EM78P157N 8-Bit Microcontroller with OTP ROM Product Specification Doc. Version 1.0 ELAN MICROELECTRONICS CORP. September 2005 Trademark Acknowledgments: IBM is a registered trademark and PS/2 is a trademark of IBM. Windows is a trademark of Microsoft Corporation ELAN and ELAN logo are trademarks of ELAN Microelectronics Corporation Copyright © 2005 by ELAN Microelectronics Corporation All Rights Reserved Printed in Taiwan The contents of this specification are subject to change without further notice. ELAN Microelectronics assumes no responsibility concerning the accuracy, adequacy, or completeness of this specification. ELAN Microelectronics makes no commitment to update, or to keep current the information and material contained in this specification. Such information and material may change to conform to each confirmed order. In no event shall ELAN Microelectronics be made responsible for any claims attributed to errors, omissions, or other inaccuracies in the information or material contained in this specification. ELAN Microelectronics shall not be liable for direct, indirect, special incidental, or consequential damages arising from the use of such information or material. The software (if any) described in this specification is furnished under a license or nondisclosure agreement, and may be used or copied only in accordance with the terms of such agreement. ELAN Microelectronics products are not intended for use in life support appliances, devices, or systems. Use of ELAN Microelectronics product in such applications is not supported and is prohibited. NO PART OF THIS SPECIFICATION MAY BE REPRODUCED OR TRANSMITTED IN ANY FORM OR BY ANY MEANS WITHOUT THE EXPRESSED WRITTEN PERMISSION OF ELAN MICROELECTRONICS. ELAN MICROELECTRONICS CORPORATION Headquarters: Hong Kong: USA: No. 12, Innovation Road 1 Hsinchu Science Park Hsinchu, Taiwan 30077 Tel: +886 3 563-9977 Fax: +886 3 563-9966 http://www.emc.com.tw Elan (HK) Microelectronics Corporation, Ltd. Elan Information Technology Group Rm. 1005B, 10/F Empire Centre 68 Mody Road, Tsimshatsui Kowloon , HONG KONG Tel: +852 2723-3376 Fax: +852 2723-7780 [email protected] 1821 Saratoga Ave., Suite 250 Saratoga, CA 95070 USA Tel: +1 408 366-8223 Fax: +1 408 366-8220 Europe: Shenzhen: Shanghai: Elan Microelectronics Corp. (Europe) Elan Microelectronics Shenzhen, Ltd. Elan Microelectronics Shanghai Corporation, Ltd. Siewerdtstrasse 105 8050 Zurich, SWITZERLAND Tel: +41 43 299-4060 Fax: +41 43 299-4079 http://www.elan-europe.com SSMEC Bldg., 3F, Gaoxin S. Ave. Shenzhen Hi-Tech Industrial Park Shenzhen, Guandong, CHINA Tel: +86 755 2601-0565 Fax: +86 755 2601-0500 23/Bldg. #115 Lane 572, Bibo Road Zhangjiang Hi-Tech Park Shanghai, CHINA Tel: +86 021 5080-3866 Fax: +86 021 5080-4600 Contents Contents 1 2 3 General Description ...................................................................................... 1 Features ......................................................................................................... 1 Pin Assignments and Descriptions.............................................................. 2 3.1 Pin Assignments ................................................................................................. 2 3.2 Pin Descriptions ................................................................................................. 3 3.2.1 3.2.2 3.2.3 3.2.4 4 EM78P157NBP and EM78P157NBM Pin Descriptions ......................................3 EM78P157NAP and EM78P157NAM Pin Descriptions ......................................3 EM78P157NAAS Pin Descriptions......................................................................4 EM78P157NAKM Pin Descriptions .....................................................................4 Function Description..................................................................................... 5 4.1 Operational Registers......................................................................................... 5 4.1.1 4.1.2 4.1.3 4.1.4 4.1.5 4.1.6 4.1.7 4.1.8 4.2 Special Purpose Registers ................................................................................. 8 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.2.6 4.2.7 4.2.8 4.2.9 4.3 4.4 Port 6 Input Change Wake-up/Interrupt Function Usage..................................16 RESET and Wake-up ....................................................................................... 17 4.5.1 4.5.2 4.6 Accumulator (A) Register ....................................................................................8 Control (CONT ) Register....................................................................................9 I/O Port Control (IOC5 ~ IOC6) Registers...........................................................9 Prescaler Counter (IOCA ) Register....................................................................9 Pull-Down Control (IOCB) Register...................................................................10 Open-Drain Control (IOCC ) Register ...............................................................10 Pull-High Control (IOCD) Register ....................................................................11 WDT Control (IOCE) Register ...........................................................................11 IOCF (Interrupt Mask Register).........................................................................12 TCC/WDT & Prescaler ..................................................................................... 12 I/O Ports ........................................................................................................... 13 4.4.1 4.5 Indirect Addressing (R0) Register .......................................................................6 Time Clock / Counter (R1) Register ....................................................................6 Program Counter and Stack (R2) Register .........................................................6 Status (R3) Register ............................................................................................7 RAM Select (R4) Register...................................................................................7 Port 5 ~ Port 6 (R5 ~ R6) Registers ....................................................................8 Interrupt Status (RF) Register .............................................................................8 General Purpose (R10 ~ R3F) Registers............................................................8 Summary of Initialized Values for Registers......................................................19 The Status of RST, T, and P of STATUS Register .............................................21 4.5.2.1 RST, T and P after RESET Values .....................................................21 4.5.2.2 Event Affecting T and P Status ...........................................................21 Interrupt ............................................................................................................ 22 Product Specification (V1.0) 09.22.2005 • iii Contents 4.7 Oscillator .......................................................................................................... 23 4.7.1 4.7.2 4.7.3 4.8 CODE Option Register ..................................................................................... 26 4.8.1 4.8.2 4.9 Oscillator Modes................................................................................................23 4.7.1.1 Oscillator Modes Defined by OSC, HLF, and HLP.............................23 4.7.1.2 The Summary of Maximum Operating Speeds ..................................23 Crystal Oscillator/Ceramic Resonators (XTAL) .................................................23 4.7.2.1 Capacitor Selection Guide for Crystal Oscillator or Ceramic Resonator ............................................................................24 External RC Oscillator Mode.............................................................................25 4.7.3.1 RC Oscillator Frequencies .................................................................26 Code Option Register (Word 0).........................................................................26 Customer ID Register (Word 1).........................................................................27 Power-On Considerations ................................................................................ 28 4.10 External Power-On Reset Circuit .................................................................... 28 4.11 Residual-Voltage Protection ............................................................................. 29 4.12 Instruction Set .................................................................................................. 30 4.13 Timing Diagrams .............................................................................................. 