ON MCR22-6G Sensitive gate silicon controlled rectifier Datasheet

MCR22-6, MCR22-8
Preferred Device
Sensitive Gate
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed and tested for repetitive peak operation required for CD
ignition, fuel ignitors, flash circuits, motor controls and low−power
switching applications.
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Features
•
•
•
•
•
SCRs
1.5 AMPERES RMS
400 thru 600 VOLTS
150 A for 2 ms Safe Area
High dv/dt
Very Low Forward “On” Voltage at High Current
Low−Cost TO−226 (TO−92)
Pb−Free Packages are Available*
G
A
K
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Peak Repetitive Off−State Voltage (Note 1)
(RGK = IK, TJ = *40 to +110°C, Sine Wave,
MCR22−6
50 to 60 Hz, RGK = 1kW)
MCR22−8
VDRM,
VRRM
On−State Current RMS
(180° Conduction Angles, TC = 80°C)
IT(RMS)
Peak Non−repetitive Surge Current,
@TA = 25°C, (1/2 Cycle, Sine Wave, 60 Hz)
Value
Unit
V
400
600
1.5
A
ITSM
15
A
I2t
0.9
A2s
PGM
0.5
W
PG(AV)
0.1
W
Forward Peak Gate Current
(Pulse Width ≤ 1.0 ms, TA = 25°C)
IFGM
0.2
A
Reverse Peak Gate Voltage
(Pulse Width ≤ 1.0 ms, TA = 25°C)
VRGM
5.0
V
Operating Junction Temperature Range
@ Rated VRRM and VDRM
TJ
−40 to +110
°C
Storage Temperature Range
Tstg
−40 to +150
°C
Symbol
Max
Unit
Circuit Fusing Considerations (t = 8.3 ms)
Forward Peak Gate Power
(Pulse Width ≤ 1.0 msec, TA = 25°C)
Forward Average Gate Power
(t = 8.3 msec, TA = 25°C)
3
STRAIGHT LEAD
BULK PACK TO−92 (TO−226)
CASE 029
STYLE 10
Thermal Resistance, Junction−to−Case
RqJC
50
°C/W
Thermal Resistance, Junction−to−Ambient
RqJA
160
°C/W
TL
+260
°C
Lead Solder Temperature
(Lead Length q 1/16″ from case, 10 S Max)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2008
November, 2008 − Rev. 6
1
2
3
BENT LEAD
TAPE & REEL
AMMO PACK
MARKING DIAGRAMS
MCR
22−x
AYWW G
G
MCR22−x = Device Code
x = 6 or 8
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
THERMAL CHARACTERISTICS
Characteristic
1
12
(Note: Microdot may be in either location)
PIN ASSIGNMENT
1
Cathode
2
Gate
3
Anode
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MCR22−6/D
MCR22−6, MCR22−8
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
−
−
−
−
10
200
mA
mA
VTM
−
1.2
1.7
V
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
(VAK = Rated VDRM or VRRM; RGK = 1 kW)
TC = 25°C
TC = 110°C
IDRM, IRRM
ON CHARACTERISTICS
Peak Forward On−State Voltage (Note 2)
(ITM = 1 A Peak)
Gate Trigger Current (Continuous dc) (Note 3)
(VAK = 6 Vdc, RL = 100 W)
TC = 25°C
TC = −40°C
IGT
−
−
30
−
200
500
mA
Gate Trigger Voltage (Continuous dc) (Note 3)
(VAK = 7 Vdc, RL = 100 W)
TC = 25°C
TC = −40°C
VGT
−
−
−
−
0.8
1.2
V
Gate Non−Trigger Voltage
(VAK = 12 Vdc, RL = 100 W)
TC = 110°C
VGD
0.1
−
−
V
Holding Current
(VAK = 12 Vdc, RGK = 1kW)
Initiating Current = 20 mA
TC = 25°C
TC = −40°C
−
−
2.0
−
5.0
10
−
25
−
IH
mA
DYNAMIC CHARACTERISTICS
dv/dt
Critical Rate of Rise of Off−State Voltage (RGK = 1kW)
(TC = 110°C)
