Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications Technical Data Agilent 4N55*, 5962-87679, HCPL-553X, HCPL-653X, HCPL-257K, HCPL-655X, 5962-90854, HCPL-550X *See matrix for available extensions. Features • Dual Marked with Device Part Number and DSCC Drawing Number Description Applications These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DSCC Drawing. All devices are manufactured and tested on a MIL-PRF38534 certified line and are included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits. • Military and Space • Manufactured and Tested on a MIL-PRF-38534 Certified Line • High Reliability Systems • QML-38534, Class H and K • Vehicle Command, Control, Life Critical Systems • Five Hermetically Sealed Package Configurations • Line Receivers • Switching Power Supply • Performance Guaranteed, Over -55°C to +125°C • Voltage Level Shifting • High Speed: Typically 400 kBit/s • Analog Signal Ground Isolation (see Figures 7, 8, and 13) • 9 MHz Bandwidth • Isolated Input Line Receiver • 2-18 Volt VCC Range • Isolated Output Line Driver • 1500 Vdc Withstand Test Voltage • Logic Ground Isolation • High Radiation Immunity • Harsh Industrial Environments • 6N135, 6N136, HCPL-2530/2531, Function Compatibility • Isolation for Test Equipment Systems • Open Collector Output • Reliability Data The connection of a 0.1 µF bypass capacitor between VCC and GND is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated photon detector. Separate connections for the photodiodes and output transistor collectors improve the speed up to a hundred times that of a conventional phototransistor optocoupler by reducing the base-collector capacitance. These devices are suitable for wide bandwidth analog applications, as well as for interfacing TTL to LSTTL or CMOS. Current Transfer Ratio (CTR) is 9% minimum at IF = 16 mA. The 18 V VCC capability will enable the designer to interface any TTL family to CMOS. The availability of the base lead allows optimized gain/ bandwidth adjustment in analog applications. The shallow depth of the IC photodiode provides better radiation immunity than conventional phototransistor couplers. These products are also available with the transistor base node not connected to improve common mode noise immunity and ESD susceptibility. In addition, higher CTR minimums are available by special request. Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and E respectively), 16 pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. Because the same functional die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part’s performance for die related reliability and certain limited radiation test results. Truth Table (Positive Logic) Input Output On (H) L Off (L) H Functional Diagram Multiple Channel Devices Available V CC VB VO GND 2 Selection Guide–Package Styles and Lead Configuration Options 16 Pin DIP 8 Pin DIP 8 Pin DIP Lead Style Through Hole Through Hole Through Hole Channels 2 1 2 4 2 None None VCC GND VCC GND None 4N55(1) HCPL-5500 HCPL-5530 HCPL-6550 HCPL-6530 MIL-PRF-38534 Class H 4N55/883B HCPL-5501 HCPL-5531 HCPL-6551 HCPL-6531 MIL-PRF-38534 Class K HCPL-257K HCPL-550K HCPL-553K HCPL-655K HCPL-653K Standard Lead Finish Gold Plate Gold Plate Gold Plate Gold Plate Solder Pads Solder Dipped* Option 200 Option 200 Option 200 Butt Joint/Gold Plate Option 100 Option 100 Option 100 Gull Wing/Soldered* Option 300 Option 300 Option 300 Prescript for all below 5962- 5962- 5962- 5962- 5962- Either Gold or Soldered 8767901EX 9085401HPX 8767902PX 8767904FX 87679032X Gold Plate 8767901EC 9085401HPC 8767902PC 8767904FC Solder Dipped* 8767901EA 9085401HPA 8767902PA Butt Joint/Gold Plate 8767901UC 9085401HYC 8767902YC Butt Joint/Soldered* 8767901UA 9085401HYA 8767902YA Gull Wing/Soldered* 8767901TA 9085401HXA 8767902XA Prescript for all below 5962- 5962- 5962- 5962- 5962- Either Gold or Soldered 8767905KEX 9085401KPX 8767906KPX 8767908KFX 8767907K2X Gold Plate 8767905KEC 9085401KPC 8767906KPC 8767908KFC Solder Dipped* 8767905KEA 9085401KPA 8767906KPA Butt Joint/Gold Plate 8767905KUC 9085401KYC 8767906KYC Butt Joint/Soldered* 8767905KUA 9085401KYA 8767906KYA Gull Wing/Soldered* 8767905KTA 9085401KXA 8767906KXA Package Common Channel Wiring 16 Pin Flat Pack 20 Pad LCCC Unformed Leads Surface Mount Agilent Part No. and Options Commercial Class H SMD Part # 87679032A Class K SMD Part # 1. JEDEC registered part. * Solder contains lead 3 8767907K2A 8 Pin Ceramic DIP Single Channel Schematic 2 ANODE IF + VF CATHODE - ICC 8 IB 7 IO 6 V CC VB VO 3 5 GND Note, base is pin 7. Functional Diagrams 16 Pin DIP Through Hole 2 Channels 8 Pin DIP Through Hole 1 Channel 8 Pin DIP Through Hole 2 Channels 16 Pin Flat Pack Unformed Leads 4 Channels 20 Pad LCCC Surface Mount 2 Channels 15 14 1 V B1 16 2 V CC1 15 1 1 V CC V O1 VB GND V CC 7 V O1 2 V CC 6 V O2 3 V O1 GND 5 4 GND V O2 GND 2 V O2 13 5 V O3 12 5 V O1 V CC1 3 V B1 GND 1 5 V B2 12 6 V CC2 11 6 V O4 11 7 GND 10 7 GND 10 8 V O2 9 8 7 8 9 Note: 8 pin DIP and flat pack devices have common VCC and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated channels with separate VCC and ground connections. Outline Drawings 16 Pin DIP Through Hole, 2 Channels 20.06 (0.790) 20.83 (0.820) 8.13 (0.320) MAX. 0.89 (0.035) 1.65 (0.065) 4.45 (0.175) MAX. 0.51 (0.020) MIN. 3.81 (0.150) MIN. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 4 0.20 (0.008) 0.33 (0.013) 13 12 14 2 4 V B2 19 20 6 13 4 15 7 3 V OUT V CC2 8 14 3 4 1 2 2 3 8 16 10 9 Leaded Device Marking Agilent DESIGNATOR Agilent P/N DSCC SMD* DSCC SMD* PIN ONE/ ESD IDENT Leadless Device Marking A QYYWWZ XXXXXX XXXXXXX XXX XXX 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) COUNTRY OF MFR. Agilent CAGE CODE* Agilent DESIGNATOR Agilent P/N PIN ONE/ ESD IDENT COUNTRY OF MFR. A QYYWWZ XXXXXX XXXX XXXXXX XXX 50434 COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) DSCC SMD* DSCC SMD* Agilent CAGE CODE* * QUALIFIED PARTS ONLY * QUALIFIED PARTS ONLY Outline Drawings 16 Pin Flat Pack, 4 Channels 7.24 (0.285) 6.99 (0.275) 2.29 (0.090) MAX. 1.27 (0.050) REF. 11.13 (0.438) 10.72 (0.422) 0.46 (0.018) 0.36 (0.014) 8.13 (0.320) MAX. 2.85 (0.112) MAX. 0.88 (0.0345) MIN. 0.89 (0.035) 0.69 (0.027) 5.23 (0.206) MAX. 0.31 (0.012) 0.23 (0.009) 9.02 (0.355) 8.76 (0.345) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 20 Terminal LCCC Surface Mount, 2 Channels 8 Pin DIP Through Hole, 1 and 2 Channel 8.70 (0.342) 9.10 (0.358) 9.40 (0.370) 9.91 (0.390) 0.76 (0.030) 1.27 (0.050) 4.95 (0.195) 5.21 (0.205) 1.78 (0.070) 2.03 (0.080) 1.02 (0.040) (3 PLCS) 1.14 (0.045) 1.40 (0.055) 8.70 (0.342) 9.10 (0.358) 4.95 (0.195) 5.21 (0.205) TERMINAL 1 IDENTIFIER 2.16 (0.085) 0.64 (0.025) (20 PLCS) 7.16 (0.282) 7.57 (0.298) 4.32 (0.170) MAX. 0.51 (0.020) MIN. METALIZED CASTILLATIONS (20 PLCS) 1.78 (0.070) 2.03 (0.080) 8.13 (0.320) MAX. 3.81 (0.150) MIN. 0.51 (0.020) 1.52 (0.060) 2.03 (0.080) 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES). NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX. 5 0.20 (0.008) 0.33 (0.013) 7.36 (0.290) 7.87 (0.310) Hermetic Optocoupler Options Option 100 Description Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). 