TEMEX CI-E03 Ci e03 is a digital dual pulse compression module Datasheet

Digital pulse compression module
CI E03
To make an enquiry please email: [email protected]
Product Description
CI E03 is a digital dual pulse compression module, well suited
for RADARS performance enhancement. Analog inputs and
outputs make it an ideal replacement for SAW based pulse
compression subsystems.
Each of the two available channels may be configured as chirp
expander or chirp compressor.
All the pulse compression parameters are programmable
(center frequency, bandwidth, time dispersion, modulation law,
weighting function, etc.).
CI E03 is provided with FPGA firmware, which will be configured
by Rakon, based on customer requirements.
Features
Digital pulse compression module
2 concurrent channels : Expander or compressor for each channel
2 x IF analog inputs, 2 x IF analog outputs
High precision clock, self sufficient or externally locked
BITE function
Low profile
High BxT compression gain
Fig. 1 : Maximum B x T compression parameters
Applications
SAW based pulse compression RADARS upgrade
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Digital pulse compression module
CI E03
Technical description
CI E03 functional bloc diagram is featured on Fig. 2.
DA C
250 MS PS
16 bits
RF OUT B (J5)
DA C
250 MS PS
16 bits
RF OUT A (J4)
(J1)
FPGA config (SPI )
JTA G
VA NA (x2)
US ER (x15)
FPGA
XC5VSX35T
RE FCLK (J6)
PLL /
VCO
CPLD
Superv ision
BIT E
IF
Os c
RF INA (J2)
RF INB (J3)
US ER (x4)
BO ARD_OK
Sta tus (x3)
N_ RST
ADC
250 MS PS
12 bits
ADC
250 MS PS
12 bits
CLKEXT _EN
Power
Control
VCFG
N_ BOA RD_PD
VINMA IN
VINVCO
Fig. 2 : CI E03 functional bloc diagram
This module is specifically designed to upgrade existing SAW based pulse compression subsystems. Plugged on a
specific carrier board, this module may upgrade many existing expanders and/or compressors. With a low size
and low profile, it may be embedded in small form factors.
This module is able to process on-the-fly 2 independent and concurrent channels. Each channel may be an
expander or a compressor. The two independent channels are processed in a single FPGA, but each of them uses
dedicated resources.
The internal clock generator is self-sufficient but may also be locked on an external clock. An external clock is
required for expander channels, but is optional for compressor channels.
As the two channels uses the same ADC, same DAC component types and the same reference clock, the phase
difference will be close to 0, and will be very stable inside the operating range. There is no need to use phase
shifters to adjust phase difference.
16 different waveforms, each of them with different specification, may be stored for each expander channel.
The active waveform is selected with 4 user inputs on J1 connector. Expander channel waveforms allows for
Doppler pre-correction, e.g. there may be 2 waveforms with different specifications, each of them with 8
different Doppler pre-corrections ranging from negative values to positive values.
FPGA firmware resides inside a flash PROM located on the carrier board, thus CI E03 has not to be application
dependant; the same CI E03 board may be used without any modification or firmware upgrade for different
applications. Firmware is automatically loaded in the FPGA at startup.
CI E03 module continuously monitors its internal temperature, powers off FPGA and some other components
and deasserts TEMP_OK signal on J1 connector if temperature exceeds a secure maximum threshold.
CI E03 module is provided with FPGA firmware to be loaded on the carrier flash memory. Functions, and
channels specifications (time dispersion, compressed pulse width, side lobes level,…) should be provided by
customer; Rakon will customize the FPGA program to fulfill customer requirements.
Expander channel bloc diagram is featured in Fig. 3. After each trigger pulse, a chirp defined by the samples set
selected by EXP_SELECT_x (user signals) is generated, and presented to the DAC input to be translated into an
analog signal. When the control input state changes, another waveform samples set is selected, and will be
active for the next trigger pulse.
For better compatibility with old SAW based subsystems, an adjustable additional delay may be inserted.
