SpectraLinear CY28341 Universal single-chip clock solution for via p4m266/km266 ddr system Datasheet

CY28341
Universal Single-Chip Clock Solution for VIA P4M266/KM266
DDR Systems
Features
Table 1. Frequency Selection Table
• Supports VIA¥ P4M266/KM266 chipsets
• Supports Pentium® 4, Athlon™ processors
• Supports two DDR DIMMS
• Supports three SDRAMS DIMMS at 100 MHz
• Provides:
— Two different programmable CPU clock pairs
— Six differential SDRAM DDR pairs
— Three low-skew/low-jitter AGP clocks
— Seven low-skew/low-jitter PCI clocks
— One 48M output for USB
— One programmable 24M or 48M for SIO
• Dial-a-Frequency™ and Dial-a-dB¥ features
• Spread Spectrum for best electromagnetic interference
(EMI) reduction
• Watchdog feature for systems recovery
• SMBus-compatible for programmability
• 56-pin SSOP and TSSOP packages
REF(0:1)
XTAL
REF0
VDDI
CPUCS_T/C
FS0
SELP4_K7#
VDDC
CPU(0:1)/CPU0D_T/C
PLL1
VDDPCI
PCI(3:6)
FS3 FS1
PCI_F
MULTSEL
PCI2
PD#
PCI1
VDDAGP
AGP(0:2)
SDATA
SCLK
SMBus
AGP
66.80
66.80
60.00
66.67
72.00
70.00
64.00
70.00
77.00
73.33
60.00
60.00
60.00
66.67
66.67
66.67
VDD48M
48M
PLL2
/2
WDEN
24_48M
WD
SELSDR_DDR
Buf_IN
S2D
CONVERT
SRESET#
VDDD
FBOUT
*FS0/REF0
VSSR
XIN
XOUT
VDDAGP
AGP0
*SELP4_K7/AGP1
AGP2
VSSAGP
**FS1/PCI_F
**SELSDR_DDR/PCI1
*MULTSEL/PCI2
VSSPCI
PCI3
PCI4
VDDPCI
PCI5
PCI6
VSS48M
**FS3/48M
**FS2/24_48M
VDD48M
VDD
VSS
IREF
*PD#/SRESET#
SCLK
SDATA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
C Y 28341
VDDR
XIN
FS2
CPU
66.80
100.00
120.00
133.33
72.00
105.00
160.00
140.00
77.00
110.00
180.00
150.00
90.00
100.00
200.00
133.33
PCI
33.40
33.40
30.00
33.33
36.00
35.00
32.00
35.00
38.50
36.67
30.00
30.00
30.00
33.33
33.33
33.33
Pin Configuration[1]
Block Diagram
XOUT
FS(3:0)
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1100
1111
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
VTTPWRGD#/REF1
VDDR
VSSC
CPUT/CPUOD_T
CPUC/CPUOD_C
VDDC
VDDI
CPUCS_C
CPUCS_T
VSSI
FBOUT
BUF_IN
DDRT0/SDRAM0
DDRC0/SDRAM1
DDRT1/SDRAM2
DDRC1/SDRAM3
VDDD
VSSD
DDRT2/SDRAM4
DDRC2/SDRAM5
DDRT3/SDRAM6
DDRC3/SDRAM7
VDDD
VSSD
DDRT4/SDRAM8
DDRC4/SDRAM9
DDRT5/SDRAM10
DDRC5/SDRAM11
56 pin SSOP
DDRT(0:5)/SDRAM(0,2,4,6,8,10)
DDRC(0:5)/SDRAM(1,3,5,7,9,11)
Note:
1. Pins marked with [*] have internal pull-up resistors. Pins marked with [**] have internal pull-down resistors.
Rev 1.0, November 20, 2006
2200 Laurelwood Road, Santa Clara, CA 95054
Page 1 of 19
Tel:(408) 855-0555
Fax:(408) 855-0550
www.SpectraLinear.com
CY28341
Pin Description[2]
Pin
Name
PWR
I/O
Description
I
Oscillator Buffer Input. Connect to a crystal or to an external clock.
O
Oscillator Buffer Output. Connect to a crystal. Do not connect when an
external clock is applied at XIN.
3
XIN
4
XOUT
VDD
1
FS0/REF0
VDD
56
VTTPWRGD#
VDDR
I
If SELP4_K7 = 1, with a P4 processor setup as CPUT/C. At power-up,
VTT_PWRGD# is an input. When this input transitions to a logic LOW, the FS
(3:0) and MULTSEL are latched and all output clocks are enabled. After the
first HIGH to LOW transition on VTT_PWRGD#, this pin is ignored and will not
effect the behavior of the device thereafter. When the VTT_PWRGD# feature
is not used, please connect this signal to ground through a 10K:resistor.
REF1
VDDR
O
If SELP4_K7 = 0, with an Athlon (K7) processor as CPU_OD(T:C).
VTT_PWRGD# function is disabled, and the feature is ignored. This pin
becomes REF1 and is a buffered copy of the signal applied at XIN.
44,42,38, DDRT
VDDD
36,32,30 (0:5)/SDRAM(0,2,4,6,
8,10)
O
These pins are programmable through strapping pin11, SELSDR_DDR#.If
SELSDR_DDR#.= 0, these pins are configured for DDR clock outputs. They
are “True” copies of signal applied at Pin45, BUF_IN. In this mode, VDDD must
be 2.5VIf SelSDR_DDR#.= 1, these pins are configured for
SDRAM(0,2,4,6,8,10) single ended clock outputs, copies of (and in phase with)
signal applied at Pin45, BUF_IN. In this mode, VDDD must be 3.3V
VDDD
43,41,37 DDRC
35,31,29 (0:5)/SDRAM(1,3,5,7,
9,11)
O
These pins are programmable through strapping pin11, SELSDR_DDR#.If
SelSDR_DDR#.= 0, these pins are configured for DDR clock outputs. They are
“Complementary” copies of signal applied at Pin45, BUF_IN. In this mode,
VDDD must be 2.5VIf SelSDR_DDR#.= 1, these pins are configured for
SDRAM(1,3,5,7,9,11) single-ended clock outputs, copies of (and in phase with)
signal applied at Pin45, BUF_IN. In this mode, VDDD must be 3.3V.
I/O Power-on Bidirectional Input/Output. At power-up, FS0 is the input. When
PU the power supply voltage crosses the input threshold voltage, FS0 state is
latched and this pin becomes REF0, buffered copy of signal applied at XIN.
7
SELP4_K7 / AGP1
VDDAG
P
I/O Power-on Bidirectional Input/Output. At power-up, SELP4_K7 is the input.