V/ms
2. Pulse Width = 1.0 ms, Duty Cycle v 1%.
3. RGK Current not included in measurement.
Voltage Current Characteristic of SCR
+ Current
Symbol
Parameter
Anode +
VTM
VDRM
Peak Repetitive Off State Forward Voltage
IDRM
Peak Forward Blocking Current
VRRM
Peak Repetitive Off State Reverse Voltage
IRRM
Peak Reverse Blocking Current
VTM
Peak on State Voltage
IH
Holding Current
on state
IRRM at VRRM
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode −
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2
IH
+ Voltage
IDRM at VDRM
Forward Blocking Region
(off state)
MCR22−6, MCR22−8
TA , MAXIMUM ALLOWABLE AMBIENT TEMPERATURE (° C)
TC , MAXIMUM ALLOWABLE CASE TEMPERATURE (° C)
CURRENT DERATING
140
100
α = 180°
α = CONDUCTION
ANGLE
60
dc
20
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
120
100
80
60
dc
40
α = 180°
α = CONDUCTION ANGLE
20
0
0
0.2
0.4
3.0
TJ = 110°C
25°C
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0
0.5
0.8
Figure 2. Maximum Ambient Temperature
5.0
2.0
0.6
IT(AV), AVERAGE ON-STATE CURRENT (AMP)
Figure 1. Maximum Case Temperature
I T , INSTANTANEOUS ON‐STATE CURRENT (AMP)
0
140
1.0
1.5
2.0
VT, INSTANTANEOUS ON-STATE VOLTAGE
(VOLTS)
Figure 3. Typical Forward Voltage
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3
2.5
1.0
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0.1
0.2
0.5
1.0
2.0
5.0
10
20
50
100
200
500
1000
2000
5000
10000
t, TIME (ms)
Figure 4. Thermal Response
TYPICAL CHARACTERISTICS
100
I GT GATE TRIGGER CURRENT ( μA)
VAK = 7.0 V
RL = 100
0.7
0.6
0.5
0.4
0.3
-75
-50
-25
0
25
50
100 110
75
50
30
20
10
5.0
3.0
2.0
1.0
-40
-20
0
20
40
60
80
100 110
TJ, JUNCTION TEMPERATURE (°C)
TJ JUNCTION TEMPERATURE (°C)
Figure 5. Typical Gate Trigger Voltage
Figure 6. Typical Gate Trigger Current
P(AV) MAXIMUM AVERAGE POWER DISSIPATION (WATTS)
VGT, GATE TRIGGER VOLTAGE (VOLTS)
0.8
2.0
10
1.8
I H , HOLDING CURRENT (mA)
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
MCR22−6, MCR22−8
1.6
VAK = 12 V
RL = 100 W
30°
1.4
5.0
60°
90°
120
°
180°
1.2
1.0
dc
0.8
0.6
2.0
0.4
0.2
1.0
-40
-20
0
20
40
60
80
100 110
0
0
0.2
0.4
0.6
0.8
1.0
1.2
TJ, JUNCTION TEMPERATURE (°C)
IT(AV), AVERAGE ON-STATE CURRENT (AMPS)
Figure 7. Typical Holding Current
Figure 8. Power Dissipation
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4
1.4
1.6
MCR22−6, MCR22−8
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H2A
H2B
H2B
H
W2
H4 H5
T1
L1
H1
W1 W
L
T
T2
F1
F2
P2
D
P2
P1
P
Figure 9. Device Positioning on Tape
Specification
Inches
Item
Tape Feedhole Diameter
Component Lead Thickness Dimension
Component Lead Pitch
Millimeter
Symbol
Min
Max
Min
Max
D
0.1496
0.1653
3.8
4.2
D2
0.015
0.020
0.38
0.51
F1, F2
0.0945
0.110
2.4
2.8
Bottom of Component to Seating Plane
H
.059
.156
1.5
4.0
Feedhole Location
H1
0.3346
0.3741
8.5
9.5
Deflection Left or Right
H2A
0
0.039
0
1.0
Deflection Front or Rear
H2B
0
0.051
0
1.0
Feedhole to Bottom of Component
H4
0.7086
0.768
18
19.5
Feedhole to Seating Plane
H5
0.610
0.649
15.5
16.5
Defective Unit Clipped Dimension
L
0.3346
0.433
8.5
11
Lead Wire Enclosure
L1
0.09842
−
2.5
−
Feedhole Pitch
P
0.4921
0.5079
12.5
12.9
Feedhole Center to Center Lead
P1
0.2342
0.2658
5.95
6.75
First Lead Spacing Dimension
P2
0.1397
0.1556
3.55
3.95
Adhesive Tape Thickness
T
0.06
0.08
0.15
0.20
Overall Taped Package Thickness
T1
−
0.0567
−
1.44
Carrier Strip Thickness
T2
0.014
0.027
0.35
0.65
Carrier Strip Width
W
0.6889
0.7481
17.5
19
Adhesive Tape Width
W1
0.2165
0.2841
5.5
6.3
Adhesive Tape Position
W2
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
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5
MCR22−6, MCR22−8
ORDERING & SHIPPING INFORMATION: MCR22 Series Packaging Options, Device Suffix
U.S.
Europe
Equivalent
MCR22−8RL1
MCR22−8RL1G
Shipping†
2000 / Tape & Reel
Description of TO−92 Tape Orientation
Flat side of TO−92 and adhesive tape visible
MCR22−6
MCR22−6G
MCR22−8
5000 Units / Box
N/A, Bulk
MCR22−8G
MCR22−6RLRA
MCR22−6RLRAG
MCR22−6RLRP
MCR22−6RLRPG
2000 / Tape & Reel
2000 / Tape & Ammo Pack
Round side of TO−92 and adhesive tape visible
Flat side of TO−92 and adhesive tape visible
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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6
MCR22−6, MCR22−8
PACKAGE DIMENSIONS
TO−92 (TO−226)
CASE 29−11
ISSUE AM
A
B
STRAIGHT LEAD
BULK PACK
R
P
L
SEATING
PLANE
K
D
X X
G
J
H
V
C
SECTION X−X
N
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
DIM
A
B
C
D
G
H
J
K
L
N
P
R
V
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500
--0.250
--0.080
0.105
--0.100
0.115
--0.135
---
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70
--6.35
--2.04
2.66
--2.54
2.93
--3.43
---
N
A
R
BENT LEAD
TAPE & REEL
AMMO PACK
B
P
T
SEATING
PLANE
G
K
D
X X
J
V
1
C
N
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
DIM
A
B
C
D
G
J
K
N
P
R
V
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.40
0.54
2.40
2.80
0.39
0.50
12.70
--2.04
2.66
1.50
4.00
2.93
--3.43
---
STYLE 10:
PIN 1. CATHODE
2. GATE
3. ANODE
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MCR22−6/D
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