AD ADG411 Lc2mos precision quad spst switch Datasheet

a
FEATURES
44 V Supply Maximum Ratings
615 V Analog Signal Range
Low On Resistance (<35 V)
Ultralow Power Dissipation (35 mW)
Fast Switching Times
tON <175 ns
tOFF <145 ns
TTL/CMOS Compatible
Plug-In Replacement for DG411/DG412/DG413
APPLICATIONS
Audio and Video Switching
Automatic Test Equipment
Precision Data Acquisition
Battery Powered Systems
Sample Hold Systems
Communication Systems
LC2MOS
Precision Quad SPST Switches
ADG411/ADG412/ADG413
FUNCTIONAL BLOCK DIAGRAMS
S1
IN1
S1
IN1
D1
S2
IN2
D1
S2
IN2
ADG411
D2
S3
IN3
ADG412
D2
S3
IN3
D3
S4
IN4
D3
S4
IN4
D4
D4
S1
IN1
D1
S2
IN2
ADG413
D2
S3
IN3
D3
S4
GENERAL DESCRIPTION
The ADG411, ADG412 and ADG413 are monolithic CMOS
devices comprising four independently selectable switches. They
are designed on an enhanced LC2MOS process which provides
low power dissipation yet gives high switching speed and low on
resistance.
The on resistance profile is very flat over the full analog input
range ensuring excellent linearity and low distortion when
switching audio signals. Fast switching speed coupled with high
signal bandwidth also make the parts suitable for video signal
switching. CMOS construction ensures ultralow power dissipation making the parts ideally suited for portable and battery
powered instruments.
The ADG411, ADG412 and ADG413 contain four independent SPST switches. The ADG411 and ADG412 differ only in
that the digital control logic is inverted. The ADG411 switches
are turned on with a logic low on the appropriate control input,
while a logic high is required for the ADG412. The ADG413
has two switches with digital control logic similar to that of the
ADG411 while the logic is inverted on the other two switches.
Each switch conducts equally well in both directions when ON
and each has an input signal range that extends to the supplies.
In the OFF condition, signal levels up to the supplies are
blocked. All switches exhibit break-before-make switching action for use in multiplexer applications. Inherent in the design is
low charge injection for minimum transients when switching the
digital inputs.
IN4
D4
SWITCHES SHOWN FOR A LOGIC "1" INPUT
PRODUCT HIGHLIGHTS
1. Extended Signal Range
The ADG411, ADG412 and ADG413 are fabricated on an
enhanced LC 2MOS, giving an increased signal range which
extends fully to the supply rails.
2. Ultralow Power Dissipation
3. Low RON
4. Break-Before-Make Switching
This prevents channel shorting when the switches are
configured as a multiplexer.
5. Single Supply Operation
For applications where the analog signal is unipolar, the
ADG411, ADG412 and ADG413 can be operated from a
single rail power supply. The parts are fully specified with a
single +12 V power supply and will remain functional with
single supplies as low as +5 V.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
World Wide Web Site: http://www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 1998
ADG411/ADG412/ADG413–SPECIFICATIONS1
Dual Supply
(VDD = +15 V 6 10%, VSS = –15 V 6 10%, VL = +5 V 6 10%, GND = 0 V, unless otherwise noted)
Parameter
ANALOG SWITCH
Analog Signal Range
RON
LEAKAGE CURRENTS
Source OFF Leakage IS (OFF)
Drain OFF Leakage ID (OFF)
Channel ON Leakage ID, IS (ON)
