; Rem → W1
DIV.ud
Unsigned divide: (Wm+1:Wm)/Wn → W0; Rem → W1
DIV.u
Unsigned divide: Wm/Wn → W0; Rem → W1
2.4
DSP Engine
The DSP engine consists of a high-speed 17-bit x
17-bit multiplier, a barrel shifter, and a 40-bit adder/subtractor (with two target accumulators, round and
saturation logic).
The dsPIC30F devices have a single instruction flow
which can execute either DSP or MCU instructions.
Many of the hardware resources are shared between
the DSP and MCU instructions. For example, the
instruction set has both DSP and MCU multiply
instructions which use the same hardware multiplier.
The DSP engine also has the capability to perform inherent accumulator-to-accumulator operations, which
require no additional data. These instructions are ADD,
SUB and NEG.
A block diagram of the DSP engine is shown in
Figure 2-2.
TABLE 2-2:
Instruction
DSP INSTRUCTION
SUMMARY
Algebraic Operation
CLR
A=0
ED
A = (x – y)2
EDAC
MAC
MOVSAC
MPY
MPY.N
MSC
A = A + (x – y)2
A = A + (x * y)
No change in A
A=x*y
A=–x*y
A=A–x*y
The DSP engine has various options selected through
various bits in the CPU Core Configuration register
(CORCON), as listed below:
1.
2.
3.
4.
5.
6.
7.
Fractional or Integer DSP Multiply (IF).
Signed or Unsigned DSP Multiply (US).
Conventional or Convergent Rounding (RND).
Automatic Saturation On/Off for AccA (SATA).
Automatic Saturation On/Off for AccB (SATB).
Automatic Saturation On/Off for Writes to Data
Memory (SATDW).
Accumulator Saturation mode Selection
(ACCSAT).
Note:
For CORCON layout, see Table 3-3.
DS70150B-page 16
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 2-2:
DSP ENGINE BLOCK DIAGRAM
40
S
a
40 Round t 16
u
Logic r
a
t
e
40-bit Accumulator A
40-bit Accumulator B
Carry/Borrow Out
Carry/Borrow In
Saturate
Adder
Negate
40
40
40
16
X Data Bus
Barrel
Shifter
40
Y Data Bus
Sign-Extend
32
16
Zero Backfill
32
33
17-bit
Multiplier/Scaler
16
16
To/From W Array
© 2006 Microchip Technology Inc.
DS70150B-page 17
dsPIC30F6010A/6015
2.4.1
MULTIPLIER
The 17x17-bit multiplier is capable of signed or
unsigned operations and can multiplex its output using
a scaler to support either 1.31 fractional (Q31) or 32-bit
integer results. Unsigned operands are zero-extended
into the 17th bit of the multiplier input value. Signed
operands are sign-extended into the 17th bit of the multiplier input value. The output of the 17x17-bit multiplier/
scaler is a 33-bit value, which is sign-extended to
40 bits. Integer data is inherently represented as a
signed two’s complement value, where the MSB is
defined as a sign bit. Generally speaking, the range of
an N-bit two’s complement integer is -2N-1 to 2N-1 – 1.
For a 16-bit integer, the data range is -32768 (0x8000)
to 32767 (0x7FFF), including 0. For a 32-bit integer, the
data range is -2,147,483,648 (0x8000 0000) to
2,147,483,645 (0x7FFF FFFF).
When the multiplier is configured for fractional multiplication, the data is represented as a two’s complement
fraction, where the MSB is defined as a sign bit and the
radix point is implied to lie just after the sign bit
(QX format). The range of an N-bit two’s complement
fraction with this implied radix point is -1.0 to (1-21-N).
For a 16-bit fraction, the Q15 data range is -1.0
(0x8000) to 0.999969482 (0x7FFF), including 0 and
has a precision of 3.01518x10-5. In Fractional mode, a
16x16 multiply operation generates a 1.31 product,
which has a precision of 4.65661x10-10.
The same multiplier is used to support the MCU multiply instructions, which include integer 16-bit signed,
unsigned and mixed sign multiplies.
2.4.2.1
The adder/subtractor is a 40-bit adder with an optional
zero input into one side and either true or complement
data into the other input. In the case of addition, the
carry/borrow input is active-high and the other input is
true data (not complemented), whereas in the case of
subtraction, the carry/borrow input is active-low and the
other input is complemented. The adder/subtractor
generates Overflow Status bits, SA/SB and OA/OB,
which are latched and reflected in the STATUS register.
• Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
• Overflow into guard bits 32 through 39: this is a
recoverable overflow. This bit is set whenever all
the guard bits are not identical to each other.
The adder has an additional saturation block which
controls accumulator data saturation, if selected. It
uses the result of the adder, the Overflow Status bits
described above, and the SATA/B (CORCON<7:6>)
and ACCSAT (CORCON<4>) mode control bits to
determine when and to what value to saturate.
Six STATUS register bits have been provided to
support saturation and overflow. They are:
1.
2.
3.
The MUL instruction may be directed to use byte or
word-sized operands. Byte operands will direct a 16-bit
result, and word operands will direct a 32-bit result to
the specified register(s) in the W array.
2.4.2
DATA ACCUMULATORS AND
ADDER/SUBTRACTOR
The data accumulator consists of a 40-bit adder/subtractor with automatic sign extension logic. It can select
one of two accumulators (A or B) as its preaccumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be
accumulated or loaded can be optionally scaled via the
barrel shifter, prior to accumulation.
DS70150B-page 18
Adder/Subtractor, Overflow and
Saturation
4.
5.
6.
OA:
AccA overflowed into guard bits
OB:
AccB overflowed into guard bits
SA:
AccA saturated (bit 31 overflow and saturation)
or
AccA overflowed into guard bits and saturated
(bit 39 overflow and saturation)
SB:
AccB saturated (bit 31 overflow and saturation)
or
AccB overflowed into guard bits and saturated
(bit 39 overflow and saturation)
OAB:
Logical OR of OA and OB
SAB:
Logical OR of SA and SB
The OA and OB bits are modified each time data passes
through the adder/subtractor. When set, they indicate
that the most recent operation has overflowed into the
accumulator guard bits (bits 32 through 39). The OA and
OB bits can also optionally generate an arithmetic warning trap when set and the corresponding overflow trap
flag enable bit (OVATE, OVBTE) in the INTCON1 register (refer to Section 5.0 “Interrupts”) is set. This allows
the user to take immediate action, for example, to correct
system gain.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
The SA and SB bits are modified each time data passes
through the adder/subtractor, but can only be cleared by
the user. When set, they indicate that the accumulator
has overflowed its maximum range (bit 31 for 32-bit
saturation, or bit 39 for 40-bit saturation) and will be
saturated if saturation is enabled. When saturation is not
enabled, SA and SB default to bit 39 overflow and thus
indicate that a catastrophic overflow has occurred. If the
COVTE bit in the INTCON1 register is set, SA and SB
bits will generate an arithmetic warning trap when
saturation is disabled.
The Overflow and Saturation Status bits can optionally
be viewed in the STATUS register (SR) as the logical
OR of OA and OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). This allows programmers to check
one bit in the STATUS register to determine if either
accumulator has overflowed, or one bit to determine if
either accumulator has saturated. This would be useful
for complex number arithmetic which typically uses
both the accumulators.
The device supports three Saturation and Overflow
modes.
1.
2.
3.
Bit 39 Overflow and Saturation:
When bit 39 overflow and saturation occurs, the
saturation logic loads the maximally positive 9.31
(0x7FFFFFFFFF) or maximally negative 9.31
value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until
cleared by the user. This is referred to as ‘super
saturation’ and provides protection against erroneous data or unexpected algorithm problems
(e.g., gain calculations).
Bit 31 Overflow and Saturation:
When bit 31 overflow and saturation occurs, the
saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF) or maximally
negative 1.31 value (0x0080000000) into the
target accumulator. The SA or SB bit is set and
remains set until cleared by the user. When this
Saturation mode is in effect, the guard bits are not
used so the OA, OB or OAB bits are never set.
Bit 39 Catastrophic Overflow
The bit 39 Overflow Status bit from the adder is
used to set the SA or SB bit, which remain set
until cleared by the user. No saturation operation is performed and the accumulator is allowed
to overflow (destroying its sign). If the COVTE
bit in the INTCON1 register is set, a catastrophic
overflow can initiate a trap exception.
© 2006 Microchip Technology Inc.
2.4.2.2
Accumulator ‘Write-Back’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the accumulator that is not targeted by the instruction
into data space memory. The write is performed across
the X bus into combined X and Y address space. The
following addressing modes are supported:
1.
2.
W13, Register Direct:
The rounded contents of the non-target
accumulator are written into W13 as a 1.15
fraction.
[W13]+ = 2, Register Indirect with Post-Increment:
The rounded contents of the non-target accumulator are written into the address pointed to
by W13 as a 1.15 fraction. W13 is then
incremented by 2 (for a word write).
2.4.2.3
Round Logic
The round logic is a combinational block, which performs a conventional (biased) or convergent (unbiased)
round function during an accumulator write (store). The
Round mode is determined by the state of the RND bit
in the CORCON register. It generates a 16-bit, 1.15
data value which is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the least
significant word is simply discarded.
Conventional rounding takes bit 15 of the accumulator,
zero-extends it and adds it to the ACCxH word (bits 16
through 31 of the accumulator). If the ACCxL word (bits
0 through 15 of the accumulator) is between 0x8000
and 0xFFFF (0x8000 included), ACCxH is incremented. If ACCxL is between 0x0000 and 0x7FFF,
ACCxH is left unchanged. A consequence of this algorithm is that over a succession of random rounding
operations, the value will tend to be biased slightly
positive.
Convergent (or unbiased) rounding operates in the
same manner as conventional rounding, except when
ACCxL equals 0x8000. If this is the case, the LSb
(bit 16 of the accumulator) of ACCxH is examined. If it
is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not
modified. Assuming that bit 16 is effectively random in
nature, this scheme will remove any rounding bias that
may accumulate.
The SAC and SAC.R instructions store either a truncated (SAC) or rounded (SAC.R) version of the contents
of the target accumulator to data memory, via the X bus
(subject to data saturation, see Section 2.4.2.4 “Data
Space Write Saturation”). Note that for the MAC class
of instructions, the accumulator write-back operation
will function in the same manner, addressing combined
MCU (X and Y) data space though the X bus. For this
class of instructions, the data is always subject to
rounding.
DS70150B-page 19
dsPIC30F6010A/6015
2.4.2.4
Data Space Write Saturation
2.4.3
BARREL SHIFTER
In addition to adder/subtractor saturation, writes to data
space may also be saturated, but without affecting the
contents of the source accumulator. The data space
write saturation logic block accepts a 16-bit, 1.15
fractional value from the round logic block as its input,
together with overflow status from the original source
(accumulator) and the 16-bit round adder. These are
combined and used to select the appropriate 1.15
fractional value as output to write to data space
memory.
The barrel shifter is capable of performing up to 16-bit
arithmetic or logic right shifts, or up to 16-bit left shifts
in a single cycle. The source can be either of the two
DSP accumulators or the X bus (to support multi-bit
shifts of register or memory data).
If the SATDW bit in the CORCON register is set, data
(after rounding or truncation) is tested for overflow and
adjusted accordingly. For input data greater than
0x007FFF, data written to memory is forced to the maximum positive 1.15 value, 0x7FFF. For input data less
than 0xFF8000, data written to memory is forced to the
maximum negative 1.15 value, 0x8000. The MSb of the
source (bit 39) is used to determine the sign of the
operand being tested.
The barrel shifter is 40 bits wide, thereby obtaining a
40-bit result for DSP shift operations and a 16-bit result
for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 to
31 for right shifts, and bit positions 0 to 15 for left shifts.
The shifter requires a signed binary value to determine
both the magnitude (number of bits) and direction of the
shift operation. A positive value will shift the operand
right. A negative value will shift the operand left. A
value of ‘0’ will not modify the operand.
If the SATDW bit in the CORCON register is not set, the
input data is always passed through unmodified under
all conditions.
DS70150B-page 20
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
3.0
MEMORY ORGANIZATION
FIGURE 3-1:
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
Reset – GOTO Instruction
Reset – Target Address
000000
000002
000004
Vector Tables
Interrupt Vector Table
Program Address Space
The program address space is 4M instruction words. It
is addressable by the 23-bit PC, table instruction
Effective Address (EA), or data space EA, when
program space is mapped into data space, as defined
by Table 3-1. Note that the program space address is
incremented by two between successive program
words, in order to provide compatibility with data space
addressing.
User Memory
Space
3.1
PROGRAM SPACE
MEMORY MAP FOR
dsPIC30F6010A/6015
User program space access is restricted to the lower
4M instruction word address range (0x000000 to
0x7FFFFE), for all accesses other than TBLRD/TBLWT,
which use TBLPAG<7> to determine user or configuration space access. In Table 3-1, read/write instructions,
bit 23 allows access to the device ID, the user ID and
the Configuration bits. Otherwise, bit 23 is always clear.
Reserved
Alternate Vector Table
User Flash
Program Memory
(48K instructions)
Reserved
(Read ‘0’s)
00007E
000080
000084
0000FE
000100
017FFE
018000
7FEFFE
7FF000
Data EEPROM
(4 Kbytes)
7FFFFE
800000
Configuration Memory
Space
Reserved
UNITID (32 instr.)
8005BE
8005C0
8005FE
800600
Reserved
Device Configuration
Registers
F7FFFE
F80000
F8000E
F80010
Reserved
DEVID (2)
© 2006 Microchip Technology Inc.
FEFFFE
FF0000
FFFFFE
DS70150B-page 21
dsPIC30F6010A/6015
TABLE 3-1:
PROGRAM SPACE ADDRESS CONSTRUCTION
Access
Space
Access Type
Instruction Access
TBLRD/TBLWT
TBLRD/TBLWT
Program Space Visibility
FIGURE 3-2:
User
User
(TBLPAG<7> = 0)
Configuration
(TBLPAG<7> = 1)
User
Program Space Address
<23>
<22:16>
<15>
<14:1>
0
PC<22:1>
TBLPAG<7:0>
Data EA <15:0>
TBLPAG<7:0>
0
<0>
0
Data EA <15:0>
PSVPAG<7:0>
Data EA <14:0>
DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
23 bits
Using
Program
Counter
Program Counter
0
Select
Using
Program
Space
Visibility
0
1
0
EA
PSVPAG Reg
8 bits
15 bits
EA
Using
Table
Instruction
1/0
TBLPAG Reg
8 bits
User/
Configuration
Space
Select
16 bits
24-bit EA
Byte
Select
Note: Program Space Visibility cannot be used to access bits <23:16> of a word in program memory.
DS70150B-page 22
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
3.1.1
DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
A set of table instructions are provided to move byte or
word-sized data to and from program space.
1.
This architecture fetches 24-bit wide program memory.
Consequently, instructions are always aligned. However, as the architecture is modified Harvard, data can
also be present in program space.
There are two methods by which program space can
be accessed; via special table instructions, or through
the remapping of a 16K word program space page into
the upper half of data space (see Section 3.1.2 “Data
Access From Program Memory Using Program
Space Visibility”). The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the least
significant word of any address within program space,
without going through data space. The TBLRDH and
TBLWTH instructions are the only method whereby the
upper 8 bits of a program space word can be accessed
as data.
2.
3.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two 16-bit
word-wide address spaces, residing side by side, each
with the same address range. TBLRDL and TBLWTL
access the space which contains the lsw, and TBLRDH
and TBLWTH access the space which contains the
MSB.
4.
TBLRDL: Table Read Low
Word: Read the least significant word of the
program address;
P<15:0> maps to D<15:0>.
Byte: Read one of the Least Significant Bytes of
the program address;
P<7:0> maps to the destination byte when byte
select = 0;
P<15:8> maps to the destination byte when byte
select = 1.
TBLWTL: Table Write Low (refer to Section 6.0
“Flash Program Memory” for details on Flash
Programming).
TBLRDH: Table Read High
Word: Read the most significant word of the
program address;
P<23:16> maps to D<7:0>; D<15:8> always
be = 0.
Byte: Read one of the Most Significant Bytes of
the program address;
P<23:16> maps to the destination byte when
byte select = 0;
The destination byte will always be = 0 when
byte select = 1.
TBLWTH: Table Write High (refer to Section 6.0
“Flash Program Memory” for details on Flash
Programming).
Figure 3-2 shows how the EA is created for table operations and data space accesses (PSV = 1). Here,
P<23:0> refers to a program space word, whereas
D<15:0> refers to a data space word.
FIGURE 3-3:
PROGRAM DATA TABLE ACCESS (LEAST SIGNIFICANT WORD)
PC Address
0x000000
0x000002
0x000004
0x000006
Program Memory
‘Phantom’ Byte
(Read as ‘0’).
© 2006 Microchip Technology Inc.
23
16
8
0
00000000
00000000
00000000
00000000
TBLRDL.W
TBLRDL.B (Wn<0> = 0)
TBLRDL.B (Wn<0> = 1)
DS70150B-page 23
dsPIC30F6010A/6015
FIGURE 3-4:
PROGRAM DATA TABLE ACCESS (MOST SIGNIFICANT BYTE)
TBLRDH.W
PC Address
0x000000
0x000002
0x000004
0x000006
23
16
8
0
00000000
00000000
00000000
00000000
TBLRDH.B (Wn<0> = 0)
Program Memory
‘Phantom’ Byte
(Read as ‘0’)
3.1.2
TBLRDH.B (Wn<0> = 1)
DATA ACCESS FROM PROGRAM
MEMORY USING PROGRAM
SPACE VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word program space page. This
provides transparent access of stored constant data
from X data space, without the need to use special
instructions (i.e., TBLRDL/H, TBLWTL/H instructions).
Program space access through the data space occurs
if the MSb of the data space EA is set and program
space visibility is enabled, by setting the PSV bit in the
Core Control register (CORCON). The functions of
CORCON are discussed in Section 2.4 “DSP
Engine”.
Data accesses to this area add an additional cycle to
the instruction being executed, since two program
memory fetches are required.
Note that the upper half of addressable data space is
always part of the X data space. Therefore, when a
DSP operation uses program space mapping to access
this memory region, Y data space should typically contain state (variable) data for DSP operations, whereas
X data space should typically contain coefficient
(constant) data.
Although each data space address, 0x8000 and higher,
maps directly into a corresponding program memory
address (see Figure 3-5), only the lower 16 bits of the
24-bit program word are used to contain the data. The
upper 8 bits should be programmed to force an illegal
instruction to maintain machine robustness. Refer
to the “dsPIC30F/33F Programmers Reference
Manual” (DS70157) for details on instruction encoding.
DS70150B-page 24
Note that by incrementing the PC by 2 for each
program memory word, the Least Significant 15 bits of
data space addresses directly map to the Least Significant 15 bits in the corresponding program space
addresses. The remaining bits are provided by the
Program
Space
Visibility
Page
register,
PSVPAG<7:0>, as shown in Figure 3-5.
Note:
PSV access is temporarily disabled during
table reads/writes.
For instructions that use PSV which are executed
outside a REPEAT loop:
• The following instructions will require one instruction cycle in addition to the specified execution
time:
- MAC class of instructions with data operand
prefetch
- MOV instructions
- MOV.D instructions
• All other instructions will require two instruction
cycles in addition to the specified execution time
of the instruction.
For instructions that use PSV which are executed
inside a REPEAT loop:
• The following instances will require two instruction
cycles in addition to the specified execution time
of the instruction:
- Execution in the first iteration
- Execution in the last iteration
- Execution prior to exiting the loop due to an
interrupt
- Execution upon re-entering the loop after an
interrupt is serviced
• Any other iteration of the REPEAT loop will allow
the instruction, accessing data using PSV, to
execute in a single cycle.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 3-5:
DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION
Data Space
Program Space
0x000100
0x0000
PSVPAG(1)
0x00
8
15
EA<15> = 0
Data
Space
EA
16
15
EA<15> = 1
0x8000
Address
15 Concatenation 23
23
15
0
0x001200
Upper half of Data
Space is mapped
into Program Space
0x017FFE
0xFFFF
BSET
MOV
MOV
MOV
CORCON,#2
#0x00, W0
W0, PSVPAG
0x9200, W0
; PSV bit set
; Set PSVPAG register
; Access program memory location
; using a data space access
Data Read
Note: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address
(i.e., it defines the page in program space to which the upper half of data space is being mapped).
3.2
Data Address Space
The core has two data spaces. The data spaces can be
considered either separate (for some DSP instructions), or as one unified linear address range (for MCU
instructions). The data spaces are accessed using two
Address Generation Units (AGUs) and separate data
paths.
3.2.1
DATA SPACE MEMORY MAP
The data space memory is split into two blocks, X and
Y data space. A key element of this architecture is that
Y space is a subset of X space, and is fully contained
within X space. In order to provide an apparent Linear
Addressing space, X and Y spaces have contiguous
addresses.
© 2006 Microchip Technology Inc.
When executing any instruction other than one of the
MAC class of instructions, the X block consists of the
64 Kbyte data address space (including all Y
addresses). When executing one of the MAC class of
instructions, the X block consists of the 64 Kbyte data
address space excluding the Y address block (for data
reads only). In other words, all other instructions regard
the entire data memory as one composite address
space. The MAC class instructions extract the Y
address space from data space and address it using
EAs sourced from W10 and W11. The remaining X
data space is addressed using W8 and W9. Both
address spaces are concurrently accessed only with
the MAC class instructions.
A data space memory map is shown in Figure 3-6.
Figure 3-7 shows a graphical summary of how X and Y
data spaces are accessed for MCU and DSP
instructions.
DS70150B-page 25
dsPIC30F6010A/6015
FIGURE 3-6:
dsPIC30F6010A/6015 DATA SPACE MEMORY MAP
Most Significant Byte
Address
MSB
2 Kbyte
SFR Space
0x0001
Least Significant Byte
Address
16 bits
LSB
0x0000
SFR Space
0x07FE
0x0800
0x07FF
0x0801
8 Kbyte
Near
Data
Space
X Data RAM (X)
8 Kbyte
SRAM Space
0x17FF
0x1801
0x17FE
0x1800
0x1FFF
0x1FFE
Y Data RAM (Y)
0x27FF
0x27FE
0x2801
0x2800
0x8001
0x8000
X Data
Unimplemented (X)
Optionally
Mapped
into Program
Memory
0xFFFF
DS70150B-page 26
0xFFFE
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE
SFR SPACE
SFR SPACE
X SPACE
FIGURE 3-7:
Y SPACE
UNUSED
X SPACE
(Y SPACE)
X SPACE
UNUSED
UNUSED
Non-MAC Class Ops (Read/Write)
MAC Class Ops (Write)
MAC Class Ops Read-Only
Indirect EA using any W
Indirect EA using W10, W11 Indirect EA using W8, W9
© 2006 Microchip Technology Inc.
DS70150B-page 27
dsPIC30F6010A/6015
3.2.2
DATA SPACES
3.2.3
The X data space is used by all instructions and supports all addressing modes. There are separate read
and write data buses. The X read data bus is the return
data path for all instructions that view data space as
combined X and Y address space. It is also the X
address space data path for the dual operand read
instructions (MAC class). The X write data bus is the
only write path to data space for all instructions.
The X data space also supports Modulo Addressing for
all instructions, subject to addressing mode restrictions. Bit-Reversed Addressing is only supported for
writes to X data space.
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED,
EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide two concurrent data read paths. No writes occur
across the Y bus. This class of instructions dedicates
two W register pointers, W10 and W11, to always
address Y data space, independent of X data space,
whereas W8 and W9 always address X data space.
Note that during accumulator write-back, the data
address space is considered a combination of X and Y
data spaces, so the write occurs across the X bus.
Consequently, the write can be to any address in the
entire data space.
The Y data space can only be used for the data
prefetch operation associated with the MAC class of
instructions. It also supports Modulo Addressing for
automated circular buffers. Of course, all other instructions can access the Y data address space through the
X data path, as part of the composite linear space.
The boundary between the X and Y data spaces is
defined as shown in Figure 3-6 and is not user programmable. Should an EA point to data outside its own
assigned address space, or to a location outside physical memory, an all-zero word/byte will be returned. For
example, although Y address space is visible by all
non-MAC instructions using any addressing mode, an
attempt by a MAC instruction to fetch data from that
space, using W8 or W9 (X space pointers), will return
0x0000.
TABLE 3-2:
EFFECT OF INVALID
MEMORY ACCESSES
Attempted Operation
Data Returned
EA = an unimplemented address
0x0000
W8 or W9 used to access Y data
space in a MAC instruction
0x0000
W10 or W11 used to access X
data space in a MAC instruction
0x0000
DATA SPACE WIDTH
The core data width is 16 bits. All internal registers are
organized as 16-bit wide words. Data space memory is
organized in byte addressable, 16-bit wide blocks.
3.2.4
DATA ALIGNMENT
To help maintain backward compatibility with
PICmicro® devices and improve data space memory
usage efficiency, the dsPIC30F instruction set supports
both word and byte operations. Data is aligned in data
memory and registers as words, but all data space EAs
resolve to bytes. Data byte reads will read the complete
word, which contains the byte, using the LSb of any EA
to determine which byte to select. The selected byte is
placed onto the LSB of the X data path (no byte
accesses are possible from the Y data path as the MAC
class of instruction can only fetch words). That is, data
memory and registers are organized as two parallel
byte wide entities with shared (word) address decode,
but separate write lines. Data byte writes only write to
the corresponding side of the array or register which
matches the byte address.
As a consequence of this byte accessibility, all Effective
Address calculations (including those generated by the
DSP operations, which are restricted to word-sized
data) are internally scaled to step through word-aligned
memory. For example, the core would recognize that
Post-Modified Register Indirect Addressing mode,
[Ws++], will result in a value of Ws + 1 for byte
operations and Ws + 2 for word operations.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported, so
care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. Should a
misaligned read or write be attempted, an address
error trap will be generated. If the error occurred on a
read, the instruction underway is completed, whereas if
it occurred on a write, the instruction will be executed
but the write will not occur. In either case, a trap will
then be executed, allowing the system and/or user to
examine the machine state prior to execution of the
address Fault.
FIGURE 3-8:
15
DATA ALIGNMENT
MSB
87
LSB
0
0001
Byte 1
Byte 0
0000
0003
Byte 3
Byte 2
0002
0005
Byte 5
Byte 4
0004
All Effective Addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes or 32K words.
DS70150B-page 28
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
A sign-extend (SE) instruction is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
zero-extend (ZE) instruction on the appropriate
address.
Although most instructions are capable of operating on
word or byte data sizes, it should be noted that some
instructions, including the DSP instructions, operate
only on words.
3.2.5
NEAR DATA SPACE
An 8 Kbyte ‘near’ data space is reserved in X address
memory space between 0x0000 and 0x1FFF, which is
directly addressable via a 13-bit absolute address field
within all memory direct instructions. The remaining X
address space and all of the Y address space is
addressable indirectly. Additionally, the whole of X data
space is addressable using MOV instructions, which
support memory direct addressing with a 16-bit
address field.
3.2.6
SOFTWARE STACK
The dsPIC DSC device contains a software stack. W15
is used as the Stack Pointer.
The Stack Pointer always points to the first available
free word and grows from lower addresses towards
higher addresses. It pre-decrements for stack pops and
post-increments for stack pushes, as shown in
Figure 3-9. Note that for a PC push during any CALL
instruction, the MSB of the PC is zero-extended before
the push, ensuring that the MSB is always clear.
Note:
A PC push during exception processing
will concatenate the SRL register to the
MSB of the PC prior to the push.
Similarly, a Stack Pointer underflow (stack error) trap is
generated when the Stack Pointer address is found to
be less than 0x0800, thus preventing the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
FIGURE 3-9:
CALL STACK FRAME
0x0000 15
Stack Grows Towards
Higher Address
All byte loads into any W register are loaded into the
LSB. The MSB is not modified.
0
PC<15:0>
000000000 PC<22:16>
<Free Word>
W15 (before CALL)
W15 (after CALL)
POP: [--W15]
PUSH: [W15++]
3.2.7
DATA RAM PROTECTION FEATURE
The dsPIC30F6010A/6015 devices support Data RAM
protection features which enable segments of RAM to
be protected when used in conjunction with Boot and
Secure Code Segment Security. BSRAM (Secure RAM
segment for BS) is accessible only from the Boot Segment Flash code when enabled. SSRAM (Secure RAM
segment for RAM) is accessible only from the Secure
Segment Flash code when enabled.
See Table 3-3 for an overview of the BSRAM and
SSRAM SFRs.
There is a Stack Pointer Limit register (SPLIM) associated with the Stack Pointer. SPLIM is uninitialized at
Reset. As is the case for the Stack Pointer, SPLIM<0>
is forced to ‘0’, because all stack operations must be
word-aligned. Whenever an Effective Address (EA) is
generated using W15 as a source or destination
pointer, the address thus generated is compared with
the value in SPLIM. If the contents of the Stack Pointer
(W15) and the SPLIM register are equal and a push
operation is performed, a stack error trap will not occur.
The stack error trap will occur on a subsequent push
operation. Thus, for example, if it is desirable to cause
a stack error trap when the stack grows beyond
address 0x2000 in RAM, initialize the SPLIM with the
value, 0x1FFE.
© 2006 Microchip Technology Inc.
DS70150B-page 29
SFR Name
CORE REGISTER MAP
Address
(Home)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
© 2006 Microchip Technology Inc.
W0
0000
W0 / WREG
0000 0000 0000 0000
W1
0002
W1
0000 0000 0000 0000
W2
0004
W2
0000 0000 0000 0000
W3
0006
W3
0000 0000 0000 0000
W4
0008
W4
0000 0000 0000 0000
W5
000A
W5
0000 0000 0000 0000
W6
000C
W6
0000 0000 0000 0000
W7
000E
W7
0000 0000 0000 0000
W8
0010
W8
0000 0000 0000 0000
W9
0012
W9
0000 0000 0000 0000
W10
0014
W10
0000 0000 0000 0000
W11
0016
W11
0000 0000 0000 0000
W12
0018
W12
0000 0000 0000 0000
W13
001A
W13
0000 0000 0000 0000
W14
001C
W14
0000 0000 0000 0000
W15
001E
W15
0000 1000 0000 0000
SPLIM
0020
SPLIM
0000 0000 0000 0000
ACCAL
0022
ACCAL
0000 0000 0000 0000
ACCAH
0024
ACCAH
ACCAU
0026
ACCBL
0028
ACCBL
ACCBH
002A
ACCBH
ACCBU
002C
PCL
002E
PCH
0030
—
—
—
—
—
—
—
—
TBLPAG
0032
—
—
—
—
—
—
—
—
TBLPAG
0000 0000 0000 0000
PSVPAG
0034
—
—
—
—
—
—
—
—
PSVPAG
0000 0000 0000 0000
RCOUNT
0036
RCOUNT
DCOUNT
0038
DCOUNT
DOSTARTL
003A
DOSTARTH
003C
DOENDL
003E
DOENDH
0040
0000 0000 0000 0000
Sign Extension (ACCA<39>)
ACCAU
0000 0000 0000 0000
0000 0000 0000 0000
Sign Extension (ACCB<39>)
ACCBU
0000 0000 0000 0000
PCL
0000 0000 0000 0000
—
PCH
uuuu uuuu uuuu uuuu
DOSTARTL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
0
uuuu uuuu uuuu uuu0
0
uuuu uuuu uuuu uuu0
DOSTARTH
DOENDL
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Legend: u = uninitialized bit
Note:
0000 0000 0000 0000
DOENDH
0000 0000 0uuu uuuu
0000 0000 0uuu uuuu
dsPIC30F6010A/6015
DS70150B-page 30
TABLE 3-3:
© 2006 Microchip Technology Inc.
TABLE 3-3:
CORE REGISTER MAP (CONTINUED)
Address
(Home)
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
SR
0042
OA
OB
SA
SB
OAB
SAB
DA
DC
IPL2
IPL1
IPL0
RA
N
OV
Z
C
0000 0000 0000 0000
CORCON
0044
—
—
—
US
EDT
DL2
DL1
DL0
SATA
SATB
IPL3
PSV
RND
IF
MODCON
0046
—
—
SFR Name
XMODEN YMODEN
BWM<3:0>
SATDW ACCSAT
YWM<3:0>
XWM<3:0>
0000 0000 0010 0000
0000 0000 0000 0000
XMODSRT
0048
XS<15:1>
0
uuuu uuuu uuuu uuu0
XMODEND
004A
XE<15:1>
1
uuuu uuuu uuuu uuu1
YMODSRT
004C
YS<15:1>
0
uuuu uuuu uuuu uuu0
YMODEND
004E
YE<15:1>
1
uuuu uuuu uuuu uuu1
XBREV
0050
BREN
DISICNT
0052
—
—
BSRAM
0750
—
—
—
—
—
—
—
—
—
—
—
—
—
IW_BSR IR_BSR RL_BSR 0000 0000 0000 0000
SSRAM
0752
—
—
—
—
—
—
—
—
—
—
—
—
—
IW_SSR IR_SSR RL_SSR 0000 0000 0000 0000
XB<14:0>
uuuu uuuu uuuu uuuu
DISICNT<13:0>
0000 0000 0000 0000
Legend: u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F6010A/6015
DS70150B-page 31
dsPIC30F6010A/6015
NOTES:
DS70150B-page 32
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
4.0
ADDRESS GENERATOR UNITS
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
The dsPIC DSC core contains two independent
Address Generator Units (AGU): the X AGU and Y
AGU. The Y AGU supports word-sized data reads for
the DSP MAC class of instructions only. The dsPIC DSC
AGUs support three types of data addressing:
Linear and Modulo Data Addressing modes can be
applied to data space or program space. Bit-Reversed
Addressing mode is only applicable to data space
addresses.
Instruction Addressing Modes
The addressing modes in Table 4-1 form the basis of
the addressing modes optimized to support the specific
features of individual instructions. The addressing
modes provided in the MAC class of instructions are
somewhat different from those in the other instruction
types.
TABLE 4-1:
FILE REGISTER INSTRUCTIONS
Most file register instructions use a 13-bit address field
(f) to directly address data present in the first
8192 bytes of data memory (near data space). Most file
register instructions employ a working register W0,
which is denoted as WREG in these instructions. The
destination is typically either the same file register, or
WREG (with the exception of the MUL instruction),
which writes the result to a register or register pair. The
MOV instruction allows additional flexibility and can
access the entire data space during file register
operation.
4.1.2
MCU INSTRUCTIONS
The three-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
• Linear Addressing
• Modulo (Circular) Addressing
• Bit-Reversed Addressing
4.1
4.1.1
where Operand 1 is always a working register (i.e., the
addressing mode can only be Register Direct), which is
referred to as Wb. Operand 2 can be a W register,
fetched from data memory, or a 5-bit literal. The result
location can be either a W register or an address
location. The following addressing modes are
supported by MCU instructions:
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
5-bit or 10-bit Literal
Note:
Not all instructions support all the addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
FUNDAMENTAL ADDRESSING MODES SUPPORTED
Addressing Mode
File Register Direct
Description
The address of the file register is specified explicitly.
Register Direct
The contents of a register are accessed directly.
Register Indirect
The contents of Wn forms the EA.
Register Indirect Post-Modified
The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-Modified
Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset
© 2006 Microchip Technology Inc.
The sum of Wn and a literal forms the EA.
DS70150B-page 33
dsPIC30F6010A/6015
4.1.3
MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP Accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
addressing modes supported by most MCU instructions, Move and Accumulator instructions also support
Register Indirect with Register Offset Addressing
mode, also referred to as Register Indexed mode.
Note:
For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA. However, the 4-bit Wb (Register Offset) field is
shared between both source and
destination (but typically only used by
one).
In summary, the following addressing modes are
supported by Move and Accumulator instructions:
•
•
•
•
•
•
•
•
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
Register Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-bit Literal
16-bit Literal
Note:
4.1.4
Not all instructions support all the addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to as MAC instructions, utilize a simplified set of
addressing modes to allow the user to effectively
manipulate the data pointers through Register Indirect
tables.
The two source operand prefetch registers must be a
member of the set {W8, W9, W10, W11}. For data reads,
W8 and W9 will always be directed to the X RAGU and
W10 and W11 will always be directed to the Y AGU. The
Effective Addresses generated (before and after modification) must, therefore, be valid addresses within X data
space for W8 and W9 and Y data space for W10 and
W11.
Note:
Register Indirect with Register Offset
Addressing is only available for W9 (in X
space) and W11 (in Y space).
DS70150B-page 34
In summary, the following addressing modes are
supported by the MAC class of instructions:
•
•
•
•
•
Register Indirect
Register Indirect Post-Modified by 2
Register Indirect Post-Modified by 4
Register Indirect Post-Modified by 6
Register Indirect with Register Offset (Indexed)
4.1.5
OTHER INSTRUCTIONS
Besides the various addressing modes outlined above,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit
signed literals to specify the branch destination directly,
whereas the DISI instruction uses a 14-bit unsigned
literal field. In some instructions, such as ADD Acc, the
source of an operand or result is implied by the opcode
itself. Certain operations, such as NOP, do not have any
operands.
4.2
Modulo Addressing
Modulo Addressing is a method of providing an
automated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or
program space (since the data pointer mechanism is
essentially the same for both). One circular buffer can be
supported in each of the X (which also provides the
pointers into program space) and Y data spaces.
Modulo Addressing can operate on any W register
pointer. However, it is not advisable to use W14 or W15
for Modulo Addressing, since these two registers are
used as the Stack Frame Pointer and Stack Pointer,
respectively.
In general, any particular circular buffer can only be
configured to operate in one direction, as there are
certain restrictions on the buffer start address (for
incrementing buffers) or end address (for
decrementing buffers) based upon the direction of the
buffer.
The only exception to the usage restrictions is for
buffers which have a power-of-2 length. As these
buffers satisfy the start and end address criteria, they
may operate in a Bidirectional mode, (i.e., address
boundary checks will be performed on both the lower
and upper address boundaries).
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
4.2.1
START AND END ADDRESS
4.2.2
The Modulo Addressing scheme requires that a
starting and an ending address be specified and
loaded into the 16-bit Modulo Buffer Address registers:
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Table 3-3).
Note:
Y space Modulo Addressing EA calculations assume word-sized data (LSb of
every EA is always clear).
The length of a circular buffer is not directly specified.
It is determined by the difference between the
corresponding start and end addresses. The maximum
possible length of the circular buffer is 32K words
(64 Kbytes).
W ADDRESS REGISTER
SELECTION
The Modulo and Bit-Reversed Addressing Control
register, MODCON<15:0>, contains enable flags, as
well as a W register field to specify the W Address
registers. The XWM and YWM fields select which
registers will operate with Modulo Addressing. If
XWM = 15, X RAGU and X WAGU Modulo Addressing
are disabled. Similarly, if YWM = 15, Y AGU Modulo
Addressing is disabled.
The X Address Space Pointer W register (XWM) to
which Modulo Addressing is to be applied, is stored in
MODCON<3:0> (see Table 3-3). Modulo Addressing is
enabled for X data space when XWM is set to any value
other than 15 and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM) to
which Modulo Addressing is to be applied, is stored in
MODCON<7:4>. Modulo Addressing is enabled for Y
data space when YWM is set to any value other than
15 and the YMODEN bit is set at MODCON<14>.
FIGURE 4-1:
MODULO ADDRESSING OPERATION EXAMPLE
Byte
Address
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
DO
MOV
AGAIN:
0x1100
#0x1100,W0
W0, XMODSRT
#0x1163,W0
W0,MODEND
#0x8001,W0
W0,MODCON
#0x0000,W0
#0x1110,W1
AGAIN,#0x31
W0, [W1++]
INC
W0,W0
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;W0 holds buffer fill value
;point W1 to buffer
;fill the 50 buffer locations
;fill the next location
;increment the fill value
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
© 2006 Microchip Technology Inc.
DS70150B-page 35
dsPIC30F6010A/6015
4.2.3
MODULO ADDRESSING
APPLICABILITY
Modulo Addressing can be applied to the Effective
Address (EA) calculation associated with any W
register. It is important to realize that the address
boundaries check for addresses less than or greater
than the upper (for incrementing buffers) and lower (for
decrementing buffers) boundary addresses (not just
equal to). Address changes may, therefore, jump
beyond boundaries and still be adjusted correctly.
Note:
4.3
The modulo corrected Effective Address is
written back to the register only when PreModify or Post-Modify Addressing mode is
used to compute the Effective Address.
When an address offset (e.g., [W7+W2]) is
used, Modulo Address correction is performed, but the contents of the register
remains unchanged.
Bit-Reversed Addressing
Bit-Reversed Addressing is intended to simplify data
re-ordering for radix-2 FFT algorithms. It is supported
by the X AGU for data writes only.
The modifier, which may be a constant value or register
contents, is regarded as having its bit order reversed.
The address source and destination are kept in normal
order. Thus, the only operand requiring reversal is the
modifier.
4.3.1
2.
3.
XB<14:0> is the Bit-Reversed Address modifier or
‘pivot point’ which is typically a constant. In the case of
an FFT computation, its value is equal to half of the FFT
data buffer size.
Note:
BWM (W register selection) in the MODCON register is any value other than 15 (the stack can not
be accessed using Bit-Reversed Addressing)
and
the BREN bit is set in the XBREV register and
the addressing mode used is Register Indirect
with Pre-Increment or Post-Increment.
FIGURE 4-2:
All Bit-Reversed EA calculations assume
word-sized data (LSb of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
When enabled, Bit-Reversed Addressing will only be
executed for Register Indirect with Pre-Increment or
Post-Increment Addressing and word-sized data writes.
It will not function for any other addressing mode or for
byte-sized data, and normal addresses will be generated instead. When Bit-Reversed Addressing is active,
the W Address Pointer will always be added to the
address modifier (XB) and the offset associated with the
Register Indirect Addressing mode will be ignored. In
addition, as word-sized data is a requirement, the LSb of
the EA is ignored (and always clear).
Note:
BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-Reversed Addressing is enabled when:
1.
If the length of a Bit-Reversed buffer is M = 2N bytes,
then the last ‘N’ bits of the data buffer start address
must be zeros.
Modulo Addressing and Bit-Reversed
Addressing should not be enabled
together. In the event that the user
attempts to do this, Bit-Reversed Addressing will assume priority when active for the
X WAGU, and X WAGU Modulo Addressing will be disabled. However, Modulo
Addressing will continue to function in the
X RAGU.
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, then a write to
the XBREV register should not be immediately followed
by an indirect read operation using the W register that
has been designated as the Bit-Reversed Pointer.
BIT-REVERSED ADDRESS EXAMPLE
Sequential Address
b15 b14 b13 b12 b11 b10 b9 b8
b7 b6 b5 b4
b3 b2 b1
0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
b15 b14 b13 b12 b11 b10 b9 b8
b7 b6 b5 b1
b2 b3 b4
0
Bit-Reversed Address
Pivot Point
XB = 0x0008 for a 16-word Bit-Reversed Buffer
DS70150B-page 36
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 4-2:
BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
Normal Address
Bit-Reversed Address
A3
A2
A1
A0
Decimal
A3
A2
A1
A0
Decimal
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
8
0
0
1
0
2
0
1
0
0
4
0
0
1
1
3
1
1
0
0
12
0
1
0
0
4
0
0
1
0
2
0
1
0
1
5
1
0
1
0
10
0
1
1
0
6
0
1
1
0
6
0
1
1
1
7
1
1
1
0
14
1
0
0
0
8
0
0
0
1
1
1
0
0
1
9
1
0
0
1
9
1
0
1
0
10
0
1
0
1
5
1
0
1
1
11
1
1
0
1
13
1
1
0
0
12
0
0
1
1
3
1
1
0
1
13
1
0
1
1
11
1
1
1
0
14
0
1
1
1
7
1
1
1
1
15
1
1
1
1
15
TABLE 4-3:
BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER
Buffer Size (Words)
XB<14:0> Bit-Reversed Address Modifier Value
4096
0x0800
2048
0x0400
1024
0x0200
512
0x0100
256
0x0080
128
0x0040
64
0x0020
32
0x0010
16
0x0008
8
0x0004
4
0x0002
2
0x0001
© 2006 Microchip Technology Inc.
DS70150B-page 37
dsPIC30F6010A/6015
NOTES:
DS70150B-page 38
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
5.0
INTERRUPTS
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
• INTTREG<15:0>
The associated interrupt vector number and the
new CPU interrupt priority level are latched into
Vector number (VECNUM<5:0>) and Interrupt
level ILR<3:0> bit fields in the INTTREG register.
The new interrupt priority level is the priority of the
pending interrupt.
Note:
The dsPIC30F6010A/6015 has 44 interrupt sources
and four processor exceptions (traps), which must be
arbitrated based on a priority scheme.
The CPU is responsible for reading the Interrupt
Vector Table (IVT) and transferring the address contained in the interrupt vector to the program counter.
The interrupt vector is transferred from the program
data bus into the program counter, via a 24-bit wide
multiplexer on the input of the program counter.
The Interrupt Vector Table (IVT) and Alternate Interrupt Vector Table (AIVT) are placed near the beginning of program memory (0x000004). The IVT and
AIVT are shown in Figure 5-1.
The interrupt controller is responsible for preprocessing the interrupts and processor exceptions,
prior to their being presented to the processor core.
The peripheral interrupts and traps are enabled,
prioritized and controlled using centralized Special
Function Registers:
• IFS0<15:0>, IFS1<15:0>, IFS2<15:0>
All Interrupt Request Flags are maintained in
these three registers. The flags are set by their
respective peripherals or external signals, and
they are cleared via software.
• IEC0<15:0>, IEC1<15:0>, IEC2<15:0>
All Interrupt Enable Control bits are maintained in
these three registers. These control bits are used
to individually enable interrupts from the
peripherals or external signals.
• IPC0<15:0>... IPC11<7:0>
The user assignable priority level associated with
each of these 44 interrupts is held centrally in
these twelve registers.
• IPL<3:0>
The current CPU priority level is explicitly stored
in the IPL bits. IPL<3> is present in the CORCON
register, whereas IPL<2:0> are present in the
STATUS register (SR) in the processor core.
• INTCON1<15:0>, INTCON2<15:0>
Global interrupt control functions are derived from
these two registers. INTCON1 contains the control and status flags for the processor exceptions.
The INTCON2 register controls the external
interrupt request signal behavior and the use of
the alternate vector table.
© 2006 Microchip Technology Inc.
Interrupt flag bits get set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an
interrupt.
All interrupt sources can be user assigned to one of
seven priority levels, 1 through 7, via the IPCx
registers. Each interrupt source is associated with an
interrupt vector, as shown in Table 5-1. Levels 7 and 1
represent the highest and lowest maskable priorities,
respectively.
Note:
Assigning a priority level of 0 to an interrupt source is equivalent to disabling that
interrupt.
If the NSTDIS bit (INTCON1<15>) is set, nesting of
interrupts is prevented. Thus, if an interrupt is currently
being serviced, processing of a new interrupt is prevented, even if the new interrupt is of higher priority
than the one currently being serviced.
Note:
The IPL bits become read-only whenever
the NSTDIS bit has been set to ‘1’.
Certain interrupts have specialized control bits for
features like edge or level triggered interrupts, interrupt-on-change, etc. Control of these features remains
within the peripheral module which generates the
interrupt.
The DISI instruction can be used to disable the
processing of interrupts of priorities 6 and lower for a
certain number of instructions, during which the DISI bit
(INTCON2<14>) remains set.
When an interrupt is serviced, the PC is loaded with the
address stored in the vector location in program
memory that corresponds to the interrupt. There are 63
different vectors within the IVT (refer to Figure 5-2).
These vectors are contained in locations 0x000004
through 0x0000FE of program memory (refer to
Figure 5-2). These locations contain 24-bit addresses,
and in order to preserve robustness, an address error
trap will take place should the PC attempt to fetch any
of these words during normal execution. This prevents
execution of random data as a result of accidentally
decrementing a PC into vector space, accidentally
mapping a data space address into vector space, or the
PC rolling over to 0x000000 after reaching the end of
implemented program memory space. Execution of a
GOTO instruction to this vector space will also generate
an address error trap.
DS70150B-page 39
dsPIC30F6010A/6015
5.1
Interrupt Priority
The user assignable Interrupt Priority (IP<2:0>) bits
for each individual interrupt source are located in the
Least Significant 3 bits of each nibble within the IPCx
register(s). Bit 3 of each nibble is not used and is read
as a ‘0’. These bits define the priority level assigned
to a particular interrupt by the user.
Note:
The user selectable priority levels start at
0, as the lowest priority and level 7, as the
highest priority.
Since more than one interrupt request source may be
assigned to a specific user-specified priority level, a
means is provided to assign priority within a given level.
This method is called “Natural Order Priority”.
Natural Order Priority is determined by the position of
an interrupt in the vector table, and only affects
interrupt operation when multiple interrupts with the
same user-assigned priority become pending at the
same time.
Table 5-1 lists the interrupt numbers and interrupt
sources for the dsPIC DSC devices and their associated
vector numbers.
Note 1: The Natural Order Priority scheme has 0
as the highest priority and 53 as the
lowest priority.
2: The Natural Order Priority number is the
same as the INT number.
The ability for the user to assign every interrupt to one
of seven priority levels means that the user can assign
a very high overall priority level to an interrupt with a
low natural order priority.
DS70150B-page 40
TABLE 5-1:
INT
Number
INTERRUPT VECTOR TABLE
Vector
Number
Interrupt Source
Highest Natural Order Priority
0
8
INT0 – External Interrupt 0
1
2
3
4
5
6
9
10
11
12
13
14
IC1 – Input Capture 1
OC1 – Output Compare 1
T1 – Timer1
IC2 – Input Capture 2
OC2 – Output Compare 2
T2 – Timer2
7
15
T3 – Timer3
8
16
SPI1
9
17
U1RX – UART1 Receiver
10
18
U1TX – UART1 Transmitter
11
19
ADC – ADC Convert Done
12
20
NVM - NVM Write Complete
13
21
SI2C – I2C™ Slave Interrupt
14
22
MI2C – I2C Master Interrupt
15
23
Input Change Interrupt
16
24
INT1 – External Interrupt 1
17
25
IC7 – Input Capture 7
18
26
IC8 – Input Capture 8
19
27
OC3 – Output Compare 3
20
28
OC4 – Output Compare 4
21
29
T4 – Timer4
22
30
T5 – Timer5
23
31
INT2 – External Interrupt 2
24
32
U2RX – UART2 Receiver
25
33
U2TX – UART2 Transmitter
26
34
SPI2
27
35
C1 – Combined IRQ for CAN1
28
36
IC3 – Input Capture 3
29
37
IC4 – Input Capture 4
30
38
IC5 – Input Capture 5
31
39
IC6 – Input Capture 6
32
40
OC5 – Output Compare 5
33
41
OC6 – Output Compare 6
34
42
OC7 – Output Compare 7
35
43
OC8 – Output Compare 8
36
44
INT3 – External Interrupt 3
37
45
INT4 - External Interrupt 4
38
46
C2 – Combined IRQ for CAN2
39
47
PWM – PWM Period Match
40
48
QEI – QEI Interrupt
41
49
Reserved
42
50
Reserved
43
51
FLTA – PWM Fault A
44
52
FLTB – PWM Fault B
45-53
53-61 Reserved
Lowest Natural Order Priority
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
5.2
Reset Sequence
A Reset is not a true exception because the interrupt
controller is not involved in the Reset process. The processor initializes its registers in response to a Reset
which forces the PC to zero. The processor then begins
program execution at location 0x000000. A GOTO
instruction is stored in the first program memory location, immediately followed by the address target for the
GOTO instruction. The processor executes the GOTO to
the specified address and then begins operation at the
specified target (start) address.
5.2.1
5.3
Traps
Traps can be considered as non-maskable interrupts
indicating a software or hardware error, which adhere
to a predefined priority, as shown in Figure 5-1. They
are intended to provide the user a means to correct
erroneous operation during debug and when operating
within the application.
Note:
RESET SOURCES
There are 6 sources of error which will cause a device
Reset.
• Watchdog Time-out:
The watchdog has timed out, indicating that the
processor is no longer executing the correct flow
of code.
• Uninitialized W Register Trap:
An attempt to use an uninitialized W register as
an Address Pointer will cause a Reset.
• Illegal Instruction Trap:
Attempted execution of any unused opcodes will
result in an illegal instruction trap. Note that a
fetch of an illegal instruction does not result in an
illegal instruction trap if that instruction is flushed
prior to execution due to a flow change.
• Brown-out Reset (BOR):
A momentary dip in the power supply to the
device has been detected which may result in
malfunction.
• Trap Lockout:
Occurrence of multiple trap conditions
simultaneously will cause a Reset.
If the user does not intend to take corrective action in the event of a trap error
condition, these vectors must be loaded
with the address of a default handler that
simply contains the RESET instruction. If,
on the other hand, one of the vectors
containing an invalid address is called, an
address error trap is generated.
Note that many of these trap conditions can only be
detected when they occur. Consequently, the questionable instruction is allowed to complete prior to trap
exception processing. If the user chooses to recover
from the error, the result of the erroneous action that
caused the trap may have to be corrected.
There are 8 fixed priority levels for traps: Level 8
through Level 15, which means that IPL3 is always set
during processing of a trap.
If the user is not currently executing a trap, and he sets
the IPL<3:0> bits to a value of ‘0111’ (Level 7), then all
interrupts are disabled, but traps can still be processed.
5.3.1
TRAP SOURCES
The following traps are provided with increasing priority. However, since all traps can be nested, priority has
little effect.
Math Error Trap:
The math error trap executes under the following three
circumstances:
1.
2.
3.
4.
© 2006 Microchip Technology Inc.
Should an attempt be made to divide by zero,
the divide operation will be aborted on a cycle
boundary and the trap taken.
If enabled, a math error trap will be taken when
an arithmetic operation on either Accumulator A
or B causes an overflow from bit 31 and the
Accumulator Guard bits are not utilized.
If enabled, a math error trap will be taken when
an arithmetic operation on either Accumulator A
or B causes a catastrophic overflow from bit 39
and all saturation is disabled.
If the shift amount specified in a shift instruction
is greater than the maximum allowed shift
amount, a trap will occur.
DS70150B-page 41
dsPIC30F6010A/6015
Address Error Trap:
5.3.2
This trap is initiated when any of the following
circumstances occurs:
It is possible that multiple traps can become active
within the same cycle (e.g., a misaligned word stack
write to an overflowed address). In such a case, the
fixed priority shown in Figure 5-2 is implemented,
which may require the user to check if other traps are
pending in order to completely correct the Fault.
1.
2.
3.
4.
A misaligned data word access is attempted.
A data fetch from our unimplemented data
memory location is attempted.
A data access of an unimplemented program
memory location is attempted.
An instruction fetch from vector space is
attempted.
Note:
5.
6.
In the MAC class of instructions, wherein
the data space is split into X and Y data
space, unimplemented X space includes
all of Y space, and unimplemented Y
space includes all of X space.
Execution of a “BRA #literal” instruction or a
“GOTO #literal” instruction, where literal
is an unimplemented program memory address.
Executing instructions after modifying the PC to
point to unimplemented program memory
addresses. The PC may be modified by loading
a value into the stack and executing a RETURN
instruction.
Stack Error Trap:
HARD AND SOFT TRAPS
‘Soft’ traps include exceptions of priority level 8 through
level 11, inclusive. The arithmetic error trap (level 11)
falls into this category of traps.
‘Hard’ traps include exceptions of priority level 12
through level 15, inclusive. The address error (level
12), stack error (level 13) and oscillator error (level 14)
traps fall into this category.
Each hard trap that occurs must be Acknowledged
before code execution of any type may continue. If a
lower priority hard trap occurs while a higher priority
trap is pending, Acknowledged, or is being processed,
a hard trap conflict will occur.
The device is automatically reset in a hard trap conflict
condition. The TRAPR Status bit (RCON<15>) is set
when the Reset occurs, so that the condition may be
detected in software.
FIGURE 5-1:
TRAP VECTORS
1.
2.
The Stack Pointer is loaded with a value which
is greater than the (user programmable) limit
value written into the SPLIM register (stack
overflow).
The Stack Pointer is loaded with a value which
is less than 0x0800 (simple stack underflow).
Decreasing
Priority
This trap is initiated under the following conditions:
IVT
Oscillator Fail Trap:
This trap is initiated if the external oscillator fails and
operation becomes reliant on an internal RC backup.
AIVT
Reset – GOTO Instruction
Reset – GOTO Address
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Stack Error Trap Vector
Math Error Trap Vector
Reserved Vector
Reserved Vector
Reserved Vector
Interrupt 0 Vector
Interrupt 1 Vector
Interrupt 52 Vector
Interrupt 53 Vector
Reserved
Reserved
Reserved
Oscillator Fail Trap Vector
Stack Error Trap Vector
Address Error Trap Vector
Math Error Trap Vector
Reserved Vector
Reserved Vector
Reserved Vector
Interrupt 0 Vector
Interrupt 1 Vector
Interrupt 52 Vector
Interrupt 53 Vector
DS70150B-page 42
0x000000
0x000002
0x000004
0x000014
0x00007E
0x000080
0x000082
0x000084
0x000094
0x0000FE
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
5.4
Interrupt Sequence
5.5
All interrupt event flags are sampled in the beginning of
each instruction cycle by the IFSx registers. A pending
Interrupt Request (IRQ) is indicated by the flag bit
being equal to a ‘1’ in an IFSx register. The IRQ will
cause an interrupt to occur if the corresponding bit in
the Interrupt Enable (IECx) register is set. For the
remainder of the instruction cycle, the priorities of all
pending interrupt requests are evaluated.
