ETC2 GBPC5002W Glass passivated single phase bridge rectifier Datasheet

GBPC5002W thru GBPC5010W
Glass Passivated Single
Phase Bridge Rectifiers
Reverse Voltage 200 to 1000V
Forward Current 50 Amp
Features
Glass passivated die construction
Integrally molded heatsink provides
Very low thermal resistance for
Maximum heat dissipation
The plastic material used carries UL
flammability recognition 94V-0
High surge current capability
High temperature soldering guaranteed:
260℃ /10 seconds, 0.375” (9.5mm) lead
length, 5lbs. (2.3kg) tension
y
y
y
y
Circuit
~
Mechanical Data
Case: Molded plastic case
Terminals: Plated leads solderable per
+
-
y
MIL-STD-750, Method 2026
Polarity: Marked on Body
Mounting Position: Any
~
Module Type
TYPE
VRRM
VRSM
GBPC5002W
GBPC5004W
GBPC5006W
GBPC5008W
GBPC5010W
200V
400V
600V
800V
1000V
300V
500V
700V
900V
1100V
Maximum Ratings and Thermal Characteristics (TA = 25℃ unless otherwise noted)
Symbol
IF(AV)
Conditions
Maximum average forward output rectified current
Tc =55℃
Peak forward surge current single half sine-wave superimposed
on rated load (JEDEC Method)
IFSM
i2t
Visol
RθJC
Tj, TSTG
Weight
Rating for fusing (t<8.3ms)
a.c.50HZ;r.m.s.;1min
Maximum thermal resistance(1)
Operating Junction and storage temperature range
Approximate Weight
Values
Units
50
A
450
A
840
A2s
2500
V
0.7
-50 to 150
15
℃/W
℃
g
Electrical Characteristics (TA = 25℃ unless otherwise noted)
Symbol
VF
IR
Notes:
Conditions
Maximum Instantaneous Forward Voltage per leg
Maximum DC reverse current at rated
DC blocking voltage per leg
IFM = 25A
TA = 25℃
TA = 125℃
Values
Units
1.1
V
5.0
500
µA
(1) Unit case mounted on Al plate heatsink
(2) Recommended mounting position is to bolt down on heatsink with silicone thermal compound for
maximum heat transfer with M5 screw
Document Number: GBPC5002W thru GBPC5010W
Aug.22, 2014
www.smsemi.com
1
GBPC5002W thru GBPC5010W
Performance Curves
Mounted on a
220x220x50 mm
AL plate heatsink
80
60
40
20
0
Resistive or
Inductive load
0
50
100
TC, CASE TEMPERATURE (ºC)
Fig.1 Forward Current Derating Curve
500
150
100
10
1.0
0.1
Tj=25ºC
Pulse Width=300μs
0.01
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig.2 Typical Forward Characteristics (per element)
1000
Single Half-Sine Wave
(JEDEC Method)
400
Cj, CAPACITANCE (pF)
IFSM, PEAK FWD SURGE CURRENT (A)
IF, INSTANTANEOUS FORWARD CURRENT (A)
I F, AVERAGE FORWARD CURRENT (A)
100
300
200
100
100
Tj=150ºC
0
10
10
NUMBER OF CYCLES AT 60Hz
Fig.3 Max Non-Repetitive Surge Current
IR, INSTANTANEOUS REVERSE CURRENT (μA)
1
Tj=25ºC
f =1MHZ
0.1
1
10
100
VR, REVERSE VOLTAGE (V)
Fig.4 Typical Junction Capacitance (per element)
100
10
Tj=125ºC
1.0
0.1
Tj=25ºC
0.01
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig.5 Typical Reverse Characteristics (per element)
Document Number: GBPC5002W thru GBPC5010W
Aug.22,2014
www.smsemi.com
2
GBPC5002W thru GBPC5010W
Package Outline Information
1.135(28.8)
1.115(28.3)
CASE: GBPC-W
0.220(5.59)
DIA.
0.200(5.08)
0.732(18.6)
0.692(17.6)
0.24(6.0)
0.18(4.6)
-
~
0.732(18.6)
0.692(17.6)
1.135(28.8)
1.115(28.3)
0.24(6.0)
0.18(4.6)
~
+
0.470(11.9) 0.50(12.7)
0.430(10.9) 0.44(11.7)
0.042(1.07)
0.038(0.97)
DIA.
1.25
(31.8)
MIN.
0.310(7.87)
0.290(7.36)
Dimensions in inches (mm)
Document Number: GBPC5002W thru GBPC5010W
Aug.22,2014
www.smsemi.com
3
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