PU When the power supply voltage crosses the input threshold voltage, SELP4_K7
state is latched and this pin becomes AGP1 clock output. SELP4_K7 = 1, P4
mode. SELP4_K7 = 0, K7 mode.
12
MULTSEL / PCI2
VDDPCI
I/O Power-on Bidirectional Input/Output. At power-up, MULTSEL is the input.
PU When the power supply voltage crosses the input threshold voltage, MULTSEL
state is latched and this pin becomes PCI2 clock output. MULTSEL = 0, Ioh is
4 x IREFMULTSEL = 1, Ioh is 6 x IREF.
53
CPUT/CPUOD_T
VDDC
O
3.3V CPU Clock outputs. This pin is programmable through strapping pin7,
SELP4_K7. If SELP4_K7 = 1, this pin is configured as the CPUT Clock Output.
If SELP4_K7 = 0, this pin is configured as the CPUOD_T Open Drain Clock
Output. See Table 1.
52
CPUC/CPUOD_C
VDDC
O
3.3V CPU Clock outputs. This pin is programmable through strapping pin7,
SELP4_K7. If SELP4_K7 = 1, this pin is configured as the CPUC Clock Output.
If SELP4_K7 = 0, this pin is configured as the CPUOD_C Open Drain Clock
Output. See Table 1.
48,49
CPUCS_T/C
VDDI
O
2.5V CPU Clock Outputs for Chipset. See Table 1.
14,15,17, PCI (3:6)
18
VDDPCI
O
PCI Clock Outputs. Are synchronous to CPU clocks. See Table 1.
10
FS1/PCI_F
VDDPCI
I/O Power-on Bidirectional Input/Output. At power-up, FS0 is the input. When
PD the power supply voltage crosses the input threshold voltage, FS1 state is
latched and this pin becomes PCI_F clock output.
20
FS3/48M
VDD48M
I/O Power-on Bidirectional Input/Output. At power-up, FS3 is the input. When
PD the power supply voltage crosses the input threshold voltage, FS3 state is
latched and this pin becomes 48M, a USB clock output.
Rev 1.0, November 20, 2006
Page 2 of 19
CY28341
Pin Description[2] (continued)
Pin
Name
PWR
I/O
Description
11
SELSDR_DDR#/PCI VDDPCI
1
I/O Power-on Bidirectional Input/Output. At power-up, SELSDR_DDR is the
PD input. When the power supply voltage crosses the input threshold voltage,
SELSDR_DDR state is latched and this pin becomes PCI clock
output.SelSDR_DDR#. = 0, DDR Mode. SelSDR_DDR#. = 1, SDR Mode.
21
FS2/24_48M
VDD48M
I/O Power-on Bidirectional Input/Output. At power-up, FS2 is the input. When
PD the power supply voltage crosses the input threshold voltage, FS2 state is
latched and this pin becomes 24_48M, a SIO programmable clock output.
6
AGP0
VDDAG
P
O
AGP Clock Output. Is synchronous to CPU clocks. See Table 1.
8
AGP2
VDDAG
P
O
AGP Clock Output. Is synchronous to CPU clocks. See Table 1.
25
IREF
I
Current reference programming input for CPU buffers. A precise resistor is
attached to this pin, which is connected to the internal current reference.
28
SDATA
27
SCLK
26
PD#/SRESET#
45
BUF_IN
If SelSDR_DDR#.= 0, 2.5V CMOS type input to the DDR differential buffers.If
SelSDR_DDR#.= 1, 3.3V CMOS type input to the SDR buffer.
46
FBOUT
If SelSDR_DDR#.= 0, 2.5V single ended SDRAM buffered output of the signal
applied at BUF_IN. It is in phase with the DDRT(0:5) signals.If
SelSDR_DDR#.= 1, 3.3V single ended SDRAM buffered output of the signal
applied at BUF_IN. It is in phase with the SDRAM(0:11) signals
5
VDDAGP
3.3V Power Supply for AGP clocks
I/O Serial Data Input. Conforms to the Philips I2C specification of a Slave
Receive/Transmit device. It is an input when receiving data. It is an open drain
output when acknowledging or transmitting data.
I
Serial Clock Input. Conforms to the Philips I2C specification.
I/O Power-down Input/System Reset Control Output. If Byte6 Bit7 = 0, this pin
PU becomes a SRESET# open drain output, and the internal pulled up is not active.
See system reset description. If Byte6 Bit7 = 1 (default), this pin becomes PD#
input with an internal pull-up. When PD# is asserted LOW, the device enters
power-down mode. See power management function.
51
VDDC
3.3V Power Supply for CPUT/C clocks
16
VDDPCI
3.3V Power Supply for PCI clocks
55
VDDR
3.3V Power Supply for REF clock
50
VDDI
2.5V Power Supply for CPUCS_T/C clocks
22
VDD48M
3.3V Power Supply for 48M
23
VDD
3.3V Common Power Supply
34,40
VDDD
If SelSDR_DDR#.= 0, 2.5V Power Supply for DDR clocksIf SelSDR_DDR#.=
1, 3.3V Power Supply for SDR clocks.
9
VSSAGP
Ground for AGP clocks
13
VSSPCI
Ground for PCI clocks
54
VSSC
Ground for CPUT/C clocks
33,39
VSSD
Ground for DDR clocks
19
VSS48M
Ground for 48M clock
47
VSSI
Ground for ICPUCS_T/C clocks
24
VSS
Common Ground
Note:
2. PU = internal Pull-up. PD = internal Pull-down. Typically = 250 kW (range 200 kW to 500 kW).
Rev 1.0, November 20, 2006
Page 3 of 19
CY28341
Serial Data Interface
Data Protocol
To enhance the flexibility and function of the clock synthesizer,
a two-signal serial interface is provided. Through the Serial
Data Interface, various device functions such as individual
clock output buffers, etc., can be individually enabled or
disabled.
The clock driver serial protocol accepts Byte Write, Byte Read,
Block Write, and Block Read operation from the controller. For
Block Write/Read operation, the bytes must be accessed in
sequential order from lowest to highest byte (most significant
bit first) with the ability to stop after any complete byte has
been transferred. For Byte Write and Byte Read operations,
the system controller can access individual indexed bytes. The
offset of the indexed byte is encoded in the command code,
as described in Table 2.
The registers associated with the Serial Data Interface
initializes to their default setting upon power-up, and therefore
use of this interface is optional. Clock device register changes
are normally made upon system initialization, if any are
required. The interface can also be used during system
operation for power management functions.
The Block Write and Block Read protocol is outlined in Table 3,
while Table 4 outlines the corresponding Byte Write and Byte
Read protocol. The slave receiver address is 11010010 (D2h).