B Version
–408C to
+258C +858C
T Version
–558C to
+258C
+1258C
VDD to VSS
25
35
± 0.1
± 0.25
± 0.1
± 0.25
± 0.1
± 0.4
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
0.005
DYNAMIC CHARACTERISTICS2
tON
110
45
±5
±5
± 10
25
35
± 0.1
± 0.25
± 0.1
± 0.25
± 0.1
± 0.4
2.4
0.8
± 0.5
0.005
Units
Test Conditions/Comments
VDD to VSS V
Ω typ
45
Ω max
VD = ± 8.5 V, IS = –10 mA;
VDD = +13.5 V, VSS = –13.5 V
± 40
2.4
0.8
V min
V max
± 0.5
µA typ
µA max
VIN = VINL or VINH
RL = 300 Ω, C L = 35 pF;
VS = ± 10 V; Test Circuit 4
RL = 300 Ω, C L = 35 pF;
VS = ± 10 V; Test Circuit 4
RL = 300 Ω, C L = 35 pF;
VS1 = VS2 = +10 V;
Test Circuit 5
VS = 0 V, RS = 0 Ω, CL = 10 nF;
Test Circuit 6
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
Test Circuit 7
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
Test Circuit 8
f = 1 MHz
f = 1 MHz
f = 1 MHz
± 20
± 20
110
Break-Before-Make Time Delay, tD 25
(ADG413 Only)
25
ns typ
ns max
ns typ
ns max
ns typ
Charge Injection
5
5
pC typ
OFF Isolation
68
68
dB typ
Channel-to-Channel Crosstalk
85
85
dB typ
CS (OFF)
CD (OFF)
CD, CS (ON)
9
9
35
9
9
35
pF typ
pF typ
pF typ
175
tOFF
100
175
100
145
145
POWER REQUIREMENTS
IDD
ISS
IL
0.0001
1
0.0001
1
0.0001
1
5
5
5
0.0001
1
0.0001
1
0.0001
1
VDD = +16.5 V, VSS = –16.5 V
VD = ± 15.5 V, VS = 715.5 V;
Test Circuit 2
VD = ± 15.5 V, VS = 715.5 V;
Test Circuit 2
VD = VS = ± 15.5 V;
Test Circuit 3
nA typ
nA max
nA typ
nA max
nA typ
nA max
5
5
5
µA typ
µA max
µA typ
µA max
µA typ
µA max
VDD = +16.5 V, VSS = –16.5 V
Digital Inputs = 0 V or 5 V
NOTES
1
Temperature ranges are as follows: B Versions: –40 °C to +85°C; T Versions: –55°C to +125°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–2–
REV. A
ADG411/ADG412/ADG413
Single Supply (V
DD
= +12 V 6 10%, VSS = 0 V, VL = +5 V 6 10%, GND = 0 V, unless otherwise noted)
B Version
–408C to
+258C +858C
Parameter
ANALOG SIGNAL RANGE
RON
LEAKAGE CURRENTS
Source OFF Leakage IS (OFF)
Drain OFF Leakage ID (OFF)
Channel ON Leakage ID, IS (ON)
T Version
–558C to
+258C
+1258C
0 V to VDD
40
80
± 0.1
± 0.25
± 0.1
± 0.25
± 0.1
± 0.4
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
0.005
DYNAMIC CHARACTERISTICS2
tON
175
100
±5
±5
± 10
40
80
± 0.1
± 0.25
± 0.1
± 0.25
± 0.1
± 0.4
2.4
0.8
± 0.5
0.005
Units
Test Conditions/Comments
0 V to VDD V
Ω typ
100
Ω max
0 < VD = 8.5 V, IS = –10 mA;
VDD = +10.8 V
± 40
2.4
0.8
V min
V max
± 0.5
µA typ
µA max
VIN = VINL or VINH
RL = 300 Ω, C L = 35 pF;
VS = +8 V; Test Circuit 4
RL = 300 Ω, C L = 35 pF;
VS = +8 V; Test Circuit 4
RL = 300 Ω, C L = 35 pF;
VS1 = VS2 = +10 V;
Test Circuit 5
VS = 0 V, RS = 0 Ω, CL = 10 nF;
Test Circuit 6
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
Test Circuit 7
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
Test Circuit 8
f = 1 MHz
f = 1 MHz
f = 1 MHz
± 20
± 20
175
Break-Before-Make Time Delay, tD 25
(ADG413 Only)
25
ns typ
ns max
ns typ
ns max
ns typ
Charge Injection
25
25
pC typ
OFF Isolation
68
68
dB typ
Channel-to-Channel Crosstalk
85
85
dB typ
CS (OFF)
CD (OFF)
CD, CS (ON)
9
9
35
9
9
35
pF typ
pF typ
pF typ
250
95
tOFF
250
95
125
125
POWER REQUIREMENTS
0.0001
1
0.0001
1
IDD
IL
5
5
0.0001
1
0.0001
1
VDD = +13.2 V
VD = 12.2/1 V, VS = 1/12.2 V;
Test Circuit 2
VD = 12.2/1 V, VS = 1/12.2 V;
