NICHIA NFSG036BT Green led Datasheet

No. STSE-CC5149A
<Cat.No.051025>
SPECIFICATIONS FOR NICHIA CHIP TYPE GREEN LED
MODEL : NFSG036BT
NICHIA CORPORATION
-0-
Nichia STSE-CC5149A
<Cat.No.051025>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Soldering Temperature
Symbol
IF
IFP
IR
PD
Topr
Tstg
Tj
Tsld
Absolute Maximum Rating
180
350
85
810
-30 ~ + 85
-40 ~ +100
105
Reflow Soldering : 260°C
Hand Soldering : 350°C
(Ts=25°C)
Unit
mA
mA
mA
mW
°C
°C
°C
for 10sec.
for 3sec.
IFP Conditions : Pulse Width <
= 10msec. and Duty <
= 1/10
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Luminous Flux
φv
Luminous Intensity
Iv
x
Chromaticity Coordinate
y
-
Condition
IF=150[mA]
IF=150[mA]
IF=150[mA]
IF=150[mA]
IF=150[mA]
Typ.
(4.0)
(12.1)
(4.5)
0.20
0.69
(Ts=25°C)
Max.
Unit
4.5
V
lm
cd
-
Min.
15.1
12.7
10.7
9.0
7.6
(Ts=25°C)
Max.
Unit
18.0
15.1
lm
12.7
10.7
9.0
Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Luminous Flux
Rank P7
Rank P6
Rank P5
Rank P4
Rank P3
Symbol
Condition
φv
IF=150[mA]
Luminous Flux Measurement allowance is ± 7%.
(IF=150mA,Ts=25°C)
Color Rank
x
y
0.190
0.628
0.136
0.739
Rank G0d
0.176
0.220
0.750
0.745
0.250
0.638
0.219
0.637
Color Coordinates Measurement allowance is ± 0.01.
One delivery will include up to one color rank and five luminous flux ranks of the products.
The quantity-ratio of the ranks is decided by Nichia.
-1-
Nichia STSE-CC5149A
<Cat.No.051025>
(4) Correspondence table of Luminous Flux – Luminous Intensity (Reference)
φV (lm)
IV (cd)
18.0
(6.8)
15.1
(5.7)
12.7
(4.7)
10.7
(3.9)
9.0
(3.3)
7.6
(2.7)
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page.
Material as follows ; Package
Encapsulating Resin
Encapsulating Resin Color
Electrodes
:
:
:
:
Ceramics
Silicone Resin (with Diffused)
Green (with Diffused)
Ag Plating
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to figure’s page.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
-U
- Year
( 4 for 2004, 5 for 2005 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
U - Ranking by Color Coordinates
- Ranking by Luminous Flux
-2-
B for Nov. )
Nichia STSE-CC5149A
<Cat.No.051025>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Steady State Operating Life
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Note
2 times
Number of
Damaged
0/50
1 time
over 95%
20 cycles
0/50
100 cycles
0/50
500 hrs.
0/50
Ta=60°C, RH=90%
500 hrs.
0/50
Ta=-40°C
500 hrs.
0/50
Ta=25°C, IF=150mA
500 hrs.
0/50
500 hrs.
0/50
500 hrs.
0/50
500 hrs.
0/50
48min.
0/50
1 time
0/50
1 time
0/50
3 times
0/50
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
Ta=100°C
0/50
Tested with Nichia standard circuit board.
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Ta=70°C, IF=100mA
Tested with Nichia standard circuit board.
60°C, RH=90%, IF=100mA
Tested with Nichia standard circuit board.
Ta=-40°C, IF=150mA
Tested with Nichia standard circuit board.
JEITA ED-4701
400 403
Substrate Bending
JEITA ED-4702
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3direction, 4cycles
3mm, 5 ± 1 sec.
Adhesion Strength
JEITA ED-4702
5N,
Electrostatic Discharges
JEITA ED-4701
300 304
R=1.5kΩ, C=100pF
Test Voltage=2kV
10 ± 1 sec.
Negative/Positive
Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 140°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Min.
Max.
Item
Symbol Test Conditions
Forward Voltage
VF
IF=150mA
Initial Level
Luminous Flux
φv
IF=150mA
Initial Level 0.7
The test is performed after the board is cooled down to the room temperature.
-3-
1.1
Nichia STSE-CC5149A-3
<Cat.No.071112>
7.CAUTIONS
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag. A package of
a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within
a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in the moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel).
