DA6240.001 20 November 2006 MAS6240 Piezo Driver with Multi-Mode Charge Pump This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice. • Both Single Ended and Differential Output • Three-Step Volume Adjusting • Up to 18Vpp Output from 3V Supply • One Wire Audio & Shutdown Control • High Efficiency • Solution without Inductors • Low External Part Count DESCRIPTION MAS6240 is a piezo driver device that can drive outputs up to 18Vpp from 3V supply. An internal three-mode charge pump generates boosted supply voltage for piezo driver. For adjusting the piezo element sound volume, the charge pump can operate in either of a 1x, 2x or 3x mode. In 1x mode the input voltage is bypassed to the output, in 2x or 3x mode the input voltage is boosted up accordingly 2 or 3 times. Charge pump mode is selected by control pins EN1 and EN2 (see Table1 at page 2). MAS6240 is an easy and low-cost solution for piezo driver, since only 4 small value capacitors are needed in addition to sound element - the use of inductors can be avoided. The inductorless design also causes significantly less disturbance to the surrounding circuits making it an ideal choice for sensitive designs. Its charge pump switches at 1MHz, allowing to use as small as 100nF external capacitors. Control logic is switching the charge pump on at first rising signal of digital input (DIN) pin. The switch-off signal will be generated while the signal at DIN has been low at least for 10ms. The piezo driver is enabled at a second rising edge of a pulse at DIN and the signal is transferred to piezo output VO1. The same signal is inverted into output VO2 for using differential output. Continuous logic high level at DIN input causes the charge pump to be turned ON but leaves the audio amplifier disabled. In that state the charge pump output can be used to power the external LEDs or any other external circuit. The output voltage is still selectable at three steps. In "disabled" mode (DIN has been low for 10ms) all functional blocks are switched off to achieve the quiescent current less than 1µA. See more information in the chapter Detailed Description. FEATURES APPLICATIONS Thin 0.75 mm QFN 12 package Piezo Driver • Three-Step Volume Adjusting • Both Single Ended and Differential Output • Up to 18Vpp Output from 3V Supply • One Wire Audio & Shutdown Control •Wrist Watches •Alarm Clocks •Handheld GPS devices •PDAs •Portable Device with Sound Feature Charge Pump • Low External Part Count • Solution without Inductors • 1 MHz Switching Frequency • Multi-Mode Charge Pump (1x/2x/3x) 1 (10) DA6240.001 20 November 2006 BLOCK & APPLICATION DIAGRAM 0.1uF CP1 0.1uF CN1 CP2 CN2 VIN (3V) 1x/2x/3x Charge Pump Oscillator 1MHz 0.1uF EN1 EN2 VOUT 0.1uF Short Circuit Protection Control Logic DIN VO1 PIEZO SOUNDER VO2 GND Figure 1: Charge Pump + Single End Piezo Driver (max 9Vpp) 0.1uF CP1 0.1uF CN1 CP2 CN2 VIN (3V) Oscillator 1MHz 0.1uF EN1 EN2 1x/2x/3x Charge Pump Control Logic VOUT 0.1uF Short Circuit Protection DIN VO1 PIEZO SOUNDER VO2 GND Figure 2: Charge Pump + Differential Piezo Driver (max 18Vpp) Table 1 Charge Pump boosting mode selection DIN EN1 EN2 Charge Pump 0 1 1 1 1 0 0 1 1 0 1 0 1 OFF OFF 1x Mode (VIN) 2x Mode (2xVIN) 3x Mode (3xVIN) Note: Pulsed signal at digital input DIN is taken as “1” if pulse low time is less than 10 ms! 2 (10) DA6240.001 20 November 2006 PIN DESCRIPTION Pin Description Symbol Type Control signal input for setting charge pump mode