E2D0090-29-22 ¡ Semiconductor MSM9892L ¡ Semiconductor This version: MSM9892L Feb. 1999 Previous version: May 1997 2M-bit Serial Voice Flash Memory GENERAL DESCRIPTION The MSM 9892L is a 2Mb flash memory that operates at 2.7 V to 3.6 V. Since backup is not needed, the number of pins is small, and the pins are contained in a small-package 28-pin TSOP, the MSM9892L is a flash memory suitable for applications such as handy terminals. In combination with OKI's recording/playback IC (MSM9888L), a solid-state recording/playback system can be easily constructed. FEATURES • Configuration • Small page size (one time write unit) • Power supply voltage • Operating current : 1024 pages ¥ 2112 bits : 2048 per page : Single 2.7 to 3.6 V : Supply current : Up to 35 mA : Stanby current : Up to 10 mA • Operating temperature : –10 to +70°C • Package: 28-pin plastic TSOP (TSOPI28-P-813-0.55-K) (Product name: MSM9892LTS-KT) PIN CONFIGURATION TEST RESET PRT NC NC VDD GND NC NC NC CS SCK DI DO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC: No connection 28-Pin Plastic TSOP 1/6 ¡ Semiconductor MSM9892L PIN DESCRIPTIONS Pin Symbol I/O 13 DI I Command, address, or data input pin. Description 14 DO O Data output pin. 12 SCK I Inputs the data transfer clock for the DI and DO pins. 11 CS I 1 TEST O Output pin for test. Leave this pin open. 3 PRT I Prohibits flash memory programming when PRT is at "L" level. 2 RESET I The device is reset when RESET is at "L" level. The device accepts the SCK pulse when CS is at "L" level and does not accept the SCK pulse when CS is at "H" level. 6 VDD I Power supply pin (2.7 to 3.6 V) 7 GND I GND pin (0 V) ABSOLUTE MAXIMUM RATINGS Parameter Symbol Power Supply Voltage Condition VDD Input Voltage VIN Storage Temperature TSTG Ta=25°C — Rating Unit –0.3 to +7.0 V –0.6 to VDD+0.6 V –55 to +150 °C Range Unit RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Power Supply Voltage VDD GND=0V 2.7 to 3.6 V Operating Temperature Top — –10 to +70 °C ELECTRICAL CHARACTERISTICS DC Characteristics Parameter Condition Min. Typ. Max. Unit. ICC — — 15 35 mA ISB Top=–10 to +70 — — 10 mA VIH — 2.0 — — V VIL — — — 0.6 V "H" Output Voltage VOH — 2.0 — — V "L" Output Voltage VOL — — — 0.4 V Input Leakage current IIL — — — 1 mA Output Leakage current IOL — — — 1 mA Operating Current Standby Current "H" Input Voltage "L" Input Voltage Symbol 2/6 ¡ Semiconductor MSM9892L PROGRAMMING/ERASE CHARACTERISTICS Parameter Programming/Erase Cycles Symbol Condition Min. Typ. Max. Unit Cycles CEP — — — 10,000 Data Retention Time TDR — — — 10 Years Write Disturb *1) CPD Bit error : None — — 20,000 Cycles Bit error : 1bit — — 50,000 Cycles Bit error : 3bits — — 100,000 Cycles (per page) *1) per page "Write Disturb" means a phenomenon that frequent write operations performed to pages in Flash memory may cause a data error in another page to which write operations are not performed. For example, 20,001 to 50,000 write operations performed onto pages other than page "n" may cause a 1-bit error in page "n". 3/6 ¡ Semiconductor MSM9892L APPLICATION CIRCUIT MCU AVDD DI FDI DI DO FDO DO SCK FSCK SCK FCS CS FRESET MON LIN MSM9888L RESET BUSY CS RESET FPRT MSM9892L MSM9893L MSM9894AL DVDD PRT MSC1157 AOUT Voice input SG LOUT + AMON XT FIN XT FOUT ADIN TEST0 TEST1 TEST2 DGND AGND 4/6 ¡ Semiconductor MSM9892L WRITE DISTURB "Write Distrub" means a phenomenon that the change from digital "0" to "1" may occur in a Flash memory page to which data is scarcely written. The above change can be avoided by refreshing Flash memory data with the DTRW command and WEND command of the MSM9888L/MSM9889L. q DTRW command w WEND command This command moves some Flash memory page data to buffer. This command programs buffer data to Flash memory. Buffer Buffer Flash Page "n" Flash Page "n" TIMING WHEN POWER IS ON Refer to the MSM9888L/MSM9889L Data Sheet. If the timing diagrams described in the MSM9888L/MSM9889L Data Sheet are not satisfied, errors such as "Recording is disabled" or "Recorded message is erased" may occur. 5/6 ¡ Semiconductor MSM9892L PACKAGE DIMENSIONS (Unit : mm) TSOPI28-P-813-0.55-K MIRROR FINISH Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 7 mm or more 0.27 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 6/6 E2Y0002-29-11 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan