OP A3 76 OPA 2376 OPA376 OPA2376 OPA4376 OPA 4376 www.ti.com SBOS406F – JUNE 2007 – REVISED MARCH 2013 Low-Noise, Low Quiescent Current, Precision Operational Amplifier e-trim™ Series Check for Samples: OPA376, OPA2376, OPA4376 FEATURES DESCRIPTION • • • • • • • • • The OPA376 family represent a new generation of low-noise operational amplifiers with e-trim, offering outstanding dc precision and ac performance. Rail-torail input and output, low offset (25μV max), low noise (7.5nV/√Hz), quiescent current of 950μA max, and a 5.5MHz bandwidth make this part very attractive for a variety of precision and portable applications. In addition, this device has a reasonably wide supply range with excellent PSRR, making it attractive for applications that run directly from batteries without regulation. 1 23 LOW NOISE: 7.5nV/√Hz at 1kHz 0.1Hz TO 10Hz NOISE: 0.8μVPP QUIESCENT CURRENT: 760μA (typ) LOW OFFSET VOLTAGE: 5μV (typ) GAIN BANDWIDTH PRODUCT: 5.5MHz RAIL-TO-RAIL INPUT AND OUTPUT SINGLE-SUPPLY OPERATION SUPPLY VOLTAGE: 2.2V to 5.5V SPACE-SAVING PACKAGES: – SC-70, SOT23, WCSP, MSOP, TSSOP The OPA376 (single version) is available in MicroSIZE SC70-5, SOT23-5, and SO-8 packages. The OPA2376 (dual) is offered in the WCSP-8, MSOP-8, and SO-8 packages. The OPA4376 (quad) is offered in a TSSOP-14 package. All versions are specified for operation from –40°C to +125°C. APPLICATIONS • • • • • • ADC BUFFER AUDIO EQUIPMENT MEDICAL INSTRUMENTATION HANDHELD TEST EQUIPMENT ACTIVE FILTERING SENSOR SIGNAL CONDITIONING OFFSET VOLTAGE PRODUCTION DISTRIBUTION INPUT VOLTAGE NOISE SPECTRAL DENSITY Population Voltage Noise (nV/ÖHz) 100 10 1 10 100 1k Frequency (Hz) 10k 100k -25.0 -22.5 -20.0 -17.5 -15.0 -12.5 -10.0 -7.5 -5.0 -2.5 0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 1 Offset Voltage (mV) 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. e-trim, NanoStar, NanoFree are trademarks of Texas Instruments Incorporated. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2013, Texas Instruments Incorporated OPA376 OPA2376 OPA4376 SBOS406F – JUNE 2007 – REVISED MARCH 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATING (1) over operating free-air temperature range (unless otherwise noted) Supply Voltage Signal Input Terminals OPA376, OPA2376, OPA4376 UNIT +7 V (V–) – 0.5 to (V+) + 0.5 V ±10 mA VS = (V+) – (V–) Voltage (2) Current (2) Output Short-Circuit (3) Continuous Operating Temperature TA –40 to +150 °C Storage Temperature TA –65 to +150 °C Junction Temperature TJ +150 °C Human Body Model 4000 V Charged Device Model 1000 V Machine Model 200 V ESD Rating (1) (2) (3) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. Short-circuit to ground, one amplifier per package. PACKAGE INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR SC70-5 DCK BUR OPA376 SOT23-5 DBV BUQ SO-8 D OPA376 OPA2376 SO-8 D MSOP-8 DGK OBBI OPA2376 Lead- (Pb-) Free WCSP-8 YZD OPA2376 OPA4376 TSSOP-14 PW OPA4376 OPA2376 (1) 2 PACKAGE MARKING For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 www.ti.com SBOS406F – JUNE 2007 – REVISED MARCH 2013 ELECTRICAL CHARACTERISTICS: VS = +2.2V to +5.5V Boldface limits apply over the specified temperature range: TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted. OPA376, OPA2376, OPA4376 PARAMETERS CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE Input Offset Voltage vs Temperature vs Power Supply 5 25 μV –40°C to +85°C 0.26 1 μV/°C μV/°C VOS dVOS/dT –40°C to +125°C 0.32 2 VS = +2.2V to +5.5V, VCM < (V+) – 1.3V 5 20 VS = +2.2V to +5.5V, VCM < (V+) – 1.3V 5 μV/V 0.5 mV/V PSRR Over Temperature Channel Separation, dc (dual, quad) μV/V INPUT BIAS CURRENT Input Bias Current IB 0.2 Over Temperature Input Offset Current 10 pA See Typical Characteristics pA 0.2 pA IOS 10 NOISE 0.8 μVPP en 7.5 nV/√Hz in 2 fA/√Hz Input Voltage Noise, f = 0.1Hz to 10Hz Input Voltage Noise Density, f = 1kHz Input Current Noise, f = 1kHz INPUT VOLTAGE RANGE Common-Mode Voltage Range VCM Common-Mode Rejection Ratio CMRR (V–) – 0.1 (V–) < VCM < (V+) – 1.3 V 76 (V+) + 0.1 V 90 dB Differential 6.5 pF Common-Mode 13 pF INPUT CAPACITANCE OPEN-LOOP GAIN Open-Loop Voltage Gain AOL FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate 50mV < VO < (V+) – 50mV, RL = 10kΩ 120 134 dB 100mV < VO < (V+) – 100mV, RL = 2kΩ 120 126 dB CL = 100pF, VS = 5.5V GBW SR 5.5 MHz G = +1 2 V/μs Settling Time 0.1% tS 2V Step , G = +1 1.6 μs Settling Time 0.01% tS 2V Step , G = +1 2 μs VIN × Gain > VS 0.33 μs VO = 1VRMS, G = +1, f = 1kHz, RL = 10kΩ 0.00027 % RL = 10kΩ (1) 10 20 mV RL = 10kΩ (2) 20 30 mV Overload Recovery Time THD + Noise THD+N OUTPUT Voltage Output Swing from Rail Over Temperature RL = 10kΩ Voltage Output Swing from Rail Over Temperature Short-Circuit Current Capacitive Load Drive Open-Loop Output Impedance (1) (2) 40 mV RL = 2kΩ (1) 40 50 mV RL = 2kΩ (2) 50 60 mV 80 mV RL = 2kΩ ISC CLOAD +30/–50 mA See Typical Characteristics RO 150 Ω SC70-5, SOT23-5, SO-8, MSOP-8, and TSSOP-14 packages only. Wafer chip-scale package only. Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 Submit Documentation Feedback 3 OPA376 OPA2376 OPA4376 SBOS406F – JUNE 2007 – REVISED MARCH 2013 www.ti.com ELECTRICAL CHARACTERISTICS: VS = +2.2V to +5.5V (continued) Boldface limits apply over the specified temperature range: TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted. OPA376, OPA2376, OPA4376 PARAMETERS CONDITIONS MIN TYP MAX UNIT 5.5 V 950 μA 1 mA °C POWER SUPPLY Specified Voltage Range VS 2.2 Operating Voltage Range Quiescent Current per amplifier 2 to 5.5 IQ IO = 0, VS = +5.5V, VCM < (V+) – 1.3V 760 Over Temperature V TEMPERATURE RANGE Specified Range –40 +125 Operating Range –40 +150 Thermal Resistance 4 θJA °C °C/W SC70 250 °C/W SOT23 200 °C/W SO-8, TSSOP-14, MSOP-8 150 °C/W WCSP-8 250 °C/W Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 www.ti.com SBOS406F – JUNE 2007 – REVISED MARCH 2013 PIN CONFIGURATIONS OPA376 SOT23-5 (TOP VIEW) OUT 1 V- 2 +IN 3 OPA2376 SO-8, MSOP-8 (TOP VIEW) 5 V+ 4 -IN OUT A 1 8 V+ -IN A 2 7 OUT B +IN A 3 6 -IN B V- 4 5 +IN B OPA376 SC70-5 (TOP VIEW) +IN 1 V- 2 -IN 3 OPA2376 WCSP-8 (TOP VIEW) 5 V+ 4 OUT +IN B D2 D1 V- -IN B C2 C1 +IN A 2,188 mm OUT B B2 B1 -IN A 2,038 mm V+ A2 A1 OUT A OPA376 SO-8 (TOP VIEW) NC (1) 1 1,15 mm 8 NC 7 V+ 1,00 mm (1) (Bump Side Down) -IN 2 +IN 3 6 OUT V- 4 5 NC + (1) OPA4376 TSSOP-14 (TOP VIEW) OUT A 1 14 OUT D -IN A 2 13 -IN D +IN A 3 12 +IN D V+ 4 11 V- +IN B 5 10 +IN C -IN B 6 9 -IN C OUT B 7 8 OUT C NOTE: (1) NC denotes no internal connection. Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 Submit Documentation Feedback 5 OPA376 OPA2376 OPA4376 SBOS406F – JUNE 2007 – REVISED MARCH 2013 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted. POWER-SUPPLY AND COMMON-MODE REJECTION RATIO vs FREQUENCY 0 140 -20 120 -40 Gain 100 -60 Phase 80 -80 60 -100 40 -120 20 -140 0 -160 -20 0.1 1 10 100 1k 10k 100k 1M Power-Supply Rejection Ratio (dB) 160 120 Phase Margin (°) Open-Loop Gain (dB) OPEN-LOOP GAIN/PHASE vs FREQUENCY V(+) Power-Supply Rejection Ratio 100 80 Common-Mode Rejection Ratio 60 40 V(-) Power-Supply Rejection Ratio 20 0 -180 10M 10 100 1k 10k 100k 1M 10M Frequency (Hz) Frequency (Hz) Figure 1. Figure 2. OPEN-LOOP GAIN AND POWER-SUPPLY REJECTION RATIO vs TEMPERATURE 0.1Hz to 10Hz INPUT VOLTAGE NOISE Open-Loop Gain (RL = 2kW) 140 120 500nV/div Open-Loop Gain and PSRR (dB) 160 Power-Supply Rejection Ratio (VS = 2.1V to 5.5V) 100 80 -50 0 -25 25 50 75 100 125 1s/div 150 Temperature (°C) Figure 3. Figure 4. INPUT VOLTAGE NOISE SPECTRAL DENSITY TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 1 Total Harmonic Distortion + Noise (%) Voltage Noise (nV/ÖHz) 100 10 1 VS = 5V, VCM = 2V, VOUT = 1VRMS 0.1 0.01 Gain = 10V/V 0.001 Gain = 1V/V 0.0001 1 10 100 1k 10k 100k 10 100 Frequency (Hz) Figure 5. 