If there is a pending IRQ with a priority level greater
than the current processor priority level in the IPL bits,
the processor will be interrupted.
The processor then stacks the current program counter
and the low byte of the processor STATUS register
(SRL), as shown in Figure 5-2. The low byte of the
STATUS register contains the processor priority level at
the time prior to the beginning of the interrupt cycle.
The processor then loads the priority level for this interrupt into the STATUS register. This action will disable
all lower priority interrupts until the completion of the
Interrupt Service Routine.
FIGURE 5-2:
INTERRUPT STACK
FRAME
Stack Grows Towards
Higher Address
0x0000 15
0
PC<15:0>
SRL IPL3 PC<22:16>
W15 (before CALL)
<Free Word>
W15 (after CALL)
POP : [--W15]
PUSH : [W15++]
Note 1: The user can always lower the priority level
by writing a new value into SR. The Interrupt
Service Routine must clear the interrupt flag
bits in the IFSx register before lowering the
processor interrupt priority in order to avoid
recursive interrupts.
2: The IPL3 bit (CORCON<3>) is always clear
when interrupts are being processed. It is
set only during execution of traps.
The RETFIE (Return from Interrupt) instruction will
unstack the program counter and STATUS registers to
return the processor to its state prior to the interrupt
sequence.
Alternate Vector Table
In program memory, the Interrupt Vector Table (IVT) is
followed by the Alternate Interrupt Vector Table (AIVT),
as shown in Figure 5-1. Access to the Alternate Vector
Table is provided by the ALTIVT bit in the INTCON2
register. If the ALTIVT bit is set, all interrupt and exception processes will use the alternate vectors instead of
the default vectors. The alternate vectors are organized
in the same manner as the default vectors. The AIVT
supports emulation and debugging efforts by providing
a means to switch between an application and a
support environment, without requiring the interrupt
vectors to be reprogrammed. This feature also enables
switching between applications for evaluation of
different software algorithms at run time.
If the AIVT is not required, the program memory allocated to the AIVT may be used for other purposes.
AIVT is not a protected section and may be freely
programmed by the user.
5.6
Fast Context Saving
A context saving option is available using shadow registers. Shadow registers are provided for the DC, N,
OV, Z and C bits in SR, and the registers W0 through
W3. The shadows are only one level deep. The shadow
registers are accessible using the PUSH.S and POP.S
instructions only.
When the processor vectors to an interrupt, the
PUSH.S instruction can be used to store the current
value of the aforementioned registers into their
respective shadow registers.
If an ISR of a certain priority uses the PUSH.S and
POP.S instructions for fast context saving, then a
higher priority ISR should not include the same instructions. Users must save the key registers in software
during a lower priority interrupt, if the higher priority ISR
uses fast context saving.
5.7
External Interrupt Requests
The interrupt controller supports five external interrupt
request signals, INT0-INT4. These inputs are edge
sensitive; they require a low-to-high or a high-to-low
transition to generate an interrupt request. The
INTCON2 register has five bits, INT0EP-INT4EP, that
select the polarity of the edge detection circuitry.
5.8
Wake-up from Sleep and Idle
The interrupt controller may be used to wake-up the
processor from either Sleep or Idle modes, if Sleep or
Idle mode is active when the interrupt is generated.
If an enabled interrupt request of sufficient priority is
received by the interrupt controller, then the standard
interrupt request is presented to the processor. At the
same time, the processor will wake-up from Sleep or
Idle and begin execution of the Interrupt Service
Routine (ISR) needed to process the interrupt request.
© 2006 Microchip Technology Inc.
DS70150B-page 43
SFR
Name
ADR
INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC30F6010A
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
INTCON1 0080
NSTDIS
—
—
—
—
OVATE
OVBTE
COVTE
—
—
—
INTCON2 0082
ALTIVT
DISI
—
—
—
—
—
—
—
—
—
Bit 4
Bit 3
Bit 2
Bit 1
MATHERR ADDRERR STKERR OSCFAIL
INT4EP
INT3EP
INT2EP
INT1EP
Bit 0
Reset State
—
0000 0000 0000 0000
INT0EP 0000 0000 0000 0000
IFS0
0084
CNIF
MI2CIF
SI2CIF
NVMIF
ADIF
U1TXIF
U1RXIF
SPI1IF
T3IF
T2IF
OC2IF
IC2IF
T1IF
OC1IF
IC1IF
INT0IF
0000 0000 0000 0000
IFS1
0086
IC6IF
IC5IF
IC4IF
IC3IF
C1IF
SPI2IF
U2TXIF
U2RXIF
INT2IF
T5IF
T4IF
OC4IF
OC3IF
IC8IF
IC7IF
INT1IF
0000 0000 0000 0000
IFS2
0088
—
—
—
FLTBIF
FLTAIF
—
—
QEIIF
PWMIF
C2IF
INT4IF
INT3IF
OC8IF
OC7IF
OC6IF
OC5IF
0000 0000 0000 0000
IEC0
008C
CNIE
MI2CIE
SI2CIE
NVMIE
ADIE
U1TXIE U1RXIE
SPI1IE
T3IE
T2IE
OC2IE
IC2IE
T1IE
OC1IE
IC1IE
INT0IE
0000 0000 0000 0000
IEC1
008E
IC6IE
IC5IE
IC4IE
IC3IE
C1IE
SPI2IE
U2TXIE
U2RXIE
INT2IE
T5IE
T4IE
OC4IE
OC3IE
IC8IE
IC7IE
INT1IE
0000 0000 0000 0000
IEC2
0090
—
—
—
—
—
QEIIE
PWMIE
C2IE
INT4IE
INT3IE
OC8IE
OC7IE
OC6IE
OC5IE
0000 0000 0000 0000
IPC0
0094
—
T1IP<2:0>
—
OC1IP<2:0>
—
IC1IP<2:0>
—
INT0IP<2:0>
0100 0100 0100 0100
IPC1
0096
—
T31P<2:0>
—
T2IP<2:0>
—
OC2IP<2:0>
—
IC2IP<2:0>
0100 0100 0100 0100
IPC2
0098
—
ADIP<2:0>
—
U1TXIP<2:0>
—
U1RXIP<2:0>
—
SPI1IP<2:0>
0100 0100 0100 0100
IPC3
009A
—
CNIP<2:0>
—
MI2CIP<2:0>
—
SI2CIP<2:0>
—
NVMIP<2:0>
0100 0100 0100 0100
IPC4
009C
—
OC3IP<2:0>
—
IC8IP<2:0>
—
IC7IP<2:0>
—
INT1IP<2:0>
0100 0100 0100 0100
IPC5
009E
—
INT2IP<2:0>
—
T5IP<2:0>
—
T4IP<2:0>
—
OC4IP<2:0>
0100 0100 0100 0100
IPC6
00A0
—
C1IP<2:0>
—
SPI2IP<2:0>
—
U2TXIP<2:0>
—
U2RXIP<2:0>
0100 0100 0100 0100
IPC7
00A2
—
IC6IP<2:0>
—
IC5IP<2:0>
—
IC4IP<2:0>
—
IC3IP<2:0>
0100 0100 0100 0100
IPC8
00A4
—
OC8IP<2:0>
—
OC7IP<2:0>
—
OC6IP<2:0>
—
OC5IP<2:0>
0100 0100 0100 0100
IPC9
00A6
—
PWMIP<2:0>
—
C2IP<2:0>
—
INT41IP<2:0>
—
INT3IP<2:0>
0100 0100 0100 0100
IPC10
00A8
—
FLTAIP<2:0>
—
—
—
—
—
—
—
—
—
QEIIP<2:0>
0100 0000 0000 0000
IPC11
00AA
—
—
—
—
—
—
—
—
—
—
FLTBIP<2:0>
0000 0000 0000 0100
—
—
—
INTTREG 00B0
Legend: u = uninitialized bit
FLTBIE FLTAIE
—
—
—
—
—
—
ILR<3:0>
VECNUM<5:0>
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150B-page 44
TABLE 5-2:
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 5-3:
INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC30F6015
SFR
Name
ADR
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
INTCON1
0080
NSTDIS
—
—
—
—
OVATE
OVBTE
COVTE
—
—
—
MATHERR
Bit 3
Bit 2
Bit 1
ADDRERR STKERR OSCFAIL
Bit 0
Reset State
—
0000 0000 0000 0000
0082
ALTIVT
DISI
—
—
—
—
—
—
—
—
—
INT4EP
INT3EP
INT2EP
INT1EP
IFS0
0084
CNIF
MI2CIF
SI2CIF
NVMIF
ADIF
U1TXIF
U1RXIF
SPI1IF
T3IF
T2IF
OC2IF
IC2IF
T1IF
OC1IF
IC1IF
INT0IF 0000 0000 0000 0000
IFS1
0086
IC6IF
IC5IF
IC4IF
IC3IF
C1IF
SPI2IF
U2TXIF
U2RXIF
INT2IF
T5IF
T4IF
OC4IF
OC3IF
IC8IF
IC7IF
INT1IF 0000 0000 0000 0000
IFS2
0088
—
—
—
FLTBIF
FLTAIF
—
—
QEIIF
PWMIF
—
INT4IF
INT3IF
OC8IF
OC7IF
OC6IF
OC5IF 0000 0000 0000 0000
IEC0
008C
CNIE
MI2CIE
SI2CIE
NVMIE
ADIE
U1TXIE U1RXIE
SPI1IE
T3IE
T2IE
OC2IE
IC2IE
T1IE
OC1IE
IC1IE
INT0IE 0000 0000 0000 0000
IEC1
008E
IC6IE
IC5IE
IC4IE
IC3IE
C1IE
SPI2IE
U2TXIE
U2RXIE
INT2IE
T5IE
T4IE
OC4IE
OC3IE
IC8IE
IC7IE
INT1IE 0000 0000 0000 0000
IEC2
0090
—
—
—
—
—
QEIIE
PWMIE
—
INT4IE
INT3IE
OC8IE
OC7IE
OC6IE
OC5IE 0000 0000 0000 0000
IPC0
0094
—
T1IP<2:0>
—
OC1IP<2:0>
—
IC1IP<2:0>
—
INT0IP<2:0>
0100 0100 0100 0100
IPC1
0096
—
T31P<2:0>
—
T2IP<2:0>
—
OC2IP<2:0>
—
IC2IP<2:0>
0100 0100 0100 0100
IPC2
0098
—
ADIP<2:0>
—
U1TXIP<2:0>
—
U1RXIP<2:0>
—
SPI1IP<2:0>
0100 0100 0100 0100
IPC3
009A
—
CNIP<2:0>
—
MI2CIP<2:0>
—
SI2CIP<2:0>
—
NVMIP<2:0>
0100 0100 0100 0100
IPC4
009C
—
OC3IP<2:0>
—
IC8IP<2:0>
—
IC7IP<2:0>
—
INT1IP<2:0>
0100 0100 0100 0100
IPC5
009E
—
INT2IP<2:0>
—
T5IP<2:0>
—
T4IP<2:0>
—
OC4IP<2:0>
0100 0100 0100 0100
IPC6
00A0
—
C1IP<2:0>
—
SPI2IP<2:0>
—
U2TXIP<2:0>
—
U2RXIP<2:0>
0100 0100 0100 0100
IPC7
00A2
—
IC6IP<2:0>
—
IC5IP<2:0>
—
IC4IP<2:0>
—
IC3IP<2:0>
0100 0100 0100 0100
IPC8
00A4
—
OC8IP<2:0>
—
OC7IP<2:0>
—
OC6IP<2:0>
—
OC5IP<2:0>
0100 0100 0100 0100
IPC9
00A6
—
PWMIP<2:0>
—
—
—
—
—
INT41IP<2:0>
—
INT3IP<2:0>
0100 0000 0100 0100
IPC10
00A8
—
FLTAIP<2:0>
—
—
—
—
—
—
—
—
—
QEIIP<2:0>
0100 0000 0000 0000
IPC11
00AA
—
—
—
—
—
—
—
—
—
—
FLTBIP<2:0>
0000 0000 0000 0100
—
—
FLTBIE FLTAIE
—
—
—
—
—
ILR<3:0>
—
INTTREG 00B0
Legend: u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
—
VECNUM<5:0>
0000 0000 0000 0000
DS70150B-page 45
dsPIC30F6010A/6015
INTCON2
INT0EP 0000 0000 0000 0000
dsPIC30F6010A/6015
NOTES:
DS70150B-page 46
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
6.0
FLASH PROGRAM MEMORY
6.2
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
RTSP is accomplished using TBLRD (table read) and
TBLWT (table write) instructions.
With RTSP, the user may erase program memory,
32 instructions (96 bytes) at a time and can write
program memory data, 32 instructions (96 bytes) at a
time.
6.3
The dsPIC30F family of devices contains internal
program Flash memory for executing user code. There
are two methods by which the user can program this
memory:
1.
2.
6.1
Table Instruction Operation Summary
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
Word or Byte mode.
In-Circuit Serial Programming™ (ICSP™)
Run-Time Self-Programming (RTSP)
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can access program memory in Word or
Byte mode.
In-Circuit Serial Programming
(ICSP)
A 24-bit program memory address is formed using
bits<7:0> of the TBLPAG register and the Effective
Address (EA) from a W register specified in the table
instruction, as shown in Figure 6-1.
dsPIC30F devices can be serially programmed while in
the end application circuit. This is simply done with two
lines for Programming Clock and Programming Data
(which are named PGC and PGD, respectively), and
three other lines for Power (VDD), Ground (VSS) and
Master Clear (MCLR). This allows customers to manufacture boards with unprogrammed devices and then
program the microcontroller just before shipping the
product. This also allows the most recent firmware or a
custom firmware to be programmed.
FIGURE 6-1:
Run-Time Self-Programming
(RTSP)
ADDRESSING FOR TABLE AND NVM REGISTERS
24 bits
Using
Program
Counter
Program Counter
0
0
NVMADR Reg EA
Using
NVMADR
Addressing
1/0
NVMADRU Reg
8 bits
16 bits
Working Reg EA
Using
Table
Instruction
User/Configuration
Space Select
© 2006 Microchip Technology Inc.
1/0
TBLPAG Reg
8 bits
16 bits
24-bit EA
Byte
Select
DS70150B-page 47
dsPIC30F6010A/6015
6.4
RTSP Operation
The dsPIC30F Flash program memory is organized
into rows and panels. Each row consists of 32 instructions, or 96 bytes. Each panel consists of 128 rows, or
4K x 24 instructions. RTSP allows the user to erase
one row (32 instructions) at a time and to program
32 instructions at one time.
Each panel of program memory contains write latches
that hold 32 instructions of programming data. Prior to
the actual programming operation, the write data must
be loaded into the panel write latches. The data to be
programmed into the panel is loaded in sequential
order into the write latches; instruction 0, instruction 1,
etc. The addresses loaded must always be from a 32
address boundary.
6.5
RTSP Control Registers
The four SFRs used to read and write the program
Flash memory are:
•
•
•
•
NVMCON
NVMADR
NVMADRU
NVMKEY
6.5.1
NVMCON REGISTER
The NVMCON register controls which blocks are to be
erased, which memory type is to be programmed and
start of the programming cycle.
6.5.2
NVMADR REGISTER
The basic sequence for RTSP programming is to set up
a Table Pointer, then do a series of TBLWT instructions
to load the write latches. Programming is performed by
setting the special bits in the NVMCON register. 32
TBLWTL and 32 TBLWTH instructions are required to
load the 32 instructions.
The NVMADR register is used to hold the lower two
bytes of the Effective Address. The NVMADR register
captures the EA<15:0> of the last table instruction that
has been executed and selects the row to write.
All of the table write operations are single-word writes
(2 instruction cycles), because only the table latches
are written.
The NVMADRU register is used to hold the upper byte
of the Effective Address. The NVMADRU register captures the EA<23:16> of the last table instruction that
has been executed.
After the latches are written, a programming operation
needs to be initiated to program the data.
The Flash program memory is readable, writable and
erasable during normal operation over the entire VDD
range.
6.5.3
6.5.4
NVMKEY REGISTER
NVMKEY is a write-only register that is used for write
protection. To start a programming or an erase
sequence, the user must consecutively write 0x55 and
0xAA to the NVMKEY register. Refer to Section 6.6
“Programming Operations” for further details.
Note:
DS70150B-page 48
NVMADRU REGISTER
The user can also directly write to the
NVMADR and NVMADRU registers to
specify a program memory address for
erasing or programming.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
6.6
Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. A programming operation is nominally 2 msec in
duration and the processor stalls (waits) until the operation is finished. Setting the WR bit (NVMCON<15>)
starts the operation, and the WR bit is automatically
cleared when the operation is finished.
6.6.1
4.
5.
PROGRAMMING ALGORITHM FOR
PROGRAM FLASH
The user can erase or program one row of program
Flash memory at a time. The general process is:
1.
2.
3.
Read one row of program Flash (32 instruction
words) and store into data RAM as a data
“image”.
Update the data image with the desired new
data.
Erase program Flash row.
a) Set up NVMCON register for multi-word,
program Flash, erase, and set WREN bit.
b) Write address of row to be erased into
NVMADRU/NVMDR.
c) Write ‘55’ to NVMKEY.
d) Write ‘AA’ to NVMKEY.
e) Set the WR bit. This will begin erase cycle.
f) CPU will stall for the duration of the erase
cycle.
g) The WR bit is cleared when erase cycle
ends.
EXAMPLE 6-1:
6.
Write 32 instruction words of data from data
RAM “image” into the program Flash write
latches.
Program 32 instruction words into program
Flash.
a) Set up NVMCON register for multi-word,
program Flash, program, and set WREN
bit.
b) Write ‘55’ to NVMKEY.
c) Write ‘AA’ to NVMKEY.
d) Set the WR bit. This will begin program
cycle.
e) CPU will stall for duration of the program
cycle.
f) The WR bit is cleared by the hardware
when program cycle ends.
Repeat steps 1 through 5 as needed to program
desired amount of program Flash memory.
6.6.2
ERASING A ROW OF PROGRAM
MEMORY
Example 6-1 shows a code sequence that can be used
to erase a row (32 instructions) of program memory.
ERASING A ROW OF PROGRAM MEMORY
; Setup NVMCON for erase operation, multi word
; program memory selected, and writes enabled
MOV
#0x4041,W0
;
;
MOV
W0,NVMCON
; Init pointer to row to be ERASED
MOV
#tblpage(PROG_ADDR),W0
;
;
MOV
W0,NVMADRU
MOV
#tbloffset(PROG_ADDR),W0
;
MOV
W0, NVMADR
;
DISI
#5
;
;
MOV
#0x55,W0
;
MOV
W0,NVMKEY
MOV
#0xAA,W1
;
;
MOV
W1,NVMKEY
BSET
NVMCON,#WR
;
NOP
;
NOP
;
© 2006 Microchip Technology Inc.
write
Init NVMCON SFR
Initialize PM Page Boundary SFR
Intialize in-page EA[15:0] pointer
Intialize NVMADR SFR
Block all interrupts with priority <7
for next 5 instructions
Write the 0x55 key
Write the 0xAA key
Start the erase sequence
Insert two NOPs after the erase
command is asserted
DS70150B-page 49
dsPIC30F6010A/6015
6.6.3
LOADING WRITE LATCHES
Example 6-2 shows a sequence of instructions that
can be used to load the 96 bytes of write latches.
32 TBLWTL and 32 TBLWTH instructions are needed to
load the write latches selected by the Table Pointer.
EXAMPLE 6-2:
LOADING WRITE LATCHES
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV
#0x0000,W0
;
; Initialize PM Page Boundary SFR
MOV
W0,TBLPAG
MOV
#0x6000,W0
; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV
#LOW_WORD_0,W2
;
MOV
#HIGH_BYTE_0,W3
;
; Write PM low word into program latch
TBLWTL W2,[W0]
; Write PM high byte into program latch
TBLWTH W3,[W0++]
; 1st_program_word
MOV
#LOW_WORD_1,W2
;
MOV
#HIGH_BYTE_1,W3
;
; Write PM low word into program latch
TBLWTL W2,[W0]
TBLWTH W3,[W0++]
; Write PM high byte into program latch
; 2nd_program_word
MOV
#LOW_WORD_2,W2
;
MOV
#HIGH_BYTE_2,W3
;
; Write PM low word into program latch
TBLWTL W2, [W0]
; Write PM high byte into program latch
TBLWTH W3, [W0++]
•
•
•
; 31st_program_word
MOV
#LOW_WORD_31,W2
;
MOV
#HIGH_BYTE_31,W3
;
; Write PM low word into program latch
TBLWTL W2, [W0]
; Write PM high byte into program latch
TBLWTH W3, [W0++]
Note: In Example 6-2, the contents of the upper byte of W3 has no effect.
6.6.4
INITIATING THE PROGRAMMING
SEQUENCE
For protection, the write initiate sequence for NVMKEY
must be used to allow any erase or program operation
to proceed. After the programming command has been
executed, the user must wait for the programming time
until programming is complete. The two instructions
following the start of the programming sequence
should be NOPs.
EXAMPLE 6-3:
INITIATING A PROGRAMMING SEQUENCE
DISI
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x55,W0
W0,NVMKEY
#0xAA,W1
W1,NVMKEY
NVMCON,#WR
DS70150B-page 50
; Block all interrupts with priority <7
; for next 5 instructions
;
;
;
;
;
;
Write the 0x55 key
Write the 0xAA key
Start the erase sequence
Insert two NOPs after the erase
command is asserted
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 6-1:
File Name
NVM REGISTER MAP
Addr.
Bit 15
Bit 14
Bit 13
NVMCON
0760
WR
WREN
WRERR
NVMADR
0762
NVMADRU
0764
Bit 12 Bit 11 Bit 10
—
—
—
Bit 9
—
Bit 8
Bit 7
TWRI
—
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
PROGOP<6:0>
NVMADR<15:0>
Bit 1
Bit 0
All Resets
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
—
—
—
—
—
—
—
—
NVMADR<23:16>
0000 0000 uuuu uuuu
—
NVMKEY
0766
Legend: u = uninitialized bit
—
—
—
—
—
—
—
KEY<7:0>
0000 0000 0000 0000
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F6010A/6015
DS70150B-page 51
dsPIC30F6010A/6015
NOTES:
DS70150B-page 52
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
7.0
DATA EEPROM MEMORY
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
The data EEPROM memory is readable and writable
during normal operation over the entire VDD range. The
data EEPROM memory is directly mapped in the
program memory address space.
The four SFRs used to read and write the program
Flash memory are used to access data EEPROM
memory, as well. As described in Section 4.0
“Address Generator Units”, these registers are:
•
•
•
•
NVMCON
NVMADR
NVMADRU
NVMKEY
The EEPROM data memory allows read and write of
single words and 16-word blocks. When interfacing to
data memory, NVMADR, in conjunction with the
NVMADRU register, is used to address the EEPROM
location being accessed. TBLRDL and TBLWTL instructions are used to read and write data EEPROM. The
dsPIC30F6010 device has 8 Kbytes (4K words) of data
EEPROM, with an address range from 0x7FF000 to
0x7FFFFE.
A word write operation should be preceded by an erase
of the corresponding memory location(s). The write
typically requires 2 ms to complete, but the write time
will vary with voltage and temperature.
© 2006 Microchip Technology Inc.
A program or erase operation on the data EEPROM
does not stop the instruction flow. The user is responsible for waiting for the appropriate duration of time
before initiating another data EEPROM write/erase
operation. Attempting to read the data EEPROM while
a programming or erase operation is in progress results
in unspecified data.
Control bit WR initiates write operations, similar to program Flash writes. This bit cannot be cleared, only set,
in software. This bit is cleared in hardware at the completion of the write operation. The inability to clear the
WR bit in software prevents the accidental or
premature termination of a write operation.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear. The WRERR bit is
set when a write operation is interrupted by a MCLR
Reset, or a WDT Time-out Reset, during normal operation. In these situations, following Reset, the user can
check the WRERR bit and rewrite the location. The
address register NVMADR remains unchanged.
Note:
7.1
Interrupt flag bit NVMIF in the IFS0 register is set when write is complete. It must be
cleared in software.
Reading the Data EEPROM
A TBLRD instruction reads a word at the current program word address. This example uses W0 as a
pointer to data EEPROM. The result is placed in
register W4, as shown in Example 7-1.
EXAMPLE 7-1:
MOV
MOV
MOV
TBLRDL
DATA EEPROM READ
#LOW_ADDR_WORD,W0 ; Init Pointer
#HIGH_ADDR_WORD,W1
W1,TBLPAG
[ W0 ], W4
; read data EEPROM
DS70150B-page 53
dsPIC30F6010A/6015
7.2
7.2.1
Erasing Data EEPROM
ERASING A BLOCK OF DATA
EEPROM
In order to erase a block of data EEPROM, the
NVMADRU and NVMADR registers must initially
point to the block of memory to be erased. Configure
NVMCON for erasing a block of data EEPROM and
set the WR and WREN bits in the NVMCON register.
Setting the WR bit initiates the erase, as shown in
Example 7-2.
EXAMPLE 7-2:
DATA EEPROM BLOCK ERASE
; Select data EEPROM block, WR, WREN bits
MOV
#4045,W0
MOV
W0,NVMCON
; Initialize NVMCON SFR
; Start erase cycle by setting WR after writing key sequence
DISI
#5
; Block all interrupts with priority <7
; for next 5 instructions
MOV
#0x55,W0
;
; Write the 0x55 key
MOV
W0,NVMKEY
MOV
#0xAA,W1
;
MOV
W1,NVMKEY
; Write the 0xAA key
BSET
NVMCON,#WR
; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
7.2.2
ERASING A WORD OF DATA
EEPROM
The NVMADRU and NVMADR registers must point to
the block. Select a block of data Flash and set the WR
and WREN bits in the NVMCON register. Setting the
WR bit initiates the erase, as shown in Example 7-3.
EXAMPLE 7-3:
DATA EEPROM WORD ERASE
; Select data EEPROM word, WR, WREN bits
MOV
#4044,W0
MOV
W0,NVMCON
; Start erase cycle by setting WR after writing key sequence
DISI
#5
; Block all interrupts with priority <7
; for next 5 instructions
MOV
#0x55,W0
;
; Write the 0x55 key
MOV
W0,NVMKEY
MOV
#0xAA,W1
;
MOV
W1,NVMKEY
; Write the 0xAA key
BSET
NVMCON,#WR
; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
DS70150B-page 54
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
7.3
Writing to the Data EEPROM
To write an EEPROM data location, the following
sequence must be followed:
1.
2.
3.
Erase data EEPROM word.
a) Select word, data EEPROM, erase and set
WREN bit in NVMCON register.
b) Write address of word to be erased into
NVMADRU/NVMADR.
c) Enable NVM interrupt (optional).
d) Write ‘55’ to NVMKEY.
e) Write ‘AA’ to NVMKEY.
f) Set the WR bit. This will begin erase cycle.
g) Either poll NVMIF bit or wait for NVMIF
interrupt.
h) The WR bit is cleared when the erase cycle
ends.
Write data word into data EEPROM write
latches.
Program 1 data word into data EEPROM.
a) Select word, data EEPROM, program and
set WREN bit in NVMCON register.
b) Enable NVM write done interrupt (optional).
c) Write ‘55’ to NVMKEY.
d) Write ‘AA’ to NVMKEY.
e) Set the WR bit. This will begin program
cycle.
f) Either poll NVMIF bit or wait for NVM
interrupt.
g) The WR bit is cleared when the write cycle
ends.
EXAMPLE 7-4:
The write will not initiate if the above sequence is not
exactly followed (write 0x55 to NVMKEY, write 0xAA to
NVMCON, then set WR bit) for each word. It is strongly
recommended that interrupts be disabled during this
code segment.
Additionally, the WREN bit in NVMCON must be set to
enable writes. This mechanism prevents accidental
writes to data EEPROM, due to unexpected code execution. The WREN bit should be kept clear at all times,
except when updating the EEPROM. The WREN bit is
not cleared by hardware.
After a write sequence has been initiated, clearing the
WREN bit will not affect the current write cycle. The WR
bit will be inhibited from being set unless the WREN bit
is set. The WREN bit must be set on a previous instruction. Both WR and WREN cannot be set with the same
instruction.
At the completion of the write cycle, the WR bit is
cleared in hardware and the Nonvolatile Memory Write
Complete Interrupt Flag bit (NVMIF) is set. The user
may either enable this interrupt, or poll this bit. NVMIF
must be cleared by software.
7.3.1
WRITING A WORD OF DATA
EEPROM
Once the user has erased the word to be programmed,
then a table write instruction is used to write one write
latch, as shown in Example 7-4.
DATA EEPROM WORD WRITE
; Point to data memory
MOV
#LOW_ADDR_WORD,W0
MOV
#HIGH_ADDR_WORD,W1
MOV
W1,TBLPAG
MOV
#LOW(WORD),W2
TBLWTL
W2,[ W0]
; The NVMADR captures last table access address
; Select data EEPROM for 1 word op
MOV
#0x4004,W0
MOV
W0,NVMCON
; Operate key to allow write operation
DISI
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
; Write cycle will
; User can poll WR
#0x55,W0
W0,NVMKEY
#0xAA,W1
W1,NVMKEY
NVMCON,#WR
; Init pointer
; Get data
; Write data
; Block all interrupts with priority <7
; for next 5 instructions
; Write the 0x55 key
; Write the 0xAA key
; Initiate program sequence
complete in 2mS. CPU is not stalled for the Data Write Cycle
bit, use NVMIF or Timer IRQ to determine write complete
© 2006 Microchip Technology Inc.
DS70150B-page 55
dsPIC30F6010A/6015
7.3.2
WRITING A BLOCK OF DATA
EEPROM
To write a block of data EEPROM, write to all sixteen
latches first, then set the NVMCON register and
program the block.
EXAMPLE 7-5:
7.4
DATA EEPROM BLOCK WRITE
MOV
MOV
MOV
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
TBLWTL
MOV
MOV
DISI
#LOW_ADDR_WORD,W0
#HIGH_ADDR_WORD,W1
W1,TBLPAG
#data1,W2
W2,[ W0]++
#data2,W2
W2,[ W0]++
#data3,W2
W2,[ W0]++
#data4,W2
W2,[ W0]++
#data5,W2
W2,[ W0]++
#data6,W2
W2,[ W0]++
#data7,W2
W2,[ W0]++
#data8,W2
W2,[ W0]++
#data9,W2
W2,[ W0]++
#data10,W2
W2,[ W0]++
#data11,W2
W2,[ W0]++
#data12,W2
W2,[ W0]++
#data13,W2
W2,[ W0]++
#data14,W2
W2,[ W0]++
#data15,W2
W2,[ W0]++
#data16,W2
W2,[ W0]++
#0x400A,W0
W0,NVMCON
#5
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x55,W0
W0,NVMKEY
#0xAA,W1
W1,NVMKEY
NVMCON,#WR
; Init pointer
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
;
Get 1st data
write data
Get 2nd data
write data
Get 3rd data
write data
Get 4th data
write data
Get 5th data
write data
Get 6th data
write data
Get 7th data
write data
Get 8th data
write data
Get 9th data
write data
Get 10th data
write data
Get 11th data
write data
Get 12th data
write data
Get 13th data
write data
Get 14th data
write data
Get 15th data
write data
Get 16th data
write data. The NVMADR captures last table access address.
Select data EEPROM for multi word op
Operate Key to allow program operation
Block all interrupts with priority <7
for next 5 instructions
; Write the 0x55 key
; Write the 0xAA key
; Start write cycle
Write Verify
Depending on the application, good programming
practice may dictate that the value written to the memory should be verified against the original value. This
should be used in applications where excessive writes
can stress bits near the specification limit.
7.5
Protection Against Spurious Write
There are conditions when the device may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been built-in. On power-up, the WREN bit is cleared;
also, the Power-up Timer prevents EEPROM write.
The write initiate sequence and the WREN bit together,
help prevent an accidental write during brown-out,
power glitch or software malfunction.
DS70150B-page 56
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
8.0
I/O PORTS
Any bit and its associated data and control registers
that are not valid for a particular device will be
disabled. That means the corresponding LATx and
TRISx registers and the port pin will read as zeros.
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the dsPIC30F
Family Reference Manual (DS70046).
When a pin is shared with another peripheral or function that is defined as an input only, it is nevertheless
regarded as a dedicated port because there is no
other competing source of outputs. An example is the
INT4 pin. Figure 8-1 shows the structure for a
dedicated port.
All of the device pins (except VDD, VSS, MCLR and
OSC1/CLKI) are shared between the peripherals and
the parallel I/O ports.
The format of the registers for PORTA are shown in
Table 8-1.
All I/O input ports feature Schmitt Trigger inputs for
improved noise immunity.
8.1
The TRISA (Data Direction Control) register controls
the direction of the RA<7:0> pins, as well as the INTx
pins and the VREF pins. The LATA register supplies
data to the outputs and is readable/writable. Reading
the PORTA register yields the state of the input pins,
while writing the PORTA register modifies the contents
of the LATA register.
Parallel I/O (PIO) Ports
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
may be read, but the output driver for the parallel port
bit will be disabled. If a peripheral is enabled, but the
peripheral is not actively driving a pin, that pin may be
driven by a port.
A parallel I/O (PIO) port that shares a pin with a peripheral is, in general, subservient to the peripheral. The
peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has ownership of the output data and control signals of
the I/O pad cell. Figure 8-2 shows how ports are shared
with other peripherals, and the associated I/O cell (pad)
to which they are connected. Table 8-1 shows the
formats of the registers for the shared ports, PORTB
through PORTG.
All port pins have three registers directly associated
with the operation of the port pin. The data direction
register (TRISx) determines whether the pin is an input
or an output. If the data direction bit is a ‘1’, then the pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the latch (LATx), read the latch.
Writes to the latch, write the latch (LATx). Reads from
the port (PORTx), read the port pins and writes to the
port pins, write the latch (LATx).
FIGURE 8-1:
BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE
Dedicated Port Module
Read TRIS
I/O Cell
TRIS Latch
Data Bus
D
WR TRIS
CK
Q
Data Latch
D
WR LAT+
WR Port
Q
I/O Pad
CK
Read LAT
Read Port
© 2006 Microchip Technology Inc.
DS70150B-page 57
dsPIC30F6010A/6015
FIGURE 8-2:
BLOCK DIAGRAM OF A SHARED PORT STRUCTURE
Output Multiplexers
Peripheral Module
Peripheral Input Data
Peripheral Module Enable
I/O Cell
Peripheral Output Enable
1
Peripheral Output Data
0
PIO Module
1
Output Enable
Output Data
0
Read TRIS
I/O Pad
Data Bus
D
WR TRIS
Q
CK
TRIS Latch
D
WR LAT +
WR Port
Q
CK
Data Latch
Read LAT
Input Data
Read Port
8.2
Configuring Analog Port Pins
The use of the ADPCFG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared
(output), the digital output level (VOH or VOL) will be
converted.
When reading the PORT register, all pins configured as
analog input channels will read as cleared (a low level).
Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a
digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
DS70150B-page 58
8.2.1
I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically this instruction
would be a NOP.
EXAMPLE 8-1:
MOV 0xFF00, W0
MOV W0, TRISBB
NOP
BTSS PORTB, #13
PORT WRITE/READ
EXAMPLE
;
;
;
;
;
Configure PORTB<15:8>
as inputs
and PORTB<7:0> as outputs
Delay 1 cycle
Next Instruction
© 2006 Microchip Technology Inc.
SFR
Name
Addr.
dsPIC30F6010A PORT REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TRISA
02C0 TRISA15 TRISA14
—
—
—
—
—
—
—
—
—
—
—
—
1100 0110 0000 0000
PORTA
02C2
RA15
RA14
—
—
—
RA10
RA9
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
LATA
02C4
LATA15
LATA14
—
—
—
LATA10
LATA9
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
TRISB
02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
1111 1111 1111 1111
PORTB
02C8
RB15
RB14
RB13
RB12
RB11
RB10
RB9
RB8
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
0000 0000 0000 0000
LATB
02CB
LATB15
LATB14
LATB13
LATB12
LATB11
LATB10
LATB9
LATB8
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
0000 0000 0000 0000
TRISC
02CC TRISC15 TRISC14 TRISC13
—
—
—
—
—
—
—
—
—
TRISC3
—
TRISC1
—
1110 0000 0000 1010
PORTC
02CE
RC15
RC14
RC13
—
—
—
—
—
—
—
—
—
RC3
—
RC1
—
0000 0000 0000 0000
LATC
02D0
LATC15
LATC14
LATC13
—
—
—
—
—
—
—
—
—
LATC3
—
LATC1
—
0000 0000 0000 0000
TRISD
02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0
1111 1111 1111 1111
PORTD
02D4
RD15
RD14
RD13
RD12
RD11
RD10
RD9
RD8
RD7
RD6
RD5
RD4
RD3
RD2
RD1
RD0
0000 0000 0000 0000
LATD
02D6
LATD15
LATD14
LATD13
LATD12
LATD11
LATD10
LATD9
LATD8
LATD7
LATD6
LATD5
LATD4
LATD3
LATD2
LATD1
LATD0
0000 0000 0000 0000
TRISE
02D8
—
—
—
—
—
—
TRISE9 TRISE8 TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0
0000 0011 1111 1111
PORTE
02DA
—
—
—
—
—
—
RE9
LATE
02DC
—
—
—
—
—
—
LATE9
TRISF
02EE
—
—
—
—
—
—
—
PORTF
02E0
—
—
—
—
—
—
—
RF8
RF7
RF6
RF5
RF4
RF3
RF2
RF1
RF0
LATF
02E2
—
—
—
—
—
—
—
LATF8
LATF7
LATF6
LATF5
LATF4
LATF3
LATF2
LATF1
LATF0
TRISG
02E4
—
—
—
—
—
—
—
—
PORTG
02E6
—
—
—
—
—
—
RG9
RG8
RG7
RG6
—
—
RG3
RG2
RG1
RG0
0000 0000 0000 0000
LATG
02E8
—
—
—
—
—
—
LATG9
LATG8
LATG7
LATG6
—
—
LATG3
LATG2
LATG1
LATG0
0000 0000 0000 0000
Legend:
Note:
TRISA10 TRISA9
Bit 8
RE8
RE7
RE6
RE5
RE4
RE3
RE2
RE1
RE0
LATE8
LATE7
LATE6
LATE5
LATE4
LATE3
LATE2
LATE1
LATE0
0000 0000 0000 0000
TRISF8 TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0
0000 0001 1111 1111
TRISG9 TRISG8 TRISG7 TRISG6
u = uninitialized bit
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TRISG3 TRISG2 TRISG1 TRISG0
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
0000 0011 1100 1111
dsPIC30F6010A/6015
DS70150B-page 59
TABLE 8-1:
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 8-2:
SFR
Name
dsPIC30F6015 PORT REGISTER MAP
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TRISA
02C0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
PORTA
02C2
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
LATA
02C4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
TRISB
02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
1111 1111 1111 1111
PORTB
02C8
RB15
RB14
RB13
RB12
RB11
RB10
RB9
RB8
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
0000 0000 0000 0000
LATB
02CB
LATB15
LATB14
LATB13
LATB12
LATB11
LATB10
LATB9
LATB8
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
0000 0000 0000 0000
TRISC
02CC TRISC15 TRISC14 TRISC13
—
—
—
—
—
—
—
—
—
—
—
—
—
1110 0000 0000 0000
PORTC
02CE
RC15
RC14
RC13
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
LATC
02D0
LATC15
LATC14
LATC13
—
—
—
—
—
—
—
—
—
—
—
—
—
0000 0000 0000 0000
TRISD
02D2
—
—
—
—
PORTD
02D4
—
—
—
—
RD11
RD10
RD9
RD8
RD7
RD6
RD5
RD4
RD3
RD2
RD1
RD0
0000 0000 0000 0000
LATD
02D6
—
—
—
—
LATD11
LATD10
LATD9
LATD8
LATD7
LATD6
LATD5
LATD4
LATD3
LATD2
LATD1
LATD0
0000 0000 0000 0000
TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0
0000 0000 1111 1111
TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0
0000 1111 1111 1111
02D8
—
—
—
—
—
—
—
—
02DA
—
—
—
—
—
—
—
—
RE7
RE6
RE5
RE4
RE3
RE2
RE1
RE0
0000 0000 0000 0000
LATE
02DC
—
—
—
—
—
—
—
—
LATE7
LATE6
LATE5
LATE4
LATE3
LATE2
LATE1
LATE0
0000 0000 0000 0000
TRISF
02EE
—
—
—
—
—
—
—
—
—
TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0
0000 0000 0111 1111
PORTF
02E0
—
—
—
—
—
—
—
—
—
RF6
RF5
RF4
RF3
RF2
RF1
RF0
0000 0000 0000 0000
LATF
02E2
—
—
—
—
—
—
—
—
—
LATF6
LATF5
LATF4
LATF3
LATF2
LATF1
LATF0
0000 0000 0000 0000
TRISG
02E4
—
—
—
—
—
—
—
—
—
—
0000 0011 1100 1100
PORTG
02E6
—
—
—
—
—
—
RG9
RG8
RG7
RG6
—
—
RG3
RG2
—
—
0000 0000 0000 0000
LATG
02E8
—
—
—
—
—
—
LATG9
LATG8
LATG7
LATG6
—
—
LATG3
LATG2
—
—
0000 0000 0000 0000
Legend:
Note:
TRISG9 TRISG8 TRISG7 TRISG6
u = uninitialized bit
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TRISG3 TRISG2
DS70150B-page 60
dsPIC30F6010A/6015
TRISE
PORTE
dsPIC30F6010A/6015
8.3
Input Change Notification Module
The input change notification module provides the
dsPIC30F devices the ability to generate interrupt
requests to the processor in response to a change-ofstate on selected input pins. This module is capable of
detecting input change-of-states, even in Sleep mode
when the clocks are disabled. There are 22 external
signals (CN0 through CN21) for dsPIC30F6010A and
19 external signals (CN0 through CN19) for
dsPIC30F6015 that may be selected (enabled) for
generating an interrupt request on a change-of-state.
Please refer to the Pin Diagrams for CN pin locations.
TABLE 8-3:
INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-8)
SFR
Name
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset State
CNEN1
00C0
CN15IE
CN14IE
CN13IE
CN12IE
CN11IE
CN10IE
CN9IE
CN8IE
0000 0000 0000 0000
CNEN2
00C2
—
—
—
—
—
—
—
—
0000 0000 0000 0000
CNPU1
00C4
CN9PUE
CN8PUE
0000 0000 0000 0000
CNPU2
00C6
—
—
0000 0000 0000 0000
CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE
—
—
—
—
—
—
Legend: u = uninitialized bit
TABLE 8-4:
INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0) FOR dsPIC30F6010A
SFR
Name
Addr.
Bit 7
Bit 6
CNEN1
00C0
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CNEN2
00C2
—
—
CN21IE
CN20IE
CN19IE
CN18IE
CNPU1
00C4
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CN0PUE
0000 0000 0000 0000
CNPU2
00C6
—
—
CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE
CN16PUE
0000 0000 0000 0000
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
CN1IE
CN0IE
0000 0000 0000 0000
CN17IE
CN16IE
0000 0000 0000 0000
Legend: u = uninitialized bit
TABLE 8-5:
INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0) FOR dsPIC30F6015
SFR
Name
Addr.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
CNEN1
00C0
CN7IE
CN6IE
CN5IE
CN4IE
CN3IE
CN2IE
CN1IE
CN0IE
0000 0000 0000 0000
CNEN2
00C2
—
—
—
—
—
CN18IE
CN17IE
CN16IE
0000 0000 0000 0000
CNPU1
00C4
CN7PUE
CN6PUE
CN5PUE
CN4PUE
CN3PUE
CN2PUE
CN1PUE
CN0PUE
0000 0000 0000 0000
CNPU2
00C6
—
—
—
—
—
CN18PUE CN17PUE
CN16PUE
0000 0000 0000 0000
Legend: u = uninitialized bit
© 2006 Microchip Technology Inc.
DS70150B-page 61
dsPIC30F6010A/6015
NOTES:
DS70150B-page 62
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
9.0
TIMER1 MODULE
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
This section describes the 16-bit General Purpose
(GP) Timer1 module and associated operational
modes.
Note:
Timer1 is a Type A timer. Please refer to the
specifications for a Type A timer in
Section 24.0 "Electrical Characteristics"
of this document.
The following sections provide a detailed description,
including setup and control registers along with associated block diagrams for the operational modes of the
timers.
The Timer1 module is a 16-bit timer which can serve as
the time counter for the Real-Time Clock, or operate as
a free running interval timer/counter. The 16-bit timer
has the following modes:
• 16-bit Timer
• 16-bit Synchronous Counter
• 16-bit Asynchronous Counter
Further, the following operational characteristics are
supported:
• Timer gate operation
• Selectable prescaler settings
• Timer operation during CPU Idle and Sleep
modes
• Interrupt on 16-bit Period register match or falling
edge of external gate signal
© 2006 Microchip Technology Inc.
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1
presents a block diagram of the 16-bit timer module.
16-bit Timer Mode: In the 16-bit Timer mode, the timer
increments on every instruction cycle up to a match
value, preloaded into the period register, PR1, then
resets to ‘0’ and continues to count.
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless the TSIDL (T1CON<13>)
bit = 0. If TSIDL = 1, the timer module logic will resume
the incrementing sequence upon termination of the
CPU Idle mode.
16-bit Synchronous Counter Mode: In the 16-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal,
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in
PR1, then resets to 0 and continues.
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless the respective TSIDL bit = 0.
If TSIDL = 1, the timer module logic will resume the
incrementing sequence upon termination of the CPU
Idle mode.
16-bit Asynchronous Counter Mode: In the 16-bit
Asynchronous Counter mode, the timer increments on
every rising edge of the applied external clock signal.
The timer counts up to a match value preloaded in
PR1, then resets to ‘0’ and continues.
When the timer is configured for the Asynchronous mode
of operation and the CPU goes into the Idle mode, the
timer will stop incrementing if TSIDL = 1.
DS70150B-page 63
dsPIC30F6010A/6015
FIGURE 9-1:
16-BIT TIMER1 MODULE BLOCK DIAGRAM (TYPE A TIMER)
PR1
Equal
Comparator x 16
TSYNC
1
Sync
(3)
TMR1
Reset
0
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
2
1X
LPOSCEN
SOSCI
Timer Gate Operation
The 16-bit timer can be placed in the Gated Time
Accumulation mode. This mode allows the internal TCY
to increment the respective timer when the gate input
signal (T1CK pin) is asserted high. Control bit TGATE
(T1CON<6>) must be set to enable this mode. The
timer must be enabled (TON = 1) and the timer clock
source set to internal (TCS = 0).
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless TSIDL = 0. If TSIDL = 1, the
timer will resume the incrementing sequence upon
termination of the CPU Idle mode.
9.2
TCKPS<1:0>
TON
SOSCO/
T1CK
9.1
TGATE
T1IF
Event Flag
Timer Prescaler
The input clock (FOSC/4 or external clock) to the 16-bit
Timer has a prescale option of 1:1, 1:8, 1:64 and 1:256
selected by control bits, TCKPS<1:0> (T1CON<5:4>).
The prescaler counter is cleared when any of the
following occurs:
Gate
Sync
01
TCY
00
9.3
Prescaler
1, 8, 64, 256
Timer Operation During Sleep
Mode
During CPU Sleep mode, the timer will operate if:
• The timer module is enabled (TON = 1) and
• The timer clock source is selected as external
(TCS = 1) and
• The TSYNC bit (T1CON<2>) is asserted to a logic
‘0’, which defines the external clock source as
asynchronous
When all three conditions are true, the timer will continue to count up to the period register and be reset to
0x0000.
When a match between the timer and the period register occurs, an interrupt can be generated, if the
respective timer interrupt enable bit is asserted.
• a write to the TMR1 register
• clearing of the TON bit (T1CON<15>)
• device Reset such as POR and BOR
However, if the timer is disabled (TON = 0), then the
timer prescaler cannot be reset since the prescaler
clock is halted.
TMR1 is not cleared when T1CON is written. It is
cleared by writing to the TMR1 register.
DS70150B-page 64
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
9.4
9.5.1
Timer Interrupt
The 16-bit timer has the ability to generate an interrupt
on period match. When the timer count matches the
period register, the T1IF bit is asserted and an interrupt
will be generated, if enabled. The T1IF bit must be
cleared in software. The Timer Interrupt Flag, T1IF, is
located in the IFS0 Control register in the interrupt
controller.
When the Gated Time Accumulation mode is enabled,
an interrupt will also be generated on the falling edge of
the gate signal (at the end of the accumulation cycle).
RTC OSCILLATOR OPERATION
When the TON = 1, TCS = 1 and TGATE = 0, the timer
increments on the rising edge of the 32 kHz LP oscillator output signal, up to the value specified in the period
register, and is then reset to ‘0’.
The TSYNC bit must be asserted to a logic ‘0’
(Asynchronous mode) for correct operation.
Enabling LPOSCEN (OSCCON<1>) will disable the
normal Timer and Counter modes and enable a timer
carry-out wake-up event.
Enabling an interrupt is accomplished via the
respective Timer Interrupt Enable bit, T1IE. The Timer
Interrupt Enable bit is located in the IEC0 Control
register in the interrupt controller.
When the CPU enters Sleep mode, the RTC will continue to operate, provided the 32 kHz external crystal
oscillator is active and the control bits have not been
changed. The TSIDL bit should be cleared to ‘0’ in
order for RTC to continue operation in Idle mode.
9.5
9.5.2
Real-Time Clock
Timer1, when operating in Real-Time Clock (RTC)
mode, provides time-of-day and event time-stamping
capabilities. Key operational features of the RTC are:
•
•
•
•
Operation from 32 kHz LP oscillator
8-bit prescaler
Low power
Real-Time Clock interrupts
These Operating modes are determined by setting the
appropriate bit(s) in the T1CON Control register.
FIGURE 9-2:
RTC INTERRUPTS
When an interrupt event occurs, the respective
interrupt flag, T1IF, is asserted and an interrupt will be
generated, if enabled. The T1IF bit must be cleared in
software. The respective Timer Interrupt Flag, T1IF, is
located in the IFS0 STATUS register in the interrupt
controller.
Enabling an interrupt is accomplished via the respective Timer Interrupt Enable bit, T1IE. The Timer
Interrupt Enable bit is located in the IEC0 Control
register in the interrupt controller.
RECOMMENDED
COMPONENTS FOR
TIMER1 LP OSCILLATOR
RTC
C1
SOSCI
32.768 kHz
XTAL
dsPIC30FXXXX
SOSCO
C2
R
C1 = C2 = 18 pF; R = 100K
© 2006 Microchip Technology Inc.
DS70150B-page 65
SFR Name
Addr.
TIMER1 REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
TMR1
0100
Timer1 Register
PR1
0102
Period Register 1
T1CON
0104
TON
—
TSIDL
—
—
—
—
—
—
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TGATE
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
uuuu uuuu uuuu uuuu
1111 1111 1111 1111
TCKPS1 TCKPS0
—
TSYNC
TCS
—
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150B-page 66
TABLE 9-1:
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
10.0
TIMER2/3 MODULE
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
This section describes the 32-bit General Purpose
(GP) Timer module (Timer2/3) and associated operational modes. Figure 10-1 depicts the simplified block
diagram of the 32-bit Timer2/3 module. Figure 10-3
and Figure 10-5 show Timer2/3 configured as two
independent 16-bit timers; Timer2 and Timer3,
respectively.
Note:
Timer2 is a Type B timer and Timer3 is a
Type C timer. Please refer to the appropriate timer type in Section 24.0 "Electrical
Characteristics" of this document.
The Timer2/3 module is a 32-bit timer, which can be
configured as two 16-bit timers, with selectable operating modes. These timers are utilized by other
peripheral modules such as:
• Input Capture
• Output Compare/Simple PWM
The following sections provide a detailed description,
including setup and control registers, along with associated block diagrams for the operational modes of the
timers.
The 32-bit timer has the following modes:
• Two independent 16-bit timers (Timer2 and
Timer3) with all 16-bit operating modes (except
Asynchronous Counter mode)
• Single 32-bit Timer operation
• Single 32-bit Synchronous Counter
Further, the following operational characteristics are
supported:
•
•
•
•
•
ADC Event Trigger
Timer Gate Operation
Selectable Prescaler Settings
Timer Operation during Idle and Sleep modes
Interrupt on a 32-bit Period Register Match
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit T2CON and T3CON
SFRs.
© 2006 Microchip Technology Inc.
For 32-bit timer/counter operation, Timer2 is the least
significant word and Timer3 is the most significant word
of the 32-bit timer.
Note:
For 32-bit timer operation, T3CON control
bits are ignored. Only T2CON control bits
are used for setup and control. Timer2
clock and gate inputs are utilized for the
32-bit timer module, but an interrupt is
generated with the Timer3 Interrupt Flag
(T3IF) and the interrupt is enabled with the
Timer3 Interrupt Enable bit (T3IE).
16-bit Mode: In the 16-bit mode, Timer2 and Timer3
can be configured as two independent 16-bit timers.
Each timer can be set up in either 16-bit Timer mode or
16-bit Synchronous Counter mode. See Section 9.0
“Timer1 Module”, Timer1 Module, for details on these
two operating modes.
The only functional difference between Timer2 and
Timer3 is that Timer2 provides synchronization of the
clock prescaler output. This is useful for high frequency
external clock inputs.
32-bit Timer Mode: In the 32-bit Timer mode, the timer
increments on every instruction cycle up to a match
value, preloaded into the combined 32-bit period
register, PR3/PR2, then resets to ‘0’ and continues to
count.
For synchronous 32-bit reads of the Timer2/Timer3
pair, reading the lsw (TMR2 register) will cause the
msw to be read and latched into a 16-bit holding
register, termed TMR3HLD.
For synchronous 32-bit writes, the holding register
(TMR3HLD) must first be written to. When followed by
a write to the TMR2 register, the contents of TMR3HLD
will be transferred and latched into the MSB of the
32-bit timer (TMR3).
32-bit Synchronous Counter Mode: In the 32-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal,
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in the
combined 32-bit period register, PR3/PR2, then resets
to ‘0’ and continues.
When the timer is configured for the Synchronous
Counter mode of operation and the CPU goes into the
Idle mode, the timer will stop incrementing, unless the
TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer
module logic will resume the incrementing sequence
upon termination of the CPU Idle mode.
DS70150B-page 67
dsPIC30F6010A/6015
FIGURE 10-1:
32-BIT TIMER2/3 BLOCK DIAGRAM FOR dsPIC30F6010A
Data Bus<15:0>
TMR3HLD
16
16
Write TMR2
Read TMR2
16
Reset
TMR3
TMR2
MSB
LSB
Sync
ADC Event Trigger
Equal
Comparator x 32
PR3
PR2
0
T3IF
Event Flag
1
D
Q
CK
TGATE (T2CON<6>)
TCS
TGATE
TGATE
(T2CON<6>)
Q
TON
T2CK
Note:
TCKPS<1:0>
2
1x
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
Timer Configuration bit T32, T2CON(<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control
bits are respective to the T2CON register.
DS70150B-page 68
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 10-2:
32-BIT TIMER2/3 BLOCK DIAGRAM FOR dsPIC30F6015
Data Bus<15:0>
TMR3HLD
16
16
Write TMR2
Read TMR2
16
Reset
TMR3
TMR2
MSB
LSB
Sync
ADC Event Trigger
Equal
Comparator x 32
PR3
PR2
0
T3IF
Event Flag
1
D
Q
CK
TGATE(T2CON<6>)
TCS
TGATE
TGATE
(T2CON<6>)
Q
TON
TCKPS<1:0>
2
1x
Note:
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
Timer Configuration bit T32, T2CON(<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control
bits are respective to the T2CON register.
© 2006 Microchip Technology Inc.
DS70150B-page 69
dsPIC30F6010A/6015
FIGURE 10-3:
16-BIT TIMER2 BLOCK DIAGRAM (TYPE B TIMER) FOR dsPIC30F6010A
PR2
Equal
Reset
TMR2
Sync
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
T2IF
Event Flag
Comparator x 16
TGATE
TON
T2CK
FIGURE 10-4:
TCKPS<1:0>
2
1x
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
16-BIT TIMER2 BLOCK DIAGRAM (TYPE B TIMER) FOR DSPIC30F6015
PR2
Equal
Reset
TMR2
Sync
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
T2IF
Event Flag
Comparator x 16
TGATE
TON
TCKPS<1:0>
2
1x
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
Note: The dsPIC30F6015 does not have an external pin input to TIMER2. The following modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
DS70150B-page 70
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 10-5:
16-BIT TIMER3 BLOCK DIAGRAM (TYPE C TIMER)
PR3
ADC Event Trigger
Equal
Reset
TMR3
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
T3IF
Event Flag
Comparator x 16
TGATE
Sync
TON
1x
01
TCY
TCKPS<1:0>
2
Prescaler
1, 8, 64, 256
00
Note: The dsPIC30F6010A/6015 devices do not have an external pin input to Timer3. These modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
© 2006 Microchip Technology Inc.
