MCR22-6, MCR22-8 Preferred Device Sensitive Gate Silicon Controlled Rectifiers Reverse Blocking Thyristors Designed and tested for repetitive peak operation required for CD ignition, fuel ignitors, flash circuits, motor controls and low−power switching applications. http://onsemi.com Features • • • • • SCRs 1.5 AMPERES RMS 400 thru 600 VOLTS 150 A for 2 ms Safe Area High dv/dt Very Low Forward “On” Voltage at High Current Low−Cost TO−226 (TO−92) Pb−Free Packages are Available* G A K MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Peak Repetitive Off−State Voltage (Note 1) (RGK = IK, TJ = *40 to +110°C, Sine Wave, MCR22−6 50 to 60 Hz, RGK = 1kW) MCR22−8 VDRM, VRRM On−State Current RMS (180° Conduction Angles, TC = 80°C) IT(RMS) Peak Non−repetitive Surge Current, @TA = 25°C, (1/2 Cycle, Sine Wave, 60 Hz) Value Unit V 400 600 1.5 A ITSM 15 A I2t 0.9 A2s PGM 0.5 W PG(AV) 0.1 W Forward Peak Gate Current (Pulse Width ≤ 1.0 ms, TA = 25°C) IFGM 0.2 A Reverse Peak Gate Voltage (Pulse Width ≤ 1.0 ms, TA = 25°C) VRGM 5.0 V Operating Junction Temperature Range @ Rated VRRM and VDRM TJ −40 to +110 °C Storage Temperature Range Tstg −40 to +150 °C Symbol Max Unit Circuit Fusing Considerations (t = 8.3 ms) Forward Peak Gate Power (Pulse Width ≤ 1.0 msec, TA = 25°C) Forward Average Gate Power (t = 8.3 msec, TA = 25°C) 3 STRAIGHT LEAD BULK PACK TO−92 (TO−226) CASE 029 STYLE 10 Thermal Resistance, Junction−to−Case RqJC 50 °C/W Thermal Resistance, Junction−to−Ambient RqJA 160 °C/W TL +260 °C Lead Solder Temperature (Lead Length q 1/16″ from case, 10 S Max) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2008 November, 2008 − Rev. 6 1 2 3 BENT LEAD TAPE & REEL AMMO PACK MARKING DIAGRAMS MCR 22−x AYWW G G MCR22−x = Device Code x = 6 or 8 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package THERMAL CHARACTERISTICS Characteristic 1 12 (Note: Microdot may be in either location) PIN ASSIGNMENT 1 Cathode 2 Gate 3 Anode ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MCR22−6/D MCR22−6, MCR22−8 ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.) Characteristic Symbol Min Typ Max Unit − − − − 10 200 mA mA VTM − 1.2 1.7 V OFF CHARACTERISTICS Peak Repetitive Forward or Reverse Blocking Current (VAK = Rated VDRM or VRRM; RGK = 1 kW) TC = 25°C TC = 110°C IDRM, IRRM ON CHARACTERISTICS Peak Forward On−State Voltage (Note 2) (ITM = 1 A Peak) Gate Trigger Current (Continuous dc) (Note 3) (VAK = 6 Vdc, RL = 100 W) TC = 25°C TC = −40°C IGT − − 30 − 200 500 mA Gate Trigger Voltage (Continuous dc) (Note 3) (VAK = 7 Vdc, RL = 100 W) TC = 25°C TC = −40°C VGT − − − − 0.8 1.2 V Gate Non−Trigger Voltage (VAK = 12 Vdc, RL = 100 W) TC = 110°C VGD 0.1 − − V Holding Current (VAK = 12 Vdc, RGK = 1kW) Initiating Current = 20 mA TC = 25°C TC = −40°C − − 2.0 − 5.0 10 − 25 − IH mA DYNAMIC CHARACTERISTICS dv/dt Critical Rate of Rise of Off−State Voltage (RGK = 1kW) (TC = 110°C) V/ms 2. Pulse Width = 1.0 ms, Duty Cycle v 1%. 3. RGK Current not included in measurement. Voltage Current Characteristic of SCR + Current Symbol Parameter Anode + VTM VDRM Peak Repetitive Off State Forward Voltage IDRM Peak Forward Blocking Current VRRM Peak Repetitive Off State Reverse Voltage IRRM Peak Reverse Blocking Current VTM Peak on State Voltage IH Holding Current on state IRRM at VRRM Reverse Blocking Region (off state) Reverse Avalanche Region Anode − http://onsemi.com 2 IH + Voltage IDRM at VDRM Forward Blocking Region (off state) MCR22−6, MCR22−8 TA , MAXIMUM ALLOWABLE AMBIENT TEMPERATURE (° C) TC , MAXIMUM ALLOWABLE CASE TEMPERATURE (° C) CURRENT DERATING 140 100 α = 180° α = CONDUCTION ANGLE 60 dc 20 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IT(AV), AVERAGE ON-STATE CURRENT (AMPS) 120 100 80 60 dc 40 α = 180° α = CONDUCTION ANGLE 20 0 0 0.2 0.4 3.0 TJ = 110°C 25°C 1.0 0.7 0.5 0.3 0.2 0.1 0.07 0.05 0.03 0.02 0.01 0 0.5 0.8 Figure 2. Maximum Ambient Temperature 5.0 2.0 0.6 IT(AV), AVERAGE ON-STATE CURRENT (AMP) Figure 1. Maximum Case Temperature I T , INSTANTANEOUS ON‐STATE CURRENT (AMP) 0 140 1.0 1.5 2.0 VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS) Figure 3. Typical Forward Voltage http://onsemi.com 3 2.5 1.0 1.0 0.7 0.5 0.3 0.2 0.1 0.07 0.05 0.03 0.02 0.01 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000 2000 5000 10000 t, TIME (ms) Figure 4. Thermal Response TYPICAL CHARACTERISTICS 100 I GT GATE TRIGGER CURRENT ( μA) VAK = 7.0 V RL = 100 0.7 0.6 0.5 0.4 0.3 -75 -50 -25 0 25 50 100 110 75 50 30 20 10 5.0 3.0 2.0 1.0 -40 -20 0 20 40 60 80 100 110 TJ, JUNCTION TEMPERATURE (°C) TJ JUNCTION TEMPERATURE (°C) Figure 5. Typical Gate Trigger Voltage Figure 6. Typical Gate Trigger Current P(AV) MAXIMUM AVERAGE POWER DISSIPATION (WATTS) VGT, GATE TRIGGER VOLTAGE (VOLTS) 0.8 2.0 10 1.8 I H , HOLDING CURRENT (mA) r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) MCR22−6, MCR22−8 1.6 VAK = 12 V RL = 100 W 30° 1.4 5.0 60° 90° 120 ° 180° 1.2 1.0 dc 0.8 0.6 2.0 0.4 0.2 1.0 -40 -20 0 20 40 60 80 100 110 0 0 0.2 0.4 0.6 0.8 1.0 1.2 TJ, JUNCTION TEMPERATURE (°C) IT(AV), AVERAGE ON-STATE CURRENT (AMPS) Figure 7. Typical Holding Current Figure 8. Power Dissipation http://onsemi.com 4 1.4 1.6 MCR22−6, MCR22−8 TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL H2A H2A H2B H2B H W2 H4 H5 T1 L1 H1 W1 W L T T2 F1 F2 P2 D P2 P1 P Figure 9. Device Positioning on Tape Specification Inches Item Tape Feedhole Diameter Component Lead Thickness Dimension Component Lead Pitch Millimeter Symbol Min Max Min Max D 0.1496 0.1653 3.8 4.2 D2 0.015 0.020 0.38 0.51 F1, F2 0.0945 0.110 2.4 2.8 Bottom of Component to Seating Plane H .059 .156 1.5 4.0 Feedhole Location H1 0.3346 0.3741 8.5 9.5 Deflection Left or Right H2A 0 0.039 0 1.0 Deflection Front or Rear H2B 0 0.051 0 1.0 Feedhole to Bottom of Component H4 0.7086 0.768 18 19.5 Feedhole to Seating Plane H5 0.610 0.649 15.5 16.5 Defective Unit Clipped Dimension L 0.3346 0.433 8.5 11 Lead Wire Enclosure L1 0.09842 − 2.5 − Feedhole Pitch P 0.4921 0.5079 12.5 12.9 Feedhole Center to Center Lead P1 0.2342 0.2658 5.95 6.75 First Lead Spacing Dimension P2 0.1397 0.1556 3.55 3.95 Adhesive Tape Thickness T 0.06 0.08 0.15 0.20 Overall Taped Package Thickness T1 − 0.0567 − 1.44 Carrier Strip Thickness T2 0.014 0.027 0.35 0.65 Carrier Strip Width W 0.6889 0.7481 17.5 19 Adhesive Tape Width W1 0.2165 0.2841 5.5 6.3 Adhesive Tape Position W2 .0059 0.01968 .15 0.5 NOTES: 1. Maximum alignment deviation between leads not to be greater than 0.2 mm. 2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. 3. Component lead to tape adhesion must meet the pull test requirements. 4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. No more than 1 consecutive missing component is permitted. 7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. Splices will not interfere with the sprocket feed holes. http://onsemi.com 5 MCR22−6, MCR22−8 ORDERING & SHIPPING INFORMATION: MCR22 Series Packaging Options, Device Suffix U.S. Europe Equivalent MCR22−8RL1 MCR22−8RL1G Shipping† 2000 / Tape & Reel Description of TO−92 Tape Orientation Flat side of TO−92 and adhesive tape visible MCR22−6 MCR22−6G MCR22−8 5000 Units / Box N/A, Bulk MCR22−8G MCR22−6RLRA MCR22−6RLRAG MCR22−6RLRP MCR22−6RLRPG 2000 / Tape & Reel 2000 / Tape & Ammo Pack Round side of TO−92 and adhesive tape visible Flat side of TO−92 and adhesive tape visible †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 6 MCR22−6, MCR22−8 PACKAGE DIMENSIONS TO−92 (TO−226) CASE 29−11 ISSUE AM A B STRAIGHT LEAD BULK PACK R P L SEATING PLANE K D X X G J H V C SECTION X−X N 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G H J K L N P R V INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --0.250 --0.080 0.105 --0.100 0.115 --0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --6.35 --2.04 2.66 --2.54 2.93 --3.43 --- N A R BENT LEAD TAPE & REEL AMMO PACK B P T SEATING PLANE G K D X X J V 1 C N SECTION X−X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G J K N P R V MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 --2.04 2.66 1.50 4.00 2.93 --3.43 --- STYLE 10: PIN 1. CATHODE 2. GATE 3. ANODE ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MCR22−6/D