ON MBRF30L60CTG Switchmodeâ ¢ power rectifier 60 v, 30 a Datasheet

MBR30L60CT,
MBRF30L60CT
SWITCHMODE™
Power Rectifier
60 V, 30 A
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Features and Benefits
•
•
•
•
•
•
SCHOTTKY BARRIER
RECTIFIER
30 AMPERES, 60 VOLTS
Low Forward Voltage
Low Power Loss/High Efficiency
High Surge Capability
30 A Total (15 A Per Diode Leg)
Guard−Ring for Stress Protection
These are Pb−Free Devices
1
2, 4
3
Applications
• Power Supply − Output Rectification
• Power Management
• Instrumentation
MARKING
DIAGRAMS
Mechanical Characteristics:
•
•
•
•
•
Case: Epoxy, Molded
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight (Approximately): 1.9 Grams (TO−220 & TO−220FP)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
TO−220 FULLPAK]
CASE 221D
STYLE 3
1
2
AYWW
B30L60G
AKA
3
4
MAXIMUM RATINGS
Please See the Table on the Following Page
TO−220AB
CASE 221A
STYLE 6
1
2
AYWW
B30L60G
AKA
3
A
Y
WW
B30L60
G
AKA
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Device
= Polarity Designator
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
December, 2008 − Rev. 0
1
Publication Order Number:
MBR30L60CT/D
MBR30L60CT, MBRF30L60CT
MAXIMUM RATINGS (Per Diode Leg)
Symbol
Value
Unit
VRRM
VRWM
VR
60
V
IF(AV)
15
30
A
IFSM
240
A
Operating Junction Temperature (Note 1)
TJ
−55 to +150
°C
Storage Temperature
Tstg
−65 to +175
°C
> 400
> 8000
V
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
MBR30L60CT (Rated VR) TC = 133°C
MBRF30L60CT (Rated VR) TC = 108°C
(Per Leg)
(Per Device)
(Per Device)
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
ESD Ratings:
Machine Model = C
Human Body Model = 3B
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Rating
Maximum Thermal Resistance
MBR30L60CT
Junction−to−Case
Junction−to−Ambient
Junction−to−Case
Junction−to−Ambient
MBRF30L60CT
Symbol
Value
RqJC
RqJA
RqJC
RqJA
2.1
70
5.0
75
Typ
Max
0.57
0.53
0.75
0.70
0.62
0.57
0.81
0.73
137
62
350
110
Unit
°C/W
ELECTRICAL CHARACTERISTICS (Per Diode Leg)
Rating
Symbol
Maximum Instantaneous Forward Voltage (Note 2)
(IF = 15 A, TC = 25°C)
(IF = 15 A, TC = 125°C)
(IF = 30 A, TC = 25°C)
(IF = 30 A, TC = 125°C)
vF
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, TC = 25°C)
(Rated DC Voltage, TC = 125°C)
iR
Unit
V
mA
mA
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
DEVICE ORDERING INFORMATION
Package Type
Shipping†
MBR30L60CTG
TO−220
(Pb−Free)
50 Units / Rail
MBRF30L60CTG
TO−220FP
(Pb−Free)
50 Units / Rail
Device Order Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
http://onsemi.com
2
MBR30L60CT, MBRF30L60CT
100
IF, AVERAGE FORWARD CURRENT
(A)
IF, AVERAGE FORWARD CURRENT
(A)
100
125°C
10
10
150°C
85°C
TJ = 25°C
0.1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
85°C
1
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
0.4
0.6
0.8
1
1.2
1.4
1.6
Figure 2. Maximum Forward Voltage
1.0E+00
1.0E+00
150°C
125°C
1.0E−02
125°C
1.0E−02
85°C
1.0E−03
150°C
1.0E−01
IR, REVERSE CURRENT (A)
IR, REVERSE CURRENT (A)
1.0E−01
85°C
1.0E−03
1.0E−04
1.0E−04
TJ = 25°C
1.0E−05
0
10
20
30
40
50
60
1.0E−06
0
10
20
30
40
50
60
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
6
RqJC = 2.1°C/W
100
110
120
130
140
150
IF, AVERAGE FORWARD CURRENT
(A)
26
24
22
20
18
16
14
12
10
8
6
4
2
0
90
TJ = 25°C
1.0E−05
VR, REVERSE VOLTAGE (V)
IF, AVERAGE FORWARD CURRENT
(A)
0.2
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
1.0E−06
150°C
TJ = 25°C
0.1
0
1.6
125°C
160
RqJA = 70°C/W
5
dc
4
3
SQUARE WAVE
2
1
0
0
20
40
60
80
100
120
140 160
TC, CASE TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 5. Current Derating, Case per Leg