It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following condition.
Baking treatment : more than 24 hours at 65 ± 5°C
· This product has silver plated metal parts that are inside and/or outside the package body. The silver
plating becomes tarnished when being exposed to an environment which contains corrosive gases.
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.
Please do not expose the LEDs to corrosive atmosphere during storage.
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by
components and materials in close proximity of the LEDs within an end product, and the gases entering
into the product from the external atmosphere. The above should be taken into consideration when
designing.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
(3) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,
or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
-4-
Nichia STSE-CC5149A-1
<Cat.No.060428>
(4) Designing the position of LED on a board.
· No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder
to avoid a crack of LED package.
Refer to the following recommended position and direction of LED.
【No good】
【Recommended Direction】
Cathode mark
Cathode mark
Appropriate LED mounting is to place perpendicularly against the stress affected side.
· Depending on the position and direction of LED, the mechanical stress on the LED package can be
changed. Refer to the following figure.
E
Perforated line
D
C
B
A
Slit
Stress : A > B = C > D > E
· Do not split board by hand. Split with exclusive special tool.
· If an aluminum circuit board is used, a large stress by thermal shock might cause a solder crack.
For this reason, it is recommended an appropriate verification should be taken before use.
-5-
Nichia STSE-CC5149A-2
<Cat.No.061220>
(5) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180 ~ 200°C
120 ~ 150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
240°C Max.
10sec. Max.
1 ~ 5°C / sec.
Pre-heating
180 ~ 200°C 60sec.Max.
260°C Max.
10sec. Max.
Above 220°C
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
3.7
4.5
1.4
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package.
The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
(6) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
-6-
Nichia STSE-CC5149A-2
<Cat.No.061220>
(7) Heat Generation
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in this specification.
· Please determine the operating current with consideration of the ambient temperature local to the LED
and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS
in this specifications. Please also take measures to remove heat from the area near the LED to improve
the operational characteristics of the LED.
· The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation
between Tj and Ts.
Tj=Ta + Rja W
1
Tj=Ts + Rjs W
2
Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C,
Ts = Solder Temperature (Cathode Side) : °C,
Rja = Heat resistance from Dice to Ambient temperature : °C /W,
Rjs = Heat resistance from Dice to Ts measuring point ≒ 85°C /W,
W = Inputting Power (IF VF) : W
(8) Others
· NFSG036B complies with RoHS Directive.
· The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent
looking directly at the LEDs with unaided eyes for more than a few seconds.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written
consent from Nichia.
When defective LEDs are found, the User shall inform Nichia directly before
disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-7-
Nichia STSE-CC5149A
<Cat.No.051025>
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
0.7
G0d
550
560
0.6
570
500
0.5
y
580
590
0.4
600
0.3
610
620
630
490
0.2
480
0.1
470
460
0
0
0.1
0.2
0.3
0.4
x
½ Color Coordinates Measurement allowance is ± 0.01.
-8-
0.5
0.6
0.7
0.8
-9-
Forward Voltage VF (V)
10
2.5 3.0 3.5 4.0 4.5 5.0 5.5
Forward Voltage VF (V)
Ta=25°C
2.0
1.5
1.0
0.5
0
0
100 200 300 400 500
Forward Current IFP (mA)
Ambient Temperature vs.
Forward Voltage
Ambient Temperature vs.
Relative Luminous Flux
5.5
2.0
5.0
IFP=150mA
IFP=100mA
4.5
4.0
3.5
3.0
2.5
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Allowable Forward Current IFP (mA)
50
1000
2.5
IFP=150mA
1.0
0.5
0.2
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Ta=25°C
500
350
180
Pulse Width <
= 10msec.
½
100
1
5 10 20
50 100
Duty Ratio (%)
Ambient Temperature vs.
Allowable Forward Current
Allowable Forward Current IF (mA)
150
100
Relative Luminous Flux (a.u.)
Ta=25°C
Relative Luminous Flux (a.u.)
Forward Current IFP (mA)
1000
Duty Ratio vs.
Allowable Forward Current
Forward Current vs.
Relative Luminous Flux
Forward Voltage vs.
Forward Current
250
Rja=110°C/W
200
180
150
100
50
0
0
20
40
60
80 100
Ambient Temperature Ta (°C)
NICHIA CORPORATION
NFSG036B
Title
CHARACTERISTICS
No.