DS70150B-page 71
dsPIC30F6010A/6015
10.1
Timer Gate Operation
The 32-bit timer can be placed in the Gated Time
Accumulation mode. This mode allows the internal TCY
to increment the respective timer when the gate input
signal (T2CK pin) is asserted high. Control bit TGATE
(T2CON<6>) must be set to enable this mode. When in
this mode, Timer2 is the originating clock source. The
TGATE setting is ignored for Timer3. The timer must be
enabled (TON = 1) and the timer clock source set to
internal (TCS = 0).
The falling edge of the external signal terminates the
count operation, but does not reset the timer. The user
must reset the timer in order to start counting from zero.
10.2
ADC Event Trigger
When a match occurs between the 32-bit timer (TMR3/
TMR2) and the 32-bit combined period register (PR3/
PR2), a special ADC trigger event signal is generated
by Timer3.
10.3
10.4
Timer Operation During Sleep
Mode
During CPU Sleep mode, the timer will not operate,
because the internal clocks are disabled.
10.5
Timer Interrupt
The 32-bit timer module can generate an interrupt on
period match, or on the falling edge of the external gate
signal. When the 32-bit timer count matches the
respective 32-bit period register, or the falling edge of
the external “gate” signal is detected, the T3IF bit
(IFS0<7>) is asserted and an interrupt will be generated if enabled. In this mode, the T3IF interrupt flag is
used as the source of the interrupt. The T3IF bit must
be cleared in software.
Enabling an interrupt is accomplished via the
respective Timer Interrupt Enable bit, T3IE (IEC0<7>).
Timer Prescaler
The input clock (FOSC/4 or external clock) to the timer
has a prescale option of 1:1, 1:8, 1:64, and 1:256
selected by control bits TCKPS<1:0> (T2CON<5:4>
and T3CON<5:4>). For the 32-bit timer operation, the
originating clock source is Timer2. The prescaler operation for Timer3 is not applicable in this mode. The
prescaler counter is cleared when any of the following
occurs:
• a write to the TMR2/TMR3 register
• clearing either of the TON (T2CON<15> or
T3CON<15>) bits to ‘0’
• device Reset such as POR and BOR
However, if the timer is disabled (TON = 0), then the
Timer2 prescaler cannot be reset, since the prescaler
clock is halted.
TMR2/TMR3 is not cleared when T2CON/T3CON is
written.
DS70150B-page 72
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 10-1:
TIMER2/3 REGISTER MAP
SFR Name Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TMR2
0106
Timer2 Register
uuuu uuuu uuuu uuuu
TMR3HLD
0108
Timer3 Holding Register (For 32-bit timer operations only)
uuuu uuuu uuuu uuuu
TMR3
010A
Timer3 Register
uuuu uuuu uuuu uuuu
PR2
010C
Period Register 2
1111 1111 1111 1111
PR3
010E
T2CON
0110
Period Register 3
TON
1111 1111 1111 1111
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS1 TCKPS0
T32
—
TCS
—
0000 0000 0000 0000
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS1 TCKPS0
—
—
TCS
—
0000 0000 0000 0000
T3CON
Legend:
0112
TON
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F6010A/6015
DS70150B-page 73
dsPIC30F6010A/6015
NOTES:
DS70150B-page 74
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
11.0
TIMER4/5 MODULE
The Timer4/5 module is similar in operation to the
Timer2/3 module. However, there are some
differences, which are listed below:
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
• The Timer4/5 module does not support the ADC
Event Trigger feature
• Timer4/5 can not be utilized by other peripheral
modules such as Input Capture and Output Compare
The operating modes of the Timer4/5 module are
determined by setting the appropriate bit(s) in the 16-bit
T4CON and T5CON SFRs.
This section describes the second 32-bit General
Purpose (GP) Timer module (Timer4/5) and associated
operational modes. Figure 11-1 depicts the simplified
block diagram of the 32-bit Timer4/5 Module.
Figure 11-2 and Figure 11-3 show Timer4/5 configured
as two independent 16-bit timers, Timer4 and Timer5,
respectively.
Note:
For 32-bit timer/counter operation, Timer4 is the lsw
and Timer5 is the msw of the 32-bit timer.
Note:
For 32-bit timer operation, T5CON control
bits are ignored. Only T4CON control bits
are used for setup and control. Timer4
clock and gate inputs are utilized for the
32-bit timer module, but an interrupt is
generated with the Timer5 Interrupt Flag
(T5IF) and the interrupt is enabled with the
Timer5 Interrupt Enable bit (T5IE).
Timer4 is a Type B timer and Timer5 is a
Type C timer. Please refer to the appropriate timer type in Section 24.0 "Electrical
Characteristics" of this document.
FIGURE 11-1:
32-BIT TIMER4/5 BLOCK DIAGRAM
Data Bus<15:0>
TMR5HLD
16
16
Write TMR4
Read TMR4
16
Reset
Equal
TMR5
TMR4
MSB
LSB
Comparator x 32
PR5
PR4
0
1
Q
D
Q
CK
TGATE(T4CON<6>)
TCS
TGATE
(T4CON<6>)
TCKPS<1:0>
TON
T4CK
2
1x
Gate
Sync
TCY
Note:
TGATE
T5IF
Event Flag
Sync
0 1
Prescaler
1, 8, 64, 256
00
Timer Configuration bit T45, T4CON(<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All
control bits are respective to the T4CON register.
© 2006 Microchip Technology Inc.
DS70150B-page 75
dsPIC30F6010A/6015
FIGURE 11-2:
16-BIT TIMER4 BLOCK DIAGRAM (TYPE B TIMER)
PR4
Equal
Comparator x 16
TMR4
Reset
Sync
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
TGATE
T4IF
Event Flag
TCKPS<1:0>
TON
T4CK
2
1x
FIGURE 11-3:
Gate
Sync
01
TCY
00
Prescaler
1, 8, 64, 256
16-BIT TIMER5 BLOCK DIAGRAM (TYPE C TIMER)
PR5
Equal
ADC Event Trigger
Comparator x 16
TMR5
Reset
0
1
Q
D
Q
CK
TGATE
TCS
TGATE
TGATE
T5IF
Event Flag
TCKPS<1:0>
TON
Sync
01
TCY
2
1x
Prescaler
1, 8, 64, 256
00
Note: The dsPIC30F6010A/6015 devices do not have an external pin input to Timer5. These modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
DS70150B-page 76
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 11-1:
SFR Name
Addr.
TIMER4/5 REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
TMR4
0114
Timer4 Register
uuuu uuuu uuuu uuuu
TMR5HLD
0116
Timer5 Holding Register (For 32-bit operations only)
uuuu uuuu uuuu uuuu
TMR5
0118
Timer5 Register
uuuu uuuu uuuu uuuu
PR4
011A
Period Register 4
1111 1111 1111 1111
PR5
011C
T4CON
011E
Period Register 5
1111 1111 1111 1111
TON
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS1
TCKPS0
T45
—
TCS
—
0000 0000 0000 0000
T5CON
Legend:
0120
TON
u = uninitialized bit
—
TSIDL
—
—
—
—
—
—
TGATE
TCKPS1
TCKPS0
—
—
TCS
—
0000 0000 0000 0000
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F6010A/6015
DS70150B-page 77
dsPIC30F6010A/6015
NOTES:
DS70150B-page 78
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
12.0
INPUT CAPTURE MODULE
12.1
Simple Capture Event Mode
The simple capture events in the dsPIC30F product
family are:
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
•
•
•
•
•
This section describes the input capture module and
associated operational modes. The features provided by
this module are useful in applications requiring
frequency (period) and pulse measurement. Figure 12-1
depicts a block diagram of the input capture module.
Input capture is useful for such modes as:
Capture every falling edge
Capture every rising edge
Capture every 4th rising edge
Capture every 16th rising edge
Capture every rising and falling edge
These simple Input Capture modes are configured by
setting the appropriate bits ICM<2:0> (ICxCON<2:0>).
12.1.1
CAPTURE PRESCALER
There are four input capture prescaler settings, specified by bits ICM<2:0> (ICxCON<2:0>). Whenever the
capture channel is turned off, the prescaler counter will
be cleared. In addition, any Reset will clear the
prescaler counter.
• Frequency/Period/Pulse Measurements
• Additional sources of External Interrupts
The key operational features of the input capture
module are:
• Simple Capture Event mode
• Timer2 and Timer3 mode selection
• Interrupt on input capture event
These operating modes are determined by setting the
appropriate bits in the ICxCON register (where
x = 1,2,...,N). The dsPIC30F6010A and dsPIC30F6015
devices have eight capture channels.
FIGURE 12-1:
INPUT CAPTURE MODE BLOCK DIAGRAM
From GP Timer Module
T3_CNT
T2_CNT
16
ICx
Pin
16
ICTMR
1
Prescaler
1, 4, 16
3
Edge
Detection
Logic
Clock
Synchronizer
0
FIFO
R/W
Logic
ICM<2:0>
Mode Select
ICxBUF
ICBNE, ICOV
ICI<1:0>
ICxCON
Data Bus
Note:
Interrupt
Logic
Set Flag
ICxIF
Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input
capture channels 1 through N.
© 2006 Microchip Technology Inc.
DS70150B-page 79
dsPIC30F6010A/6015
12.1.2
CAPTURE BUFFER OPERATION
Each capture channel has an associated FIFO buffer,
which is four 16-bit words deep. There are two status
flags, which provide status on the FIFO buffer:
• ICBNE – Input Capture Buffer Not Empty
• ICOV – Input Capture Overflow
The ICBFNE will be set on the first input capture event
and remain set until all capture events have been read
from the FIFO. As each word is read from the FIFO, the
remaining words are advanced by one position within
the buffer.
In the event that the FIFO is full with four capture
events and a fifth capture event occurs prior to a read
of the FIFO, an overflow condition will occur and the
ICOV bit will be set to a logic ‘1’. The fifth capture event
is lost and is not stored in the FIFO. No additional
events will be captured till all four events have been
read from the buffer.
If a FIFO read is performed after the last read and no
new capture event has been received, the read will
yield indeterminate results.
12.1.3
TIMER2 AND TIMER3 SELECTION
MODE
Each capture channel can select between one of two
timers for the time base, Timer2 or Timer3.
Selection of the timer resource is accomplished
through SFR bit ICTMR (ICxCON<7>). Timer3 is the
default timer resource available for the input capture
module.
12.1.4
HALL SENSOR MODE
When the input capture module is set for capture on
every edge, rising and falling, ICM<2:0> = 001, the following operations are performed by the input capture
logic:
• The input capture interrupt flag is set on every
edge, rising and falling.
• The interrupt on Capture mode setting bits,
ICI<1:0>, is ignored, since every capture
generates an interrupt.
• A capture overflow condition is not generated in
this mode.
12.2
Input Capture Operation During
Sleep and Idle Modes
An input capture event will generate a device wake-up
or interrupt, if enabled, if the device is in CPU Idle or
Sleep mode.
Independent of the timer being enabled, the input
capture module will wake-up from the CPU Sleep or Idle
mode when a capture event occurs, if ICM<2:0> = 111
and the interrupt enable bit is asserted. The same wakeup can generate an interrupt, if the conditions for processing the interrupt have been satisfied. The wake-up
feature is useful as a method of adding extra external pin
interrupts.
12.2.1
INPUT CAPTURE IN CPU SLEEP
MODE
CPU Sleep mode allows input capture module operation with reduced functionality. In the CPU Sleep
mode, the ICI<1:0> bits are not applicable, and the
input capture module can only function as an external
interrupt source.
The capture module must be configured for interrupt
only on the rising edge (ICM<2:0> = 111), in order for
the input capture module to be used while the device
is in Sleep mode. The prescale settings of 4:1 or 16:1
are not applicable in this mode.
12.2.2
INPUT CAPTURE IN CPU IDLE
MODE
CPU Idle mode allows input capture module operation
with full functionality. In the CPU Idle mode, the Interrupt mode selected by the ICI<1:0> bits is applicable,
as well as the 4:1 and 16:1 capture prescale settings,
which are defined by control bits ICM<2:0>. This mode
requires the selected timer to be enabled. Moreover,
the ICSIDL bit must be asserted to a logic ‘0’.
If the input capture module is defined as
ICM<2:0> = 111 in CPU Idle mode, the input capture
pin will serve only as an external interrupt pin.
12.3
Input Capture Interrupts
The input capture channels have the ability to generate
an interrupt, based upon the selected number of capture events. The selection number is set by control bits
ICI<1:0> (ICxCON<6:5>).
Each channel provides an interrupt flag (ICxIF) bit. The
respective Capture Channel Interrupt Flag is located in
the corresponding IFSx STATUS register.
Enabling an interrupt is accomplished via the respective Capture Channel Interrupt Enable (ICxIE) bit. The
Capture Interrupt Enable bit is located in the
corresponding IEC Control register.
DS70150B-page 80
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 12-1:
SFR Name Addr.
IC1BUF
0140
IC1CON
0142
IC2BUF
0144
IC2CON
0146
IC3BUF
0148
IC3CON
014A
IC4BUF
014C
IC4CON
014E
IC5BUF
0150
IC5CON
0152
IC6BUF
0154
IC6CON
0156
IC7BUF
0158
IC7CON
015A
IC8BUF
015C
IC8CON
015E
INPUT CAPTURE REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
—
—
ICSIDL
—
—
—
—
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
ICOV
ICBNE
Bit 2
Bit 1
ICTMR
ICI<1:0>
ICM<2:0>
—
ICSIDL
—
—
—
—
—
—
ICSIDL
—
—
—
—
—
ICTMR
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICTMR
—
ICSIDL
—
—
—
—
—
—
ICSIDL
—
—
—
—
—
ICTMR
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICTMR
—
ICSIDL
—
—
—
—
—
—
ICSIDL
—
—
—
—
—
ICTMR
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
ICTMR
—
—
ICSIDL
—
—
—
—
—
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
ICTMR
ICI<1:0>
ICOV
ICBNE
ICM<2:0>
0000 0000 0000 0000
DS70150B-page 81
dsPIC30F6010A/6015
u = uninitialized bit
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 8 Capture Register
Legend:
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 7 Capture Register
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 6 Capture Register
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 5 Capture Register
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 4 Capture Register
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 3 Capture Register
—
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
Input 2 Capture Register
—
Reset State
uuuu uuuu uuuu uuuu
Input 1 Capture Register
—
Bit 0
dsPIC30F6010A/6015
NOTES:
DS70150B-page 82
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
13.0
OUTPUT COMPARE MODULE
The key operational features of the output compare
module include:
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
This section describes the output compare module and
associated operational modes. The features provided
by this module are useful in applications requiring
operational modes such as:
• Generation of Variable Width Output Pulses
• Power Factor Correction
Figure 13-1 depicts a block diagram of the output
compare module.
FIGURE 13-1:
•
•
•
•
•
•
Timer2 and Timer3 Selection mode
Simple Output Compare Match mode
Dual Output Compare Match mode
Simple PWM mode
Output Compare during Sleep and Idle modes
Interrupt on Output Compare/PWM Event
These operating modes are determined by setting the
appropriate bits in the 16-bit OCxCON SFR (where
x = 1,2,3,...,N).
The
dsPIC30F6010A
and
dsPIC30F6015 devices have eight compare channels.
OCxRS and OCxR in Figure 13-1 represent the Dual
Compare registers. In the Dual Compare mode, the
OCxR register is used for the first compare and OCxRS
is used for the second compare.
OUTPUT COMPARE MODE BLOCK DIAGRAM
Set Flag bit
OCxIF
OCxRS
Output
Logic
OCxR
3
OCM<2:0>
Mode Select
Comparator
S Q
R
OCx
Output Enable
OCFA
(for x = 1, 2, 3 or 4)
0
1
OCTSEL
0
1
or OCFB
(for x = 5, 6, 7 or 8)
From GP Timer Module
TMR2<15:0
Note:
TMR3<15:0> T2P2_MATCH
T3P3_MATCH
Where ‘x’ is shown, reference is made to the registers associated with the respective output compare
channels 1 through N.
© 2006 Microchip Technology Inc.
DS70150B-page 83
dsPIC30F6010A/6015
13.1
Timer2 and Timer3 Selection
Mode
Each output compare channel can select between one
of two 16-bit timers; Timer2 or Timer3.
The selection of the timers is controlled by the OCTSEL
bit (OCxCON<3>). Timer2 is the default timer resource
for the Output Compare module.
13.2
Simple Output Compare Match
Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 001,
010 or 011, the selected output compare channel is
configured for one of three simple output compare
match modes:
• Compare forces I/O pin low
• Compare forces I/O pin high
• Compare toggles I/O pin
The OCxR register is used in these modes. The OCxR
register is loaded with a value and is compared to the
selected incrementing timer count. When a compare
occurs, one of these compare match modes occurs. If
the counter resets to zero before reaching the value in
OCxR, the state of the OCx pin remains unchanged.
13.3
Dual Output Compare Match Mode
13.3.2
For the user to configure the module for the generation
of a continuous stream of output pulses, the following
steps are required:
• Determine instruction cycle time TCY.
• Calculate desired pulse value based on TCY.
• Calculate timer to start pulse width from timer
start value of 0x0000.
• Write pulse-width start and stop times into OCxR
and OCxRS (x denotes channel 1, 2, ...,N)
Compare registers, respectively.
• Set Timer Period register to value equal to, or
greater than, value in OCxRS Compare register.
• Set OCM<2:0> = 101.
• Enable timer, TON (TxCON<15>) = 1.
13.4
The user must perform the following steps in order to
configure the output compare module for PWM
operation:
1.
• Single Output Pulse mode
• Continuous Output Pulse mode
3.
SINGLE PULSE MODE
For the user to configure the module for the generation
of a single output pulse, the following steps are
required (assuming timer is off):
• Determine instruction cycle time TCY.
• Calculate desired pulse-width value based on
TCY.
• Calculate time to start pulse from timer start value
of 0x0000.
• Write pulse-width start and stop times into OCxR
and OCxRS Compare registers (x denotes
channel 1, 2, ...,N).
• Set Timer Period register to value equal to, or
greater than, value in OCxRS Compare register.
• Set OCM<2:0> = 100.
• Enable timer, TON (TxCON<15>) = 1.
Simple PWM Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 110
or 111, the selected output compare channel is configured for the PWM mode of operation. When configured
for the PWM mode of operation, OCxR is the main latch
(read-only) and OCxRS is the secondary latch. This
enables glitchless PWM transitions.
When control bits OCM<2:0> (OCxCON<2:0>) = 100
or 101, the selected output compare channel is configured for one of two Dual Output Compare modes,
which are:
13.3.1
CONTINUOUS PULSE MODE
2.
4.
Set the PWM period by writing to the appropriate
period register.
Set the PWM duty cycle by writing to the OCxRS
register.
Configure the output compare module for PWM
operation.
Set the TMRx prescale value and enable the
Timer, TON (TxCON<15>) = 1.
13.4.1
INPUT PIN FAULT PROTECTION
FOR PWM
When control bits OCM<2:0> (OCxCON<2:0>) = 111,
the selected output compare channel is again
configured for the PWM mode of operation, with the
additional feature of input Fault protection. While in this
mode, if a logic ‘0’ is detected on the OCFA/B pin, the
respective PWM output pin is placed in the highimpedance input state. The OCFLT bit (OCxCON<4>)
indicates whether a Fault condition has occurred. This
state will be maintained until both of the following
events have occurred:
• The external Fault condition has been removed.
• The PWM mode has been re-enabled by writing
to the appropriate control bits.
To initiate another single pulse, issue another write to
set OCM<2:0> = 100.
DS70150B-page 84
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
13.4.2
PWM PERIOD
The PWM period is specified by writing to the PRx
register. The PWM period can be calculated using
Equation 13-1.
EQUATION 13-1:
PWM PERIOD
PWM Period = [(PRx) + 1] • 4 • TOSC •
(TMRx Prescale Value)
PWM frequency is defined as 1/[PWM period].
When the selected TMRx is equal to its respective
period register, PRx, the following four events occur on
the next increment cycle:
• TMRx is cleared.
• The OCx pin is set.
- Exception 1: If PWM duty cycle is 0x0000,
the OCx pin will remain low.
- Exception 2: If duty cycle is greater than PRx,
the pin will remain high.
• The PWM duty cycle is latched from OCxRS into
OCxR.
• The corresponding timer interrupt flag is set.
See Figure 13-2 for key PWM period comparisons.
Timer3 is referred to in the figure for clarity.
FIGURE 13-2:
PWM OUTPUT TIMING
Period
Duty Cycle
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
13.5
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
TMR3 = Duty Cycle (OCxR)
TMR3 = Duty Cycle (OCxR)
Output Compare Operation During
CPU Sleep Mode
When the CPU enters the Sleep mode, all internal
clocks are stopped. Therefore, when the CPU enters
the Sleep state, the output compare channel will drive
the pin to the active state that was observed prior to
entering the CPU Sleep state.
For example, if the pin was high when the CPU
entered the Sleep state, the pin will remain high. Likewise, if the pin was low when the CPU entered the
Sleep state, the pin will remain low. In either case, the
output compare module will resume operation when
the device wakes up.
13.6
Output Compare Operation During
CPU Idle Mode
When the CPU enters the Idle mode, the output
compare module can operate with full functionality.
The output compare channel will operate during the
CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at
logic 0 and the selected time base (Timer2 or Timer3)
is enabled and the TSIDL bit of the selected timer is
set to logic 0.
© 2006 Microchip Technology Inc.
13.7
Output Compare Interrupts
The output compare channels have the ability to generate an interrupt on a compare match, for whichever
match mode has been selected.
For all modes except the PWM mode, when a compare
event occurs, the respective interrupt flag (OCxIF) is
asserted and an interrupt will be generated, if enabled.
The OCxIF bit is located in the corresponding IFS STATUS register and must be cleared in software. The
interrupt is enabled via the respective Compare Interrupt Enable (OCxIE) bit, located in the corresponding
IEC Control register.
For the PWM mode, when an event occurs, the respective Timer Interrupt Flag (T2IF or T3IF) is asserted and
an interrupt will be generated, if enabled. The IF bit is
located in the IFS0 STATUS register, and must be
cleared in software. The interrupt is enabled via the
respective Timer Interrupt Enable bit (T2IE or T3IE),
located in the IEC0 Control register. The output
compare interrupt flag is never set during the PWM
mode of operation.
DS70150B-page 85
OUTPUT COMPARE REGISTER MAP
SFR Name
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
OC1RS
0180
Output Compare 1 Secondary Register
OC1R
0182
Output Compare 1 Main Register
OC1CON
0184
OC2RS
0186
Output Compare 2 Secondary Register
OC2R
0188
Output Compare 2 Main Register
OC2CON
018A
OC3RS
018C
Output Compare 3 Secondary Register
OC3R
018E
Output Compare 3 Main Register
OC3CON
0190
OC4RS
0192
Output Compare 4 Secondary Register
OC4R
0194
Output Compare 4 Main Register
OC4CON
0196
OC5RS
0198
Output Compare 5 Secondary Register
OC5R
019A
Output Compare 5 Main Register
OC5CON
019C
OC6RS
019E
Output Compare 6 Secondary Register
OC6R
01A0
Output Compare 6 Main Register
OC6CON
01A2
OC7RS
01A4
Output Compare 7 Secondary Register
OC7R
01A6
Output Compare 7 Main Register
OC7CON
01A8
OC8RS
01AA
Output Compare 8 Secondary Register
OC8R
01AC
Output Compare 8 Main Register
—
—
—
—
—
—
—
OC8CON
01AE
—
Legend: u = uninitialized bit
Note:
—
—
—
—
—
—
—
—
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
OCSIDL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
—
—
—
—
—
—
—
—
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSE
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
0000 0000 0000 0000
0000 0000 0000 0000
—
OCFLT
OCTSEL
OCM<2:0>
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150B-page 86
TABLE 13-1:
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
14.0
QUADRATURE ENCODER
INTERFACE (QEI) MODULE
The operational features of the QEI include:
• Three input channels for two phase signals and
index pulse
• 16-bit up/down position counter
• Count direction status
• Position Measurement (x2 and x4) mode
• Programmable digital noise filters on inputs
• Alternate 16-bit Timer/Counter mode
• Quadrature Encoder Interface interrupts
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
This section describes the Quadrature Encoder Interface (QEI) module and associated operational modes.
The QEI module provides the interface to incremental
encoders for obtaining mechanical position data.
FIGURE 14-1:
These operating modes are determined by setting the
appropriate bits, QEIM<2:0> (QEICON<10:8>).
Figure 14-1 depicts the Quadrature Encoder Interface
block diagram.
QUADRATURE ENCODER INTERFACE BLOCK DIAGRAM
TQCKPS<1:0>
Sleep Input
TQCS
TCY
Synchronize
0
Det
1
2
Prescaler
1, 8, 64, 256
1
QEIM<2:0>
0
TQGATE
QEA
Programmable
Digital Filter
UPDN_SRC
0
QEICON<11>
2
Quadrature
Encoder
Interface Logic
QEB
Programmable
Digital Filter
INDX
Programmable
Digital Filter
Q
CK
Q
QEIIF
Event
Flag
16-bit Up/Down Counter
(POSCNT)
Reset
Comparator/
Zero Detect
Equal
3
QEIM<2:0>
Mode Select
1
D
Max Count Register
(MAXCNT)
3
PCDOUT
Existing Pin Logic
0
UPDN
1
© 2006 Microchip Technology Inc.
Up/Down
DS70150B-page 87
dsPIC30F6010A/6015
14.1
Quadrature Encoder Interface
Logic
A typical incremental (a.k.a. optical) encoder has three
outputs: Phase A, Phase B, and an index pulse. These
signals are useful and often required in position and
speed control of ACIM and SR motors.
The two channels, Phase A (QEA) and Phase B (QEB),
have a unique relationship. If Phase A leads Phase B,
then the direction (of the motor) is deemed positive or
forward. If Phase A lags Phase B, then the direction (of
the motor) is deemed negative or reverse.
A third channel, termed index pulse, occurs once per
revolution and is used as a reference to establish an
absolute position. The index pulse coincides with
Phase A and Phase B, both low.
14.2
16-bit Up/Down Position Counter
Mode
The 16-bit up/down counter counts up or down on
every count pulse, which is generated by the difference
of the Phase A and Phase B input signals. The counter
acts as an integrator, whose count value is proportional
to position. The direction of the count is determined by
the UPDN signal, which is generated by the
Quadrature Encoder Interface logic.
14.2.1
POSITION COUNTER ERROR
CHECKING
Position count error checking in the QEI is provided for
and indicated by the CNTERR bit (QEICON<15>). The
error checking only applies when the position counter
is configured for Reset on the Index Pulse modes
(QEIM<2:0> = ‘110’ or ‘100’). In these modes, the
contents of the POSCNT register are compared with
the values (0xFFFF or MAXCNT + 1, depending on
direction). If these values are detected, an error condition is generated by setting the CNTERR bit and a QEI
count error interrupt is generated. The QEI count error
interrupt can be disabled by setting the CEID bit
(DFLTCON<8>). The position counter continues to
count encoder edges after an error has been detected.
The POSCNT register continues to count up/down until
a natural rollover/underflow. No interrupt is generated
for the natural rollover/underflow event. The CNTERR
bit is a read/write bit and reset in software by the user.
14.2.2
POSITION COUNTER RESET
The Position Counter Reset Enable bit, POSRES
(QEI<2>), controls whether the position counter is reset
when the index pulse is detected. This bit is only
applicable when QEIM<2:0> = 100 or 110.
DS70150B-page 88
If the POSRES bit is set to ‘1’, then the position counter
is reset when the index pulse is detected. If the
POSRES bit is set to ‘0’, then the position counter is not
reset when the index pulse is detected. The position
counter will continue counting up or down, and will be
reset on the rollover or underflow condition.
The interrupt is still generated on the detection of the
index pulse and not on the position counter overflow/
underflow.
14.2.3
COUNT DIRECTION STATUS
As mentioned in the previous section, the QEI logic
generates an UPDN signal, based upon the relationship between Phase A and Phase B. In addition to the
output pin, the state of this internal UPDN signal is
supplied to a SFR bit, UPDN (QEICON<11>) as a readonly bit. To place the state of this signal on an I/O pin,
the SFR bit, PCDOUT (QEICON<6>), must be 1.
14.3
Position Measurement Mode
There are two measurement modes which are
supported and are termed x2 and x4. These modes are
selected by the QEIM<2:0> mode select bits located in
SFR QEICON<10:8>.
When control bits QEIM<2:0> = 100 or 101, the x2
Measurement mode is selected and the QEI logic only
looks at the Phase A input for the position counter
increment rate. Every rising and falling edge of the
Phase A signal causes the position counter to be incremented or decremented. The Phase B signal is still
utilized for the determination of the counter direction,
just as in the x4 mode.
Within the x2 Measurement mode, there are two
variations of how the position counter is reset:
1.
2.
Position counter reset by detection of index
pulse, QEIM<2:0> = 100.
Position counter reset by match with MAXCNT,
QEIM<2:0> = 101.
When control bits QEIM<2:0> = 110 or 111, the x4
Measurement mode is selected and the QEI logic looks
at both edges of the Phase A and Phase B input signals. Every edge of both signals causes the position
counter to increment or decrement.
Within the x4 Measurement mode, there are two
variations of how the position counter is reset:
1.
2.
Position counter reset by detection of index
pulse, QEIM<2:0> = 110.
Position counter reset by match with MAXCNT,
QEIM<2:0> = 111.
The x4 Measurement mode provides for finer resolution data (more position counts) for determining motor
position.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
14.4
Programmable Digital Noise
Filters
The digital noise filter section is responsible for
rejecting noise on the incoming capture or quadrature
signals. Schmitt Trigger inputs and a three-clock cycle
delay filter combine to reject low level noise and large,
short duration noise spikes that typically occur in noise
prone applications, such as a motor system.
In addition, control bit, UDSRC (QEICON<0>), determines whether the timer count direction state is based
on the logic state, written into the UPDN control/Status
bit (QEICON<11>), or the QEB pin state. When
UDSRC = 1, the timer count direction is controlled from
the QEB pin. Likewise, when UDSRC = 0, the timer
count direction is controlled by the UPDN bit.
Note:
The filter ensures that the filtered output signal is not
permitted to change until a stable value has been
registered for three consecutive clock cycles.
For the QEA, QEB and INDX pins, the clock divide
frequency for the digital filter is programmed by bits
QECK<2:0> (DFLTCON<6:4>) and are derived from
the base instruction cycle TCY.
To enable the filter output for channels QEA, QEB and
INDX, the QEOUT bit must be ‘1’. The filter network for
all channels is disabled on POR and BOR.
14.5
Alternate 16-bit Timer/Counter
When the QEI module is not configured for the QEI
mode QEIM<2:0> = 001, the module can be configured
as a simple 16-bit timer/counter. The setup and control
of the auxiliary timer is accomplished through the
QEICON SFR register. This timer functions identically
to Timer1. The QEA pin is used as the timer clock input.
When configured as a timer, the POSCNT register
serves as the Timer Count register and the MAXCNT
register serves as the Period register. When a Timer/
Period register match occur, the QEI interrupt flag will
be asserted.
The only exception between the general purpose
timers and this timer is the added feature of external
up/down input select. When the UPDN pin is asserted
high, the timer will increment up. When the UPDN pin
is asserted low, the timer will be decremented.
Note:
Changing the operational mode (i.e., from
QEI to Timer or vice versa), will not affect
the Timer/Position Count register contents.
14.6
14.6.1
This Timer does not support the External
Asynchronous Counter mode of operation.
If using an external clock source, the clock
will automatically be synchronized to the
internal instruction cycle.
QEI Module Operation During CPU
Sleep Mode
QEI OPERATION DURING CPU
SLEEP MODE
The QEI module will be halted during the CPU Sleep
mode.
14.6.2
TIMER OPERATION DURING CPU
SLEEP MODE
During CPU Sleep mode, the timer will not operate,
because the internal clocks are disabled.
14.7
QEI Module Operation During CPU
Idle Mode
Since the QEI module can function as a Quadrature
Encoder Interface, or as a 16-bit timer, the following
section describes operation of the module in both
modes.
14.7.1
QEI OPERATION DURING CPU IDLE
MODE
When the CPU is placed in the Idle mode, the QEI
module will operate if the QEISIDL bit (QEICON<13>)
= 0. This bit defaults to a logic ‘0’ upon executing POR
and BOR. For halting the QEI module during the CPU
Idle mode, QEISIDL should be set to ‘1’.
The UPDN control/Status bit (QEICON<11>) can be
used to select the count direction state of the Timer
register. When UPDN = 1, the timer will count up.
When UPDN = 0, the timer will count down.
© 2006 Microchip Technology Inc.
DS70150B-page 89
dsPIC30F6010A/6015
14.7.2
TIMER OPERATION DURING CPU
IDLE MODE
When the CPU is placed in the Idle mode and the QEI
module is configured in the 16-bit Timer mode, the
16-bit timer will operate if the QEISIDL bit
(QEICON<13>) = 0. This bit defaults to a logic ‘0’ upon
executing POR and BOR. For halting the timer module
during the CPU Idle mode, QEISIDL should be set
to ‘1’.
If the QEISIDL bit is cleared, the timer will function
normally, as if the CPU Idle mode had not been
entered.
14.8
Quadrature Encoder Interface
Interrupts
The Quadrature Encoder Interface has the ability to
generate an interrupt on occurrence of the following
events:
• Interrupt on 16-bit up/down position counter
rollover/underflow
• Detection of qualified index pulse, or if CNTERR
bit is set
• Timer period match event (overflow/underflow)
• Gate accumulation event
The QEI Interrupt Flag bit, QEIIF, is asserted upon
occurrence of any of the above events. The QEIIF bit
must be cleared in software. QEIIF is located in the
IFS2 STATUS register.
Enabling an interrupt is accomplished via the respective enable bit, QEIIE. The QEIIE bit is located in the
IEC2 Control register.
DS70150B-page 90
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 14-1:
SFR
Name
Addr.
QEI REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12 Bit 11
—
QEISIDL
INDX UPDN
—
—
Bit 10
Bit 9
Bit 8
QEIM<2:0>
Bit 7
Bit 6
Bit 5
SWPAB PCDOUT TQGATE
Bit 4
Bit 3
TQCKPS<1:0>
Bit 2
Bit 1
POSRES TQCS
Bit 0
Reset State
UDSRC
0000 0000 0000 0000
—
0000 0000 0000 0000
QEICON
0122 CNTERR
DFLTCON
0124
POSCNT
0126
Position Counter<15:0>
0000 0000 0000 0000
MAXCNT
0128
Legend: u = uninitialized bit
Maximun Count<15:0>
1111 1111 1111 1111
Note:
—
—
—
IMV<1:0>
CEID
QEOUT
QECK<2:0>
—
—
—
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F6010A/6015
DS70150B-page 91
dsPIC30F6010A/6015
NOTES:
DS70150B-page 92
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
15.0
MOTOR CONTROL PWM
MODULE
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
The PWM module has the following features:
•
•
•
•
•
•
This module simplifies the task of generating multiple,
synchronized Pulse-Width Modulated (PWM) outputs.
In particular, the following power and motion control
applications are supported by the PWM module:
•
•
•
•
•
•
Three Phase AC Induction Motor
Switched Reluctance (SR) Motor
Brushless DC (BLDC) Motor
Uninterruptible Power Supply (UPS)
•
•
8 PWM I/O pins with 4 duty cycle generators
Up to 16-bit resolution
‘On-the-Fly’ PWM frequency changes
Edge and Center-Aligned Output modes
Single Pulse Generation mode
Interrupt support for asymmetrical updates in
Center-Aligned mode
Output override control for Electrically
Commutative Motor (ECM) operation
‘Special Event’ comparator for scheduling other
peripheral events
Fault pins to optionally drive each of the PWM
output pins to a defined state
Duty cycle updates are configurable to be
immediate or synchronized to the PWM time base
This module contains 4 duty cycle generators, numbered 1 through 4. The module has 8 PWM output pins,
numbered PWM1H/PWM1L through PWM4H/PWM4L.
The eight I/O pins are grouped into high/low numbered
pairs, denoted by the suffix H or L, respectively. For
complementary loads, the low PWM pins are always
the complement of the corresponding high I/O pin.
The PWM module allows several modes of operation
which are beneficial for specific power control
applications.
© 2006 Microchip Technology Inc.
DS70150B-page 93
dsPIC30F6010A/6015
FIGURE 15-1:
PWM MODULE BLOCK DIAGRAM
PWMCON1
PWM Enable and Mode SFRs
PWMCON2
DTCON1
Dead-Time Control SFRs
DTCON2
FLTACON
Fault Pin Control SFRs
FLTBCON
OVDCON
PWM Manual
Control SFR
PWM Generator #4
16-bit Data Bus
PDC4 Buffer
PDC4
Comparator
PWM Generator
#3
PTMR
Channel 3 Dead-Time
Generator and
Override Logic
Comparator
PWM Generator
#2
PTPER
PWM Generator
#1
PTPER Buffer
PWM4H
Channel 4 Dead-Time
Generator and
Override Logic
PWM4L
PWM3H
Output
Driver
PWM3L
Block
Channel 2 Dead-Time
Generator and
Override Logic
Channel 1 Dead-Time
Generator and
Override Logic
PWM2H
PWM2L
PWM1H
PWM1L
FLTA
PTCON
FLTB
Comparator
SEVTDIR
SEVTCMP
Special Event
Postscaler
Special Event Trigger
PTDIR
PWM Time Base
Note:
Details of PWM Generator #1, #2 and #3 not shown for clarity.
DS70150B-page 94
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
15.1
PWM Time Base
The PWM time base is provided by a 15-bit timer with
a prescaler and postscaler. The time base is accessible
via the PTMR SFR. PTMR<15> is a read-only Status
bit, PTDIR, that indicates the present count direction of
the PWM time base. If PTDIR is cleared, PTMR is
counting upwards. If PTDIR is set, PTMR is counting
downwards. The PWM time base is configured via the
PTCON SFR. The time base is enabled/disabled by
setting/clearing the PTEN bit in the PTCON SFR.
PTMR is not cleared when the PTEN bit is cleared in
software.
The PTPER SFR sets the counting period for PTMR.
The user must write a 15-bit value to PTPER<14:0>.
When the value in PTMR<14:0> matches the value in
PTPER<14:0>, the time base will either reset to ‘0’, or
reverse the count direction on the next occurring clock
cycle. The action taken depends on the operating
mode of the time base.
Note:
If the Period register is set to 0x0000, the
timer will stop counting, and the interrupt
and the special event trigger will not be
generated, even if the special event value
is also 0x0000. The module will not update
the Period register, if it is already at
0x0000; therefore, the user must disable
the module in order to update the Period
register.
The PWM time base can be configured for four different
modes of operation:
•
•
•
•
Free-Running mode
Single-Shot mode
Continuous Up/Down Count mode
Continuous Up/Down Count mode with interrupts
for double updates
These four modes are selected by the PTMOD<1:0>
bits in the PTCON SFR. The Up/Down Counting modes
support center-aligned PWM generation. The SingleShot mode allows the PWM module to support pulse
control of certain Electronically Commutative Motors
(ECMs).
The interrupt signals generated by the PWM time base
depend on the mode selection bits (PTMOD<1:0>) and
the postscaler bits (PTOPS<3:0>) in the PTCON SFR.
© 2006 Microchip Technology Inc.
15.1.1
FREE-RUNNING MODE
In the Free-Running mode, the PWM time base counts
upwards until the value in the Time Base Period register (PTPER) is matched. The PTMR register is reset on
the following input clock edge and the time base will
continue to count upwards as long as the PTEN bit
remains set.
When the PWM time base is in the Free-Running mode
(PTMOD<1:0> = 00), an interrupt event is generated
each time a match with the PTPER register occurs and
the PTMR register is reset to zero. The postscaler
selection bits may be used in this mode of the timer to
reduce the frequency of the interrupt events.
15.1.2
SINGLE-SHOT MODE
In the Single-Shot Counting mode, the PWM time base
begins counting upwards when the PTEN bit is set.
When the value in the PTMR register matches the
PTPER register, the PTMR register will be reset on the
following input clock edge and the PTEN bit will be
cleared by the hardware to halt the time base.
When the PWM time base is in the Single-Shot mode
(PTMOD<1:0> = 01), an interrupt event is generated
when a match with the PTPER register occurs, the
PTMR register is reset to zero on the following input
clock edge, and the PTEN bit is cleared. The postscaler
selection bits have no effect in this mode of the timer.
15.1.3
CONTINUOUS UP/DOWN
COUNTING MODES
In the Continuous Up/Down Counting modes, the PWM
time base counts upwards until the value in the PTPER
register is matched. The timer will begin counting
downwards on the following input clock edge. The
PTDIR bit in the PTMR SFR is read-only and indicates
the counting direction The PTDIR bit is set when the
timer counts downwards.
In the Up/Down Counting mode (PTMOD<1:0> = 10),
an interrupt event is generated each time the value of
the PTMR register becomes zero and the PWM time
base begins to count upwards. The postscaler selection bits may be used in this mode of the timer to reduce
the frequency of the interrupt events.
DS70150B-page 95
dsPIC30F6010A/6015
15.1.4
DOUBLE UPDATE MODE
EQUATION 15-1:
In the Double Update mode (PTMOD<1:0> = 11), an
interrupt event is generated each time the PTMR register is equal to zero, as well as each time a period match
occurs. The postscaler selection bits have no effect in
this mode of the timer.
The Double Update mode provides two additional functions to the user. First, the control loop bandwidth is
doubled because the PWM duty cycles can be
updated, twice per period. Second, asymmetrical center-aligned PWM waveforms can be generated, which
are useful for minimizing output waveform distortion in
certain motor control applications.
Note:
15.1.5
Programming a value of 0x0001 in the
Period register could generate a continuous interrupt pulse, and hence, must be
avoided.
PWM TIME BASE PRESCALER
The input clock to PTMR (FOSC/4), has prescaler
options of 1:1, 1:4, 1:16, or 1:64, selected by control
bits, PTCKPS<1:0>, in the PTCON SFR. The prescaler
counter is cleared when any of the following occurs:
• a write to the PTMR register
• a write to the PTCON register
• any device Reset
15.1.6
PWM TIME BASE POSTSCALER
The match output of PTMR can optionally be postscaled through a 4-bit postscaler (which gives a 1:1 to
1:16 scaling).
The postscaler counter is cleared when any of the
following occurs:
• a write to the PTMR register
• a write to the PTCON register
• any device Reset
PWM Period
PTPER is a 15-bit, double-buffered register that sets the
counting period for the PWM time base. The PTPER
buffer is loaded into the PTPER register at these instants:
• Free-Running and Single-Shot modes: When the
PTMR register is reset to zero after a match with
the PTPER register.
• Up/Down Counting modes: When the PTMR
register is zero.
The value held in the PTPER buffer is automatically
loaded into the PTPER register when the PWM time
base is disabled (PTEN = 0).
The PWM period
Equation 15-1:
DS70150B-page 96
can
be
determined
(PTMR Prescale Value)
If the PWM time base is configured for one of the Up/
Down Count modes, the PWM period will be given by
Equation 15-2.
EQUATION 15-2:
TPWM =
PWM PERIOD FOR UP/
DOWN COUNT
TCY •
2 • (PTPER + 0.75)
(PTMR Prescale Value)
The maximum resolution (in bits) for a given device
oscillator and PWM frequency can be determined using
Equation 15-3:
EQUATION 15-3:
PWM RESOLUTION
log (2 • TPWM/TCY)
Resolution =
log (2)
Edge-Aligned PWM
Edge-aligned PWM signals are produced by the module
when the PWM time base is in the Free-Running or
Single-Shot mode. For edge-aligned PWM outputs, the
output has a period specified by the value in PTPER
and a duty cycle specified by the appropriate Duty Cycle
register (see Figure 15-2). The PWM output is driven
active at the beginning of the period (PTMR = 0) and is
driven inactive when the value in the Duty Cycle register
matches PTMR.
If the value in a particular Duty Cycle register is zero,
then the output on the corresponding PWM pin will be
inactive for the entire PWM period. In addition, the output on the PWM pin will be active for the entire PWM
period if the value in the Duty Cycle register is greater
than the value held in the PTPER register.
PTMR is not cleared when PTCON is written.
15.2
TCY • (PTPER + 1)
TPWM =
15.3
PTMR is not cleared when PTCON is written.
PWM PERIOD
using
FIGURE 15-2:
EDGE-ALIGNED PWM
New Duty Cycle Latched
PTPER
PTMR
Value
0
Duty Cycle
Period
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
15.4
15.5.1
Center-Aligned PWM
Center-aligned PWM signals are produced by the module when the PWM time base is configured in an Up/
Down Counting mode (see Figure 15-3).
The PWM compare output is driven to the active state
when the value of the Duty Cycle register matches the
value of PTMR and the PWM time base is counting
downwards (PTDIR = 1). The PWM compare output is
driven to the inactive state when the PWM time base is
counting upwards (PTDIR = 0) and the value in the
PTMR register matches the duty cycle value.
If the value in a particular Duty Cycle register is zero,
then the output on the corresponding PWM pin will be
inactive for the entire PWM period. In addition, the output on the PWM pin will be active for the entire PWM
period if the value in the Duty Cycle register is equal to
the value held in the PTPER register.
FIGURE 15-3:
CENTER-ALIGNED PWM
Period/2
PTPER
PTMR
Value
Duty
Cycle
0
The four PWM Duty Cycle registers are doublebuffered to allow glitchless updates of the PWM
outputs. For each duty cycle, there is a Duty Cycle register that is accessible by the user and a second Duty
Cycle register that holds the actual compare value
used in the present PWM period.
For edge-aligned PWM output, a new duty cycle value
will be updated whenever a match with the PTPER register occurs and PTMR is reset. The contents of the
duty cycle buffers are automatically loaded into the
Duty Cycle registers when the PWM time base is disabled (PTEN = 0) and the UDIS bit is cleared in
PWMCON2.
When the PWM time base is in the Up/Down Counting
mode, new duty cycle values are updated when the
value of the PTMR register is zero and the PWM time
base begins to count upwards. The contents of the duty
cycle buffers are automatically loaded into the Duty
Cycle registers when the PWM time base is disabled
(PTEN = 0).
When the PWM time base is in the Up/Down Counting
mode with double updates, new duty cycle values are
updated when the value of the PTMR register is zero,
and when the value of the PTMR register matches the
value in the PTPER register. The contents of the duty
cycle buffers are automatically loaded into the Duty
Cycle registers when the PWM time base is disabled
(PTEN = 0).
15.5.2
Period
15.5
PWM Duty Cycle Comparison
Units
There are four 16-bit Special Function Registers
(PDC1, PDC2, PDC3 and PDC4) used to specify duty
cycle values for the PWM module.
The value in each Duty Cycle register determines the
amount of time that the PWM output is in the active
state. The Duty Cycle registers are 16-bits wide. The
LSb of a Duty Cycle register determines whether the
PWM edge occurs in the beginning. Thus, the PWM
resolution is effectively doubled.
DUTY CYCLE REGISTER BUFFERS
DUTY CYCLE IMMEDIATE
UPDATES
When the Immediate Update Enable bit is set (IUE = 1),
any write to the Duty Cycle registers will update the
new duty cycle value immediately. This feature gives
the option to the user to allow immediate updates of the
active PWM Duty Cycle registers instead of waiting for
the end of the current time base period. System stability is improved in closed loop servo applications by
reducing the delay between system observation and
the issuance of system corrective commands when
immediate updates are enabled (IUE = 1).
If the PWM output is active at the time the new duty
cycle is written and the new duty cycle is less than the
current time base value, the PWM pulse width will be
shortened. If the PWM output is active at the time the
new duty cycle is written and the new duty cycle is
greater than the current time base value, the PWM
pulse width will be lengthened.
If the PWM output is inactive at the time the new duty
cycle is written and the new duty cycle is greater than
the current time base value, the PWM output will
become active immediately and will remain active for
the new written duty cycle value.
© 2006 Microchip Technology Inc.
DS70150B-page 97
dsPIC30F6010A/6015
15.6
Complementary PWM Operation
In the Complementary mode of operation, each pair of
PWM outputs is obtained by a complementary PWM
signal. A dead time may be optionally inserted during
device switching, when both outputs are inactive for a
short period (Refer to Section 15.7 “Dead-Time
Generators”).
In Complementary mode, the duty cycle comparison
units are assigned to the PWM outputs as follows:
•
•
•
•
PDC1 register controls PWM1H/PWM1L outputs
PDC2 register controls PWM2H/PWM2L outputs
PDC3 register controls PWM3H/PWM3L outputs
PDC4 register controls PWM4H/PWM4L outputs
The Complementary mode is selected for each PWM
I/O pin pair by clearing the appropriate PMODx bit in the
PWMCON1 SFR. The PWM I/O pins are set to
Complementary mode by default upon a device Reset.
15.7
The PWM module allows two different dead times to be
programmed. These two dead times may be used in
one of two methods described below to increase user
flexibility:
• The PWM output signals can be optimized for
different turn off times in the high side and low
side transistors in a complementary pair of transistors. The first dead time is inserted between
the turn off event of the lower transistor of the
complementary pair and the turn on event of the
upper transistor. The second dead time is
inserted between the turn off event of the upper
transistor and the turn on event of the lower transistor.
• The two dead times can be assigned to individual
PWM I/O pin pairs. This Operating mode allows
the PWM module to drive different transistor/load
combinations with each complementary PWM I/O
pin pair.
DEAD-TIME GENERATORS
DEAD-TIME ASSIGNMENT
The DTCON2 SFR contains control bits that allow the
dead times to be assigned to each of the complementary outputs. Table 15-1 summarizes the function of
each dead-time selection control bit.
TABLE 15-1:
DEAD-TIME SELECTION BITS
Bit
Function
DTS1A
Selects PWM1L/PWM1H active edge dead time.
DTS1I
Selects PWM1L/PWM1H inactive edge
dead time.
DTS2A
Selects PWM2L/PWM2H active edge dead time.
DTS2I
Selects PWM2L/PWM2H inactive edge
dead time.
DTS3A
Selects PWM3L/PWM3H active edge dead time.
DTS3I
Selects PWM3L/PWM3H inactive edge
dead time.
DTS4A
Selects PWM4L/PWM4H active edge dead time.
DTS4I
Selects PWM4L/PWM4H inactive edge
dead time.
Dead-Time Generators
Dead-time generation may be provided when any of
the PWM I/O pin pairs are operating in the
Complementary Output mode. The PWM outputs use
Push-Pull drive circuits. Due to the inability of the
power output devices to switch instantaneously, some
amount of time must be provided between the turn off
event of one PWM output in a complementary pair and
the turn on event of the other transistor.
15.7.1
15.7.2
15.7.3
DEAD-TIME RANGES
The amount of dead time provided by each dead-time
unit is selected by specifying the input clock prescaler
value and a 6-bit unsigned value. The amount of dead
time provided by each unit may be set independently.
Four input clock prescaler selections have been provided to allow a suitable range of dead times, based on
the device operating frequency. The clock prescaler
option may be selected independently for each of the
two dead-time values. The dead-time clock prescaler
values are selected using the DTAPS<1:0> and
DTBPS<1:0> control bits in the DTCON1 SFR. One of
four clock prescaler options (TCY, 2 TCY, 4 TCY or 8
TCY) may be selected for each of the dead-time values.
After the prescaler values are selected, the dead time
for each unit is adjusted by loading two 6-bit unsigned
values into the DTCON1 SFR.
The dead-time unit prescalers are cleared on the
following events:
• On a load of the down timer due to a duty cycle
comparison edge event.
• On a write to the DTCON1 or DTCON2 registers.
• On any device Reset.
Note:
The user should not modify the DTCON1
or DTCON2 values while the PWM module is operating (PTEN = 1). Unexpected
results may occur.
Each complementary output pair for the PWM module
has a 6-bit down counter that is used to produce the
dead-time insertion. As shown in Figure 15-4, each
dead-time unit has a rising and falling edge detector
connected to the duty cycle comparison output.
DS70150B-page 98
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 15-4:
DEAD-TIME TIMING DIAGRAM
Duty Cycle Generator
PWMxH
PWMxL
Time selected by DTSxA bit (A or B)
15.8
Independent PWM Output
An independent PWM Output mode is required for driving certain types of loads. A particular PWM output pair
is in the Independent Output mode when the corresponding PMOD bit in the PWMCON1 register is set.
No dead-time control is implemented between adjacent
PWM I/O pins when the module is operating in the
Independent mode and both I/O pins are allowed to be
active simultaneously.
In the Independent mode, each duty cycle generator is
connected to both of the PWM I/O pins in an output
pair. By using the associated Duty Cycle register and
the appropriate bits in the OVDCON register, the user
may select the following signal output options for each
PWM I/O pin operating in the Independent mode:
• I/O pin outputs PWM signal
• I/O pin inactive
• I/O pin active
15.9
Single-Pulse PWM Operation
The PWM module produces single pulse outputs when
the PTCON control bits PTMOD<1:0> = 10. Only edgealigned outputs may be produced in the Single-Pulse
mode. In Single-Pulse mode, the PWM I/O pin(s) are
driven to the active state when the PTEN bit is set.
When a match with a Duty Cycle register occurs, the
PWM I/O pin is driven to the inactive state. When a
match with the PTPER register occurs, the PTMR
register is cleared, all active PWM I/O pins are driven
to the inactive state, the PTEN bit is cleared, and an
interrupt is generated.
© 2006 Microchip Technology Inc.
Time selected by DTSxI bit (A or B)
15.10 PWM Output Override
The PWM output override bits allow the user to manually drive the PWM I/O pins to specified logic states,
independent of the duty cycle comparison units.
All control bits associated with the PWM output override function are contained in the OVDCON register.
The upper half of the OVDCON register contains eight
bits, POVDxH<4:1> and POVDxL<4:1>, that determine
which PWM I/O pins will be overridden. The lower half
of the OVDCON register contains eight bits,
POUTxH<4:1> and POUTxL<4:1>, that determine the
state of the PWM I/O pins when a particular output is
overridden via the POVD bits.
15.10.1
COMPLEMENTARY OUTPUT MODE
When a PWMxL pin is driven active via the OVDCON
register, the output signal is forced to be the complement of the corresponding PWMxH pin in the pair.
Dead-time insertion is still performed when PWM
channels are overridden manually.
15.10.2
OVERRIDE SYNCHRONIZATION
If the OSYNC bit in the PWMCON2 register is set, all
output overrides performed via the OVDCON register
are synchronized to the PWM time base. Synchronous
output overrides occur at the following times:
• Edge-Aligned mode, when PTMR is zero.
• Center-Aligned modes, when PTMR is zero and
when the value of PTMR matches PTPER.
DS70150B-page 99
dsPIC30F6010A/6015
15.11 PWM Output and Polarity Control
15.12.2
There are three device Configuration bits associated
with the PWM module that provide PWM output pin
control:
The FLTACON and FLTBCON Special Function Registers have 8 bits each that determine the state of each
PWM I/O pin when it is overridden by a Fault input.
When these bits are cleared, the PWM I/O pin is driven
to the inactive state. If the bit is set, the PWM I/O pin
will be driven to the active state. The active and inactive
states are referenced to the polarity defined for each
PWM I/O pin (HPOL and LPOL polarity control bits).
• HPOL Configuration bit
• LPOL Configuration bit
• PWMPIN Configuration bit
These three bits in the FPORBOR Configuration register (see Section 21.0 “System Integration”) work in
conjunction with the four PWM Enable bits (PENxH and
PENxL) located in the PWMCON1 SFR. The Configuration bits and PWM Enable bits ensure that the PWM
pins are in the correct states after a device Reset
occurs. The PWMPIN configuration fuse allows the
PWM module outputs to be optionally enabled on a
device Reset. If PWMPIN = 0, the PWM outputs will be
driven to their inactive states at Reset. If PWMPIN = 1
(default), the PWM outputs will be tri-stated. The HPOL
bit specifies the polarity for the PWMxH outputs,
whereas the LPOL bit specifies the polarity for the
PWMxL outputs.
15.11.1
OUTPUT PIN CONTROL
The PEN<4:1>H and PEN<4:1>L control bits in the
PWMCON1 SFR enable each high PWM output pin
and each low PWM output pin, respectively. If a particular PWM output pin is not enabled, it is treated as a
general purpose I/O pin.
15.12 PWM Fault Pins
There are two Fault pins (FLTA and FLTB) associated
with the PWM module. When asserted, these pins can
optionally drive each of the PWM I/O pins to a defined
state.
15.12.1
FAULT PIN ENABLE BITS
The FLTACON and FLTBCON SFRs each have 4 control bits that determine whether a particular pair of
PWM I/O pins is to be controlled by the Fault input pin.
To enable a specific PWM I/O pin pair for Fault
overrides, the corresponding bit should be set in the
FLTACON or FLTBCON register.
If all enable bits are cleared in the FLTACON or
FLTBCON registers, then the corresponding Fault
input pin has no effect on the PWM module and the pin
may be used as a general purpose interrupt or I/O pin.
Note:
The Fault pin logic can operate independent of the PWM logic. If all the enable bits
in the FLTACON/FLTBCON register are
cleared, then the Fault pin(s) could be
used as general purpose interrupt pin(s).
Each Fault pin has an interrupt vector,
Interrupt Flag bit and Interrupt Priority bits
associated with it.