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Digital pulse compression module
CI E03
EXP_SELECT
Waveforms
RFOUT
DAC
TRIG
Timing
CLOCK
Fig. 3 : Expander channel bloc diagram
Compressor, featured in Fig. 4, uses a FIR filter whose coefficients are matched to the expander waveform
samples. Input data are preliminary translated into baseband, and then are translated again into IF signal. Digital
IF signal is then presented to the DAC to be translated into an analog IF signal.
For better compatibility with old SAW based subsystems, an adjustable additional delay may be inserted.
RF IN
ADC
To
ba seba nd
OS C
FIR
To
F0
DA C
RF OUT
Timing
Fig. 4 : Compressor channel bloc diagram
Fig. 5 represents the maximum time dispersion vs. bandwidth area covered with one and two concurrent
compressor channels operating. These areas assume 250 MHz internal clock, and a compressor sample period of
ζ-3dB / 3.5. Contact Rakon-Temex form higher Time x Bandwidth products.
Fig. 5 : Maximum Time dispersion vs. Bandwidth
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Digital pulse compression module
CI E03
Specifications
1.0
Environmental conditions
Line
Parameter
Test Condition
Min.
Typ.
Max.
Unit
Operating temperature range
1.1
Forced air cooling (250 ft/min at sea
VITA 47 Class AC2, FC2
level)
-40
+55
°C
1.2
Conduction cooling with specific
heat sink
VITA 47 Class CC3
-40
+70
°C
-40
+85
°C
95
% RH
1.3
Storage temperature range
VITA 47 Class C2
1.4
Humidity
30 °C (non condensing)
Vibration
1.5
PSD (5 Hz to 100 Hz)
VITA 47 Class V2
1.6
PSD (100 Hz ~ 1000 Hz)
VITA 47 Class V2
1.7
PSD (100 Hz ~ 1000 Hz)
VITA 47 Class V2
1.8
Shock
2.0
Electrical Interface
Line
Parameter
increasing at 3 dB/octave g2/Hz
2
decreasing at 6 dB/octave g /Hz
VITA 47, Class OS1
Test Condition
g2/Hz
0.04
20
Min.
Typ.
Max.
g
Unit
Power supply
2.1
Voltage
5.5
13.2
V
2.2
Power dissipation 1
1 or 2 expander channels
operation
5
10
W
2.3
Power dissipation 1
1 compressor channel
operation
8
15
W
2.4
Power dissipation 1
2 compressor channels
operation
9.5
15
W
RF_IN_A / RF_IN_B
2.5
Coupling
AC
2.6
Impedance
50
2.7
Sampling rate
2.8
Resolution
2.9
Bandwidth
100
MHz
2.10
Input level
8
dBm
Ω
250
12
MSPS
bits
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Digital pulse compression module
CI E03
Line
Parameter
Test Condition
Min.
Typ.
Max.
Unit
RF_OUT_A / RF_OUT_B
2.11
Coupling
AC
2.12
Impedance
50
2.13
Sampling rate
2.14
Resolution
2.15
Bandwidth
2.16
Output level
Ω
250
16
MSPS
bits
100
MHz
5
dBm
CLK_IN
2.17
Coupling
AC
2.18
Impedance
50
2.19
Frequency
10
202
Ω
125
MHz
Status signals (BOARD_OK, INITTIME_ALM, POWER_OK, TEMP_OK)
2.20
Logic high output voltage
IOH = 8 mA
2.9
3.3
V
2.21
Logic low output voltage
IOL = 8 mA
0
0.4
V
Control signals (CLKEXT_EN, N_RST)
2.22
Logic high input voltage
2.0
3.3
V
2.23
Logic low input voltage
0
0.8
V
0
1
V
Power down signal (N_BOARD_PD)
2.24
Logic low input voltage
User signals (USERCLVTx)
2.25
Logic high input voltage
2.0
3.3
V
2.26
Logic low input voltage
0
0.8
V
2.27
Logic high output voltage
IOH = 8 mA
2.9
3.3
V
2.28
Logic low output voltage
IOL = 8 mA
0
0.4
V
User signals (USERFLVTx)
2.29
Logic high input voltage
2.0
3.3
V
2.30
Logic low input voltage
0
0.8
V
2.31
Logic high output voltage
2.4
3.3
V
2.32
Logic low output voltage
0
0.4
V
IOH = 2 to 24 mA
(programmable)
IOL = 2 to 24 mA
(programmable)
User signals (USERFDIFFx, programmed as single 2.5V LVCMOS signals)
2.33
Logic high input voltage
1.7
2.5
V
2.34
Logic low input voltage
0
0.7
V
2.35
Logic high output voltage
2.1
2.5
V
IOH = 2 to 24 mA
(programmable)
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Digital pulse compression module
CI E03
2.36
Logic low output voltage
IOL = 2 to 24 mA
(programmable)
