Rohm BU6577FV Silicon monolithic integrated circuit Datasheet

1/4
◆Structure
Silicon monolithic integrated circuit
◆Product
3ch 16bit 12MSPS CIS/CCD Analog Front End
◆Type
BU6577FV
◆Features
・Correlated double sampling (CDS)
・Programmable gain amplifier (8bit resolution)
・16bit 12MSPS ADC
・Serial control interface
・Offset calibration DAC (8bit resolution)
・Internally generated voltage references
・8 or 4-bit wide multiplexed data output formats
◆Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Supply voltage 1
VAVDD
Supply voltage 2
VDVDD
I/O supply voltage
VVDDIO
Digital input voltage *1
VID
Digital output voltage *2
VOD
Analog input voltage *3
VIA
Analog output voltage *4
VOA
Storage temperature
Tstg
Power dissipation *5
Pd
Ratings
-0.2~4.0
-0.2~4.0
-0.2~4.0
-0.2~VVDDIO + 0.3
-0.2~VVDDIO + 0.3
-0.2~VAVDD + 0.3
-0.2~VAVDD + 0.3
-40~125
640
Unit
V
V
V
V
V
V
V
℃
mW
*1 : Pin No.4,5,6,7,9,11,12
*2 : Pin No.13,14,15,16,17,18,19,20
*3 : Pin No.1,27,28
*4 : Pin No.23,24,25,26
*5 : Reduced by 6.4mW for each increase in Ta of 1℃ over 25℃
◆Operating conditions (Ta = 0℃ to 70℃)
Parameter
Symbol
Supply voltage 1
VAVDD
Supply voltage 2
VDVDD
I/O supply voltage
VVDDIO
MIN
3.135
3.135
3.0
TYP
3.3
3.3
3.3
This product is not designed for protection against radioactive rays
Status of this document
The Japanese version of this document is the formal specification.
A customer may use this translation version only for a reference to help reading the formal version.
If there are any differences in translation version of this document, formal version takes priority.
REV. A
MAX
3.465
3.465
3.6
Unit
V
V
V
2/4
◆ Electrical characteristics
(Unless otherwise noted, Ta=25℃、VAVDD=VDVDD=VVDDIO=3.3V、MCLK=24MHz)
MIN
SPEC
TYP
MAX
VIN
RATE
0.26
-
-
2.7
12
V
MSPS
VIH
VIL
IIH
IIL
0.7*VVDDIO
-
-
0.2*VVDDIO
1
1
V
V
μA
μA
VOH
VOL
VVDDIO-0.5
-
-
0.5
V
V
Total supply current active
ITOTAL
-
68
130
mA
Total Analog AVDD,
Supply current - active
IAVDD
-
60
100
mA
Total digital DVDD,
Supply current - active
IDVDD
-
3
10
mA
Total digital I/O,
Supply current - active
IVDDIO
-
5
20
mA
Supply current – full power
down mode
IPD
-
30
60
μA
Parameter
Symbol
Unit
Conditions
Overall System Specification
Input signal limits
Conversion Rate
Digital Inputs
High level input voltage
Low level input voltage
High level input current
Low level input current
Digital Outputs
High level output voltage
Low level output voltage
Supply Currents
REV. A
IOH = 1mA
IOL = 1mA
MCLK=Low
3/4
◆Package outline
Part number
Include. BURR
BU6577FV
1PIN MARK
Lot No.
SSOP-B28 (Unit: mm)
◆Pin description
◆Block diagram
VSMP
MCLK
RLC/ACYC
AVDD
AGND
AGND
TIMING CONTROL
CP
BANDGAP
REFERENCE
VIN1
CLAMP
CM
PGA
CN
OEB
8
VIN2
CLAMP
PGA
8
VIN3
VBIAS
GENERATOR
16-bit
ADC
OFFSET
DAC
B[0]
B[1]
B[2]
B[3]
B[4]
B[5]
B[6]
L
A
T
C
H
B[7]
/SDO
CLAMP
PGA
8
VRLC
/VBIAS
OFFSET
DAC
OFFSET
DAC
8
CONTROL REGISTER
DIGITAL INTERFACE
SEN
SCK
SDI
DVDD
REV. A
DGND
VDDIO
Pin
Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Pin Name
VIN1
AGND
DVDD
OEB
VSMP
RLC/ACYC
MCLK
DGND
SEN
VDDIO
SDI
SCK
B[0]
B[1]
B[2]
B[3]
B[4]
B[5]
B[6]
B[7]/SDO
AVDD
AGND
CN
CP
CM
VRLC/VBIAS
VIN3
VIN2
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●Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down
devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding
the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses,
etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the
interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when
there are GND pattern for small signal and GND pattern for large current included the external circuits, separate each GND
pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no
problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the
terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals; such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied,
apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical
characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Rush current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of
GND wiring, and routing of wiring.
REV. A
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
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