4.32 (0.170) MAX. 0.51 (0.020) MIN. 1.14 (0.045) 1.40 (0.055) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 4.32 (0.170) MAX. 0.51 (0.020) MIN. 1.14 (0.045) 1.40 (0.055) 2.29 (0.090) 2.79 (0.110) 0.20 (0.008) 0.33 (0.013) 0.51 (0.020) MAX. 7.36 (0.290) 7.87 (0.310) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 200 Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 and 16 pin DIP. DSCC drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature. 300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This option has solder dipped leads. 4.57 (0.180) MAX. 0.51 (0.020) MIN. 1.40 (0.055) 1.65 (0.065) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 4.57 (0.180) MAX. 0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110) 1.40 (0.055) 1.65 (0.065) 4.57 (0.180) MAX. 5˚ MAX. 0.51 (0.020) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 6 0.20 (0.008) 0.33 (0.013) 9.65 (0.380) 9.91 (0.390) Absolute Maximum Ratings No derating required up to +125° C. Symbol Min. Max. Units Storage Temperature Range TS -65° +150° C Operating Ambient Temperature TA -55° +125° C Junction Temperature TJ +175° C Case Temperature TC +170° C 260° for 10 s C Parameter Lead Solder Temperature (1.6 mm below seating plane) Average Input Forward Current IF AVG 20 mA Peak Forward Input Current (each channel, ≤ 1 ms duration) IFPK 40 mA Reverse Input Voltage BVR See Electrical Characteristics Average Output Current, each channel IO 8 mA Peak Output Current, each channel IO 16 mA Supply Voltage VCC -0.5 20 V Output Voltage VO -0.5 20 V Input Power Dissipation, each channel 36 mW Output Power Dissipation, each channel 50 mW 200 mW VEBO 3 V IB 5 mA Package Power Dissipation, each channel PD Single Channel 8 Pin, Dual Channel 16 Pin, and LCCC Only Emitter Base Reverse Voltage Base Current, each channel ESD Classification (MIL-STD-883, Method 3015) 4N55, 4N55/883B, HCPL-257K, HCPL-5500/01/0K, and HCPL-6530/31/3K (∆), Class 1 HCPL-5530/31/3K, HCPL-6550/51/5K (Dot), Class 3 Recommended Operating Conditions Parameter Symbol Min. Max. Units 250 µA Input Current, Low Level IFL Input Current, High Level IFH 12 20 mA Supply Voltage, Output VCC 2 18 V 7 Electrical Characteristics TA = -55° C to +125° C, unless otherwise specified. See Note 12. Parameter Symbol Group A, Subgroup Test Conditions CTR 1, 2, 3 VO = 0.4V, IF = 16 mA, VCC = 4.5V IOH 1, 2, 3 IF = 0, IF (other channels) = 20 mA VO = VCC = 18 V 5 IOLeak 1, 2, 3 IF = 250 µA, IF (other channels) = 20 mA, VO = VCC = 18 V 30 Input-Output Insulation Leakage Current II-O 1 VI-O = 1500 Vdc, RH ≤ 65%, TA = 25°C, t = 5 s Input Forward Voltage VF 1, 2, 3 IF = 20 mA BVR 1, 2, 3 IR = 10 µA Current Transfer Ratio Logic High Output Current Output Leakage Current Limits Units Fig. Notes % 2, 3 1, 2, 10 100 µA 4 1 250 µA 4 1 1.0 µA 1.8 V Min. Typ.* Max. 9 20 1.55 3, 9 1 1.9 Reverse Breakdown Voltage 5 1, 13 V 1, 14 3 Logic High Supply Current Logic Low Supply Current µA 0.1 10 Dual Channel VCC = 18 V, IF = 0 mA (all channels) 0.2 20 1,4 Quad Channel VCC = 18 V, IF = 0 mA (all channels) 0.4 40 1 VCC = 18 V, IF = 20 mA 35 200 Dual Channel VCC = 18 V, IF1 = IF2 = 20 mA 70 400 1, 4 Quad Channel VCC = 18 V, IF1 = IF2 = IF3 = IF4 = 20 mA 140 800 1 RL = 8.2 kΩ, CL = 50 pF, IF = 16 mA, VCC = 5 V 1.0 6.0 0.4 2.0 Single Channel ICCH ICCL Propagation Delay Time to Logic High at Output tPLH Propagation Delay Time to Logic Low at Output tPHL *All typical values are at VCC = 5 V, TA = 25°C. 8 1, 13 VCC = 18 V, IF = 0 mA Single Channel 1, 2, 3 1, 14 1, 2, 3 9, 10, 11 1 µA µs 1 