051014546171
Nichia STSE-CC5149A
<Cat.No.051025>
Model
Forward Current vs.
Chromaticity Coordinate (λD)
y
0.70
0.65
Ta=25°C
150mA 40mA
180mA (530nm) (539nm)
20mA
(529nm)
80mA
(542nm)
(535nm)
350mA
(524nm)
0.60
0.55
0.10 0.15 0.20 0.25 0.30 0.35
560
550
Ta=25°C
540
530
520
510
500
10
100
1000
Forward Current IFP (mA)
Ta=25°C
IF=150mA
1.0
0.8
0.6
0.4
0.2
0
350
450
550
650
Wavelength λ (nm)
750
Ambient Temperature vs.
Dominant Wavelength
Dominant Wavelength λ D (nm)
-10-
Dominant Wavelength λ D (nm)
x
Forward Current vs.
Dominant Wavelength
1.2
Directivity
532
0°
1.0
533
IFP=150mA
Relative Illuminance (a.u.)
0.75
Relative Emission Intensity (a.u.)
0.80
Spectrum
531
530
529
528
-40 -20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Ta=25°C
IFP=150mA
10° 20°
30°
40°
50°
60°
0.5
70°
80°
0
90°
60°
30°
Radiation Angle
NICHIA CORPORATION
0.5
90°
1.0
NFSG036B
Title
CHARACTERISTICS
No.
051014546181
Nichia STSE-CC5149A
<Cat.No.051025>
Model
0°
3.3
3.5
φ 2.6
1.6
3.3
3.5
0.8
Cathode mark
Anode
Cathode
-11-
A
K
Protection device
MATERIALS
PACKAGE
Ceramics
ENCAPSULATING RESIN
Silicone Resin (with Diffused)
ENCAPSULATING RESIN COLOR
Green (with Diffused)
ELECTRODES
Ag Plating
½ NFSG036x has a protection device built in as a protection
circuit against static electricity.
Model
NICHIA CORPORATION
Title
No.
NFSG036x
OUTLINE DIMENSIONS
051014538652
Unit
mm
8/1
Scale
Allow
±0.2
Nichia STSE-CC5149A
<Cat.No.051025>
ITEM
+0.1
-0
±0.1
4
Cathode mark
±1
1.75
φ1.5
Reel PART
±0.1
Taping PART
±0.05
φ180
0.2
±0.05
+1
1
XXXX LED
+0.2
-0
φ1.5
TYPE NFSx036xT
LOT XXXXXX-△■
QTY
pcs
±0.1
3.85
Reel End of Tape
±
0.
2
Label
±0.1
8
φ
13
±0.1
φ60-0
5.5
+0.3
12-0.1
8
0.
±
21
φ
3.85
±0.1
2
15.4
+1
13-0
+0
-3
±0.05
No LEDs
LEDs mounting part
No LEDs
Top cover tape
-12Pull direction
Reel Lead Min.40mm (No LEDs)
Embossed carrier tape
Reel Lead Min.160mm (No LEDs is more than 40)
Reel Lead Min.400mm
Taping is based on the JIS C 0806 : Packaging of Electronic
Components on Continuous Tapes.
Model
NICHIA CORPORATION
Title
No.
NFSx036xT
TAPING DIMENSIONS
050620537332
Unit
mm
Scale
Allow
Nichia STSE-CC5149A
<Cat.No.051025>
2,000pcs/Reel
Nichia STSE-CC5149A
<Cat.No.051025>
The reel and moisture absorbent material are put in the moisture proof foil bag
and then heat sealed.
Reel
Label
NICHIA
Seal
XXXX LED
TYPE
LOT
QTY
NFSx036xT
xxxxxx-U„
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture proof foil bag
Moisture
absorbent material
The box is partitioned with the
cardboard.
Label
NICHIA
Nichia
XXXX LED
LED
TYPE
RANK
QTY
NFSx036xT
U„
PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag
Cardboard box
Cardboard box S
Cardboard box M
Cardboard box L
Reel/bag
1reel
Quantity/bag (pcs)
2,000 MAX.
Dimensions (mm)
291¯237¯120¯8t
259¯247¯243¯5t
444¯262¯259¯8t
NICHIA CORPORATION
-13-
Reel/box
5reel MAX.
10reel MAX.
20reel MAX.
Quantity/box (pcs)
10,000 MAX.
20,000 MAX.
40,000 MAX.
Model
NFSx036xT
Title
PACKING
No.
050616541931
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