0
0.4
V
1 Power dissipation highly depends on channels specifications. Typical figures are given as a rough guide.
2
Frequency should be divisible by 10 MHz
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Digital pulse compression module
CI E03
3.0
Expander operation Performances
Line
Parameter
3.1
Stored waveforms
3.2
Center frequency (F0)
3.3
Bandwidth (B)
Test Condition
Min.
Typ.
Max.
Unit
16
100 –
MHz
B/2
3
100
MHz
Time dispersion (T)
3.4
16 Exp Wve for each channel
2 expander channels
operation
25
µs
3.5
1 Exp Wve for each channel
2 expander channels
operation
400
µs
4
Measured from the trigger
input rising edge to the
center of the output chirp
T/2 +
0.3
3.6
Minimal Expander delay (TE)
3.7
Additional Expander delay (TE)
3.8
Modulation slope
Up-chirp / Down-chirp
3.9
Modulation Type
Linear / Non linear
Measured from the trigger
input rising edge to the
center of the output chirp
µs
1
s
3 Some frequency values are not allowed. Center frequency should be related to the master clock by a fractional number.
4 Minimal delay depends slightly on the design. The typical figure is given as a rough guide.
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Digital pulse compression module
CI E03
4.0
Compressor operation Performances
Line
Parameter
4.1
Center frequency (F0)
4.2
Bandwidth (B)
Test Condition
Min.
Typ.
Max.
Unit
100 –
MHz
B/2
5
46.9
MHz
267
µs
Time dispersion (T)
4.3
B < 3 MHz
2 compressor operation 6
4.4
B < 7 MHz
2 compressor operation
6
48
µs
2 compressor operation
6
5
µs
178
µs
21
µs
4.5
B < 20 MHz
4.6
B < 7 MHz
1 compressor operation
6
4.7
B < 20 MHz
1 compressor operation
6
4.8
Compressed pulse width @ -3 dB (τ-3dB)
4.9
Side lobe level (SLL) 7
4.10
Minimal Compressor delay (TC)
8, 9
9
18
Measured from the center of
the input chirp, to the center
of the compressed pulse
output
ns
35 to
45
dB
T/2 +
2.5
µs
Measured from the center of
the input chirp, to the center
of the compressed pulse
output
4.11
Additional Compressor delay (TC)