6, 9 1, 6 Typical Characteristics All typical values are at TA = 25°C, VCC = 5 V, unless otherwise specified. Symbol Test Conditions Typ. Units CIN VF = 0 V, f = 1 MHz 60 pF 1 ∆VF/∆TA IF = 20 mA -1.5 mV/°C 1 Resistance (Input-Output) RI-O VI-O = 500 V 1012 Ω 3 Capacitance (Input-Output) C I-O f = 1 MHz 1.0 pF 1, 11 Transistor DC Current Gain hFE VO = 5 V, IO = 3 mA 250 - 1 Small Signal Current Transfer Ratio ∆IO/∆IF VCC = 5 V, VO = 2 V 21 % 7 1 Common Mode Transient Immunity at Logic High Level Output |CM H| IF = 0 mA, RL = 8.2 kΩ, VO (min) = 2.0 V, VCM = 10 VP-P 1000 V/µs 10 1, 7 Common Mode Transient Immunity at Logic Low Level Output |CM L| IF = 16 mA, RL = 8.2 kΩ, VO (max) = 0.8 V, VCM = 10 VP-P -1000 V/µs 10 1, 7 9 MHz 8 8 Parameter Input Capacitance Input Diode Temperature Coefficient Bandwidth BW Fig. Notes Multi-Channel Product Only Parameter Symbol Test Conditions Typ. Units Notes Input-Input Insulation Leakage Current II-I RH ≤ 65%, VI-I = 500 V, t = 5 s 1 pA 5, 9 Resistance (Input-Input) RI-I VI-I = 500 V 1012 Ω 5 Capacitance (Input-Input) CI-I f=1 MHz 0.8 pF 5 Notes: 1. Each channel of a multi-channel device. 2. Current Transfer Ratio is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100%. CTR is known to degrade slightly over the unit’s lifetime as a function of input current, temperature, signal duty cycle, and system on time. Refer to Application Note 1002 for more detail. ln short, it is recommended that designers allow at least 20-25% guardband for CTR degradation. 3. All devices are considered two-terminal devices; measured between all input leads or terminals shorted together and all output leads or terminals shorted together. 4. The 4N55, 4N55/883B, HCPL-257K, HCPL6530, HCPL-6531, and HCPL-653K dual channel parts function as two independent single channel units. Use the single channel parameter limits. IF = 0 mA for channel under test and I F = 20 mA for other channels. 5. Measured between adjacent input pairs shorted together for each multichannel device. 9 6. tPHL propagation delay is measured from the 50% point on the leading edge of the input pulse to the 1.5 V point on the leading edge of the output pulse. The tPLH propagation delay is measured from the 50% point on the trailing edge of the input pulse to the 1.5 V point on the trailing edge of the output pulse. 7. CML is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic low state (VO < 0.8 V). CMH is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic high state (VO > 2.0 V). 8. Bandwidth is the frequency at which the ac output voltage is 3 dB below the low frequency asymptote. For the HCPL-5530 the typical bandwidth is 2 MHz. 9. This is a momentary withstand test, not an operating condition. 10. Higher CTR minimums are available to support special applications. 11. Measured between each input pair shorted together and all output connections for that channel shorted together. 12. Standard parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD and 883B parts receive 100% testing at 25, 125, and -55°C (Subgroups 1 and 9, 2 and 10, 3 and 11, respectively). 13. Not required for 4N55, 4N55/883B, HCPL257K, 5962-8767901, and 5962-8767905 types. 14. Required for 4N55, 4N55/883B, HCPL-257K, 5962-8767901, and 5962-8767905 types only. IOH - LOGIC HIGH OUTPUT CURRENT - µA Figure 1. Input Diode Forward Current vs. Forward Voltage. 