Table 2. Command Code Definition
Bit
7
Description
0 = Block Read or Block Write operation
1 = Byte Read or Byte Write operation
(6:0)
Byte offset for Byte Read or Byte Write operation. For Block Read or Block Write operations, these bits
should be “0000000”
Table 3. Block Read and Block Write Protocol
Block Write Protocol
Block Read Protocol
Bit
Description
Bit
1
Start
1
2:8
Slave address – 7 bits
2:8
9
Write
9
10
Acknowledge from slave
10
11:18
Command Code – 8-bit “00000000” stands for
Block operation
11:18
19
Acknowledge from slave
19
20:27
Byte Count – 8 bits
20
28
Acknowledge from slave
21:27
Description
Start
Slave address – 7 bits
Write
Acknowledge from slave
Command Code – 8-bit “00000000” stands for
Block operation
Acknowledge from slave
Repeat start
Slave address – 7 bits
29:36
Data byte 0 – 8 bits
28
Read
37
Acknowledge from slave
29
Acknowledge from slave
38:45
Data byte 1 – 8 bits
30:37
46
Acknowledge from slave
38
....
Data Byte N/Slave acknowledge...
39:46
....
Data Byte N – 8 bits
47
....
Acknowledge from slave
48:55
....
Stop
56
Rev 1.0, November 20, 2006
Byte count from slave – 8 bits
Acknowledge
Data byte from slave – 8 bits
Acknowledge
Data byte from slave – 8 bits
Acknowledge
....
Data bytes from slave/Acknowledge
....
Data byte N from slave – 8 bits
....
Not Acknowledge
....
Stop
Page 4 of 19
CY28341
Table 4. Byte Read and Byte Write Protocol
Byte Write Protocol
Bit
Byte Read Protocol
Description
Bit
Description
1
Start
1
Start
2:8
Slave address – 7 bits
2:8
Slave address – 7 bits
9
Write
9
Write
10
Acknowledge from slave
10
Acknowledge from slave
11:18
Command Code – 8 bits “1xxxxxxx” stands for
byte operationbit[6:0] of the command code
represents the offset of the byte to be accessed
11:18
Command Code – 8 bits “1xxxxxxx” stands for
byte operationbit[6:0] of the command code
represents the offset of the byte to be accessed
19
Acknowledge from slave
19
Acknowledge from slave
20:27
Byte Count – 8 bits
20
Repeat start
28
Acknowledge from slave
21:27
Slave address – 7 bits
29
Stop
28
Read
29
Acknowledge from slave
30:37
Data byte from slave – 8 bits
38
Not Acknowledge
39
Stop
Serial Control Registers
Byte 0: Frequency Select Register
Bit
@Pup
Pin#
Name
Reserved
Description
7
0
6
H/W Setting
21
5
H/W Setting
10
FS1
For Selecting Frequencies see Table 1.
4
H/W Setting
1
FS0
For Selecting Frequencies see Table 1.
3
0
2
H/W Setting
11
1
H/W Setting
20
FS3
0
H/W Setting
7
SELP4_K7
FS2
Reserved
For Selecting Frequencies see Table 1.
If this bit is programmed to “1,” it enables Write to bits (6:4,1) for
selecting the frequency via software (SMBus). If this bit is
programmed to a “0,” it enables only Read of bits (6:4,1), which
reflects the hardware setting of FS(0:3).
SELSDR_DDR Only for reading the hardware setting of the SDRAM interface
mode, status of SELSDR_DDR# strapping.
For Selecting frequencies see Table 1
Only for reading the hardware setting of the CPU interface mode,
status of SELP4_K7# strapping.
Byte 1: CPU Clocks Register
Bit
7
@Pup
0
Pin#
Name
MODE
6
1
SSCG
1 = Enable (default). 0 = Disable
5
1
SST1
Select spread bandwidth. See Table 9.
4
1
SST0
Select spread bandwidth. See Table 9.
3
1
48,49
CPUCS_T, CPUCS_C
2
1
53,52
CPUT/CPUOD_T
CPUC/CPUOD_C
Rev 1.0, November 20, 2006
Description
0 = Down Spread. 1 = Center Spread. See Table 9.
1 = output enabled (running). 0 = output disabled asynchronously in a LOW
state.
1 = output enabled (running). 0 = output disable.
Page 5 of 19
CY28341
Byte 1: CPU Clocks Register (continued)
1
1
53,52
CPUT/C
In K7 mode, this bit is ignored.In P4 mode, 0 = when PD# asserted LOW,
CPUT stops in a HIGH state, CPUC stops in a LOW state. In P4 mode, 1 =
when PD# asserted LOW, CPUT and CPUC stop in High-Z.
0
1
11
MULT0
Only For reading the hardware setting of the Pin11 MULT0 value.
Byte 2: PCI Clock Register
Bit
@Pup
7
0
Pin#
Name
Description
PCI_DRV
PCI clock output drive strength 0 = Normal, 1 = increase the drive strength 20%.
6
1
10
PCI_F
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
5
1
18
PCI6
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
4
1
17
PCI5
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
3
1
15
PCI4
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
2
1
14
PCI3
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
1
1
12
PCI2
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
0
1
11
PCI1
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
Byte 3: AGP/Peripheral Clocks Register
Bit @Pup
Pin#
Name
Description
24_48M
“0” = pin21 output is 24MHz. Writing a “1” into this register asynchronously changes the
frequency at pin21 to 48 MHz.
7
0
21
6
1
20
48MHz
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
5
1
21
24_48M
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
4
0
6,7,8
DASAG1
3
0
6,7,8
DASAG0
Programming these bits allow shifting skew of the AGP(0:2) signals relative to their
default value. See Table 5.
2
1
8
AGP2
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
1
1
7
AGP1
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
0
1
6
AGP0
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
Table 5. Dial-a-Skew™ AGP(0:2)
DASAG (1:0)
AGP(0:2) Skew Shift
00
Default
01
–280 ps
10
+280 ps
11
+480 ps
Byte 4: Peripheral Clocks Register
Bit @Pup Pin#
Name
Description
7
1
20
48M
1 = normal strength, 0 = high strength
1 = normal strength, 0 = high strength
6
1
21
24_48M
1 = normal strength, 0 = high strength
1 = normal strength, 0 = high strength
5
0
6,7,8
4
0
6,7,8
3
1
1
REF0
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
2
1
56
REF1
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state. (K7 Mode only.)
1
1
1
REF0
1 = normal strength, 0 = high strength
0
1
56
REF1
1 = normal strength, 0 = high strength (K7 Mode only.)
DARAG1 Programming these bits allow modifying the frequency ratio of the AGP(2:0), PCI(6:1, F) clocks
DARAG0 relative to the CPU clocks. See Table 6.
Table 6. Dial-A-Ratio™ AGP(0:2)
DARAG (1:0)
Rev 1.0, November 20, 2006
CU/AGP Ratio
Page 6 of 19
CY28341
Table 6. Dial-A-Ratio™ AGP(0:2)
00
Frequency Selection Default
01
2/1
10
2.5/1
11
3/1
Byte 5: SDR/DDR Clock Register
Bit
@Pup
Pin#
Name
7
0
45
BUF_IN
threshold
voltage
Description
6
1
46
5
1
29,30
DDRT/C5/SD 1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
RAM(10,11)
4
1
31,32
DDRT/C4/SD 1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
RAM(8,9)
3
1
35,36
DDRT/C3/SD 1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
RAM(6,7)
2
1
37,38
DDRT/C2/SD 1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
RAM(4,5)
1
1
41,42
DDRT/C1/SD 1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
RAM(2,3)
0
1
43,44
DDRT/C0/SD 1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
RAM(0,1)
DDR Mode, BUF_IN threshold setting. 0 = 1.15V, 1 = 1.05VSDR Mode, BUF_IN
threshold setting. 0 = 1.35V, 1 = 1.25V
FBOUT
1 = output enabled (running). 0 = output disabled asynchronously in a LOW state.
Byte 6: Watchdog Register
Bit @Pup Pin#
26
Name
Description
7
1
6
0
SRESET# 1 = Pin 26 is the input pin as PD# signal. 0 = Pin 26 is the output pin as SRESET# signal.
5
0
WDTEST WD-Test, ALWAYS program to “0.”
4
0
WD Alarm This bit is set to “1” when the Watchdog times out. It is reset to “0” when the system clears the
WD time stamps (WD3:0).
3
0
WD3
This bit allows the selection of the time stamp for the Watchdog timer. See Table 7.
2
0
WD2
This bit allows the selection of the time stamp for the Watchdog timer. See Table 7.
1
0
WD1
This bit allows the selection of the time stamp for the Watchdog timer. See Table 7.
0
0
WD0
This bit allows the selection of the time stamp for the Watchdog timer. See Table 7.
Frequency This bit allows setting the Revert Frequency once the system is rebooted due to Watchdog time
Revert
out only.0 = selects frequency of existing H/W setting1 = selects frequency of the second to last
S/W setting (the software setting prior to the one that caused a system reboot).
Table 7. Watchdog Time Stamp
WD3
WD2
WD1
WD0
0
0
0
0
Off
0
0
0
1
1 second
0
0
1
0
2 seconds
0
0
1
1
3 seconds
0
1
0
0
4 seconds
0
1
0
1
5 seconds
0
1
1
0
6 seconds
0
1
1
1
7 seconds
1
0
0
0
8 seconds
1
0
0
1
9 seconds
1
0
1
0
10 seconds
Rev 1.0, November 20, 2006
FUNCTION
Page 7 of 19
CY28341
Table 7. Watchdog Time Stamp
1
0
1
1
11 seconds
1
1
0
0
12 seconds
1
1
0
1
13 seconds
1
1
1
0
14 seconds
1
1
1
1
15 seconds
Byte 7: Dial-a-Frequency Control Register N
Bit
@Pup
Pin#
Name
Description
7
0
Reserved
Reserved for device function test.
6
0
N6, MSB
5
0
N5
4
0
N4
3
0
N3
These bits are for programming the PLL’s internal N register. This access
allows the user to modify the CPU frequency at very high resolution
(accuracy). All other synchronous clocks (clocks that are generated from
the same PLL, such as PCI) remain at their existing ratios relative to the
CPU clock.
2
0
N2
1
0
N3
0
0
N0, LSB
Byte 8: Silicon Signature Register (All bits are Read-only)
Bit
@Pup
7
0
Pin#
Revision_ID3
Name
Revision ID bit [3]
Description
6
0
Revision_ID2
Revision ID bit [2]
5
0
Revision_ID1
Revision ID bit [1]
4
0
Revision_ID0
Revision ID bit [0]
3
1
Vender_ID3
Cypress Vender ID bit [3].
2
0
Vender_ID2
Cypress Vender ID bit [2].
1
0
Vender_ID1
Cypress Vender ID bit [1].
0
0
Vender_ID0
Cypress Vender ID bit [0].
Byte9: Dial-A-Frequency Control Register R
Bit @Pup
Pin#
Name
Description
7
0
Reserved
6
0
R5, MSB
5
0
R4
4
0
R3
3
0
R2
2
0
R1
1
0
R0
0
0
DAF_ENB This Edge-trigger bit enables the Dial-a-Frequency N and R bits. It is the transition of this bit
from “0” to “1” that latches the N(6:0) and R(5:0) data into the internal N and R registers. The
user must only program a one time “1” into this bit for every new N and R values
These bits are for programming the PLL’s internal R register. This access allows the user to
modify the CPU frequency at very high resolution (accuracy). All other synchronous clocks
(clocks that are generated from the same PLL, such as PCI) remain at their existing ratios
relative to the CPU clock.
Dial-a-Frequency Feature
SMBus Dial-a-Frequency feature is available in this device via
Byte7 and Byte9. P is a PLL constant that depends on the
frequency selection prior to accessing the Dial-a-Frequency
feature.
Table 8.
FS(4:0)
XXXXX
P
96016000
Spread Spectrum Clock Generation (SSCG)
Spread Spectrum is enabled/disabled via SMBus register
Byte 1, Bit 7.
Rev 1.0, November 20, 2006
Page 8 of 19
CY28341
operation of the system in case of a hang-up due to the
frequency change.
Table 9. Spread Spectrum Table
Mode
SST1
SST0
% Spread
0
0
0
–1.5%
0
0
1
–1.0%
0
1
0
–0.7%
0
1
1
–0.5%
1
0
0
±0.75%
1
0
1
±0.5%
1
1
0
±0.35%
1
1
1
±0.25%
When the system sends an SMBus command requesting a
frequency change through Byte 4 or through Bytes 13 and 14,
it must have previously sent a command to Byte 12, for
selecting which time out stamp the Watchdog must perform,
otherwise the System Self Recovery feature will not be applicable. Consequently, this device will change frequency and
then the Watchdog timer starts timing. Meanwhile, the system
BIOS is running its operation with the new frequency. If this
device receives a new SMBus command to clear the bits originally programmed in Byte 12,Bits (3:0) (reprogram to 0000),
before the Watchdog times out, then this device will keep
operating in its normal condition with the new selected
frequency. If the Watchdog times out the first time before the
new SMBus reprograms Byte12,Bits (3:0) to (0000), then this
device will send a low system reset pulse, on SRESET# (see
Byte12,Bit7), and changes WD alarm (Byte12,Bit4) status to
“1” then restarts the Watchdog timer again. If the Watchdog
times out a second time, then this device will send another low
pulse on SRESET#, will relatch original hardware strapping
frequency (or second to last software selected frequency, see
Byte12,Bit6) selection, set WD alarm bit (Byte12,Bit4) to “1,”
then start WD timer again. The above-described sequence will
keep repeating until the BIOS clears the SMBus
Byte12,Bits(3:0). Once the BIOS sets Byte12,Bits(3:0) = 0000,
then the Watchdog timer is turned off and the WD alarm bit
(Byte12,Bit4) is reset to”0.”