6 Submit Documentation Feedback 1k 10k 100k Frequency (Hz) Figure 6. Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 www.ti.com SBOS406F – JUNE 2007 – REVISED MARCH 2013 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted. COMMON-MODE REJECTION RATIO vs TEMPERATURE QUIESCENT CURRENT vs TEMPERATURE 1000 100 900 Quiescent Current (mA) Common-Mode Rejection Ratio (dB) 110 90 80 70 800 700 600 60 50 500 -50 -25 0 25 50 75 100 125 150 -50 -25 0 Temperature (°C) 25 50 75 100 125 150 125 150 Temperature (°C) Figure 7. Figure 8. QUIESCENT AND SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE SHORT-CIRCUIT CURRENT vs TEMPERATURE 75 50 1000 VS = ±2.75V Quiescent Current (mA) ISC+ 30 800 IQ 700 20 10 600 0 500 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Short-Circuit Current (mA) 40 900 Short-Circuit Current (mA) 50 ISC+ 25 0 -25 ISC- -50 -75 -100 -50 5.5 -25 0 25 50 75 100 Temperature (°C) Supply Voltage (V) Figure 9. Figure 10. INPUT BIAS CURRENT vs TEMPERATURE OUTPUT VOLTAGE vs OUTPUT CURRENT 3 1000 VS = ±2.75 2 800 Output Voltage (V) Input Bias Current (pA) 900 700 600 500 400 300 200 1 +150°C +125°C +25°C -40°C 0 -1 -2 100 -3 0 -50 -25 0 25 50 75 100 125 150 0 10 20 Temperature (°C) Figure 11. 30 40 50 60 70 80 Output Current (mA) Figure 12. Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 Submit Documentation Feedback 7 OPA376 OPA2376 OPA4376 SBOS406F – JUNE 2007 – REVISED MARCH 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted. OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION (–40°C to +125°C) -25.0 -22.5 -20.0 -17.5 -15.0 -12.5 -10.0 -7.5 -5.0 -2.5 0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 Population Population OFFSET VOLTAGE PRODUCTION DISTRIBUTION ½Offset Voltage Drift½ (mV/°C) Offset Voltage (mV) Figure 13. Figure 14. MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 6 VS = 5.5V VS = 5V G = +1V/V Small-Signal Overshoot (%) Output Voltage (VPP) 5 4 3 SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE 50 VS = 2.5V 2 1 40 30 20 10 0 0 1k 10k 100k 1M 10M 10 100 Frequency (Hz) Load Capacitance (pF) Figure 15. Figure 16. SMALL-SIGNAL PULSE RESPONSE LARGE-SIGNAL PULSE RESPONSE G = +1 RL = 2kW CL = 50pF 1V/div 50mV/div G = +1 RL = 10kW CL = 50pF Time (2ms/div) Time (400ns/div) Figure 17. 8 1k Submit Documentation Feedback Figure 18. Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 www.ti.com SBOS406F – JUNE 2007 – REVISED MARCH 2013 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VO UT = VS/2, unless otherwise noted. SETTLING TIME vs CLOSED-LOOP GAIN CHANNEL SEPARATION vs FREQUENCY 140 100 Channel Separation (dB) Settling Time (ms) 120 10 0.01% 1 0.1% 100 80 60 40 20 0 0.1 1 10 10 100 100 10k 1k 100k Closed-Loop Gain (V/V) Frequency (Hz) Figure 19. Figure 20. 1M 10M 100M OPEN-LOOP OUTPUT RESISTANCE vs FREQUENCY Open-Loop Output Resistance (W) 1k 100 10 400mA Load 2mA Load 1 0.1 10 100 1k 10k 100k 1M 10M Frequency (Hz) Figure 21. Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 Submit Documentation Feedback 9 OPA376 OPA2376 OPA4376 SBOS406F – JUNE 2007 – REVISED MARCH 2013 www.ti.com APPLICATION INFORMATION The OPA376 family of operational amplifiers is built using e-trim, a proprietary technique in which offset voltage is adjusted during the final steps of manufacturing. This technique compensates for performance shifts that can occur during the molding process. Through e-trim, the OPA376 family delivers excellent offset voltage (5μV, typ). Additionally, the amplifier boasts a fast slew rate, low drift, low noise, and excellent PSRR and AOL. These 5.5MHz CMOS op amps operate on 760μA (typ) quiescent current. R2 10kW +5V C1 100nF R1 1kW VOUT OPA376 OPERATING CHARACTERISTICS VIN The OPA376 family of amplifiers has parameters that are fully specified from 2.2V to 5.5V (±1.1V to ±2.75V). Many of the specifications apply from –40°C to +125°C. Parameters that can exhibit significant variance with regard to operating voltage or temperature are presented in the Typical Characteristics. VCM = 2.5V GENERAL LAYOUT GUIDELINES Figure 22. Basic Single-Supply Connection BASIC AMPLIFIER CONFIGURATIONS The OPA376 family is unity-gain stable. It does not exhibit output phase inversion when the input is overdriven. A typical single-supply connection is shown in Figure 22. The OPA376 is configured as a basic inverting amplifier with a gain of –10V/V. This single-supply connection has an output centered on the common-mode voltage, VCM. For the circuit shown, this voltage is 2.5V, but may be any value within the common-mode input voltage range. COMMON-MODE VOLTAGE RANGE The input common-mode voltage range of the OPA376 series extends 100mV beyond the supply rails. The offset voltage of the amplifier is very low, from approximately (V–) to (V+) – 1V, as shown in Figure 23. The offset voltage increases as commonmode voltage exceeds (V+) –1V. Common-mode rejection is specified from (V–) to (V+) – 1.3V. 3 Input Offset Voltage (mV) For best operational performance of the device, good printed circuit board (PCB) layout practices are required. Low-loss, 0.1μF bypass capacitors must be connected between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable to single-supply applications. 2 1 0 -1 -2 -V +V -3 -0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Common-Mode Voltage (V) Figure 23. Offset and Common-Mode Voltage 10 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 www.ti.com SBOS406F – JUNE 2007 – REVISED MARCH 2013 INPUT AND ESD PROTECTION The OPA376 family incorporates internal electrostatic discharge (ESD) protection circuits on all pins. In the case of input and output pins, this protection primarily consists of current steering diodes connected between the input and power-supply pins. These ESD protection diodes also provide in-circuit, input overdrive protection, as long as the current is limited to 10mA as stated in the Absolute Maximum Ratings. Figure 24 shows how a series input resistor may be added to the driven input to limit the input current. The added resistor contributes thermal noise at the amplifier input and its value should be kept to a minimum in noise-sensitive applications. load, a voltage divider is created, introducing a gain error at the output and slightly reducing the output swing. The error introduced is proportional to the ratio RS/RL, and is generally negligible at low output current levels. V+ RS VOUT OPA376 10W to 20W VIN RL CL Figure 25. Improving Capacitive Load Drive V+ IOVERLOAD 10mA max ACTIVE FILTERING VOUT OPA376 VIN 5kW Figure 24. Input Current Protection CAPACITIVE LOAD AND STABILITY The OPA376 series of amplifiers may be used in applications where driving a capacitive load is required. As with all op amps, there may be specific instances where the OPAx376 can become unstable, leading to oscillation. The particular op amp circuit configuration, layout, gain, and output loading are some of the factors to consider when establishing whether an amplifier will be stable in operation. An op amp in the unity-gain (+1V/V) buffer configuration and driving a capacitive load exhibits a greater tendency to be unstable than an amplifier operated at a higher noise gain. The capacitive load, in conjunction with the op amp output