32 4.13.1 AC Test Input/Output Waveform........................................................................32 4.13.2 RESET Timing (CLK = ”0”)................................................................................32 4.13.3 TCC Input Timing (CLKS = ”0”) .........................................................................32 5 6 Absolute Maximum Ratings........................................................................ 33 Electrical Characteristics............................................................................ 33 6.1 DC Electrical Characteristic.............................................................................. 33 6.2 AC Electrical Characteristics ............................................................................ 34 6.3 Device Characteristics...................................................................................... 35 6.3.1 6.3.2 6.3.3 6.3.4 6.3.5 Port 6 Vih/Vil vs. VDD (Input Pin with Schmitt Inverter) ....................................35 Port 5 Input Threshold Voltage (Vth) vs. VDD...................................................35 Ports 5 & Port 6 Voh vs. Ioh, VDD=5V and 3V .................................................36 Ports 5 & Port 6 Vol vs. Iol, VDD=5V and 3V....................................................36 WDT Time Out Period vs. VDD (Prescaler Set to 1:1)......................................37 6.3.6 Typical RC OSC Frequency vs. VDD (Cext = 100pF, Temp. = 25℃) ..............38 6.3.7 Typical RC OSC Frequency vs. VDD (with R and C under Ideal Conditions) ..............................................................38 Typical and Maximum Operating Current (ICC1/2/3/4) vs. Temperature ............................................................................39 Typical and Maximum Standby Current (ISB1 and ISB2) vs. Temperature .....................................................................41 6.3.8 6.3.9 6.3.10 Operating Voltage under Temperature Range of 0°C to 70°C and –40°C to 85°C ............................................................................................42 6.3.11 Operating Current Range (Based on High and Low Freq. @ =25℃) vs. Voltage.........................................................................................................43 iv • Product Specification (V1.0) 09.22.2005 Contents APPENDIX A Package Types............................................................................................. 44 A..1 Package Detailed Information .......................................................................... 44 A.1.1 A.1.2 A.1.3 A.1.4 A.1.5 B C 14-Lead Plastic Dual in line (PDIP) — 300 Mil .................................................44 14-Lead Plastic Small Outline (SOP) — 150 Mil...............................................45 18-Lead Plastic Dual in Line (PDIP) — 300 Mil ................................................46 18-Lead Plastic Small Outline (SOP) — 300 Mil...............................................47 20-Lead Plastic Small Outline (SSOP) — 209 Mil ............................................48 Quality Assurance and Reliability .............................................................. 49 Address Trap Detect.................................................................................... 50 Product Specification (V1.0) 09.22.2005 •v Contents Specification Revision History Doc. Version 1.0 vi • Revision Description Initial version Date 09/22/2005 Product Specification (V1.0) 09.22.2005 EM78P157N 8-Bit Microcontroller with OTP ROM 1 General Description EM78P157N is an 8-bit microprocessor designed and developed with low-power, high-speed CMOS technology. It is equipped with 1K*13-bits Electrical One Time Programmable Read Only Memory (OTP-ROM). It provides three PROTECTION bits to prevent user’s code in the OTP memory from being intruded. Eight OPTION bits are also provided to meet user’s additional requirements. With its OTP-ROM feature, the EM78P157N is able to offer a convenient way of developing and verifying user’s programs. Moreover, user can take advantage of ELAN DWriter to easily program his development code. 2 Features Operating voltage range: 2.5V~5.5V Operating temperature range: -40°C~85°C Operating frequency range (base on 2 clocks ): • Crystal mode: DC~20MHz at 5V, DC~8MHz at 3V, DC~4MHz at 2.5V. • ERC mode: DC~4MHz at 5V, DC~4MHz at 3V, DC~4MHz at 2.5V. Low power consumption: • Less then 2 mA at 5V/4MHz • Typically 20 µA at 3V/32KHz • Typically 1 µA during sleep mode 1K × 13 bits on chip ROM One security register to prevent intrusion of OTP memory codes One configuration register to accommodate user’s requirements 48× 8 bits on chip registers (SRAM, general purpose register) 2 bi-directional I/O ports 5 level stacks for subroutine nesting 8-bit real time clock/counter (TCC) with selective signal sources, trigger edges, and overflow interrupt Two clocks per instruction cycle Power down (SLEEP) mode Three available interruptions • TCC overflow interrupt • Input-port status changed interrupt (wake up from sleep mode) • External interrupt Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) •1 EM78P157N 8-Bit Microcontroller with OTP ROM Programmable free running watchdog timer 8 programmable pull-high pins 7 programmable pull-down pins 8 programmable open-drain pins 2 programmable R-option pins Package types: • • • • • • 3 14 pin DIP 300mil : EM78P157NBP 14 pin SOP 150mil : EM78P157NBM 18 pin DIP 300mil : EM78P157NAP 18 pin SOP 300mil : EM78P157NAM 20 pin SSOP 209mil : EM78P157NAAS 20 pin SSOP 209mil : EM78P157NAKM 99.9% single instruction cycle commands The transient point of system frequency between HXT and LXT is around 400KHz Pin Assignments and Descriptions 3.1 Pin Assignments TCC 3 /RESET 4 Vss 5 P60/INT 6 P61 2 14 13 P51 P50 1 18 P51 P53 2 17 P50 TCC 3 16 OSCI /RESET 4 15 OSCO Vss 5 P60/INT 6 VDD P61 7 9 P67 P62 8 7 8 P66 P63 9 12 OSCI 11 OSCO 10 EM78P157NAP EM78P157NAM 1 EM78P157NBP EM78P157NBM P52 P53 P52 14 VDD 13 P67 12 P66 11 P65 10 P64 20 NC P52 1 20 P51 2 19 P51 P53 2 19 P50 P53 3 18 P50 TCC 3 18 OSCI TCC 4 17 OSCI /RESET 4 /RESET 5 16 OSCO Vss 5 15 VDD Vss 6 14 EM78P157NAKM 1 EM78P157NAAS NC P52 17 OSCO 16 VDD 15 VDD Vss 6 P60/INT 7 P67 P60/INT 7 14 P67 P61 8 13 P66 P61 8 13 P66 P62 9 12 P65 P62 9 12 P65 P63 10 11 P64 P63 10 11 P64 Fig. 1-1 Pin Assignments 2• Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 3.2 Pin Descriptions 3.2.1 EM78P157NBP and EM78P157NBM Pin Descriptions Symbol Pin No. Type VDD 10 – OSCI 12 I OSCO 11 I/O TCC 3 I /RESET 4 I P50~P53 13, 14, 1, 2 I/O P60~P61 6~7 I/O P66~P67 8~9 I/O /INT VSS 6 5 I – Function y Power supply y XTAL type: Crystal input terminal or external clock input pin y ERC type: RC oscillator input pin y XTAL type: Output terminal for crystal oscillator or external clock input pin y RC type: Instruction clock output y External clock signal input y The real time clock/counter (with Schmitt trigger input pin), must be tied to VDD or VSS if not in use y Input pin with Schmitt trigger. If this pin remains at logic low, the controller will also remain at reset condition. y P50~P53 are bi-directional I/O pins y P50 and P51 can also be defined as the R-option pins y P50~P52 can be set as pull-down by software y P60~P61 are bi-directional I/O pins y These pins can be set as pull-high, pull-down, or open-drain through software programming y P66~P67 are bi-directional I/O pins y These pins can be set as pull-high or open-drain through software programming y External interrupt pin triggered by falling edge y Ground 3.2.2 EM78P157NAP and EM78P157NAM Pin Descriptions Symbol Pin No. Type VDD 14 – OSCI 16 I OSCO 15 I/O TCC 3 I /RESET 4 I P50~P53 17,18, 1, 2 I/O P60~P67 6~13 I/O /INT VSS 6 5 I – Function y Power supply y XTAL type: Crystal input terminal or external clock input pin y ERC type: RC oscillator input pin y XTAL type: Output terminal for crystal oscillator or external clock input pin y RC type: Instruction clock output y External clock signal input y The real time clock/counter (with Schmitt trigger input pin), must be tied to VDD or VSS if not in use y Input pin with Schmitt trigger. If this pin remains at logic low, the controller will also remain at reset condition. y P50~P53 are bi-directional I/O pins y P50 and P51 can also be defined as the R-option pins y P50~P52 can be set as pull-down by software y P60~P67 are bi-directional I/O pins y These pins can be set as pull-high or open-drain through software programming y P60~P63 can also be set as pull-down by software y External interrupt pin triggered by falling edge y Ground Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) •3 EM78P157N 8-Bit Microcontroller with OTP ROM 3.2.3 EM78P157NAAS Pin Descriptions Symbol Pin No. Type Function y Power supply y XTAL type: Crystal input terminal or external clock input pin y ERC type: RC oscillator input pin VDD 15 – OSCI 17 I OSCO 16 I/O TCC 4 I /RESET 5 I P50~P53 18, 19, 2, 3 I/O P60~P67 7~14 I/O /INT VSS 7 6 I – y XTAL type: Output terminal for