Lineage Power ESTW025A0F41-SZ Estw025a0f series (eighth-brick) dc-dc converter power module Datasheet

Data Sheet
October 11, 2011
ESTW025A0F Series (Eighth-Brick) DC-DC Converter Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output Current
STINGRAY™ SERIES
RoHS Compliant
Features

Wide input voltage range: 36-75 Vdc

Delivers up to 25A Output current

Monotonic startup into prebiased load

Output Voltage adjust: 80% to 110% of Vo,nom

Remote sense

Constant switching frequency

Positive remote On/Off logic

Input under voltage protection

Output overcurrent and overvoltage protection

Over-temperature protection

Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 8.5mm
(2.28 in x 0.9 in x 0.335 in)
Low profile height and reduced component skyline
Applications

Distributed power architectures

Wireless networks

Access and optical network Equipment

Enterprise Networks including Power over Ethernet
(PoE)

Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Options


Suitable for cold wall cooling using suitable Gap
Pad applied directly to top side of module

High efficiency 92% at full load (Vin=48Vdc)

No thermal derating up to 68°C, 1.0m/s (200 LFM)

Wide operating temperature range (-40°C to 85°C)

Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)

Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)

UL* 60950-1, 2nd Ed. Recognized, CSA† C22.2 No.
60950-1-07 Certified, and VDE‡ (EN60950-1, 2nd
Ed.) Licensed

Negative Remote On/Off logic (-1 option,
preferred/standard)

Surface Mount version (-S option)

Auto-restart (-4 option, preferred/standard)

CE mark meets 2006/95/EC directive

Trimmed leads (-6 or -8 options)

Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed for
Basic insulation rating per EN60950-1

2250 Vdc Isolation tested in compliance with IEEE
¤
802.3 PoE standards

ISO 9001 and ISO 14001 certified manufacturing
facilities
§
**
Description
The ESTW025A0F series, Eighth-brick power modules are isolated dc-dc converters that can deliver up to 25A of output
current and provide a precisely regulated output voltage over a wide range of input voltages (Vin = 36 -75Vdc). The
module achieves typical full load efficiency of 92% at 3.3Vdc output voltage. The open frame modules construction, available
in both surface-mount and through-hole packaging, enable designers to develop cost- and space-efficient solutions.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§
This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
‡
Document No: DS09-013 ver.1.01
PDF name: ESTW025A0F.pdf
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter
Device
Symbol
Min
Max
Unit
Continuous
All
VIN
-0.3
80
Vdc
Transient, operational (≤100 ms)
All
VIN,trans
-0.3
100
Vdc
All
TA
-40
85
°C
-18H, H
TC
-40
110
°C
Storage Temperature
All
Tstg
-55
125
°C
I/O Isolation voltage (100% factory Hi-Pot tested)
All


2250
Vdc
Input Voltage
Operating Ambient Temperature
Maximum Base-plate Operating Temperature
(see Thermal Considerations section)
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter
Device
Symbol
Min
Typ
Max
Unit
All
VIN
36
48
75
Vdc
All
IIN,max
2.7
Adc
All
IIN,No load
50
All
IIN,stand-by
6
Inrush Transient
All
It
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,
IO= IOmax ; See Test configuration section)
All
30
mAp-p
Input Ripple Rejection (120Hz)
All
50
dB
Operating Input Voltage
Maximum Input Current
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current
(VIN = VIN, nom, IO = 0, module enabled)
Input Stand-by Current
(VIN = VIN, nom, module disabled)
2
mA
8
mA
1
As
2
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.
LINEAGE POWER
2
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Electrical Specifications (continued)
Parameter
Device
Symbol
Min
Typ
Max
Unit
All
VO, set
3.250
3.300
3.350
Vdc
All
VO
3.200