Swing Select Functions Through Hardware
MULT- Board Target Reference R,
Output
SEL Trace/Term Z IREF = VDD/(3*Rr) Current VOH@Z
0
50 Ohm
Rr = 221 1%,
IOH = 4 * 1.0V@50
IREF = 5.00 mA
Iref
1
50 Ohm
Rr = 475 1%,
IOH = 6 * 0.7V@50
IREF = 2.32 mA
Iref
System Self-recovery Clock Management
This feature is designed to allow the system designer to
change frequency while the system is running and reboot the
S y s te m r u n n in g w ith
o r ig in a lly s e le c t e d
f r e q u e n c y v ia
h a r d w a r e s t r a p p in g .
N o
F r e q u e n c y w ill c h a n g e b u t S y s t e m S e lf
R e c o v e r y n o t a p p lic a b le ( n o t im e s t a m p
s e le c t e d a n d b y t e 1 2 , b it ( 3 : 0 ) is s t ill =
"0 0 0 0 "
R e c e iv e F r e q u e n c y
C h a n g e R e q u e s t v ia
S M B u s B y t e 4 o r V ia D ia la -fre q u e n c y ?
Y e s
C h a n g e to a n e w
fre q u e n c y
N o
I s S M B u s B y t e 9 , t im e o u t
s t a m p e n a b le d - ( b y t e 1 2 , b it
(3 :0 )
0 0 0 0 )?
1 ) S e n d a n o t h e r 3 m S lo w p u ls e o n S
2 ) R e la t c h o r ig in a l h a r d w a r e s t r a p p in
f o r r e t u r n t o o r ig in a l f r e q u e n c y s e t t in g
3 ) S e t W D A la r m b it ( b y t e 1 2 , B it 4 ) t o
4 ) S ta r t W D tim e r
Y e s
R E S E T
g s e le c tio n
s .
"1 "
S ta r t in te r n a l w a tc h d o g tim e r .
Y e s
W a t c h D o g t im e o u t ?
1 ) S e n d S R E S E T
p u ls e
2 ) S e t W D b it
( b y t e 1 2 , b it 4 ) t o '1 '
3 ) S t a r t W D t im e r
Y e s
W a tc h D o g tim e o u t?
N o
N o
S M B u s b y te 1 2 tim e
o u t s t a m p d is a b le d ?
N o
S M B u s b y te 9 tim e o u t
s t a m p d is a b le d , B y t e
1 2 , b it( 3 :0 ) = ( 0 0 0 0 ) ?
N o
Y e s
Y e s
T u r n o f f w a t c h d o g t im e r .
K e e p n e w fr e q u e n c y s e ttin g . S e t W D
b it ( b y t e 1 2 , b it 4 ) t o ''0 '
a la r m
Figure 1.
Power Management Functions
All clocks can be individually enabled or stopped via the 2-wire
control interface. All clocks are stopped in the LOW state. All
clocks maintain a valid HIGH period on transitions from
running to stop and on transitions from stopped to running
Rev 1.0, November 20, 2006
when the chip was not powered down. On power-up, the
VCOs will stabilize to the correct pulse widths within about 0.5
mS.
Page 9 of 19
CY28341
Maximum Ratings[3]
This device contains circuitry to protect inputs against damage
due to high-static voltages or electric field. However, precautions should be take to avoid application of any voltage higher
than the maximum-rated voltages to this circuit. For proper
operation, VIN and VOUT should be constrained to the range:
Input Voltage Relative to VSS:...............................VSS – 0.3V
Input Voltage Relative to VDDQ or AVDD: ............. VDD + 0.3V
Storage Temperature: ................................ –65qC to + 150qC
VSS < (VIN or VOUT) < VDD.
Operating Temperature:.................................... 0qC to +70qC
Unused inputs must always be tied to an appropriate logic
voltage level (either VSS or VDD).
Maximum ESD............................................................. 2000V
Maximum Power Supply: ................................................ 5.5V
DC Parameters VDD = VDDPCI = VDDAGP = VDDR = VDD48M = VDDC = 3.3V ± 5%, VDDI = VDD = 2.5V ± 5%, TA = 0°C to +70°C
Parameter
VIL1
VIH1
VIL2
VIH2
Vol
Iol
Ioz
Idd3.3V
Idd2.5V
Ipd
Ipup
Ipdwn
Cin
Cout
Lpin
Cxtal
Description
Input Low Voltage
Input High Voltage
Input Low Voltage
Input High Voltage
Output Low Voltage for SRESET#
Pull-down Current for SRESET#
Three-state Leakage Current
Dynamic Supply Current
Dynamic Supply Current
Power-down Supply Current
Internal Pull-up Device Current
Internal Pull-down Device Current
Input Pin Capacitance
Output Pin Capacitance
Pin Inductance
Crystal Pin Capacitance
Conditions
Applicable to PD#, F S(0:4)
Min.
Typ.
Max.
0.8
2.0
Applicable to SDATA and SCLK
1.0
2.2
0.4
24
IOL
VOL = 0.4V
35
CPU Frequency Set at 133.3 MHz[5]
CPU Frequency Set at 133.3 MHz[5]
PD# = 0
Input @ VSS
Input @ VDD
Measured from the XIN or XOUT to VSS
10
190
195
600
–25
10
5
6
7
45
150
175
95
27
36
Unit
Vdc
Vdc
Vdc
Vdc
V
mA
PA
mA
mA
PA
PA
PA
pF
pF
pF
pF
AC Parameters
100 MHz
Parameter
Description
Min.
Max.
133MHz
Min.
Max
200 MHz
Min.