crystal oscillator or external clock input pin y RC type: Instruction clock output y External clock signal input y The real time clock/counter (with Schmitt trigger input pin), must be tied to VDD or VSS if not in use y Input pin with Schmitt trigger. If this pin remains at logic low, the controller will also remain at reset condition. y P50~P53 are bi-directional I/O pins y P50 and P51 can also be defined as the R-option pins y P50~P52 can be set as pull-down by software y P60~P67 are bi-directional I/O pins y These pins can be set as pull-high or open-drain through software programming y P60~P63 can also be set as pull-down by software y External interrupt pin triggered by falling edge y Ground 3.2.4 EM78P157NAKM Pin Descriptions 4• Symbol Pin No. Type VDD 15,16 – OSCI 18 I OSCO 17 I/O TCC 3 I /RESET 4 I Function y y y y y y y y P50~P53 19, 20, 1, 2 I/O P60~P67 7~14 I/O y y y y y /INT VSS 7 5, 6 I – y y y Power supply XTAL type: Crystal input terminal or external clock input pin ERC type: RC oscillator input pin XTAL type: Output terminal for crystal oscillator or external clock input pin RC type: Instruction clock output External clock signal input The real time clock/counter (with Schmitt trigger input pin), must be tied to VDD or VSS if not in use Input pin with Schmitt trigger. If this pin remains at logic low, the controller will also remain at reset condition. P50~P53 are bi-directional I/O pins P50 and P51 can also be defined as the R-option pins P50~P52 can be set as pull-down by software P60~P67 are bi-directional I/O pins These pins can be set as pull-high or open-drain through software programming P60~P63 can also be set as pull-down by software External interrupt pin triggered by falling edge Ground Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 4 Function Description OSCO /RESET OSCI TCC WDT timer /INT Oscillator/Timing Control R2 ROM Prescaler Stack IOCA R4 ALU Instruction Register Interrupt Controller RAM R3 R1(TCC) Instruction Decoder ACC DATA & CONTROL BUS IOC6 R6 P60//INT P61 P62 P63 P64 P65 P66 P67 I/O PORT 6 IOC5 R5 I/O PORT 5 P50 P51 P52 P53 Fig. 4-1 Function Block Diagram 4.1 Operational Registers The following is the operational registers’ data memory configuration. Address R PAGE Registers IOC PAGE Registers 00 01 02 03 R0 R1 R2 R3 (IAR) (TCC) (PC) (Status) Reserve CONT Reserve Reserve 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 ︰ 3F R4 R5 R6 Reserve Reserve Reserve Reserve Reserve Reserve Reserve Reserve RF (RSR) (Port5) (Port6) Reserve IOC5 IOC6 Reserve Reserve Reserve IOCA IOCB IOCC IOCD IOCE IOCF (Interrupt Status) (Control Register) (I/O Port Control Register) (I/O Port Control Register) (Prescaler Control Register) (Pull-down Register) (Open-drain Control) (Pull-high Control Register) (WDT Control Register) (Interrupt Mask Register) General Registers Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) •5 EM78P157N 8-Bit Microcontroller with OTP ROM 4.1.1 Indirect Addressing (R0) Register R0 is not a physically implemented register. Its major function is to perform as an indirect addressing pointer. Any instruction using R0 as a pointer actually accesses data pointed by the RAM Select Register (R4). 4.1.2 Time Clock / Counter (R1) Register Increased by an external signal edge, which is defined by TE bit (CONT-4) through the TCC pin, or by the instruction cycle clock. Writable and readable as any other registers. Defined by resetting PAB (CONT-3). The prescaler is assigned to TCC, if the PAB bit (CONT-3) is reset. The contents of the prescaler counter will be cleared only when TCC register is written with a value. 4.1.3 Program Counter and Stack (R2) Register Depending on the device type, R2 and hardware stack are 10-bits wide. The R2 structure is depicted in Fig. 4-2 below. Generates 1024×13 bits on-chip OTP ROM addresses to the relative programming instruction codes. One program page is 1024 words long. R2 is set as all “0” when under RESET condition. "JMP" instruction allows direct loading of the lower 10 program counter bits. Thus, "JMP" allows PC to go to any location within a page. "CALL" instruction loads the lower 10 bits of the PC, and then PC+1 is pushed into the stack. Thus, the subroutine entry address can be located anywhere within a page. "RET" ("RETL k," "RETI") instruction loads the program counter with the contents of the top-level stack. "ADD R2, A" allows the contents of ‘A’ to be added to the current PC, and the ninth and tenth bits of the PC are cleared. "MOV R2, A" allows to load an address from the "A" register to the lower 8 bits of the PC, and the ninth and tenth bits of the PC are cleared. Any instruction that writes to R2 (e.g., "ADD R2,A," "MOV R2,A," "BC R2,6",⋅etc.) will cause the ninth and tenth bits (A8~A9) of the PC to be cleared. Thus, the computed jump is limited to the first 256 locations of a page. All instructions are single instruction cycle (fclk/2 or fclk/4) except for the instruction that would change the contents of R2. Such instruction will need one more instruction cycle. 6• Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM Reset Vector Interrupt Vector PC (A9 ~ A0) 000H 008H User Memory Space On-chip Program Memory Stack Level 1 Stack Level 2 Stack Level 3 Stack Level 4 Stack Level 5 3FFH Fig. 4-2 R2 (Program Counter) & Stack Organization 4.1.4 Status (R3) Register Bit 7 GP2 Bit 0 (C): Bit 6 GP1 Bit 5 GP0 Bit 4 T Bit 3 P Bit 2 Z Bit 1 DC Bit 0 C Carry flag Bit 1 (DC): Auxiliary carry flag Bit 2 (Z): Zero flag Set to "1" if the result of an arithmetic or logic operation is zero Bit 3 (P): Power down bit Set to “1” during power on or by a "WDTC" command Reset to “0” by a "SLEP" command Bit 4 (T): Time-out bit Set to “1” with the "SLEP" and "WDTC" commands, or during power up Reset to “0” by WDT time-out Bit 5~7 (GP0 ~ 2): General-purpose read/write bits 4.1.5 RAM Select (R4) Register Bit 7 Bit 6 Bit 5 Bit 4 Not used (read only) Bit 3 Bit 2 Bit 1 Bit 0 Select Registers Z flag of R3 will set to “1” when R4 content is equal to “3F.” When R4=R4+1, R4 content will function as R0. See the data memory configuration shown in Section 4.1. Bits 0~5: are used to select registers (Address: 00~06, 0F~3F) in indirect address mode Bits 6~7: are not used (read only) Bits 6~7 are set to “1” all the time Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) •7 EM78P157N 8-Bit Microcontroller with OTP ROM 4.1.6 Port 5 ~ Port 6 (R5 ~ R6) Registers R5 and R6 are I/O registers. Only the lower 4 bits of R5 are available. 4.1.7 Interrupt Status (RF) Register Bit 7 - Bit 6 Bit 5 - Bit 4 - Bit 3 - - Bit 2 EXIF Bit 1 ICIF Bit 0 TCIF RF can be cleared by instruction but cannot be set IOCF is the interrupt mask register (see Section 4.2.9) NOTE The result of reading RF is the "logic AND" of RF and IOCF. 0: disable interrupt request 1: enable interrupt request Bit 0 (TCIF): TCC overflow interrupt flag Set when TCC overflows. Reset by software. Bit 1 (ICIF): Port 6 input status change interrupt flag Set when Port 6 input changes. Reset by software. Bit 2 (EXIF): External interrupt flag Set by falling edge on /INT pin. Reset by software. Bits 3 ~ 7: Not used 4.1.8 General Purpose (R10 ~ R3F) Registers R10 ~ R3F are all 8-bit general-purpose registers 4.2 Special Purpose Registers 4.2.1 Accumulator (A) Register 8• Internal data transfer, or instruction operand holding It cannot be addressed Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 4.2.2 Control (CONT ) Register Bit 7 - Bit 6 Bit 5 Bit 4 /INT TS TE Bit 3 PAB Bit 2 Bit 1 Bit 0 PSR2 PSR1 PSR0 CONT register is both readable and writable Bit 0 ~ Bit 2 (PSR0 ~ PSR2): TCC/WDT prescaler bits PSR2 PSR1 PSR0 TCC Rate WDT Rate 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 1:2 1:4 1:8 1:16 1:32 1:64 1:128 1:256 1:1 1:2 1:4 1:8 1:16 1:32 1:64 1:128 Bit 3 (PAB): Prescaler assignment bit 0: TCC 1: WDT Bit 4 (TE): TCC signal edge 0: increment if the transition from low to high takes place on TCC pin 1: increment if the transition from high to low takes place on TCC pin Bit 5 (TS): TCC signal source 0: internal instruction cycle clock 1: transition on TCC pin Bit 6 (/INT): Interrupt enable flag 0: masked by DISI or hardware interrupt 1: enabled by ENI/RETI instructions Bit 7: Not used 4.2.3 I/O Port Control (IOC5 ~ IOC6) Registers 0: defines the relative I/O pin as output 1: put the relative I/O pin into high impedance Only the lower 4 bits of IOC5 can be defined. IOC5 and IOC6 registers are both readable and writable 4.2.4 Prescaler Counter (IOCA ) Register IOCA register is readable The value of IOCA is equal to the contents of Prescaler counter Down counter Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) •9 EM78P157N 8-Bit Microcontroller with OTP ROM 4.2.5 Pull-Down Control (IOCB) Register Bit 7 /PD7 Bit 6 /PD6 Bit 5 /PD5 Bit 4 /PD4 Bit 3 - Bit 2 /PD2 Bit 1 /PD1 Bit 0 /PD0 IOCB Register is both readable and writable. Bit 0 (/PD0): Control bit is used