DS70150B-page 100
FAULT STATES
A special case exists when a PWM module I/O pair is
in the Complementary mode and both pins are programmed to be active on a Fault condition. The
PWMxH pin always has priority in the Complementary
mode, so that both I/O pins cannot be driven active
simultaneously.
15.12.3
FAULT PIN PRIORITY
If both Fault input pins have been assigned to control a
particular PWM I/O pin, the Fault state programmed for
the Fault A input pin will take priority over the Fault B
input pin.
15.12.4
FAULT INPUT MODES
Each of the Fault input pins has two modes of
operation:
• Latched Mode: When the Fault pin is driven low,
the PWM outputs will go to the states defined in
the FLTACON/FLTBCON register. The PWM outputs will remain in this state until the Fault pin is
driven high and the corresponding interrupt flag
has been cleared in software. When both of these
actions have occurred, the PWM outputs will
return to normal operation at the beginning of the
next PWM cycle or half-cycle boundary. If the
interrupt flag is cleared before the Fault condition
ends, the PWM module will wait until the Fault pin
is no longer asserted, to restore the outputs.
• Cycle-by-Cycle Mode: When the Fault input pin
is driven low, the PWM outputs remain in the
defined Fault states for as long as the Fault pin is
held low. After the Fault pin is driven high, the
PWM outputs return to normal operation at the
beginning of the following PWM cycle or
half-cycle boundary.
The Operating mode for each Fault input pin is selected
using the FLTAM and FLTBM control bits in the
FLTACON and FLTBCON Special Function Registers.
Each of the Fault pins can be controlled manually in
software.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
15.13 PWM Update Lockout
15.14.1
For a complex PWM application, the user may need to
write up to four Duty Cycle registers and the Time Base
Period register, PTPER, at a given time. In some applications, it is important that all buffer registers be written
before the new duty cycle and period values are loaded
for use by the module.
The PWM special event trigger has a postscaler that
allows a 1:1 to 1:16 postscale ratio. The postscaler is
configured by writing the SEVOPS<3:0> control bits in
the PWMCON2 SFR.
The PWM update lockout feature is enabled by setting
the UDIS control bit in the PWMCON2 SFR. The UDIS
bit affects all Duty Cycle Buffer registers and the PWM
time base period buffer, PTPER. No duty cycle
changes or period value changes will have effect while
UDIS = 1.
If the IUE bit is set, any change to the Duty Cycle registers will be immediately updated regardless of the
UDIS bit state. The PWM Period register updates
(PTPER) are not affected by the IUE control bit.
SPECIAL EVENT TRIGGER
POSTSCALER
The special event output postscaler is cleared on the
following events:
• Any write to the SEVTCMP register
• Any device Reset
15.15 PWM Operation During CPU Sleep
Mode
The Fault A and Fault B input pins have the ability to
wake the CPU from Sleep mode. The PWM module
generates an interrupt if either of the Fault pins is
driven low while in Sleep.
15.14 PWM Special Event Trigger
The PWM module has a special event trigger that
allows A/D conversions to be synchronized to the PWM
time base. The A/D sampling and conversion time may
be programmed to occur at any point within the PWM
period. The special event trigger allows the user to minimize the delay between the time when A/D conversion
results are acquired and the time when the duty cycle
value is updated.
15.16 PWM Operation During CPU Idle
Mode
The PTCON SFR contains a PTSIDL control bit. This
bit determines if the PWM module will continue to
operate or stop when the device enters Idle mode. If
PTSIDL = 0, the module will continue to operate. If
PTSIDL = 1, the module will stop operation as long as
the CPU remains in Idle mode.
The PWM special event trigger has an SFR named
SEVTCMP, and five control bits to control its operation.
The PTMR value for which a special event trigger
should occur is loaded into the SEVTCMP register.
When the PWM time base is in an Up/Down Counting
mode, an additional control bit is required to specify the
counting phase for the special event trigger. The count
phase is selected using the SEVTDIR control bit in the
SEVTCMP SFR. If the SEVTDIR bit is cleared, the special event trigger will occur on the upward counting
cycle of the PWM time base. If the SEVTDIR bit is set,
the special event trigger will occur on the downward
count cycle of the PWM time base. The SEVTDIR
control bit has no effect unless the PWM time base is
configured for an Up/Down Counting mode.
© 2006 Microchip Technology Inc.
DS70150B-page 101
8-OUTPUT PWM REGISTER MAP
SFR Name Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
PTCON
01C0
PTEN
—
PTSIDL
—
—
—
—
—
PTMR
01C2
PTDIR
PWM Timer Count Value
0000 0000 0000 0000
PTPER
01C4
—
PWM Time Base Period Register
0111 1111 1111 1111
SEVTCMP
01C6 SEVTDIR
PTOPS<3:0>
Bit 3
Bit 2
PTCKPS<1:0>
Bit 1
Bit 0
PTMOD<1:0>
PWM Special Event Compare Register
0000 0000 0000 0000
—
—
—
—
PWMCON2 01CA
—
—
—
—
DTCON1
01CC
DTBPS<1:0>
DTCON2
01CE
—
—
—
—
—
—
—
—
DTS4A
DTS4I
DTS3A
DTS3I
DTS2A
FLTACON
01D0
FAOV4H
FAOV4L
FAOV3H
FAOV3L
FAOV2H
FAOV2L
FAOV1H
FAOV1L
FLTAM
—
—
—
FLTBCON
01D2
FBOV4H
FBOV4L FBOV3H
FBOV3L FBOV2H
FBOV2L
FBOV1H FBOV1L
FLTBM
—
—
—
OVDCON
01D4 POVD4H POVD4L POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L POUT4H POUT4L POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L 1111 1111 0000 0000
PDC1
01D6
PWM Duty Cycle #1 Register
0000 0000 0000 0000
PDC2
01D8
PWM Duty Cycle #2 Register
0000 0000 0000 0000
PDC3
01DA
PWM Duty Cycle #3 Register
0000 0000 0000 0000
PDC4
01DC
PWM Duty Cycle #4 Register
0000 0000 0000 0000
PWMCON1 01C8
PTMOD4 PTMOD3 PTMOD2 PTMOD1
Reset State
0000 0000 0000 0000
PEN4H
PEN3H
PEN2H
PEN1H
—
—
—
—
SEVOPS<3:0>
Dead-Time B Value
DTAPS<1:0>
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
PEN4L
PEN3L
PEN2L
PEN1L
0000 0000 1111 1111
—
IUE
OSYNC
UDIS
0000 0000 0000 0000
DTS2I
DTS1A
DTS1I
0000 0000 0000 0000
FAEN4
FAEN3
FAEN2
FAEN1
0000 0000 0000 0000
FBEN4
FBEN3
FBEN2
FBEN1
0000 0000 0000 0000
Dead-Time A Value
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150B-page 102
TABLE 15-2:
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
16.0
SPI MODULE
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046).
The Serial Peripheral Interface (SPI) module is a
synchronous serial interface. It is useful for communicating with other peripheral devices such as
EEPROMs, shift registers, display drivers and A/D
converters, or other microcontrollers. It is compatible
with Motorola’s SPI and SIOP interfaces.
16.1
Operating Function Description
Transmit writes are also double-buffered. The user
writes to SPIxBUF. When the master or slave transfer
is completed, the contents of the shift register
(SPIxSR) is moved to the receive buffer. If any transmit data has been written to the buffer register, the
contents of the transmit buffer are moved to SPIxSR.
The received data is thus placed in SPIxBUF and the
transmit data in SPIxSR is ready for the next transfer.
Note:
Both the transmit buffer (SPIxTXB) and
the receive buffer (SPIxRXB) are mapped
to the same register address, SPIxBUF.
In Master mode, the clock is generated by prescaling
the system clock. Data is transmitted as soon as a
value is written to SPIxBUF. The interrupt is generated
at the middle of the transfer of the last bit.
Each SPI module consists of a 16-bit shift register,
SPIxSR (where x = 1 or 2), used for shifting data in
and out, and a buffer register, SPIxBUF. A control register, SPIxCON, configures the module. Additionally, a
STATUS register, SPIxSTAT, indicates various status
conditions.
In Slave mode, data is transmitted and received as
external clock pulses appear on SCK. Again, the interrupt is generated when the last bit is latched. If SSx
control is enabled, then transmission and reception
are enabled only when SSx = low. The SDOx output
will be disabled in SSx mode with SSx high.
The serial interface consists of 4 pins: SDIx (Serial
Data Input), SDOx (Serial Data Output), SCKx (Shift
Clock Input or Output) and SSx (active-low Slave
Select).
The clock provided to the module is (FOSC/4). This
clock is then prescaled by the primary (PPRE<1:0>)
and the secondary (SPRE<2:0>) prescale factors. The
CKE bit determines whether transmit occurs on transition from active clock state to Idle clock state, or vice
versa. The CKP bit selects the Idle state (high or low)
for the clock.
In Master mode operation, SCK is a clock output, but
in Slave mode, it is a clock input.
A series of eight (8) or sixteen (16) clock pulses shifts
out bits from the SPIxSR to SDOx pin and simultaneously shifts in data from SDIx pin. An interrupt is
generated when the transfer is complete and the corresponding interrupt flag bit (SPI1IF or SPI2IF) is set.
This interrupt can be disabled through an interrupt
enable bit (SPI1IE or SPI2IE).
The receive operation is double-buffered. When a
complete byte is received, it is transferred from
SPIxSR to SPIxBUF.
If the receive buffer is full when new data is being
transferred from SPIxSR to SPIxBUF, the module will
set the SPIROV bit, indicating an overflow condition.
The transfer of the data from SPIxSR to SPIxBUF will
not be completed and the new data will be lost. The
module will not respond to SCL transitions while
SPIROV is ‘1’, effectively disabling the module until
SPIxBUF is read by user software.
Note:
The user must perform reads of SPIxBUF
if the module is used in a transmit only
configuration to avoid a receive overflow
condition. (SPIROV = 1)
© 2006 Microchip Technology Inc.
16.1.1
WORD AND BYTE
COMMUNICATION
A control bit, MODE16 (SPIxCON<10>), allows the
module to communicate in either 16-bit or 8-bit mode.
16-bit operation is identical to 8-bit operation, except
that the number of bits transmitted is 16 instead of 8.
The user software must disable the module prior to
changing the MODE16 bit. The SPI module is reset
when the MODE16 bit is changed by the user.
A basic difference between 8-bit and 16-bit operation is
that the data is transmitted out of bit 7 of the SPIxSR for
8-bit operation, and data is transmitted out of bit 15 of
the SPIxSR for 16-bit operation. In both modes, data is
shifted into bit 0 of the SPIxSR.
16.1.2
SDOx DISABLE
A control bit, DISSDO, is provided to the SPIxCON register to allow the SDOx output to be disabled. This will
allow the SPI module to be connected in an input only
configuration. SDO can also be used for general
purpose I/O.
DS70150B-page 103
dsPIC30F6010A/6015
FIGURE 16-1:
SPI BLOCK DIAGRAM
Internal
Data Bus
Read
Write
SPIxBUF
SPIxBUF
Transmit
Receive
SPIxSR
SDIx
bit 0
SDOx
Shift
clock
SS & FSYNC
Clock
Control
Control
SSx
Edge
Select
Secondary
Prescaler
1:1-1:8
SCKx
Primary
Prescaler
1, 4, 16, 64
FCY
Enable Master Clock
Note: x = 1 or 2.
FIGURE 16-2:
SPI MASTER/SLAVE CONNECTION
SPI Master
SPI Slave
SDOx
SDIy
Serial Input Buffer
(SPIxBUF)
SDIx
Shift Register
(SPIxSR)
MSb
Serial Input Buffer
(SPIyBUF)
LSb
Shift Register
(SPIySR)
MSb
SCKx
PROCESSOR 1
SDOy
Serial Clock
LSb
SCKy
PROCESSOR 2
Note: x = 1 or 2, y = 1 or 2.
DS70150B-page 104
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
16.2
Framed SPI Support
The module supports a basic framed SPI protocol in
Master or Slave mode. The control bit, FRMEN,
enables framed SPI support and causes the SSx pin to
perform the Frame Synchronization pulse (FSYNC)
function. The control bit SPIFSD determines whether
the SSx pin is an input or an output (i.e., whether the
module receives or generates the Frame Synchronization pulse). The frame pulse is an active-high pulse for
a single SPI clock cycle. When Frame Synchronization
is enabled, the data transmission starts only on the
subsequent transmit edge of the SPI clock.
16.3
Slave Select Synchronization
The SSx pin allows a Synchronous Slave mode. The
SPI must be configured in SPI Slave mode, with SSx
pin control enabled (SSEN = 1). When the SSx pin is
low, transmission and reception are enabled, and the
SDOx pin is driven. When SSx pin goes high, the SDOx
pin is no longer driven. Also, the SPI module is resynchronized, and all counters/control circuitry are
reset. Therefore, when the SSx pin is asserted low
again, transmission/reception will begin at the MSb,
even if SSx had been de-asserted in the middle of a
transmit/receive.
© 2006 Microchip Technology Inc.
16.4
SPI Operation During CPU Sleep
Mode
During Sleep mode, the SPI module is shut down. If
the CPU enters Sleep mode while an SPI transaction
is in progress, then the transmission and reception is
aborted.
The transmitter and receiver will stop in Sleep mode.
However, register contents are not affected by
entering or exiting Sleep mode.
16.5
SPI Operation During CPU Idle
Mode
When the device enters Idle mode, all clock sources
remain functional. The SPISIDL bit (SPIxSTAT<13>)
selects if the SPI module will stop or continue on Idle.
If SPISIDL = 0, the module will continue to operate
when the CPU enters Idle mode. If SPISIDL = 1, the
module will stop when the CPU enters Idle mode.
DS70150B-page 105
SFR
Name
SPI1 REGISTER MAP
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
SPI1STAT
0220
SPI1CON
0222
SPIEN
—
SPISIDL
—
—
FRMEN
SPIFSD
—
Bit 11
Bit 10
—
—
DISSDO MODE16
SPI1BUF
0224
Legend: u = uninitialized bit
Note:
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
—
—
—
SPIROV
—
—
—
—
SPITBF
SPIRBF 0000 0000 0000 0000
SMP
CKE
SSEN
CKP
MSTEN
SPRE2
SPRE1
SPRE0
PPRE1
PPRE0
Transmit and Receive Buffer
0000 0000 0000 0000
0000 0000 0000 0000
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 16-2:
SFR Name
SPI2 REGISTER MAP
Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
SPI2STAT
0226
SPIEN
—
SPISIDL
—
—
—
—
—
—
SPIROV
—
—
—
—
SPITBF
SPIRBF
0000 0000 0000 0000
SPI2CON
0228
—
FRMEN
SPIFSD
—
SMP
CKE
SSEN
CKP
MSTEN
SPRE2
PPRE1
PPRE0
0000 0000 0000 0000
SPI2BUF
022A
Legend: u = uninitialized bit
Note:
DISSDO MODE16
Transmit and Receive Buffer
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
SPRE1 SPRE0
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150B-page 106
TABLE 16-1:
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
17.0
I2C™ MODULE
17.1
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
The Inter-Integrated Circuit™ (I2C™) module provides
complete hardware support for both Slave and MultiMaster modes of the I2C serial communication
standard, with a 16-bit interface.
This module offers the following key features:
• I2C interface supporting both Master and Slave
operation.
• I2C Slave mode supports 7 and 10-bit address.
• I2C Master mode supports 7 and 10-bit address.
• I2C port allows bidirectional transfers between
master and slaves.
• Serial clock synchronization for I2C port can be
used as a handshake mechanism to suspend and
resume serial transfer (SCLREL control).
• I2C supports multi-master operation; detects bus
collision and will arbitrate accordingly.
FIGURE 17-1:
Operating Function Description
The hardware fully implements all the master and
slave functions of the I2C Standard and Fast mode
specifications, as well as 7 and 10-bit addressing.
Thus, the I2C module can operate either as a slave or
a master on an I2C bus.
17.1.1
VARIOUS I2C MODES
The following types of I2C operation are supported:
•
•
•
I2C Slave operation with 7-bit address
I2C Slave operation with 10-bit address
I2C Master operation with 7 or 10-bit address
See the I2C programmer’s model in Figure 17-1.
17.1.2
PIN CONFIGURATION IN I2C MODE
I2C has a 2-pin interface; pin SCL is clock and pin SDA
is data.
PROGRAMMER’S MODEL
I2CRCV (8 bits)
bit 7
bit 0
bit 7
bit 0
I2CTRN (8 bits)
I2CBRG (9 bits)
bit 8
bit 0
I2CCON (16 bits)
bit 15
bit 0
bit 15
bit 0
I2CSTAT (16 bits)
I2CADD (10 bits)
bit 9
17.1.3
I2C REGISTERS
I2CCON and I2CSTAT are control and STATUS registers, respectively. The I2CCON register is readable and
writable. The lower 6 bits of I2CSTAT are read-only.
The remaining bits of the I2CSTAT are read/write.
I2CRSR is the shift register used for shifting data,
whereas I2CRCV is the buffer register to which data
bytes are written, or from which data bytes are read.
I2CRCV is the receive buffer, as shown in Figure 16-1.
I2CTRN is the transmit register to which bytes are written
during a transmit operation, as shown in Figure 16-2.
© 2006 Microchip Technology Inc.
bit 0
The I2CADD register holds the slave address. A Status
bit, ADD10, indicates 10-bit Address mode. The
I2CBRG acts as the Baud Rate Generator reload value.
In receive operations, I2CRSR and I2CRCV together
form a double-buffered receiver. When I2CRSR receives
a complete byte, it is transferred to I2CRCV and an interrupt pulse is generated. During transmission, the
I2CTRN is not double-buffered.
Note:
Following a Restart condition in 10-bit
mode, the user only needs to match the
first 7-bit address.
DS70150B-page 107
dsPIC30F6010A/6015
FIGURE 17-2:
I2C™ BLOCK DIAGRAM
Internal
Data Bus
I2CRCV
Read
SCL
Shift
Clock
I2CRSR
LSB
SDA
Addr_Match
Match Detect
Write
I2CADD
Read
Start and
Stop bit Detect
I2CSTAT
Write
Control Logic
Start, Restart,
Stop bit Generate
Write
I2CCON
Collision
Detect
Acknowledge
Generation
Clock
Stretching
Read
Read
Write
I2CTRN
LSB
Shift
Clock
Read
Reload
Control
BRG Down
Counter
DS70150B-page 108
Write
I2CBRG
FCY
Read
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
17.2
I2C Module Addresses
The I2CADD register contains the Slave mode
addresses. The register is a 10-bit register.
If the A10M bit (I2CCON<10>) is ‘0’, the address is
interpreted by the module as a 7-bit address. When an
address is received, it is compared to the 7 Least
Significant bits of the I2CADD register.
If the A10M bit is ‘1’, the address is assumed to be a
10-bit address. When an address is received, it will be
compared with the binary value ‘1 1 1 1 0 A9 A8’
(where A9, A8 are two Most Significant bits of
I2CADD). If that value matches, the next address will
be compared with the Least Significant 8 bits of
I2CADD, as specified in the 10-bit addressing protocol.
TABLE 17-1:
17.3.2
SLAVE RECEPTION
If the R_W bit received is a ‘0’ during an address
match, then Receive mode is initiated. Incoming bits
are sampled on the rising edge of SCL. After 8 bits are
received, if I2CRCV is not full or I2COV is not set,
I2CRSR is transferred to I2CRCV. ACK is sent on the
ninth clock.
If the RBF flag is set, indicating that I2CRCV is still
holding data from a previous operation (RBF = 1), then
ACK is not sent; however, the interrupt pulse is generated. In the case of an overflow, the contents of the
I2CRSR are not loaded into the I2CRCV.
Note:
7-BIT I2C™ SLAVE
ADDRESSES SUPPORTED BY
dsPIC30F
The I2CRCV will be loaded if the I2COV
bit = 1 and the RBF flag = 0. In this case,
a read of the I2CRCV was performed, but
the user did not clear the state of the
I2COV bit before the next receive
occurred. The Acknowledgement is not
sent (ACK = 1) and the I2CRCV is
updated.
0x00
General call address or start byte
0x01-0x03
Reserved
0x04-0x07
Hs-mode Master codes
17.4
0x04-0x77
Valid 7-bit addresses
0x78-0x7b
Valid 10-bit addresses (lower 7
bits)
In 10-bit mode, the basic receive and transmit operations are the same as in the 7-bit mode. However, the
criteria for address match is more complex.
0x7c-0x7f
Reserved
17.3
I2C 7-bit Slave Mode Operation
Once enabled (I2CEN = 1), the slave module will wait
for a Start bit to occur (i.e., the I2C module is ‘Idle’).
Following the detection of a Start bit, 8 bits are shifted
into I2CRSR and the address is compared against
I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0>
are compared against I2CRSR<7:1> and I2CRSR<0>
is the R_W bit. All incoming bits are sampled on the
rising edge of SCL.
If an address match occurs, an Acknowledgement will
be sent, and the Slave Event Interrupt Flag (SI2CIF) is
set on the falling edge of the ninth (ACK) bit. The
address match does not affect the contents of the
I2CRCV buffer or the RBF bit.
17.3.1
SLAVE TRANSMISSION
If the R_W bit received is a ‘1’, then the serial port will
go into Transmit mode. It will send ACK on the ninth bit
and then hold SCL to ‘0’ until the CPU responds by writing to I2CTRN. SCL is released by setting the SCLREL
bit, and 8 bits of data are shifted out. Data bits are
shifted out on the falling edge of SCL, such that SDA is
valid during SCL high (see timing diagram). The interrupt pulse is sent on the falling edge of the ninth clock
pulse, regardless of the status of the ACK received
from the master.
© 2006 Microchip Technology Inc.
I2C 10-bit Slave Mode Operation
The I2C specification dictates that a slave must be
addressed for a write operation, with two address bytes
following a Start bit.
The A10M bit is a control bit that signifies that the
address in I2CADD is a 10-bit address rather than a
7-bit address. The address detection protocol for the
first byte of a message address is identical for 7-bit
and 10-bit messages, but the bits being compared are
different.
I2CADD holds the entire 10-bit address. Upon receiving an address following a Start bit, I2CRSR <7:3> is
compared against a literal ‘11110’ (the default 10-bit
address) and I2CRSR<2:1> are compared against
I2CADD<9:8>. If a match occurs and if R_W = 0, the
interrupt pulse is sent. The ADD10 bit will be cleared to
indicate a partial address match. If a match fails or
R_W = 1, the ADD10 bit is cleared and the module
returns to the Idle state.
The low byte of the address is then received and compared with I2CADD<7:0>. If an address match occurs,
the interrupt pulse is generated and the ADD10 bit is
set, indicating a complete 10-bit address match. If an
address match did not occur, the ADD10 bit is cleared
and the module returns to the Idle state.
DS70150B-page 109
dsPIC30F6010A/6015
17.4.1
10-BIT MODE SLAVE
TRANSMISSION
Once a slave is addressed in this fashion, with the full
10-bit address (we will refer to this state as
“PRIOR_ADDR_MATCH”), the master can begin
sending data bytes for a slave reception operation.
17.4.2
10-BIT MODE SLAVE RECEPTION
Once addressed, the master can generate a Repeated
Start, reset the high byte of the address and set the
R_W bit without generating a Stop bit, thus initiating a
slave transmit operation.
17.5
Automatic Clock Stretch
In the slave modes, the module can synchronize buffer
reads and write to the master device by clock
stretching.
17.5.1
TRANSMIT CLOCK STRETCHING
Both 10-bit and 7-bit Transmit modes implement clock
stretching by asserting the SCLREL bit after the falling
edge of the ninth clock if the TBF bit is cleared,
indicating the buffer is empty.
17.5.3
When the STREN bit is set in Slave Receive mode,
the SCL line is held low when the buffer register is full.
The method for stretching the SCL output is the same
for both 7 and 10-bit addressing modes.
Clock stretching takes place following the ninth clock of
the receive sequence. On the falling edge of the ninth
clock at the end of the ACK sequence, if the RBF bit is
set, the SCLREL bit is automatically cleared, forcing the
SCL output to be held low. The user’s ISR must set the
SCLREL bit before reception is allowed to continue. By
holding the SCL line low, the user has time to service
the ISR and read the contents of the I2CRCV before the
master device can initiate another receive sequence.
This will prevent buffer overruns from occurring.
Note 1: If the user reads the contents of the
I2CRCV, clearing the RBF bit before the
falling edge of the ninth clock, the
SCLREL bit will not be cleared and clock
stretching will not occur.
2: The SCLREL bit can be set in software,
regardless of the state of the RBF bit. The
user should be careful to clear the RBF bit
in the ISR before the next receive
sequence in order to prevent an overflow
condition.
In Slave Transmit modes, clock stretching is always
performed, irrespective of the STREN bit.
Clock synchronization takes place following the ninth
clock of the transmit sequence. If the device samples
an ACK on the falling edge of the ninth clock, and if the
TBF bit is still clear, then the SCLREL bit is automatically cleared. The SCLREL being cleared to ‘0’
will assert the SCL line low. The user’s ISR must set
the SCLREL bit before transmission is allowed to continue. By holding the SCL line low, the user has time to
service the ISR and load the contents of the I2CTRN
before the master device can initiate another transmit
sequence.
Note 1: If the user loads the contents of I2CTRN,
setting the TBF bit before the falling edge
of the ninth clock, the SCLREL bit will not
be cleared and clock stretching will not
occur.
2: The SCLREL bit can be set in software,
regardless of the state of the TBF bit.
17.5.2
RECEIVE CLOCK STRETCHING
The STREN bit in the I2CCON register can be used to
enable clock stretching in Slave Receive mode. When
the STREN bit is set, the SCL pin will be held low at
the end of each data receive sequence.
CLOCK STRETCHING DURING
7-BIT ADDRESSING (STREN = 1)
17.5.4
CLOCK STRETCHING DURING
10-BIT ADDRESSING (STREN = 1)
Clock stretching takes place automatically during the
addressing sequence. Because this module has a
register for the entire address, it is not necessary for
the protocol to wait for the address to be updated.
After the address phase is complete, clock stretching
will occur on each data receive or transmit sequence
as was described earlier.
17.6
Software Controlled Clock
Stretching (STREN = 1)
When the STREN bit is ‘1’, the SCLREL bit may be
cleared by software to allow software to control the
clock stretching. The logic will synchronize writes to
the SCLREL bit with the SCL clock. Clearing the
SCLREL bit will not assert the SCL output until the
module detects a falling edge on the SCL output and
SCL is sampled low. If the SCLREL bit is cleared by
the user while the SCL line has been sampled low, the
SCL output will be asserted (held low). The SCL output will remain low until the SCLREL bit is set, and all
other devices on the I2C bus have de-asserted SCL.
This ensures that a write to the SCLREL bit will not
violate the minimum high time requirement for SCL.
If the STREN bit is ‘0’, a software write to the SCLREL
bit will be disregarded and have no effect on the
SCLREL bit.
DS70150B-page 110
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
17.7
Interrupts
The I2C module generates two interrupt flags, MI2CIF
(I2C Master Interrupt Flag) and SI2CIF (I2C Slave Interrupt Flag). The MI2CIF interrupt flag is activated on
completion of a master message event. The SI2CIF
interrupt flag is activated on detection of a message
directed to the slave.
17.8
Slope Control
The I2C standard requires slope control on the SDA
and SCL signals for Fast Mode (400 kHz). The control
bit, DISSLW, enables the user to disable slew rate control, if desired. It is necessary to disable the slew rate
control for 1 MHz mode.
17.9
IPMI Support
The control bit, IPMIEN, enables the module to support
Intelligent Peripheral Management Interface (IPMI).
When this bit is set, the module accepts and acts upon
all addresses.
17.10 General Call Address Support
The general call address can address all devices. When
this address is used, all devices should, in theory,
respond with an acknowledgement.
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all ‘0’s with R_W = 0.
The general call address is recognized when the General Call Enable (GCEN) bit is set (I2CCON<7> = 1).
Following a Start bit detection, 8 bits are shifted into
I2CRSR and the address is compared with I2CADD,
and is also compared with the general call address
which is fixed in hardware.
If a general call address match occurs, the I2CRSR is
transferred to the I2CRCV after the eighth clock, the
RBF flag is set, and on the falling edge of the ninth bit
(ACK bit), the Master Event Interrupt Flag (MI2CIF) is
set.
When the interrupt is serviced, the source for the
interrupt can be checked by reading the contents of the
I2CRCV to determine if the address was device-specific, or a general call address.
17.11 I2C Master Support
As a Master device, six operations are supported.
• Assert a Start condition on SDA and SCL.
• Assert a Restart condition on SDA and SCL.
• Write to the I2CTRN register initiating
transmission of data/address.
• Generate a Stop condition on SDA and SCL.
• Configure the I2C port to receive data.
• Generate an ACK condition at the end of a
received byte of data.
© 2006 Microchip Technology Inc.
17.12 I2C Master Operation
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the data direction bit. In
this case, the data direction bit (R_W) is logic ‘0’. Serial
data is transmitted 8 bits at a time. After each byte is
transmitted, an ACK bit is received. Start and Stop conditions are output to indicate the beginning and the end
of a serial transfer.
In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device
(7 bits) and the data direction bit. In this case, the data
direction bit (R_W) is logic ‘1’. Thus, the first byte
transmitted is a 7-bit slave address, followed by a ‘1’ to
indicate receive bit. Serial data is received via SDA,
while SCL outputs the serial clock. Serial data is
received 8 bits at a time. After each byte is received, an
ACK bit is transmitted. Start and Stop conditions
indicate the beginning and end of transmission.
17.12.1
I2C MASTER TRANSMISSION
Transmission of a data byte, a 7-bit address, or the
second half of a 10-bit address is accomplished by simply writing a value to I2CTRN register. The user should
only write to I2CTRN when the module is in a WAIT
state. This action will set the buffer full flag (TBF) and
allow the Baud Rate Generator to begin counting and
start the next transmission. Each bit of address/data
will be shifted out onto the SDA pin after the falling
edge of SCL is asserted. The Transmit Status Flag,
TRSTAT (I2CSTAT<14>), indicates that a master
transmit is in progress.
17.12.2
I2C MASTER RECEPTION
Master mode reception is enabled by programming the
Receive Enable (RCEN) bit (I2CCON<3>). The I2C
module must be idle before the RCEN bit is set, otherwise the RCEN bit will be disregarded. The Baud Rate
Generator begins counting, and on each rollover, the
state of the SCL pin toggles, and data is shifted in to the
I2CRSR on the rising edge of each clock.
17.12.3
BAUD RATE GENERATOR
I2C
In
Master mode, the reload value for the BRG is
located in the I2CBRG register. When the BRG is
loaded with this value, the BRG counts down to ‘0’ and
stops until another reload has taken place. If clock arbitration is taking place, for instance, the BRG is
reloaded when the SCL pin is sampled high.
DS70150B-page 111
dsPIC30F6010A/6015
As per the I2C standard, FSCL may be 100 kHz or
400 kHz. However, the user can specify any baud rate
up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.
The Master will continue to monitor the SDA and SCL
pins, and if a Stop condition occurs, the MI2CIF bit will
be set.
EQUATION 17-1:
A write to the I2CTRN will start the transmission of data
at the first data bit, regardless of where the transmitter
left off when bus collision occurred.
SERIAL CLOCK RATE
F CY
F CY
I2CBRG = ⎛⎝ ------------- – ---------------------------⎞⎠ – 1
F SCL 1, 111, 111
17.12.4
CLOCK ARBITRATION
Clock arbitration occurs when the master de-asserts
the SCL pin (SCL allowed to float high) during any
receive, transmit, or Restart/Stop condition. When the
SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL
pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with
the contents of I2CBRG and begins counting. This
ensures that the SCL high time will always be at least
one BRG rollover count in the event that the clock is
held low by an external device.
17.12.5
MULTI-MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master operation support is achieved by bus
arbitration. When the master outputs address/data bits
onto the SDA pin, arbitration takes place when the
master outputs a ‘1’ on SDA, by letting SDA float high
while another master asserts a ‘0’. When the SCL pin
floats high, data should be stable. If the expected data
on SDA is a ‘1’ and the data sampled on the SDA
pin = 0, then a bus collision has taken place. The
master will set the MI2CIF pulse and reset the master
portion of the I2C port to its Idle state.
In a Multi-Master environment, the interrupt generation
on the detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the I2CSTAT
register, or the bus is Idle and the S and P bits are
cleared.
17.13 I2C Module Operation During CPU
Sleep and Idle Modes
17.13.1
I2C OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’. If
Sleep occurs in the middle of a transmission, and the
state machine is partially into a transmission as the
clocks stop, then the transmission is aborted. Similarly,
if Sleep occurs in the middle of a reception, then the
reception is aborted.
17.13.2
I2C OPERATION DURING CPU IDLE
MODE
For the I2C, the I2CSIDL bit selects if the module will
stop on Idle or continue on Idle. If I2CSIDL = 0, the
module will continue operation on assertion of the Idle
mode. If I2CSIDL = 1, the module will stop on Idle.
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the TBF flag is
cleared, the SDA and SCL lines are de-asserted, and a
value can now be written to I2CTRN. When the user
services the I2C master event Interrupt Service
Routine, if the I2C bus is free (i.e., the P bit is set), the
user can resume communication by asserting a Start
condition.
If a Start, Restart, Stop or Acknowledge condition was
in progress when the bus collision occurred, the
condition is aborted, the SDA and SCL lines are deasserted, and the respective control bits in the I2CCON
register are cleared to 0. When the user services the
bus collision Interrupt Service Routine, and if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
DS70150B-page 112
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 17-2:
SFR Name Addr.
I2C™ REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
—
—
—
—
—
—
—
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Receive Register
—
Transmit Register
Bit 2
Bit 1
Bit 0
Reset State
I2CRCV
0200
—
I2CTRN
0202
—
—
—
—
—
—
—
—
—
—
—
—
—
—
A10M
DISSLW
SMEN
GCEN
STREN
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
0001 0000 0000 0000
BCL
—
GCSTAT
ADD10
IWCOL
I2COV
D_A
P
S
R_W
RBF
TBF
0000 0000 0000 0000
I2CBRG
0204
—
I2CCON
0206
I2CEN
I2CSTAT
0208
ACKSTAT
I2CSIDL SCLREL IPMIEN
—
—
—
TRSTAT
—
—
—
—
0000 0000 0000 0000
0000 0000 1111 1111
Baud Rate Generator
I2CADD
Legend:
—
020A
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
Address Register
0000 0000 0000 0000
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150B-page 113
dsPIC30F6010A/6015
NOTES:
DS70150B-page 114
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
18.0
UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART) MODULE
18.1
The key features of the UART module are:
•
•
•
•
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
•
This section describes the Universal Asynchronous
Receiver/Transmitter Communications module.
•
•
•
•
•
•
FIGURE 18-1:
UART Module Overview
Full-duplex, 8 or 9-bit data communication
Even, Odd or No Parity options (for 8-bit data)
One or two Stop bits
Fully integrated Baud Rate Generator with 16-bit
prescaler
Baud rates range from 38 bps to 1.875 Mbps at a
30 MHz instruction rate
4-word deep transmit data buffer
4-word deep receive data buffer
Parity, Framing and Buffer Overrun error detection
Support for Interrupt only on Address Detect
(9th bit = 1)
Separate Transmit and Receive Interrupts
Loopback mode for diagnostic support
UART TRANSMITTER BLOCK DIAGRAM
Internal Data Bus
Control and Status bits
Write
UTX8
Write
UxTXREG Low Byte
Transmit Control
– Control TSR
– Control Buffer
– Generate Flags
– Generate Interrupt
Load TSR
UxTXIF
UTXBRK
Data
UxTX
Transmit Shift Register (UxTSR)
‘0’ (Start)
‘1’ (Stop)
Parity
Parity
Generator
16 Divider
16X Baud Clock
from Baud Rate
Generator
Control
Signals
Note: x = 1 or 2.
© 2006 Microchip Technology Inc.
DS70150B-page 115
dsPIC30F6010A/6015
FIGURE 18-2:
UART RECEIVER BLOCK DIAGRAM
Internal Data Bus
16
Write
Read
Read Read
UxMODE
URX8
Write
UxSTA
UxRXREG Low Byte
Receive Buffer Control
– Generate Flags
– Generate Interrupt
– Shift Data Characters
8-9
LPBACK
UxRX
0
· Start bit Detect
· Parity Check
· Stop bit Detect
· Shift Clock Generation
· Wake Logic
Control
Signals
FERR
Load RSR
to Buffer
Receive Shift Register
(UxRSR)
1
PERR
From UxTX
16 Divider
16X Baud Clock from
Baud Rate Generator
UxRXIF
DS70150B-page 116
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
18.2
18.2.1
Enabling and Setting Up UART
ENABLING THE UART
The UART module is enabled by setting the UARTEN
bit in the UxMODE register (where x = 1 or 2). Once
enabled, the UxTX and UxRX pins are configured as an
output and an input respectively, overriding the TRIS
and LAT register bit settings for the corresponding I/O
port pins. The UxTX pin is at logic ‘1’ when no
transmission is taking place.
18.2.2
18.3
18.3.1
1.
2.
3.
Disabling the UART module resets the buffers to
empty states. Any data characters in the buffers are
lost, and the baud rate counter is reset.
All error and status flags associated with the UART
module are reset when the module is disabled. The
URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and
UTXBF bits are cleared, whereas RIDLE and TRMT
are set. Other control bits, including ADDEN,
URXISEL<1:0>, UTXISEL, as well as the UxMODE
and UxBRG registers, are not affected.
Clearing the UARTEN bit while the UART is active will
abort all pending transmissions and receptions and
reset the module as defined above. Re-enabling the
UART will restart the UART in the same configuration.
18.2.3
SETTING UP DATA, PARITY AND
STOP BIT SELECTIONS
Control bits PDSEL<1:0> in the UxMODE register are
used to select the data length and parity used in the
transmission. The data length may either be 8-bits with
even, odd or no parity, or 9-bits with no parity.
The STSEL bit determines whether one or two Stop
bits will be used during data transmission.
The default (power-on) setting of the UART is 8 bits, no
parity, 1 Stop bit (typically represented as 8, N, 1).
TRANSMITTING IN 8-BIT DATA
MODE
The following steps must be performed in order to
transmit 8-bit data:
DISABLING THE UART
The UART module is disabled by clearing the
UARTEN bit in the UxMODE register. This is the
default state after any Reset. If the UART is disabled,
all I/O pins operate as port pins under the control of
the LAT and TRIS bits of the corresponding port pins.
Transmitting Data
Set up the UART:
First, the data length, parity and number of Stop
bits must be selected. Then, the Transmit and
Receive Interrupt Enable and Priority bits are
setup in the UxMODE and UxSTA registers.
Also, the appropriate baud rate value must be
written to the UxBRG register.
Enable the UART by setting the UARTEN bit
(UxMODE<15>).
Set the UTXEN bit (UxSTA<10>), thereby
enabling a transmission.
Note:
4.
5.
The UTXEN bit must be set after the
UARTEN bit is set to enable UART
transmissions.
Write the byte to be transmitted to the lower byte
of UxTXREG. The value will be transferred to
the Transmit Shift Register (UxTSR) immediately and the serial bit stream will start shifting
out during the next rising edge of the baud clock.
Alternatively, the data byte may be written while
UTXEN = 0, following which, the user may set
UTXEN. This will cause the serial bit stream to
begin immediately because the baud clock will
start from a cleared state.
A transmit interrupt will be generated depending
on the value of the interrupt control bit UTXISEL
(UxSTA<15>).
18.3.2
TRANSMITTING IN 9-BIT DATA
MODE
The sequence of steps involved in the transmission of
9-bit data is similar to 8-bit transmission, except that a
16-bit data word (of which the upper 7 bits are always
clear) must be written to the UxTXREG register.
18.3.3
TRANSMIT BUFFER (UXTXB)
The transmit buffer is 9-bits wide and 4 characters
deep. Including the Transmit Shift Register (UxTSR),
the user effectively has a 5-deep FIFO (First-In, FirstOut) buffer. The UTXBF Status bit (UxSTA<9>)
indicates whether the transmit buffer is full.
If a user attempts to write to a full buffer, the new data
will not be accepted into the FIFO, and no data shift
will occur within the buffer. This enables recovery from
a buffer overrun condition.
The FIFO is reset during any device Reset, but is not
affected when the device enters or wakes up from a
Power-Saving mode.
© 2006 Microchip Technology Inc.
DS70150B-page 117
dsPIC30F6010A/6015
18.3.4
TRANSMIT INTERRUPT
The Transmit Interrupt Flag (U1TXIF or U2TXIF) is
located in the corresponding interrupt flag register.
The transmitter generates an edge to set the UxTXIF
bit. The condition for generating the interrupt depends
on UTXISEL control bit:
a)
b)
If UTXISEL = 0, an interrupt is generated when
a word is transferred from the transmit buffer to
the Transmit Shift Register (UxTSR). This
means that the transmit buffer has at least one
empty word.
If UTXISEL = 1, an interrupt is generated when
a word is transferred from the transmit buffer to
the Transmit Shift Register (UxTSR) and the
transmit buffer is empty.
Switching between the two interrupt modes during
operation is possible and sometimes offers more
flexibility.
18.3.5
TRANSMIT BREAK
18.4.2
RECEIVE BUFFER (UXRXB)
The receive buffer is 4 words deep. Including the
Receive Shift Register (UxRSR), the user effectively
has a 5-word deep FIFO buffer.
URXDA (UxSTA<0>) = 1 indicates that the receive
buffer has data available. URXDA = 0 means that the
buffer is empty. If a user attempts to read an empty
buffer, the old values in the buffer will be read and no
data shift will occur within the FIFO.
The FIFO is reset during any device Reset. It is not
affected when the device enters or wakes up from a
Power-Saving mode.
18.4.3
RECEIVE INTERRUPT
The Receive Interrupt Flag (U1RXIF or U2RXIF) can
be read from the corresponding interrupt flag register.
The interrupt flag is set by an edge generated by the
receiver. The condition for setting the receive interrupt
flag depends on the settings specified by the
URXISEL<1:0> (UxSTA<7:6>) control bits.
Setting the UTXBRK bit (UxSTA<11>) will cause the
UxTX line to be driven to logic ‘0’. The UTXBRK bit
overrides all transmission activity. Therefore, the user
should generally wait for the transmitter to be Idle
before setting UTXBRK.
a)
To send a Break character, the UTXBRK bit must be
set by software and must remain set for a minimum of
13 baud clock cycles. The UTXBRK bit is then cleared
by software to generate Stop bits. The user must wait
for a duration of at least one or two baud clock cycles
in order to ensure a valid Stop bit(s) before reloading
the UxTXB or starting other transmitter activity. Transmission of a Break character does not generate a
transmit interrupt.
b)
18.4
Switching between the interrupt modes during operation is possible, though generally not advisable during
normal operation.
18.4.1
Receiving Data
RECEIVING IN 8-BIT OR 9-BIT DATA
MODE
The following steps must be performed while receiving
8-bit or 9-bit data:
1.
2.
3.
4.
Set up and enable the UART (see Section 18.3
"Transmitting Data").
A receive interrupt will be generated when one
or more data words have been received,
depending on the receive interrupt settings
specified by the URXISEL bits (UxSTA<7:6>).
Read the OERR bit to determine if an overrun
error has occurred. The OERR bit must be reset
in software.
Read the received data from UxRXREG. The
act of reading UxRXREG will move the next
word to the top of the receive FIFO, and the
PERR and FERR values will be updated.
DS70150B-page 118
c)
If URXISEL<1:0> = 00 or 01, an interrupt is
generated every time a data word is transferred
from the Receive Shift Register (UxRSR) to the
receive buffer. There may be one or more
characters in the receive buffer.
If URXISEL<1:0> = 10, an interrupt is generated
when a word is transferred from the Receive
Shift Register (UxRSR) to the receive buffer,
which, as a result of the transfer, contains
3 characters.
If URXISEL<1:0> = 11, an interrupt is set when
a word is transferred from the Receive Shift
Register (UxRSR) to the receive buffer, which,
as a result of the transfer, contains 4 characters
(i.e., becomes full).
18.5
18.5.1
Reception Error Handling
RECEIVE BUFFER OVERRUN
ERROR (OERR BIT)
The OERR bit (UxSTA<1>) is set if all of the following
conditions occur:
a)
b)
c)
The receive buffer is full.
The Receive Shift Register is full, but unable to
transfer the character to the receive buffer.
The Stop bit of the character in the UxRSR is
detected, indicating that the UxRSR needs to
transfer the character to the buffer.
Once OERR is set, no further data is shifted in UxRSR
(until the OERR bit is cleared in software or a Reset
occurs). The data held in UxRSR and UxRXREG
remains valid.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
18.5.2
FRAMING ERROR (FERR)
The FERR bit (UxSTA<2>) is set if a ‘0’ is detected
instead of a Stop bit. If two Stop bits are selected, both
Stop bits must be ‘1’, otherwise FERR will be set. The
read-only FERR bit is buffered along with the received
data. It is cleared on any Reset.
18.5.3
PARITY ERROR (PERR)
The PERR bit (UxSTA<3>) is set if the parity of the
received word is incorrect. This error bit is applicable
only if a Parity mode (odd or even) is selected. The
read-only PERR bit is buffered along with the received
data bytes. It is cleared on any Reset.
18.5.4
IDLE STATUS
When the receiver is active (i.e., between the initial
detection of the Start bit and the completion of the
Stop bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between
the completion of the Stop bit and detection of the next
Start bit, the RIDLE bit is ‘1’, indicating that the UART
is Idle.
18.5.5
RECEIVE BREAK
The receiver will count and expect a certain number of
bit times based on the values programmed in the
PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>)
bits.
If the break is longer than 13 bit times, the reception is
considered complete after the number of bit times
specified by PDSEL and STSEL. The URXDA bit is
set, FERR is set, zeros are loaded into the receive
FIFO, interrupts are generated, if appropriate, and the
RIDLE bit is set.
When the module receives a long break signal and the
receiver has detected the Start bit, the data bits and
the invalid Stop bit (which sets the FERR), the receiver
must wait for a valid Stop bit before looking for the
next Start bit. It cannot assume that the break
condition on the line is the next Start bit.
Break is regarded as a character containing all ‘0’s,
with the FERR bit set. The Break character is loaded
into the buffer. No further reception can occur until a
Stop bit is received. Note that RIDLE goes high when
the Stop bit has not been received yet.
18.6
Address Detect Mode
Setting the ADDEN bit (UxSTA<5>) enables this
special mode, in which a 9th bit (URX8) value of ‘1’
identifies the received word as an address rather than
data. This mode is only applicable for 9-bit data communication. The URXISEL control bit does not have
any impact on interrupt generation in this mode, since
an interrupt (if enabled) will be generated every time
the received word has the 9th bit set.
18.7
Loopback Mode
Setting the LPBACK bit enables this special mode in
which the UxTX pin is internally connected to the UxRX
pin. When configured for the Loopback mode, the
UxRX pin is disconnected from the internal UART
receive logic. However, the UxTX pin still functions as
in a normal operation.
To select this mode:
a)
b)
c)
Configure UART for desired mode of operation.
Set LPBACK = 1 to enable Loopback mode.
Enable transmission as defined in Section 18.3
“Transmitting Data”.
18.8
Baud Rate Generator (BRG)
The UART has a 16-bit Baud Rate Generator to allow
maximum flexibility in baud rate generation. The Baud
Rate Generator register (UxBRG) is readable and
writable. The baud rate is computed as follows:
BRG = 16-bit value held in UxBRG register
(0 through 65535)
FCY = Instruction Clock Rate (1/TCY)
The baud rate is given by Equation 18-1.
EQUATION 18-1:
BAUD RATE
Baud Rate = FCY/(16 * (BRG + 1))
Therefore, maximum baud rate possible is
FCY/16 (if BRG = 0),
and the minimum baud rate possible is
FCY/(16 * 65536).
With a full 16-bit Baud Rate Generator, at 30 MIPS
operation, the minimum baud rate achievable is
28.5 bps.
© 2006 Microchip Technology Inc.
DS70150B-page 119
dsPIC30F6010A/6015
18.9
Auto-Baud Support
To allow the system to determine baud rates of
received characters, the input can be optionally linked
to a selected capture input. To enable this mode, the
user must program the input capture module to detect
the falling and rising edges of the Start bit.
18.10.2
UART OPERATION DURING CPU
IDLE MODE
For the UART, the USIDL bit selects if the module will
stop operation when the device enters Idle mode, or
whether the module will continue on Idle. If USIDL = 0,
the module will continue operation during Idle mode. If
USIDL = 1, the module will stop on Idle.
18.10 UART Operation During CPU
Sleep and Idle Modes
18.10.1
UART OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shut down and stay at logic ‘0’. If
entry into Sleep mode occurs while a transmission is
in progress, then the transmission is aborted. The
UxTX pin is driven to logic ‘1’. Similarly, if entry into
Sleep mode occurs while a reception is in progress,
then the reception is aborted. The UxSTA, UxMODE,
Transmit and Receive registers and buffers, and the
UxBRG register are not affected by Sleep mode.
If the Wake bit (UxMODE<7>) is set before the device
enters Sleep mode, then a falling edge on the UxRX
pin will generate a receive interrupt. The Receive
Interrupt Select Mode bit (URXISEL) has no effect for
this function. If the receive interrupt is enabled, then
this will wake-up the device from Sleep. The UARTEN
bit must be set in order to generate a wake-up
interrupt.
DS70150B-page 120
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 18-1:
UART1 REGISTER MAP
SFR Name Addr.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
U1MODE
020C
UARTEN
—
USIDL
—
U1STA
020E
UTXISEL
—
—
—
U1TXREG
0210
—
—
—
—
—
U1RXREG
0212
—
—
—
—
—
U1BRG
Legend:
0214
u = uninitialized bit
Note:
—
Bit 9
Bit 8
Bit 7
LPBACK
Bit 5
Bit 4
ABAUD
Bit 3
—
—
PERR
Bit 1
Bit 0
Reset State
—
—
TRMT
—
—
UTX8
Transmit Register
0000 000u uuuu uuuu
—
—
URX8
Receive Register
0000 0000 0000 0000
URXISEL1 URXISEL0 ADDEN
RIDLE
Bit 2
UTXBF
UTXBRK UTXEN
WAKE
Bit 6
PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000
FERR
OERR
URXDA 0000 0001 0001 0000
Baud Rate Generator Prescaler
0000 0000 0000 0000
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
TABLE 18-2:
SFR
Name
—
Bit 10
Addr.
UART2 REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
—
—
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
WAKE
LPBACK
ABAUD
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
U2MODE
0216
UARTEN
—
USIDL
—
U2STA
0218
UTXISEL
—
—
—
U2TXREG
021A
—
—
—
—
—
—
—
UTX8
Transmit Register
0000 000u uuuu uuuu
U2RXREG
021C
—
—
—
—
—
—
—
URX8
Receive Register
0000 0000 0000 0000
U2BRG
Legend:
021E
u = uninitialized bit
Note:
UTXBRK UTXEN
—
—
UTXBF
TRMT
URXISEL1 URXISEL0 ADDEN
Baud Rate Generator Prescaler
—
—
RIDLE
PERR
PDSEL1 PDSEL0
FERR
OERR
STSEL 0000 0000 0000 0000
URXDA 0000 0001 0001 0000
0000 0000 0000 0000
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F6010A/6015
DS70150B-page 121
dsPIC30F6010A/6015
NOTES:
DS70150B-page 122
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
19.0
CAN MODULE
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
19.1
Overview
The Controller Area Network (CAN) module is a serial
interface, useful for communicating with other CAN
modules or microcontroller devices. This interface/
protocol was designed to allow communications within
noisy environments. The dsPIC30F6010A has two
CAN modules. The dsPIC30F6015 has only one.
The CAN module is a communication controller implementing the CAN 2.0 A/B protocol, as defined in the
BOSCH specification. The module will support
CAN 1.2, CAN 2.0A, CAN2.0B Passive and CAN 2.0B
Active versions of the protocol. The module implementation is a full CAN system. The CAN specification is
not covered within this data sheet. The reader may
refer to the BOSCH CAN specification for further
details.
The module features are as follows:
• Implementation of the CAN protocol CAN 1.2,
CAN 2.0A and CAN 2.0B
• Standard and extended data frames
• 0-8 bytes data length
• Programmable bit rate up to 1 Mbit/sec
• Support for remote frames
• Double-buffered receiver with two prioritized
received message storage buffers (each buffer
may contain up to 8 bytes of data)
• 6 full (standard/extended identifier) acceptance
filters, 2 associated with the high priority receive
buffer, and 4 associated with the low priority
receive buffer
• 2 full acceptance filter masks, one each associated with the high and low priority receive buffers
• Three transmit buffers with application specified
prioritization and abort capability (each buffer may
contain up to 8 bytes of data)
• Programmable wake-up functionality with
integrated low-pass filter
• Programmable Loopback mode supports self-test
operation
• Signaling via interrupt capabilities for all CAN
receiver and transmitter error states
• Programmable clock source
• Programmable link to timer module for
time-stamping and network synchronization
• Low-Power Sleep and Idle mode
© 2006 Microchip Technology Inc.
The CAN bus module consists of a protocol engine,
and message buffering/control. The CAN protocol
engine handles all functions for receiving and transmitting messages on the CAN bus. Messages are
transmitted by first loading the appropriate data registers. Status and errors can be checked by reading the
appropriate registers. Any message detected on the
CAN bus is checked for errors and then matched
against filters to see if it should be received and stored
in one of the receive registers.
19.2
Frame Types
The CAN module transmits various types of frames,
which include data messages or remote transmission
requests initiated by the user as other frames that are
automatically generated for control purposes. The
following frame types are supported:
• Standard Data Frame
A Standard Data Frame is generated by a node when
the node wishes to transmit data. It includes a 11-bit
Standard Identifier (SID), but not an 18-bit Extended
Identifier (EID).
• Extended Data Frame
An Extended Data Frame is similar to a Standard Data
Frame, but includes an Extended Identifier as well.
• Remote Frame
It is possible for a destination node to request the data
from the source. For this purpose, the destination node
sends a Remote Frame with an identifier that matches
the identifier of the required Data Frame. The appropriate data source node will then send a Data Frame as a
response to this remote request.
• Error Frame
An Error Frame is generated by any node that detects
a bus error. An error frame consists of 2 fields: an Error
Flag field and an Error Delimiter field.
• Overload Frame
An Overload Frame can be generated by a node as a
result of 2 conditions. First, the node detects a dominant bit during lnterframe Space, which is an illegal
condition. Second, due to internal conditions, the node
is not yet able to start reception of the next message. A
node may generate a maximum of 2 sequential
Overload Frames to delay the start of the next
message.
• Interframe Space
Interframe Space separates a proceeding frame (of
whatever type) from a following Data or Remote
Frame.
DS70150B-page 123
dsPIC30F6010A/6015
FIGURE 19-1:
CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM
Acceptance Mask
RXM1
BUFFERS
Acceptance Filter
RXF2
MESSAGE
MSGREQ
TXABT
TXLARB
TXERR
MTXBUFF
TXB2
MESSAGE
MSGREQ
TXABT
TXLARB
TXERR
MTXBUFF
TXB1
MESSAGE
MSGREQ
TXABT
TXLARB
TXERR
MTXBUFF
TXB0
A
c
c
e
p
t
Acceptance Mask
RXM0
Acceptance Filter
RXF3
Acceptance Filter
RXF0
Acceptance Filter
RXF4
Acceptance Filter
RXF1
Acceptance Filter
RXF5
R
X
B
0
Message
Queue
Control
Identifier
M
A
B
Data Field
Transmit Byte Sequencer
Data Field
PROTOCOL
ENGINE
Note 1.
RERRCNT
TERRCNT
ErrPas
BusOff
Transmit
Error
Counter
CRC Generator
R
X
B
1
Identifier
Receive
Error
Counter
Transmit Shift
A
c
c
e
p
t
Receive Shift
Protocol
Finite
State
Machine
CRC Check
Transmit
Logic
Bit
Timing
Logic
CiTX(1)
CiRX(1)
Bit Timing
Generator
i = 1 or 2 refers to a particular CAN module (CAN1 or CAN2).
The dsPIC30F6015 has only one CAN module.
DS70150B-page 124
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
19.3
Modes of Operation
The CAN module can operate in one of several operation
modes selected by the user. These modes include:
•
•
•
•
•
•
Initialization mode
Disable mode
Normal Operation mode
Listen-Only mode
Loopback mode
Error Recognition mode
Modes are requested by setting the REQOP<2:0>
bits (CiCTRL<10:8>). Entry into a mode is
acknowledged by monitoring the OPMODE<2:0> bits
(CiCTRL<7:5>). The module will not change the mode
and the OPMODE bits until a change in mode is
acceptable, generally during bus idle time which is
defined as at least 11 consecutive recessive bits.
19.3.1
INITIALIZATION MODE
In the Initialization mode, the module will not transmit or
receive. The error counters are cleared and the interrupt flags remain unchanged. The programmer will
have access to Configuration registers that are access
restricted in other modes. The module will protect the
user from accidentally violating the CAN protocol
through programming errors. All registers which control
the configuration of the module can not be modified
while the module is on-line. The CAN module will not
be allowed to enter the Configuration mode while a
transmission is taking place. The Configuration mode
serves as a lock to protect the following registers:
•
•
•
•
•
All Module Control Registers
Baud Rate and Interrupt Configuration Registers
Bus Timing Registers
Identifier Acceptance Filter Registers
Identifier Acceptance Mask Registers
19.3.2
DISABLE MODE
In Disable mode, the module will not transmit or
receive. The module has the ability to set the WAKIF bit
due to bus activity, however any pending interrupts will
remain and the error counters will retain their value.