100 10 1 Figure 2. DC and Pulsed Transfer Characteristic. Figure 3. Normalized Current Transfer Ratio vs. Input Diode Forward Current. Figure 5. Logic Low Supply Current vs. Input Diode Forward Current. Figure 6. Propagation Delay vs. Temperature. IF = 250 µA, IF (OTHER CHANNELS) = 20 mA IF = 0 µA, IF (OTHER CHANNELS) = 20 mA IF = IF (OTHER CHANNELS) = 0 mA 0.1 VCC = VO = 18 V 0.01 0.001 -60 -40 -20 0 20 40 60 80 100 120 140 TA - TEMPERATURE - ˚C Figure 4. Logic High Output Current vs. Temperature. Figure 7. Normalized Small Signal Current Transfer Ratio vs. Quiescent Input Current. 10 +12 V D.U.T. +12 V 0.1 µF 0.1 µF 1.2 k Ω V CC 2.1 k Ω Q1 V IN VB 100 Ω 51 Ω 9.1 k Ω VO 47 µF 15 k Ω RF 1kΩ Q3 0.01 µF Q2 100 Ω 0.01 µF VO (1 M Ω, 12 pF TEST INPUT) 470 Ω GND 22 Ω SINGLE CHANNEL TESTING, INDEPENDENT VCC DEVICES 1N4150 TRIM FOR UNITY GAIN Q 1 , Q 2 , Q 3 : 2N3904 TYPICAL LINEARITY = +3 % AT V IN = 1 V P-P TYPICAL SNR = 50 dB TYPICAL R F = 375 Ω TYPICAL V O dc = 3.8 V TYPICAL IF = 9 mA D.U.T. 20 k Ω SET I F AC INPUT 0.1 µF 560 Ω 100 Ω +15 +15 V V CC 100 Ω VO 2N3053 1.6 Vdc 0.25 V P-P ac GND COMMON V CC DEVICES NORMALIZED RESPONSE - dB +5 V +10 PULSE GEN. Z O = 50 Ω t r = 5 ns IF D.U.T. +5 V V CC RL VO IF MONITOR 100 Ω C L * = 50 pF GND SINGLE CHANNEL OR COMMON V CC DEVICES 10 % DUTY CYCLE 1/f < 100 µs NOTES: * C L INCLUDES PROBE AND STRAY WIRING CAPACITANCE. BASE LEAD NOT CONNECTED. Figure 9. Switching Test Circuit.* *JEDEC Registered Data. 11 INDEPENDENT V CC DEVICES +5 0 -5 -10 COMMON V CC DEVICES -15 -20 0.1 Figure 8. Frequency Response. T A = 25 ˚C 1.0 10 f - FREQUENCY - MHz 100 IF B D.U.T. +5 V V CC RM RL A VO V FF GND SINGLE CHANNEL OR COMMON V CC DEVICES V CM + PULSE GEN. NOTE: BASE LEAD NOT CONNECTED. Figure 10. Test Circuit for Transient Immunity and Typical Waveforms. V CC 5V 220 Ω RL D.U.T. V CC Logic Family LSTTL CMOS Device No. 54LS14 CD40106BM VCC TTL RL 5% Tolerance LOGIC GATE 0.01 µF EACH CHANNEL Figure 11. Recommended Logic Interface. V CC VOC D.U.T.* VCC (EACH INPUT) - V IN 0.1 µF VO GND NOMINAL CONDITIONS PER CHANNEL: IF = 20 mA IO = 4 mA ICC = 30 µA NOTE: BASE LEAD NOT CONNECTED. T A = +125 ˚C Figure 12. Operating Circuit for Burn-In and Steady State Life Tests. All Channels Tested Simultaneously. 12 5V 15 V 18 kΩ * 8.2 kΩ 22 kΩ *The equivalent output load resistance is affected by the LSTTL input current and is approximately 8.2 kΩ. This is a worst case design which takes into account 25% degradation of CTR. See App. Note 1002 to assess actual degradation and lifetime. GND + 5V (EACH OUTPUT) U1 + + R3 2 HCPL-5530 IF 1 V IN 1 8 2 7 3 6 4 5 OFFSET ADJUST 5kΩ 220 Ω IC 1 IC 2 U3 + IF 2 2 U2 + - R1 2.7 k Ω R2 2.7 k Ω R 4 1 kΩ 5 k Ω GAIN ADJUST -15 V U4 + U 1 , U 2 , U 3 , U 4 , LM307 IC IC 1 2 =K1 IF IF =K2 IF IF 50 k Ω V OUT 2 n1 1 R5 I CC 6 mA ´ 1 n2 2 -15 V ´ 2 Figure 13. Isolation Amplifier Application Circuit. Description Performance of Circuit The schematic uses a dualchannel, high-speed optocoupler (HCPL-5530) to function as a servo type dc isolation amplifier. This circuit operates on the principle that two optocouplers will track each other if their gain changes by the same amount over a specific operating region. • 1% linearity for 10 V peakto-peak dynamic range 13 • Gain drift: -0.03%/°C • Offset Drift: ± 1 mV/°C • 25 kHz bandwidth (limited by Op-Amps U1, U2) MIL-PRF-38534 Class H, Class K, and DSCC SMD Test Program Agilent’s Hi-Rel Optocouplers are in compliance with MILPRF-38534 Classes H and K. Class H and Class K devices are also in compliance with DSCC drawings 5962-87679, and 5962-90854. Testing consists of 100% screening and quality conformance inspection to MIL-PRF-38534. www.agilent.com/ semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. December 10, 2004 5989-1659EN