to enable the P50 pin pull-down 0: Enable internal pull-down 1: Disable internal pull-down Bit 1 (/PD1): Control bit is used to enable the P51 pin pull-down Bit 2 (/PD2): Control bit is used to enable the P52 pin pull-down Bit 3: Not used Bit 4 (/PD4): Control bit is used to enable the P60 pin pull-down Bit 5 (/PD5): Control bit is used to enable the P61 pin pull-down Bit 6 (/PD6): Control bit is used to enable the P62 pin pull-down Bit 7 (/PD7): Control bit is used to enable the P63 pin pull-down 4.2.6 Open-Drain Control (IOCC ) Register Bit 7 OD7 Bit 6 OD6 Bit 5 OD5 Bit 4 OD4 Bit 3 OD3 Bit 2 OD2 Bit 1 OD1 Bit 0 OD0 IOCC Register is both readable and writable. Bit 0 (OD0): Control bit is used to enable the P60 pin open-drain 0: Disable open-drain output 1: Enable open-drain output Bit 1 (OD1): Control bit is used to enable the P61 pin open-drain Bit 2 (OD2): Control bit is used to enable the P62 pin open-drain Bit 3 (OD3): Control bit is used to enable the P63 pin open-drain Bit 4 (OD4): Control bit is used to enable the P64 pin open-drain Bit 5 (OD5): Control bit is used to enable the P65 pin open-drain Bit 6 (OD6): Control bit is used to enable the P66 pin open-drain Bit 7 (OD7): Control bit is used to enable the P67 pin open-drain 10 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 4.2.7 Pull-High Control (IOCD) Register Bit 7 /PH7 Bit 6 /PH6 Bit 5 /PH5 Bit 4 /PH4 Bit 3 /PH3 Bit 2 /PH2 Bit 1 /PH1 Bit 0 /PH0 IOCD Register is both readable and writable Bit 0 (/PH0): Control bit is used to enable the P60 pin pull-high 0: Enable internal pull-high 1: Disable internal pull-high Bit 1 (/PH1): Control bit is used to enable the P61 pin pull-high Bit 2 (/PH2): Control bit is used to enable the P62 pin pull-high Bit 3 (/PH3): Control bit is used to enable the P63 pin pull-high Bit 4 (/PH4): Control bit is used to enable the P64 pin pull-high Bit 5 (/PH5): Control bit is used to enable the P65 pin pull-high Bit 6 (/PH6): Control bit is used to enable the P66 pin pull-high Bit 7 (/PH7): Control bit is used to enable the P67 pin pull-high 4.2.8 WDT Control (IOCE) Register Bit 7 WDTE Bits 0~3, 5: Bit 6 EIS Bit 5 - Bit 4 Bit 3 ROC Bit 2 - Bit 1 - - Bit 0 - Not used Bit 4 (ROC): ROC is used for the R-option Setting the ROC to "1" will enable the status of R-option pins (P50∼P51) that are read by the controller. Clearing the ROC will disable the R-option function. If the R-option function is selected, you must connect the P51 pin or/and P50 pin to VSS with a 430KΩ external resistor (Rex). If the Rex is connected or disconnected, the status of P50 (P51) is read as "0" or "1" respectively Refer to Fig. 4-6 under Section 4.4. Bit 6 (EIS): Control bit is used to define the P60 (/INT) pin function 0: P60, bi-directional I/O pin 1: /INT, external interrupt pin. In this case, the I/O control bit of P60 (bit 0 of IOC6) must be set to "1" EIS is both readable and writable. When EIS is "0," the path of /INT is masked. When EIS is "1,” the status of /INT pin can also be read by way of reading Port 6 (R6). Refer to Fig. 4-5(a) under Section 4.4. Bit 7 (WDTE): Control bit is used to enable Watchdog timer 0: Disable WDT 1: Enable WDT WDTE is both readable and writable Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 11 EM78P157N 8-Bit Microcontroller with OTP ROM 4.2.9 IOCF (Interrupt Mask Register) Bit 7 - Bit 6 - Bit 5 Bit 4 - - Bit 3 - Bit 2 EXIE Bit 1 ICIE Bit 0 TCIE Individual interrupt is enabled by setting its associated control bit in the IOCF to "1." Global interrupt is enabled by the ENI instruction and is disabled by the DISI instruction. Refer to Fig. 4-8 under Section 4.6. IOCF register is both readable and writable. Bit 0 (TCIE): TCIF interrupt enable bit 0: disable TCIF interrupt 1: enable TCIF interrupt Bit 1 (ICIE): ICIF interrupt enable bit 0: disable ICIF interrupt 1: enable ICIF interrupt Bit 2 (EXIE): EXIF interrupt enable bit 0: disable EXIF interrupt 1: enable EXIF interrupt Bits 3~7: Not used. 4.3 TCC/WDT & Prescaler An 8-bit counter available as prescaler for the TCC or WDT. The prescaler is available for either the TCC or WDT only at any given time, and the PAB bit of the CONT register is used to determine the prescaler assignment. The PSR0~PSR2 bits determine the ratio. The prescaler is cleared each time the instruction is written to TCC under TCC mode. The WDT and prescaler, when assigned to WDT mode, are cleared by the “WDTC” or “SLEP” instructions. Fig. 4-3 below, depicts the circuit diagram of TCC/WDT. 12 • R1 (TCC) is an 8-bit timer/counter. The clock source of TCC can be internal or external clock input (edge selectable from TCC pin). If TCC signal source is from internal clock, TCC will increase by 1 at every instruction cycle (without prescaler). Referring to Fig. 4-3 below, CLK=Fosc/2 or CLK=Fosc/4 application is determined by the CODE Option bit CLK status. CLK=Fosc/2 is used when CLK bit is "0," and CLK=Fosc/4 is used when CLK bit is "1." If TCC signal source comes from external clock input, TCC is increased by 1 at every falling edge or rising edge of TCC pin. Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM The watchdog timer is a free running on-chip RC oscillator. The WDT will keep on running even when the oscillator driver has been turned off (i.e., in sleep mode). During normal operation or sleep mode, a WDT time-out (if enabled) will cause the device to reset. The WDT can be enabled or disabled any time during normal mode by software programming. Refer to WDTE bit of IOCE register. Without prescaler, the WDT time-out period is approximately 18 ms1 (default). Data Bus CLK(=Fosc/2 or Fosc/4) 0 TCC Pin 1 1 M U X 0 M U X SYNC 2 cycles TE TS TCC (R1) TCC overflow interrupt PAB 0 WDT 1 WTE (in IOCE) M U X 8-bit Counter PAB 8-to-1 MUX M U X IOCA PAB PSR0~PSR2 0 Initial value 1 MUX PAB WDT time-out Fig. 4-3 TCC and WDT Block Diagram 4.4 I/O Ports The I/O registers, both Port 5 and Port 6, are bi-directional tri-state I/O ports. Port 6 can be set as pull-high internally by software. Furthermore, Port 6 can also be set as open-drain output by software and supports input status change interrupt (or wake-up) function. P50 ~ P52 and P60 ~ P63 pins can be pulled down by software. Each I/O pin can be defined as "input" or "output" pin by the I/O control register (IOC5 ~ IOC6). P50 ~ P51 are the R-option pins which are enabled by setting the ROC bit in the IOCE register to “1.” When the R-option function is used, it is recommended that P50 ~ P51 are used as output pins. When R-option is in enabled state, P50 ~ P51 must be programmed as input pins. Under R-option mode, the current/power consumption by Rex should be taken into the consideration to promote energy conservation. The I/O registers and I/O control registers are both readable and writable. The I/O interface circuits for Port 5 and Port 6 are depicted in Figures 4-4, 4-5(a), 4-5(b), and 4-6 shown below. 1 Vdd = 5V, set up time period = 16.8ms ± 30% Vdd = 3V, set up time period = 18ms ± 30% Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 13 EM78P157N 8-Bit Microcontroller with OTP ROM PCRD P R Q _ Q PORT C L D P R Q _ Q C L PCW R CLK IO D D PDW R CLK PDRD 0 1 M U X NOTE: Pull-down is not shown in the figure Fig. 4-4(a) I/O Port and I/O Control Register Port 5 Circuit Diagram PC R D Q _ Q P R D C L K C L Q _ Q P R D C L K C L PC W R P 6 0 /I N T PO R T B it 6 o f I O C E P R C L K C L D 0 Q 1 _ Q IO D PD W R M U X PD R D P R C L K C L D T 10 Q _ Q IN T NOTE: Pull-high/down and open-drain are not shown in the figure Fig. 4-5(b) I/O Port and I/O Control Register P60 (/INT) Circuit Diagram 14 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM PCRD P61~P67 PORT 0 1 Q _ Q P R D CLK C L Q _ Q P R D CLK C L PCWR IOD PDWR M U X TIN PDRD P R CLK C L D Q _ Q NOTE: Pull-high/down and open-drain are not shown in the figure Fig. 4-5(c) I/O Port and I/O Control Register for P61~P67 Circuit Diagram IOCE.1 D P R Q Interrupt CLK _ C Q L RE.1 ENI Instruction P D R Q T10 T11 CLK _ C L Q P Q R D CLK _ Q C L T17 DISI Instruction /SLEP Interrupt (Wake-up from SLEEP) Next Instruction (Wake-up from SLEEP) Fig. 4-5(d) Block Diagram on I/O Port 6 with Input Change Interrupt/Wake-up Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 15 EM78P157N 8-Bit Microcontroller with OTP ROM 4.4.1 Port 6 Input Change Wake-up/Interrupt Function Usage (I) Wake-up from Port 6 Input Status Change (II) Port 6 Input Status Change Interrupt (a) Before SLEEP 1. Read I/O Port 6 (MOV R6,R6) 1. Disable WDT* (using very carefully) 2. Execute "ENI" 2. Read I/O Port 6 (MOV R6,R6) 3. Enable interrupt (Set IOCF.1) 3. Execute "ENI" or "DISI" 4. IF Port 6 change (interrupt) → Interrupt vector (008H) 4. Enable interrupt (Set IOCF.1) 5. Execute "SLEP" instruction (b) After Wake-up 1. IF "ENI" → Interrupt vector (008H) 2. IF "DISI" → Next instruction * Software disables WDT (watchdog timer) but hardware must be enabled before applying the Port 6 