If the REQOP<2:0> bits (CiCTRL<10:8>) = 001, the
module will enter the Module Disable mode. If the
module is active, the module will wait for 11 recessive
bits on the CAN bus, detect that condition as an idle
bus, then accept the module disable command. When
the OPMODE<2:0> bits (CiCTRL<7:5>) = 001, that
indicates whether the module successfully went into
Module Disable mode. The I/O pins will revert to normal
I/O function when the module is in the Module Disable
mode.
© 2006 Microchip Technology Inc.
The module can be programmed to apply a low-pass
filter function to the CiRX input line while the module or
the CPU is in Sleep mode. The WAKFIL bit
(CiCFG2<14>) enables or disables the filter.
Note:
19.3.3
Typically, if the CAN module is allowed to
transmit in a particular mode of operation
and a transmission is requested immediately after the CAN module has been
placed in that mode of operation, the module waits for 11 consecutive recessive bits
on the bus before starting transmission. If
the user switches to Disable mode within
this 11-bit period, then this transmission is
aborted and the corresponding TXABT bit
is set and TXREQ bit is cleared.
NORMAL OPERATION MODE
Normal Operating mode is selected when
REQOP<2:0> = 000. In this mode, the module is
activated, the I/O pins will assume the CAN bus
functions. The module will transmit and receive CAN
bus messages via the CiTX and CiRX pins.
19.3.4
LISTEN-ONLY MODE
If the Listen-Only mode is activated, the module on the
CAN bus is passive. The transmitter buffers revert to
the Port I/O function. The receive pins remain inputs.
For the receiver, no error flags or acknowledge signals
are sent. The error counters are deactivated in this
state. The Listen-Only mode can be used for detecting
the baud rate on the CAN bus. To use this, it is necessary that there are at least two further nodes that
communicate with each other.
19.3.5
ERROR RECOGNITION MODE
The module can be set to ignore all errors and receive
any message. The Error Recognition mode is activated
by setting the RXM<1:0> bits (CiRXnCON<6:5>) to
‘11’. In this mode, the data which is in the message
assembly buffer until the time an error occurred, is copied in the receive buffer and can be read via the CPU
interface.
19.3.6
LOOPBACK MODE
If the Loopback mode is activated, the module will connect the internal transmit signal to the internal receive
signal at the module boundary. The transmit and
receive pins revert to their Port I/O function.
DS70150B-page 125
dsPIC30F6010A/6015
19.4
19.4.1
Message Reception
RECEIVE BUFFERS
The CAN bus module has 3 receive buffers. However,
one of the receive buffers is always committed to monitoring the bus for incoming messages. This buffer is
called the Message Assembly Buffer (MAB). So there
are 2 receive buffers visible, RXB0 and RXB1, that can
essentially instantaneously receive a complete
message from the protocol engine.
All messages are assembled by the MAB, and are transferred to the RXBn buffers only if the acceptance filter
criterion is met. When a message is received, the RXnIF
flag (CiINTF<0> or CiINTF<1>) will be set. This bit can
only be set by the module when a message is received.
The bit is cleared by the CPU when it has completed
processing the message in the buffer. If the RXnIE bit
(CiINTE<0> or CiINTE<1>) is set, an interrupt will be
generated when a message is received.
RXF0 and RXF1 filters with RXM0 mask are associated
with RXB0. The filters RXF2, RXF3, RXF4, and RXF5
and the mask RXM1 are associated with RXB1.
19.4.2
MESSAGE ACCEPTANCE FILTERS
The message acceptance filters and masks are used to
determine if a message in the message assembly
buffer should be loaded into either of the receive buffers. Once a valid message has been received into the
message assembly buffer, the identifier fields of the
message are compared to the filter values. If there is a
match, that message will be loaded into the appropriate
receive buffer.
The acceptance filter looks at incoming messages for
the RXIDE bit (CiRXnSID<0>) to determine how to
compare the identifiers. If the RXIDE bit is clear, the
message is a standard frame, and only filters with the
EXIDE bit (CiRXFnSID<0>) clear are compared. If the
RXIDE bit is set, the message is an extended frame,
and only filters with the EXIDE bit set are compared.
Configuring the RXM<1:0> bits to ‘01’ or ‘10’ can
override the EXIDE bit.
19.4.3
MESSAGE ACCEPTANCE FILTER
MASKS
The mask bits essentially determine which bits to apply
the filter to. If any mask bit is set to a zero, then that bit
will automatically be accepted regardless of the filter
bit. There are 2 programmable acceptance filter masks
associated with the receive buffers, one for each buffer.
19.4.4
RECEIVE OVERRUN
An overrun condition occurs when the message
assembly buffer has assembled a valid received
message and the message is accepted through the
acceptance filters, but the receive buffer associated
with the filter still contains unread data.
The overrun error flag, RXnOVR (CiINTF<15> or
CiINTF<14>) and the ERRIF bit (CiINTF<5>) will be set
and the message in the MAB will be discarded.
If the DBEN bit is clear, RXB1 and RXB0 operate independently. When this is the case, a message intended
for RXB0 will not be diverted into RXB1 if RXB0
contains an unread message and the RX0OVR bit will
be set.
If the DBEN bit is set, the overrun for RXB0 is handled
differently. If a valid message is received for RXB0 and
RXFUL = 1 indicates that RXB0 is full and RXFUL = 0
indicates that RXB1 is empty, the message for RXB0
will be loaded into RXB1. An overrun error will not be
generated for RXB0. If a valid message is received for
RXB0 and RXFUL = 1, and RXFUL = 1 indicating that
both RXB0 and RXB1 are full, the message will be lost
and an overrun will be indicated for RXB1.
19.4.5
RECEIVE ERRORS
The CAN module will detect the following receive
errors:
• Cyclic Redundancy Check (CRC) error
• Bit Stuffing error
• Invalid message receive error
These receive errors do not generate an interrupt.
However, the receive error counter is incremented by
one in case one of these errors occur. The RXWAR bit
(CiINTF<9>) indicates that the Receive Error Counter
has reached the CPU warning limit of 96 and an
interrupt is generated.
19.4.6
RECEIVE INTERRUPTS
Receive interrupts can be divided into 3 major groups,
each including various conditions that generate
interrupts:
• Receive Interrupt
A message has been successfully received and loaded
into one of the receive buffers. This interrupt is activated immediately after receiving the End-of-Frame
(EOF) field. Reading the RXnIF flag will indicate which
receive buffer caused the interrupt.
• Wake-up Interrupt
The CAN module has woken up from Disable mode or
the device has woken up from Sleep mode.
DS70150B-page 126
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
• Receive Error Interrupts
A receive error interrupt will be indicated by the ERRIF
bit. This bit shows that an error condition occurred. The
source of the error can be determined by checking the
bits in the CAN Interrupt STATUS register, CiINTF.
• Invalid message received
If any type of error occurred during reception of the last
message, an error will be indicated by the IVRIF bit.
• Receiver overrun
The RXnOVR bit indicates that an overrun condition
occurred.
• Receiver warning
The RXWAR bit indicates that the Receive Error
Counter (RERRCNT<7:0>) has reached the Warning
limit of 96.
• Receiver error passive
The RXEP bit indicates that the Receive Error Counter
has exceeded the Error Passive limit of 127 and the
module has gone into Error Passive state.
19.5
19.5.1
Message Transmission
TRANSMIT BUFFERS
The CAN module has three transmit buffers. Each of
the three buffers occupies 14 bytes of data. Eight of the
bytes are the maximum 8 bytes of the transmitted message. Five bytes hold the standard and extended
identifiers and other message arbitration information.
19.5.2
TRANSMIT MESSAGE PRIORITY
Transmit priority is a prioritization within each node of the
pending transmittable messages. There are 4 levels of
transmit priority. If TXPRI<1:0> (CiTXnCON<1:0>, where
n = 0, 1 or 2 represents a particular transmit buffer) for a
particular message buffer is set to ‘11’, that buffer has the
highest priority. If TXPRI<1:0> for a particular message
buffer is set to ‘10’ or ‘01’, that buffer has an intermediate
priority. If TXPRI<1:0> for a particular message buffer is
‘00’, that buffer has the lowest priority.
19.5.3
TRANSMISSION SEQUENCE
To initiate transmission of the message, the TXREQ bit
(CiTXnCON<3>) must be set. The CAN bus module
resolves any timing conflicts between setting of the
TXREQ bit and the Start-of-Frame (SOF), ensuring
that if the priority was changed, it is resolved correctly
before the SOF occurs. When TXREQ is set, the
TXABT (CiTXnCON<6>), TXLARB (CiTXnCON<5>)
and TXERR (CiTXnCON<4>) flag bits are
automatically cleared.
© 2006 Microchip Technology Inc.
Setting TXREQ bit simply flags a message buffer as
enqueued for transmission. When the module detects
an available bus, it begins transmitting the message
which has been determined to have the highest priority.
If the transmission completes successfully on the first
attempt, the TXREQ bit is cleared automatically and an
interrupt is generated if TXIE was set.
If the message transmission fails, one of the error
condition flags will be set and the TXREQ bit will
remain set indicating that the message is still pending
for transmission. If the message encountered an error
condition during the transmission attempt, the TXERR
bit will be set and the error condition may cause an
interrupt. If the message loses arbitration during the
transmission attempt, the TXLARB bit is set. No
interrupt is generated to signal the loss of arbitration.
19.5.4
ABORTING MESSAGE
TRANSMISSION
The system can also abort a message by clearing the
TXREQ bit associated with each message buffer.
Setting the ABAT bit (CiCTRL<12>) will request an
abort of all pending messages. If the message has not
yet started transmission, or if the message started but
is interrupted by loss of arbitration or an error, the abort
will be processed. The abort is indicated when the
module sets the TXABT bit, and the TXnIF flag is not
automatically set.
19.5.5
TRANSMISSION ERRORS
The CAN module will detect the following transmission
errors:
• Acknowledge error
• Form error
• Bit Eerror
These transmission errors will not necessarily generate
an interrupt, but are indicated by the transmission error
counter. However, each of these errors will cause the
transmission error counter to be incremented by one.
Once the value of the error counter exceeds the value
of 96, the ERRIF (CiINTF<5>) and the TXWAR bit
(CiINTF<10>) are set. Once the value of the error
counter exceeds the value of 96, an interrupt is
generated and the TXWAR bit in the Error Flag register
is set.
DS70150B-page 127
dsPIC30F6010A/6015
19.5.6
TRANSMIT INTERRUPTS
19.6
Baud Rate Setting
Transmit interrupts can be divided into 2 major groups,
each including various conditions that generate
interrupts:
All nodes on any particular CAN bus must have the
same nominal bit rate. In order to set the baud rate, the
following parameters have to be initialized:
• Transmit Interrupt
•
•
•
•
•
•
At least one of the three transmit buffers is empty (not
scheduled) and can be loaded to schedule a message
for transmission. Reading the TXnIF flags will indicate
which transmit buffer is available and caused the
interrupt.
• Transmit Error Interrupts
A transmission error interrupt will be indicated by the
ERRIF flag. This flag shows that an error condition
occurred. The source of the error can be determined by
checking the error flags in the CAN Interrupt STATUS
register, CiINTF. The flags in this register are related to
receive and transmit errors.
• Transmitter Warning Interrupt
The TXWAR bit indicates that the Transmit Error
Counter has reached the CPU warning limit of 96.
• Transmitter Error Passive
The TXEP bit (CiINTF<12>) indicates that the Transmit
Error Counter has exceeded the Error Passive limit of
127 and the module has gone to Error Passive state.
• Bus Off
The TXBO bit (CiINTF<13>) indicates that the Transmit
Error Counter has exceeded 255 and the module has
gone to Bus Off state.
FIGURE 19-2:
Synchronization jump width
Baud rate prescaler
Phase segments
Length determination of Phase2 Seg
Sample point
Propagation segment bits
19.6.1
BIT TIMING
All controllers on the CAN bus must have the same baud
rate and bit length. However, different controllers are not
required to have the same master oscillator clock. At different clock frequencies of the individual controllers, the
baud rate has to be adjusted by adjusting the number of
time quanta in each segment.
The Nominal Bit Time can be thought of as being
divided into separate non-overlapping time segments.
These segments are shown in Figure 19-2.
•
•
•
•
Synchronization segment (Sync Seg)
Propagation time segment (Prop Seg)
Phase segment 1 (Phase1 Seg)
Phase segment 2 (Phase2 Seg)
The time segments and also the nominal bit time are
made up of integer units of time called time quanta or
TQ. By definition, the nominal bit time has a minimum
of 8 TQ and a maximum of 25 TQ. Also, by definition,
the minimum nominal bit time is 1 μsec, corresponding
to a maximum bit rate of 1 MHz.
CAN BIT TIMING
Input Signal
Sync
Prop
Segment
Phase
Segment 1
Phase
Segment 2
Sync
Sample Point
TQ
DS70150B-page 128
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
19.6.2
PRESCALER SETTING
There is a programmable prescaler, with integral
values ranging from 1 to 64, in addition to a fixed divideby-2 for clock generation. The Time Quantum (TQ) is a
fixed unit of time derived from the oscillator period, and
is given by Equation 19-1, where FCAN is FCY (if the
CANCKS bit is set or 4 FCY (if CANCKS is cleared).
Note:
FCAN must not exceed 30 MHz. If
CANCKS = 0, then FCY must not exceed
7.5 MHz.
EQUATION 19-1:
TIME QUANTUM FOR
CLOCK GENERATION
TQ = 2 ( BRP<5:0> + 1 )/FCAN
19.6.3
PROPAGATION SEGMENT
This part of the bit time is used to compensate physical
delay times within the network. These delay times consist of the signal propagation time on the bus line and
the internal delay time of the nodes. The Propagation
Segment can be programmed from 1 TQ to 8 TQ by
setting the PRSEG<2:0> bits (CiCFG2<2:0>).
19.6.4
PHASE SEGMENTS
The phase segments are used to optimally locate the
sampling of the received bit within the transmitted bit
time. The sampling point is between Phase1 Seg and
Phase2 Seg. These segments are lengthened or shortened by re-synchronization. The end of the Phase1
Seg determines the sampling point within a bit period.
The segment is programmable from 1 TQ to 8 TQ.
Phase2 Seg provides delay to the next transmitted data
transition. The segment is programmable from 1 TQ to
8 TQ, or it may be defined to be equal to the greater of
Phase1 Seg or the Information Processing Time
(2 TQ). The Phase1 Seg is initialized by setting bits
SEG1PH<2:0> (CiCFG2<5:3>), and Phase2 Seg is
initialized by setting SEG2PH<2:0> (CiCFG2<10:8>).
The following requirement must be fulfilled while setting
the lengths of the Phase Segments:
• Propagation Segment + Phase1 Seg > = Phase2 Seg
19.6.5
SAMPLE POINT
The sample point is the point of time at which the bus
level is read and interpreted as the value of that respective bit. The location is at the end of Phase1 Seg. If the
bit timing is slow and contains many TQ, it is possible to
specify multiple sampling of the bus line at the sample
point. The level determined by the CAN bus then corresponds to the result from the majority decision of three
values. The majority samples are taken at the sample
point and twice before with a distance of TQ/2. The
CAN module allows the user to chose between sampling three times at the same point or once at the same
point, by setting or clearing the SAM bit (CiCFG2<6>).
Typically, the sampling of the bit should take place at
about 60-70% through the bit time, depending on the
system parameters.
19.6.6
SYNCHRONIZATION
To compensate for phase shifts between the oscillator
frequencies of the different bus stations, each CAN
controller must be able to synchronize to the relevant
signal edge of the incoming signal. When an edge in
the transmitted data is detected, the logic will compare
the location of the edge to the expected time (Synchronous Segment). The circuit will then adjust the values
of Phase1 Seg and Phase2 Seg. There are 2
mechanisms used to synchronize.
19.6.6.1
Hard Synchronization
Hard synchronization is only done whenever there is a
recessive to dominant edge during bus Idle, indicating
the start of a message. After hard synchronization, the
bit time counters are restarted with the Synchronous
Segment. Hard synchronization forces the edge which
has caused the hard synchronization to lie within the
synchronization segment of the restarted bit time. If a
hard synchronization is done, there will not be a
re-synchronization within that bit time.
19.6.6.2
Re-synchronization
As a result of re-synchronization, Phase1 Seg may be
lengthened or Phase2 Seg may be shortened. The
amount of lengthening or shortening of the phase
buffer segment has an upper bound known as the
synchronization jump width, and is specified by the
SJW<1:0> bits (CiCFG1<7:6>). The value of the
synchronization jump width will be added to Phase1
Seg or subtracted from Phase2 Seg. The resynchronization jump width is programmable between
1 TQ and 4 TQ.
The following requirement must be fulfilled while setting
the SJW<1:0> bits:
• Phase2 Seg > Synchronization Jump Width
© 2006 Microchip Technology Inc.
DS70150B-page 129
CAN1 REGISTER MAP FOR dsPIC30F6010A AND 6015 DEVICES
SFR Name
Addr.
Bit 15
Bit 14
Bit 13
C1RXF0SID
0300
—
—
—
C1RXF0EIDH
0302
—
—
—
C1RXF0EIDL
0304
C1RXF1SID
0308
—
—
—
C1RXF1EIDH
030A
—
—
—
C1RXF1EIDL
030C
C1RXF2SID
0310
—
—
—
C1RXF2EIDH
0312
—
—
—
C1RXF2EIDL
0314
Bit 12
Bit 11
Bit 10
C1RXF3SID
0318
C1RXF3EIDH
031A
—
—
—
C1RXF3EIDL
031C
C1RXF4SID
0320
—
—
—
C1RXF4EIDH
0322
—
—
—
C1RXF4EIDL
0324
C1RXF5SID
0328
—
—
—
C1RXF5EIDH
032A
—
—
—
C1RXF5EIDL
032C
C1RXM0SID
0330
—
—
—
C1RXM0EIDH 0332
—
—
—
0334
C1RXM1SID
0338
—
C1RXM1EIDH 033A
—
—
—
—
—
—
Bit 2
Bit 1
Bit 0
—
EXIDE
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
EXIDE
—
—
—
—
EXIDE
—
—
—
—
—
—
—
—
—
—
EXIDE
—
—
—
—
—
EXIDE
Receive Acceptance Filter 4 Extended Identifier<17:6>
—
—
—
—
—
—
—
—
—
—
—
EXIDE
Receive Acceptance Filter 5 Extended Identifier<17:6>
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TXRTR
TXRB1
—
—
—
—
uuuu uu00 0000 0000
000u uuuu uuuu uu0u
uuuu uu00 0000 0000
000u uuuu uuuu uu0u
—
uuuu uu00 0000 0000
—
MIDE
000u uuuu uuuu uu0u
—
—
—
uuuu uu00 0000 0000
—
MIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
SRR
TXIDE
uuuu u000 uuuu uuuu
—
—
uuuu uuuu uuuu u000
Receive Acceptance Mask 1 Extended Identifier<17:6>
—
000u uuuu uuuu uu0u
0000 uuuu uuuu uuuu
—
Receive Acceptance Mask 1 Standard Identifier<10:0>
—
uuuu uu00 0000 0000
—
Receive Acceptance Mask 0 Extended Identifier<17:6>
—
000u uuuu uuuu uu0u
0000 uuuu uuuu uuuu
Receive Acceptance Mask 0 Standard Identifier<10:0>
—
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
Receive Acceptance Filter 5 Standard Identifier<10:0>
—
000u uuuu uuuu uu0u
0000 uuuu uuuu uuuu
Receive Acceptance Filter 4 Standard Identifier<10:0>
—
uuuu uu00 0000 0000
0000 uuuu uuuu uuuu
Receive Acceptance Filter 3 Extended Identifier<17:6>
—
000u uuuu uuuu uu0u
0000 uuuu uuuu uuuu
—
—
Reset State
0000 uuuu uuuu uuuu
Receive Acceptance Filter 3 Standard Identifier <10:0>
Receive Acceptance Mask 0 Extended Identifier<5:0>
—
Bit 3
Receive Acceptance Filter 2 Extended Identifier<17:6>
Receive Acceptance Filter 5 Extended Identifier<5:0>
C1RXM0EIDL
Bit 4
Receive Acceptance Filter 2 Standard Identifier <10:0>
Receive Acceptance Filter 4 Extended Identifier<5:0>
—
Bit 5
Receive Acceptance Filter 1 Extended Identifier<17:6>
Receive Acceptance Filter 3 Extended Identifier<5:0>
—
Bit 6
Receive Acceptance Filter 1 Standard Identifier<10:0>
Receive Acceptance Filter 2 Extended Identifier<5:0>
—
Bit 7
Receive Acceptance Filter 0 Extended Identifier<17:6>
Receive Acceptance Filter 1 Extended Identifier<5:0>
—
Bit 8
Receive Acceptance Filter 0 Standard Identifier<10:0>
—
Receive Acceptance Filter 0 Extended Identifier<5:0>
—
Bit 9
0000 uuuu uuuu uuuu
—
—
© 2006 Microchip Technology Inc.
C1RXM1EIDL
033C
Receive Acceptance Mask 1 Extended Identifier<5:0>
C1TX2SID
0340
Transmit Buffer 2 Standard Identifier<10:6>
C1TX2EID
0342
C1TX2DLC
0344
C1TX2B1
0346
Transmit Buffer 2 Byte 1
Transmit Buffer 2 Byte 0
uuuu uuuu uuuu uuuu
C1TX2B2
0348
Transmit Buffer 2 Byte 3
Transmit Buffer 2 Byte 2
uuuu uuuu uuuu uuuu
C1TX2B3
034A
Transmit Buffer 2 Byte 5
Transmit Buffer 2 Byte 4
uuuu uuuu uuuu uuuu
C1TX2B4
034C
Transmit Buffer 2 Byte 7
Transmit Buffer 2 Byte 6
C1TX2CON
034E
C1TX1SID
0350
C1TX1EID
0352
C1TX1DLC
0354
C1TX1B1
Transmit Buffer 2 Extended Identifier<17:14>
—
Transmit Buffer 2 Extended Identifier<5:0>
—
—
—
—
—
Transmit Buffer 1 Standard Identifier<10:6>
Transmit Buffer 1 Extended Identifier<17:14>
0356
—
Transmit Buffer 1 Extended Identifier<5:0>
—
—
—
—
—
—
—
—
—
TXRTR
TXRB1
Transmit Buffer 1 Byte 1
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
Transmit Buffer 2 Standard Identifier<5:0>
Transmit Buffer 2 Extended Identifier<13:6>
TXRB0
—
—
DLC<3:0>
TXABT
TXLARB
TXERR
TXREQ
uuuu 0000 uuuu uuuu
uuuu uuuu uuuu uuuu
—
Transmit Buffer 1 Standard Identifier<5:0>
TXPRI<1:0>
SRR
TXIDE
uuuu u000 uuuu uuuu
—
—
uuuu uuuu uuuu u000
Transmit Buffer 1 Extended Identifier<13:6>
TXRB0
DLC<3:0>
Transmit Buffer 1 Byte 0
—
0000 0000 0000 0000
uuuu 0000 uuuu uuuu
uuuu uuuu uuuu uuuu
dsPIC30F6010A/6015
DS70150B-page 130
TABLE 19-1:
© 2006 Microchip Technology Inc.
TABLE 19-1:
SFR Name
C1TX1B2
Addr.
CAN1 REGISTER MAP FOR dsPIC30F6010A AND 6015 DEVICES (CONTINUED)
Bit 15
Bit 14
Bit 13
0358
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Transmit Buffer 1 Byte 3
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
Transmit Buffer 1 Byte 2
uuuu uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
C1TX1B3
035A
Transmit Buffer 1 Byte 5
Transmit Buffer 1 Byte 4
C1TX1B4
035C
Transmit Buffer 1 Byte 7
Transmit Buffer 1 Byte 6
C1TX1CON
035E
C1TX0SID
0360
C1TX0EID
0362
C1TX0DLC
0364
C1TX0B1
0366
Transmit Buffer 0 Byte 1
Transmit Buffer 0 Byte 0
uuuu uuuu uuuu uuuu
C1TX0B2
0368
Transmit Buffer 0 Byte 3
Transmit Buffer 0 Byte 2
uuuu uuuu uuuu uuuu
C1TX0B3
036A
Transmit Buffer 0 Byte 5
Transmit Buffer 0 Byte 4
uuuu uuuu uuuu uuuu
C1TX0B4
036C
Transmit Buffer 0 Byte 7
Transmit Buffer 0 Byte 6
C1TX0CON
036E
—
—
—
—
—
—
—
—
Transmit Buffer 0 Standard Identifier<10:6>
Transmit Buffer 0 Extended Identifier<17:14>
—
—
—
—
—
—
—
—
—
—
TXRTR
TXRB1
Transmit Buffer 0 Extended Identifier<5:0>
—
—
—
—
—
TXABT
TXLARB
TXERR
uuuu uuuu uuuu uuuu
TXREQ
—
TXPRI<1:0>
Transmit Buffer 0 Standard Identifier<5:0>
SRR
TXIDE
uuuu u000 uuuu uuuu
—
—
uuuu uuuu uuuu u000
Transmit Buffer 0 Extended Identifier<13:6>
TXRB0
—
—
TXABT
TXLARB
TXERR
uuuu 0000 uuuu uuuu
—
DLC<3:0>
0000 0000 0000 0000
uuuu uuuu uuuu uuuu
TXREQ
—
TXPRI<1:0>
Receive Buffer 1 Standard Identifier<10:0>
0370
—
—
—
0372
—
—
—
C1RX1DLC
0374
C1RX1B1
0376
Receive Buffer 1 Byte 1
Receive Buffer 1 Byte 0
uuuu uuuu uuuu uuuu
C1RX1B2
0378
Receive Buffer 1 Byte 3
Receive Buffer 1 Byte 2
uuuu uuuu uuuu uuuu
C1RX1B3
037A
Receive Buffer 1 Byte 5
Receive Buffer 1 Byte 4
uuuu uuuu uuuu uuuu
C1RX1B4
037C
Receive Buffer 1 Byte 7
Receive Buffer 1 Byte 6
C1RX1CON
037E
—
—
—
C1RX0SID
0380
—
—
—
C1RX0EID
0382
—
—
—
C1RX0DLC
0384
C1RX0B1
0386
Receive Buffer 0 Byte 1
Receive Buffer 0 Byte 0
uuuu uuuu uuuu uuuu
C1RX0B2
0388
Receive Buffer 0 Byte 3
Receive Buffer 0 Byte 2
uuuu uuuu uuuu uuuu
C1RX0B3
038A
Receive Buffer 0 Byte 5
Receive Buffer 0 Byte 4
uuuu uuuu uuuu uuuu
C1RX0B4
038C
Receive Buffer 0 Byte 7
Receive Buffer 0 Byte 6
uuuu uuuu uuuu uuuu
C1RX0CON
038E
—
—
—
—
—
C1CTRL
0390
CANCAP
—
CSIDLE
ABAT
CANCKS
C1CFG1
0392
—
—
—
—
—
C1CFG2
0394
—
WAKFIL
—
—
—
SEG2PH<2:0>
C1INTF
0396
RX0OVR
RX1OVR
TXBO
TXEP
RXEP
TXWAR RXWAR EWARN
C1INTE
0398
—
—
—
—
—
C1EC
039A
Receive Buffer 1 Extended Identifier<5:0>
—
RXIDE
Receive Buffer 1 Extended Identifier<17:6>
—
RXRTR
—
—
RXRB1
—
—
—
RXFUL
—
—
0000 uuuu uuuu uuuu
RXRB0
—
—
DLC<3:0>
—
uuuu uuuu 000u uuuu
uuuu uuuu uuuu uuuu
RXRTRRO
FILHIT<2:0>
Receive Buffer 0 Standard Identifier<10:0>
SRR
0000 0000 0000 0000
RXIDE
Receive Buffer 0 Extended Identifier<17:6>
Receive Buffer 0 Extended Identifier<5:0>
RXRTR
—
—
RXRB1
—
—
RXFUL
REQOP<2:0>
—
—
—
—
—
—
—
OPMODE<2:0>
—
—
DLC<3:0>
—
Transmit Error Count Register
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
uuuu uuuu 000u uuuu
RXRTRRO DBEN JTOFF FILHIT0
—
ICODE<2:0>
SJW<1:0>
SEG2PHTS
—
BRP<5:0>
SAM
000u uuuu uuuu uuuu
0000 uuuu uuuu uuuu
RXRB0
—
000u uuuu uuuu uuuu
SEG1PH<2:0>
0000 0000 0000 0000
0000 0100 1000 0000
0000 0000 0000 0000
PRSEG<2:0>
0u00 0uuu uuuu uuuu
IVRIF
WAKIF
ERRIF
TX2IF
TX1IF
TX0IF RX1IF
RX0IF
0000 0000 0000 0000
IVRIE
WAKIE
ERRIE
TX2IE
TX1IE
TX0IE RX1E
RX0IE
0000 0000 0000 0000
Receive Error Count Register
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150B-page 131
C1RX1SID
C1RX1EID
—
SRR
0000 0000 0000 0000
CAN2 REGISTER MAP FOR dsPIC30F6010A
SFR Name
Addr.
Bit 15
Bit 14
Bit 13
C2RXF0SID
03C0
—
—
—
C2RXF0EIDH 03C2
—
—
—
C2RXF0EIDL
03C4
C2RXF1SID
03C8
—
—
—
C2RXF1EIDH 03CA
—
—
—
03CC
C2RXF2SID
03D0
—
—
—
C2RXF2EIDH 03D2
—
—
—
Bit 10
03D4
C2RXF3SID
03D8
—
—
—
C2RXF3EIDH 03DA
—
—
—
03E0
—
—
—
C2RXF4EIDH
03E2
—
—
—
C2RXF4EIDL
03E4
C2RXF5SID
03E8
—
—
—
C2RXF5EIDH 03EA
—
—
—
—
03EC
C2RXM0SID
03F0
—
—
—
C2RXM0EIDH 03F2
—
—
—
—
03F8
—
—
—
—
—
—
C2RXM1EIDL 03FC
Bit 4
Bit 3
Bit 2
—
—
—
—
—
Bit 1
Bit 0
Reset State
—
EXIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
—
EXIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
—
EXIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
—
EXIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
—
EXIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
—
EXIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
—
MIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
—
MIDE
000u uuuu uuuu uu0u
—
—
uuuu uu00 0000 0000
SRR
TXIDE
uuuu u000 uuuu uuuu
—
—
uuuu uuuu uuuu u000
0000 uuuu uuuu uuuu
—
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Filter 2 Standard Identifier<10:0>
—
Receive Acceptance Filter 2 Extended Identifier<17:6>
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Filter 3 Standard Identifier<10:0>
—
Receive Acceptance Filter 3 Extended Identifier<17:6>
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Filter 4 Standard Identifier<10:0>
—
Receive Acceptance Filter 4 Extended Identifier<17:6>
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Filter 5 Standard Identifier <10:0>
—
Receive Acceptance Filter 5 Extended Identifier<17:6>
—
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Mask 0 Standard Identifier<10:0>
—
Receive Acceptance Mask 0 Extended Identifier<17:6>
—
Receive Acceptance Mask 0 Extended Identifier<5:0>
C2RXM1EIDH 03FA
Bit 5
Receive Acceptance Filter 1 Extended Identifier<17:6>
Receive Acceptance Filter 5 Extended Identifier<5:0>
C2RXM0EIDL 03F4
Bit 6
Receive Acceptance Filter 1 Standard Identifier<10:0>
—
Receive Acceptance Filter 4 Extended Identifier<5:0>
C2RXF5EIDL
Bit 7
Receive Acceptance Filter 0 Extended Identifier<17:6>
Receive Acceptance Filter 3 Extended Identifier<5:0>
C2RXF4SID
Bit 8
Receive Acceptance Filter 0 Standard Identifier<10:0>
Receive Acceptance Filter 2 Extended Identifier<5:0>
03DC
Bit 9
—
Receive Acceptance Filter 1 Extended Identifier<5:0>
C2RXF2EIDL
C2RXM1SID
Bit 11
Receive Acceptance Filter 0 Extended Identifier<5:0>
C2RXF1EIDL
C2RXF3EIDL
Bit 12
—
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Receive Acceptance Mask 1 Standard Identifier<10:0>
—
Receive Acceptance Mask 1 Extended Identifier<17:6>
—
—
—
—
—
—
—
—
TXRTR
TXRB1
Receive Acceptance Mask 1 Extended Identifier<5:0>
Transmit Buffer 2 Standard Identifier<10:6>
—
—
—
—
0000 uuuu uuuu uuuu
—
—
Transmit Buffer 2 Standard Identifier<5:0>
© 2006 Microchip Technology Inc.
C2TX2SID
0400
C2TX2EID
0402
C2TX2DLC
0404
C2TX2B1
0406
Transmit Buffer 2 Byte 1
Transmit Buffer 2 Byte 0
uuuu uuuu uuuu uuuu
C2TX2B2
0408
Transmit Buffer 2 Byte 3
Transmit Buffer 2 Byte 2
uuuu uuuu uuuu uuuu
C2TX2B3
040A
Transmit Buffer 2 Byte 5
Transmit Buffer 2 Byte 4
uuuu uuuu uuuu uuuu
C2TX2B4
040C
Transmit Buffer 2 Byte 7
Transmit Buffer 2 Byte 6
C2TX2CON
040E
C2TX1SID
0410
C2TX1EID
0412
C2TX1DLC
0414
Transmit Buffer 2 Extended Identifier<17:14>
—
Transmit Buffer 2 Extended Identifier<5:0>
—
—
—
—
—
Transmit Buffer 1 Standard Identifier<10:6>
Transmit Buffer 1 Extended Identifier<17:14>
—
Transmit Buffer 1 Extended Identifier<5:0>
—
—
—
—
—
—
—
—
—
TXRTR
TXRB1
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
Transmit Buffer 2 Extended Identifier<13:6>
TXRB0
—
—
DLC<3:0>
TXABT
TXLARB TXERR
TXREQ
uuuu 0000 uuuu uuuu
uuuu uuuu uuuu uuuu
—
Transmit Buffer 1 Standard Identifier<5:0>
TXPRI<1:0>
SRR
TXIDE
uuuu u000 uuuu uuuu
—
—
uuuu uuuu uuuu u000
Transmit Buffer 1 Extended Identifier<13:6>
TXRB0
DLC<3:0>
—
0000 0000 0000 0000
uuuu 0000 uuuu uuuu
dsPIC30F6010A/6015
DS70150B-page 132
TABLE 19-2:
© 2006 Microchip Technology Inc.
TABLE 19-2:
SFR Name
C2TX1B1
Addr.
CAN2 REGISTER MAP FOR dsPIC30F6010A (CONTINUED)
Bit 15
Bit 14
Bit 13
0416
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
Transmit Buffer 1 Byte 1
Transmit Buffer 1 Byte 0
uuuu uuuu uuuu uuuu
0418
Transmit Buffer 1 Byte 3
Transmit Buffer 1 Byte 2
uuuu uuuu uuuu uuuu
C2TX1B3
041A
Transmit Buffer 1 Byte 5
Transmit Buffer 1 Byte 4
uuuu uuuu uuuu uuuu
C2TX1B4
041C
Transmit Buffer 1 Byte 7
Transmit Buffer 1 Byte 6
C2TX1CON
041E
C2TX0SID
0420
C2TX0EID
0422
C2TX0DLC
0424
C2TX0B1
0426
Transmit Buffer 0 Byte 1
Transmit Buffer 0 Byte 0
uuuu uuuu uuuu uuuu
C2TX0B2
0428
Transmit Buffer 0 Byte 3
Transmit Buffer 0 Byte 2
uuuu uuuu uuuu uuuu
C2TX0B3
042A
Transmit Buffer 0 Byte 5
Transmit Buffer 0 Byte 4
uuuu uuuu uuuu uuuu
C2TX0B4
042C
Transmit Buffer 0 Byte 7
Transmit Buffer 0 Byte 6
C2TX0CON
042E
—
—
—
C2RX1SID
0430
—
—
—
C2RX1EID
0432
—
—
—
C2RX1DLC
0434
C2RX1B1
0436
Receive Buffer 1 Byte 1
Receive Buffer 1 Byte 0
uuuu uuuu uuuu uuuu
C2RX1B2
0438
Receive Buffer 1 Byte 3
Receive Buffer 1 Byte 2
uuuu uuuu uuuu uuuu
C2RX1B3
043A
Receive Buffer 1 Byte 5
Receive Buffer 1 Byte 4
uuuu uuuu uuuu uuuu
C2RX1B4
043C
Receive Buffer 1 Byte 7
Receive Buffer 1 Byte 6
C2RX1CON
043E
—
—
—
C2RX0SID
0440
—
—
—
C2RX0EID
0442
—
—
—
C2RX0DLC
0444
C2RX0B1
0446
Receive Buffer 0 Byte 1
Receive Buffer 0 Byte 0
uuuu uuuu uuuu uuuu
C2RX0B2
0448
Receive Buffer 0 Byte 3
Receive Buffer 0 Byte 2
uuuu uuuu uuuu uuuu
C2RX0B3
044A
Receive Buffer 0 Byte 5
Receive Buffer 0 Byte 4
uuuu uuuu uuuu uuuu
C2RX0B4
044C
Receive Buffer 0 Byte 7
Receive Buffer 0 Byte 6
uuuu uuuu uuuu uuuu
C2RX0CON
044E
—
—
—
—
—
C2CTRL
0450
CANCAP
—
CSIDLE
ABAT
CANCKS
C2CFG1
0452
—
—
—
—
—
C2CFG2
0454
WAKFIL
—
—
—
C2INTF
0456
RX0OVR
RX1OVR
TXBO
TXEP
RXEP
TXWAR
RXWAR
C2INTE
0458
—
—
—
—
—
—
—
C2EC
—
—
—
—
—
Transmit Buffer 0 Standard Identifier<10:6>
Transmit Buffer 0 Extended Identifier<17:14>
—
—
—
—
—
—
—
—
—
—
TXRTR
TXRB1
Transmit Buffer 0 Extended Identifier<5:0>
—
—
—
—
TXABT
TXLARB TXERR
uuuu uuuu uuuu uuuu
TXREQ
—
TXPRI<1:0>
Transmit Buffer 0 Standard Identifier<5:0>
TXRB0
—
TXABT
TXLARB TXERR
uuuu u000 uuuu uuuu
—
—
uuuu uuuu uuuu u000
uuuu uuuu uuuu uuuu
TXREQ
—
TXPRI<1:0>
Receive Buffer 1 Standard Identifier<10:0>
—
TXIDE
uuuu 0000 uuuu uuuu
—
DLC<3:0>
SRR
RXIDE
Receive Buffer 1 Extended Identifier <17:6>
RXRTR
—
—
RXRB1
—
—
—
—
RXFUL
—
—
—
DLC<3:0>
uuuu uuuu 000u uuuu
FILHIT<2:0>
SRR
0000 0000 0000 0000
RXIDE
Receive Buffer 0 Extended Identifier<17:6>
Receive Buffer 0 Extended Identifier<5:0>
RXRTR
—
RXRB1
—
—
—
RXFUL
REQOP<2:0>
—
—
—
—
—
—
OPMODE<2:0>
—
SEG2PH<2:0>
000u uuuu uuuu uuuu
0000 uuuu uuuu uuuu
RXRB0
—
000u uuuu uuuu uuuu
uuuu uuuu uuuu uuuu
RXRTRRO
Receive Buffer 0 Standard Identifier<10:0>
—
0000 0000 0000 0000
0000 uuuu uuuu uuuu
RXRB0
—
0000 0000 0000 0000
SRR
Transmit Buffer 0 Extended Identifier<13:6>
—
—
Receive Buffer 1 Extended Identifier<5:0>
045A
—
DLC<3:0>
uuuu uuuu 000u uuuu
RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000
—
ICODE<2:0>
SJW<1:0>
—
BRP<5:0>
0000 0000 0000 0000
SEG2PHTS
SAM
EWARN
IVRIF
WAKIF
ERRIF
TX2IF
TX1IF
TX0IF RX1IF
RX0IF
0000 0000 0000 0000
—
IVRIE
WAKIE
ERRIE
TX2IE
TX1IE
TX0IE
RX0IE
0000 0000 0000 0000
Transmit Error Count Register
Legend:
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
SEG1PH<2:0>
0000 0100 1000 0000
Receive Error Count Register
PRSEG<2:0>
RX1E
0u00 0uuu uuuu uuuu
0000 0000 0000 0000
dsPIC30F6010A/6015
DS70150B-page 133
C2TX1B2
dsPIC30F6010A/6015
NOTES:
DS70150B-page 134
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
20.0
10-BIT HIGH-SPEED ANALOGTO-DIGITAL CONVERTER
(ADC) MODULE
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046).
The10-bit high-speed Analog-to-Digital Converter
(ADC) allows conversion of an analog input signal to a
10-bit digital number. This module is based on a Successive Approximation Register (SAR) architecture,
and provides a maximum sampling rate of 1 Msps. The
A/D module has 16 analog inputs which are multiplexed into four sample and hold amplifiers. The output
of the sample and hold is the input into the converter,
which generates the result. The analog reference voltages are software selectable to either the device supply voltage (AVDD/AVSS) or the voltage level on the
(VREF+/VREF-) pin. The A/D converter has a unique
feature of being able to operate while the device is in
Sleep mode.
© 2006 Microchip Technology Inc.
The A/D module has six 16-bit registers:
•
•
•
•
•
•
A/D Control Register 1 (ADCON1)
A/D Control Register 2 (ADCON2)
A/D Control Register 3 (ADCON3)
A/D Input Select Register (ADCHS)
A/D Port Configuration Register (ADPCFG)
A/D Input Scan Selection Register (ADCSSL)
The ADCON1, ADCON2 and ADCON3 registers
control the operation of the A/D module. The ADCHS
register selects the input channels to be converted. The
ADPCFG register configures the port pins as analog
inputs or as digital I/O. The ADCSSL register selects
inputs for scanning.
Note:
The SSRC<2:0>, ASAM, SIMSAM,
SMPI<3:0>, BUFM and ALTS bits, as well
as the ADCON3 and ADCSSL registers,
must not be written to while ADON = 1.
This would lead to indeterminate results.
The block diagram of the A/D module is shown in
Figure 20-1.
DS70150B-page 135
dsPIC30F6010A/6015
FIGURE 20-1:
10-BIT HIGH-SPEED A/D FUNCTIONAL BLOCK DIAGRAM
AVDD AVSS
VREF+ (Note 1)
VREF- (Note 2)
AN2
+
AN6
AN9
-
AN1
AN4
+
AN7
AN10
-
AN2
AN5
+
AN8
AN11
-
S/H
CH1
ADC
10-bit Result
S/H
CH2
16-word, 10-bit
Dual Port
Buffer
S/H
CH3
CH1,CH2,
CH3,CH0
sample
AN3
AN0
AN1
AN2
AN3
AN4
AN4
AN5
AN5
AN6
AN6
AN7
AN7
AN8
AN8
AN9
AN9
AN10
AN10
AN11
AN11
AN12
AN12
AN13
AN13
AN14
AN14
AN15
AN15
+
AN1
-
Note
input
switches
S/H
Sample/Sequence
Control
Input MUX
Control
CH0
1:
VREF+ is multiplexed with AN0 in the dsPIC30F6015 variant.
2:
VREF- is multiplexed with AN1 in the dsPIC30F6015 variant.
DS70150B-page 136
Conversion Logic
Bus Interface
AN1
AN0
AN3
Data
Format
AN0
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
20.1
A/D Result Buffer
The module contains a 16-word dual port, read-only
buffer, called ADCBUF0...ADCBUFF, to buffer the A/D
results. The RAM is 10-bits wide, but is read into different
format 16-bit words. The contents of the sixteen A/D
Conversion Result Buffer registers, ADCBUF0 through
ADCBUFF, cannot be written by user software.
20.2
Conversion Operation
After the A/D module has been configured, the sample
acquisition is started by setting the SAMP bit. Various
sources, such as a programmable bit, timer time-outs and
external events, will terminate acquisition and start a conversion. When the A/D conversion is complete, the result
is loaded into ADCBUF0...ADCBUFF, and the A/D
Interrupt Flag ADIF and the DONE bit are set after the
number of samples specified by the SMPI bit.
The following steps should be followed for doing an
A/D conversion:
1.
2.
3.
4.
5.
6.
7.
Configure the A/D module:
-Configure analog pins, voltage reference
and digital I/O
-Select A/D input channels
-Select A/D conversion clock
-Select A/D conversion trigger
-Turn on A/D module
Configure A/D interrupt (if required):
-Clear ADIF bit
-Select A/D interrupt priority
Start sampling.
Wait the required acquisition time.
Trigger acquisition end, start conversion
Wait for A/D conversion to complete, by either:
-Waiting for the A/D interrupt
Read A/D result buffer, clear ADIF if required.
20.3
Selecting the Conversion
Sequence
Several groups of control bits select the sequence in
which the A/D connects inputs to the sample/hold
channels, converts channels, writes the buffer memory,
and generates interrupts. The sequence is controlled
by the sampling clocks.
The SIMSAM bit controls the acquire/convert
sequence for multiple channels. If the SIMSAM bit is
‘0’, the two or four selected channels are acquired and
converted sequentially, with two or four sample clocks.
If the SIMSAM bit is ‘1’, two or four selected channels
are acquired simultaneously, with one sample clock.
The channels are then converted sequentially. Obviously, if there is only 1 channel selected, the SIMSAM
bit is not applicable.
© 2006 Microchip Technology Inc.
The CHPS bits selects how many channels are sampled. This can vary from 1, 2 or 4 channels. If CHPS
selects 1 channel, the CH0 channel will be sampled at
the sample clock and converted. The result is stored in
the buffer. If CHPS selects 2 channels, the CH0 and
CH1 channels will be sampled and converted. If CHPS
selects 4 channels, the CH0, CH1, CH2 and CH3
channels will be sampled and converted.
The SMPI bits select the number of acquisition/conversion sequences that would be performed before an
interrupt occurs. This can vary from 1 sample per
interrupt to 16 samples per interrupt.
The user cannot program a combination of CHPS and
SMPI bits that specifies more than 16 conversions per
interrupt, or 8 conversions per interrupt, depending on
the BUFM bit. The BUFM bit, when set, will split the
16-word results buffer (ADCBUF0...ADCBUFF) into
two 8-word groups. Writing to the 8-word buffers will be
alternated on each interrupt event. Use of the BUFM bit
will depend on how much time is available for moving
data out of the buffers after the interrupt, as determined
by the application.
If the processor can quickly unload a full buffer within
the time it takes to acquire and convert one channel,
the BUFM bit can be ‘0’ and up to 16 conversions may
be done per interrupt. The processor will have one
sample and conversion time to move the sixteen
conversions.
If the processor cannot unload the buffer within the acquisition and conversion time, the BUFM bit should be ‘1’.
For example, if SMPI<3:0> (ADCON2<5:2> = 0111),
then eight conversions will be loaded into 1/2 of the
buffer, following which an interrupt occurs. The next eight
conversions will be loaded into the other 1/2 of the buffer.
The processor will have the entire time between
interrupts to move the eight conversions.
The ALTS bit can be used to alternate the inputs
selected during the sampling sequence. The input
multiplexer has two sets of sample inputs: MUX A and
MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are
selected for sampling. If the ALTS bit is ‘1’ and
SMPI<3:0> = 0000, on the first sample/convert
sequence, the MUX A inputs are selected, and on the
next acquire/convert sequence, the MUX B inputs are
selected.
The CSCNA bit (ADCON2<10>) will allow the CH0
channel inputs to be alternately scanned across a
selected number of analog inputs for the MUX A group.
The inputs are selected by the ADCSSL register. If a
particular bit in the ADCSSL register is ‘1’, the corresponding input is selected. The inputs are always
scanned from lower to higher numbered inputs, starting
after each interrupt. If the number of inputs selected is
greater than the number of samples taken per interrupt,
the higher numbered inputs are unused.
DS70150B-page 137
dsPIC30F6010A/6015
20.4
Programming the Start of
Conversion Trigger
The conversion trigger will terminate acquisition and
start the requested conversions.
The SSRC<2:0> bits select the source of the
conversion trigger.
The SSRC bits provide for up to 5 alternate sources of
conversion trigger.
When SSRC<2:0> = 000, the conversion trigger is
under software control. Clearing the SAMP bit will
cause the conversion trigger.
When SSRC<2:0> = 111 (Auto-Start mode), the conversion trigger is under A/D clock control. The SAMC
bits select the number of A/D clocks between the start
of acquisition and the start of conversion. This provides
the fastest conversion rates on multiple channels.
SAMC must always be at least 1 clock cycle.
Other trigger sources can come from timer modules,
motor control PWM module, or external interrupts.
Note:
To operate the A/D at the maximum specified conversion speed, the Auto-Convert
Trigger option should be selected
(SSRC = 111) and the Auto-Sample Time
bits should be set to 1 TAD
(SAMC = 00001). This configuration will
give a total conversion period (sample +
convert) of 13 TAD.
The use of any other conversion trigger
will result in additional TAD cycles to
synchronize the external event to the A/D.
20.5
Aborting a Conversion
Clearing the ADON bit during a conversion will abort
the current conversion and stop the sampling sequencing. The ADCBUF will not be updated with the partially
completed A/D conversion sample. That is, the
ADCBUF will continue to contain the value of the last
completed conversion (or the last value written to the
ADCBUF register).
If the clearing of the ADON bit coincides with an
auto-start, the clearing has a higher priority.
20.6
Selecting the A/D Conversion
Clock
The A/D conversion requires 12 TAD. The source of the
A/D conversion clock is software selected using a sixbit counter. There are 64 possible options for TAD.
EQUATION 20-1:
A/D CONVERSION CLOCK
TAD = TCY * (0.5 * (ADCS<5:0> + 1))
TAD
ADCS<5:0> = 2
–1
TCY
The internal RC oscillator is selected by setting the
ADRC bit.
For correct A/D conversions, the A/D conversion clock
(TAD) must be selected to ensure a minimum TAD time
of 83.33 nsec (for VDD = 5V). Refer to the Section 24.0
"Electrical Characteristics" for minimum TAD under
other operating conditions.
Example 20-1 shows a sample calculation for the
ADCS<5:0> bits, assuming a device operating speed
of 30 MIPS.
EXAMPLE 20-1:
A/D CONVERSION CLOCK
CALCULATION
TAD = 84 nsec
TCY = 33 nsec (30 MIPS)
TAD
–1
TCY
84 nsec
=2•
33 nsec
= 4.09
ADCS<5:0> = 2
–1
Therefore,
Set ADCS<5:0> = 9
TCY
(ADCS<5:0> + 1)
2
33 nsec
=
(9 + 1)
2
Actual TAD =
= 99 nsec
After the A/D conversion is aborted, a 2 TAD wait is
required before the next sampling may be started by
setting the SAMP bit.
If sequential sampling is specified, the A/D will continue
at the next sample pulse which corresponds with the
next channel converted. If simultaneous sampling is
specified, the A/D will continue with the next
multichannel group conversion sequence.
DS70150B-page 138
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
20.7
A/D Conversion Speeds
The dsPIC30F 10-bit A/D converter specifications
permit a maximum 1 Msps sampling rate. Table 20-1
summarizes the conversion speeds for the dsPIC30F
10-bit A/D converter and the required operating
conditions.
TABLE 20-1:
10-BIT A/D CONVERSION RATE PARAMETERS
dsPIC30F 10-bit A/D Converter Conversion Rates
A/D Speed
Up to
1 Msps(1)
TAD
Sampling
RS Max
Minimum Time Min
83.33 ns
12 TAD
500Ω
VDD
Temperature
4.5V to 5.5V
-40°C to +85°C
A/D Channels Configuration
VREF- VREF+
CH1, CH2 or CH3
ANx
S/H
ADC
CH0
S/H
Up to
750 ksps(1)
95.24 ns
2 TAD
500Ω
4.5V to 5.5V
-40°C to +85°C
VREF- VREF+
CHX
ANx
S/H
Up to
600 ksps(1)
138.89 ns
12 TAD
500Ω
3.0V to 5.5V
ADC
-40°C to +125°C
VREF- VREF+
CH1, CH2 or CH3
ANx
S/H
CH0
ADC
S/H
Up to
500 ksps
153.85 ns
1 TAD
5.0 kΩ
4.5V to 5.5V
-40°C to +125°C
VREF- VREF+
or
or
AVSS AVDD
CHX
ANx
S/H
ADC
ANx or VREF-
Up to
300 ksps
256.41 ns
1 TAD
5.0 kΩ
3.0V to 5.5V
-40°C to +125°C
VREF- VREF+
or
or
AVSS AVDD
CHX
ANx
S/H
ADC
ANx or VREF-
Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 20-2 for recommended
circuit.
© 2006 Microchip Technology Inc.
DS70150B-page 139
dsPIC30F6010A/6015
The following figure depicts the recommended circuit
for the conversion rates above 500 ksps.
The configuration guidelines give the required setup
values for the conversion speeds above 500 ksps,
since they require external VREF pins usage and there
are some differences in the configuration procedure.
Configuration details that are not critical to the
conversion speed have been omitted.
FIGURE 20-2:
A/D CONVERTER VOLTAGE REFERENCE SCHEMATIC
VDD
VSS
VDD
VDD
C8
1 μF
VDD
dsPIC30F6010A
VSS
VDD
20.7.1
C4
0.1 μF
VDD
C3
0.01 μF
VDD
VDD
1 Msps CONFIGURATION
GUIDELINE
Single Analog Input
For conversions at 1 Msps for a single analog input, at
least two sample and hold channels must be enabled.
The analog input multiplexer must be configured so
that the same input pin is connected to both sample
and hold channels. The A/D converts the value held on
one S/H channel, while the second S/H channel
acquires a new input sample.
DS70150B-page 140
VDD
VSS
VDD
VREF+
VREF
AVDD
AVSS
R1
10
The configuration for 1 Msps operation is dependent on
whether a single input pin is to be sampled or whether
multiple pins will be sampled.
20.7.1.1
VDD
C5
1 μF
C1
0.01 μF
C6
0.01 μF
VDD
VDD
C2
0.1 μF
C7
0.1 μF
VDD
VSS
VDD
R2
10
VDD
20.7.1.2
Multiple Analog Inputs
The A/D converter can also be used to sample multiple
analog inputs using multiple sample and hold channels.
In this case, the total 1 Msps conversion rate is divided
among the different input signals. For example, four
inputs can be sampled at a rate of 250 ksps for each
signal or two inputs could be sampled at a rate of
500 ksps for each signal. Sequential sampling must be
used in this configuration to allow adequate sampling
time on each input.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
20.7.1.3
1 Msps Configuration Items
The following configuration items are required to
achieve a 1 Msps conversion rate.
• Comply with conditions provided in Table 20-2
• Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 20-2
• Set SSRC<2:0> = 111 in the ADCON1 register to
enable the auto-convert option
• Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
• Enable sequential sampling by clearing the
SIMSAM bit in the ADCON1 register
• Enable at least two sample and hold channels by
writing the CHPS<1:0> control bits in the
ADCON2 register
• Write the SMPI<3:0> control bits in the ADCON2
register for the desired number of conversions
between interrupts. At a minimum, set
SMPI<3:0> = 0001 since at least two sample and
hold channels should be enabled
• Configure the A/D clock period to be:
1
= 83.33 ns
12 x 1,000,000
by writing to the ADCS<5:0> control bits in the
ADCON3 register
• Configure the sampling time to be 2 TAD by
writing: SAMC<4:0> = 00010
• Select at least two channels per analog input pin
by writing to the ADCHS register
20.7.2
750 ksps CONFIGURATION
GUIDELINE
The following configuration items are required to
achieve a 750 ksps conversion rate. This configuration
assumes that a single analog input is to be sampled.
• Comply with conditions provided in Table 20-2
• Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 20-2
• Set SSRC<2:0> = 111 in the ADCON1 register to
enable the auto-convert option
• Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
• Enable one sample and hold channel by setting
CHPS<1:0> = 00 in the ADCON2 register
• Write the SMPI<3:0> control bits in the ADCON2
register for the desired number of conversions
between interrupts
• Configure the A/D clock period to be:
1
= 95.24 ns
(12 + 2) X 750,000
by writing to the ADCS<5:0> control bits in the
ADCON3 register
• Configure the sampling time to be 2 TAD by
writing: SAMC<4:0> = 00010
© 2006 Microchip Technology Inc.
20.7.3
600 ksps CONFIGURATION
GUIDELINE
The configuration for 600 ksps operation is dependent
on whether a single input pin is to be sampled or
whether multiple pins will be sampled.
20.7.3.1
Single Analog Input
When performing conversions at 600 ksps for a single
analog input, at least two sample and hold channels
must be enabled. The analog input multiplexer must be
configured so that the same input pin is connected to
both sample and hold channels. The A/D converts the
value held on one S/H channel, while the second S/H
channel acquires a new input sample.
20.7.3.2
Multiple Analog Input
The A/D converter can also be used to sample multiple
analog inputs using multiple sample and hold channels.