resistance, creates a pole within the feedback loop that degrades the phase margin. The degradation of the phase margin increases as the capacitive loading increases. The OPAx376 in a unity-gain configuration can directly drive up to 250pF pure capacitive load. Increasing the gain enhances the ability of the amplifier to drive greater capacitive loads; see the typical characteristic plot, Small-Signal Overshoot vs Capacitive Load. In unity-gain configurations, capacitive load drive can be improved by inserting a small (10Ω to 20Ω) resistor, RS, in series with the output, as shown in Figure 25. This resistor significantly reduces ringing while maintaining dc performance for purely capacitive loads. However, if there is a resistive load in parallel with the capacitive The OPA376 series is well-suited for filter applications requiring a wide bandwidth, fast slew rate, low-noise, single-supply operational amplifier. Figure 26 shows a 50kHz, 2nd-order, low-pass filter. The components have been selected to provide a maximally-flat Butterworth response. Beyond the cutoff frequency, roll-off is –40dB/dec. The Butterworth response is ideal for applications requiring predictable gain characteristics such as the anti-aliasing filter used ahead of an analog-to-digital converter (ADC). R3 5.49kW C2 150pF V+ R1 5.49kW R2 12.4kW OPA376 VIN C1 1nF VOUT (V+)/2 Figure 26. Second-Order Butterworth 50kHz LowPass Filter Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 Submit Documentation Feedback 11 OPA376 OPA2376 OPA4376 SBOS406F – JUNE 2007 – REVISED MARCH 2013 www.ti.com OPA2376 WCSP PACKAGE The OPA2376YZD is a lead- (PB-) free, die-level, wafer chip-scale package (WCSP). Unlike devices that are in plastic packages, these devices have no molding compound, lead frame, wire bonds, or leads. Using standard surface-mount assembly procedures, the WCSP can be mounted to a PCB without additional underfill. Figure 27 and Figure 28 detail the pinout and package marking. See the NanoStar™ and NanoFree™ 300μm Solder Bump WCSP Application Note (SBVA017) for more detailed information on package characteristics and PCB design. should be expected. Fluorescent lighting may introduce noise or hum because of the time-varying light output. Best layout practices include end-product packaging that provides shielding from possible light sources during operation. DRIVING AN ANALOG-TO-DIGITAL CONVERTER The low noise and wide gain bandwidth of the OPA376 family make it an ideal driver for ADCs. Figure 29 illustrates the OPA376 driving an ADS8327, 16-bit, 250kSPS converter. The amplifier is connected as a unity-gain, noninverting buffer. OPA2376YZD Top View (bump side down) Not to Scale +5V C1 0.1mF +5V (1) +IN B D2 D1 V- -IN B C2 C1 +IN A OUT B B2 B1 -IN A V+ A2 A1 OUT A R1 100W +IN OPA376 (1) C3 1.2nF VIN ADS8327 Low Power 16-Bit 500kSPS -IN REF IN +5V WCSP-8 REF5040 4.096V Figure 27. Pin Description OPA2376YZD WCSP-8 Enlarged Image Top View (bump side down) C4 100nF NOTE: (1) Suggested value; may require adjustment based on specific application. Figure 29. Driving an ADS8327 Exact Size: 1.150mm x 2.188mm YMDCGLS Actual Size: Package Marking Code: YMD = year/month/day CGL = indicates OPA2376YZD S = for engineering purposes only Figure 28. Top View Package Marking PHOTOSENSITIVITY Although the OPA2376YZD package has a protective backside coating that reduces the amount of light exposure on the die, unless fully shielded, ambient light can reach the active region of the device. Input bias current for the package is specified in the absence of light. Depending on the amount of light exposure in a given application, an increase in bias current, and possible increases in offset voltage 12 Submit Documentation Feedback PHANTOM-POWERED