Change Wake-Up function (CODE Option Register and Bit 11 (ENWDTB-) set to “1”). PCRD VCC ROC Q P R Q C L Q P R Q C L Weakly Pull-up PORT D CLK PCWR IOD D PDWR PDRD 0 Rex* 1 M U X *The Rex is a 430K ohm external resistor Fig. 4-6 I/O Port with R-option (P50,P51) Circuit Diagram 16 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 4.5 RESET and Wake-up A RESET is initiated by one of the following events: 1. Power on reset 2. /RESET pin input "low," or 3. WDT time-out (if enabled) The device is kept in a RESET condition for a period of approximately 18ms2 (one oscillator start-up timer period) after the reset is detected. Once the RESET occurs, the following functions are performed (see Fig. 4-7 under Section 4.5.2.1) The oscillator is running, or will be started. The Program Counter (R2) is set to all "0." All I/O port pins are configured as input mode (high-impedance state). The Watchdog timer and prescaler are cleared. When power is switched on, the upper 3 bits of R3 are cleared. All the CONT register bits are set to "1" except for the Bit 6 (INT flag). All the IOCA register bits are set to "1." All the IOCB register bits are set to "1." The IOCC register is cleared. All the IOCD register bits are set to "1." Bit 7 of the IOCE register is set to "1," and Bits 4 and 6 are cleared. Bits 0 ~2 of RF and bits 0 ~2 of IOCF registers are cleared. The sleep (power down) mode is asserted by executing the “SLEP” instruction. While entering sleep mode, WDT (if enabled) is cleared but keeps on running. The controller can be awakened by: 1. External reset input on /RESET pin, 2. WDT time-out (if enabled), or 3. Port 6 input status changes (if enabled). The first two cases will cause the EM78P157N to reset. The T and P flags of R3 can be used to determine the source of the reset (wake-up). The last case is considered the continuation of the program execution. The global interrupt ("ENI" or "DISI" being executed) decides whether or not the controller branches to the interrupt vector following wake-up. If ENI is executed before SLEP, the instruction will begin to execute from the address 008H after wake-up. If DISI is executed before SLEP, the operation will restart from the succeeding instruction right next to SLEP after wake-up. 2 Vdd = 5V, set up time period = 16.8ms ± 30% Vdd = 3V, set up time period = 18ms ± 30% Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 17 EM78P157N 8-Bit Microcontroller with OTP ROM Only one of Cases 2 and 3 can be enabled before entering into sleep mode, i.e., [a] if Port 6 Input Status Change Interrupt is enabled before SLEP, WDT must be disabled by software. However, the WDT bit in the option register remains enabled. Hence, the EM78P157N can be awakened only by either Case 1 or 3. [b] if WDT is enabled before SLEP, Port 6 Input Status Change Interrupt must be disabled. Hence, the EM78P157N can only be awakened by either Case 1 or 2. Refer to the section (Section 4.6) on Interrupt. If Port 6 Input Status Change Interrupt is used to wake-up the EM78P157N (Case [a] above), the following instructions must be executed before SLEP: MOV A, @xx000110b CONTW CLR R1 MOV A, @xxxx1110b CONTW WDTC MOV A, @0xxxxxxxb IOW RE MOV R6, R6 MOV A, @00000x1xb IOW RF ENI (or DISI) SLEP ; Select internal TCC clock ; Clear TCC and prescaler ; Select WDT prescaler ; Clear WDT and prescaler ; Disable WDT ; Read Port 6 ; Enable Port 6 input change interrupt ; Enable (or disable) global interrupt ; Sleep NOP One problem you should be aware of is that after waking up from the sleep mode, WDT is enabled automatically. The WDT operation (being enabled or disabled) should be handled appropriately by software after waking up from the sleep mode. 18 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 4.5.1 Summary of Initialized Values for Registers Legend: U = Unknown or don’t care Address Name Reset Type P = Previous value before reset Bit 7 Bit 6 Bit 5 X X X Bit Name N/A N/A N/A 0x00 0x01 0x02 0x03 0x04 0x05 IOC5 IOC6 CONT R0(IAR) R1(TCC) R2(PC) R3(SR) R4(RSR) P5 t = Check with Section 4.5.2.1 Bit 4 Bit 3 X Bit 2 Bit 1 Bit 0 C53 C52 C51 C50 Power-On U U U U 1 1 1 1 /RESET and WDT Wake-Up from Pin Change Bit Name U U U U 1 1 1 1 U U U U P P P P C67 C66 C65 C64 C63 C62 C61 C60 Power-On 1 1 1 1 1 1 1 1 /RESET and WDT Wake-Up from Pin Change Bit Name 1 1 1 1 1 1 1 1 P P P P P P P P X /INT TS TE PAB 1 1 0 0 1 1 1 1 1 1 1 1 1 1 1 1 P P P P P P P P Power-On /RESET and WDT Wake-Up from Pin Change Bit Name PSR2 PSR1 PSR0 - - - - - - - - Power-On /RESET and WDT Wake-Up from Pin Change Bit Name U P U P U P U P U P U P U P U P P P P P P P P P - - - - - - - - Power-On /RESET and WDT Wake-Up from Pin Change Bit Name 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 P P P P P P P P Power-On /RESET and WDT Wake-Up from Pin Change Bit Name - - - - - - - - 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 *0/P *0/P *0/P *0/P *1/P *0/P *0/P *0/P GP2 GP1 GP0 T P Z DC C 0 0 0 0 0 0 1 t 1 t U P U P U P P P P t t P P P Power-On /RESET and WDT Wake-Up from Pin Change Bit Name Power-On /RESET and WDT Wake-Up from Pin Change Bit Name - - - - - - - - 1 1 1 1 U P U P U P U P U P U P 1 1 P P P P P P X X X X P53 P52 P51 P50 Power-On 0 0 0 0 U U U U /RESET and WDT 0 0 0 0 P P P P Wake-Up from Pin 0 0 0 0 P P P P Change * Jump to address 0x08, or execute the instruction following the “SLEP” instruction. Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 19 EM78P157N 8-Bit Microcontroller with OTP ROM Address 0x06 0x0F 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F Name P6 RF(ISR) IOCA IOCB IOCC IOCD IOCE IOCF 0x10~0x2F R10~R2F 20 • Reset Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit Name P67 P66 P65 P64 P63 P62 P61 P60 Power-On U U U U U U U U /RESET and WDT Wake-Up from Pin Change Bit Name P P P P P P P P P P P P P P P P X X X X X EXIF ICIF TCIF Power-On U U U U U 0 0 0 /RESET and WDT Wake-Up from Pin Change Bit Name U U U U U 0 0 0 U U U U U P P P - - - - - - - - Power-On 1 1 1 1 1 1 1 1 /RESET and WDT Wake-Up from Pin Change Bit Name 1 1 1 1 1 1 1 1 P P P P P P P P /PD7 /PD6 /PD5 /PD4 X /PD2 /PD1 /PD0 Power-On 1 1 1 1 U 1 1 1 /RESET and WDT Wake-Up from Pin Change Bit Name 1 1 1 1 U 1 1 1 P P P P U P P P OD7 OD6 OD5 OD4 OD3 OD2 OD1 OD0 Power-On 0 0 0 0 0 0 0 0 /RESET and WDT Wake-Up from Pin Change Bit Name 0 0 0 0 0 0 0 0 P P P P P P P P /PH7 /PH6 /PH5 /PH4 /PH3 /PH2 /PH1 /PH0 Power-On 1 1 1 1 1 1 1 1 /RESET and WDT Wake-Up from Pin Change Bit Name 1 1 1 1 1 1 1 1 P P P P P P P P WDTE EIS X ROC X X X X Power-On 1 0 U 0 U U U U /RESET and WDT Wake-Up from Pin Change Bit Name 1 0 U 0 U U U U 1 P U P U U U U X X X X X EXIE ICIE TCIE Power-On U U U U U 0 0 0 /RESET and WDT Wake-Up from Pin Change Bit Name U U U U U 0 0 0 U U U U U P P P - - - - - - - - Power-On U U U U U U U U /RESET and WDT Wake-Up from Pin Change P P P P P P P P P P P P P P P P Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 4.5.2 The Status of RST, T, and P of STATUS Register A RESET condition is initiated by the following events: 1. A power-on condition 2. A high-low-high pulse on /RESET pin 3. Watchdog timer time-out 4.5.2.1 RST, T and P after RESET Values The values of T (Time-out) and P (Power-down) as listed below are used to verify how the processor wakes up. Reset Type T Power on /RESET during Operating mode /RESET wake-up during SLEEP mode WDT during Operating mode WDT wake-up during SLEEP mode Wake-Up on pin change during SLEEP mode P 1 1 *P *P 1 0 0 1 0 *P 0 0 *P = Previous status before reset 4.5.2.2 Event Affecting T and P Status The table below shows the events that may affect the status of T (Time-out) and P (Power-down). Event T P Power on 1 1 WDTC instruction 1 1 WDT time-out 0 *P SLEP instruction 1 0 Wake-Up on pin change during SLEEP mode 1 0 *P = Previous status before reset VDD D CLK Oscillator Q CLK CLR Power-on Reset Voltage Detector WDTE WDT WDT Timeout Setup Time RESET /RESET Fig. 4-7 Controller Reset Block Diagram Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 21 EM78P157N 8-Bit Microcontroller with OTP ROM 4.6 Interrupt The EM78P157N has three falling-edge interrupts as listed below: 1. TCC overflow interrupt 2. Port 6 Input Status Change Interrupt 3. External interrupt [(P60, /INT) pin]. Before the Port 6 Input Status Change Interrupt is enabled, reading Port 6 (e.g., "MOV R6,R6") is necessary. Each Port 6 pin of will have this feature when its status changes. Any pin configured as output or P60 pin configured as “/INT,” is excluded from this function. The Port 6 Input Status Change Interrupt can wake up the EM78P157N from the sleep mode if Port 6 is enabled prior to going into the sleep mode by executing SLEP instruction. When the chip wakes-up, the controller will continue to execute the succeeding address if the global interrupt is disabled or branches to the interrupt vector 008H if the global interrupt is enabled. RF is the interrupt status register that records the