MBR30L60CT
Figure 6. Current Derating, Ambient per Leg
MBR30L60CT
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3
26
RqJC = 5.0°C/W
24
dc
22
20
18
16
SQUARE WAVE
14
12
10
8
6
4
2
0
30 40 50 60 70 80 90 100 110 120 130 140 150 160
TC, CASE TEMPERATURE (°C)
6
IF, AVERAGE FORWARD CURRENT
(A)
IF, AVERAGE FORWARD CURRENT
(A)
MBR30L60CT, MBRF30L60CT
RqJA = 75°C/W
5
4
dc
3
SQUARE WAVE
2
1
0
0
R(t), TRANSIENT THERMAL RESISTANCE
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
40
60
80
100
120
TA, AMBIENT TEMPERATURE (°C)
140 160
Figure 8. Current Derating, Ambient per Leg
MBRF30L60CT
10000
TJ = 150°C
TJ = 25°C
C, CAPACITANCE (pF)
PFO, AVERAGE POWER DISSIPATION (W)
Figure 7. Current Derating, Case per Leg
MBRF30L60CT
20
SQUARE WAVE
dc
0
2
4
6
8
1000
100
10
10 12 14 16 18 20 22 24 26 28 30
0
10
20
30
40
IO, AVERAGE FORWARD CURRENT (A)
VR, REVERSE VOLTAGE (V)
Figure 9. Forward Power Dissipation
Figure 10. Capacitance
50
60
10
D=
0.5
1
0.2
0.1
0.1
0.05
P(pk)
0.01
t1
SINGLE PULSE
0.01
0.000001
t2
DUTY CYCLE, D = t1/t2
0.00001
0.0001
0.001
0.01
0.1
1
10
t1, TIME (sec)
Figure 11. Thermal Response Junction−to−Case, per Leg for MBR30L60CT
http://onsemi.com
4
100
1000
R(t), TRANSIENT THERMAL RESISTANCE
MBR30L60CT, MBRF30L60CT
100
D=
0.5
0.2
10
1
0.1
0.05
0.01
0.1
SINGLE PULSE
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
R(t), TRANSIENT THERMAL RESISTANCE
Figure 12. Thermal Response Junction−to−Ambient, per Leg for MBR30L60CT
10
D=
0.5
0.2
0.1
1
0.05
0.02
0.1
0.01
SINGLE PULSE
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
1
10
100
1000
100
1000
R(t), TRANSIENT THERMAL RESISTANCE
Figure 13. Thermal Response Junction−to−Case, per Leg for MBRF30L60CT
100
D=
0.5
10
0.2
0.1
0.02
0.05
1
0.01
0.1
SINGLE PULSE
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
1
10
Figure 14. Thermal Response Junction−to−Ambient, per Leg for MBRF30L60CT
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5
MBR30L60CT, MBRF30L60CT
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AF
−T−
B
F
T
SEATING
PLANE
C
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
U
1 2 3
H
K
Z
L
R
V
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.161
0.095
0.105
0.110
0.155
0.014
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
STYLE 6:
PIN 1.
2.
3.
4.
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6
ANODE
CATHODE
ANODE
CATHODE
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
4.09
2.42
2.66
2.80
3.93
0.36
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
MBR30L60CT, MBRF30L60CT
PACKAGE DIMENSIONS
TO−220 FULLPAK
CASE 221D−03
ISSUE J
−T−
−B−
F
SEATING
PLANE
C
S
Q
U
A
1 2 3
H
−Y−
K
G
N
L
D
J
R
3 PL
0.25 (0.010)
M
B
M
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. 221D-01 THRU 221D-02 OBSOLETE, NEW
STANDARD 221D-03.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
U
INCHES
MIN
MAX
0.617
0.635
0.392
0.419
0.177
0.193
0.024
0.039
0.116
0.129
0.100 BSC
0.118
0.135
0.018
0.025
0.503
0.541
0.048
0.058
0.200 BSC
0.122
0.138
0.099
0.117
0.092
0.113
0.239
0.271
MILLIMETERS
MIN
MAX
15.67
16.12
9.96
10.63
4.50
4.90
0.60
1.00
2.95
3.28
2.54 BSC
3.00
3.43
0.45
0.63
12.78
13.73
1.23
1.47
5.08 BSC
3.10
3.50
2.51
2.96
2.34
2.87
6.06
6.88
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
FULLPAK and SWITCHMODE are trademarks of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,
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or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an
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MBRF30L60CT/D
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