5
4.12
Modulation slope
Up-chirp / Down-chirp
4.13
Modulation type
Linear / Non linear
ms
5 Some frequency values are not allowed. Center frequency should be related to the master clock by a fractional number.
6 Assuming 250 MHz FPGA processing, 3.5 points inside the compressed pulse width @ -3dB.
7 Side lobe level depends on B, T and other programmable parameters. Higher values are achievable.
8 Minimal delay depends slightly on the design. The typical figure is given as a rough guide.
9 Assuming B < 7 MHz.
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Digital pulse compression module
CI E03
Mechanical features
5.0
Mechanical features
Line
Parameter
5.1
Module size
5.2
Module height
5.3
Stacking height
Test Condition
Measured from the upper
side of the carrier board
Value
Unit
75 x 120
mm
10
mm
6.4
mm
2
Fig. 6 : CI E03 interfaces drawing
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Digital pulse compression module
CI E03
Interfaces description
J1 : Low profile 1.27 pitch, 2x50 pins connector
J2 to J6 : MMCX jack connectors
6.0
Line
Interfaces description
Pin number
Name
Description
6.1
P1-76
BOARD_OK
Board status correct output
6.2
P1-56
CFGCCLK
FPGA configuration Clock output
6.3
P1-60
CFGCEO
FPGA configuration PROM counter input
6.4
P1-50
CFGDIN
FPGA configuration Data input
6.5
P1-48
CFGDONE
FPGA configuration termination signal output
6.6
P1-78
CLKEXT_EN
Enable external reference clock input
6.7
P1-70
INITTIME_ALM
FPGA configuration time exceeded output
6.8
P1-96
JTAGTCK
JTAG Clock input
6.9
P1-90
JTAGTDI
JTAG Data input
6.10
P1-92
JTAGTDO
JTAG Data output
6.11
P1-86
JTAGTMS
JTAG Test Mode select input
6.12
P1-100
JTAG_EN
JTAG clock buffer enable input
6.13
P1-93
N_BOARD_PD
Board power down, active low open-drain input /
output with internal pull-up.
Should not be driven with a logic high level.
6.14
P1-50
N_CFGINIT
FPGA configuration init signal, active low output
6.15
P1-52
N_CFGPROG
FPGA configuration program signal, active low
output
6.16
P1-82
N_RST
Board active low reset input
6.17
P1-74
POWER_OK
Board power status output
6.18
P1-72
TEMP_OK
Board temperature status output
6.19
P1-68; 66; 64; 62
USERCLVT[3:0]
6.20
P1-30; 26; 22;
18; 14 (+)
P1-28; 24; 20;
16; 12 (-)
USERFDIFF[4:0]±
6.21
P1-10; 8; 6; 4; 2
USERFLVT[4:0]
LVTTL user signals
Each signal may be programmed independently as
input or output
May be used for waveform selection or other
purpose
Differential LVDS user signals
Each pair may be programmed independently as
input or output
These signal may also be used as 2.5V LVCMOS
single inputs or outputs
LVTTL user signals
Each signal may be programmed independently as
input or output
May be used for trigger input, waveform selection,
or other purpose
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Digital pulse compression module
CI E03
Low frequency differential analog input
|VANAx+ - VANAx-| ≤ 1Vpp
6.22
P1-34; 42 (+)
P1-36; 40 (-)
VANA[1:0]±
0 ≤ VANAx- ≤ 0.5V
May be used for current measurement, RF power
measurement, or other purpose
6.23
P1-59
RFU
Reserved for future use
6.24
P1-11; 13; 15
VCFG
2.5V Power supply output for FPGA configuration
flash PROM
6.25
P1-45; 47; 49;
51; 65; 67; 69;
71; 73; 75; 77
VINMAIN
Main power input
5.5 to 13.2 V
6.26
P1-89; 91
VINVCO
System clock power input
5.5 to 13.2 V / 30 mA
6.27
P1-1; 3; 5; 7; 9;
17; 19; 21; 23;
25; 27; 29; 31;
32; 33; 35; 37;
38; 39; 41; 43;
44; 53; 54; 55;
57; 58; 61; 63;
79; 80; 81; 83;
84; 85; 87; 88;
94; 95; 97; 98;
99
GNDD
Digital ground
6.28
J6
REFCLK
6.29
J2
RFINA
6.30
J3
RFINB
6.31
J4
RFOUTA
6.32
J5
RFOUTB
External clock input
AC, 50 ohms, 0 dBm typ
Channel A input
AC, 50 ohms, 8 dBm max
Channel B input
AC, 50 ohms, 8 dBm max
Channel A output
AC, 50 ohms, 5 dBm max
Channel B output
AC, 50 ohms, 5 dBm max
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