interrupt requests in the relative flags/bits. IOCF is an interrupt mask register. The global interrupt is enabled by the ENI instruction and is disabled by the DISI instruction. When one of the enabled interrupts occurs, the next instruction will be fetched from address 008H. Once in the interrupt service routine, the source of an interrupt can be determined by polling the flag bits in RF. The interrupt flag bit must be cleared by instructions before leaving the interrupt service routine and before interrupts are enabled to avoid recursive interrupts. The flag (except ICIF bit) in the Interrupt Status Register (RF) is set regardless of the status of its mask bit or ENI execution. Note that the outcome of RF will be the logic AND of RF and IOCF (refer to Fig. 4-7 above). The RETI instruction ends the interrupt routine and enables the global interrupt (execution of ENI). When an interrupt is generated by the INT instruction (enabled), the next instruction will be fetched from address 001H. VCC D /IRQn P R CLK C L Q IRQn INT _ Q RFRD IRQm RF ENI/DISI Q IOCF _ Q P R C L IOD D CLK IOCFWR /RESET IOCFRD RFWR Fig. 4-8 Interrupt Input Circuit 22 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 4.7 Oscillator 4.7.1 Oscillator Modes The EM78P157N can be operated in three different oscillator modes, namely, External RC oscillator mode (ERC), High XTAL oscillator mode (HXT), and Low XTAL oscillator mode (LXT). User can select one of them by programming OSC, HLF, and HLP in the CODE option register. The following table depicts how these three modes are defined. 4.7.1.1 Oscillator Modes Defined by OSC, HLF, and HLP Mode OSC HLF ERC (External RC oscillator mode) 0 1 1 X 1 1 0 HXT (High XTAL oscillator mode) 1 LXT (Low XTAL oscillator mode) 1 2 HLP 2 2 X 2 X 0 The transient point of system frequency between HXT and LXY is around 400 kHz X = Don’t care 4.7.1.2 The Summary of Maximum Operating Speeds The maximum operational frequency of crystal/resonator under different VDDs is as listed below. Condition Two cycles with two clocks VDD Fxt Max Freq. 3.0 8.0 MHz 5.0 20.0 MHz 4.7.2 Crystal Oscillator/Ceramic Resonators (XTAL) EM78P157N can be driven by an external clock signal through the OSCI pin as illustrated in the following figure. OSCI Ext. Clock OSCO EM78P157N Fig. 4-9 External Clock Input Circuit Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 23 EM78P157N 8-Bit Microcontroller with OTP ROM In most applications, Pin OSCI and Pin OSCO can connected with a crystal or ceramic resonator to generate oscillation. The figure below depicts such circuit. The same thing is applicable whether it is in the HXT mode or LXT mode. Table below provides the recommended values of C1 and C2. Since each resonator has its own attribute, you should refer to its specification for the appropriate values of C1 and C2. RS, a serial resistor, may be necessary for AT strip cut crystal or low frequency mode. C1 OSCI EM78P157N XTAL OSCO RS C2 Fig. 4-10 Crystal/Resonator Circuit 4.7.2.1 Capacitor Selection Guide for Crystal Oscillator or Ceramic Resonator The table below provides the recommended values of C1 and C2. Since each resonator has its own attribute, you should refer to its specification for the appropriate values of C1 and C2. RS, a serial resistor, may be necessary for AT strip cut crystal or low frequency mode. Oscillator Type Frequency Mode Frequency C1(pF)* C2(pF)* Ceramic Resonators HXT 455 kHz 2.0 MHz 4.0 MHz 100~150 20~40 10~30 100~150 20~40 10~30 LXT 32.768kHz 100KHz 200KHz 25 25 25 15 25 25 HXT 455KHz 1.0MHz 2.0MHz 4.0MHz 20~40 15~30 15 15 20~150 15~30 15 15 Crystal Oscillator * The values shown for capacitors C1 & C2 are for reference only. 24 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 4.7.3 External RC Oscillator Mode For some applications that do not need a very precise timing calculation, the RC oscillator (Fig. 4-11 below) offers a lot of cost savings. Nevertheless, it should be noted that the frequency of the RC oscillator is influenced by the supply voltage, the values of the resistor (Rext), the capacitor (Cext), and even by the operation temperature. Moreover, the frequency also changes slightly from one chip to another due to the manufacturing process variation. In order to maintain a stable system frequency, the values of the Cext should not be less than 20pF, and that the value of Rext should not be greater than 1 MΩ. If they cannot be kept in this range, the frequency is easily affected by noise, humidity, and leakage. The smaller the Rext in the RC oscillator, the faster its frequency will be. On the contrary, for very low Rext values, for instance, 1 KΩ, the oscillator will become unstable because the NMOS cannot accurately discharge the current of the capacitance. Based on the above factors, it must be kept in mind that all of the supply voltage, the operation temperature, the components of the RC oscillator, the package types, the way the PCB is laid out, will affect the system frequency. Vcc Rext OSCI Cext EM78P157N Fig. 4-11 External RC Oscillator Mode Circuit Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 25 EM78P157N 8-Bit Microcontroller with OTP ROM 4.7.3.1 RC Oscillator Frequencies Cext Rext Average Fosc 5V, 25°C Average Fosc 3V, 25°C 3.3k 3.92 MHz 3.65 MHz 5.1k 2.67 MHz 2.60 MHz 10k 1.39MHz 1.40 MHz 20 pF 100k 149 KHz 156 KHz 3.3k 1.39 MHz 1.33 MHz 5.1k 10k 940 KHz 480 KHz 920 KHz 475 KHz 100k 52 KHz 50 KHz 3.3k 595 KHz 560 KHz 5.1k 400 KHz 390 KHz 10k 200 KHz 200 KHz 100k 21 KHz 20 KHz 100 pF 300 pF NOTE: 1. Values derived and measured from DIP packages 2. Values are for design references only 3. The frequency drift is about ±30% 4.8 CODE Option Register The EM78P157N has a CODE option word that is not a part of the normal program memory. The option bits cannot be accessed during normal program execution. The following is the Code Option Register and Customer ID Register arrangement distribution: Word 0 Word 1 Bit12~Bit0 Bit12~Bit0 4.8.1 Code Option Register (Word 0) WORD 0 Bit12 Bit11 Bit10 - - - Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 - CLKS ENWDTB - HLF OSC HLP PR2 PR1 PR0 Bit 9~Bit 12: Not used (reserved) This bit is set to “1” all the time Bit 8 (CLKS): Instruction period option bit 0: two oscillator periods 1: four oscillator periods (Refer to Section 4-12, Instruction Set) Bit 7 (ENWDTB): Watchdog timer enable bit 0: Enable 1: Disable Bit 6: Not used (reserved) This bit is set to “1” all the time 26 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM Bit 5 (HLF): XTAL frequency selection 0: XTAL2 type (low frequency, 32.768KHz) 1: XTAL1 type (high frequency) This bit will affect system oscillation only when Bit 4 (OSC) is “1.” When OSC is”0,” HLF must be “0”. NOTE The transient point of system frequency between HXT and LXY is around 400 KHz. Bit 4 (OSC): Oscillator type selection 0: RC type 1: XTAL type (XTAL1 and XTAL2) Bit 3 (HLP): Power selection 0: Low power 1: High power Bit 2 ~ Bit 0 (PR2 ~ PR0): Protect bits PR2 ~ PR0 are protect bits that can be set as follows: PR2 PR1 PR0 Protect 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Enable Enable Enable Enable Enable Enable Enable Disable 4.8.2 Customer ID Register (Word 1) Bit 12 ~ Bit 0 XXXXXXXXXXXXX Bit 12 ~ Bit 0: Customer’s ID code Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 27 EM78P157N 8-Bit Microcontroller with OTP ROM 4.9 Power-On Considerations Any microcontroller is not guaranteed to start to operate properly before the power supply stays at its steady state. EM78P157N POR voltage range is 1.2V~1.8V. Under customer application, when power is OFF, Vdd must drop to below 1.2V and remains OFF for 10µs before power can be switched ON again. This way, the EM78P157N will reset and works normally. The extra external reset circuit will work well if Vdd can rise at very fast speed (50 ms or less). However, under most cases where critical applications are involved, extra devices are required to assist in solving the power-up problems. 