Control signal input for setting charge pump mode Enable signal + Digital signal input Flying capacitor negative terminal Supply ground Digital audio signal output Digital audio signal output Flying capacitor negative terminal Flying capacitor positive terminal Charge pump output Flying capacitor positive terminal Power supply EN1 EN2 DIN CN1 GND VO2 VO1 CN2 CP1 VOUT CP2 VIN DI DI DI I/O G DO DO I/O I/O AO I/O P X-coordinate Y-coordinate 152 µm 152 µm 152 µm 672 µm 808 µm 980 µm 980 µm 980 µm 980 µm 765 µm 612 µm 447 µm 989 µm 804 µm 588 µm 200 µm 202 µm 225 µm 378 µm 558 µm 711 µm 1000 µm 1000 µm 999 µm G = Ground, P = Power, D = Digital, A = Analog, I = Input, O = Output. Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. Note: See IC outlines on a page 6 for IC layout. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Supply Voltage Outputs and Flying Capacitors Pins Voltages VIN VOUT, CP1, CP2, CN1, CN2, VO1, VO2 DIN, EN1, EN2 tSC Voltage Range for Input Pins VOUT Short-Circuit Duration Storage Temperature ESD Rating Conditions Min Max Unit -0.3 -0.3 5.5 10 V V -0.3 VIN + 0.3 V Note 1 Indefinite -55 o +150 1 Human Body Model (HBM) C kV NOTE 1. SHORT CIRCUIT CURRENT INTERNALLY LIMITED. RECOMMENDED OPERATING CONDITIONS All voltages with respect to ground. Parameter Operating Junction Temperature Operating Ambient Temperature Operating Supply Voltage Symbol Conditions Min Typ Max Unit +125 °C TJ -40 TA -40 +27 +85 °C VIN 2.5 3.0 3.3 V 3 (10) DA6240.001 20 November 2006 ELECTRICAL CHARACTERISTICS TA = -40°C to +85°C, typical values at TA = 27°C, VIN = 3.0 V, C1 = 100 nF, C2 = 100 nF, COUT = 100 nF, CIN = 100 nF, Cpiezo = 15 nF, digital input DIN=4kHz; unless otherwise specified Parameter Output Voltage Current Consumption Signal Frequency Symbol VOUT ICC ISD Internal Switching Frequency (Charge Pump) VOUT Turn-ON Time (From DIN signal HIGH to 90% VOUT steady state) Shut Down delay FOSC Short Circuit Current Limit ISC Control Input Threshold VIH VIL IIH IIL tON tOFF IIH IIL IIH IIL Min VOUT pin voltage towards ground at VDD = 3 V 1x Mode (no load) 2x Mode (no load) 3x Mode (no load) Charge Pump (no load): 1x Mode 2x Mode 3x Mode Single ended application (Cpiezo = 15nF; f=4kHz): 1x Mode 2x Mode 3x Mode Differential application (Cpiezo = 15 nF; f=4kHz): 1x Mode 2x Mode 3x Mode FAUDIO Shutdown Current Control Input Current Conditions Typ EN1, EN2, DIN pins VDIN = 3V, (900kΩ pull down) VDIN = 0V VDIN = 3V VEN1,EN2 = 3V, (900kΩ pull down) VEN1,EN2 = 0V VDIN = 0V VEN1,EN2 = 3V VEN1,EN2 = 0V Unit 3 6 9 V 50 490 820 µA 0.27 1.3 2.7 mA mA 0.2 0.88 3.5 7.6 4 8 1 µA 0.6 1 1.8 MHz 10 10 60 120 20 ms 10 30 mA DIN = 0V, 1x Mode 2x Mode 3x Mode Time before device shutdown after DIN signal goes to LOW From VIN pin Max kHz µs 1.6 3.4 0 0.55 7 1 V V µA µA 3.4 0 7 1 µA µA 0 0 1 1 µA µA 4 (10) DA6240.001 20 November 2006 DETAILED DESCRIPTION MAS6240 first pulse skipping 10 9 8 7 voltage [V] 6 5 VO1 4 DIN 3 2 1 0 -1 -20 -10 0 10 20 30 40 50 60 70 time [ms] Figure 3: Enabling output VO1 The piezo driver is enabled at the second rising edge of the pulse at DIN, thus the signal is transferred to the piezo output VO1. An output VO2 is enabled at the same time, but it is optional to take it in use. Control logic is switching the charge pump on at first rising signal of digital input DIN pin. If only one continous pulse is fed to the input DIN, the output VO1 is not enabled. This make it possible to control