In this case, the total 600 ksps conversion rate is
divided among the different input signals. For example,
four inputs can be sampled at a rate of 150 ksps for
each signal or two inputs can be sampled at a rate of
300 ksps for each signal. Sequential sampling must be
used in this configuration to allow adequate sampling
time on each input.
20.7.3.3
600 ksps Configuration Items
The following configuration items are required to
achieve a 600 ksps conversion rate.
• Comply with conditions provided in Table 20-2
• Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 20-2
• Set SSRC<2:0> = 111 in the ADCON1 register to
enable the auto-convert option
• Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
• Enable sequential sampling by clearing the
SIMSAM bit in the ADCON1 register
• Enable at least two sample and hold channels by
writing the CHPS<1:0> control bits in the
ADCON2 register
• Write the SMPI<3:0> control bits in the ADCON2
register for the desired number of conversions
between interrupts. At a minimum, set
SMPI<3:0> = 0001 since at least two sample and
hold channels should be enabled
• Configure the A/D clock period to be:
1
= 138.89 ns
12 x 600,000
by writing to the ADCS<5:0> control bits in the
ADCON3 register
• Configure the sampling time to be 2 TAD by
writing: SAMC<4:0> = 00010
• Select at least two channels per analog input pin
by writing to the ADCHS register
DS70150B-page 141
dsPIC30F6010A/6015
20.8
A/D Acquisition Requirements
The analog input model of the 10-bit A/D converter is
shown in Figure 20-3. The total sampling time for the
A/D is a function of the internal amplifier settling time,
device VDD and the holding capacitor charge time.
For the A/D converter to meet its specified accuracy,
the charge holding capacitor (CHOLD) must be allowed
to fully charge to the voltage level on the analog input
pin. The analog output source impedance (RS), the
interconnect impedance (RIC), and the internal sampling switch (RSS) impedance combine to directly affect
the time required to charge the capacitor CHOLD. The
combined impedance must therefore be small enough
to fully charge the holding capacitor within the chosen
sample time. To minimize the effects of pin leakage
currents on the accuracy of the A/D converter, the maximum recommended source impedance, RS, is 5 kΩ for
conversion rates up to 500 ksps and a maximum of
500Ω for conversion rates up to 1 Msps. After the
analog input channel is selected (changed), this sampling function must be completed prior to starting the
conversion. The internal holding capacitor will be in a
discharged state prior to each sample operation.
FIGURE 20-3:
The user must allow at least 1 TAD period of sampling
time, TSAMP, between conversions to allow each sample to be acquired. This sample time may be controlled
manually in software by setting/clearing the SAMP bit,
or it may be automatically controlled by the A/D converter. In an automatic configuration, the user must
allow enough time between conversion triggers so that
the minimum sample time can be satisfied. Refer to
Section 24.0 “Electrical Characteristics” for TAD and
sample time requirements.
A/D CONVERTER ANALOG INPUT MODEL
VDD
Rs
VA
ANx
RIC ≤ 250Ω
VT = 0.6V
Sampling
Switch
RSS ≤ 3 kΩ
RSS
CPIN
VT = 0.6V
I leakage
± 500 nA
CHOLD
= DAC capacitance
= 4.4 pF
VSS
Legend: CPIN
= input capacitance
= threshold voltage
VT
I leakage = leakage current at the pin due to
various junctions
= interconnect resistance
RIC
= sampling switch resistance
RSS
= sample/hold capacitance (from DAC)
CHOLD
Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 5 kΩ.
DS70150B-page 142
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
20.9
Module Power-Down Modes
If the A/D interrupt is enabled, the device will wake-up
from Sleep. If the A/D interrupt is not enabled, the A/D
module will then be turned off, although the ADON bit
will remain set.
The module has 3 internal power modes. When the
ADON bit is ‘1’, the module is in Active mode; it is fully
powered and functional. When ADON is ‘0’, the module
is in Off mode. The digital and analog portions of the
circuit are disabled for maximum current savings. In
order to return to the Active mode from Off mode, the
user must wait for the ADC circuitry to stabilize.
20.10.2
The ADSIDL bit selects if the module will stop on Idle or
continue on Idle. If ADSIDL = 0, the module will continue
operation on assertion of Idle mode. If ADSIDL = 1, the
module will stop on Idle.
20.10 A/D Operation During CPU Sleep
and Idle Modes
20.10.1
20.11 Effects of a Reset
A/D OPERATION DURING CPU
SLEEP MODE
A device Reset forces all registers to their Reset state.
This forces the A/D module to be turned off, and any
conversion and acquisition sequence is aborted. The
values that are in the ADCBUF registers are not modified. The A/D Result register will contain unknown data
after a Power-on Reset.
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’.
If Sleep occurs in the middle of a conversion, the conversion is aborted. The converter will not continue with
a partially completed conversion on exit from Sleep
mode.
20.12 Output Formats
Register contents are not affected by the device
entering or leaving Sleep mode.
The A/D result is 10 bits wide. The data buffer RAM is
also 10 bits wide. The 10-bit data can be read in one of
four different formats. The FORM<1:0> bits select the
format. Each of the output formats translates to a 16-bit
result on the data bus.
The A/D module can operate during Sleep mode if the
A/D clock source is set to RC (ADRC = 1). When the
RC clock source is selected, the A/D module waits one
instruction cycle before starting the conversion. This
allows the SLEEP instruction to be executed, which
eliminates all digital switching noise from the conversion. When the conversion is complete, the DONE bit
will be set and the result loaded into the ADCBUF
register.
FIGURE 20-4:
A/D OPERATION DURING CPU IDLE
MODE
Write data will always be in right justified (integer)
format.
A/D OUTPUT DATA FORMATS
RAM Contents:
d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
Read to Bus:
Signed Fractional (1.15)
d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
0
0
Fractional (1.15)
d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
0
0
Signed Integer
Integer
© 2006 Microchip Technology Inc.
d09 d09 d09 d09 d09 d09 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
0
0
0
0
0
0
d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
DS70150B-page 143
dsPIC30F6010A/6015
20.13 Configuring Analog Port Pins
20.14 Connection Considerations
The use of the ADPCFG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be
converted.
The analog inputs have diodes to VDD and VSS as ESD
protection. This requires that the analog input be
between VDD and VSS. If the input voltage exceeds this
range by greater than 0.3V (either direction), one of the
diodes becomes forward biased and it may damage the
device if the input current specification is exceeded.
The A/D operation is independent of the state of the
CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.
An external RC filter is sometimes added for antialiasing of the input signal. The R component should be
selected to ensure that the sampling time requirements
are satisfied. Any external components connected (via
high-impedance) to an analog input pin (capacitor,
Zener diode, etc.) should have very little leakage
current at the pin.
When reading the PORT register, all pins configured as
analog input channels will read as cleared.
Pins configured as digital inputs will not convert an
analog input. Analog levels on any pin that is defined as
a digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
DS70150B-page 144
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 20-2:
SFR Name Addr.
ADC REGISTER MAP
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset State
ADCBUF0
0280
—
—
—
—
—
—
ADC Data Buffer 0
0000 00uu uuuu uuuu
ADCBUF1
0282
—
—
—
—
—
—
ADC Data Buffer 1
0000 00uu uuuu uuuu
ADCBUF2
0284
—
—
—
—
—
—
ADC Data Buffer 2
0000 00uu uuuu uuuu
ADCBUF3
0286
—
—
—
—
—
—
ADC Data Buffer 3
0000 00uu uuuu uuuu
ADCBUF4
0288
—
—
—
—
—
—
ADC Data Buffer 4
0000 00uu uuuu uuuu
ADCBUF5
028A
—
—
—
—
—
—
ADC Data Buffer 5
0000 00uu uuuu uuuu
ADCBUF6
028C
—
—
—
—
—
—
ADC Data Buffer 6
0000 00uu uuuu uuuu
ADCBUF7
028E
—
—
—
—
—
—
ADC Data Buffer 7
0000 00uu uuuu uuuu
ADCBUF8
0290
—
—
—
—
—
—
ADC Data Buffer 8
0000 00uu uuuu uuuu
ADCBUF9
0292
—
—
—
—
—
—
ADC Data Buffer 9
0000 00uu uuuu uuuu
ADCBUFA
0294
—
—
—
—
—
—
ADC Data Buffer 10
0000 00uu uuuu uuuu
ADCBUFB
0296
—
—
—
—
—
—
ADC Data Buffer 11
0000 00uu uuuu uuuu
ADCBUFC
0298
—
—
—
—
—
—
ADC Data Buffer 12
0000 00uu uuuu uuuu
ADCBUFD
029A
—
—
—
—
—
—
ADC Data Buffer 13
0000 00uu uuuu uuuu
ADCBUFE
029C
—
—
—
—
—
—
ADC Data Buffer 14
0000 00uu uuuu uuuu
ADCBUFF
029E
—
—
—
—
—
—
ADC Data Buffer 15
ADCON1
02A0
ADON
—
ADSIDL
—
—
—
FORM<1:0>
ADCON2
02A2
—
—
CSCNA
CHPS<1:0>
ADCON3
02A4
ADCHS
02A6
ADPCFG
ADCSSL
Legend:
—
—
CH123NB<1:0>
—
SAMC<4:0>
CH0SB<3:0>
BUFS
—
ADRC
—
0000 00uu uuuu uuuu
SIMSAM
ASAM
SMPI<3:0>
SAMP
DONE
0000 0000 0000 0000
BUFM
ALTS
0000 0000 0000 0000
ADCS<5:0>
CH0NB
02A8 PCFG15 PCFG14
PCFG13
PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6
PCFG5
PCFG4
PCFG3
PCFG2 PCFG1 PCFG0 0000 0000 0000 0000
02AA CSSL15 CSSL14
u = uninitialized bit
CSSL13
CSSL12
CSSL5
CSSL4
CSSL3
CSSL2 CSSL1 CSSL0
CSSL9 CSSL8 CSSL7 CSSL6
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
CH123SA CH0NA
CH0SA<3:0>
0000 0000 0000 0000
CH123SB
CSSL11 CSSL10
CH123NA<1:0>
—
0000 0000 0000 0000
0000 0000 0000 0000
DS70150B-page 145
dsPIC30F6010A/6015
Note:
VCFG<2:0>
SSRC<2:0>
dsPIC30F6010A/6015
NOTES:
DS70150B-page 146
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
21.0
SYSTEM INTEGRATION
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
There are several features intended to maximize
system reliability, minimize cost through elimination of
external components, provide power-saving operating
modes and offer code protection:
• Oscillator Selection
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
• Watchdog Timer (WDT)
• Power-Saving modes (Sleep and Idle)
• Code Protection
• Unit ID Locations
• In-Circuit Serial Programming (ICSP)
21.1
Oscillator System Overview
The dsPIC30F oscillator system has the following
modules and features:
• Various external and internal oscillator options as
clock sources
• An on-chip PLL to boost internal operating
frequency
• A clock switching mechanism between various
clock sources
• Programmable clock postscaler for system power
savings
• A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and takes fail-safe measures
• Clock Control register (OSCCON)
• Configuration bits for main oscillator selection
Configuration bits determine the clock source upon
Power-on Reset (POR) and Brown-out Reset (BOR).
Thereafter, the clock source can be changed between
permissible clock sources. The OSCCON register controls the clock switching and reflects system clock
related Status bits.
Table 21-1 provides a summary of the dsPIC30F
oscillator operating modes. A simplified diagram of the
oscillator system is shown in Figure 21-1.
dsPIC30F devices have a Watchdog Timer, which is
permanently enabled via the Configuration bits or can
be software controlled. It runs off its own RC oscillator
for added reliability. There are two timers that offer
necessary delays on power-up. One is the Oscillator
Start-up Timer (OST), intended to keep the chip in
Reset until the crystal oscillator is stable. The other is
the Power-up Timer (PWRT), which provides a delay
on power-up only, designed to keep the part in Reset
while the power supply stabilizes. With these two timers on-chip, most applications need no external Reset
circuitry.
Sleep mode is designed to offer a very low-current
Power-Down mode. The user can wake-up from Sleep
through external Reset, Watchdog Timer Wake-up or
through an interrupt. Several oscillator options are also
made available to allow the part to fit a wide variety of
applications. In the Idle mode, the clock sources are
still active, but the CPU is shut-off. The RC oscillator
option saves system cost, while the LP crystal option
saves power.
© 2006 Microchip Technology Inc.
DS70150B-page 147
dsPIC30F6010A/6015
TABLE 21-1:
OSCILLATOR OPERATING MODES
Oscillator Mode
Description
XTL
200 kHz-4 MHz crystal on OSC1:OSC2
XT
4 MHz-10 MHz crystal on OSC1:OSC2
XT w/PLL 4x
4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled
XT w/PLL 8x
4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled
XT w/PLL 16x
4 MHz-7.5 MHz crystal on OSC1:OSC2, 16x PLL enabled(1)
LP
32 kHz crystal on SOSCO:SOSCI(2)
HS
10 MHz-25 MHz crystal.
HS/2 w/PLL 4x
10 MHz-20 MHz crystal, divide by 2, 4x PLL enabled(3)
HS/2 w/PLL 8x
10 MHz-20 MHz crystal, divide by 2, 8x PLL enabled(3)
HS/2 w/PLL 16x
10 MHz-15 MHz crystal, divide by 2, 16x PLL enabled(1)
HS/3 w/PLL 4x
12 MHz-25 MHz crystal, divide by 3, 4x PLL enabled(4)
HS/3 w/PLL 8x
12 MHz-25 MHz crystal, divide by 3, 8x PLL enabled(4)
HS/3 w/PLL 16x
12 MHz-22.5 MHz crystal, divide by 3, 16x PLL enabled(1)(4)
EC
External clock input (0-40 MHz)
ECIO
External clock input (0-40 MHz), OSC2 pin is I/O
EC w/PLL 4x
External clock input (4-10 MHz), OSC2 pin is I/O, 4x PLL enabled
EC w/PLL 8x
External clock input (4-10 MHz), OSC2 pin is I/O, 8x PLL enabled
EC w/PLL 16x
External clock input (4-7.5 MHz), OSC2 pin is I/O, 16x PLL enabled(1)
ERC
External RC oscillator, OSC2 pin is FOSC/4 output(5)
ERCIO
External RC oscillator, OSC2 pin is I/O(5)
FRC
7.37 MHz internal RC oscillator
FRC w/PLL 4x
7.37 MHz internal RC oscillator, 4x PLL enabled
FRC w/PLL 8x
7.37 MHz internal RC oscillator, 8x PLL enabled
FRC w/PLL 16x
7.37 MHz internal RC oscillator, 16x PLL enabled
LPRC
512 kHz internal RC oscillator
Note 1:
2:
3:
4:
5:
Any higher will violate device operating frequency range.
LP oscillator can be conveniently shared as system clock, as well as Real-Time Clock for Timer1.
Any higher will violate PLL input range.
Any lower will violate PLL input range.
Requires external R and C. Frequency operation up to 4 MHz.
DS70150B-page 148
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 21-1:
OSCILLATOR SYSTEM BLOCK DIAGRAM
Oscillator Configuration bits
PWRSAV Instruction
Wake-up Request
FPLL
OSC1
OSC2
Primary
Oscillator
PLL
x4, x8, x16
PLL
Lock
COSC<2:0>
Primary Osc
TUN<5:0>
6
NOSC<2:0>
Primary
Oscillator
Stability Detector
OSWEN
Internal Fast RC
Oscillator (FRC)
POR Done
Oscillator
Start-up
Timer
Clock
Secondary Osc
Switching
and Control
Block
SOSCO
SOSCI
32 kHz LP
Oscillator
Secondary
Oscillator
Stability Detector
Internal LowPower RC
Oscillator (LPRC)
FCKSM<1:0>
2
Programmable
Clock Divider System
Clock
2
POST<1:0>
LPRC
Fail-Safe Clock
Monitor (FSCM)
CF
Oscillator Trap
to Timer1
© 2006 Microchip Technology Inc.
DS70150B-page 149
dsPIC30F6010A/6015
21.2
Oscillator Configurations
21.2.1
INITIAL CLOCK SOURCE
SELECTION
While coming out of Power-on Reset or Brown-out
Reset, the device selects its clock source based on:
a)
b)
FOS<2:0> Configuration bits that select one of
four oscillator groups,
and FPR<4:0> Configuration bits that select one
of 16 oscillator choices within the primary group.
The selection is as shown in Table 21-2.
TABLE 21-2:
.CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator Mode
Oscillator
Source
FOS<2:0>
FPR<4:0>
OSC2 Function
ECIO w/PLL 4x
PLL
1
1
1
0
1
1
0
1
I/O
ECIO w/PLL 8x
PLL
1
1
1
0
1
1
1
0
I/O
ECIO w/PLL 16x
PLL
1
1
1
0
1
1
1
1
I/O
FRC w/PLL 4x
PLL
1
1
1
0
0
0
0
1
I/O
FRC w/PLL 8x
PLL
1
1
1
0
1
0
1
0
I/O
FRC w/PLL 16x
PLL
1
1
1
0
0
0
1
1
I/O
XT w/PLL 4x
PLL
1
1
1
0
0
1
0
1
OSC2
XT w/PLL 8x
PLL
1
1
1
0
0
1
1
0
OSC2
XT w/PLL 16x
PLL
1
1
1
0
0
1
1
1
OSC2
HS/2 w/PLL 4x
PLL
1
1
1
1
0
0
0
1
OSC2
HS/2 w/PLL 8x
PLL
1
1
1
1
0
0
1
0
OSC2
HS/2 w/PLL 16x
PLL
1
1
1
1
0
0
1
1
OSC2
HS/3 w/PLL 4x
PLL
1
1
1
1
0
1
0
1
OSC2
HS/3 w/PLL 8x
PLL
1
1
1
1
0
1
1
0
OSC2
HS/3 w/PLL 16x
PLL
1
1
1
1
0
1
1
1
OSC2
ECIO
External
0
1
1
0
1
1
0
0
I/O
XT
External
0
1
1
0
0
1
0
0
OSC2
HS
External
0
1
1
0
0
0
1
0
OSC2
EC
External
0
1
1
0
1
0
1
1
CLKO
ERC
External
0
1
1
0
1
0
0
1
CLKO
ERCIO
External
0
1
1
0
1
0
0
0
I/O
XTL
External
0
1
1
0
0
0
0
0
OSC2
LP
Secondary
0
0
0
x
x
x
x
x
(Note 1, 2)
FRC
Internal FRC
0
0
1
x
x
x
x
x
(Note 1, 2)
Internal LPRC
0
1
0
x
x
x
x
x
(Note 1, 2)
LPRC
Note 1:
2:
OSC2 pin function is determined by FPR<4:0>.
OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is
selected at all times.
DS70150B-page 150
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
21.2.2
OSCILLATOR START-UP TIMER
(OST)
In order to ensure that a crystal oscillator (or ceramic
resonator) has started and stabilized, an Oscillator
Start-up Timer is included. It is a simple 10-bit counter
that counts 1024 TOSC cycles before releasing the
oscillator clock to the rest of the system. The time-out
period is designated as TOST. The TOST time is
involved every time the oscillator has to restart (i.e., on
POR, BOR and wake-up from Sleep). The Oscillator
Start-up Timer is applied to the LP, XT, XTL and HS
Oscillator modes (upon wake-up from Sleep, POR and
BOR) for the primary oscillator.
21.2.3
LP OSCILLATOR CONTROL
Enabling the LP oscillator is controlled with two
elements:
1.
2.
The current oscillator group bits COSC<2:0>
The LPOSCEN bit (OSCCON register)
The LP oscillator is ON (even during Sleep mode) if
LPOSCEN = 1. The LP oscillator is the device clock if:
• COSC<2:0> = 000 (LP selected as main oscillator)
and
• LPOSCEN = 1
Keeping the LP oscillator ON at all times allows for a
fast switch to the 32 kHz system clock for lower power
operation. Returning to the faster main oscillator will
still require a start-up time.
21.2.4
PHASE LOCKED LOOP (PLL)
The PLL multiplies the clock which is generated by the
primary oscillator. The PLL is selectable to have either
gains of x4, x8 and x16. Input and output frequency
ranges are summarized in Table 21-3.
TABLE 21-3:
Fin
4 MHz-10 MHz
4 MHz-10 MHz
4 MHz-7.5 MHz
PLL FREQUENCY RANGE
PLL
Multiplier
x4
x8
x16
Fout
16 MHz-40 MHz
32 MHz-80 MHz
64 MHz-120 MHz
The PLL features a lock output, which is asserted when
the PLL enters a phase locked state. Should the loop
fall out of lock (e.g., due to noise), the lock signal will be
rescinded. The state of this signal is reflected in the
read-only LOCK bit in the OSCCON register.
© 2006 Microchip Technology Inc.
21.2.5
FAST RC OSCILLATOR (FRC)
The FRC oscillator is a fast (7.37 MHz nominal) internal
RC oscillator. This oscillator is intended to provide reasonable device operating speeds without the use of an
external crystal, ceramic resonator or RC network. The
FRC oscillator can be used with the PLL to obtain
higher clock frequencies.
The dsPIC30F operates from the FRC oscillator whenever the current oscillator selection control bits in the
OSCCON register (OSCCON<14:12>) are set to ‘001’.
The six bit field specified by TUN<5:0>
(OSCTUN<5:0>) allows the user to tune the internal
fast RC oscillator (nominal 7.37 MHz). The user can
tune the FRC oscillator within a range of +12.6% (930
kHz) and -13% (960 kHz) in steps of 0.4% around the
factory-calibrated setting, see Table 20-4.
If OSCCON<14:12> are set to ‘111’ and FPR<4:0> are
set to ‘00101’, ‘00110’ or ‘00111’, then a PLL
multiplier of 4, 8 or 16 (respectively) is applied.
Note:
When a 16x PLL is used, the FRC oscillator must not be tuned to a frequency
greater than 7.5 MHz.
TABLE 21-4:
TUN<5:0>
Bits
01 1111
01 1110
01 1101
...
00 0100
00 0011
00 0010
00 0001
00 0000
11
11
11
11
1111
1110
1101
1100
...
10 0011
10 0010
10 0001
10 0000
FRC TUNING
FRC Frequency
+12.6%
+12.2%
+11.8%
...
+1.6%
+1.2%
+0.8%
+0.4%
Center Frequency (oscillator is
running at calibrated frequency)
-0.4%
-0.8%
-1.2%
-1.6%
...
-11.8%
-12.2%
-12.6%
-13.0%
DS70150B-page 151
dsPIC30F6010A/6015
21.2.6
LOW-POWER RC OSCILLATOR
(LPRC)
The LPRC oscillator is a component of the Watchdog
Timer (WDT) and oscillates at a nominal frequency of
512 kHz. The LPRC oscillator is the clock source for
the Power-up Timer (PWRT) circuit, WDT and clock
monitor circuits. It may also be used to provide a low
frequency clock source option for applications where
power consumption is critical, and timing accuracy is
not required.
The LPRC oscillator is always enabled at a Power-on
Reset, because it is the clock source for the PWRT.
After the PWRT expires, the LPRC oscillator will
remain ON if one of the following is TRUE:
• The Fail-Safe Clock Monitor is enabled
• The WDT is enabled
• The LPRC oscillator is selected as the system
clock via the COSC<2:0> control bits in the
OSCCON register
If one of the above conditions is not true, the LPRC will
shut-off after the PWRT expires.
Note 1: OSC2 pin function is determined by the
Primary Oscillator mode selection
(FPR<4:0>).
2: Note that OSC1 pin cannot be used as an
I/O pin, even if the secondary oscillator or
an internal clock source is selected at all
times.
21.2.7
FAIL-SAFE CLOCK MONITOR
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue to operate even in the event of an oscillator
failure. The FSCM function is enabled by appropriately
programming the FCKSM Configuration bits (Clock
Switch and Monitor Selection bits) in the FOSC device
Configuration register. If the FSCM function is
enabled, the LPRC internal oscillator will run at all
times (except during Sleep mode) and will not be
subject to control by the SWDTEN bit.
In the event of an oscillator failure, the FSCM will
generate a clock failure trap event and will switch the system clock over to the FRC oscillator. The user will then
have the option to either attempt to restart the oscillator
or execute a controlled shutdown. The user may decide
to treat the trap as a warm Reset by simply loading the
Reset address into the oscillator fail trap vector. In this
event, the CF (Clock Fail) Status bit (OSCCON<3>) is
also set whenever a clock failure is recognized.
In the event of a clock failure, the WDT is unaffected
and continues to run on the LPRC clock.
If the oscillator has a very slow start-up time coming
out of POR, BOR or Sleep, it is possible that the
PWRT timer will expire before the oscillator has
started. In such cases, the FSCM will be activated and
the FSCM will initiate a clock failure trap, and the
DS70150B-page 152
COSC<2:0> bits are loaded with FRC oscillator selection. This will effectively shut-off the original oscillator
that was trying to start.
The user may detect this situation and restart the
oscillator in the clock fail trap ISR.
Upon a clock failure detection, the FSCM module will
initiate a clock switch to the FRC oscillator as follows:
1.
2.
3.
The COSC bits (OSCCON<14:12>) are loaded
with the FRC oscillator selection value.
CF bit is set (OSCCON<3>).
OSWEN control bit (OSCCON<0>) is cleared.
For the purpose of clock switching, the clock sources
are sectioned into four groups:
1.
2.
3.
4.
Primary
Secondary
Internal FRC
Internal LPRC
The user can switch between these functional groups,
but cannot switch between options within a group. If the
primary group is selected, then the choice within the
group is always determined by the FPR<4:0>
Configuration bits.
The OSCCON register holds the control and Status bits
related to clock switching.
• COSC<2:0>: Read-only Status bits always reflect
the current oscillator group in effect.
• NOSC<2:0>: Control bits which are written to
indicate the new oscillator group of choice.
- On POR and BOR, COSC<2:0> and
NOSC<2:0> are both loaded with the
Configuration bit values FOS<2:0>.
• LOCK: The LOCK Status bit indicates a PLL lock.
• CF: Read-only Status bit indicating if a clock fail
detect has occurred.
• OSWEN: Control bit changes from a ‘0’ to a ‘1’
when a clock transition sequence is initiated.
Clearing the OSWEN control bit will abort a clock
transition in progress (used for hang-up situations).
If Configuration bits FCKSM<1:0> = 1x, then the clock
switching and Fail-Safe Clock Monitor functions are
disabled. This is the default Configuration bit setting.
If clock switching is disabled, then the FOS<2:0> and
FPR<4:0> bits directly control the oscillator selection
and the COSC<2:0> bits do not control the clock
selection. However, these bits will reflect the clock
source selection.
Note:
The application should not attempt to
switch to a clock of frequency lower than
100 kHz when the Fail-Safe Clock Monitor
is enabled. If clock switching is performed,
the device may generate an oscillator fail
trap and switch to the fast RC oscillator.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
21.2.8
PROTECTION AGAINST
ACCIDENTAL WRITES TO OSCCON
A write to the OSCCON register is intentionally made
difficult because it controls clock switching and clock
scaling.
To write to the OSCCON low byte, the following code
sequence must be executed without any other
instructions in between:
Byte Write “0x46” to OSCCON low
Byte Write “0x57” to OSCCON low
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
To write to the OSCCON high byte, the following
instructions must be executed without any other
instructions in between:
Byte Write “0x78” to OSCCON high
Byte Write “0x9A” to OSCCON high
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
21.3
Reset
The dsPIC30F differentiates between various kinds of
Reset:
a)
b)
c)
d)
e)
f)
g)
h)
Power-on Reset (POR)
MCLR Reset during normal operation
MCLR Reset during Sleep
Watchdog Timer (WDT) Reset (during normal
operation)
Programmable Brown-out Reset (BOR)
RESET Instruction
Reset caused by trap lockup (TRAPR)
Reset caused by illegal opcode, or by using an
uninitialized W register as an Address Pointer
(IOPUWR)
Different registers are affected in different ways by
various Reset conditions. Most registers are not
affected by a WDT wake-up, since this is viewed as the
resumption of normal operation. Status bits from the
RCON register are set or cleared differently in different
Reset situations, as indicated in Table 21-5. These bits
are used in software to determine the nature of the
Reset.
A block diagram of the on-chip Reset circuit is shown in
Figure 21-2.
A MCLR noise filter is provided in the MCLR Reset
path. The filter detects and ignores small pulses.
Internally generated Resets do not drive MCLR pin low.
FIGURE 21-2:
RESET SYSTEM BLOCK DIAGRAM
RESET
Instruction
Digital
Glitch Filter
MCLR
Sleep or Idle
WDT
Module
POR
VDD Rise
Detect
S
VDD
Brown-out
Reset
BOR
BOREN
R
Q
SYSRST
Trap Conflict
Illegal Opcode/
Uninitialized W Register
© 2006 Microchip Technology Inc.
DS70150B-page 153
dsPIC30F6010A/6015
21.3.1
POR: POWER-ON RESET
A power-on event will generate an internal POR pulse
when a VDD rise is detected. The Reset pulse will occur
at the POR circuit threshold voltage (VPOR), which is
nominally 1.85V. The device supply voltage characteristics must meet specified starting voltage and rise rate
requirements. The POR pulse will reset a POR timer
and place the device in the Reset state. The POR also
selects the device clock source identified by the
oscillator configuration fuses.
The POR circuit inserts a small delay, TPOR, which is
nominally 10 μs and ensures that the device bias
circuits are stable. Furthermore, a user selected powerup time-out (TPWRT) is applied. The TPWRT parameter
is based on device Configuration bits and can be 0 ms
(no delay), 4 ms, 16 ms or 64 ms. The total delay is at
device power-up TPOR + TPWRT. When these delays
have expired, SYSRST will be negated on the next
leading edge of the Q1 clock, and the PC will jump to
the Reset vector.
The timing for the SYSRST signal is shown in
Figure 21-3 through Figure 21-5.
FIGURE 21-3:
TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)
VDD
MCLR
Internal POR
TOST
OST Time-out
TPWRT
PWRT Time-out
Internal Reset
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
FIGURE 21-4:
VDD
MCLR
Internal POR
TOST
OST Time-out
TPWRT
PWRT Time-out
Internal Reset
DS70150B-page 154
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 21-5:
TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
VDD
MCLR
Internal POR
TOST
OST Time-out
TPWRT
PWRT Time-out
Internal Reset
21.3.1.1
POR with Long Crystal Start-up
Time (with FSCM Enabled)
The oscillator start-up circuitry is not linked to the POR
circuitry. Some crystal circuits (especially low frequency
crystals) will have a relatively long start-up time. Therefore, one or more of the following conditions is possible
after the POR timer and the PWRT have expired:
• The oscillator circuit has not begun to oscillate.
• The Oscillator Start-up Timer has NOT expired (if
a crystal oscillator is used).
• The PLL has not achieved a LOCK (if PLL is
used).
If the FSCM is enabled and one of the above conditions
is true, then a clock failure trap will occur. The device
will automatically switch to the FRC oscillator and the
user can switch to the desired crystal oscillator in the
trap ISR.
21.3.1.2
Operating without FSCM and PWRT
If the FSCM is disabled and the Power-up Timer
(PWRT) is also disabled, then the device will exit rapidly
from Reset on power-up. If the clock source is FRC,
LPRC, EXTRC or EC, it will be active immediately.
If the FSCM is disabled and the system clock has not
started, the device will be in a frozen state at the Reset
vector until the system clock starts. From the user’s
perspective, the device will appear to be in Reset until
a system clock is available.
© 2006 Microchip Technology Inc.
21.3.2
BOR: PROGRAMMABLE
BROWN-OUT RESET
The BOR (Brown-out Reset) module is based on an
internal voltage reference circuit. The main purpose of
the BOR module is to generate a device Reset when a
brown-out condition occurs. Brown-out conditions are
generally caused by glitches on the AC mains (i.e.,
missing portions of the AC cycle waveform due to bad
power transmission lines or voltage sags due to excessive current draw when a large inductive load is turned
on).
The BOR module allows selection of one of the
following voltage trip points:
• 2.6V–2.71V
• 4.1V–4.4V
• 4.58V–4.73V
Note:
The BOR voltage trip points indicated here
are nominal values provided for design
guidance only.
A BOR will generate a Reset pulse which will reset the
device. The BOR will select the clock source, based on
the device Configuration bit values (FOS<2:0> and
FPR<4:0>). Furthermore, if an oscillator mode is
selected, the BOR will activate the Oscillator Start-up
Timer (OST). The system clock is held until OST
expires. If the PLL is used, then the clock will be held
until the LOCK bit (OSCCON<5>) is ‘1’.
DS70150B-page 155
dsPIC30F6010A/6015
Concurrently, the POR time-out (TPOR) and the PWRT
time-out (TPWRT) will be applied before the internal
Reset is released. If TPWRT = 0 and a crystal oscillator
is being used, then a nominal delay of TFSCM = 100 μs
is applied. The total delay in this case is
(TPOR + TFSCM).
FIGURE 21-6:
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
VDD
D
The BOR Status bit (RCON<1>) will be set to indicate
that a BOR has occurred. The BOR circuit, if enabled,
will continue to operate while in Sleep or Idle modes
and will reset the device should VDD fall below the BOR
threshold voltage.
R
R1
C
MCLR
dsPIC30F
Note 1: External Power-on Reset circuit is
required only if the VDD power-up slope
is too slow. The diode D helps discharge
the capacitor quickly when VDD powers
down.
2: R should be suitably chosen so as to
make sure that the voltage drop across
R does not violate the device’s electrical
specification.
3: R1 should be suitably chosen so as to
limit any current flowing into MCLR from
external capacitor C, in the event of
MCLR/VPP pin breakdown due to Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
Note:
DS70150B-page 156
Dedicated supervisory devices, such as
the MCP1XX and MCP8XX, may also be
used as an external Power-on Reset
circuit.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
Table 21-5 shows the Reset conditions for the RCON
register. Since the control bits within the RCON register
are R/W, the information in the table means that all the
bits are negated prior to the action specified in the
condition column.
TABLE 21-5:
INITIALIZATION CONDITION FOR RCON REGISTER CASE 1
Condition
Program
Counter
TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR
Power-on Reset
0x000000
0
0
0
0
0
0
0
1
1
Brown-out Reset
0x000000
0
0
0
0
0
0
0
0
1
MCLR Reset during normal
operation
0x000000
0
0
1
0
0
0
0
0
0
Software Reset during
normal operation
0x000000
0
0
0
1
0
0
0
0
0
MCLR Reset during Sleep
0x000000
0
0
1
0
0
0
1
0
0
MCLR Reset during Idle
0x000000
0
0
1
0
0
1
0
0
0
WDT Time-out Reset
0x000000
0
0
0
0
1
0
0
0
0
WDT Wake-up
PC + 2
0
0
0
0
1
0
1
0
0
Interrupt Wake-up from
Sleep
PC + 2(1)
0
0
0
0
0
0
1
0
0
Clock Failure Trap
0x000004
0
0
0
0
0
0
0
0
0
Trap Reset
0x000000
1
0
0
0
0
0
0
0
0
Illegal Operation Trap
0x000000
0
1
0
0
0
0
0
0
0
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’
Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.
Table 21-6 shows a second example of the bit
conditions for the RCON register. In this case, it is not
assumed the user has set/cleared specific bits prior to
action specified in the condition column.
TABLE 21-6:
INITIALIZATION CONDITION FOR RCON REGISTER CASE 2
Condition
Power-on Reset
Program
Counter
0x000000
TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR
0
0
0
0
0
0
0
1
1
Brown-out Reset
0x000000
u
u
u
u
u
u
u
0
1
MCLR Reset during normal
operation
0x000000
u
u
1
0
0
0
0
u
u
Software Reset during
normal operation
0x000000
u
u
0
1
0
0
0
u
u
MCLR Reset during Sleep
0x000000
u
u
1
u
0
0
1
u
u
MCLR Reset during Idle
0x000000
u
u
1
u
0
1
0
u
u
WDT Time-out Reset
0x000000
u
u
0
0
1
0
0
u
u
WDT Wake-up
PC + 2
u
u
u
u
1
u
1
u
u
PC + 2(1)
u
u
u
u
u
u
1
u
u
Clock Failure Trap
0x000004
u
u
u
u
u
u
u
u
u
Trap Reset
0x000000
1
u
u
u
u
u
u
u
u
Illegal Operation Reset
0x000000
u
1
u
u
u
u
u
u
u
Interrupt Wake-up from
Sleep
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’
Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.
© 2006 Microchip Technology Inc.
DS70150B-page 157
dsPIC30F6010A/6015
21.4
21.4.1
Watchdog Timer (WDT)
WATCHDOG TIMER OPERATION
The primary function of the Watchdog Timer (WDT) is
to reset the processor in the event of a software
malfunction. The WDT is a free running timer, which
runs off an on-chip RC oscillator, requiring no external
component. Therefore, the WDT timer will continue to
operate even if the main processor clock (e.g., the
crystal oscillator) fails.
21.4.2
ENABLING AND DISABLING THE
WDT
The Watchdog Timer can be “Enabled” or “Disabled”
only through a Configuration bit (FWDTEN) in the
Configuration register FWDT.
The processor wakes up from Sleep if at least one of
the following conditions has occurred:
• any interrupt that is individually enabled and
meets the required priority level
• any Reset (POR, BOR and MCLR)
• WDT time-out
On waking up from Sleep mode, the processor will
restart the same clock that was active prior to entry
into Sleep mode. When clock switching is enabled,
bits COSC<2:0> will determine the oscillator source
that will be used on wake-up. If clock switch is
disabled, then there is only one system clock.
Note:
If a POR or BOR occurred, the selection of
the oscillator is based on the FOS<2:0>
and FPR<4:0> Configuration bits.
Setting FWDTEN = 1 enables the Watchdog Timer.
The enabling is done when programming the device.
By default, after chip-erase, FWDTEN bit = 1. Any
device programmer capable of programming
dsPIC30F devices allows programming of this and
other Configuration bits.
If the clock source is an oscillator, the clock to the
device is held off until OST times out (indicating a
stable oscillator). If PLL is used, the system clock is
held off until LOCK = 1 (indicating that the PLL is
stable). Either way, TPOR, TLOCK and TPWRT delays are
applied.
If enabled, the WDT will increment until it overflows or
“times out”. A WDT time-out will force a device Reset
(except during Sleep). To prevent a WDT time-out, the
user must clear the Watchdog Timer using a CLRWDT
instruction.
If EC, FRC, LPRC or ERC oscillators are used, then a
delay of TPOR (~ 10 μs) is applied. This is the smallest
delay possible on wake-up from Sleep.
If a WDT times out during Sleep, the device will wakeup. The WDTO bit in the RCON register will be cleared
to indicate a wake-up resulting from a WDT time-out.
Setting FWDTEN = 0 allows user software to enable/
disable the Watchdog Timer via the SWDTEN
(RCON<5>) control bit.
21.5
Power-Saving Modes
There are two power-saving states that can be entered
through the execution of a special instruction, PWRSAV.
These are: Sleep and Idle.
The format of the PWRSAV instruction is as follows:
PWRSAV <parameter>, where ‘parameter’ defines
Idle or Sleep mode.
21.5.1
SLEEP MODE
In Sleep mode, the clock to the CPU and peripherals is
shut down. If an on-chip oscillator is being used, it is
shut down.
The Fail-Safe Clock Monitor is not functional during
Sleep, since there is no clock to monitor. However,
LPRC clock remains active if WDT is operational during
Sleep.
The Brown-out protection circuit, if enabled, will remain
functional during Sleep.
If Watchdog Timer is enabled, then the processor will
wake-up from Sleep mode upon WDT time-out. The
DS70150B-page 158
Moreover, if LP oscillator was active during Sleep, and
LP is the oscillator used on wake-up, then the start-up
delay will be equal to TPOR. PWRT delay and OST
timer delay are not applied. In order to have the smallest possible start-up delay when waking up from Sleep,
one of these faster wake-up options should be selected
before entering Sleep.
Any interrupt that is individually enabled (using the
corresponding IE bit) and meets the prevailing priority
level will be able to wake-up the processor. The processor will process the interrupt and branch to the ISR. The
Sleep Status bit in RCON register is set upon wake-up.
Note:
In spite of various delays applied (TPOR,
TLOCK and TPWRT), the crystal oscillator
(and PLL) may not be active at the end of
the time-out (e.g., for low-frequency crystals). In such cases, if FSCM is enabled,
then the device will detect this as a clock
failure and process the clock failure trap,
the FRC oscillator will be enabled, and the
user will have to re-enable the crystal oscillator. If FSCM is not enabled, then the
device will simply suspend execution of
code until the clock is stable, and will
remain in Sleep until the oscillator clock has
started.
All Resets will wake-up the processor from Sleep
mode. Any Reset, other than POR, will set the Sleep
Status bit. In a POR, the Sleep bit is cleared.
Sleep and WDTO Status bits are both set.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
21.5.2
IDLE MODE
In Idle mode, the clock to the CPU is shutdown while
peripherals keep running. Unlike Sleep mode, the clock
source remains active.
Several peripherals have a control bit in each module,
that allows them to operate during Idle.
LPRC fail-safe clock remains active if clock failure
detect is enabled.
The processor wakes up from Idle if at least one of the
following conditions is true:
21.6
The Configuration bits in each device Configuration
register specify some of the device modes and are
programmed by a device programmer, or by using the
In-Circuit Serial Programming™ (ICSP™) feature of the
device. Each device Configuration register is a 24-bit
register, but only the lower 16 bits of each register are
used to hold configuration data. There are six device
Configuration registers available to the user:
1.
• on any interrupt that is individually enabled (IE bit
is ‘1’) and meets the required priority level
• on any Reset (POR, BOR, MCLR)
• on WDT time-out
2.
Upon wake-up from Idle mode, the clock is re-applied
to the CPU and instruction execution begins immediately, starting with the instruction following the PWRSAV
instruction.
4.
Any interrupt that is individually enabled (using IE bit)
and meets the prevailing priority level will be able to
wake-up the processor. The processor will process the
interrupt and branch to the ISR. The Idle Status bit in
RCON register is set upon wake-up.
6.
Any Reset, other than POR, will set the Idle Status bit.
On a POR, the Idle bit is cleared.
If Watchdog Timer is enabled, then the processor will
wake-up from Idle mode upon WDT time-out. The Idle
and WDTO Status bits are both set.
Unlike wake-up from Sleep, there are no time delays
involved in wake-up from Idle.
Device Configuration Registers
3.
5.
FOSC (0xF80000): Oscillator Configuration
register
FWDT (0xF80002): Watchdog Timer
Configuration register
FBORPOR (0xF80004): BOR and POR
Configuration register
FBS (0xF80006): Boot Code Segment
Configuration register
FSS (0xF80008): Secure Code Segment
Configuration register
FGS (0xF8000A): General Code Segment
Configuration register
The placement of the Configuration bits is automatically
handled when you select the device in your device programmer. The desired state of the Configuration bits may
be specified in the source code (dependent on the language tool used), or through the programming interface.
After the device has been programmed, the application
software may read the Configuration bit values through
the table read instructions. For additional information,
please refer to the “dsPIC30F/33F Programmers Reference Manual” (DS70157) and the “dsPIC30F Family
Reference Manual” (DS70046).
Note 1: If the code protection Configuration Fuse
bits (FBS(BSS<2:0>), FSS(SSS<2:0>),
FGS<GCP> and FGS<GWRP>) have
been programmed, an erase of the entire
code-protected device is only possible at
voltages VDD ≥ 4.5V.
2: This device supports an Advanced implementation of CodeGuard™ Security.
Please refer to the “CodeGuard Security”
chapter (DS70180) for information on
how CodeGuard Security may be used in
your application.
© 2006 Microchip Technology Inc.
DS70150B-page 159
dsPIC30F6010A/6015
21.7
Peripheral Module Disable (PMD)
Registers
The Peripheral Module Disable (PMD) registers provide a method to disable a peripheral module by stopping all clock sources supplied to that module. When a
peripheral is disabled via the appropriate PMD control
bit, the peripheral is in a minimum power consumption
state. The control and STATUS registers associated
with the peripheral will also be disabled so writes to
those registers will have no effect and read values will
be invalid.
A peripheral module will only be enabled if both the
associated bit in the PMD register is cleared and the
peripheral is supported by the specific dsPIC DSC variant. If the peripheral is present in the device, it is
enabled in the PMD register by default.
Note:
If a PMD bit is set, the corresponding module is disabled after a delay of 1 instruction
cycle. Similarly, if a PMD bit is cleared, the
corresponding module is enabled after a
delay of 1 instruction cycle (assuming the
module control registers are already
configured to enable module operation).
21.8
When MPLAB® ICD 2 is selected as a debugger, the
In-Circuit Debugging functionality is enabled. This
function allows simple debugging functions when used
with MPLAB IDE. When the device has this feature
enabled, some of the resources are not available for
general use. These resources include the first 80 bytes
of data RAM and two I/O pins.
One of four pairs of debug I/O pins may be selected by
the user using configuration options in MPLAB IDE.
These pin pairs are named EMUD/EMUC, EMUD1/
EMUC1, EMUD2/EMUC2 and MUD3/EMUC3.
In each case, the selected EMUD pin is the Emulation/
Debug Data line, and the EMUC pin is the Emulation/
Debug Clock line. These pins will interface to the
MPLAB ICD 2 module available from Microchip. The
selected pair of debug I/O pins is used by MPLAB
ICD 2 to send commands and receive responses, as
well as to send and receive data. To use the In-Circuit
Debugger function of the device, the design must
implement ICSP connections to MCLR, VDD, VSS,
PGC, PGD and the selected EMUDx/EMUCx pin pair.
This gives rise to two possibilities:
1.
2.
DS70150B-page 160
In-Circuit Debugger
If EMUD/EMUC is selected as the debug I/O pin
pair, then only a 5-pin interface is required, as
the EMUD and EMUC pin functions are multiplexed with the PGD and PGC pin functions in
all dsPIC30F devices.
If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/
EMUC3 is selected as the debug I/O pin pair,
then a 7-pin interface is required, as the
EMUDx/EMUCx pin functions (x = 1, 2 or 3) are
not multiplexed with the PGD and PGC pin
functions.
© 2006 Microchip Technology Inc.
© 2006 Microchip Technology Inc.
TABLE 21-7:
SFR
Name
Addr.
RCON
SYSTEM INTEGRATION REGISTER MAP FOR dsPIC30F6010A
Bit 15
Bit 14
Bit 13
0740 TRAPR IOPUWR BGST
—
—
OSCCON 0742
OSCTUN 0744
T5MD
COSC<2:0>
—
—
Bit 10
—
—
—
—
—
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
—
—
—
EXTR
SWR
SWDTEN
WDTO
SLEEP
IDLE
LOCK
—
—
NOSC<2:0>
—
POST<1:0>
—
—
—
PMD2
Legend:
0772 IC8MD IC7MD
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
Addr.
RCON
T2MD
Bit 9
0770
SFR
Name
T3MD
Bit 11
PMD1
TABLE 21-8:
T4MD
Bit 12
IC6MD IC5MD IC4MD IC3MD
IC2MD
—
I2CMD
U2MD
IC1MD OC8MD OC7MD
Bit 14
Bit 13
0740 TRAPR IOPUWR BGST
—
—
T5MD
COSC<2:0>
—
—
T3MD
Bit 11
Bit 10
SPI2MD SPI1MD
C2MD
OC5MD OC4MD OC3MD
—
—
—
—
—
T2MD
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
—
—
—
EXTR
SWR
SWDTEN
WDTO
SLEEP
IDLE
LOCK
—
—
NOSC<2:0>
—
POST<1:0>
—
—
—
0770
PMD2
Legend:
0772 IC8MD IC7MD
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
BOR
POR
Reset State
Depends on type of Reset.
LPOSCEN OSWEN Depends on Configuration bits.
0000 0000 0000 0000
C1MD
ADCMD
0000 0000 0000 0000
OC2MD
OC1MD
0000 0000 0000 0000
Bit 1
Bit 0
Reset State
T1MD QEIMD PWMMD
IC6MD IC5MD IC4MD IC3MD
IC2MD
—
I2CMD
U2MD
IC1MD OC8MD OC7MD
U1MD
OC6MD
CF
—
TUN<5:0>
BOR
POR
SPI2MD SPI1MD
—
OC5MD OC4MD OC3MD
Depends on type of Reset.
LPOSCEN OSWEN Depends on Configuration bits.
0000 0000 0000 0000
C1MD
ADCMD
0000 0000 0000 0000
OC2MD
OC1MD
0000 0000 0000 0000
DEVICE CONFIGURATION REGISTER MAP
Addr.
Bits 23-16
FOSC
F80000
—
Bit 15
Bit 14
FCKSM<1:0>
Bit 13
Bit 12
Bit 11
—
—
—
Bit 10
Bit 9
Bit 8
FOS<2:0>
Bit 7
Bit 6
Bit 5
—
—
—
Bit 4
FWDT
F80002
—
FWDTEN
—
—
—
—
—
—
—
—
—
FWPSA<1:0>
F80004
—
MCLREN
—
—
—
—
PWMPIN
HPOL
LPOL
BOREN
—
BORV<1:0>
FBS
F80006
RBS1
RBS0
FSS
F80008
RSS1
RSS0
—
—
—
—
—
—
—
F8000A
u = uninitialized bit
Note:
Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
Bit 2
—
BSS<2:0>
ESS1
ESS0
SSS<2:0>
—
—
—
—
Bit 0
FWPSB<3:0>
—
EBS
—
Bit 1
FPR<4:0>
FBORPOR
FGS
Legend:
Bit 3
—
—
FPWRT<1:0>
GSS<1:0>
BWRP
SWRP
GWRP
DS70150B-page 161
dsPIC30F6010A/6015
File Name
T4MD
Bit 12
PMD1
TABLE 21-9:
U1MD
OC6MD
Bit 0
SYSTEM INTEGRATION REGISTER MAP FOR dsPIC30F6015
Bit 15
OSCCON 0742
OSCTUN 0744
T1MD QEIMD PWMMD
CF
—
TUN<5:0>
Bit 1
dsPIC30F6010A/6015
NOTES:
DS70150B-page 162
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
22.0
INSTRUCTION SET SUMMARY
Note: This data sheet summarizes features of this
group of dsPIC30F devices and is not intended to be
a complete reference source. For more information
on the CPU, peripherals, register descriptions and
general device functionality, refer to the “dsPIC30F
Family Reference Manual” (DS70046). For more
information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers
Reference Manual” (DS70157).
The dsPIC30F instruction set adds many enhancements to the previous PICmicro® Microcontroller
(MCU) instruction sets, while maintaining an easy
migration from PICmicro MCU instruction sets.
Most instructions are a single program memory word
(24-bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word divided
into an 8-bit opcode which specifies the instruction
type, and one or more operands which further specify
the operation of the instruction.
The instruction set is highly orthogonal and is grouped
into five basic categories:
•
•
•
•
•
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
Table 22-1 shows the general symbols used in
describing the instructions.
The dsPIC30F instruction set summary in Table 22-2
lists all the instructions along with the Status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
• The first source operand, which is typically a
register ‘Wb’ without any address modifier
• The second source operand, which is typically a
register ‘Ws’ with or without an address modifier
• The destination of the result, which is typically a
register ‘Wd’ with or without an address modifier
However, word or byte-oriented file register instructions have two operands:
• The file register specified by the value ‘f’
• The destination, which could either be the file
register ‘f’ or the W0 register, which is denoted as
‘WREG’
© 2006 Microchip Technology Inc.
Most bit oriented instructions (including simple rotate/
shift instructions) have two operands:
• The W register (with or without an address modifier) or file register (specified by the value of ‘Ws’
or ‘f’)
• The bit in the W register or file register
(specified by a literal value, or indirectly by the
contents of register ‘Wb’)
The literal instructions that involve data movement may
use some of the following operands:
• A literal value to be loaded into a W register or file
register (specified by the value of ‘k’)
• The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
• The first source operand, which is a register ‘Wb’
without any address modifier
• The second source operand, which is a literal
value
• The destination of the result (only if not the same
as the first source operand), which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instructions may use some of the
following operands:
• The accumulator (A or B) to be used (required
operand)
• The W registers to be used as the two operands
• The X and Y address space prefetch operations
• The X and Y address space prefetch destinations
• The accumulator write-back destination
The other DSP instructions do not involve any
multiplication, and may include:
• The accumulator to be used (required)
• The source or destination operand (designated as
Wso or Wdo, respectively) with or without an
address modifier
• The amount of shift, specified by a W register
‘Wn’ or a literal value
The control instructions may use some of the following
operands:
• A program memory address
• The mode of the table read and table write
instructions
All instructions are a single word, except for certain
double word instructions, which were made double
word instructions so that all the required information is
available in these 48 bits. In the second word, the
8 MSbs are ‘0’s. If this second word is executed as an
instruction (by itself), it will execute as a NOP.
DS70150B-page 163
dsPIC30F6010A/6015
Most single-word instructions are executed in a single
instruction cycle, unless a conditional test is true or the
program counter is changed as a result of the instruction. In these cases, the execution takes two instruction
cycles with the additional instruction cycle(s) executed
as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, all table
reads and writes and RETURN/RETFIE instructions,
which are single-word instructions, but take two or
three cycles. Certain instructions that involve skipping
over the subsequent instruction, require either two or
TABLE 22-1:
three cycles if the skip is performed, depending on
whether the instruction being skipped is a single-word
or two-word instruction. Moreover, double word moves
require two cycles. The double word instructions
execute in two instruction cycles.
Note:
For more details on the instruction set,
refer to the “dsPIC30F/33F Programmers
Reference Manual“ (DS70157).
SYMBOLS USED IN OPCODE DESCRIPTIONS
Field
#text
(text)
[text]
{ }
<n:m>
.b
.d
.S
.w
Acc
AWB
bit4
C, DC, N, OV, Z
Expr
f
lit1
lit4
lit5
lit8
lit10
lit14
lit16
lit23
None
OA, OB, SA, SB
PC
Slit10
Slit16
Slit6
DS70150B-page 164
Description
Means literal defined by “text”
Means “content of “text”
Means “the location addressed by text”
Optional field or operation
Register bit field
Byte mode selection
Double Word mode selection
Shadow register select
Word mode selection (default)
One of two accumulators {A, B}
Accumulator Write-Back Destination Address register ∈ {W13, [W13]+ = 2}
4-bit bit selection field (used in word addressed instructions) ∈ {0...15}
MCU Status bits: Carry, Digit Carry, Negative, Overflow, Zero
Absolute address, label or expression (resolved by the linker)
File register address ∈ {0x0000...0x1FFF}
1-bit unsigned literal ∈ {0,1}
4-bit unsigned literal ∈ {0...15}
5-bit unsigned literal ∈ {0...31}
8-bit unsigned literal ∈ {0...255}
10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode
14-bit unsigned literal ∈ {0...16384}
16-bit unsigned literal ∈ {0...65535}
23-bit unsigned literal ∈ {0...8388608}; LSB must be ‘0’
Field does not require an entry, may be blank
DSP Status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate
Program Counter
10-bit signed literal ∈ {-512...511}
16-bit signed literal ∈ {-32768...32767}
6-bit signed literal ∈ {-16...16}
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 22-1:
SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field
Wb
Wd
Wdo
Wm,Wn
Wm*Wm
Wm*Wn
Wn
Wnd
Wns
WREG
Ws
Wso
Wx
Wxd
Wy
Wyd
© 2006 Microchip Technology Inc.