MICROPHONE The circuit shown in Figure 30 depicts how a remote microphone amplifier can be powered by a phantom source on the output side of the signal cable. The cable serves double duty, carrying both the differential output signal from and dc power to the microphone amplifier stage. An OPA2376 serves as a single-ended input to a differential output amplifier with a 6dB gain. Commonmode bias for the two op amps is provided by the dc voltage developed across the electret microphone element. A 48V phantom supply is reduced to 5.1V by the series 6.8kΩ resistors on the output side of the cable, and the 4.7kΩ and zener diode on the input side of the cable. AC coupling blocks the different dc voltage levels from each other on each end of the cable. Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 OPA376 OPA2376 OPA4376 www.ti.com SBOS406F – JUNE 2007 – REVISED MARCH 2013 An INA163 instrumentation amplifier provides differential inputs and receives the balanced audio signals from the cable. The INA163 gain may be set from 0dB to 80dB by selecting the RG value. The INA163 circuit is typical of the input circuitry used in mixing consoles. Phantom Power (Provides power source for microphone) 48V Microphone 100W + 1mF + D1 5.1V 33mF R1 2.7kW R9 4.7kW R8 4.7kW R6 100W R10 6.8kW + 1/2 OPA2376 C2 33mF R11 6.8kW +15V 10mF + 2 2 3 3 1kW RG INA163 10mF + Panasonic WM-034CY 1kW 1 10kW + 1 R7 100W 3.3kW + 1/2 OPA2376 C3 33mF 3.3kW Low-level differential audio signal is transmitted differentially on the same cable as power to the microphone. -15V 10mF Typical microphone input circuit used in mixing consoles. Figure 30. Phantom-Powered Electret Microphone V+ = +2.7V to 5V Passband 300Hz to 3kHz R9 510kW R1 1.5kW R2 1MW R4 20kW C3 33pF C1 1000pF 1/2 OPA2376 Electret (1) Microphone R3 1MW R6 100kW R7 51kW R8 150kW VREF 1 8 V+ 7 1/2 OPA2376 C2 1000pF +IN ADS7822 6 12-Bit A/D 5 2 -IN DCLOCK DOUT CS/SHDN Serial Interface 3 4 R5 20kW G = 100 GND NOTE: (1) Electret microphone powered by R1. Figure 31. OPA2376 as a Speech Bandpass Filtered Data Acquisition System Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 Submit Documentation Feedback 13 OPA376 OPA2376 OPA4376 SBOS406F – JUNE 2007 – REVISED MARCH 2013 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (January 2013) to Revision F Page • Changed unit (typo) for Quiescent Current feature bullet ..................................................................................................... 1 • Changed TSSOP-14 pinout for OPA4376 ............................................................................................................................ 5 Changes from Revision D (August 2010) to Revision E Page • Changed rail-to-rail feature bullet to show input and output ................................................................................................. 1 • Changed description text to show rail-to-rail input and output ............................................................................................. 1 Changes from Revision C (October 2008) to Revision D Page • Updated format of Electrical Characteristics table ................................................................................................................ 3 • Updated Figure 11 ................................................................................................................................................................ 