3.400
Vdc
All
All
All





±0.2
±0.1
10
% VO, set
mV
% VO, set
All

8
20
mVrms
All

40
75
mVpk-pk
Nominal Output Voltage Set-point
VIN=VIN, nom, IO=IO, max, TA=25°C)
Output Voltage
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max)
Load (IO=IO, min to IO, max)
Temperature (Tref=TA, min to TA, max)
Output Ripple and Noise on nominal output
(Co=1uF,ceramic+10uF,tantalum, VIN=VIN, nom ,IO= IO,
max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth)
Peak-to-Peak (5Hz to 20MHz bandwidth)
External Capacitance
1
Output Current
Output Current Limit Inception (Hiccup Mode )
(VO= 90% of VO, set)
Output Short-Circuit Current (VO≤250mV)
( Hiccup Mode)
All
CO, max
0

20,000
μF
All
Io
0

25.0
Adc
All
IO, lim
26.3
29
32.5
Adc
All
IO, s/c
All
All
η
η
1.6
Arms
91.0
91.0
92.0
92.0
%
%
85.5
87.0
%
355
kHz
Efficiency
VIN= VIN, nom, TA=25°C, IO=IO, max , VO= VO,set
VIN= VIN, nom, TA=25°C, IO=10A , VO= VO,set
VIN= VIN, nom, TA=25°C, IO=5A , VO= VO,set
All
η
All
fsw
(Co=1uF,ceramic+220uF,tantalum, dIo/dt=0.1A/s;
VIN = 48V; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation
All
Vpk

127

mV
Settling Time (Vo<10% peak deviation)
All
ts

200

s
Unit
Switching Frequency
Dynamic Load Response
1.
See Note 2 under Feature Specifications.
Isolation Specifications
Parameter
Device
Symbol
Min
Typ
Max
Isolation Capacitance
All
Ciso

1000

pF
Isolation Resistance
All
Riso

30

MΩ
I/O Isolation Voltage (100% factory Hi-pot tested)
All
All


2250
Vdc
Device
Symbol
Typ
Max
All
FIT
229.4
10 /Hours
All
MTBF
4,359,904
Hours
General Specifications
Parameter
Calculated Reliability based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,
airflow = 200 lfm, 90% confidence)
Min
Unit
9
Weight (Open Frame)
All
22 (0.78)
g(oz)
Weight (with Heatplate)
All
35 (1.23)
g(oz)
LINEAGE POWER
3
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current
All
Ion/off


0.15
mA
Logic Low - On/Off Voltage
All
Von/off
-0.7

0.6
Vdc
Logic High Voltage – (Typ = Open Collector)
All
Von/off
2.4

15.0
Vdc
Logic High maximum allowable leakage current
All
Ion/off


25
μA
Case 1: Input power is applied for >1 second and then
the On/Off input is set to ON (Tdelay = time from instant
On/Off signal is ON until VO = 10% of VO, set)
All
Tdelay
―
12
―
msec
Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (Tdelay = time
at which VIN = VIN, min until Vo=10% of VO,set)
All
Tdelay
―
20
―
msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set)
All
Trise
―
4
―
msec
―
5
% VO, set
10
% VO, set
1
Turn-On Delay and Rise Times
o
(IO=IO, max , VIN=VIN, nom, TA = 25 C)
Output voltage overshoot – Startup
All
o
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C
Prebias Output Load Performance:
Output Start up characteristic
All
Back Bias current drawn from output (Module Enabled)
All
Remote Sense Range
All
Output Voltage Adjustment Range
Monotonic
mAdc
-15
VSENSE
-20
+10
% VO, set
All
VO, limit
3.9
5.1
Vdc
Overtemperature Protection – Hiccup Auto Restart
All
Tref