4.10 External Power-On Reset Circuit The circuit shown below implements an external RC to produce the reset pulse. The pulse width (time constant) should be kept long enough for Vdd to reach the minimum operation voltage. This circuit is used when the power supply has a slow rise time. Because the current leakage from the /RESET pin is about ±5µA, it is recommended that R should not be greater than 40K. In this way, the /RESET pin voltage is held below 0.2V. The diode (D) acts as a short circuit at the moment of power down. The capacitor C will discharge rapidly and fully. Rin, the current-limited resistor, will prevent high current or ESD (electrostatic discharge) from flowing into /RESET pin. Vdd R /RESET D EM78P157N Rin C Fig. 4-12 External Power-Up Reset Circuit 28 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 4.11 Residual-Voltage Protection When battery is replaced, device power (Vdd) is taken off but residual-voltage remains. The residual-voltage may trips below Vdd minimum, but not to zero. This condition may cause a poor power-on reset. Figures 4-13 and 4-14 illustrate how to build a residual-voltage protection circuit. Vdd Vdd 33K EM78P157N Q1 10K /RESET 40K 1N4684 Fig. 4-13 Circuit 1 for the Residue Voltage Protection Vdd Vdd R1 EM78P157N Q1 /RESET 40K R2 Fig. 4-14 Circuit 2 for the Residue Voltage Protection Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 29 EM78P157N 8-Bit Microcontroller with OTP ROM 4.12 Instruction Set Each instruction in the instruction set is a 13-bit word divided into an OP code and one or more operands. Normally, all instructions are executed within one single instruction cycle (one instruction consists of 2 oscillator periods), unless the program counter is changed by instruction "MOV R2,A," "ADD R2,A," or by instructions of arithmetic or logic operation on R2 (e.g., "SUB R2,A," "BS(C) R2,6," "CLR R2," etc.). In this case, the execution takes two instruction cycles. If for some reasons, the specification of the instruction cycle is not suitable for certain applications, try modifying the instruction as follows: 1. Change one instruction cycle to consist of 4 oscillator periods. 2. "JMP,” "CALL," "RET," "RETL," and "RETI," or the conditional skip ("JBS," "JBC," "JZ," "JZA," "DJZ," and "DJZA") commands which were tested to be true, are executed within two instruction cycles. The instructions that are written to the program counter also take two instruction cycles. Case (1) is selected by the CODE Option bit, called CLK. One instruction cycle consists of two oscillator clocks if CLK is low, and four oscillator clocks if CLK is high. Note that once the 4 oscillator periods within one instruction cycle is selected as in Case (A), the internal clock source to TCC should be CLK=Fosc/4, instead of Fosc/2 as indicated in Fig. 4-3 (TCC and WDT Block Diagram) in Section 4.3. Furthermore, the instruction set has the following features: 1. Every bit of any register can be set, cleared, or tested directly. 2. The I/O register can be regarded as general register. That is, the same instruction can operate on I/O register. LEGEND: "R" represents a register designator that specifies which one of the registers (including operational registers and general purpose registers) is to be utilized by the instruction. "b" represents a bit field designator that selects the value for the bit which is located in the register "R" and affects operation. "k" represents an 8 or 10-bit constant or literal value. Instruction Binary 0 0 0 0 0 0 0 0 0 0000 0001 0002 0003 0004 000r 0010 0011 0012 NOP DAA CONTW SLEP WDTC IOW R ENI DISI RET 0 0000 0001 0011 0013 RETI 0 0 0 0 0014 001r 00rr 0080 CONTR IOR R MOV R,A CLRA 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0001 0001 0001 Mnemonic 0000 0001 0010 0011 0100 rrrr 0000 0001 0010 30 • 0000 0000 0000 0000 0000 0000 0000 0000 0000 Hex 0001 0001 01rr 1000 0100 rrrr rrrr 0000 Operation No Operation Decimal Adjust A A → CONT 0 → WDT, Stop oscillator 0 → WDT A → IOCR Enable Interrupt Disable Interrupt [Top of Stack] → PC [Top of Stack] → PC, Enable Interrupt CONT → A IOCR → A A→R 0→A Status Affected None C None T,P T,P 1 None None None None None None 1 None None Z Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM Instruction Binary 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0000 0001 0001 0001 0001 0010 0010 0010 0010 0011 0011 0011 0011 0100 0100 0100 0100 0101 0101 0101 0101 Mnemonic Status Affected Z Z,C,DC Z,C,DC Z Z Z Z Z Z Z Z Z,C,DC Z,C,DC Z Z Z Z Z Z None None SUB A,k INT PC+1 → [SP], 001H → PC None ADD A,k k+A → A Z,C,DC 00rr 01rr 01rr 01rr 01rr 02rr 02rr 02rr 02rr 03rr 03rr 03rr 03rr 04rr 04rr 04rr 04rr 05rr 05rr 05rr 05rr CLR R SUB A,R SUB R,A DECA R DEC R OR A,R OR R,A AND A,R AND R,A XOR A,R XOR R,A ADD A,R ADD R,A MOV A,R MOV R,R COMA R COM R INCA R INC R DJZA R DJZ R 0 0110 00rr rrrr 06rr RRCA R 0 0110 01rr rrrr 06rr RRC R 0 0110 10rr rrrr 06rr RLCA R 0 0110 11rr rrrr 06rr RLC R 0 0111 00rr rrrr 07rr SWAPA R 0 0 0 0 0 0 0 1 1 1 1 1 1 rrrr rrrr rrrr rrrr rrrr rrrr rrrr kkkk kkkk kkkk kkkk kkkk kkkk 07rr 07rr 07rr 0xxx 0xxx 0xxx 0xxx 1kkk 1kkk 18kk 19kk 1Akk 1Bkk SWAP R JZA R JZ R BC R,b BS R,b JBC R,b JBS R,b CALL k JMP k MOV A,k OR A,k AND A,k XOR A,k 1 1100 kkkk kkkk 1Ckk RETL k 1 1101 kkkk kkkk 1Dkk 1 1110 0000 0001 1E01 1 1111 kkkk kkkk 1Fkk 01rr 10rr 11rr bbrr bbrr bbrr bbrr kkkk kkkk kkkk kkkk kkkk kkkk Operation 0→R R-A → A R-A → R R-1 → A R-1 → R A∨R→A A∨R→R A&R→A A&R→R A⊕R→A A⊕R→R A+R→A A+R→R R→A R→R /R → A /R → R R+1 → A R+1 → R R-1 → A, skip if zero R-1 → R, skip if zero R(n) → A(n-1), R(0) → C, C → A(7) R(n) → R(n-1), R(0) → C, C → R(7) R(n) → A(n+1), R(7) → C, C → A(0) R(n) → R(n+1), R(7) → C, C → R(0) R(0-3) → A(4-7), R(4-7) → A(0-3) R(0-3) ↔ R(4-7) R+1 → A, skip if zero R+1 → R, skip if zero 0 → R(b) 1 → R(b) if R(b)=0, skip if R(b)=1, skip PC+1 → [SP], (Page, k) → PC (Page, k) → PC k→A A∨k→A A&k→A A⊕k→A k → A, [Top of Stack] → PC k-A → A rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr rrrr 0111 0111 0111 100b 101b 110b 111b 00kk 01kk 1000 1001 1010 1011 11rr 00rr 01rr 10rr 11rr 00rr 01rr 10rr 11rr 00rr 01rr 10rr 11rr 00rr 01rr 10rr 11rr 00rr 01rr 10rr 11rr Hex C C C C None None None None 2 None 3 None None None None None None Z Z Z None Z,C,DC 1 This instruction is applicable to IOC5 ~ IOC6 and IOCB ~ IOCF only This instruction is not recommended for RF operation 3 This instruction cannot operate under RF 2 Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 31 EM78P157N 8-Bit Microcontroller with OTP ROM 4.13 Timing Diagrams 4.13.1 AC Test Input/Output Waveform 2.4 2.0 0.8 TEST POINTS 2.0 0.8 0.4 AC Testing : Input is driven at 2.4V for logic "1",and 0.4V for logic "0".Timing measurements are made at 2.0V for logic "1",and 0.8V for logic "0". Fig. 4-15 AC Test Input/Output Waveform Timing Diagram 4.13.2 RESET Timing (CLK = ”0”) Instruction 1 Executed NOP CLK /RESET Tdrh Fig. 4-16 RESET Timing (CLK = ”0”)Timing Diagram 4.13.3 TCC Input Timing (CLKS = ”0”) Tins CLK TCC Ttcc Fig. 4-17 TCC Input Timing (CLKS = ”0”) Timing Diagram 32 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 5 Absolute Maximum Ratings EM78P157N Items 6 Rating Temperature under bias –40°C to 85°C Storage temperature –65°C to 150°C Working voltage 2.5 to 5.5V Working frequency DC to 20MHz Input voltage Vss-0.3V to Vdd+0.5V Output voltage Vss-0.3V to Vdd+0.5V Electrical Characteristics 6.1 DC Electrical Characteristic (Ta=25 °C, VDD=5V±5%, VSS=0V) Symbol FXT ERC IIL VIH1 VIL1 VIHT1 VILT1 VIHX1 VILX1 VIH2 VIL2 VIHT2 VILT2 VIHX2 VILX2 Parameter XTAL: VDD to 3V XTAL: VDD to 5V ERC: VDD to 5V Input Leakage Current for input pins Input High Voltage (VDD=5V) Input Low Voltage (VDD=5V) Input High Threshold Voltage (VDD=5V) Input Low Threshold Voltage (VDD=5V) Clock Input High Voltage (VDD=5V) Clock Input Low Voltage (VDD=5V) Input High Voltage (VDD=3V) Input Low Voltage (VDD=3V) Input High Threshold Voltage (VDD=3V) Input Low Threshold Voltage (VDD=3V) Clock Input High Voltage (VDD=3V) Clock Input Low Voltage (VDD=3V) Condition Two cycle with two clocks Two cycle with two clocks R: 5.1KΩ, C: 100 pF Min DC DC F±30% VIN = VDD, VSS Ports 5, 6 Ports 5, 6 2.0 /RESET, TCC(Schmitt trigger) 2.0 /RESET, TCC(Schmitt trigger) OSCI Max Unit 940 8.0 20.0 F±30% MHz MHz kHz ±1 µA 0.8 V V V 0.8 3.5 OSCI Ports 5, 6 Ports 5, 6 1.5 /RESET, TCC(Schmitt trigger) 1.5 /RESET, TCC(Schmitt trigger) OSCI Typ V 1.5 V 0.4 V V V 0.4 2.1 OSCI V V V 0.9 V VOH1 Output High Voltage (Ports 5) IOH = -12.0 mA 2.4 V VOH1 Output High Voltage (Ports 6) (Schmitt trigger) IOH = -12.0 mA 2.4 V VOL1 Output Low Voltage(Port5) IOL = 12.0 mA Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) 0.4 V • 33 EM78P157N 8-Bit Microcontroller with OTP ROM Symbol Parameter VOL1 Output Low Voltage (Ports 6) (Schmitt trigger) IPH Pull-high current IPD Pull-down current ISB1 Power down current ISB2 Power down current ICC1 Operating supply current (VDD=3V) at two cycles/four clocks ICC2 Operating supply current (VDD=3V) at two cycles/four clocks ICC3 Operating supply current (VDD=5.0V) at two cycles/two clocks ICC4 Operating supply current (VDD=5.0V) at two cycles/four clocks Condition Min Typ IOL = 12.0 mA Pull-high active, input pin at VSS Pull-down active, input pin at VDD All input and I/O pins at VDD, output pin floating, WDT disabled All input and I/O pins at VDD, output pin floating, WDT enabled /RESET= 'High', Fosc=32KHz (Crystal type,CLKS="0"), output pin floating, WDT disabled /RESET= 'High', Fosc=32KHz (Crystal type,CLKS="0"), output pin floating, WDT enabled /RESET= 'High', Fosc=4MHz (Crystal type, CLKS="0"), output pin floating, WDT enabled /RESET= 'High', Fosc=10MHz (Crystal type, CLKS="0"), output pin floating, WDT enabled Max Unit 0.4 V –50 –70 –240 µA 25 50 120 µA 1 2 µA 15 µA 20 30 µA 25 35 µA 2.0 mA 4.0 mA Typ Max Unit 50 55 % 15 6.2 AC Electrical Characteristics (Ta=25 °C, VDD=5V±5%, VSS=0V) Symbol Parameter Dclk Input CLK duty cycle Tins Instruction cycle time (CLKS="0") Conditions Min 45 Crystal type 100 DC ns RC type 500 DC ns Ttcc TCC input period (Tins+20)/N* Tdrh Device reset hold time 11.8 Trst /RESET pulse width Ta = 25°C 2000 Twdt Watchdog timer period Ta = 25°C 11.8 Tset Input pin setup time 0 ns Thold Input pin hold time 20 ns Tdelay Output pin delay time 50 ns Cload=20pF ns 16.8 21.8 ms ns 16.8 21.8 ms *N = selected prescaler ratio 34 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 6.3 Device Characteristics The graphs provided in the following pages were derived based on a limited number of samples and are shown herein for reference purposes only and are not guaranteed for its accuracy. In some graphs, the data may be out of the specified warranted operating range. 