(1/6) SMD Inductors(Coils) For High Frequency(Multilayer) Conformity to RoHS Directive MLG Series MLG1005S Type FEATURES • Nominal inductance values are supported from 0.3 to 390nH. • Provides high Q characteristics. • Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for high-frequency. • The products contain no lead and also support lead-free soldering. • It is a product conforming to RoHS directive. PRODUCT IDENTIFICATION APPLICATIONS For high-frequency applications including mobile phones, high frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB and tuners. (4) Inductance value MLG 1005 S 2N2 S T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions 1005 1.0× 0.5mm (L× W) (3) Material code 2N2 12N R10 2.2nH 12nH 100nH (5) Inductance tolerance SHAPES AND DIMENSIONS B C S H J 0.5±0.05 1.0±0.05 ±0.1nH ±0.2nH ±0.3nH ±3% ±5% (6) Packaging style T 0.25±0.1 Taping (reel) 0.5±0.05 SPECIFICATIONS Operating temperature range Storage temperature range –55 to +125°C –55 to +125°C [Unit of products] Weight: 1mg PACKAGING STYLE AND QUANTITIES 0.4 to 0.6 RECOMMENDED PC BOARD PATTERN 0.4 to 0.5 0.4 to 0.5 0.4 to 0.5 Dimensions in mm RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260˚C Natural cooling 230˚C Packaging style Taping Quantity 10000 pieces/reel HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. 180˚C 150˚C Preheating 60 to 120s Soldering 30 to 60s Time(s) • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 006-01 / 20070703 / e521_mlg1005.fm (2/6) ELECTRICAL CHARACTERISTICS Inductance (nH) Inductance tolerance Q min. Test frequency L, Q (MHz) 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.2, ±0.3nH ±0.2, ±0.3nH ±0.2, ±0.3nH ±0.2, ±0.3nH ±3%, ±0.3nH ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% — — — — — — — 7 7 7 7 7 7 7 7 7 7 7 7 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 6 6 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 50 50 Self-resonant frequency (GHz) min. typ. 10.0 20up 10.0 20up 10.0 20up 10.0 20up 10.0 18.7 10.0 16.4 10.0 17.7 10.0 13.8 10.0 19.3 10.0 11.6 8.00 11.7 8.00 9.6 7.50 9.4 7.50 10.3 7.50 9.3 7.00 8.6 7.00 8.2 6.00 7.3 5.50 6.8 5.00 6.1 5.00 6.7 5.00 6.5 4.50 6.0 4.50 5.4 4.00 5.0 4.00 5.3 4.00 4.7 3.50 4.4 3.00 4.1 3.00 4.0 3.00 3.8 2.50 3.4 2.50 3.0 2.20 2.8 2.00 2.5 1.70 2.2 1.60 2.0 1.40 1.8 1.20 1.6 1.10 1.4 1.00 1.3 0.80 1.1 0.70 1.0 0.70 0.9 0.60 0.8 0.55 0.7 0.50 0.6 0.45 0.5 0.40 0.5 0.35 0.4 0.30 0.4 DC resistance (Ω) max. 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.12 0.15 0.15 0.15 0.15 0.15 0.20 0.20 0.20 0.20 0.20 0.25 0.25 0.25 0.25 0.25 0.25 0.30 0.30 0.35 0.40 0.55 0.60 0.70 0.80 0.90 1.00 1.20 1.30 1.50 1.60 2.00 2.20 3.50 3.80 4.20 4.80 7.00 8.00 typ. 0.01 0.01 0.01 0.01 0.02 0.02 0.04 0.04 0.03 0.04 0.04 0.06 0.05 0.06 0.07 0.08 0.08 0.08 0.09 0.09 0.09 0.11 0.11 0.12 0.13 0.14 0.16 0.15 0.15 0.19 0.20 0.22 0.25 0.35 0.40 0.46 0.53 0.59 0.65 0.75 0.83 0.87 1.01 1.37 1.48 2.44 2.88 3.02 3.54 5.21 5.97 Rated current (mA)max. Part No. 