125

Input Undervoltage Lockout
All
VUVLO
Turn-on Threshold

34.0
35.5
Vdc
Turn-off Threshold
30.5
32.0

Vdc
Hysteresis
1.0
2.0

Vdc
Output Overvoltage Protection (CO=470μF)
1.
2.
All
2
O
C
The module has an adaptable extended Turn-On Delay interval, Tdelay, of 25mS. The extended Tdelay will occur when the module restarts
following the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and
then back to normal.
The module requires a minimum of 470 μF external output capacitor to prevent shutdown during full load to no load transients and to avoid
exceeding the OVP maximum limits during startup into open loop fault conditions.
LINEAGE POWER
4
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Characteristic Curves
o
Figure 3. Transient Response to 0.1A/µS Dynamic
Load Change from 25% to 50% to 25% of full load.
LINEAGE POWER
On/Off VOLTAGE
OUTPUT VOLTAGE
TIME, t (200µs/div)
VO (V) (200mV/div)
TIME, t (10ms/div)
OUTPUT VOLTAGE
Vo (V) (1V/div)
VIN (V) (20V/div
Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io = Io,max).
INPUT VOLTAGE
OUTPUT VOLTAGE
VO (V) (20mV/div)
VO (V) (200mV/div)
Io(A) (5A/div)
OUTPUT CURRENT OUTPUT VOLTAGE
Figure 2. Typical output ripple and noise (VIN = VIN,NOM,
Io = Io,max).
Io(A) (5A/div)
OUTPUT CURRENT OUTPUT VOLTAGE
Figure 4. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load.
Figure 1. Converter Efficiency versus Output Current.
TIME, t (2s/div)
TIME, t (200µs/div)
VO (V) (1V/div)
OUTPUT CURRENT, IO (A)
VOn/off (V) (5V/div)
EFFICIENCY,  (%)
The following figures provide typical characteristics for the ESTW025A0F (3.3V, 25A) at 25 C. The figures are
identical for either positive or negative remote On/Off logic.
TIME, t (5ms/div)
Figure 6. Typical Start-up Using Input Voltage (VIN =
VIN,NOM, Io = Io,max).
5
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Test Configurations
Design Considerations
Input Filtering
CURRENT PROBE
TO OSCILLOSCOPE
LTEST
Vin+
BATTERY
12μH
CS
220μF
100μF
E.S.R.<0.1
@ 20°C 100kHz
Safety Considerations
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test
Setup.
COPPER STRIP
VO (+)
RESISTIVE
LOAD
SCOPE
V O (–)
0.01uF 0.1uF 10uF
GROUND PLANE
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 8. Output Ripple and Noise Test Setup.
Rdistribution
Rcontact
Rcontact
Vin+
Rdistribution
RLOAD
VO
Rcontact
Rcontact
Vin-
Rdistribution
Vout+
VIN
Rdistribution
Vout-
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test
Setup.
VO. IO
Efficiency
 =
LINEAGE POWER
VIN. IIN
x
100 %
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7 a 100μF
electrolytic capacitor (ESR<0.7 at 100kHz), mounted
close to the power module helps ensure the stability of
the unit. Consult the factory for further application
guidelines.
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e. UL60950-1, CSA C22.2 No.60950-1,
and VDE0805-1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:

The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.

One VIN pin and one VOUT pin are to be grounded,
or both the input and output pins are to be kept
floating.

The input pins of the module are not operator
accessible.

Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety
agencies, to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the
UL60950 A.2 for reduced thickness.
For input voltages exceeding 60 Vdc but less than or
equal to 75 Vdc, these converters have been
evaluated to the applicable requirements of BASIC
INSULATION between secondary DC MAINS
DISTRIBUTION input (classified as TNV-2 in Europe)
and unearthed SELV outputs.
The input to these units is to be provided with a
maximum 5 A fast-acting fuse in the ungrounded lead.
6
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).
SENSE(+)
SENSE(–)
SUPPLY
Vin+
Vout+
II
VI(+)
VO(+)
VI(-)
VO(–)
CONTACT
RESISTANCE
IO
LOAD
CONTACT AND
DISTRIBUTION LOSSE
Ion/off
ON/OFF
TRIM
Von/off
Input Undervoltage Lockout
Vin-
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (Von/off) between the ON/OFF
terminal and the VIN(-) terminal (see Figure 10). Logic
low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a
logic low is 1mA, the switch should maintain a logic
low level while sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 15V, and the maximum
allowable leakage current at Von/off = 5V is 1μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between the
remote-sense pins and the output terminals must not
exceed the output voltage sense range given in the
Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
LINEAGE POWER
Figure 11. Circuit Configuration for remote
sense .
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, VUV/ON.
Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under certain fault conditions,
the unit is equipped with a thermal shutdown circuit.
The unit will shutdown if the thermal reference point
o
Tref (Figure 13), exceeds 125 C (typical), but the
thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating.
The module can be restarted by cycling the dc input
power for at least one second or by toggling the
remote on/off signal for at least one second. If the
auto-restart option (4) is ordered, the module will
automatically restart upon cool-down to a safe
temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the
latching protection feature. If the auto-restart option
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current limiting circuitry and can endure current
limiting continuously. At the point of current limit
inception, the unit enters hiccup mode. If the unit is
7
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Feature Descriptions (continued)
not configured with auto–restart, then it will latch off
following the over current condition. The module can
be restarted by cycling the dc input power for at least
one second or by toggling the remote on/off signal for
at least one second. If the unit is configured with the
auto-restart option (4), it will remain in the hiccup
mode as long as the overcurrent condition exists; it
operates normally, once the output current is brought
back into its specified range. The average output
current during hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin.
VIN(+)
VO(+)
Rtrim-up
ON/OFF
LOAD
VOTRIM
Rtrim-down
VIN(-)
VO(-)
Figure 12. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between
the TRIM pin and the VO(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%
the output voltage set point. The following equation
determines the required external resistor value to
obtain a percentage output voltage change of Δ%:
 5.11  Vo , set  (100   %) 511

Rtrim  up  

 10.22  
1
.
225


%

%


Where
V
 V o , set
 %   desired

V
o , set


  100


For example, to trim-up the output voltage of the
module by 5% to 3.465V, Rtrim-up is calculated is as
follows:
%  5
 5 . 11  3 . 3  (100  5 ) 511


 10 . 22  
R trim  up  
1 . 225  5
5


Rtrim up  176 .7 
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output voltage
of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the
maximum output power of the module remains at or
below the maximum rated power (Maximum rated
power = VO,set x IO,max).
 511

R trim  down  
 10 . 22  
 %

Where
V
 V desired
 %   o , set
V
o , set


  100


For example, to trim-down the output voltage of the
module by 8% to 3.036V, Rtrim-down is calculated as
follows:
%  8
 511