6.3.1 Port 6 Vih/Vil vs. VDD (Input Pin with Schmitt Inverter) Vih/Vil (Input Pins with Schmitt Inverter) 2.5 Vih max (-40℃ to 85℃) Vih/Vil (Volt) 2 Vih typ 25℃ Vih min (-40℃ to 85℃) 1.5 1 Vil max (-40℃ to 85℃) 0.5 Vil typ 25℃ 0 2.5 3 3.5 Vil min ( 40℃ to 85℃) 4 4.5 5 5.5 VDD (Volt) Fig. 6-1 Graph on Port 6 Vih/Vil vs. VDD 6.3.2 Port 5 Input Threshold Voltage (Vth) vs. VDD Vth (Input Threshold Voltage) of I/O pins 2 Max(-40℃ to 85℃) Vth (Volt) 1.5 Typ 25℃ 1 Min(-40℃ to 85℃) 0.5 0 2.5 3 3.5 4 4.5 5 5.5 VDD (Volt) Fig. 6-2 Graph on Port 5 Input Threshold Voltage (Vth) vs. VDD Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 35 EM78P157N 8-Bit Microcontroller with OTP ROM 6.3.3 Ports 5 & Port 6 Voh vs. Ioh, VDD=5V and 3V Voh/Ioh (3V) 0 0 -5 -2 -10 -4 Ioh (mA) Ioh (mA) Voh/Ioh (5V) Min 85℃ Min 85℃ -6 -15 Typ 25℃ Typ 25℃ -8 -20 Max –40 Max –40 -10 -25 1.5 2 2.5 3 3.5 4 4.5 0 5 0.5 1 1.5 2 2.5 3 Voh (Volt) Voh (Volt) Fig. 6-3 Graph on Ports 5 & 6 Voh vs. Ioh, VDD=5V Fig. 6-4 Graph on Ports 5 & 6 Voh vs. Ioh, VDD=3V 6.3.4 Ports 5 & Port 6 Vol vs. Iol, VDD=5V and 3V Vol/Iol (5V) Vol/Iol (3V) 45 100 90 Max -40 40 80 35 70 30 60 50 Min 85℃ 40 Iol (mA) Iol (mA) Typ 25℃ Typ 25℃ 25 Min 85℃ 20 15 30 10 20 5 10 0 0 0 0.5 1 1.5 2 2.5 3 Vol (Volt) Fig. 6-5 Graph on Ports 5 & 6 Vol vs. Ioh, VDD=5V 36 • Max -40 0 0.5 1 1.5 2 2.5 3 Vol (Volt) Fig. 6-6 Graph on Ports 5 & 6 Voh vs. Iol, VDD=3V Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 6.3.5 WDT Time Out Period vs. VDD (Prescaler Set to 1:1) WDT Time out 45 40 WDT period (mS) 35 Max 85℃ 30 Max 70℃ 25 Typ 25℃ 20 Min 0℃ 15 Min -40℃ 10 5 0 2 3 4 5 6 VDD (Volt) Fig. 6-7 Graph on WDT Time Out Period vs. VDD (Perscaler Set to 1:1) Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 37 EM78P157N 8-Bit Microcontroller with OTP ROM 6.3.6 Typical RC OSC Frequency vs. VDD (Cext = 100pF, Temp. = 25℃) Cext = 100pF, Typical RC Frequency vs. VDD 1.6 R = 3.3K 1.4 Frequency (M Hz) 1.2 R = 5.1K 1 0.8 R = 10K 0.6 0.4 0.2 R = 100K 0 3 3.5 4 4.5 VDD (Volt) 5 5.5 Fig. 6-8 Graph on Typical RC OSC Frequency vs. VDD (Cext = 100pF, Temperature at 25℃) 6.3.7 Typical RC OSC Frequency vs. VDD (with R and C under Ideal Conditions) VDD = 5V VDD = 3V Fig. 6-9 Graph on Typical RC OSC Frequency vs. VDD (with R & C under Ideal Conditions) 38 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 6.3.8 Typical and Maximum Operating Current (ICC1/2/3/4) vs. Temperature The following four conditions exist with the Operating Current ICC1 to ICC4: ICC1: VDD=3V, Fosc=32K Hz, 2 clocks, WDT disabled ICC2: VDD=3V, Fosc=32K Hz, 2 clocks, WDT enabled ICC3: VDD=5V, Fosc=4M Hz, 2 clocks, WDT enabled ICC4: VDD=5V, Fosc=10M Hz, 2 clocks, WDT enabled Typical ICC1 and ICC2 vs. Temperature Current (uA) 15 12 9 6 3 0 -40 -20 0 20 40 60 80 Temperature (℃) Fig. 6-10 Graph on Typical Operating Current (ICC1 and ICC2) vs. Temperature Maximum ICC1 and ICC2 vs. Temperature 21 Current (uA) 18 15 12 9 6 -40 -20 0 20 40 60 80 Temperature (℃) Fig. 6-11 Graph on Maximum Operating Current (ICC1 and ICC2) vs. Temperature Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 39 EM78P157N 8-Bit Microcontroller with OTP ROM Current (mA) Typical ICC3 and ICC4 vs. Temperature 4 3.5 3 2.5 2 1.5 1 0.5 0 Typ ICC4 Typ ICC3 -40 -20 0 20 40 60 80 Temperature (℃) Fig. 6-12 Graph on Typical Operating Current (ICC3 and ICC4) vs. Temperature Maximum ICC3 and ICC4 vs. Temperature 4.5 Max ICC4 Current (mA) 4 3.5 3 2.5 Max ICC3 2 1.5 1 -40 -20 0 20 40 60 80 Temperature (℃) Fig. 6-13 Graph on Maximum Operating Current (ICC3 and ICC4) vs. Temperature 40 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 6.3.9 Typical and Maximum Standby Current (ISB1 and ISB2) vs. Temperature The following two conditions exist with the Standby Current ISB1 and ISB2: ISB1: VDD=5V, WDT disabled ISB2: VDD=5V, WDT enabled Typical ISB1 and ISB2 vs. Temperature 12 Current (uA) 10 Typ ISB2 8 6 4 Typ ISB1 2 0 -40 -20 0 20 40 60 80 Temperature (℃) Fig. 6-14 Graph on Typical Standby Current (ISB1 and ISB2) vs. Temperature Maximum ISB1 and ISB2 vs. Temperature Current (uA) 12 10 8 6 4 2 0 -40 -20 0 20 Temperature (℃) 40 60 80 Fig. 6-15 Graph on Maximum Standby Current (ISB1 and ISB2) vs. Temperature Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 41 EM78P157N 8-Bit Microcontroller with OTP ROM 6.3.10 Operating Voltage under Temperature Range of 0°C to 70°C and –40°C to 85°C Fig. 6-16 Graph on Operating Voltage under Temperature Range of 0°C to 70°C Fig. 6-17 Graph on Operating Voltage under Temperature Range of –40°C to 85°C 42 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM 6.3.11 Operating Current Range (Based on High and Low Freq. @ =25℃) vs. Voltage EM78P157N HXT V-I 2.5 2.25 2 I(mA) 1.75 1.5 1.25 1 0.75 0.5 0.25 0 2.3 2.8 3.3 3.8 4.3 4.8 5.3 Voltage(V) Fig. 34 Operating Current Range (Based on High Freq. @ =25℃) vs. Voltage EM78P157N LXT V-I 40 35 30 I(uA) 25 20 15 10 5 0 2.3 2.8 3.3 3.8 4.3 4.8 5.3 Voltage(V) Fig. 35 Operating Current Range (Based on Low Freq. @ =25℃) vs. Voltage Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 43 EM78P157N 8-Bit Microcontroller with OTP ROM APPENDIX A Package Types OTP MCU Package Type Pin Count Package Size EM78P157NBP DIP 14 300 mil EM78P157NBM SOP 14 150 mil EM78P157NAP DIP 18 300 mil EM78P157NAM SOP 18 300 mil EM78P157NAAS SSOP 20 209 mil EM78P157NAKM SSOP 20 209 mil A.1 Package Detailed Information A.1.1 44 • 14-Lead Plastic Dual in line (PDIP) — 300 Mil Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM A.1.2 14-Lead Plastic Small Outline (SOP) — 150 Mil Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 45 EM78P157N 8-Bit Microcontroller with OTP ROM A.1.3 46 • 18-Lead Plastic Dual in Line (PDIP) — 300 Mil Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM A.1.4 18-Lead Plastic Small Outline (SOP) — 300 Mil Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) • 47 EM78P157N 8-Bit Microcontroller with OTP ROM A.1.5 48 • 20-Lead Plastic Small Outline (SSOP) — 209 Mil Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) EM78P157N 8-Bit Microcontroller with OTP ROM B Quality Assurance and Reliability Test Category Solderability Test Conditions Remarks Solder temperature=245±5℃，for 5 seconds up to the stopper using a rosin-type flux Step1: TCT ，65℃(15mins)~150℃(15mins)，10 cycles For SMD IC(such as SOP, QFP, SOJ, etc.) Step2: bake 125℃，TD(durance)=24 hrs Pre-condition Step3:soak 30°C /60%，TD(durance)=192hrs Step4:IR flow 3cycles (Pkg thickness≧2.5mm or Pkg volume≧350mm3 ----225±5℃) (Pkg thickness≦2.5mm or Pkg volume≦350mm3 ----240±5℃) Temperature cycle test –65℃(15mins)~150℃(15mins) , 200 cycles Pressure cooker test TA =121℃,RH=100%,pressure=2atm, TD(durance)= 96 Hrs High temperature /high humidity test TA=85℃ , RH=85%，TD(durance)=168 ,500 Hrs High-temperature storage life TA=150℃, TD(durance)=500,1000Hrs High-temperature operating life TA=125 ℃ , VCC=Max. operating voltage, TD(durance) =168,500,1000Hrs Latch-up TA=25℃, VCC=Max. operating voltage, 150mA/20V ESD(HBM) TA=25℃, ≧∣±3KV∣ ESD(MM) TA=25℃, ≧∣±300V∣ Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice) IP_ND,OP_ND,IO_ND IP_NS,OP_NS,IO_NS IP_PD,OP_PD,IO_PD, IP_PS,OP_PS,IO_PS, VDD-VSS(+),VDD_V SS(-)mode • 49 EM78P157N 8-Bit Microcontroller with OTP ROM C Address Trap Detect An address trap detect is one of the fail-safe function that detects CPU malfunction caused by noise or the like. If the CPU attempts to fetch an instruction from a part of RAM, an internal recovery circuit will auto started. Until CPU got the correct function, it will execute the next program that follows. Vdd Tvr /Reset Tvd Internal POR Tpor Power on Reset Symbol Parameter Condition Min. Typ. Max. Unit Tpor Power on reset time Vdd = 5V, -40℃ to 85℃ 10.5 16.8 22 ms Tvd Vdd Voltage drop time Vdd = 5V, -40℃ to 85℃ - - 1* us Tvr Vdd Voltage rise time Vdd = 5V, -40℃ to 85℃ - - 1** us * Tvd is the period of Vdd voltage less than POR voltage 1.9 volts. ** Tvr is the period of Vdd voltage higher than 5.5 volts. 50 • Product Specification (V1.0) 09.22.2005 (This specification is subject to change without further notice)