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 900 900 900 800 800 800 800 700 700 700 700 600 600 600 600 500 500 500 500 400 400 350 350 300 300 250 250 200 200 200 200 150 150 150 100 100 50 50 MLG1005S0N3∗ T MLG1005S0N4T MLG1005S0N5T MLG1005S0N6T MLG1005S0N7T MLG1005S0N8T MLG1005S0N9T MLG1005S1N0T MLG1005S1N1T MLG1005S1N2T MLG1005S1N3T MLG1005S1N5T MLG1005S1N6T MLG1005S1N8T MLG1005S2N0T MLG1005S2N2T MLG1005S2N4T MLG1005S2N7T MLG1005S3N0T MLG1005S3N3T MLG1005S3N6T MLG1005S3N9T MLG1005S4N3T MLG1005S4N7T MLG1005S5N1T MLG1005S5N6T MLG1005S6N2T MLG1005S6N8T MLG1005S7N5T MLG1005S8N2T MLG1005S9N1T MLG1005S10NT MLG1005S12NT MLG1005S15NT MLG1005S18NT MLG1005S22NT MLG1005S27NT MLG1005S33NT MLG1005S39NT MLG1005S47NT MLG1005S56NT MLG1005S68NT MLG1005S82NT MLG1005SR10T MLG1005SR12T MLG1005SR15T MLG1005SR18T MLG1005SR22T MLG1005SR27T MLG1005SR33T MLG1005SR39T : Please specify inductance tolerance, B (±0.1nH), C (±0.2nH), S (±0.3nH), H (±3%) or J (±5%). • Test equipment Inductance Q : HP4291A+16193A, or equivalent SRF: HP8720C, or equivalent Rdc: YOKOGAWA TYPE7561, or equivalent • Rated current : Value obtained when current flows and temperature has risen to under 20°C. ∗ • All specifications are subject to change without notice. 006-01 / 20070703 / e521_mlg1005.fm (3/6) L, Q vs. FREQUENCY CHARACTERISTICS Part No. MLG1005S0N3∗ T MLG1005S0N4T MLG1005S0N5T MLG1005S0N6T MLG1005S0N7T MLG1005S0N8T MLG1005S0N9T MLG1005S1N0T MLG1005S1N1T MLG1005S1N2T MLG1005S1N3T MLG1005S1N5T MLG1005S1N6T MLG1005S1N8T MLG1005S2N0T MLG1005S2N2T MLG1005S2N4T MLG1005S2N7T MLG1005S3N0T MLG1005S3N3T MLG1005S3N6T MLG1005S3N9T MLG1005S4N3T MLG1005S4N7T MLG1005S5N1T MLG1005S5N6T MLG1005S6N2T MLG1005S6N8T MLG1005S7N5T MLG1005S8N2T MLG1005S9N1T MLG1005S10NT MLG1005S12NT MLG1005S15NT MLG1005S18NT MLG1005S22NT MLG1005S27NT MLG1005S33NT MLG1005S39NT MLG1005S47NT MLG1005S56NT MLG1005S68NT MLG1005S82NT MLG1005SR10T MLG1005SR12T MLG1005SR15T MLG1005SR18T MLG1005SR22T MLG1005SR27T MLG1005SR33T MLG1005SR39T ∗ Inductance(nH)typ. 500MHz 800MHz 0.3 0.3 0.4 0.4 0.5 0.5 0.6 0.6 0.7 0.7 0.8 0.8 0.9 0.8 0.9 0.9 1.0 1.0 1.1 1.1 1.2 1.2 1.4 1.4 1.5 1.5 1.7 1.7 1.9 1.9 2.1 2.1 2.3 2.3 2.6 2.6 2.9 2.9 3.2 3.2 3.4 3.4 3.7 3.7 4.1 4.1 4.5 4.5 4.9 4.9 5.4 5.4 6.0 6.0 6.5 6.6 7.2 7.4 7.9 8.0 8.8 9.0 9.7 9.9 11.7 12.1 14.7 15.3 17.7 18.6 21.8 23.3 27.0 29.6 33.5 37.8 40.3 46.9 50.2 63.2 60.9 80.2 75.8 107.5 96.9 164.8 128.9 325.8 175.2 284.7 422.4 874.6 1.8GHz 0.3 0.4 0.5 0.6 0.7 0.8 0.8 0.9 1.0 1.1 1.2 1.4 1.5 1.7 1.9 2.1 2.3 2.6 3.0 3.3 3.6 3.9 4.3 4.8 5.4 5.8 6.8 7.4 8.6 9.3 10.8 12.4 16.2 22.0 29.0 44.5 92.4 314.7 2.0GHz 0.3 0.4 0.5 0.6 0.7 0.8 0.8 0.9 1.0 1.1 1.2 1.5 1.6 1.7 1.9 2.1 2.3 2.7 3.0 3.4 3.6 3.9 4.4 4.9 5.6 5.9 7.1 7.8 9.2 9.9 11.6 13.5 18.3 26.0 36.1 65.1 317.8 2.4GHz 0.3 0.4 0.5 0.6 0.7 0.8 0.8 0.9 1.0 1.1 1.2 1.5 1.6 1.7 1.9 2.2 2.4 2.7 3.1 3.5 3.8 4.1 4.6 5.2 6.1 6.3 7.8 8.6 10.5 11.3 13.7 16.7 25.5 41.7 74.4 341.5 Q typ. 500MHz 39 41 26 22 22 26 21 22 23 23 