Test Circuit 2
VD = VS = +12.2 V/+1 V;
Test Circuit 3
nA typ
nA max
nA typ
nA max
nA typ
nA max
µA typ
µA max
µA typ
µA max
5
5
VDD = +13.2 V
Digital Inputs = 0 V or 5 V
VL = +5.25 V
NOTES
1
Temperature ranges are as follows: B Versions: –40 °C to +85°C; T Versions: –55°C to +125°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
Truth Table (ADG411/ADG412)
Truth Table (ADG413)
ADG411 In
ADG412 In
Switch Condition
Logic
Switch 1, 4
Switch 2, 3
0
1
1
0
ON
OFF
0
1
OFF
ON
ON
OFF
REV. A
–3–
ADG411/ADG412/ADG413
ABSOLUTE MAXIMUM RATINGS 1
TERMINOLOGY
(TA = +25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
VL to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Analog, Digital Inputs2 . . . . . . . . . . . VSS –2 V to V DD +2 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300°C
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 117°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 77°C/W
TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 115°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 35°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
VDD
VSS
VL
GND
S
D
IN
RON
IS (OFF)
ID (OFF)
ID, IS (ON)
VD (VS)
CS (OFF)
CD (OFF)
CD, CS (ON)
tON
tOFF
tD
Crosstalk
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Off Isolation
Charge
Injection
ORDERING GUIDE
l
PIN CONFIGURATION
(DIP/SOIC)
2
Model
Temperature Range
Package Option
ADG411BN
ADG411BR
ADG411TQ
ADG411BRU
ADG412BN
ADG412BR
ADG412TQ
ADG413BN
ADG413BR
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
–40°C to +85°C
–40°C to +85°C
N-16
R-16A
Q-16
RU-16
N-16
R-16A
Q-16
N-16
R-16A
Most positive power supply potential.
Most negative power supply potential in dual
supplies. In single supply applications, it may
be connected to GND.
Logic power supply (+5 V).
Ground (0 V) reference.
Source terminal. May be an input or output.
Drain terminal. May be an input or output.
Logic control input.
Ohmic resistance between D and S.
Source leakage current with the switch “OFF.”
Drain leakage current with the switch “OFF.”
Channel leakage current with the switch “ON.”
Analog voltage on terminals D, S.
“OFF” switch source capacitance.
“OFF” switch drain capacitance.
“ON” switch capacitance.
Delay between applying the digital control
input and the output switching on.
Delay between applying the digital control
input and the output switching off.
“OFF” time or “ON” time measured between
the 90% points of both switches, when switching
from one address state to another.
A measure of unwanted signal which is coupled
through from one channel to another as a result
of parasitic capacitance.
A measure of unwanted signal coupling
through an “OFF” switch.
A measure of the glitch impulse transferred
from the digital input to the analog output
during switching.
IN1 1
16
IN2
D1 2
15
D2
14
S2
S1 3
ADG411
ADG412
ADG413
VDD
TOP VIEW
GND 5 (Not to Scale) 12 VL
S4 6
11 S3
VSS 4
NOTES
1
To order MIL-STD-883, Class B processed parts, add /883B to T grade part
numbers.
2
N = Plastic DIP; R = 0.15" Small Outline IC (SOIC); RU= Thin Shrink Small
Outline (TSSOP); Q = Cerdip.
D4 7
10
D3
IN4 8
9
IN3
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG411/ADG412/ADG413 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
–4–
13
WARNING!