Description
Base W register ∈ {W0..W15}
Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Destination W register ∈
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Dividend, Divisor working register pair (direct addressing)
Multiplicand and Multiplier working register pair for Square instructions ∈
{W4*W4,W5*W5,W6*W6,W7*W7}
Multiplicand and Multiplier working register pair for DSP instructions ∈
{W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7}
One of 16 working registers ∈ {W0..W15}
One of 16 destination working registers ∈ {W0..W15}
One of 16 source working registers ∈ {W0..W15}
W0 (working register used in file register instructions)
Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Source W register ∈
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
X data space prefetch address register for DSP instructions
∈ {[W8]+ = 6, [W8]+ = 4, [W8]+ = 2, [W8], [W8]- = 6, [W8]- = 4, [W8]- = 2,
[W9]+ = 6, [W9]+ = 4, [W9]+ = 2, [W9], [W9]- = 6, [W9]- = 4, [W9]- = 2,
[W9+W12], none}
X data space prefetch destination register for DSP instructions ∈ {W4..W7}
Y data space prefetch address register for DSP instructions
∈ {[W10]+ = 6, [W10]+ = 4, [W10]+ = 2, [W10], [W10]- = 6, [W10]- = 4, [W10]- = 2,
[W11]+ = 6, [W11]+ = 4, [W11]+ = 2, [W11], [W11]- = 6, [W11]- = 4, [W11]- = 2,
[W11+W12], none}
Y data space prefetch destination register for DSP instructions ∈ {W4..W7}
DS70150B-page 165
dsPIC30F6010A/6015
TABLE 22-2:
INSTRUCTION SET OVERVIEW
Base
Assembly
Instr
Mnemonic
#
1
2
3
4
5
6
7
8
9
10
ADD
ADDC
AND
ASR
BCLR
BRA
BSET
BSW
BTG
BTSC
Assembly Syntax
Description
# of
words
# of
cycles
Status Flags
Affected
ADD
ADD
Acc
f
Add Accumulators
f = f + WREG
1
1
1
1
OA,OB,SA,SB
C,DC,N,OV,Z
ADD
f,WREG
WREG = f + WREG
1
1
C,DC,N,OV,Z
ADD
#lit10,Wn
Wd = lit10 + Wd
1
1
C,DC,N,OV,Z
ADD
Wb,Ws,Wd
Wd = Wb + Ws
1
1
C,DC,N,OV,Z
ADD
Wb,#lit5,Wd
Wd = Wb + lit5
1
1
C,DC,N,OV,Z
ADD
Wso,#Slit4,Acc
16-bit Signed Add to Accumulator
1
1
OA,OB,SA,SB
ADDC
f
f = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
f,WREG
WREG = f + WREG + (C)
1
1
C,DC,N,OV,Z
ADDC
#lit10,Wn
Wd = lit10 + Wd + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,Ws,Wd
Wd = Wb + Ws + (C)
1
1
C,DC,N,OV,Z
ADDC
Wb,#lit5,Wd
Wd = Wb + lit5 + (C)
1
1
C,DC,N,OV,Z
AND
f
f = f .AND. WREG
1
1
N,Z
AND
f,WREG
WREG = f .AND. WREG
1
1
N,Z
AND
#lit10,Wn
Wd = lit10 .AND. Wd
1
1
N,Z
AND
Wb,Ws,Wd
Wd = Wb .AND. Ws
1
1
N,Z
AND
Wb,#lit5,Wd
Wd = Wb .AND. lit5
1
1
N,Z
ASR
f
f = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
f,WREG
WREG = Arithmetic Right Shift f
1
1
C,N,OV,Z
ASR
Ws,Wd
Wd = Arithmetic Right Shift Ws
1
1
C,N,OV,Z
ASR
Wb,Wns,Wnd
Wnd = Arithmetic Right Shift Wb by Wns
1
1
N,Z
ASR
Wb,#lit5,Wnd
Wnd = Arithmetic Right Shift Wb by lit5
1
1
N,Z
BCLR
f,#bit4
Bit Clear f
1
1
None
BCLR
Ws,#bit4
Bit Clear Ws
1
1
None
BRA
C,Expr
Branch if Carry
1
1 (2)
None
BRA
GE,Expr
Branch if greater than or equal
1
1 (2)
None
BRA
GEU,Expr
Branch if unsigned greater than or equal
1
1 (2)
None
BRA
GT,Expr
Branch if greater than
1
1 (2)
None
BRA
GTU,Expr
Branch if unsigned greater than
1
1 (2)
None
BRA
LE,Expr
Branch if less than or equal
1
1 (2)
None
BRA
LEU,Expr
Branch if unsigned less than or equal
1
1 (2)
None
BRA
LT,Expr
Branch if less than
1
1 (2)
None
BRA
LTU,Expr
Branch if unsigned less than
1
1 (2)
None
BRA
N,Expr
Branch if Negative
1
1 (2)
None
BRA
NC,Expr
Branch if Not Carry
1
1 (2)
None
BRA
NN,Expr
Branch if Not Negative
1
1 (2)
None
BRA
NOV,Expr
Branch if Not Overflow
1
1 (2)
None
BRA
NZ,Expr
Branch if Not Zero
1
1 (2)
None
BRA
OA,Expr
Branch if Accumulator A overflow
1
1 (2)
None
BRA
OB,Expr
Branch if Accumulator B overflow
1
1 (2)
None
BRA
OV,Expr
Branch if Overflow
1
1 (2)
None
BRA
SA,Expr
Branch if Accumulator A saturated
1
1 (2)
None
BRA
SB,Expr
Branch if Accumulator B saturated
1
1 (2)
None
BRA
Expr
Branch Unconditionally
1
2
None
BRA
Z,Expr
Branch if Zero
1
1 (2)
None
None
BRA
Wn
Computed Branch
1
2
BSET
f,#bit4
Bit Set f
1
1
None
BSET
Ws,#bit4
Bit Set Ws
1
1
None
BSW.C
Ws,Wb
Write C bit to Ws<Wb>
1
1
None
BSW.Z
Ws,Wb
Write Z bit to Ws<Wb>
1
1
None
BTG
f,#bit4
Bit Toggle f
1
1
None
BTG
Ws,#bit4
Bit Toggle Ws
1
1
None
BTSC
f,#bit4
Bit Test f, Skip if Clear
1
None
BTSC
Ws,#bit4
Bit Test Ws, Skip if Clear
1
1
(2 or 3)
1
(2 or 3)
DS70150B-page 166
None
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 22-2:
INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly
Instr
Mnemonic
#
11
12
13
14
15
BTSS
BTST
BTSTS
CALL
CLR
Assembly Syntax
Description
# of
words
# of
cycles
Status Flags
Affected
Z
BTSS
f,#bit4
Bit Test f, Skip if Set
1
BTSS
Ws,#bit4
Bit Test Ws, Skip if Set
1
BTST
f,#bit4
Bit Test f
1
1
(2 or 3)
1
(2 or 3)
1
None
BTST.C
Ws,#bit4
Bit Test Ws to C
1
1
C
BTST.Z
Ws,#bit4
Bit Test Ws to Z
1
1
Z
BTST.C
Ws,Wb
Bit Test Ws<Wb> to C
1
1
C
BTST.Z
Ws,Wb
Bit Test Ws<Wb> to Z
1
1
Z
BTSTS
f,#bit4
Bit Test then Set f
1
1
Z
BTSTS.C
Ws,#bit4
Bit Test Ws to C, then Set
1
1
C
None
BTSTS.Z
Ws,#bit4
Bit Test Ws to Z, then Set
1
1
Z
CALL
lit23
Call Subroutine
2
2
None
CALL
Wn
Call indirect Subroutine
1
2
None
CLR
f
f = 0x0000
1
1
None
CLR
WREG
WREG = 0x0000
1
1
None
CLR
Ws
Ws = 0x0000
1
1
None
CLR
Acc,Wx,Wxd,Wy,Wyd,AWB
Clear Accumulator
1
1
OA,OB,SA,SB
16
CLRWDT
CLRWDT
Clear Watchdog Timer
1
1
WDTO,Sleep
17
COM
COM
f
f=f
1
1
N,Z
COM
f,WREG
WREG = f
1
1
N,Z
COM
CP
Ws,Wd
f
Wd = Ws
Compare f with WREG
1
1
1
1
N,Z
C,DC,N,OV,Z
CP
Wb,#lit5
Compare Wb with lit5
1
1
C,DC,N,OV,Z
CP
Wb,Ws
Compare Wb with Ws (Wb – Ws)
1
1
C,DC,N,OV,Z
CP0
f
Compare f with 0x0000
1
1
C,DC,N,OV,Z
CP0
Ws
Compare Ws with 0x0000
1
1
C,DC,N,OV,Z
CPB
f
Compare f with WREG, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,#lit5
Compare Wb with lit5, with Borrow
1
1
C,DC,N,OV,Z
CPB
Wb,Ws
1
1
C,DC,N,OV,Z
1
18
19
20
CP
CP0
CPB
21
CPSEQ
CPSEQ
Wb, Wn
Compare Wb with Ws, with Borrow
(Wb – Ws – C)
Compare Wb with Wn, skip if =
22
CPSGT
CPSGT
Wb, Wn
Compare Wb with Wn, skip if >
1
23
CPSLT
CPSLT
Wb, Wn
Compare Wb with Wn, skip if <
1
24
CPSNE
CPSNE
Wb, Wn
Compare Wb with Wn, skip if ≠
1
25
DAW
DAW
Wn
Wn = decimal adjust Wn
1
1
(2 or 3)
1
(2 or 3)
1
(2 or 3)
1
(2 or 3)
1
26
DEC
DEC
f
f = f –1
1
1
C,DC,N,OV,Z
DEC
f,WREG
WREG = f –1
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
27
DEC2
None
None
None
None
C
DEC
Ws,Wd
Wd = Ws – 1
1
1
DEC2
f
f=f–2
1
1
C,DC,N,OV,Z
DEC2
f,WREG
WREG = f – 2
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
DEC2
Ws,Wd
Wd = Ws – 2
1
1
28
DISI
DISI
#lit14
Disable Interrupts for k instruction cycles
1
1
None
29
DIV
DIV.S
DIV.SD
Wm,Wn
Signed 16/16-bit Integer Divide
1
18
N,Z,C, OV
Wm,Wn
Signed 32/16-bit Integer Divide
1
18
N,Z,C, OV
DIV.U
Wm,Wn
Unsigned 16/16-bit Integer Divide
1
18
N,Z,C, OV
DIV.UD
Wm,Wn
Unsigned 32/16-bit Integer Divide
1
18
N,Z,C, OV
30
DIVF
DIVF
Wm,Wn
Signed 16/16-bit Fractional Divide
1
18
N,Z,C, OV
31
DO
DO
#lit14,Expr
Do code to PC + Expr, lit14 + 1 times
2
2
None
DO
Wn,Expr
Do code to PC + Expr, (Wn) + 1 times
2
2
None
32
ED
ED
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance (no accumulate)
1
1
33
EDAC
EDAC
Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance
1
1
34
EXCH
EXCH
Wns,Wnd
Swap Wns with Wnd
1
1
OA,OB,OAB,
SA,SB,SAB
OA,OB,OAB,
SA,SB,SAB
None
© 2006 Microchip Technology Inc.
DS70150B-page 167
dsPIC30F6010A/6015
TABLE 22-2:
INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly
Instr
Mnemonic
#
35
36
FBCL
FF1L
Assembly Syntax
FBCL
FF1L
Description
# of
words
# of
cycles
Status Flags
Affected
Ws,Wnd
Find Bit Change from Left (MSb) Side
Find First One from Left (MSb) Side
1
1
1
1
C
C
Ws,Wnd
37
FF1R
FF1R
Ws,Wnd
Find First One from Right (LSb) Side
1
1
C
38
GOTO
GOTO
Expr
Go to address
2
2
None
GOTO
Wn
Go to indirect
1
2
None
INC
f
f=f+1
1
1
C,DC,N,OV,Z
INC
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
INC
Ws,Wd
Wd = Ws + 1
1
1
C,DC,N,OV,Z
INC2
f
f=f+2
1
1
C,DC,N,OV,Z
INC2
f,WREG
WREG = f + 2
1
1
C,DC,N,OV,Z
39
40
41
42
INC
INC2
IOR
LAC
INC2
Ws,Wd
Wd = Ws + 2
1
1
C,DC,N,OV,Z
IOR
f
f = f .IOR. WREG
1
1
N,Z
IOR
f,WREG
WREG = f .IOR. WREG
1
1
N,Z
IOR
#lit10,Wn
Wd = lit10 .IOR. Wd
1
1
N,Z
IOR
Wb,Ws,Wd
Wd = Wb .IOR. Ws
1
1
N,Z
IOR
Wb,#lit5,Wd
Wd = Wb .IOR. lit5
1
1
N,Z
LAC
Wso,#Slit4,Acc
Load Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
None
43
LNK
LNK
#lit14
Link Frame Pointer
1
1
44
LSR
LSR
f
f = Logical Right Shift f
1
1
C,N,OV,Z
LSR
f,WREG
WREG = Logical Right Shift f
1
1
C,N,OV,Z
LSR
Ws,Wd
Wd = Logical Right Shift Ws
1
1
C,N,OV,Z
LSR
Wb,Wns,Wnd
Wnd = Logical Right Shift Wb by Wns
1
1
N,Z
LSR
Wb,#lit5,Wnd
Wnd = Logical Right Shift Wb by lit5
1
1
N,Z
MAC
1
1
OA,OB,OAB,
SA,SB,SAB
MAC
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd, Multiply and Accumulate
AWB
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate
1
1
MOV
f,Wn
Move f to Wn
1
1
OA,OB,OAB,
SA,SB,SAB
None
MOV
f
Move f to f
1
1
N,Z
MOV
f,WREG
Move f to WREG
1
1
N,Z
MOV
#lit16,Wn
Move 16-bit literal to Wn
1
1
None
MOV.b
#lit8,Wn
Move 8-bit literal to Wn
1
1
None
MOV
Wn,f
Move Wn to f
1
1
None
MOV
Wso,Wdo
Move Ws to Wd
1
1
None
MOV
WREG,f
Move WREG to f
1
1
N,Z
MOV.D
Wns,Wd
Move Double from W(ns):W(ns + 1) to Wd
1
2
None
MOV.D
Ws,Wnd
Move Double from Ws to W(nd + 1):W(nd)
1
2
None
45
46
MAC
MOV
MOV.D
Ws,Wnd
Move Double from Ws to W(nd + 1):W(nd)
1
2
None
47
MOVSAC
MOVSAC
Acc,Wx,Wxd,Wy,Wyd,AWB
Prefetch and store Accumulator
1
1
None
48
MPY
MPY
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
Multiply Wm by Wn to Accumulator
1
1
MPY
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square Wm to Accumulator
1
1
-(Multiply Wm by Wn) to Accumulator
OA,OB,OAB,
SA,SB,SAB
OA,OB,OAB,
SA,SB,SAB
None
49
MPY.N
MPY.N
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
50
MSC
MSC
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd, Multiply and Subtract from Accumulator
AWB
51
MUL
MUL.SS
MUL.SU
Wb,Ws,Wnd
Wb,Ws,Wnd
{Wnd + 1, Wnd} = signed(Wb) * signed(Ws)
{Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws)
MUL.US
Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws)
1
1
None
MUL.UU
Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) * unsigned(Ws)
1
1
None
MUL.SU
Wb,#lit5,Wnd
{Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5)
1
1
None
MUL.UU
Wb,#lit5,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) * unsigned(lit5)
1
1
None
MUL
f
W3:W2 = f * WREG
1
1
None
DS70150B-page 168
1
1
1
1
OA,OB,OAB,
SA,SB,SAB
1
1
1
1
None
None
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 22-2:
INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly
Instr
Mnemonic
#
52
NEG
# of
words
# of
cycles
Negate Accumulator
1
1
OA,OB,OAB,
SA,SB,SAB
Assembly Syntax
NEG
Acc
Description
Status Flags
Affected
NEG
f
f=f+1
1
1
C,DC,N,OV,Z
NEG
f,WREG
WREG = f + 1
1
1
C,DC,N,OV,Z
Ws,Wd
Wd = Ws + 1
No Operation
1
1
1
1
C,DC,N,OV,Z
None
53
NOP
NEG
NOP
No Operation
1
1
None
54
POP
POP
f
Pop f from Top-of-Stack (TOS)
1
1
None
POP
Wdo
Pop from Top-of-Stack (TOS) to Wdo
1
1
None
POP.D
Wnd
1
2
None
POP.S
PUSH
f
Pop from Top-of-Stack (TOS) to
W(nd):W(nd+1)
Pop Shadow Registers
Push f to Top-of-Stack (TOS)
1
1
1
1
All
None
PUSH
Wso
Push Wso to Top-of-Stack (TOS)
1
1
None
PUSH.D
Wns
Push W(ns):W(ns +1) to Top-of-Stack (TOS)
1
2
None
PUSH.S
PWRSAV
RCALL
#lit1
Expr
Push Shadow Registers
Go into Sleep or Idle mode
Relative Call
1
1
1
1
1
2
None
WDTO,Sleep
None
RCALL
Wn
Computed Call
1
2
None
REPEAT
#lit14
Repeat Next Instruction lit14 + 1 times
1
1
None
REPEAT
Wn
Repeat Next Instruction (Wn) + 1 times
1
1
None
Software device Reset
1
1
None
NOPR
55
56
57
58
PUSH
PWRSAV
RCALL
REPEAT
59
RESET
RESET
60
RETFIE
RETFIE
61
RETLW
RETLW
62
RETURN
RETURN
63
RLC
RLC
f
RLC
64
65
66
67
RLNC
RRC
RRNC
SAC
Return from interrupt
1
3 (2)
None
Return with literal in Wn
1
3 (2)
None
Return from Subroutine
1
3 (2)
None
f = Rotate Left through Carry f
1
1
C,N,Z
f,WREG
WREG = Rotate Left through Carry f
1
1
C,N,Z
#lit10,Wn
RLC
Ws,Wd
Wd = Rotate Left through Carry Ws
1
1
C,N,Z
RLNC
f
f = Rotate Left (No Carry) f
1
1
N,Z
RLNC
f,WREG
WREG = Rotate Left (No Carry) f
1
1
N,Z
RLNC
Ws,Wd
Wd = Rotate Left (No Carry) Ws
1
1
N,Z
RRC
f
f = Rotate Right through Carry f
1
1
C,N,Z
RRC
f,WREG
WREG = Rotate Right through Carry f
1
1
C,N,Z
C,N,Z
RRC
Ws,Wd
Wd = Rotate Right through Carry Ws
1
1
RRNC
f
f = Rotate Right (No Carry) f
1
1
N,Z
RRNC
f,WREG
WREG = Rotate Right (No Carry) f
1
1
N,Z
N,Z
RRNC
Ws,Wd
Wd = Rotate Right (No Carry) Ws
1
1
SAC
Acc,#Slit4,Wdo
Store Accumulator
1
1
None
SAC.R
Acc,#Slit4,Wdo
Store Rounded Accumulator
1
1
None
68
SE
SE
Ws,Wnd
Wnd = sign extended Ws
1
1
C,N,Z
69
SETM
SETM
f
f = 0xFFFF
1
1
None
SETM
WREG
WREG = 0xFFFF
1
1
None
SETM
Ws
Ws = 0xFFFF
1
1
None
SFTAC
Acc,Wn
Arithmetic Shift Accumulator by (Wn)
1
1
SFTAC
Acc,#Slit6
Arithmetic Shift Accumulator by Slit6
1
1
OA,OB,OAB,
SA,SB,SAB
OA,OB,OAB,
SA,SB,SAB
SL
SL
f
f,WREG
f = Left Shift f
WREG = Left Shift f
1
1
1
1
SL
Ws,Wd
Wd = Left Shift Ws
1
1
C,N,OV,Z
SL
Wb,Wns,Wnd
Wnd = Left Shift Wb by Wns
1
1
N,Z
SL
Wb,#lit5,Wnd
Wnd = Left Shift Wb by lit5
1
1
N,Z
70
71
SFTAC
SL
© 2006 Microchip Technology Inc.
C,N,OV,Z
C,N,OV,Z
DS70150B-page 169
dsPIC30F6010A/6015
TABLE 22-2:
INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Assembly
Instr
Mnemonic
#
72
73
74
75
SUB
SUBB
SUBR
SUBBR
Assembly Syntax
Description
# of
words
# of
cycles
1
1
Status Flags
Affected
SUB
Acc
Subtract Accumulators
SUB
f
f = f – WREG
1
1
OA,OB,OAB,
SA,SB,SAB
C,DC,N,OV,Z
SUB
f,WREG
WREG = f – WREG
1
1
C,DC,N,OV,Z
SUB
#lit10,Wn
Wn = Wn – lit10
1
1
C,DC,N,OV,Z
SUB
Wb,Ws,Wd
Wd = Wb – Ws
1
1
C,DC,N,OV,Z
SUB
Wb,#lit5,Wd
Wd = Wb – lit5
1
1
C,DC,N,OV,Z
SUBB
f
f = f – WREG – (C)
1
1
C,DC,N,OV,Z
SUBB
f,WREG
WREG = f – WREG – (C)
1
1
C,DC,N,OV,Z
SUBB
#lit10,Wn
Wn = Wn – lit10 - (C)
1
1
C,DC,N,OV,Z
SUBB
Wb,Ws,Wd
Wd = Wb – Ws – (C)
1
1
C,DC,N,OV,Z
SUBB
SUBR
Wb,#lit5,Wd
f
Wd = Wb – lit5 – (C)
f = WREG – f
1
1
1
1
C,DC,N,OV,Z
C,DC,N,OV,Z
SUBR
f,WREG
WREG = WREG – f
1
1
C,DC,N,OV,Z
SUBR
Wb,Ws,Wd
Wd = Ws – Wb
1
1
C,DC,N,OV,Z
SUBR
Wb,#lit5,Wd
Wd = lit5 - Wb
1
1
C,DC,N,OV,Z
SUBBR
f
f = WREG – f - (C)
1
1
C,DC,N,OV,Z
SUBBR
f,WREG
WREG = WREG – f – (C)
1
1
C,DC,N,OV,Z
SUBBR
Wb,Ws,Wd
Wd = Ws – Wb – (C)
1
1
C,DC,N,OV,Z
SWAP
SUBBR
SWAP.b
Wb,#lit5,Wd
76
Wn
Wd = lit5 – Wb – (C)
Wn = nibble swap Wn
1
1
1
1
C,DC,N,OV,Z
None
SWAP
Wn
Wn = byte swap Wn
1
1
None
77
TBLRDH
TBLRDH
Ws,Wd
Read Prog<23:16> to Wd<7:0>
1
2
None
78
TBLRDL
TBLRDL
Ws,Wd
Read Prog<15:0> to Wd
1
2
None
79
TBLWTH
TBLWTH
Ws,Wd
Write Ws<7:0> to Prog<23:16>
1
2
None
80
TBLWTL
TBLWTL
Ws,Wd
Write Ws to Prog<15:0>
1
2
None
81
ULNK
ULNK
Unlink Frame Pointer
1
1
None
82
XOR
XOR
f
f = f .XOR. WREG
1
1
N,Z
XOR
f,WREG
WREG = f .XOR. WREG
1
1
N,Z
XOR
#lit10,Wn
Wd = lit10 .XOR. Wd
1
1
N,Z
XOR
Wb,Ws,Wd
Wd = Wb .XOR. Ws
1
1
N,Z
XOR
Wb,#lit5,Wd
Wd = Wb .XOR. lit5
1
1
N,Z
ZE
Ws,Wnd
Wnd = Zero-Extend Ws
1
1
C,Z,N
83
ZE
DS70150B-page 170
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
23.0
DEVELOPMENT SUPPORT
The PICmicro® microcontrollers are supported with a
full range of hardware and software development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Assemblers/Compilers/Linkers
- MPASMTM Assembler
- MPLAB C18 and MPLAB C30 C Compilers
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB ASM30 Assembler/Linker/Library
• Simulators
- MPLAB SIM Software Simulator
• Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB ICE 4000 In-Circuit Emulator
• In-Circuit Debugger
- MPLAB ICD 2
• Device Programmers
- PICSTART® Plus Development Programmer
- MPLAB PM3 Device Programmer
- PICkit™ 2 Development Programmer
• Low-Cost Demonstration and Development
Boards and Evaluation Kits
23.1
MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Visual device initializer for easy register
initialization
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-line help
• Integration of select third party tools, such as
HI-TECH Software C Compilers and IAR
C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either assembly or C)
• One touch assemble (or compile) and download
to PICmicro MCU emulator and simulator tools
(automatically updates all project information)
• Debug using:
- Source files (assembly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
© 2006 Microchip Technology Inc.
DS70150B-page 171
dsPIC30F6010A/6015
23.2
MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for all PICmicro MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
23.5
MPLAB ASM30 Assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 C Compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
•
•
•
•
•
•
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
23.6
23.3
MPLAB C18 and MPLAB C30
C Compilers
The MPLAB C18 and MPLAB C30 Code Development
Systems are complete ANSI C compilers for
Microchip’s PIC18 family of microcontrollers and the
dsPIC30, dsPIC33 and PIC24 family of digital signal
controllers. These compilers provide powerful integration capabilities, superior code optimization and ease
of use not found with other compilers.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
23.4
MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulating the PICmicro MCUs and dsPIC® DSCs on an
instruction level. On any given instruction, the data
areas can be examined or modified and stimuli can be
applied from a comprehensive stimulus controller.
Registers can be logged to files for further run-time
analysis. The trace buffer and logic analyzer display
extend the power of the simulator to record and track
program execution, actions on I/O, most peripherals
and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
offers the flexibility to develop and debug code outside
of the hardware laboratory environment, making it an
excellent, economical software development tool.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
DS70150B-page 172
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
23.7
MPLAB ICE 2000
High-Performance
In-Circuit Emulator
The MPLAB ICE 2000 In-Circuit Emulator is intended
to provide the product development engineer with a
complete microcontroller design tool set for PICmicro
microcontrollers. Software control of the MPLAB ICE
2000 In-Circuit Emulator is advanced by the MPLAB
Integrated Development Environment, which allows
editing, building, downloading and source debugging
from a single environment.
The MPLAB ICE 2000 is a full-featured emulator
system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow
the system to be easily reconfigured for emulation of
different processors. The architecture of the MPLAB
ICE 2000 In-Circuit Emulator allows expansion to
support new PICmicro microcontrollers.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft® Windows® 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
23.8
MPLAB ICE 4000
High-Performance
In-Circuit Emulator
The MPLAB ICE 4000 In-Circuit Emulator is intended to
provide the product development engineer with a
complete microcontroller design tool set for high-end
PICmicro MCUs and dsPIC DSCs. Software control of
the MPLAB ICE 4000 In-Circuit Emulator is provided by
the MPLAB Integrated Development Environment,
which allows editing, building, downloading and source
debugging from a single environment.
23.9
MPLAB ICD 2 In-Circuit Debugger
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low-cost, run-time development tool,
connecting to the host PC via an RS-232 or high-speed
USB interface. This tool is based on the Flash PICmicro
MCUs and can be used to develop for these and other
PICmicro MCUs and dsPIC DSCs. The MPLAB ICD 2
utilizes the in-circuit debugging capability built into
the Flash devices. This feature, along with Microchip’s
In-Circuit Serial ProgrammingTM (ICSPTM) protocol,
offers cost-effective, in-circuit Flash debugging from the
graphical user interface of the MPLAB Integrated
Development Environment. This enables a designer to
develop and debug source code by setting breakpoints,
single stepping and watching variables, and CPU
status and peripheral registers. Running at full speed
enables testing hardware and applications in real
time. MPLAB ICD 2 also serves as a development
programmer for selected PICmicro devices.
23.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modular, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PICmicro devices without a PC connection. It can also
set code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an SD/MMC card for
file storage and secure data applications.
The MPLAB ICE 4000 is a premium emulator system,
providing the features of MPLAB ICE 2000, but with
increased emulation memory and high-speed performance for dsPIC30F and PIC18XXXX devices. Its
advanced emulator features include complex triggering
and timing, and up to 2 Mb of emulation memory.
The MPLAB ICE 4000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft Windows 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
© 2006 Microchip Technology Inc.
DS70150B-page 173
dsPIC30F6010A/6015
23.11 PICSTART Plus Development
Programmer
23.13 Demonstration, Development and
Evaluation Boards
The PICSTART Plus Development Programmer is an
easy-to-use, low-cost, prototype programmer. It
connects to the PC via a COM (RS-232) port. MPLAB
Integrated Development Environment software makes
using the programmer simple and efficient. The
PICSTART Plus Development Programmer supports
most PICmicro devices in DIP packages up to 40 pins.
Larger pin count devices, such as the PIC16C92X and
PIC17C76X, may be supported with an adapter socket.
The PICSTART Plus Development Programmer is CE
compliant.
A wide variety of demonstration, development and
evaluation boards for various PICmicro MCUs and dsPIC
DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
23.12 PICkit 2 Development Programmer
The PICkit™ 2 Development Programmer is a low-cost
programmer with an easy-to-use interface for programming many of Microchip’s baseline, mid-range
and PIC18F families of Flash memory microcontrollers.
The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and
HI-TECH’s PICC™ Lite C compiler, and is designed to
help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to
program, evaluate and develop applications using
Microchip’s powerful, mid-range Flash memory family
of microcontrollers.
DS70150B-page 174
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart® battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Check the Microchip web page (www.microchip.com)
and the latest “Product Selector Guide” (DS00148) for
the complete list of demonstration, development and
evaluation kits.
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
24.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to the “dsPIC30F Family Reference Manual”
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings(†)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD and MCLR) (Note 1) ..................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V
Voltage on MCLR with respect to VSS........................................................................................................ 0V to +13.25V
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin (Note 2)................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD) .......................................................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ...................................................................................................±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports (Note 2)....................................................................................................200 mA
Note 1: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather
than pulling this pin directly to VSS.
2: Maximum allowable current is a function of device maximum power dissipation. See Table 24-6.
†NOTICE:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
© 2006 Microchip Technology Inc.
DS70150B-page 175
dsPIC30F6010A/6015
24.1
DC Characteristics
TABLE 24-1:
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6010A
VDD Range
(in Volts)
Max MIPS
Temp Range
(in °C)
dsPIC30F6010A-30I
4.5-5.5
-40 to +85
30
—
4.5-5.5
-40 to +125
—
20
3.0-3.6
-40 to +85
20
—
3.0-3.6
-40 to +125
—
15
2.5-3.0
-40 to +85
10
—
TABLE 24-2:
dsPIC30F6010A-20E
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6015
VDD Range
(in Volts)
Max MIPS
Temp Range
(in °C)
dsPIC30F6015-30I
4.5-5.5
-40 to +85
30
—
4.5-5.5
-40 to +125
—
20
3.0-3.6
-40 to +85
20
—
3.0-3.6
-40 to +125
—
15
2.5-3.0
-40 to +85
10
—
TABLE 24-3:
dsPIC30F6015-20E
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Operating Junction Temperature Range
TJ
Operating Ambient Temperature Range
Typ
Max
Unit
-40
+125
°C
TA
-40
+85
°C
Operating Junction Temperature Range
TJ
-40
+150
°C
Operating Ambient Temperature Range
TA
-40
+125
°C
dsPIC30F6010A-30I/dsPIC30F6015-30I
dsPIC30F6010A-20E/dsPIC30F6015-20E
Power Dissipation:
Internal chip power dissipation:
P INT = V D D × ( I D D – ∑ I O H)
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/θJA
W
I/O Pin Power Dissipation:
P I/O = ∑ ( { V D D – V O H } × I OH ) + ∑ ( V O L × I O L )
Maximum Allowed Power Dissipation
TABLE 24-4:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
Note 1:
Symbol
θJA
θJA
θJA
Typ
Max
Unit
Notes
36
°C/W
1
39
°C/W
1
39
°C/W
1
Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.
DS70150B-page 176
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-5:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ(1)
Max
Units
Conditions
Operating Voltage(2)
DC10
VDD
Supply Voltage
2.5
—
5.5
V
Industrial temperature
DC11
VDD
Supply Voltage
3.0
—
5.5
V
Extended temperature
DC12
VDR
RAM Data Retention Voltage(3)
1.5
—
—
V
DC16
VPOR
VDD Start Voltage
to ensure internal
Power-on Reset signal
—
VSS
—
V
DC17
SVDD
VDD Rise Rate
to ensure internal
Power-on Reset signal
0.05
—
—
Note 1:
2:
3:
V/ms 0-5V in 0.1 sec
0-3V in 60 ms
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which VDD can be lowered without losing RAM data.
© 2006 Microchip Technology Inc.
DS70150B-page 177
dsPIC30F6010A/6015
TABLE 24-6:
DC CHARACTERISTICS: OPERATING CURRENT (IDD)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
Operating Current (IDD)(2)
DC31a
9.5
15
mA
25°C
DC31b
DC31c
9.5
9.4
15
15
mA
mA
85°C
125°C
DC31e
DC31f
18
17
27
27
mA
mA
25°C
85°C
DC31g
DC30a
17
15
27
23
mA
mA
125°C
25°C
DC30b
DC30c
15
14
23
23
mA
mA
85°C
125°C
DC30e
DC30f
30
29
45
45
mA
mA
25°C
85°C
DC30g
DC23a
27
40
45
50
mA
mA
125°C
25°C
DC23b
DC23c
40
36
50
50
mA
mA
85°C
125°C
DC23e
DC23f
44
43
64
64
mA
mA
25°C
85°C
DC23g
DC24a
43
50
64
75
mA
mA
125°C
25°C
DC24b
DC24c
51
51
75
75
mA
mA
85°C
125°C
DC24e
DC24f
85
84
125
125
mA
mA
25°C
85°C
DC24g
DC27a
84
89
125
115
mA
mA
125°C
25°C
DC27b
DC27d
89
147
115
185
mA
mA
85°C
25°C
DC27e
DC27f
146
145
185
185
mA
mA
85°C
125°C
DC29a
DC29b
206
205
255
255
mA
mA
25°C
85°C
Note 1:
2:
Conditions
3.3V
0.128 MIPS
LPRC (512 kHz)
5V
3.3V
(1.8 MIPS)
FRC (7.37 MHz)
5V
3.3V
4 MIPS
5V
3.3V
10 MIPS
5V
3.3V
20 MIPS
5V
5V
30 MIPS
Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail-to-rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are operational. No peripheral modules are operating.
DS70150B-page 178
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-7:
DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1,2)
Max
Units
Operating Current (IDD)(3)
DC51a
9.0
14
mA
25°C
DC51b
DC51c
9.0
9.0
14
14
mA
mA
85°C
125°C
DC51e
DC51f
17
16
26
26
mA
mA
25°C
85°C
DC51g
DC50a
16
11
26
18
mA
mA
125°C
25°C
DC50b
DC50c
12
11
18
18
mA
mA
85°C
125°C
DC50e
DC50f
25
24
38
38
mA
mA
25°C
85°C
DC50g
DC43a
23
19
38
30
mA
mA
125°C
25°C
DC43b
DC43c
20
20
30
30
mA
mA
85°C
125°C
DC43e
DC43f
34
33
51
51
mA
mA
25°C
85°C
DC43g
DC44a
33
34
51
53
mA
mA
125°C
25°C
DC44b
DC44c
35
35
53
53
mA
mA
85°C
125°C
DC44e
DC44f
59
59
89
89
mA
mA
25°C
85°C
DC44g
DC47a
59
59
89
70
mA
mA
125°C
25°C
DC47b
DC47d
60
99
70
115
mA
mA
85°C
25°C
DC47e
DC47f
99
100
115
115
mA
mA
85°C
125°C
DC49a
DC49b
138
139
155
155
mA
mA
25°C
85°C
Note 1:
2:
3:
Conditions
3.3V
0.128 MIPS
LPRC (512 kHz)
5V
3.3V
(1.8 MIPS)
FRC (7.37 MHz)
5V
3.3V
4 MIPS
5V
3.3V
10 MIPS
5V
3.3V
20 MIPS
5V
5V
30 MIPS
Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
Base IIDLE current is measured with Core off, Clock on and all modules turned off.
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail-to-rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are operational. No peripheral modules are operating.
© 2006 Microchip Technology Inc.
DS70150B-page 179
dsPIC30F6010A/6015
TABLE 24-8:
DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Parameter
No.
Typical(1)
Max
Units
—
μA
Conditions
Power-Down Current (IPD)(2)
DC60a
0.2
25°C
DC60b
1.2
40
μA
85°C
DC60c
12
65
μA
125°C
DC60e
0.4
—
μA
25°C
DC60f
1.7
55
μA
85°C
DC60g
15
90
μA
125°C
DC61a
9
15
μA
25°C
DC61b
9
15
μA
85°C
DC61c
9
15
μA
125°C
DC61e
18
30
μA
25°C
DC61f
17
30
μA
85°C
DC61g
16
30
μA
125°C
DC62a
4
10
μA
25°C
DC62b
5
10
μA
85°C
DC62c
4
10
μA
125°C
DC62e
4
15
μA
25°C
DC62f
6
15
μA
85°C
DC62g
5
15
μA
125°C
DC63a
29
52
μA
25°C
DC63b
32
52
μA
85°C
DC63c
33
52
μA
125°C
DC63e
34
60
μA
25°C
DC63f
39
60
μA
85°C
38
60
μA
125°C
DC63g
Note 1:
2:
3:
3.3V
Base Power-Down Current(3)
5V
3.3V
Watchdog Timer Current: ΔIWDT(3)
5V
3.3V
Timer1 w/32 kHz Crystal: ΔITI32(3)
5V
3.3V
BOR On: ΔIBOR(3)
5V
Data in the “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled high. BOR, WDT, etc. are all switched off.
The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
DS70150B-page 180
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-9:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Min
Typ(1)
Max
Units
I/O pins:
with Schmitt Trigger buffer
VSS
—
0.2 VDD
V
DI15
MCLR
VSS
—
0.2 VDD
V
DI16
OSC1 (in XT, HS and LP modes)
VSS
—
0.2 VDD
V
VIL
DI10
Characteristic
Conditions
Input Low Voltage(2)
mode)(3)
DI17
OSC1 (in RC
VSS
—
0.3 VDD
V
DI18
SDA, SCL
VSS
—
0.3 VDD
V
SMBus disabled
SDA, SCL
VSS
—
0.2 VDD
V
SMBus enabled
I/O pins:
with Schmitt Trigger buffer
0.8 VDD
—
VDD
V
DI25
MCLR
0.8 VDD
—
VDD
V
DI26
OSC1 (in XT, HS and LP modes) 0.7 VDD
—
VDD
V
DI27
(3)
OSC1 (in RC mode)
0.9 VDD
—
VDD
V
DI28
SDA, SCL
0.7 VDD
—
VDD
V
SMBus disabled
SDA, SCL
0.8 VDD
—
VDD
V
SMBus enabled
50
250
400
μA
VDD = 5V, VPIN = VSS
DI19
VIH
DI20
DI29
Input High
Voltage(2)
ICNPU
CNXX Pull-up Current(2)
IIL
Input Leakage Current(2)(4)(5)
DI30
DI50
I/O ports
—
0.01
±1
μA
VSS ≤ VPIN ≤ VDD,
Pin at high-impedance
DI51
Analog Input Pins
—
0.50
—
μA
VSS ≤ VPIN ≤ VDD,
Pin at high-impedance
DI55
MCLR
—
0.05
±5
μA
VSS ≤ VPIN ≤ VDD
DI56
OSC1
—
0.05
±5
μA
VSS ≤ VPIN ≤ VDD, XT, HS
and LP Osc mode
Note 1:
2:
3:
4:
5:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that
the dsPIC30F device be driven with an external clock while in RC mode.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
© 2006 Microchip Technology Inc.
DS70150B-page 181
dsPIC30F6010A/6015
TABLE 24-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
VOL
Characteristic
Min
Typ(1)
Max
Units
—
0.6
V
Conditions
Output Low Voltage(2)
DO10
I/O ports
—
—
—
TBD
V
IOL = 2.0 mA, VDD = 3V
DO16
OSC2/CLKO
—
—
0.6
V
IOL = 1.6 mA, VDD = 5V
(RC or EC Osc mode)
—
—
TBD
V
IOL = 2.0 mA, VDD = 3V
VDD – 0.7
—
—
V
IOH = -3.0 mA, VDD = 5V
TBD
—
—
V
IOH = -2.0 mA, VDD = 3V
VDD – 0.7
—
—
V
IOH = -1.3 mA, VDD = 5V
TBD
—
—
V
IOH = -2.0 mA, VDD = 3V
15
pF
In XTL, XT, HS and LP modes
when external clock is used to
drive OSC1.
VOH
DO20
Output High Voltage(2)
I/O ports
DO26
IOL = 8.5 mA, VDD = 5V
OSC2/CLKO
(RC or EC Osc mode)
Capacitive Loading Specs
on Output Pins(2)
DO50
COSC2
OSC2/SOSC2 pin
—
—
DO56
CIO
All I/O pins and OSC2
—
—
50
pF
RC or EC Osc mode
DO58
CB
SCL, SDA
—
—
400
pF
In I2C™ mode
Legend: TBD = To Be Determined
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
FIGURE 24-1:
BROWN-OUT RESET CHARACTERISTICS
VDD
BO10
(Device in Brown-out Reset)
BO15
(Device not in Brown-out Reset)
Reset (due to BOR)
Power-up Time-out
DS70150B-page 182
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-11: ELECTRICAL CHARACTERISTICS: BOR
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
No.
BO10
Symbol
VBOR
Min
Typ(1)
Max
Units
BORV = 11(3)
—
—
—
V
BORV = 10
2.6
—
2.71
V
BORV = 01
4.1
—
4.4
V
BORV = 00
4.58
—
4.73
V
—
5
—
mV
Characteristic
BOR Voltage(2) on
VDD transition
high-to-low
Conditions
Not in operating
range
BO15
VBHYS
Note 1:
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
‘11’ values not in usable operating range.
2:
3:
TABLE 24-12: DC CHARACTERISTICS: PROGRAM AND EEPROM
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
DC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min
Typ(1)
Max
Units
Conditions
Data EEPROM Memory(2)
-40°C ≤ TA ≤ +85°C
D120
ED
Byte Endurance
100K
1M
—
E/W
D121
VDRW
VDD for Read/Write
VMIN
—
5.5
V
D122
TDEW
Erase/Write Cycle Time
—
2
—
ms
D123
TRETD
Characteristic Retention
40
100
—
Year
Provided no other specifications
are violated
D124
IDEW
IDD During Programming
—
10
30
mA
Row Erase
-40°C ≤ TA ≤ +85°C
Using EECON to read/write
VMIN = Minimum operating
voltage
Program FLASH Memory(2)
D130
EP
Cell Endurance
10K
100K
—
E/W
D131
VPR
VDD for Read
VMIN
—
5.5
V
VMIN = Minimum operating
voltage
D132
VEB
VDD for Bulk Erase
4.5
—
5.5
V
D133
VPEW
VDD for Erase/Write
3.0
—
5.5
V
D134
TPEW
Erase/Write Cycle Time
—
2
—
ms
D135
TRETD
Characteristic Retention
40
100
—
Year
D136
TEB
ICSP™ Block Erase Time
—
4
—
ms
D137
IPEW
IDD During Programming
—
10
30
mA
Row Erase
D138
IEB
IDD During Programming
—
10
30
mA
Bulk Erase
Note 1:
2:
Provided no other specifications are violated
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
© 2006 Microchip Technology Inc.
DS70150B-page 183
dsPIC30F6010A/6015
24.2
AC Characteristics and Timing Parameters
The information contained in this section defines dsPIC30F AC characteristics and timing parameters.
TABLE 24-13: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Operating voltage VDD range as described in DC Spec Section 24.0.
AC CHARACTERISTICS
FIGURE 24-2:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 – for all pins except OSC2
Load Condition 2 – for OSC2
VDD/2
VSS
Legend:
RL = 464 Ω
CL = 50 pF for all pins except OSC2
5 pF for OSC2 output
CL
Pin
VSS
FIGURE 24-3:
CL
Pin
RL
EXTERNAL CLOCK TIMING
Q4
Q1
Q2
Q3
Q4
Q1
OSC1
OS20
OS30
OS25
OS30
OS31
OS31
CLKO
OS40
DS70150B-page 184
OS41
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-14: EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
OS10
Symb
ol
FOSC
Characteristic
External CLKN Frequency(2)
(External clocks allowed only
in EC mode)
Oscillator Frequency(2)
Min
Typ(1)
Max
Units
Conditions
DC
4
4
4
—
—
—
—
40
10
10
7.5(3)
MHz
MHz
MHz
MHz
EC
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
DC
0.4
4
4
4
4
10
10
10
10
12(4)
12(4)
12(4)
—
—
—
—
—
—
—
—
—
—
—
—
—
—
32.768
4
4
10
10
10
7.5(3)
25
20(4)
20(4)
15(3)
25
25
22.5(3)
—
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
kHz
RC
XTL
XT
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS
HS/2 with 4x PLL
HS/2 with 8x PLL
HS/2 with 16x PLL
HS/3 with 4x PLL
HS/3 with 8x PLL
HS/3 with 16x PLL
LP
OS20
TOSC
TOSC = 1/FOSC
—
—
—
—
See parameter OS10
for FOSC value
OS25
TCY
Instruction Cycle Time(2)(5)
33
—
DC
ns
See Table 24-16
(2)
OS30
TosL,
TosH
External Clock in (OSC1)
High or Low Time
.45 x TOSC
—
—
ns
EC
OS31
TosR,
TosF
External Clock(2) in (OSC1)
Rise or Fall Time
—
—
20
ns
EC
OS40
TckR
CLKO Rise Time(2)(6)
—
—
—
ns
See parameter DO31
—
—
—
ns
See parameter DO32
OS41
TckF
Note 1:
2:
3:
4:
5:
6:
CLKO Fall Time
(2)(6)
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
Limited by the PLL output frequency range.
Limited by the PLL input frequency range.
Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“Max.” cycle time limit is “DC” (no clock) for all devices.
Measurements are taken in EC or ERC modes. The CLKO signal is measured on the OSC2 pin. CLKO is
low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).
© 2006 Microchip Technology Inc.
DS70150B-page 185
dsPIC30F6010A/6015
TABLE 24-15: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Characteristic(1)
Symbol
Min
Typ(2)
Max
Units
Conditions
OS50
FPLLI
PLL Input Frequency Range(2)
4
4
4
4
4
4
5(3)
5(3)
5(3)
4
4
4
—
—
—
—
—
—
—
—
—
—
—
—
10
10
7.5(4)
10
10
7.5(4)
10
10
7.5(4)
8.33(3)
8.33(3)
7.5(4)
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS/2 with 4x PLL
HS/2 with 8x PLL
HS/2 with 16x PLL
HS/3 with 4x PLL
HS/3 with 8x PLL
HS/3 with 16x PLL
OS51
FSYS
On-Chip PLL Output(2)
16
—
120
MHz
EC, XT, HS/2, HS/3
modes with PLL
OS52
TLOC
PLL Start-up Time (Lock Time)
—
20
50
μs
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Limited by oscillator frequency range.
Limited by device operating frequency range.
TABLE 24-16: PLL JITTER
AC CHARACTERISTICS
Param
No.
Characteristic
Min
Typ(1)
Max
Units
x4 PLL
—
0.251
0.413
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0 to 3.6V
—
0.251
0.413
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0 to 3.6V
—
0.256
0.47
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5 to 5.5V
—
0.256
0.47
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5 to 5.5V
—
0.355
0.584
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0 to 3.6V
—
0.355
0.584
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0 to 3.6V
—
0.362
0.664
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5 to 5.5V
—
0.362
0.664
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5 to 5.5V
—
0.67
0.92
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0 to 3.6V
—
0.632
0.956
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5 to 5.5V
—
0.632
0.956
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5 to 5.5V
OS61
x8 PLL
x16 PLL
Note 1:
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Conditions
These parameters are characterized but not tested in manufacturing.
DS70150B-page 186
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-17: INTERNAL CLOCK TIMING EXAMPLES
Clock
Oscillator
Mode
FOSC
(MHz)(1)
TCY (μsec)(2)
MIPS(3)
w/o PLL
EC
0.200
20.0
0.05
—
—
—
4
1.0
1.0
4.0
8.0
16.0
XT
Note 1:
2:
3:
MIPS(3)
w/PLL x4
MIPS(3)
w/PLL x8
MIPS(3)
w/PLL x16
10
0.4
2.5
10.0
20.0
—
25
0.16
6.25
—
—
—
4
1.0
1.0
4.0
8.0
16.0
10
0.4
2.5
10.0
20.0
—
Assumption: Oscillator Postscaler is divide by 1.
Instruction Execution Cycle Time: TCY = 1/MIPS.
Instruction Execution Frequency: MIPS = (FOSC * PLLx)/4 [since there are 4 Q clocks per instruction
cycle].
© 2006 Microchip Technology Inc.
DS70150B-page 187
dsPIC30F6010A/6015
TABLE 24-18: AC CHARACTERISTICS: INTERNAL FRC JITTER, ACCURACY AND DRIFT(2)
AC CHARACTERISTICS
Param
No.
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Characteristic
Min
Typ
Max
Units
Conditions
Internal FRC Jitter @ FRC Freq. = 7.37 MHz(1)
OS62
FRC
FRC with 4x PLL
FRC with 8x PLL
FRC with 16x PLL
—
+0.04
+0.16
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-3.6V
—
+0.07
+0.23
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5-5.5V
—
+0.31
+0.62
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-3.6V
—
+0.34
+0.77
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5-5.5V
—
+0.44
+0.87
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-3.6V
—
+0.48
+1.08
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5-5.5V
—
+0.71
+1.23
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5-5.5V
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0-5.5V
MHz(1)
Internal FRC Accuracy @ FRC Freq. = 7.37
OS63
FRC
—
—
Internal FRC Drift @ FRC Freq. = 7.37 MHz
OS64
Note 1:
2:
+0.4
(1)
-0.7
—
0.5
%
-40°C ≤ TA ≤ +85°C
VDD = 3.0-3.6V
-0.7
—
0.7
%
-40°C ≤ TA ≤ +125°C
VDD = 3.0-3.6V
-0.7
—
0.5
%
-40°C ≤ TA ≤ +85°C
VDD = 4.5-5.5V
-0.7
—
0.7
%
-40°C ≤ TA ≤ +125°C
VDD = 4.5-5.5V
Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift.
Overall FRC variation can be calculated by adding the absolute values of jitter, accuracy and drift
percentages.
TABLE 24-19: INTERNAL LPRC ACCURACY
AC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ
Max
Units
Conditions
-35
—
+35
%
—
LPRC @ Freq. = 512 kHz(1)
OS65
Note 1:
Change of LPRC frequency as VDD changes.
DS70150B-page 188
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-4:
CLKOUT AND I/O TIMING CHARACTERISTICS
I/O Pin
(Input)
DI35
DI40
I/O Pin
(Output)
New Value
Old Value
DO31
DO32
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-20: CLKOUT AND I/O TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Characteristic(1)(2)(3)
Symbol
Min
Typ(4)
Max
Units
Conditions
DO31
TIOR
Port output rise time
—
7
20
ns
—
DO32
TIOF
Port output fall time
—
7
20
ns
—
DI35
TINP
INTx pin high or low time (output)
20
—
—
ns
—
DI40
TRBP
CNx high or low time (input)
2 TCY
—
—
—
—
Note 1:
2:
3:
4:
These parameters are asynchronous events not related to any internal clock edges.
Measurements are taken in RC mode and EC mode where CLKO output is 4 x TOSC.
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
© 2006 Microchip Technology Inc.
DS70150B-page 189
dsPIC30F6010A/6015
FIGURE 24-5:
VDD
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS
SY12
MCLR
SY10
Internal
POR
SY11
PWRT
Time-out
OSC
Time-out
SY30
Internal
Reset
Watchdog
Timer
Reset
SY13
SY20
SY13
I/O Pins
SY35
FSCM
Delay
Note: Refer to Figure 24-2 for load conditions.
DS70150B-page 190
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SY10
TmcL
MCLR Pulse Width (low)
2
—
—
μs
-40°C to +85°C
SY11
TPWRT
Power-up Timer Period
3
12
50
4
16
64
6
22
90
ms
-40°C to +85°C
User programmable
SY12
TPOR
Power-on Reset Delay(4)
3
10
30
μs
-40°C to +85°C
SY13
TIOZ
I/O High-impedance from MCLR
Low or Watchdog Timer Reset
—
0.8
1.0
μs
SY20
TWDT1
Watchdog Timer Time-out Period
(No Prescaler)
1.4
2.1
2.8
ms
TWDT2
VDD = 5V, -40°C to +85°C
1.4
2.1
2.8
ms
VDD = 3V, -40°C to +85°C
SY25
TBOR
Brown-out Reset Pulse Width(3)
100
—
—
μs
VDD ≤ VBOR (D034)
SY30
TOST
Oscillator Start-up Timer Period
—
1024 TOSC
—
—
TOSC = OSC1 period
SY35
TFSCM
Fail-Safe Clock Monitor Delay
—
500
900
μs
-40°C to +85°C
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
Refer to Figure 24-1 and Table for BOR
Characterized by design but not tested.
FIGURE 24-6:
BAND GAP START-UP TIME CHARACTERISTICS
VBGAP
0V
Enable Band Gap
(see Note)
Band Gap
Stable
SY40
Note: Set FBORPOR<7>.
TABLE 24-22: BAND GAP START-UP TIME REQUIREMENTS
AC CHARACTERISTICS
Param
No.
SY40
Note 1:
Symbol
TBGAP
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Characteristic(1)
Min
Typ
Max
Units
Conditions
Band Gap Start-up Time
—
40
65
μs
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable
(RCON<13>Status bit).
These parameters are characterized but not tested in manufacturing.
© 2006 Microchip Technology Inc.
DS70150B-page 191
dsPIC30F6010A/6015
FIGURE 24-7:
TIMER1, 2, 3, 4 AND 5 EXTERNAL CLOCK TIMING CHARACTERISTICS
TxCK
Tx11
Tx10
Tx15
Tx20
OS60
TMRX
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-23: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
TA10
TA11
Symbol
TTXH
TTXL
Characteristic
TxCK High Time
TxCK Low Time
Min
Typ
Max
Units
Conditions
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Must also meet
parameter TA15
Synchronous,
with prescaler
10
—
—
ns
Asynchronous
10
—
—
ns
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
Asynchronous
TA15
TTXP
10
—
—
ns
TCY + 10
—
—
ns
Synchronous,
with prescaler
Greater of:
20 ns or
(TCY + 40)/N
—
—
—
Asynchronous
20
—
—
ns
DC
—
50
kHz
1.5
TCY
—
TxCK Input Period Synchronous,
no prescaler
OS60
Ft1
TA20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
Note:
SOSC1/T1CK oscillator input
frequency range (oscillator enabled
by setting bit TCS (T1CON, bit 1))
0.5 TCY
Must also meet
parameter TA15
N = prescale
value
(1, 8, 64, 256)
Timer1 is a Type A.
DS70150B-page 192
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-24: TIMER2 AND TIMER4 EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
TB10
TB11
TB15
Symbol
TtxH
TtxL
TtxP
Characteristic
TxCK High Time
TxCK Low Time
Min
Typ
Max
Units
Conditions
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Must also meet
parameter TB15
Synchronous,
with prescaler
10
—
—
ns
Synchronous,
no prescaler
0.5 TCY + 20
—
—
ns
Synchronous,
with prescaler
10
—
—
ns
TCY + 10
—
—
ns
—
1.5 TCY
—
TxCK Input Period Synchronous,
no prescaler
Synchronous,
with prescaler
TB20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
Greater of:
20 ns or
(TCY + 40)/N
0.5 TCY
Must also meet
parameter TB15
N = prescale
value
(1, 8, 64, 256)
TABLE 24-25: TIMER3 AND TIMER5 EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
TC10
TtxH
TxCK High Time
Synchronous
0.5 TCY + 20
—
—
ns
Must also meet
parameter TC15
TC11
TtxL
TxCK Low Time
Synchronous
0.5 TCY + 20
—
—
ns
Must also meet
parameter TC15
TC15
TtxP
TxCK Input Period Synchronous,
no prescaler
TCY + 10
—
—
ns
N = prescale
value
(1, 8, 64, 256)
—
1.5
TCY
—
Synchronous,
with prescaler
TC20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
© 2006 Microchip Technology Inc.
Greater of:
20 ns or
(TCY + 40)/N
0.5 TCY
DS70150B-page 193
dsPIC30F6010A/6015
FIGURE 24-8:
TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS
QEB
TQ11
TQ10
TQ15
TQ20
POSCNT
TABLE 24-26: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ
Max
Units
Conditions
TQ10
TtQH
TQCK High Time
Synchronous,
with prescaler
TCY + 20
—
ns
Must also meet
parameter TQ15
TQ11
TtQL
TQCK Low Time
Synchronous,
with prescaler
TCY + 20
—
ns
Must also meet
parameter TQ15
TQ15
TtQP
TQCP Input
Period
Synchronous, 2 * TCY + 40
with prescaler
—
ns
—
TQ20
TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
1.5
TCY
—
—
Note 1:
0.5 TCY
These parameters are characterized but not tested in manufacturing.
DS70150B-page 194
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-9:
INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS
ICX
IC10
IC11
IC15
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-27: INPUT CAPTURE TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
IC10
TccL
Characteristic(1)
ICx Input Low Time
No Prescaler
Min
Max
Units
0.5 TCY + 20
—
ns
10
—
ns
0.5 TCY + 20
—
ns
10
—
ns
(2 TCY + 40)/N
—
ns
With Prescaler
IC11
TccH
ICx Input High Time
No Prescaler
With Prescaler
IC15
Note 1:
TccP
ICx Input Period
Conditions
N = prescale
value (1, 4, 16)
These parameters are characterized but not tested in manufacturing.
FIGURE 24-10:
OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
OCx
(Output Compare
or PWM Mode)
OC10
OC11
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-28: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic(1)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Min
Typ(2)
Max
Units
Conditions
OC10
TccF
OCx Output Fall Time
—
—
—
ns
See parameter DO32
OC11
TccR
OCx Output Rise Time
—
—
—
ns
See parameter DO31
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
© 2006 Microchip Technology Inc.
DS70150B-page 195
dsPIC30F6010A/6015
FIGURE 24-11:
OC/PWM MODULE TIMING CHARACTERISTICS
OC20
OCFA/OCFB
OC15
OCx
TABLE 24-29: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
OC15
TFD
Fault Input to PWM I/O
Change
—
—
50
ns
—
OC20
TFLT
Fault Input Pulse Width
50
—
—
ns
—
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
DS70150B-page 196
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-12:
MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS
MP30
FLTA/B
MP20
PWMx
FIGURE 24-13:
MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS
MP11 MP10
PWMx
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-30: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
—
ns
See parameter DO32
Conditions
MP10
TFPWM
PWM Output Fall Time
—
—
MP11
TRPWM
PWM Output Rise Time
—
—
—
ns
See parameter DO31
TFD
Fault Input ↓ to PWM
I/O Change
—
—
50
ns
—
TFH
Minimum Pulse Width
50
—
—
ns
—
MP20
MP30
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
© 2006 Microchip Technology Inc.