Rtrim  down  
 10 .22  
 8

Rtrim  down  53 .655 
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases
LINEAGE POWER
8
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference points, Tref1,Tref2 and Tref3 used
in the specifications for open frame modules are
shown in Figures 13a and 13b. For reliable operation
o
o
these temperatures should not exceed 125 C, 110 C
and 105oC respectively.
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
for natural convection and up to 2.0 m/s (400 ft./min)
forced airflow, are shown in Figure 15.
OUTPUT CURRENT, IO (A)
Data Sheet
October 11, 2011
o
AMBIENT TEMEPERATURE, TA ( C)
Figure 15. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
Heat Transfer via Conduction
Figure 13b. Tref 2 and Tref 3 Temperature
Measurement Locations for Open Frame Module.
The thermal reference point, Tref, used in the
specifications for modules with heatplate is shown in
Figure 14. For reliable operation this temperature
should not exceed 110oC.
Figure 16. Cold Wall Mounting
OUTPUT CURRENT, IO (A)
Figure 13a. Tref 1 Temperature Measurement
Location for Open Frame Module.
The module can also be used in a sealed environment
with cooling via conduction from the module’s top
surface through a gap pad material to a cold wall, as
shown in Figure 16. The output current derating
versus cold wall temperature, when using a gap pad
such as Bergquist GP2500S20, is shown in Figure 17.
o
COLDPLATE TEMEPERATURE, TC ( C)
Figure 14. Tref Temperature Measurement
Location for Module with Heatplate.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves, showing the
maximum output current that can be delivered by
each module versus local ambient temperature (TA)
LINEAGE POWER
Figure 17. Derated Output Current versus Cold
Wall Temperature with local ambient temperature
around module at 85C; Vin=48V.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame BoardMounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
9
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Surface Mount Information
Pick and Place
The ESTW025A0F modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
o
temperatures of up to 300 C. The label also carries
product information such as product code, serial
number and the location of manufacture.
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
300
P eak Temp 235oC
REFLOW TEMP (C)
250
200
150
So ak zo ne
30-240s
100
50
Tin Lead Soldering
The ESTW025A0F power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
LINEAGE POWER
P reheat zo ne
max 4oCs -1
REFLOW TIME (S)
Figure 19. Reflow Profile for Tin/Lead (Sn/Pb)
process.
240
235
MAX TEMP SOLDER (C)
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tlim above
205oC
0
Figure 18. Pick and Place Location.
Nozzle Recommendations
Co o ling
zo ne
1-4oCs -1
Heat zo ne
max 4oCs -1
230
225
220
215
210
205
200
0
10
20
30
40
50
60
o
Figure 20. Time Limit Curve Above 205 C for
Tin/Lead (Sn/Pb) process
Lead Free Soldering
The –Z version of the ESTW025A0F modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Reflow Soldering Information
The surface mountable modules in the
ESTW025A0F-S family use our newest SMT
10
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Surface Mount Information (continued)
technology called “Column Pin” (CP) connectors.
Figure 19 shows the new CP connector before and
after reflow soldering onto the end-board assembly.
ESTW Board
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of  30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Solder Ball
End assembly PCB
Figure 21. Column Pin Connector Before and After
Reflow Soldering .
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn63/Pb37) solder for non-Z codes, or
Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
o
o
at 183 C (Sn/Pb solder) or 217-218 C (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
300
Per J-STD-020 Rev. C
Peak Temp 260°C
250
Reflow Temp (°C)
Insulator
200
* Min. Time Above 235°C
15 Seconds
Cooling
Zone
150
Heating Zone
1°C/Second
*Time Above 217°C
60 Seconds
100
50
0
Reflow Time (Seconds)
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 22.
MSL Rating
The ESTW025A0F modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
LINEAGE POWER
Figure 22. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have a RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is
270C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
11
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
EMC Considerations
The filter circuit schematic and plots in Figure 23 shows a suggested configuration as tested to meet the conducted
emission limits of EN55022 Class B.
Note: Customer is ultimately responsible for the proper selection, component rating and verification of the suggested
parts based on the end application.
Figure 23. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
LINEAGE POWER
12
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]