ESD SENSITIVE DEVICE
REV. A
ADG411/ADG412/ADG413
Typical Performance Graphs
50
50
TA = +258C
VL = +5V
TA = +258C
VL = +5V
40
40
VDD = +5V
VSS = 0V
30
VDD = +10V
VSS = –10V
RON – V
RON – V
VDD = +5V
VSS = –5V
VDD = +12V
VSS = –12V
20
30
VDD = +10V
VSS = 0V
20
10
10
VDD = +15V
VSS = 0V
VDD = +15V
VSS = –15V
0
–20
VDD = +12V
VSS = 0V
0
–10
0
10
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
0
20
5
10
15
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
20
Figure 4. On Resistance as a Function of VD (VS ) Single
Supply
Figure 1. On Resistance as a Function of VD (V S) Dual
Supplies
50
100mA
VDD = +15V
VSS = –15V
VL = +5V
40
10mA
VDD = +15V
VSS = –15V
VL = +5V
4 SW
1 SW
I+, I–
ISUPPLY
RON – V
1mA
30
+1258C
20
100mA
+858C
10mA
+258C
IL
10
1mA
0
–20
–10
0
10
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
100nA
10
20
Figure 2. On Resistance as a Function of VD (V S) for
Different Temperatures
0.04
LEAKAGE CURRENT – nA
LEAKAGE CURRENT – nA
VDD = +15V
VSS = –15V
VL = +5V
VS = 615V
VD = 615V
IS (OFF)
0.1
ID (OFF)
0.01
0.001
100
ID (ON)
1k
10k
100k
1M
FREQUENCY – Hz
10M
0.02
1M
10M
VDD = +15V
VSS = –15V
TA = +258C
VL = +5V
ID (ON)
IS (OFF)
0.00
ID (OFF)
–0.02
–0.04
–20
10M
Figure 3. Leakage Currents as a Function of Temperature
REV. A
1k
10k
100k
FREQUENCY – Hz
Figure 5. Supply Current vs. Input Switching Frequency
10
1
100
0
10
–10
VD OR VS – DRAIN OR SOURCE VOLTAGE – V
20
Figure 6. Leakage Currents as a Function of V D (V S)
–5–
ADG411/ADG412/ADG413
APPLICATION
120
VDD = +15V
VSS = –15V
VL = +5V
Figure 9 illustrates a precise, fast, sample-and-hold circuit. An
AD845 is used as the input buffer while the output operational
amplifier is an AD711. During the track mode, SW1 is closed
and the output VOUT follows the input signal VIN. In the hold
mode, SW1 is opened and the signal is held by the hold capacitor CH.
OFF ISOLATION – dB
100
80
Due to switch and capacitor leakage, the voltage on the hold
capacitor will decrease with time. The ADG411/ADG412/
ADG413 minimizes this droop due to its low leakage specifications. The droop rate is further minimized by the use of a polystyrene hold capacitor. The droop rate for the circuit shown is
typically 30 µV/µs.
60
40
100
1k
10k
100k
FREQUENCY – Hz
1M
10M
Figure 7. Off Isolation vs. Frequency
110
VDD = +15V
VSS = –15V
VL = +5V
CROSSTALK – dB
100
A second switch, SW2, which operates in parallel with SW1, is
included in this circuit to reduce pedestal error. Since both
switches will be at the same potential, they will have a differential effect on the op amp AD711, which will minimize charge
injection effects. Pedestal error is also reduced by the compensation network RC and CC. This compensation network also reduces the hold time glitch while optimizing the acquisition time.
Using the illustrated op amps and component values, the pedestal error has a maximum value of 5 mV over the ± 10 V input
range. Both the acquisition and settling times are 850 ns.