7 14 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Product Folder Links: OPA376 OPA2376 OPA4376 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) OPA2376AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 2376 OPA2376AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 2376 OPA2376AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OBBI OPA2376AIDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OBBI OPA2376AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OBBI OPA2376AIDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OBBI OPA2376AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 2376 OPA2376AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 2376 OPA2376AIYZDR ACTIVE DSBGA YZD 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 OPA2376 OPA2376AIYZDT ACTIVE DSBGA YZD 8 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 OPA2376 OPA376AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 376 OPA376AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BUQ OPA376AIDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BUQ OPA376AIDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BUQ OPA376AIDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BUQ OPA376AIDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BUR OPA376AIDCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BUR Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) OPA376AIDCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BUR OPA376AIDCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BUR OPA376AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 376 OPA376AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 376 OPA376AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA 376 OPA4376AIPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4376 OPA4376AIPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4376 OPA4376AIPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4376 OPA4376AIPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4376 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF OPA376 : • Automotive: OPA376-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 9-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant OPA2376AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2376AIYZDR DSBGA YZD 8 3000 180.0 8.4 1.24 2.29 0.81 4.0 8.0 Q1 OPA2376AIYZDR DSBGA YZD 8 3000 180.0 8.4 1.24 2.29 0.81 4.0 8.0 Q1 OPA2376AIYZDT DSBGA YZD 8 250 180.0 8.4 1.24 2.29 0.81 4.0 8.0 Q1 OPA2376AIYZDT DSBGA YZD 8 250 180.0 8.4 1.24 2.29 0.81 4.0 8.0 Q1 OPA376AIDBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 OPA376AIDBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 OPA376AIDBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 OPA376AIDBVT SOT-23 DBV 5 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 OPA376AIDCKR SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 OPA376AIDCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 OPA376AIDCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 OPA376AIDCKT SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3 OPA376AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA4376AIPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2376AIDR SOIC D 8 2500 367.0 367.0 35.0 OPA2376AIYZDR DSBGA YZD 8 3000 182.0 182.0 17.0 OPA2376AIYZDR DSBGA YZD 8 3000 220.0 220.0 34.0 OPA2376AIYZDT DSBGA YZD 8 250 220.0 220.0 34.0 OPA2376AIYZDT DSBGA YZD 8 250 182.0 182.0 17.0 OPA376AIDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 OPA376AIDBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 OPA376AIDBVT SOT-23 DBV 5 250 195.0 200.0 45.0 OPA376AIDBVT SOT-23 DBV 5 250 202.0 201.0 28.0 OPA376AIDCKR SC70 DCK 5 3000 195.0 200.0 45.0 OPA376AIDCKR SC70 DCK 5 3000 180.0 180.0 18.0 OPA376AIDCKT SC70 DCK 5 250 180.0 180.0 18.0 OPA376AIDCKT SC70 DCK 5 250 195.0 200.0 45.0 OPA376AIDR SOIC D 8 2500 367.0 367.0 35.0 OPA4376AIPWR TSSOP PW 14 2000 367.0 367.0 35.0 Pack Materials-Page 2 D: Max = 2.178 mm, Min =2.118 mm E: Max = 1.14 mm, Min = 1.08 mm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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