*Top side label includes Lineage Power name, product designation and date code.
Top
View*
Side
View
*For optional pin lengths, see Table 2, Device Options
Bottom
View
Pin
1
2
3
4
5
6
7
8
LINEAGE POWER
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
13
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Mechanical Outline for Surface Mount Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]
* Top side label includes Lineage Power name, product designation and date code.
Top
View*
Side
View
Bottom
View
Pin
1
2
3
4
5
6
7
8
LINEAGE POWER
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
14
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Mechanical Outline for Through-Hole Module with 1/8th Heat Plate (-H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]
Top
View
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom
View*
Pin
1
2
3
4
5
6
7
8
LINEAGE POWER
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
15
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Mechanical Outline for Through-Hole Module with 1/4th Heat Plate (-18H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]
Pin
1
2
3
4
5
6
7
8
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
LINEAGE POWER
16
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]
SMT Recommended Pad Layout (Component Side View)
LINEAGE POWER
17
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
TH Recommended Pad Layout (Component Side View)
LINEAGE POWER
18
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Packaging Details
The surface mount versions of the ESTW025A0F
modules (suffix –S) are supplied as standard in
the plastic tray shown in Figure 24. The tray has
external dimensions of 135.1mm(W) x 321.8mm(L) x
12.42mm(H) or 5.319in(W) x 12.669in(L) x 0.489in(H).
Tray Specification
Material
Antistatic coated PVC
Max surface resistivity
Color
Capacity
Min order quantity
1012/sq
Clear
12 power modules
48 pcs (1 box of 4 full trays)
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray
giving a total number of 48 power modules.
Figure 24. Surface Mount Packaging Tray.
LINEAGE POWER
19
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
ESTW025A0F41Z
48V (36-75Vdc)
Output
Voltage
3.3V
ESTW025A0F41-HZ
48V (36-75Vdc)
3.3V
25A
Negative
Through hole
ESTW025A0F41-SZ
48V (36-75Vdc)
3.3V
25A
Negative
Surface Mount
CC109159505
CC109159496
ESTW025A0F641
48V (36-75Vdc)
3.3V
25A
Negative
Through hole
CC109159125
ESTW025A0F4Z
48V (36-75Vdc)
3.3V
25A
Positive
Through hole
ESTW025A0F641Z
48V (36-75Vdc)
3.3V
25A
Negative
Through hole
CC109168118
CC109169363
ESTW025A0F841Z
48V (36-75Vdc)
3.3V
25A
Negative
Through hole
CC109167367
ESTW025A0F64-18HZ
48V (36-75Vdc)
3.3V
25A
Positive
Through hole
CC109172846
Product Codes
Input Voltage
Output
Current
25A
On/Off
Logic
Negative
Connector
Type
Through hole
Comcodes
CC109158498
Table 2. Device Options
Character and Position
Ratings
Characteristic
Form Factor
Family Designator
Input Voltage
Output Current
Output Voltage
E
ST
W
025A0
F
Pin Length
Action following
Protective
Options
On/Off Logic
Customer Specific
6
8
4
1
XY
H
Mechanical Features
18H
RoHS
Definition
E = Eighth Brick
ST = Stingray Series
W = Wide Range, 36V-75V
025A0 = 025.0 Amps Maximum Output Current
F = 3.3V nominal
Omit = Default Pin Length shown in Mechanical Outline Figures
6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)
8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)
Omit = Latching Mode
4 = Auto-restart following shutdown (Overcurrent/Overvoltage)
Omit = Positive Logic
1 = Negative Logic
XY = Customer Specific Modified Code, Omit for Standard Code
Omit = Standard open Frame Module
H = 1/8th Brick size heat plate, for
use with heat sinks (not available with –S option)
18H = 1/4th Brick size heat plate with unthreaded inserts for
use in coldwall applications (not available with –S option)
S = Surface mount connections
Omit = RoHS 5/6, Lead Based Solder Used
Z Z = RoHS 6/6 Compliant, Lead free
Asia-Pacific Headquarters
Tel: +65 6593 7211
World Wide Headquarters
Lineage Power Corporation
601 Shiloh Road, Plano, TX 75074, USA
+1-800-526-7819
(Outside U.S.A.: +1-972-244-9428)
www.lineagepower.com
e-m ail: [email protected]
Europe, Middle-East and Africa Headquarters
Tel: +49 89 878067-280
India Headquarters
Tel: +91 80 28411633
Lineage Power reser ves the right to make c hanges to the product(s) or inf ormation contained herei n without notice. N o liability is ass umed as a res ult of their use or
application. No rights under any patent accompany the sale of any suc h produc t(s) or infor mati on.
Lineage Power DC-DC products are protected under various patents. Information on these patents is availabl e at www.lineagepower.c om/patents.
© 2011 Lineage Power Corporation, (Plano, Texas) All Int ernational Rights Reser ved.
Document No: DS09-013 ver.1.01
PDF name: ESTW025A0F.pdf
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