90
+15V
+5V
2200pF
80
+15V
SW1
+15V
VIN
70
D
SW2
AD845
60
100
S
S
D
–15V
1k
10k
100k
FREQUENCY – Hz
1M
10M
RC
75V
CC
1000pF
CH
2200pF
AD711
VOUT
–15V
ADG411
ADG412
ADG413
Figure 8. Crosstalk vs. Frequency
–15V
Figure 9. Fast, Accurate Sample-and-Hold
–6–
REV. A
ADG411/ADG412/ADG413
Test Circuits
IDS
V1
S
VS
S
A
D
S
A
VD
VS
RON = V1/IDS
Test Circuit 1. On Resistance
ID (ON)
ID (OFF)
IS (OFF)
D
+15V
Test Circuit 3. On Leakage
+5V
0.1mF
0.1mF
3V
VS
VDD
VL
S
D
VIN
ADG411
VIN
ADG412
VOUT
RL
300V
IN
50%
50%
50%
50%
3V
CL
35pF
90%
90%
VOUT
VSS
GND
0.1mF
–15V
tON
tOFF
Test Circuit 4. Switching Times
+15V
+5V
0.1mF
0.1mF
3V
VDD
VS1
VS2
VIN
VL
S1
D1
S2
D2
RL2
300V
IN1, IN2
VIN
GND
50%
0V
VOUT1
VOUT2
RL1
300V
50%
90%
90%
VOUT1
CL1
35pF
0V
CL2
35pF
VSS
90%
VOUT2
90%
0V
tD
0.1mF
–15V
tD
Test Circuit 5. Break-Before-Make Time Delay
RS
VS
+15V
+5V
VDD
VL
S
D
3V
VOUT
VIN
CL
10nF
IN
GND
VSS
VOUT
Test Circuit 6. Charge Injection
REV. A
DVOUT
QINJ = CL 3 DVOUT
–15V
–7–
A
VD
VS
Test Circuit 2. Off Leakage
D
ADG411/ADG412/ADG413
+15V
+5V
VDD
VL
S
D
0.1mF
VDD
VL
S
D
50V
VOUT
RL
50V
VS
+5V
0.1mF
0.1mF
VIN1
VS
VIN2
IN
VIN
VOUT
VSS
GND
RL
50V
D
S
GND
VSS
0.1mF
–15V
NC
CHANNEL TO CHANNEL
CROSSTALK = 20 3 LOG VS/VOUT
0.1mF
–15V
Test Circuit 7. Off Isolation
C1748a–3–2/98
+15V
0.1mF
Test Circuit 8. Channel-to-Channel Crosstalk
MECHANICAL INFORMATION
Dimensions are shown in inches and (mm).
16-Lead Cerdip
(Q-16)
0.080 (2.03) MAX
16
9
1
8
0.3937 (10.00)
0.3859 (9.80)
0.310 (7.87)
0.220 (5.59)
PIN 1
0.060 (1.52)
0.015 (0.38)
0.840 (21.34) MAX
0.200 (5.08)
MAX
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.100
(2.54)
BSC
0.150
(3.81)
MIN
SEATING
0.070 (1.78)
PLANE
0.030 (0.76)
0.1574 (4.00)
0.1497 (3.80)
0.320 (8.13)
0.290 (7.37)
16
9
1
8
0.015 (0.38)
0.008 (0.20)
0.0500
SEATING (1.27)
PLANE BSC
0.840 (21.34)
0.745 (18.92)
8
0.280 (7.11)
0.240 (6.10)
0.060 (1.52)
0.015 (0.38)
0.130
(3.30)
MIN
0.100
(2.54)
BSC
0.070 (1.77) SEATING
0.045 (1.15) PLANE
16
0.325 (8.26)
0.300 (7.62) 0.195 (4.95)
0.115 (2.93)
0.015 (0.381)
0.008 (0.204)
9
0.256 (6.50)
0.246 (6.25)
1
0.177 (4.50)
0.169 (4.30)
9
0.022 (0.558)
0.014 (0.356)
88
0.0099 (0.25) 08 0.0500 (1.27)
0.0160 (0.41)
0.0075 (0.19)
0.0192 (0.49)
0.0138 (0.35)
0.201 (5.10)
0.193 (4.90)
16
PIN 1
0.0196 (0.50)
x 458
0.0099 (0.25)
16-Lead TSSOP
(RU-16)
16-Lead Plastic DIP (Narrow)
(N-16)
0.210 (5.33)
MAX
0.160 (4.06)
0.115 (2.93)
0.0688 (1.75)
0.0532 (1.35)
PIN 1
0.0098 (0.25)
0.0040 (0.10)
15°
0°
0.2440 (6.20)
0.2284 (5.80)
1
PRINTED IN U.S.A.
0.005 (0.13) MIN
16-Lead SOIC
(R-16A)
8
PIN 1
0.006 (0.15)
0.002 (0.05)
0.0256
SEATING (0.65)
PLANE BSC
–8–
0.0433
(1.10)
MAX
0.0118 (0.30)
0.0075 (0.19)
8°
0°
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
REV. A