Max
Unit
Notes[4]
XTAL
TDC
XIN Duty Cycle
45
55
45
55
45
55
%
7,8
TPeriod
XIN Period
69.841
71.0
69.84
71.0
69.84
71.0
ns
7,8
VHIGH
XIN High Voltage
0.7VDD
VDD
0.7VDD
VDD
0.7VDD
VDD
V
9
VLOW
XIN Low Voltage
0
0.3VDD
0
0.3VDD
0
0.3VDD
V
10
Tr/Tf
XIN Rise and Fall Times
10.0
10
10
ns
10
TCCJ
XIN Cycle to Cycle Jitter
500
500
500
ps
11,12
Txs
Crystal Start-up Time
30
30
30
ms
12,9
P4 Mode CPU at 0.7V
TDC
CPUT/C Duty Cycle
45
55
45
55
45
55
%
7,11,14,21,
22
TPeriod
CPUT/C Period
9.85
10.2
7.35
7.65
4.85
5.1
ns
7,11,14,21,
22
Tr/Tf
CPUT/C Rise and Fall Times
175
700
175
700
175
700
ps
Rise/Fall Matching
Delta Tr/Tf Rise/Fall Time Variation
20%
20%
20%
125
125
125
23,24
23,26,24
ps
11,23,22
Notes:
3. Multiple Supplies: The Voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
4. All notes for this table may be found at the end of the table, on page 13.
Rev 1.0, November 20, 2006
Page 10 of 19
CY28341
AC Parameters (continued)
100 MHz
Parameter
Description
133MHz
200 MHz
Min.
Max.
Min.
Max
Min.
Max
Unit
Notes[4]
0
200
0
150
0
200
ps
11,15,21,22
TSKEW
CPUCS_T/C to CPUT/C Clock
Skew
TCCJ
CPUT/C Cycle to Cycle Jitter
–150
+150
–150
+150
–200
+200
ps
11,15,21,22
Vcross
Crossing Point Voltage at 0.7V
Swing
280
430
280
430
280
430
mV
22
45
55
45
55
45
55
%
11,14,21
CPUT/C Period
9.85
10.2
7.35
7.65
4.85
5.1
nS
11,14,21
Differential CPUT/C Rise and Fall Times
Tr/Tf
175
467
175
467
175
467
ps
13,15,25
0
200
0
150
0
200
0
11,15,21
P4 Mode CPU at 1.0V
TDC
CPUT/C Duty Cycle
TPeriod
TSKEW
CPUCS_T/C to CPUT/C Clock
Skew
TCCJ
CPUT/C Cycle to Cycle Jitter
–150
+150
–150
+150
–200
+200
ps
11,15,21
Vcross
Crossing Point Voltage at 1V
Swing
510
760
510
760
510
760
mV
26
SEDeltaSlew
Absolute Single-ended Rise/Fall
Waveform Symmetry
325
ps
24,31
K7 Mode
TDC
CPUOD_T/C Duty Cycle
TPeriod
CPUOD_T/C Period
325
325
45
55
45
55
45
55
%
11,14
9.98
10.5
7.5
8.0
5
5.5
ns
11,14
TLOW
CPUOD_T/C LOW Time
2.8
ns
11,14
Tf
CPUOD_T/C Fall Time
0.4
1.6
1.67
0.4
1.6
0.4
2.8
1.6
ns
11,13
TSKEW
CPUCS_T/C to CPUT/C Clock
Skew
0
200
0
150
0
200
0
11,15,21
TCCJ
CPUOD_T/C Cycle to Cycle
Jitter
–150
+150
–150
+150
–200
+200
ps
11,14
VD
Differential Voltage AC
0.4
Vp+.6V
0.4
Vp+.6V
0.4
Vp+.6V
V
20
VX
Differential Crossover Voltage
500
1100
500
1100
500
1100
mV
19
CHIPSET CLOCK
TDC
CPUCS_T/C Duty Cycle
45
55
45
55
45
55
%
7,11,14
CPUCS_T/C Period
10.0
10.5
15
15.5
10.0
10.5
ns
7,11,14
Tr / Tf
CPUCS_T/C Rise and Fall Times
0.4
1.6
0.4
1.6
0.4
1.6
ns
7,11,13
VD
Differential Voltage AC
0.4
Vp+.6V
0.4
Vp+.6V
0.4
Vp+.6V
V
27
VX
Differential Crossover Voltage
0.5*VDDI 0.5*VDDI + 0.5*VDDI 0.5*VDDI 0.5*VDDI 0.5*VDDI
– 0.2
– 0.2
– 0.2
0.2
+ 0.2
+ 0.2
V
21
TPeriod
AGP
TDC
AGP(0:2) Duty Cycle
45
55
45
55
45
55
%
7,11,14
TPeriod
AGP(0:2) Period
15
16
15
16
15
16
ns
7,11,14
THIGH
AGP(0:2) HIGH Time
5.25
5.25
5.25
ns
11,16
TLOW
AGP(0:2) LOW Time
5.05
5.05
5.05
ns
11,17
Tr / Tf
AGP(0:2) Rise and Fall Times
0.4
1.6
ns
11,13
TSKEW
Any AGP to Any AGP clock Skew
250
250
250
ps
11,15
TCCJ
AGP(0:2) Cycle to Cycle Jitter
500
500
500
ps
11,14,15
PCI
TDC
PCI(_F,1:6) Duty Cycle
55
%
7,11,14
TPeriod
PCI(_F,1:6) Period
ns
7,11,14
Rev 1.0, November 20, 2006
45
30.0
1.6
55
0.4
45
30.0
1.6
55
0.4
45
30.0
Page 11 of 19
CY28341
AC Parameters (continued)
100 MHz
Parameter
Description
Min.
Max.
133MHz
Min.
200 MHz
Max
Min.
Max
Unit
Notes[4]
THIGH
PCI(_F,1:6) HIGH Time
12.0
12.0
12.0
ns
11,16
TLOW
PCI(_F,1:6) LOW Time
12.0
12.0
12.0
ns
11,17
Tr / Tf
PCI(_F,1:6) Rise and Fall Times
0.5
2.5
ns
11,13
TSKEW
Any PCI to Any PCI Clock Skew
500
500
500
ps
11,15
TCCJ
PCI(_F,1:6) Cycle to Cycle Jitter
500
500
500
ps
11,14,15
48MHz
TDC
48MHz Duty Cycle
55
%
7,11,14
TPeriod
48MHz Period
Tr / Tf
48MHz Rise and Fall Times
TCCJ
48MHz Cycle to Cycle Jitter
24MHz
TDC
24MHz Duty Cycle
TPeriod
24MHz Period
Tr / Tf
24MHz Rise and Fall Times
TCCJ
24MHz Cycle to Cycle Jitter
REF
TDC
REF Duty Cycle
TPeriod
REF Period
Tr / Tf
REF Rise and Fall Times
TCCJ
REF Cycle to Cycle Jitter
DDR
VX
Crossing Point Voltage of
DDRT/C
2.5
45
55
20.8299
20.8333
1.0
4.0
0.5
45
2.5
55
0.5
45
20.8299 20.8333 20.8299 20.8333
1.0
500
4.0
1.0
500
ns
7,11,14
4.0
ns
11,13
500
ps
11,14,15
%
7,11,14
45
55
45
55
45
55
41.660
41.667
41.660
41.667
41.660
41.667
ns
7,11,14
1.0
4.0
1.0
4.0
1.0
4.0
ns
11,13
500
ps
11,14,15
500
500
45
55
45
55
45
55
%
7,11,14
69.8413
71.0
69.8413
71.0
69.8413
71.0
ns
7,11,14
1.0
4.0
1.0
4.0
1.0
4.0
ns
11,13
1000
ps
11,14,15
V
19
1000
1000
0.5*VDD 0.5*VDDD + 0.5*VDD 0.5*VDD 0.5*VDD 0.5*VDD
– 0.2
0.2
D – 0.2
D+ 0.2
D–0.2
D+0.2
VD
Differential Voltage Swing
0.7
VDDD + 0.6
0.7
VDDD +
0.6
0.7
VDDD +
0.6
V
20
TDC
DDRT/C(0:5) Duty Cycle
45
55
45
55
45
55
%
21
TPeriod
DDRT/C(0:5) Period
9.85
10.2
14.85
15.3
9.85
10.2
ns
21
Tr / Tf
DDRT/C(0:5) Rise/Fall Slew
Rate
1
3
1
3
1
3
V/ns
13
TSKEW
DDRT/C to Any DDRT/C Clock
Skew
100
100
100
ps
11,15,21
TCCJ
DDRT/C(0:5) Cycle to Cycle
Jitter
±75
±75
±75
ps
11,15,21
THPJ
DDRT/C(0:5) Half-period Jitter
±100
±100
±100
ps
11,15,21
TDelay
BUF_IN to Any DDRT/C Delay
TSKEW
FBOUT to Any DDRT/CSkew
tstable
All Clock Stabilization from
Power-up
Rev 1.0, November 20, 2006
1
4
ns
11,14
100
4
1
100
4
1
100
ps
11,14
3
3
3
ms
18
Page 12 of 19
CY28341
AC Parameters (continued)
100 MHz
Parameter
Description
Min.
Max.
133MHz
Min.
Max
200 MHz
Min.
Max
Unit
Notes[4]
Notes:
5. All outputs loaded as per maximum capacitive load table.
6. All outputs are not loaded.
7. This parameter is measured as an average over a 1-Ps duration, with a crystal center frequency of 14.31818 MHz.
8. This is required for the duty cycle on the REF clock out to be as specified. The device will operate reliably with input duty cycles up to 30/70 but the REF clock
duty cycle will not be within data sheet specifications.
9. When crystal meets minimum 40-ohm device series resistance specification.
10. Measured between 0.2VDD and 0.7VDD.
11. All outputs loaded as per loading specified in the Table 11.
12. When XIN is driven from an external clock source (3.3V parameters apply).
13. Probes are placed on the pins, and measurements are acquired between 0.4V and 2.4V for 3.3V signals and between 0.4V and 2.0V for 2.5V signals, and
between 20% and 80% for differential signals.
14. Probes are placed on the pins, and measurements are acquired at 1.5V for 3.3V signals and at 1.25V for 2.5V, and 50% point for differential signals.
15. This measurement is applicable with Spread ON or spread OFF.
16. Probes are placed on the pins, and measurements are acquired at 2.4V for 3.3V signals and at 2.0V for 2.5V signals)
17. Probes are placed on the pins, and measurements are acquired at 0.4V.
18. The time specified is measured from when all VDD's reach their respective supply rail (3.3V and 2.5V) till the frequency output is stable and operating within the
specifications.
19. The typical value of VX is expected to be 0.5*VDDD (or 0.5*VDDC for CPUCS signals) and will track the variations in the DC level of the same.
20. VD is the magnitude of the difference between the measured voltage level on a DDRT (and CPUCS_T) clock and the measured voltage level on its complementary
DDRC (and CPUCS_C) one.
21. Measured at VX, or where subtraction of CLK-CLK# crosses 0 volts.
22. See Figure 10. for 0.7V loading specification.
23. Measured from Vol=0.175V to Voh=0.525V.
24. Measurements taken from common mode waveforms, measure rise/fall time from 0.41V to 0.86V. Rise/fall time matching is defined as “the instantaneous
difference between maximum clk rise (fall) and minimum clk# fall (rise) time, or minimum clk rise (fall) and maximum clk# fall (rise) time”. This parameter is
designed for waveform symmetry.
25. Measurement taken from differential waveform, from -0.35V to +0.35V.
26. Measured in absolute voltage, i.e. single-ended measurement.
27. Measured at VX between the rising edge and the following falling edge of the signal.
28. Measured at VX between the falling edge and the following rising edge of the signal.
29. This parameter is intended to be 0.45*Tperiod(min) for minimum spec. and 0.55*Tperiod(min) for maximum spec.
30. Determined as a fraction of 2*(Trise-Tfall)/(Trise+Tfall).
P4 Processor SELP4_K7# = 1
Power-down Assertion (P4 Mode)
When PD# is sampled LOW by two consecutive rising edges
of CPU# clock then all clock outputs except CPU clocks must
be held LOW on their next HIGH to LOW transition. CPU
clocks must be held with the CPU clock pin driven HIGH with
a value of 2 x Iref, and CPU# undriven. Note that Figure 4
shows CPU = 133 MHz, this diagram and description is applicable for all valid CPU frequencies 66, 100, 133, 200MHz.Due
to the state of internal logic, stopping and holding the REF
clock outputs in the LOW state may require more than one
clock cycle to complete.
PW RDW N#
C PU T 133M H z
C PU T# 133M H z
PC I 33M H z
AG P 66M H z
U SB 48M H z
R E F 1 4 .3 1 8 M H z
D D R T 133M H z
D D R C 133M H z
SD R AM 133M H z
Figure 2. Power-down Assertion Timing Waveform (in P4 Mode)
Rev 1.0, November 20, 2006
Page 13 of 19
CY28341
Power-down Deassertion (P4 Mode)
The power-up latency needs to be less than 3 mS.
< 1 .5 m s e c
PW RDW N#
CPU 133M Hz
CPU# 133M Hz
PCI 33M Hz
AG P 66M Hz
USB 48M Hz
R E F 1 4 .3 1 8 M H z
DDRT 133M Hz
DDRC 133M Hz
SDRAM 133M Hz
Figure 3. Power-down Deassertion Timing Waveform (in P4 Mode)
AMD K7 Processor SELP4_K7# = 0
Power-down Assertion (K7 Mode)
When the PD# signal is asserted LOW, all clocks are disabled
to a LOW level in an orderly fashion prior to removing power
from the part. When PD# is asserted (forced) LOW, the device
transitions to a shutdown (power-down) mode and all power
supplies may then be removed. When PD# is sampled LOW
by two consecutive rising edges of CPU clock, then all affected
clocks are stopped in a LOW state as soon as possible. When
in power-down (and before power is removed), all outputs are
synchronously stopped in a LOW state (see figure3 below), all
PLL's are shut off, and the crystal oscillator is disabled. When
the device is shutdown, the I2C function is also disabled.