22 23 23 20 21 22 21 22 24 24 21 22 24 23 23 22 24 23 24 23 24 24 23 23 23 22 20 20 20 19 19 17 16 14 12 11 8 5 1 800MHz 48 48 32 27 28 34 27 29 29 29 27 29 29 26 25 27 26 27 29 30 26 28 30 30 29 28 29 28 30 28 30 30 29 28 28 27 23 23 21 20 18 15 11 6 1 1.8GHz 99 98 58 46 45 57 44 48 47 48 44 47 46 41 41 44 42 43 47 46 40 43 47 45 42 42 42 40 41 38 40 37 33 29 26 21 10 3 2.0GHz 117 109 63 49 49 60 47 50 50 50 47 50 49 43 43 47 44 45 49 48 42 45 49 47 43 43 43 41 41 38 39 36 31 26 22 14 3 2.4GHz 127 117 69 53 54 66 53 56 57 56 53 56 54 49 48 52 49 50 54 53 46 50 53 50 44 45 43 41 39 36 36 31 23 17 11 2 : Please specify inductance tolerance, B (±0.1nH), C (±0.2nH), S (±0.3nH), H (±3%) or J (±5%). • All specifications are subject to change without notice. 006-01 / 20070703 / e521_mlg1005.fm (4/6) TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE vs. FREQUENCY CHARACTERISTICS Q vs. FREQUENCY CHARACTERISTICS 1000 50 1.0nH 270nH 100nH 40 33nH 10 10nH 30 10nH Q Inductance (nH) 100 3.3nH 1 3.3nH 20 1.0nH 100nH 33nH 10 270nH 0 10 100 1000 Frequency(MHz) 10000 0 10 100 1000 Frequency(MHz) 10000 • All specifications are subject to change without notice. 006-01 / 20070703 / e521_mlg1005.fm (5/6) MLG Series MLG1005M Type (For Wireless LAN & Bluetooh) FEATURES • Nominal inductance values are supported from 0.6 to 5.6nH. • Provides high Q characteristics. • Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for high-frequency. • The products contain no lead and also support lead-free soldering. • It is a product conforming to RoHS directive. PRODUCT IDENTIFICATION MLG 1005 M 2N2 B T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions 1005 1.0× 0.5mm(L× W) (3) Material code APPLICATIONS The most suitable in high frequency circuit of 2.4GHz and 5GHz wireless LAN & Bluetooh. (4) Inductance value 2N2 5N6 2.2nH 5.6nH SHAPES AND DIMENSIONS (5) Inductance tolerance 1.0±0.05 0.5±0.05 B ±0.1nH (6) Packaging style T Taping (reel) SPECIFICATIONS 0.25±0.1 0.5±0.05 Operating temperature range Storage temperature range –55 to +125°C –55 to +125°C [Unit of products] PACKAGING STYLE AND QUANTITIES Weight: 1mg Packaging style Taping Quantity 15000 pieces/reel 0.4 to 0.6 RECOMMENDED PC BOARD PATTERN 0.4 to 0.5 0.4 to 0.5 0.4 to 0.5 Dimensions in mm RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 300°C. Soldering time should not exceed 3 seconds. 10s max. 250 to 260˚C Natural cooling 230˚C 180˚C 150˚C Preheating 60 to 120s Soldering 30 to 60s Time(s) • All specifications are subject to change without notice. 006-01 / 20070703 / e521_mlg1005.fm (6/6) PACKAGING STYLES REEL DIMENSIONS ø60±2.0 1.0 2.0±0.5 9.0±0.3 ø13±0.5 13.0±1.4 ø21±0.8 ø178±2.0 Dimensions in mm Cavity 3.5±0.05 1.5 +0.1 –0.0 0.8max. 0.65±0.1 4.0±0.1 2.0±0.05 160min. Taping 2.0±0.05 1.15±0.1 8.0±0.3 Sprocket hole 1.75±0.1 TAPE DIMENSIONS 200min. Drawing direction 300min. Dimensions in mm • All specifications are subject to change without notice. 006-01 / 20070703 / e521_mlg1005.fm