DS70150B-page 197
dsPIC30F6010A/6015
FIGURE 24-14:
QEA/QEB INPUT CHARACTERISTICS
TQ36
QEA
(input)
TQ30
TQ31
TQ35
QEB
(input)
TQ41
TQ40
TQ30
TQ31
TQ35
QEB
Internal
TABLE 24-31: QUADRATURE DECODER TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Typ(2)
Max
Units
Conditions
TQ30
TQUL
Quadrature Input Low Time
6 TCY
—
ns
—
TQ31
TQUH
Quadrature Input High Time
6 TCY
—
ns
—
TQ35
TQUIN
Quadrature Input Period
12 TCY
—
ns
—
TQ36
TQUP
Quadrature Phase Period
3 TCY
—
ns
—
TQ40
TQUFL
Filter Time to Recognize Low,
with Digital Filter
3 * N * TCY
—
ns
N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
TQ41
TQUFH
Filter Time to Recognize High,
with Digital Filter
3 * N * TCY
—
ns
N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
N = Index Channel Digital Filter Clock Divide Select Bits. Refer to the “Quadrature Encoder Interface
(QEI)” section in the “dsPIC30F Family Reference Manual” (DS70046).
DS70150B-page 198
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-15:
QEI MODULE INDEX PULSE TIMING CHARACTERISTICS
QEA
(input)
QEB
(input)
Ungated
Index
TQ50
TQ51
Index Internal
TQ55
Position
TABLE 24-32: QEI INDEX PULSE TIMING REQUIREMENTS
AC CHARACTERISTICS
Param
No.
Symbol
TQ50
TqIL
TQ51
TQ55
Note 1:
2:
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
Characteristic(1)
Min
Max
Units
Conditions
Filter Time to Recognize Low,
with Digital Filter
3 * N * TCY
—
ns
N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
TqiH
Filter Time to Recognize High,
with Digital Filter
3 * N * TCY
—
ns
N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
Tqidxr
Index Pulse Recognized to Position
Counter Reset (Ungated Index)
3 TCY
—
ns
—
These parameters are characterized but not tested in manufacturing.
Alignment of index pulses to QEA and QEB is shown for position counter reset timing only. Shown for
forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but
index pulse recognition occurs on falling edge.
© 2006 Microchip Technology Inc.
DS70150B-page 199
dsPIC30F6010A/6015
FIGURE 24-16:
SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
SCKx
(CKP = 0)
SP11
SP10
SP21
SP20
SP20
SP21
SCKx
(CKP = 1)
SP35
BIT14 - - - - - -1
MSb
SDOx
SP31
SDIx
LSb
SP30
MSb IN
LSb IN
BIT14 - - - -1
SP40 SP41
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-33: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
SP10
TscL
SCKX Output Low Time(3)
TCY/2
—
—
ns
—
SP11
TscH
SCKX Output High Time(3)
TCY/2
—
—
ns
—
—
—
—
ns
See parameter DO32
—
—
—
ns
See parameter DO31
Time(4)
SP20
TscF
SCKX Output Fall
SP21
TscR
SCKX Output Rise Time(4)
Time(4)
SP30
TdoF
SDOX Data Output Fall
—
—
—
ns
See parameter DO32
SP31
TdoR
SDOX Data Output Rise
Time(4)
—
—
—
ns
See parameter DO31
SP35
TscH2doV,
TscL2doV
SDOX Data Output Valid after
SCKX Edge
—
—
30
ns
—
SP40
TdiV2scH,
TdiV2scL
Setup Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
DS70150B-page 200
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-17:
SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS
SP36
SCKX
(CKP = 0)
SP11
SP10
SP21
SP20
SP20
SP21
SCKX
(CKP = 1)
SP35
SP40
SDIX
LSb
BIT14 - - - - - -1
MSb
SDOX
SP30,SP31
MSb IN
BIT14 - - - -1
LSb IN
SP41
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-34: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
SP10
Symbol
TscL
Characteristic(1)
SCKX output low time(3)
time(3)
Min
Typ(2)
Max
Units
Conditions
TCY/2
—
—
ns
—
SP11
TscH
SCKX output high
TCY/2
—
—
ns
—
SP20
TscF
SCKX output fall time(4)
—
—
—
ns
See parameter DO32
SP21
TscR
SCKX output rise time(4)
—
—
—
ns
See parameter DO31
SP30
TdoF
SDOX data output fall time(4)
—
—
—
ns
See parameter DO32
SP31
TdoR
—
—
—
ns
See parameter DO31
SP35
TscH2doV, SDOX data output valid after
TscL2doV SCKX edge
—
—
—
ns
—
SP36
TdoV2sc,
TdoV2scL
30
—
—
ns
—
SP40
TdiV2scH, Setup time of SDIX data input
TdiV2scL to SCKX edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
20
—
—
ns
—
Note 1:
2:
3:
4:
SDOX data output rise
time(4)
SDOX data output setup to
first SCKX edge
Hold time of SDIX data input
to SCKX edge
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
© 2006 Microchip Technology Inc.
DS70150B-page 201
dsPIC30F6010A/6015
FIGURE 24-18:
SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SSX
SP52
SP50
SCKX
(CKP = 0)
SP71
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
MSb
SDOX
LSb
BIT14 - - - - - -1
SP51
SP30,SP31
SDIX
MSb IN
BIT14 - - - -1
LSb IN
SP41
Note: Refer to Figure 24-2 for load conditions.
SP40
TABLE 24-35: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
—
—
ns
—
SP70
TscL
SCKX Input Low Time
30
SP71
TscH
SCKX Input High Time
30
—
—
ns
—
SP72
TscF
SCKX Input Fall Time(3)
—
10
25
ns
—
Time(3)
SP73
TscR
SCKX Input Rise
—
10
25
ns
—
SP30
TdoF
SDOX Data Output Fall Time(3)
—
—
—
ns
See parameter DO32
SP31
TdoR
SDOX Data Output Rise Time(3)
—
—
—
ns
See parameter DO31
SP35
TscH2doV, SDOX Data Output Valid after
TscL2doV SCKX Edge
—
—
30
ns
—
SP40
TdiV2scH, Setup Time of SDIX Data Input
TdiV2scL to SCKX Edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
20
—
—
ns
—
SP50
TssL2scH, SSX↓ to SCKX↑ or SCKX↓ Input
TssL2scL
120
—
—
ns
—
SP51
TssH2doZ
10
—
50
ns
—
SP52
TscH2ssH SSX after SCK Edge
TscL2ssH
1.5 TCY +40
—
—
ns
—
Note 1:
2:
3:
Hold Time of SDIX Data Input
to SCKX Edge
SSX↑ to SDOX Output
High-impedance(3)
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Assumes 50 pF load on all SPI pins.
DS70150B-page 202
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-19:
SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SP60
SSX
SP52
SP50
SCKX
(CKP = 0)
SP71
SP70
SP73
SP72
SP72
SP73
SCKX
(CKP = 1)
SP35
SP52
MSb
SDOX
BIT14 - - - - - -1
LSb
SP30,SP31
SDIX
MSb IN
SP51
BIT14 - - - -1
LSb IN
SP41
SP40
Note: Refer to Figure 24-2 for load conditions.
TABLE 24-36: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
Min
Typ(2)
Max
Units
Conditions
—
—
ns
—
SP70
TscL
SCKX Input Low Time
30
SP71
TscH
SCKX Input High Time
30
—
—
ns
—
SP72
TscF
SCKX Input Fall Time(3)
—
10
25
ns
—
Time(3)
SP73
TscR
SCKX Input Rise
—
10
25
ns
—
SP30
TdoF
SDOX Data Output Fall Time(3)
—
—
—
ns
See parameter DO32
SP31
TdoR
SDOX Data Output Rise Time(3)
—
—
—
ns
See parameter DO31
SP35
TscH2doV, SDOX Data Output Valid after
TscL2doV SCKX Edge
—
—
30
ns
—
SP40
TdiV2scH, Setup Time of SDIX Data Input
TdiV2scL to SCKX Edge
20
—
—
ns
—
SP41
TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge
20
—
—
ns
—
SP50
TssL2scH,
TssL2scL
SSX↓ to SCKX↓ or SCKX↑ input
120
—
—
ns
—
Note 1:
2:
3:
4:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
© 2006 Microchip Technology Inc.
DS70150B-page 203
dsPIC30F6010A/6015
TABLE 24-36: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS (CONTINUED)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic(1)
SP51
TssH2doZ
SS↑ to SDOX Output
High-impedance(4)
SP52
TscH2ssH
TscL2ssH
SSX↑ after SCKX Edge
SP60
TssL2doV
SDOX Data Output Valid after
SSX Edge
Note 1:
2:
3:
4:
Min
Typ(2)
Max
Units
Conditions
10
—
50
ns
—
1.5 TCY +
40
—
—
ns
—
—
—
50
ns
—
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPI pins.
DS70150B-page 204
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-20:
I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
SCL
IM31
IM34
IM30
IM33
SDA
Stop
Condition
Start
Condition
Note: Refer to Figure 24-2 for load conditions.
FIGURE 24-21:
I2C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
IM20
IM21
IM11
IM10
SCL
IM11
IM26
IM10
IM25
IM33
SDA
In
IM40
IM40
IM45
SDA
Out
Note: Refer to Figure 24-2 for load conditions.
© 2006 Microchip Technology Inc.
DS70150B-page 205
dsPIC30F6010A/6015
TABLE 24-37: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
IM10
Min(1)
Max
Units
Conditions
TLO:SCL Clock Low Time 100 kHz mode
TCY/2 (BRG + 1)
—
μs
—
400 kHz mode
TCY/2 (BRG + 1)
—
μs
—
(2)
TCY/2 (BRG + 1)
—
μs
—
Clock High Time 100 kHz mode
TCY/2 (BRG + 1)
—
μs
—
400 kHz mode
TCY/2 (BRG + 1)
—
μs
—
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
—
100 kHz mode
—
300
ns
400 kHz mode
20 + 0.1 CB
300
ns
Characteristic
1 MHz mode
IM11
IM20
IM21
IM25
IM26
IM30
IM31
IM33
IM34
THI:SCL
TF:SCL
TR:SCL
SDA and SCL
Fall Time
SDA and SCL
Rise Time
TSU:DAT Data Input
Setup Time
THD:DAT Data Input
Hold Time
TSU:STA
Start Condition
Setup Time
THD:STA Start Condition
Hold Time
TSU:STO Stop Condition
Setup Time
THD:STO Stop Condition
Hold Time
IM40
TAA:SCL
Output Valid
From Clock
1 MHz mode(2)
—
100
ns
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1 CB
300
ns
1 MHz mode(2)
—
300
ns
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
1 MHz mode(2)
TBD
—
ns
100 kHz mode
0
—
ns
400 kHz mode
0
0.9
μs
1 MHz mode(2)
TBD
—
ns
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
IM50
TBF:SDA Bus Free Time
CB
CB is specified to be
from 10 to 400 pF
—
—
Only relevant for
Repeated Start
condition
After this period the
first clock pulse is
generated
100 kHz mode
TCY/2 (BRG + 1)
—
μs
400 kHz mode
TCY/2 (BRG + 1)
—
μs
1 MHz mode(2)
TCY/2 (BRG + 1)
—
μs
100 kHz mode
TCY/2 (BRG + 1)
—
ns
400 kHz mode
TCY/2 (BRG + 1)
—
ns
1 MHz mode(2)
TCY/2 (BRG + 1)
—
ns
100 kHz mode
—
3500
ns
—
400 kHz mode
—
1000
ns
—
mode(2)
—
—
ns
—
100 kHz mode
4.7
—
μs
Time the bus must be
free before a new
transmission can start
1 MHz
IM45
CB is specified to be
from 10 to 400 pF
400 kHz mode
1.3
—
μs
1 MHz mode(2)
TBD
—
μs
—
400
pF
Bus Capacitive Loading
—
—
—
Legend: TBD = To Be Determined
Note 1: BRG is the value of the I2C Baud Rate Generator. Refer to the “Inter-Integrated Circuit (I2C™)” section
in the “dsPIC30F Family Reference Manual” (DS70046).
2: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
DS70150B-page 206
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-22:
I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
SCL
IS34
IS31
IS30
IS33
SDA
Stop
Condition
Start
Condition
FIGURE 24-23:
I2C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS20
IS21
IS11
IS10
SCL
IS30
IS26
IS31
IS25
IS33
SDA
In
IS40
IS40
IS45
SDA
Out
© 2006 Microchip Technology Inc.
DS70150B-page 207
dsPIC30F6010A/6015
TABLE 24-38: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
IS10
IS11
Symbol
TLO:SCL
THI:SCL
Characteristic
Clock Low Time
Clock High Time
IS20
TF:SCL
SDA and SCL
Fall Time
IS21
TR:SCL
SDA and SCL
Rise Time
IS25
TSU:DAT
Data Input
Setup Time
IS26
THD:DAT
Data Input
Hold Time
IS30
TSU:STA
Start Condition
Setup Time
IS31
THD:STA
Start Condition
Hold Time
IS33
TSU:STO
Stop Condition
Setup Time
IS34
THD:STO
Stop Condition
Hold Time
IS40
TAA:SCL
Output Valid
From Clock
IS45
TBF:SDA
Bus Free Time
IS50
CB
Note 1:
Min
Max
Units
100 kHz mode
4.7
—
μs
400 kHz mode
1.3
—
μs
1 MHz mode(1)
100 kHz mode
0.5
4.0
—
—
µs
µs
400 kHz mode
0.6
—
µs
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
100 kHz mode
400 kHz mode
1 MHz mode(1)
0.5
—
20 + 0.1 CB
—
—
20 + 0.1 CB
—
250
100
100
0
0
0
4.7
0.6
0.25
4.0
0.6
0.25
4.7
0.6
0.6
4000
600
250
0
0
0
4.7
1.3
0.5
—
—
300
300
100
1000
300
300
—
—
—
—
0.9
0.3
—
—
—
—
—
—
—
—
—
—
—
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
ns
ns
ns
ns
ns
ns
μs
μs
μs
pF
3500
1000
350
—
—
—
400
Bus Capacitive
Loading
Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
DS70150B-page 208
Conditions
Device must operate at a
minimum of 1.5 MHz
Device must operate at a
minimum of 10 MHz
—
Device must operate at a
minimum of 1.5 MHz
Device must operate at a
minimum of 10 MHz
—
CB is specified to be from
10 to 400 pF
CB is specified to be from
10 to 400 pF
—
—
Only relevant for Repeated
Start condition
After this period, the first
clock pulse is generated
—
—
—
Time the bus must be free
before a new transmission
can start
—
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-24:
CXTX Pin
(output)
CAN MODULE I/O TIMING CHARACTERISTICS
New Value
Old Value
CA10 CA11
CXRX Pin
(input)
CA20
TABLE 24-39: CAN MODULE I/O TIMING REQUIREMENTS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
CA10
Characteristic(1)
Symbol
TioF
Port Output Fall Time
Min
Typ(2)
Max
Units
Conditions
—
—
—
ns
See parameter DO32
—
—
ns
See parameter DO31
ns
—
CA11
TioR
Port Output Rise Time
—
CA20
Tcwf
Pulse Width to Trigger
CAN Wake-up Filter
500
Note 1:
2:
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
© 2006 Microchip Technology Inc.
DS70150B-page 209
dsPIC30F6010A/6015
TABLE 24-40: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS(1)
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
Device Supply
AD01
AVDD
Module VDD Supply
Greater of
VDD – 0.3
or 2.7
Lesser of
VDD + 0.3
or 5.5
V
—
AD02
AVSS
Module VSS Supply
Vss - 0.3
VSS + 0.3
V
—
AD05
VREFH
Reference Voltage High
AVss +
2.7
AVDD
V
—
AD06
VREFL
Reference Voltage Low
AVss
AVDD – 2.7
V
—
AD07
VREF
Absolute Reference Voltage AVss – 0.3
AD08
IREF
Current Drain
AD10
VINH-VINL Full-Scale Input Span
AD12
—
Leakage Current
—
AD13
—
Leakage Current
AD17
RIN
Recommended Impedance
of Analog Voltage Source
Reference Inputs
AVDD + 0.3
V
—
300
3
μA
μA
A/D operating
A/D off
VREFH
V
—
±0.001
±0.244
μA
VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
Source Impedance = 5 kΩ
—
±0.001
±0.244
μA
VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
Source Impedance = 5 kΩ
—
—
—
Ω
See Table 20-2
bits
—
—
200
.001
Analog Input
VREFL
DC Accuracy
AD20
Nr
Resolution
AD21
INL
Integral Nonlinearity(2)
—
±1
±1
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD21A INL
Integral Nonlinearity(2)
—
±1
±1
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD22
DNL
Differential Nonlinearity(2)
—
±1
±1
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD22A DNL
Differential Nonlinearity(2)
—
±1
±1
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD23
GERR
Gain Error(2)
+1
±5
±6
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD23A GERR
Gain Error(2)
+1
±5
±6
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
Note 1:
2:
3:
10 data bits
These parameters are characterized but not tested in manufacturing.
Measurements taken with external VREF+ and VREF- used as the ADC voltage references.
The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.
DS70150B-page 210
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
TABLE 24-40: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS(1) (CONTINUED)
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
No.
Symbol
Characteristic
Min.
Typ
Max.
Units
Conditions
EOFF
Offset Error(2)
±1
±2
±3
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD24A EOFF
Offset Error(2)
±1
±2
±3
LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD25
—
Monotonicity(3)
—
—
—
—
AD30
THD
Total Harmonic Distortion
—
-64
-67
dB
—
AD31
SINAD
Signal to Noise and
Distortion
—
57
58
dB
—
AD32
SFDR
Spurious Free Dynamic
Range
—
67
71
dB
—
AD33
FNYQ
Input Signal Bandwidth
—
—
500
kHz
—
AD34
ENOB
Effective Number of Bits
9.29
9.41
—
bits
—
AD24
Guaranteed
Dynamic Performance
Note 1:
2:
3:
These parameters are characterized but not tested in manufacturing.
Measurements taken with external VREF+ and VREF- used as the ADC voltage references.
The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.
© 2006 Microchip Technology Inc.
DS70150B-page 211
dsPIC30F6010A/6015
FIGURE 24-25:
10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS
(CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000)
AD50
ADCLK
Instruction
Execution SET SAMP
CLEAR SAMP
SAMP
ch0_dischrg
ch0_samp
ch1_dischrg
ch1_samp
eoc
AD61
AD60
AD55
TSAMP
AD55
DONE
ADIF
ADRES(0)
ADRES(1)
1
2
3
4
5
6
8
9
5
6
8
9
1 - Software sets ADCON. SAMP to start sampling.
2 - Sampling starts after discharge period TSAMP is described in Section 20.8 “A/D Acquisition Requirements”.
3 - Software clears ADCON. SAMP to start conversion.
4 - Sampling ends, conversion sequence starts.
5 - Convert bit 9.
6 - Convert bit 8.
8 - Convert bit 0.
9 - One TAD for end of conversion.
DS70150B-page 212
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
FIGURE 24-26:
10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS
(CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001)
AD50
ADCLK
Instruction
Execution SET ADON
SAMP
ch0_dischrg
ch0_samp
ch1_dischrg
ch1_samp
eoc
TSAMP
TSAMP
AD55
TCONV
AD55
DONE
ADIF
ADRES(0)
ADRES(1)
1
2
3
4
5
6
7
3
4
5
6
8
3
1 - Software sets ADCON. ADON to start AD operation.
5 - Convert bit 0.
2 - Sampling starts after discharge period.
TSAMP is described in the “dsPIC30F
Family Reference Manual” (DS70046), Section 17.
6 - One TAD for end of conversion.
3 - Convert bit 9.
8 - Sample for time specified by SAMC.
TSAMP is described in Section 20.8
“A/D Acquisition Requirements”.
4 - Convert bit 8.
© 2006 Microchip Technology Inc.
4
7 - Begin conversion of next channel.
DS70150B-page 213
dsPIC30F6010A/6015
TABLE 24-41: 10-BIT HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
-40°C ≤ TA ≤ +125°C for Extended
AC CHARACTERISTICS
Param
Symbol
No.
Characteristic
Min.
Typ(1)
Max.
Units
Conditions
Clock Parameters
AD50
TAD
A/D Clock Period
AD51
tRC
A/D Internal RC Oscillator Period
—
84
—
ns
700
900
1100
ns
See Table 20-2(2)
—
Conversion Rate
AD55
tCONV
Conversion Time
—
12 TAD
—
—
AD56
FCNV
Throughput Rate
—
1.0
—
Msps
See Table 20-2(2)
—
AD57
TSAMP
Sample Time
—
1 TAD
—
—
See Table 20-2(2)
Auto-Convert Trigger
(SSRC = 111) not
selected
Timing Parameters
AD60
tPCS
Conversion Start from Sample
Trigger(3)
AD61
tPSS
Sample Start from Setting
Sample (SAMP) Bit
AD62
tCSS
AD63
tDPU
Note 1:
2:
3:
—
1.0 TAD
—
—
0.5 TAD
—
1.5 TAD
—
—
Conversion Completion to
Sample Start (ASAM = 1)(3)
—
0.5 TAD
—
—
—
Time to Stabilize Analog Stage
from A/D Off to A/D On(3)
—
20
—
μs
—
These parameters are characterized but not tested in manufacturing.
Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
Characterized by design but not tested.
DS70150B-page 214
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
25.0
PACKAGING INFORMATION
25.1
Package Marking Information
64-Lead TQFP
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
80-Lead TQFP
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
dsPIC30F6015
-30I/PT e3
0512XXX
dsPIC30F6010
A-30I/PT e3
0512XXX
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2006 Microchip Technology Inc.
DS70150B-page 215
dsPIC30F6010A/6015
64-Lead Plastic Thin Quad Flatpack 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
#leads=n1
p
D1
D
2
1
B
n
CH x 45°
α
A
φ
c
L
β
A2
A1
F
Units
Dimension Limits
n
p
INCHES
NOM
64
.020
16
.043
.039
.006
.024
.039 REF.
3.5
.472
.472
.394
.394
.007
.009
.035
10
10
MAX
MILLIMETERS*
NOM
64
0.50
16
1.00
1.10
0.95
1.00
0.05
0.15
0.45
0.60
1.00 REF.
0
3.5
11.75
12.00
11.75
12.00
9.90
10.00
9.90
10.00
0.13
0.18
0.17
0.22
0.64
0.89
5
10
5
10
MAX
Number of Pins
Pitch
Pins per Side
n1
Overall Height
A
.039
.047
1.20
Molded Package Thickness
A2
.037
.041
1.05
Standoff
A1
.002
.010
0.25
Foot Length
L
.018
.030
0.75
Footprint
F
φ
Foot Angle
0
7
7
Overall Width
E
.463
.482
12.25
Overall Length
D
.463
.482
12.25
Molded Package Width
E1
.390
.398
10.10
Molded Package Length
D1
.390
.398
10.10
c
Lead Thickness
.005
.009
0.23
Lead Width
B
.007
.011
0.27
Pin 1 Corner Chamfer
CH
.025
.045
1.14
α
Mold Draft Angle Top
5
15
15
β
Mold Draft Angle Bottom
5
15
15
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MS-026
Revised 07-22-05
Drawing No. C04-085
DS70150B-page 216
MIN
MIN
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
80-Lead Plastic Thin Quad Flatpack 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
#leads=n1
p
D1
D
2
1
B
n
α
CH x 45°
A
c
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
n1
A
A2
A1
L
F
φ
E
D
E1
INCHES
NOM
80
.020 BSC
20
.039
.043
.037
.039
.002
.004
.018
.024
.039 REF.
0°
3.5°
.551 BSC
.551 BSC
.472 BSC
MIN
A2
A1
F
MAX
MILLIMETERS*
NOM
80
0.50 BSC
20
1.00
1.10
0.95
1.00
0.05
0.10
0.45
0.60
1.00 REF.
0°
3.5°
14.00 BSC
14.00 BSC
12.00 BSC
MIN
.047
.041
.006
.030
7°
MAX
1.20
1.05
0.15
0.75
7°
Molded Package Length
D1
.472 BSC
12.00 BSC
c
Lead Thickness
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.007
.009
.011
0.17
0.22
0.27
Pin 1 Corner Chamfer
CH
.025
.035
.045
0.64
0.89
1.14
α
5°
10°
15°
5°
10°
15°
Mold Draft Angle Top
β
5°
10°
15°
5°
10°
15°
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Revised 07-22-05
JEDEC Equivalent: MS-026
Drawing No. C04-092
© 2006 Microchip Technology Inc.
DS70150B-page 217
dsPIC30F6010A/6015
80-Lead Plastic Thin Quad Flatpack 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
#leads = n1
p
D1 D
B
2
1
n
α
c
φ
β
L
Units
Number of Pins
Pitch
Dimension Limits
n
p
Pins per Side
n1
Overall Height
A
A
A1
(F)
A2
MILLIMETERS*
INCHES
MIN
NOM
MIN
MAX
NOM
MAX
80
80
.026
0.65
20
20
.047
1.20
Molded Package Thickness
A2
.037
Standoff
A1
.002
Foot Length
L
.018
Footprint
Foot Angle
F
φ
Overall Width
E
.630 BSC
16.00 BSC
.039
.024
.041
0.95
.006
0.05
.030
0.45
3.5°
0.15
0.60
7°
0°
3.5°
Overall Length
D
.630 BSC
16.00 BSC
Molded Package Width
E1
.551 BSC
14.00 BSC
Molded Package Length
D1
c
.551 BSC
Lead Thickness
.004
1.05
0.75
1.00 REF.
.039 REF.
0°
1.00
7°
14.00 BSC
.008
0.09
0.20
.011
.013
.015
0.27
0.32
0.37
Mold Draft Angle Top
B
α
11°
12°
13°
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
11°
12°
13°
Lead Width
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MS-026
Revised 7-20-06
Drawing No. C04-116
DS70150B-page 218
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
APPENDIX A:
REVISION HISTORY
Revision A (July 2005)
Original data sheet for
dsPIC30F6015 devices.
dsPIC30F6010A
and
Revision B (September 2006)
This revision reflects updates in these areas:
• Data Ram protection feature enables segments of
RAM to be protected when used in conjunction
with Boot and Secure Code Segment Security
(see Section 3.2.7 “Data Ram Protection Feature”)
• BSRAM and SSRAM SFRs added to support
Data Ram Protection (see Table 3-3)
• Base Instruction CP1 removed (see Table 22-2)
• Supported I2C Slave addresses (see Table 17-2)
• Revised Electrical Characteristics:
- Operating current (IDD) specifications (see
Table 24-6)
- Idle current (IIDLE) specifications (see
Table 24-7)
- Power-down current (IPD) specifications (see
Table 24-8)
- I/O Pin input specifications (see Table 24-9)
- BOR voltage limits (see Table 24-11)
- Watchdog Timer time-out limits (see
Table 24-21)
• Added note to package drawings.
© 2006 Microchip Technology Inc.
DS70150B-page 219
dsPIC30F6010A/6015
NOTES:
DS70150B-page 220
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
APPENDIX B:
DEVICE
COMPARISONS
This appendix outlines the differences between the
dsPIC30F6010 and the dsPIC30F6010A. Differences
are highlighted in Table B-1.
TABLE B-1:
dsPIC30F6010 AND dsPIC30F6010A COMPARISON
Features
dsPIC30F6010
dsPIC30F6010A
Program Memory (Kbytes)
144
144
Data Memory (Bytes)
8192
8192
Data EEPROM (Bytes)
4096
4096
Timers (16-bits)
5
5
Input Capture Channels
8
8
Input Change Notification Channels
22
22
Output Compare/Standard PWM Channels
8
8
Motor Control PWM Channels
8
8
A/D 10-bit 500 ksps
16
16
Quadrature Encoder
Yes
Yes
UART
2
2
SPI
2
2
I2C™
1
1
CAN
PGC (ICSP™ Clock Input)
PGC (ICSP Data Input/Output)
Packages
I/O Pins (maximum)
© 2006 Microchip Technology Inc.
1
1
RB1/AN1
RB1/AN1
RB0/AN0
RB0/AN0
80-Pin TQFP (14x14x1 mm)
80-Pin TQFP (14x14x1 mm)
80-Pin TQFP (12x12x1 mm)
68
68
DS70150B-page 221
dsPIC30F6010A/6015
NOTES:
DS70150B-page 222
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
APPENDIX C:
MIGRATION FROM
dsPIC30F6010 TO
dsPIC30F6010A
The dsPIC30F6010A supersedes the dsPIC30F6010
device. The “A” version of the silicon is identical in
nearly all aspects compared to the dsPIC30F6010
device. Review the latest dsPIC30F6010A/6015
Silicon Errata documents posted on the Microchip web
site to see what is fixed from the dsPIC30F6010 Rev.
B2 Silicon Errata (DS80195B) document.
This appendix describes the differences between the
dsPIC30F6010 and dsPIC30F6010A devices.
C.1
Code Compatibility
For the most part, dsPIC30F code developed with the
MPLAB C30 C Compiler and MPLAB ASM30 Assembler is directly portable between the dsPIC30F6010
and dsPIC30F6010A devices. However, in some cases
small changes may be required depending on which
features have been enhanced. To migrate source code
to the dsPIC30F6010A device, perform these two
steps:
1.
2.
Include the appropriate dsPIC30F6010A device
header (.h) and include (.inc) files in the
source code files.
Remove any workarounds implemented in
source code or MPLAB C30 command-line
options
for errata
described
in
the
“dsPIC30F6010 Rev. B2 Silicon Errata”
(DS80195B) document.
Other changes are called out in this section. Read the
latest dsPIC30F6010A/6015 Silicon Errata documents
posted on the Microchip web site.
Another important change deals with the OSCCON
SFR. Bits have been added to both the COSC and
NOSC functional definitions. Use the dsPIC30F6010A
device header and include files to achieve code
portability with the OSCCON SFR.
Note:
C.3
Oscillator Operation
Several oscillator modes have been added to the
dsPIC30F6010A device:
• FRC with x4, x8 and x16 PLL mode
• HS/2 with x4, x8 and x16 PLL mode
• HS/3 with x4, x8 and x16 PLL mode
Device Configuration Registers
In support of the new oscillator modes, the FOSC
Configuration register has been modified. The
dsPIC30F6010A device header and include files
provide the updated bit field definitions and macros for
the device Configuration registers. Please refer to
these new macros when embedding specific device
configuration information in the C and Assembler
source files.
C.4
Electrical Characteristics
The dsPIC30F6010A device is rated at 30 MIPS @
4.5-5.5 VDC and 20 MIPS @ 3.0-3.6 VDC for the industrial temperature range. Even though compatible
devices are tested to the same electrical specifications,
the device characteristics may have changed due to
changes in the manufacturing process. These differences should not affect the systems that were
designed well within the device specifications. For systems that operate close to or outside the specification
limits, manufacturing differences may cause the device
to behave differently.
C.5
C.2
Oscillator operation should be verified to
ensure that it starts and performs as
expected. You may need to adjust the load
capacitor and/or the oscillator mode to
achieve the proper values.
Device Packages
The dsPIC30F6010A device is offered in the following
TQFP pages:
• 80-Pin TQFP 12x12x1mm (new designs)
• 80-Pin TQFP 14x14x1mm (migration support)
Refer to Section 25.0 “Packaging Information” for
details on these packages.
The new oscillator modes are presented in
Section 21.0 “System Integration”. In support of the
FRC, the OSCTUN Special Function Register (SFR)
has been added. This register includes four FRC tuning
bits (TUN<5:0>). There are no code or operational
compatibility issues to address for this new feature.
© 2006 Microchip Technology Inc.
DS70150B-page 223
dsPIC30F6010A/6015
NOTES:
DS70150B-page 224
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
INDEX
A
A/D
Aborting a Conversion ............................................. 138
Acquisition Requirements ........................................ 142
ADCHS .................................................................... 135
ADCON1 .................................................................. 135
ADCON2 .................................................................. 135
ADCON3 .................................................................. 135
ADCSSL ................................................................... 135
ADPCFG .................................................................. 135
Configuring Analog Port Pins ................................... 144
Connection Considerations ...................................... 144
Conversion Operation .............................................. 137
Conversion Rate Parameters ................................... 139
Conversion Speeds .................................................. 139
Effects of a Reset ..................................................... 143
Operation During CPU Idle Mode ............................ 143
Operation During CPU Sleep Mode ......................... 143
Output Formats ........................................................ 143
Power-Down Modes ................................................. 143
Programming the Start of Conversion Trigger ......... 138
Register Map ............................................................ 145
Result Buffer ............................................................ 137
Selecting the Conversion Clock ............................... 138
Selecting the Conversion Sequence ........................ 137
Voltage Reference Schematic ................................. 140
1 Msps Configuration Guideline ............................... 140
10-bit High-Speed Analog-to-Digital
Converter Module ............................................ 135
600 ksps Configuration Guideline ............................ 141
750 ksps Configuration Guideline ............................ 141
AC Characteristics ........................................................... 184
Internal FRC Jitter, Accuracy and Drift .................... 188
Internal LPRC Accuracy ........................................... 188
Load Conditions ....................................................... 184
Temperature and Voltage Specifications ................. 184
Address Generator Units ................................................... 33
Alternate Vector Table ....................................................... 43
Alternate 16-bit Timer/Counter ........................................... 89
Assembler
MPASM Assembler .................................................. 172
Automatic Clock Stretch ................................................... 110
During 10-bit Addressing (STREN = 1) .................... 110
During 7-bit Addressing (STREN = 1) ...................... 110
Receive Mode .......................................................... 110
Transmit Mode ......................................................... 110
B
Barrel Shifter ...................................................................... 20
Bit-Reversed Addressing ................................................... 36
Example ..................................................................... 36
Implementation .......................................................... 36
Modifier Values (table) ............................................... 37
Sequence Table (16-Entry) ........................................ 37
Block Diagrams
CAN Buffers and Protocol Engine ............................ 124
Dedicated Port Structure ............................................ 57
DSP Engine ............................................................... 17
dsPIC30F6010A ........................................................... 8
dsPIC30F6015 ............................................................. 9
External Power-on Reset Circuit .............................. 156
Input Capture Mode ................................................... 79
I2C ............................................................................ 108
© 2006 Microchip Technology Inc.
Oscillator System ..................................................... 149
Output Compare Mode .............................................. 83
PWM Module ............................................................. 94
Quadrature Encoder Interface ................................... 87
Reset System .......................................................... 153
Shared Port Structure ................................................ 58
SPI ........................................................................... 104
SPI Master/Slave Connection .................................. 104
UART Receiver ........................................................ 116
UART Transmitter .................................................... 115
10-bit High-Speed A/D Functional ........................... 136
16-bit Timer1 Module (Type A Timer) ........................ 64
16-bit Timer2 (Type B Timer) for dsPIC30F6010A .... 70
16-bit Timer2 (Type B Timer) for dsPIC30F6015 ...... 70
16-bit Timer3 (Type C Timer) .................................... 71
16-bit Timer4 (Type B Timer) .................................... 76
16-bit Timer5 (Type C Timer) .................................... 76
32-bit Timer2/3 for dsPIC30F6010A .......................... 68
32-bit Timer2/3 for dsPIC30F6015 ............................ 69
32-bit Timer4/5 .......................................................... 75
BOR. See Brown-out Reset.
Brown-out Reset (BOR) ................................................... 147
C
C Compilers
MPLAB C18 ............................................................. 172
MPLAB C30 ............................................................. 172
CAN
Baud Rate Setting ................................................... 128
Bit Timing ......................................................... 128
Phase Segments ............................................. 129
Prescaler ......................................................... 129
Propagation Segment ...................................... 129
Sample Point ................................................... 129
Synchronization ............................................... 129
CAN1 Register Map for dsPIC30F6010A/6015 ....... 130
CAN2 Register Map for dsPIC30F6010A ................ 132
Frame Types ........................................................... 123
Message Reception ................................................. 126
Acceptance Filter Masks ................................. 126
Acceptance Filters ........................................... 126
Receive Buffers ............................................... 126
Receive Errors ................................................. 126
Receive Interrupts ........................................... 126
Receive Overrun .............................................. 126
Message Transmission ............................................ 127
Aborting ........................................................... 127
Errors ............................................................... 127
Priority ............................................................. 127
Sequence ........................................................ 127
Transmit Buffers .............................................. 127
Transmit Interrupts .......................................... 128
Operation Modes ..................................................... 125
Disable ............................................................ 125
Error Recognition ............................................. 125
Initialization ...................................................... 125
Listen-Only ...................................................... 125
Loopback ......................................................... 125
Normal ............................................................. 125
Overview .................................................................. 123
CAN Module .................................................................... 123
Center-Aligned PWM ......................................................... 97
DS70150B-page 225
dsPIC30F6010A/6015
Code Examples
Data EEPROM Block Erase ....................................... 54
Data EEPROM Block Write ........................................ 56
Data EEPROM Read ................................................. 53
Data EEPROM Word Erase ....................................... 54
Data EEPROM Word Write ........................................ 55
Erasing a Row of Program Memory ........................... 49
Initiating a Programming Sequence ........................... 50
Loading Write Latches ............................................... 50
Port Write/Read Example .......................................... 58
Code Protection ............................................................... 147
Complementary PWM Operation ....................................... 98
Configuring Analog Port Pins ............................................. 58
Core Overview ................................................................... 13
CPU Architecture Overview ............................................... 13
Customer Change Notification Service ............................ 231
Customer Notification Service .......................................... 231
Customer Support ............................................................ 231
D
Data Access from Program Memory Using
Program Space Visibility ............................................ 24
Data Accumulators and Adder/Subtracter .......................... 18
Data Space Write Saturation ..................................... 20
Write Back .................................................................. 19
Data Accumulators and Adder/Subtractor
Overflow and Saturation ............................................ 18
Round Logic ............................................................... 19
Data Address Space .......................................................... 25
Alignment ................................................................... 28
Alignment (Figure) ..................................................... 28
Effect of Invalid Memory Accesses ............................ 28
MCU and DSP (MAC Class) Instructions Example .... 27
Memory Map ........................................................ 25, 26
Near Data Space ....................................................... 29
Software Stack ........................................................... 29
Spaces ....................................................................... 28
Width .......................................................................... 28
Data EEPROM Memory ..................................................... 53
Erasing ....................................................................... 54
Erasing, Block ............................................................ 54
Erasing, Word ............................................................ 54
Protection Against Spurious Write ............................. 56
Reading ...................................................................... 53
Write Verify ................................................................ 56
Writing ........................................................................ 55
Writing, Block ............................................................. 56
Writing, Word ............................................................. 55
DC Characteristics ........................................................... 176
Brown-out Reset ...................................................... 182
I/O Pin Output Specifications ................................... 182
Idle Current (IIDLE) ................................................... 179
Operating Current (IDD) ............................................ 178
Operating MIPS vs. Voltage for dsPIC30F6010A .... 176
Operating MIPS vs. Voltage for dsPIC30F6015 ...... 176
Power-Down Current (IPD) ....................................... 180
Program and EEPROM ............................................ 183
Thermal Operating Conditions for
dsPIC30F6010A/6015 ...................................... 176
Thermal Packaging Characteristics ......................... 176
Dead-Time Generators ...................................................... 98
Assignment ................................................................ 98
Ranges ....................................................................... 98
Selection Bits ............................................................. 98
Development Support ...................................................... 171
Device Comparisons ........................................................ 221
DS70150B-page 226
Device Configuration
Register Map ........................................................... 161
Device Configuration Registers ....................................... 159
FBORPOR ............................................................... 159
FGS ......................................................................... 159
FOSC ....................................................................... 159
FWDT ...................................................................... 159
Device Overview .................................................................. 7
Divide Support ................................................................... 16
DSP Engine ....................................................................... 16
Multiplier .................................................................... 18
dsPIC30F6010A Port Register Map .................................. 59
dsPIC30F6015 Port Register Map ..................................... 60
Dual Output Compare Match Mode ................................... 84
Continuous Pulse Mode ............................................. 84
Single Pulse Mode ..................................................... 84
E
Edge-Aligned PWM ........................................................... 96
Electrical Characteristics ................................................. 175
Absolute Maximum Ratings ..................................... 175
BOR ......................................................................... 183
Equations
A/D Conversion Clock .............................................. 138
Baud Rate ................................................................ 119
PWM Period ............................................................... 96
PWM Resolution ........................................................ 96
Serial Clock Rate ..................................................... 112
Time Quantum for Clock Generation ....................... 129
Errata ................................................................................... 5
External Interrupt Requests ............................................... 43
F
Fast Context Saving .......................................................... 43
Flash Program Memory ..................................................... 47
In-Circuit Serial Programming (ICSP) ........................ 47
Run-Time Self-Programming (RTSP) ........................ 47
Table Instruction Operation Summary ....................... 47
I
I/O Ports ............................................................................. 57
Parallel I/O (PIO) ....................................................... 57
Idle Current (IIDLE) ........................................................... 179
In-Circuit Debugger (ICD 2) ............................................. 160
In-Circuit Serial Programming (ICSP) .............................. 147
Independent PWM Output ................................................. 99
Initialization Condition for RCON Register Case 1 .......... 157
Initialization Condition for RCON Register Case 2 .......... 157
Input Capture Module ........................................................ 79
Interrupts ................................................................... 80
Operation During Sleep and Idle Modes .................... 80
Register Map ............................................................. 81
Simple Capture Event Mode ...................................... 79
Input Change Notification Module ...................................... 61
Register Map (bits 15-8) ............................................ 61
Register Map (bits 7-0 for dsPIC30F6010A) .............. 61
Register Map (bits 7-0 for dsPIC30F6015) ................ 61
Instruction Addressing Modes ........................................... 33
File Register Instructions ........................................... 33
Fundamental Modes Supported ................................ 33
MAC Instructions ....................................................... 34
MCU Instructions ....................................................... 33
Move and Accumulator Instructions ........................... 34
Other Instructions ...................................................... 34
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
Instruction Set
Overview .................................................................. 166
Summary .................................................................. 163
Internet Address ............................................................... 231
Interrupt Controller
Register Map (dsPIC30F6010A) ................................ 44
Register Map (dsPIC30F6015) .................................. 45
Interrupt Priority ................................................................. 40
Interrupt Sequence ............................................................ 43
Interrupt Stack Frame ................................................ 43
Interrupts ............................................................................ 39
I2C Master Operation
Baud Rate Generator ............................................... 111
Clock Arbitration ....................................................... 112
Multi-Master Communication, Bus Collision
and Bus Arbitration .......................................... 112
Reception ................................................................. 111
Transmission ............................................................ 111
I2C Module
Addresses ................................................................ 109
General Call Address Support ................................. 111
Interrupts .................................................................. 111
IPMI Support ............................................................ 111
Master Operation ..................................................... 111
Master Support ........................................................ 111
Operating Function Description ............................... 107
Operation During CPU Sleep and Idle Modes ......... 112
Pin Configuration ..................................................... 107
Programmer’s Model ................................................ 107
Register Map ............................................................ 113
Registers .................................................................. 107
Slope Control ........................................................... 111
Software Controlled Clock Stretching (STREN = 1) . 110
Various Modes ......................................................... 107
I2C 10-bit Slave Mode Operation ..................................... 109
10-bit Mode Slave Reception ................................... 110
10-bit Mode Slave Transmission .............................. 110
I2C 7-bit Slave Mode Operation ....................................... 109
Reception ................................................................. 109
Transmission ............................................................ 109
I2C™ Module ................................................................... 107
M
Memory Organization ......................................................... 21
Core Register Map ..................................................... 30
Microchip Internet Web Site ............................................. 231
Migration from dsPIC30F6010 to dsPIC30F6010A .......... 223
Modulo Addressing ............................................................ 34
Applicability ................................................................ 36
Operation Example .................................................... 35
Start and End Address ............................................... 35
W Address Register Selection ................................... 35
Motor Control PWM Module ............................................... 93
8-Output Register Map ............................................. 102
MPLAB ASM30 Assembler, Linker, Librarian .................. 172
MPLAB ICD 2 In-Circuit Debugger .................................. 173
MPLAB ICE 2000 High-Performance Universal
In-Circuit Emulator ................................................... 173
MPLAB ICE 4000 High-Performance Universal
In-Circuit Emulator ................................................... 173
MPLAB Integrated Development Environment Software . 171
MPLAB PM3 Device Programmer ................................... 173
MPLINK Object Linker/MPLIB Object Librarian ............... 172
© 2006 Microchip Technology Inc.
O
Operating Current (IDD) ................................................... 178
Oscillator
Operating Modes (Table) ......................................... 148
System Overview ..................................................... 147
Oscillator Configurations .................................................. 150
Fail-Safe Clock Monitor ........................................... 152
Fast RC (FRC) ......................................................... 151
Initial Clock Source Selection .................................. 150
Low-Power RC (LPRC) ........................................... 152
LP Oscillator Control ................................................ 151
Phase Locked Loop (PLL) ....................................... 151
Start-up Timer (OST) ............................................... 151
Oscillator Selection .......................................................... 147
Output Compare Module ................................................... 83
Interrupts ................................................................... 85
Operation During CPU Idle Mode .............................. 85
Operation During CPU Sleep Mode .......................... 85
Register Map ............................................................. 86
P
Packaging Information ..................................................... 215
Marking .................................................................... 215
Peripheral Module Disable (PMD) Registers ................... 160
PICSTART Plus Development Programmer .................... 174
Pin Diagrams ................................................................... 3–4
Pinout Descriptions ............................................................ 10
POR. See Power-on Reset.
Position Measurement Mode ............................................. 88
Power Saving Modes
Idle ........................................................................... 159
Sleep ....................................................................... 158
Power-on Reset (POR) .................................................... 147
Oscillator Start-up Timer (OST) ............................... 147
Power-up Timer (PWRT) ......................................... 147
Power-Saving Modes ....................................................... 158
Power-Saving Modes (Sleep and Idle) ............................ 147
Program Address Space .................................................... 21
Construction .............................................................. 22
Data Access from Program Memory Using
Table Instructions .............................................. 23
Data Access from, Address Generation .................... 22
Memory Map .............................................................. 21
Table Instructions
TBLRDH ............................................................ 23
TBLRDL ............................................................. 23
TBLWTH ............................................................ 23
TBLWTL ............................................................ 23
Program Counter ............................................................... 14
Program Data Table Access .............................................. 24
Program Space Visibility
Window into Program Space Operation .................... 25
Programmable ................................................................. 147
Programmable Digital Noise Filters ................................... 89
Programmer’s Model ......................................................... 14
Diagram ..................................................................... 15
Programming Operations ................................................... 49
Algorithm for Program Flash ...................................... 49
Erasing a Row of Program Memory .......................... 49
Initiating the Programming Sequence ....................... 50
Loading Write Latches ............................................... 50
Protection Against Accidental Writes to OSCCON .......... 153
PWM Duty Cycle Comparison Units .................................. 97
Duty Cycle Immediate Updates ................................. 97
Duty Cycle Register Buffers ...................................... 97
DS70150B-page 227
dsPIC30F6010A/6015
PWM Fault Pins ............................................................... 100
Enable Bits ............................................................... 100
Fault States .............................................................. 100
Input Modes ............................................................. 100
Cycle-by-Cycle ................................................. 100
Latched ............................................................ 100
Priority ...................................................................... 100
PWM Operation During CPU Idle Mode ........................... 101
PWM Operation During CPU Sleep Mode ....................... 101
PWM Output and Polarity Control .................................... 100
Output Pin Control ................................................... 100
PWM Output Override ........................................................ 99
Complementary Output Mode .................................... 99
Synchronization ......................................................... 99
PWM Period ....................................................................... 96
PWM Special Event Trigger ............................................. 101
Postscaler ................................................................ 101
PWM Time Base ................................................................ 95
Continuous Up/Down Counting Modes ...................... 95
Double Update Mode ................................................. 96
Free-Running Mode ................................................... 95
Postscaler .................................................................. 96
Prescaler .................................................................... 96
Single-Shot Mode ...................................................... 95
PWM Update Lockout ...................................................... 101
Q
Quadrature Encoder Interface (QEI) Module ..................... 87
Interrupts .................................................................... 90
Logic .......................................................................... 88
Operation During CPU Idle Mode .............................. 89
Operation During CPU Sleep Mode ........................... 89
Register Map .............................................................. 91
Timer Operation During CPU Idle Mode .................... 90
Timer Operation During CPU Sleep Mode ................. 89
R
Reader Response ............................................................ 232
Reset ........................................................................ 147, 153
Reset Sequence ................................................................. 41
Reset Sources ........................................................... 41
Resets
Brown-out Rest (BOR), Programmable ................... 155
POR with Long Crystal Start-up Time ...................... 155
POR, Operating without FSCM and PWRT ............. 155
Power-on Reset (POR) ............................................ 154
Revision History ............................................................... 219
RTSP Control Registers ..................................................... 48
NVMADR ................................................................... 48
NVMADRU ................................................................. 48
NVMCON ................................................................... 48
NVMKEY .................................................................... 48
S
Simple Capture Event Mode
Capture Buffer Operation ........................................... 80
Capture Prescaler ...................................................... 79
Hall Sensor Mode ...................................................... 80
Timer2 and Timer3 Selection Mode ........................... 80
Simple Output Compare Match Mode ................................ 84
Simple PWM Mode ............................................................ 84
Input Pin Fault Protection ........................................... 84
Period ......................................................................... 85
Single-Pulse PWM Operation ............................................ 99
Software Controlled Clock Stretching (STREN = 1) ......... 110
Software Simulator (MPLAB SIM) .................................... 172
DS70150B-page 228
Software Stack Pointer, Frame Pointer ............................. 14
CALL Stack Frame .................................................... 29
SPI Module ...................................................................... 103
Framed SPI Support ................................................ 105
Operating Function Description ............................... 103
Operation During CPU Idle Mode ............................ 105
Operation During CPU Sleep Mode ......................... 105
SDOx Disable .......................................................... 103
Slave Select Synchronization .................................. 105
SPI1 Register Map ................................................... 106
SPI2 Register Map ................................................... 106
Word and Byte Communication ............................... 103
STATUS Register .............................................................. 14
Symbols Used in Opcode Descriptions ........................... 164
System Integration ........................................................... 147
Register Map for dsPIC30F6010A ........................... 161
Register Map for dsPIC30F6015 ............................. 161
T
Timer1 Module ................................................................... 63
Gate Operation .......................................................... 64
Interrupt ..................................................................... 65
Operation During Sleep Mode ................................... 64
Prescaler ................................................................... 64
Real-Time Clock ........................................................ 65
Interrupts ........................................................... 65
Oscillator Operation ........................................... 65
Register Map ............................................................. 66
16-bit Asynchronous Counter Mode .......................... 63
16-bit Synchronous Counter Mode ............................ 63
16-bit Timer Mode ...................................................... 63
Timer2 and Timer3 Selection Mode ................................... 84
Timer2/3 Module ................................................................ 67
ADC Event Trigger ..................................................... 72
Gate Operation .......................................................... 72
Interrupt ..................................................................... 72
Operation During Sleep Mode ................................... 72
Register Map ............................................................. 73
Timer Prescaler ......................................................... 72
32-bit Synchronous Counter Mode ............................ 67
32-bit Timer Mode ...................................................... 67
Timer4/5 Module ................................................................ 75
Register Map ............................................................. 77
Timing Diagrams
Band Gap Start-up Time .......................................... 191
CAN Bit .................................................................... 128
CAN I/O ................................................................... 209
Center-Aligned PWM ................................................. 97
Dead-Time ................................................................. 99
Edge-Aligned PWM ................................................... 96
External Clock .......................................................... 184
Input Capture (CAPx) .............................................. 195
I2C Bus Data (Master Mode) ................................... 205
I2C Bus Data (Slave Mode) ..................................... 207
I2C Bus Start/Stop Bits (Master Mode) .................... 205
I2C Bus Start/Stop Bits (Slave Mode) ...................... 207
Motor Control PWM ................................................. 197
Motor Control PWM Fault ........................................ 197
OC/PWM .................................................................. 196
Output Compare (OCx) ............................................ 195
PWM Output .............................................................. 85
QEA/QEB Input ....................................................... 198
QEI Module Index Pulse .......................................... 199
Reset, Watchdog Timer, Oscillator Start-up
Timer and Power-up Timer .............................. 190
SPI Master Mode (CKE = 0) .................................... 200
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
SPI Master Mode (CKE = 1) .................................... 201
SPI Slave Mode (CKE = 0) ...................................... 202
SPI Slave Mode (CKE = 1) ...................................... 203
Time-out Sequence on Power-up (MCLR
Not Tied to VDD), Case 1 ................................. 154
Time-out Sequence on Power-up (MCLR
Not Tied to VDD), Case 2 ................................. 155
Time-out Sequence on Power-up (MCLR
Tied to VDD) ..................................................... 154
TimerQ (QEI Module) External Clock ...................... 194
Timer1, 2, 3, 4, 5 External Clock .............................. 192
10-bit High-Speed A/D Conversion (CHPS = 01,
SIMSAM = 0, ASAM = 0, SSRC = 000) ........... 212
10-bit High-Speed A/D Conversion (CHPS = 01,
SIMSAM = 0, ASAM = 1, SSRC = 111,
SAMC = 00001) ............................................... 213
Timing Requirements
Input Capture ........................................................... 195
Timing Specifications
Band Gap Start-up Time Requirements ................... 191
CAN I/O Requirements ............................................ 209
CLKOUT and I/O Characteristics ............................. 189
CLKOUT and I/O Requirements .............................. 189
External Clock Requirements .................................. 185
Internal Clock Examples .......................................... 187
I2C Bus Data Requirements (Master Mode) ............ 206
I2C Bus Data Requirements (Slave Mode) .............. 208
Motor Control PWM Requirements .......................... 197
Output Compare Requirements ............................... 195
PLL Clock ................................................................. 186
PLL Jitter .................................................................. 186
QEI External Clock Requirements ........................... 194
QEI Index Pulse Requirements ................................ 199
Quadrature Decoder Requirements ......................... 198
Reset, Watchdog Timer, Oscillator Start-up
Timer, Power-up Timer and Brown-out
Reset Requirements ........................................ 191
Simple OC/PWM Mode Requirements .................... 196
SPI Master Mode (CKE = 0) Requirements ............. 200
SPI Master Mode (CKE = 1) Requirements ............. 201
SPI Slave Mode (CKE = 0) Requirements ............... 202
SPI Slave Mode (CKE = 1) Requirements ............... 203
Timer1 External Clock Requirements ...................... 192
Timer2 and Timer4 External Clock Requirements ... 193
Timer3 and Timer5 External Clock Requirements ... 193
10-bit High-Speed A/D ............................................. 210
10-bit High-Speed A/D Conversion Requirements .. 214
Traps .................................................................................. 41
Hard and Soft ............................................................. 42
Sources ...................................................................... 41
Vectors ....................................................................... 42
Reception Error Handling ........................................ 118
Framing Error (FERR) ..................................... 119
Idle Status ....................................................... 119
Parity Error (PERR) ......................................... 119
Receive Break ................................................. 119
Receive Buffer Overrun Error (OERR Bit) ....... 118
Setting Up Data, Parity and Stop Bit Selections ...... 117
Transmitting Data .................................................... 117
In 8-bit Data Mode ........................................... 117
In 9-bit Data Mode ........................................... 117
Interrupt ........................................................... 118
Transmit Break ................................................ 118
Transmit Buffer (UxTXB) ................................. 117
UART1 Register Map .............................................. 121
UART2 Register Map .............................................. 121
Unit ID Locations ............................................................. 147
Universal Asynchronous Receiver Transmitter
Module (UART) ........................................................ 115
W
Wake-up from Sleep ........................................................ 147
Wake-up from Sleep and Idle ............................................ 43
Watchdog Timer (WDT) ........................................... 147, 158
Enabling and Disabling ............................................ 158
Operation ................................................................. 158
WWW Address ................................................................ 231
WWW, On-Line Support ...................................................... 5
Z
16-bit Up/Down Position Counter Mode ............................ 88
Count Direction Status ............................................... 88
Error Checking ........................................................... 88
U
UART
Address Detect Mode .............................................. 119
Auto-Baud Support .................................................. 120
Baud Rate Generator (BRG) .................................... 119
Disabling .................................................................. 117
Enabling and Setup .................................................. 117
Loopback Mode ....................................................... 119
Module Overview ..................................................... 115
Operation During CPU Sleep and Idle Modes ......... 120
Receiving Data ......................................................... 118
In 8-bit or 9-bit Data Mode ............................... 118
Interrupt ........................................................... 118
Receive Buffer (UxRXB) .................................. 118
© 2006 Microchip Technology Inc.
DS70150B-page 229
dsPIC30F6010A/6015
NOTES:
DS70150B-page 230
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
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© 2006 Microchip Technology Inc.
DS70150B-page 231
dsPIC30F6010A/6015
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
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Literature Number: DS70150B
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DS70150B-page 232
© 2006 Microchip Technology Inc.
dsPIC30F6010A/6015
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
d s P I C 3 0 F 6 0 1 0 AT - 3 0 I / P F - 0 0 0
Custom ID (3 digits) or
Engineering Sample (ES)
Trademark
Architecture
PF
PT
PT
S
W
Flash
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
=
=
=
=
=
Package
TQFP 14x14
TQFP 12x12
TQFP 10x10
Die (Waffle Pack)
Die (Wafers)
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Speed
20 = 20 MIPS
30 = 30 MIPS
Device ID
T = Tape and Reel
A,B,C… = Revision Level
Example:
dsPIC30F6010AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
© 2006 Microchip Technology Inc.
DS70150B-page 233
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DS70150B-page 234
© 2006 Microchip Technology Inc.