e.g. a white LED or other device through pin VOUT while charge pump is enabled, without enabling the piezo output VO1. MAS6240 first pulse skipping & power down delay 10 8 voltage [V] 6 DIN 4 VO2 2 0 -20 -10 0 10 20 30 40 50 60 70 -2 time [sec] Figure 4: Disabling VO2 Figure 4 is drawn in the case of VO2. The switch-off signal will be generated after the signal at DIN has been low at least for 10 ms. In the figure 4 the switch-off delay is about 25 ms. Again when new pulses are fed into DIN, the charge pump and piezo driver will be enabled. 5 (10) DA6240.001 20 November 2006 VOUT VIN CP2 IC OUTLINES EN2 CP1 DIN CN2 1200 µm EN1 VO1 MAS6240 GND CN1 VO2 1130 µm DIE size = 1.13 x 1.20 mm; PAD size = 80 x 80 µm DEVICE OUTLINE CONFIGURATION QFN 3x3 12ld 7 10 1234 GAv 4 YWW 1 Top Marking Information: 1234 = Product Number Av = Version Number G = Lead Free, RoHS Compliant Package YWW = Year Week Pin nr. 1 2 3 Pin Name EN1 EN2 DIN Pin nr. 4 5 6 Pin Name CN1 GND VO2 Pin nr. Pin Name Pin nr. Pin Name 7 8 9 VO1 CN2 CP1 10 11 12 VOUT CP2 VIN 6 (10) DA6240.001 20 November 2006 PACKAGE (QFN 3X3x0.75 12ld) OUTLINE D D/2 E/2 TOP VIEW A3 A PIN 1 MARK AREA SIDE VIEW A1 SEATING PLANE DETAIL A D2 b D2/2 L Terminal Tip e Package Center Line X or Y E2 E2/2 SHAPE OF PIN #1 IDENTIFICATION IS OPTIONAL BOTTOM VIEW EXPOSED PAD DETAIL A Symbol Min Nom Max PACKAGE DIMENSIONS A 0.700 0.750 0.800 A1 0.000 0.020 0.050 A3 0.178 --0.228 b 0.180 --0.300 D 2.950 3.000 3.050 D2 (Exposed.pad) 1.300 --1.550 E 2.950 3.000 3.050 E2 (Exposed.pad) 1.300 --1.550 e 0.500 BSC L 0.300 --0.500 Dimensions do not include mold or interlead flash, protrusions or gate burrs. Unit mm mm mm mm mm mm mm mm mm mm 2500 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative 7 (10) DA6240.001 20 November 2006 SOLDERING INFORMATION ◆ For Lead-Free / Green QFN 3mm x 3mm x 0.75mm Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile According to RSH test IEC 68-2-58/20 260°C 3 Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org 7.62 - 25.4 µm, Matte Tin Lead Finish EMBOSSED TAPE SPECIFICATIONS P2 PO P1 D0 T X E W F B0 R 0.25 typ K0 X A0 User Direction of Feed Dimension Ao Bo Do E F Ko Po P1 P2 T W Min/Max 3.30 ±0.10 3.30 ±0.10 1.50 +0.1/-0.0 1.75 5.50 ±0.05 1.10 ±0.10 4.0 8.0 ±0.10 2.0 ±0.05 0.3 ±0.05 12.00 ±0.3 All dimensions in millimeters Unit Mm Mm Mm Mm Mm Mm Mm Mm Mm Mm Mm 8 (10) DA6240.001 20 November 2006 REEL SPECIFICATIONS W2 A D C Tape Slot for Tape Start N B W1 Carrier Tape Cover Tape End Start Trailer Dimension A B C D N W 1 (measured at hub) W 2 (measured at hub) Trailer Leader Components Min 1.5 12.80 20.2 100 12.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape Leader Max Unit 330 mm mm mm mm mm mm mm mm mm 13.50 14.4 18.4 9 (10) DA6240.001 20 November 2006 ORDERING INFORMATION Product Code Product Package Comments MAS6240A1HP06 Piezo Driver with Multi-Mode Charge Pump Piezo Driver with Multi-Mode Charge Pump QFN 3x3x0.75 12ld, Pb Free, RoHS Compliant EWS Tested wafers 400 µm Tape and Reel MAS6240A1TC00 Die size 1.13 x 1.20 mm The formation of product code An example for MAS6240A1HP06: MAS6240 Product name A Design version 1 Product Version HP Package: HP = QFN 3 x 3 x 0.75 (Pb free, RoHS compliant) 06 Delivery format: 06 = T&R 08 = Loose components LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O.Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Telefax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 10 (10)