PW RDW N#
C PUO D_T 133M Hz
C PU CS_T 133M Hz
C PU O D _C 133M Hz
CPUC S_C 133M Hz
PCI 33M Hz
AG P 66M Hz
U SB 48M Hz
R E F 1 4 .3 1 8 M H z
DD RT 133M Hz
DDR C 133M Hz
SD RAM 133M Hz
Figure 4. Power-down Assertion Timing Waveform (in K7 Mode)
Rev 1.0, November 20, 2006
Page 14 of 19
CY28341
Power-down Deassertion (K7 Mode)
When de-asserted PD# to HIGH level, all clocks are enabled
and start running on the rising edge of the next full period in
order to guarantee a glitch-free operation, no partial clock
pulses.
< 1 .5 m se c
PW RDW N#
CPU 133MHz
CPU# 133MHz
PCI 33MHz
AGP 66MHz
USB 48MHz
R E F 1 4 .3 1 8 M H z
DDRT 133MHz
DDRC 133MHz
SDRAM 133MHz
Figure 5. Power-down Deassertion Timing Waveform (in K7 mode)
VID (0:3),
SEL (0,1)
VTT_PW RGD#
PW RGD
0.2-0.3m S
Delay
VDD Clock Gen
Clock State
Clock Outputs
Clock VCO
State 0
W ait for
VTT_GD#
State 1
State 2
Off
Off
Sam ple Sels
State 3
On
(Note A)
On
Figure 6. VTT_PWGD# Timing Diagram (With Advanced PIII Processor SelP4_K7 = 1)[31]
Note:
31. This time diagram shows that VTT_PWRGD# transits to a logic LOW in the first time at power-up. After the first HIGH to LOW transition of VTT_PWRGD#, device
is not affected, VTT_PWRGD# is ignored.
Rev 1.0, November 20, 2006
Page 15 of 19
WR
TP
=L
VT
S1
ow
GD
#
CY28341
S2
W a it f o r
1 .1 4 6 m s
S a m p le
In p u ts
F S ( 3 :0 )
D e la y 0 .2 5 m S
E n a b le
O u tp u te s
V D D A = 2 .0 V
S0
S3
P o w e r O ff
N o rm a l
O p e r a tio n
V D D 3 .3 = O f f
Figure 7. Clock Generator Power-up/ Run State Diagram (with P4 Processor SELP4_K7# = 1)
Connection Circuit DDRT/C Signals
For Open Drain CPU Output Signals (with K7 Processor SELP4_K7# = 0)
VDDCPU(1.5V)
3.3V
60.4 Ohm
CPUOD_T
47 Ohm
500 Ohm
Measurement Point
Ohm"
Ohm5"
680 pF
20 pF
500 Ohm
301 Ohm
47 Ohm
CPUOD_C
VDDCPU(1.5V)
Ohm1"
500 Ohm
Ohm5"
680 pF
60.4 Ohm
500 Ohm
Measurement Point
20 pF
3.3V
Figure 8.
6”
6”
Figure 9.
Rev 1.0, November 20, 2006
Page 16 of 19
CY28341
Table 10.Signal Loading Table
Clock Name
Max Load (in pF)
REF (0:1), 48MHz (USB), 24_48MHz
20
AGP(0:2), SDRAM (0:11)
30
PCI_F(0:5)
30
DDRT/C (0:5), FBOUT
CPUT/C
See Figure 10
CPUOD_T/C
See Figure 8
CPUCS_T/C
See Figure 9
For Differential CPU Output Signals (with P4 Processor SELP4_K7= 1)
The following diagram shows lumped test load configurations
for the differential Host Clock Outputs.
CLK Measurement Point
T PCB
CPUT
RtA1
RtB1
R LB1
RLA1
CLA
RD
MULTSEL
CLK Measurement Point
T PCB
CPUT#
RtA2
RLA2
R LB2
RtB2
CLB
Rref
Figure 10.
Group Timing Relationships and Tolerances[32]
Table 11.Lumped Test Load Configuration
Component 0.7V Amplitude Value 1.0V Amplitude Value
RtA1, RtA2
33:
0:
RLA1, RLA2
49.9:
f
TPCB
3” 50 :Z
3” 50 :Z
RLB1, RLB2
f
63:
RD
f
470:
RtB1, RtB2
0:
33:
CLA, CLB
2 pF
2 pF
Rref
475: w/mult0 = 1
221: w/mult0 = 0
Offset (ps) Tolerance (ps) Conditions
tCSAGP CPUCS to
AGP
tAP
AGP to
PCI
750
500
CPUCS
Leads
1,250
500
AGP Leads
Note:
32. Ideally the probes should be placed on the pins. If there is a transmission line between the test point and the pin for one signal of the pair (e.g., CPU), the same
length transmission line to the other signal of the pair (e.g., AGP) should be added.
Rev 1.0, November 20, 2006
Page 17 of 19
CY28341
0ns
10ns
20ns
30ns
CPU CLOCK 66.6MHz
CPU CLOCK 100MHz
CPU CLOCK 133.3MHz
tCSAGP
AGP CLOCK 66.6MHz
tAP
PCI CLOCK 33.3MHz
Ordering Information
Part Number
Package Type
Product Flow
CY28341OC
56-pin Shrunk Small Outline package (SSOP)
CY28341OCT
56-pin Shrunk Small Outline package (SSOP)–Tape and Reel
Commercial, 0q to 70qC
CY28341ZC
56-pin Thin Shrunk Small Outline package (TSSOP)
Commercial, 0q to 70qC
CY28341ZCT
56-pin Thin Shrunk Small Outline package (TSSOP)–Tape and Reel
Commercial, 0q to 70qC
Rev 1.0, November 20, 2006
Commercial, 0q to 70qC
Page 18 of 19
CY28341
Package Drawing and Dimensions
56-lead Thin Shrunk Small Outline Package, Type II (6 mm × 12 mm) Z56
56-lead Shrunk Small Outline Package O56
51 85062 C
While SLI has reviewed all information herein for accuracy and reliability, Spectra Linear Inc. assumes no responsibility for the use of any circuitry or for the infringement of any patents or other rights of third parties which would result from each use. This product is intended for use in
normal commercial applications and is not warranted nor is it intended for use in life support, critical medical instruments, or any other application requiring extended temperature range, high reliability, or any other extraordinary environmental requirements unless pursuant to additional
processing by Spectra Linear Inc., and expressed written agreement by Spectra Linear Inc. Spectra Linear Inc. reserves the right to change any
circuitry or specification without notice.
Rev 1.0, November 20, 2006
Page 19 of 19